US Patent No. 10,039,218

ELECTRONIC CIRCUIT COMPONENT MOUNTING SYSTEM


Patent No. 10,039,218
Issue Date July 31, 2018
Title Electronic Circuit Component Mounting System
Inventorship Tomokatsu Kubota, Anjyo (JP)
Junichi Suzuki, Toyoake (JP)
Assignee FUJI MACHINE MFG. CO., LTD., Chiryu (JP)

Claim of US Patent No. 10,039,218

1. An electronic circuit component mounting system comprising:a mounter main body;
(a) a circuit substrate conveying and holding device held on the mounter main body that conveys, fixes, and holds a circuit substrate,
(b) a head main body that is moved with respect to the mounter main body by a head moving device to any position on a movement plane inside the mounter main body,
(c) at least one head-side feeder held on the head main body that supplies electronic circuit components,
(d) a mounting device that receives the electronic circuit components from the at least one head-side feeder and mounts the electronic circuit components on the circuit substrate held by the circuit substrate conveying and holding device using multiple component holding tools provided on the head main body,
(e) a control device that controls the circuit substrate conveying and holding device, the head moving device, the at least one head-side feeder, and the mounting device, and
(f) a control device that performs control such that, during contact between the component holding tool positioned at a component mounting position and an electronic circuit component of the electronic circuit components, and during contact between the electronic circuit component and the circuit substrate, the component holding tool positioned at a component pickup position of the at least one head-side feeder and an electronic component contact each other, and the electronic circuit component and the at least one head-side feeder contact each other,
wherein the head main body includes a pair of clamping devices that respectively include positioning pins that engage a pair of positioning holes on the at least one head-side feeder.