US Patent No. 10,015,907

HEAT DISSIPATING DEVICE


Patent No. 10,015,907
Issue Date July 03, 2018
Title Heat Dissipating Device
Inventorship Chun-Lung Wu, New Taipei (TW)
Ming-Sian Lin, New Taipei (TW)
Assignee AMULAIRE THERMAL TECHNOLOGY, INC., New Taipei (TW)

Claim of US Patent No. 10,015,907

1. A heat dissipating device, comprising:a thermal conductive substance, having a first surface and a second surface opposite to the first surface;
a plurality of heat-radiating protrusions, integrally formed with the thermal conductive substance on the first surface, each of the heat-radiating protrusions being solid; and
a plurality of turbulence-generating structures, each of the heat-radiating protrusions having one of the turbulence-generating structures, each of the turbulence-generating structures being formed on the first surface of the thermal conductive substance in concaved manner and around bottom peripheries of the heat-radiating protrusions, so as to obstruct a development of a boundary layer around the bottom peripheries of the heat-radiating protrusions;
each of the turbulence-generating structures is ring-shaped and concavely surrounds around a bottom periphery of each of the heat-radiating protrusions, respectively;
wherein the turbulence-generating structures are independently separated from each other without communication.