US Patent No. 10,070,547

CONTROL OF ELECTRIC FIELD EFFECTS IN A PRINTED CIRCUIT BOARD ASSEMBLY USING EMBEDDED NICKEL-METAL COMPOSITE MATERIALS


Patent No. 10,070,547
Issue Date September 04, 2018
Title Control Of Electric Field Effects In A Printed Circuit Board Assembly Using Embedded Nickel-metal Composite Materials
Inventorship Lendon L. Bendix, Deland, FL (US)
Derek Turner, Winter Park, FL (US)
Assignee Sparton Corporation, Schaumburg, IL (US)

Claim of US Patent No. 10,070,547

1. A sonobuoy system for use in an externally-generated resonant broadband electric field, the system comprising:a perforated cylindrical outer sonobuoy housing having a wall that defines a cavity;
a power supply;
an electrically-initiated device (EID), wherein the EID is part of a launch device or other controlled component of the sonobuoy system; and
a printed circuit board assembly (PCBA), characterized by an absence of an electromagnetic interface shield or a Faraday cage between the PCBA and the externally-generated resonant broadband electric field, wherein the EID, the power supply, and the PCBA are encapsulated within the cavity of the housing, the EID and the PCBA are electrically connected to each other and to the power supply, and the PCBA includes:
a plurality of conductive layers, including a conductive layer in which an electrical current with a predetermined current density is impressed by the broadband electric field falling incident upon the conductive layers, wherein the conductive layers are electrically connected to the EID;
one or more vias connecting the plurality of conductive layers;
a plurality of dielectric layers interposed between the plurality of conductive layers to form a stack-up; and
a trans-conductor layer (TCL) constructed of a nickel-metal composite metamaterial and having a variable geometry along each of a width and a length of the TCL, the TCL being embedded between adjacent ones of the conductive and dielectric layers,
wherein the TCL is configured to change shape, surface roughness, and/or characteristic impedance in the presence of the broadband electric field to thereby redirect the impressed electrical current away from the conductive layers of the PCBA and into at least one of the dielectric layers, and
wherein the at least one of the dielectric layers is configured to dissipate the redirected electrical current and is fabricated with a material configured as a dielectric waveguide that redirects field energy of the electrical current to ends of the PCBA and into the one or more vias, the vias being configured to radiate field energy of the electrical current away from the EID.