US Patent No. 10,015,916

REMOVAL OF ELECTROSTATIC CHARGES FROM AN INTERPOSER VIA A GROUND PAD THEREOF FOR DIE ATTACH FOR FORMATION OF A STACKED DIE


Patent No. 10,015,916
Issue Date July 03, 2018
Title Removal Of Electrostatic Charges From An Interposer Via A Ground Pad Thereof For Die Attach For Formation Of A Stacked Die
Inventorship James Karp, Saratoga, CA (US)
Assignee XILINX, INC., San Jose, CA (US)

Claim of US Patent No. 10,015,916

1. An apparatus, comprising:a passive interposer having a plurality of conductors for coupling two or more integrated circuit dies to the interposer to provide a stacked die and one or more microbumps extending from one or more microbump pads, the microbumps configured for coupling to the two or more integrated circuit dies;
wherein the interposer includes an exposed conductive pad disposed outward and clear of areas of the interposer configured to receive the two or more integrated circuit dies, the exposed conductive pad coupled to a conductive network of the interposer configured to dissipate electrostatic charge from the interposer prior to the two or more integrated circuit dies being coupled to the interposer, and
wherein the exposed conductive pad has a larger plan area than each of the one or more microbump pads.