16. An immersion cooled electronics arrangement, comprising:a sealed housing with an interior;
a coolant contained within the interior of the sealed housing;
a variable-volume chamber disposed within the sealed housing and submerged within the coolant, wherein the variable-volume chamber is fluidly isolated from the interior of the sealed housing;
a vent fluidly coupling the variable-volume chamber with the environment external to the sealed housing; and
an electronic device disposed within the sealed housing and in thermal communication with the coolant,
wherein a volume of the sealed housing being alterable between at least a first volume and a second volume in response to changes in pressure within the sealed chamber to reduce the rate of pressure change over time in the sealed housing from heating of the coolant.