US Patent No. 10,045,436


Patent No. 10,045,436
Issue Date August 07, 2018
Title Printed Circuit Board And Method Of Manufacturing The Same
Inventorship Suk Hyeon Cho, Suwon-si (KR)
Hyo Seung Nam, Hwasung-si (KR)
Yong Sam Lee, Yongin-si (KR)
Seok Hwan Ahn, Suwon-si (KR)
Assignee Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)

Claim of US Patent No. 10,045,436

1. A method of manufacturing a printed circuit board comprising a core made of a glass material and having a through hole, an insulator formed on top, bottom, and all lateral sides of the core, and a via in the through hole passing through the core and the insulator, the via electrically connecting between circuit layers on opposite sides of the core, the method comprising:forming sets of slits in a glass sheet of the glass material, each set of slits having two parallel slits extending from a top surface to a bottom surface of the glass sheet and formed to define a dam comprised of an uncut portion of the glass sheet located between the two slits, one of the sets of slits being formed along each lateral side surface of each of a plurality of unit regions of the glass sheet to surround every lateral side surface of the plurality of unit regions;
coupling an insulating member to the glass sheet such that a portion of the insulating member is on the dam and other portions of the insulating member fill into the slits on opposite sides of the dam, the insulating member and the glass sheet collectively forming a substrate; and
cutting the substrate along dicing lines.