US Patent No. 10,015,890

METHOD OF MANUFACTURING CONDUCTIVE LAYER AND WIRING BOARD


Patent No. 10,015,890
Issue Date July 03, 2018
Title Method Of Manufacturing Conductive Layer And Wiring Board
Inventorship Masahiro Kaizu, Tokyo (JP)
Masateru Ichikawa, Shizuoka (JP)
Assignee FUJIKURA LTD., Tokyo (JP)

Claim of US Patent No. 10,015,890

1. A method of manufacturing a conductive layer on a support body, the method comprising:a first process of forming a precursor layer containing at least one of metal particles and metal oxide particles on the support body;
a second process of forming a sintering layer by irradiating an electromagnetic wave pulse on the precursor layer; and
a third process of compressing the sintering layer,
wherein the conductive layer is formed by repeating the first to third processes “N” times, where “N” denotes a natural number equal to or greater than 2, on the same location of the support body, and
the third process performed in the first to (N?1)th operations includes forming a surface of the sintering layer in an uneven shape.