US Patent No. 10,015,882

MODULAR SEMICONDUCTOR PACKAGE


Patent No. 10,015,882
Issue Date July 03, 2018
Title Modular Semiconductor Package
Inventorship Dylan Murdock, Allen, TX (US)
Binh K. Le, Frisco, TX (US)
Michael J. Arnold, Westminster, TX (US)
Walid Meliane, Frisco, TX (US)
Assignee Qorvo US, Inc., Greensboro, NC (US)

Claim of US Patent No. 10,015,882

1. A semiconductor package comprising:a carrier having a top surface, wherein the top surface of the carrier is planar;
a die attached directly to the top surface of the carrier;
a signal carrying component capable of transmitting signals, the signal carrying component having a top surface, a bottom surface attached to the top surface of the carrier, and an opening disposed around the die, wherein the signal carrying component is electrically coupled to the die through one or more interconnects;
at least one first component, wherein:
the at least one first component is at least one of a group consisting of transistors, diodes, resistors, capacitors, inductors, and transformers; and
the at least one first component is at least partially disposed in the opening and attached directly to the top surface of the carrier; and
a lid attached to the top surface of the signal carrying component such that the carrier, the signal carrying component, and the lid enclose the die and the at least one first component;
wherein the signal carrying component comprises a printed circuit board; and
wherein the lid is plastic or ceramic and the carrier is metal.