1. A method comprising:forming a passivation layer over a first substrate;
forming an interconnect over the passivation layer;
forming a conductive connector on the interconnect;
applying a nonconductive film with a release layer to the passivation layer, the interconnect, and the conductive connector, the conductive connector being embedded within the nonconductive film;
before the applying the nonconductive film with the release layer, removing a base layer from a first side of the nonconductive film, the release layer being on a second side of the nonconductive film, the second side being opposite the first side;
pressing the nonconductive film with a roller, the roller rolling along a surface of the release layer, wherein after pressing, the conductive connector extends through the nonconductive film; and
removing the release layer.