US Patent No. 10,070,552

ELECTRONIC DEVICE AND COMPONENT MODULE


Patent No. 10,070,552
Issue Date September 04, 2018
Title Electronic Device And Component Module
Inventorship Sheng-Ming Liu, Taoyuan (TW)
Chin-Kai Sun, Taoyuan (TW)
Assignee HTC Corporation, Taoyuan (TW)

Claim of US Patent No. 10,070,552

1. An electronic device, comprising:a housing, having a mounting region;
a component, disposed in the mounting region;
a flexible substrate, comprising:
a bonding portion, located between the component and a carrying surface of the mounting region, and the bonding portion having a first surface and a second surface opposite to the first surface, wherein the first surface is bonded to the component, the second surface is bonded to the carrying surface, and the bonding portion is ring-shaped; and
an extending portion, connected to the bonding portion and extended to an outside of the mounting region,
wherein a material of the flexible substrate comprises one of polyethylene terephthalate and Mylar.