US Patent No. 10,015,888


Patent No. 10,015,888
Issue Date July 03, 2018
Title Interconnect Joint Protective Layer Apparatus And Method
Inventorship Cheng-Ting Chen, Taichung (TW)
Hsuan-Ting Kuo, Taichung (TW)
Hsien-Wei Chen, Hsin-Chu (TW)
Wen-Hsiung Lu, Jhonghe (TW)
Ming-Da Cheng, Jhubei (TW)
Chung-Shi Liu, Hsin-Chu (TW)
Assignee Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu (TW)

Claim of US Patent No. 10,015,888

1. A method comprising:forming a passivation layer over a first substrate;
forming an interconnect over the passivation layer;
forming a conductive connector on the interconnect;
applying a nonconductive film with a release layer to the passivation layer, the interconnect, and the conductive connector, the conductive connector being embedded within the nonconductive film;
before the applying the nonconductive film with the release layer, removing a base layer from a first side of the nonconductive film, the release layer being on a second side of the nonconductive film, the second side being opposite the first side;
pressing the nonconductive film with a roller, the roller rolling along a surface of the release layer, wherein after pressing, the conductive connector extends through the nonconductive film; and
removing the release layer.