US Patent No. 10,036,596

COMBINATION STRUCTURE OF HEAT DISSIPATION MODULE


Patent No. 10,036,596
Issue Date July 31, 2018
Title Combination Structure Of Heat Dissipation Module
Inventorship Wen-Ji Lan, New Taipei (TW)
Assignee ASIA VITAL COMPONENTS CO., LTD., New Taipei (TW)

Claim of US Patent No. 10,036,596

1. A combination structure of a heat dissipation module comprising:at least one heat pipe having a heat-absorption section, at least one heat-dissipation section, and at least one curved section connected to the heat-absorption section and the heat-dissipation section; the heat-absorption section having a horizontal length; the heat-dissipation section having a cross-section area, and a cross-section length being defined between a rightmost and a leftmost edge of the cross-section area; and the curved section having a curved length
a heat dissipation fin set being penetrated through the heat pipe including a first portion, a second portion, and a third portion, which are located respectively corresponding to a heat-dissipation section, a curved section, and a heat-absorption section of the heat pipe; the fins of the first portion being provided with a plurality of first slots, each of which has a first slot length corresponding to a cross-section length of the heat-dissipation section of the heat pipe; the fins of the second portion and the third portion of the heat dissipation fin set being respectively provided with a plurality of second and third slots, which are gradually extended according to a length of the curved section and a horizontal length of the heat-absorption section of the heat pipe, and the fins of the third portion internally defining a receiving opening communicable with the slots.