US Patent No. 10,039,209


Patent No. 10,039,209
Issue Date July 31, 2018
Title Structure For Transferring Heat In Devices
Inventorship John Avery Howard, Palo Alto, CA (US)
David Eric Peters, San Jose, CA (US)
Ross Kenneth Thayer, Santa Clara, CA (US)
Assignee Amazon Technologies, Inc., Seattle, WA (US)

Claim of US Patent No. 10,039,209

1. A structure comprising:a heat source;
a substrate including a first material having a first thermal conductivity, a first surface facing the heat source, and a second surface distal from the heat source; and
a second material disposed on the second surface of the substrate, the second material having a second thermal conductivity less than the first thermal conductivity, wherein the second material is distributed on the substrate in a pattern having a first portion thicker than a second portion and one or more of the first material or the second material is arranged to conduct heat away from at least one hot spot associated with the heat source.