US Patent No. 10,056,531


Patent No. 10,056,531
Issue Date August 21, 2018
Title Method Of Processing A Semiconductor Structure
Inventorship Jerome Chandra Bhat, Palo Alto, CA (US)
Daniel Alexander Steigerwald, Cupertino, CA (US)
Michael David Camras, Sunnyvale, CA (US)
Han Ho Choi, Sunnyvale, CA (US)
Nathan Fredrick Gardner, Sunnyvale, CA (US)
Oleg Borisovich Shchekin, San Francisco, CA (US)
Assignee Lumileds LLC, San Jose, CA (US)

Claim of US Patent No. 10,056,531

1. A method comprising:providing a wafer comprising a semiconductor structure grown on a growth substrate, the semiconductor structure comprising a III-nitride light emitting layer sandwiched between an n-type region and a p-type region;
bonding the wafer to a transparent substrate that comprises a wavelength converting material disposed in glass;
removing the growth substrate;
after bonding the wafer to the transparent substrate, processing the wafer into multiple light emitting devices;
testing the wafer after processing the wafer into multiple light emitting devices and before dicing the wafer; and
adjusting an amount of wavelength converting material corresponding to each light emitting device according to the results of the testing.