US Patent No. 10,070,560

DRAWER-LEVEL IMMERSION-COOLING WITH HINGED, LIQUID-COOLED HEAT SINK


Patent No. 10,070,560
Issue Date September 04, 2018
Title Drawer-level Immersion-cooling With Hinged, Liquid-cooled Heat Sink
Inventorship Levi A. Campbell, Poughkeepsie, NY (US)
Milnes P. David, Fishkill, NY (US)
Dustin W. Demetriou, Poughkeepsie, NY (US)
Michael J. Ellsworth, Jr., Poughkeepsie, NY (US)
Roger R. Schmidt, Poughkeepsie, NY (US)
Robert E. Simons, Poughkeepsie, NY (US)
Assignee INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)

Claim of US Patent No. 10,070,560

1. A method of fabricating a cooling apparatus for cooling one or more electronic components, the method comprising:providing an enclosure sized to reside within an electronics rack, the enclosure comprising a compartment accommodating the one or more electronic components;
providing a dielectric fluid within the compartment, the dielectric fluid comprising a liquid dielectric at least partially immersing the one or more electronic components; and
hingedly mounting a liquid-cooled heat sink within the compartment of the enclosure, the hinged, liquid-cooled heat sink operatively facilitating cooling the one or more electronic components via the dielectric fluid within the compartment, and the hinged, liquid-cooled heat sink being rotatable between an operational position overlying the one or more electronic components within the compartment, and a service position which allows access to the one or more electronic components within the compartment.