US Patent No. 10,015,884

PRINTED CIRCUIT BOARD INCLUDING EMBEDDED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME


Patent No. 10,015,884
Issue Date July 03, 2018
Title Printed Circuit Board Including Embedded Electronic Component And Method For Manufacturing The Same
Inventorship Seung Eun Lee, Sungnam (KR)
Yee Na Shin, Suwon (KR)
Yul Kyo Chung, Yongin (KR)
Doo Hwan Lee, Daejeon (KR)
Assignee Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)

Claim of US Patent No. 10,015,884

1. A printed circuit board (PCB) including an embedded electronic component, the printed circuit board comprising:a core having a cavity;
an electronic component inserted into the cavity and comprising external electrodes provided on one or more side portions thereof;
an insulating layer laminated on a surface of the core and bonded to an outer circumferential surface of the electronic component inserted in the cavity;
an external circuit pattern provided on the insulating layer; and
a via formed in the insulating layer,
wherein the external electrodes comprise a first rough surface and a second rough surface formed on surfaces thereof, the second rough surface having a lower surface roughness than the first rough surface,
wherein a concave part is formed at the external electrodes,
wherein a lower part of the via is inserted into the concave part, and
wherein the second rough surface is formed only at an interface between the lower portion of the via and the concave part.