US Patent No. 10,039,213

AIR INLET CHANNEL WITH THERMOELECTRIC COOLING ELEMENT


Patent No. 10,039,213
Issue Date July 31, 2018
Title Air Inlet Channel With Thermoelectric Cooling Element
Inventorship John Norton, Houston, TX (US)
Kevin Leigh, Houston, TX (US)
Peter Lieber, Houston, TX (US)
Assignee HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP, Houston, TX (US)

Claim of US Patent No. 10,039,213

1. An electronic device comprising:a chassis;
a circuit board in the chassis that includes a first active component and a second active component;
a number of fans;
a number of guide walls that define an air inlet channel; and
a thermoelectric cooler (TEC),
wherein there is airflow path such that, when the fans operate, air flows along the airflow path from an intake opening of the air inlet channel to an exhaust of the chassis, the first active component being located in the airflow path downstream of the intake opening of the air inlet channel,
wherein a cold portion of the TEC extends into the airflow path upstream of the first active component and a hot portion of the TEC extends into the airflow path downstream of the first active component, and
wherein the second active component is located in the airflow path downstream of the hot portion of the TEC.