US Patent No. 10,015,915

SHIELD FILM, SHIELDED PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING SHIELD FILM


Patent No. 10,015,915
Issue Date July 03, 2018
Title Shield Film, Shielded Printed Wiring Board, And Method For Manufacturing Shield Film
Inventorship Hiroshi Tajima, Higashiosaka (JP)
Sirou Yamauchi, Higashiosaka (JP)
Kenji Kamino, Higashiosaka (JP)
Masahiro Watanabe, Higashiosaka (JP)
Assignee

Claim of US Patent No. 10,015,915

1. A shield film suitable for use in shielding a signal-transmitting circuit from signal-interfering electromagnetic noise, comprising:a metal layer, which is 2 ?m to 12 ?m thick;
an insulating layer, which is 1 ?m to 10 ?m thick and is disposed along and in contact with a first surface of the metal layer; and
an anisotropic conductive adhesive layer containing conductive filler with an average particle size of 2 ?m to 20 ?m, which anisotropic conductive adhesive layer is disposed along and in contact with a second, opposite surface of the metal layer;
wherein the shield film exhibits between 74 dB and 96 dB of attenuation of an electric field wave at 1 GHz, as measured using KEC method.