US Patent No. 10,015,881


Patent No. 10,015,881
Issue Date July 03, 2018
Title Cavities Containing Multi-wiring Structures And Devices
Inventorship Cyprian Emeka Uzoh, San Jose, CA (US)
Craig Mitchell, San Jose, CA (US)
Belgacem Haba, Saratoga, CA (US)
Ilyas Mohammed, Santa Clara, CA (US)
Assignee Invensas Corporation, San Jose, CA (US)

Claim of US Patent No. 10,015,881

1. A method for making an interconnection component comprising:forming a resist layer overlying a first surface of a sheet-like element and at least partially filing a first opening in the sheet-like element, the sheet-like element having a second opposed surface, the element consisting essentially of a material having a coefficient of thermal expansion of less than 10 parts per million per degree Celsius;
forming a mask layer covering the resist layer that overlies the sheet-like element and that at least partially fills the first opening in the sheet-like element;
forming a plurality of mask openings in the mask layer, wherein the plurality of mask openings are partly aligned with at least a portion of the resist layer overlying the first surface and at least a portion of the resist layer filling the first opening;
forming resist openings that extend through those portions of the resist layer exposed through the mask openings and that at least partially fill the first opening, such that the resist openings extend between the first and second surfaces of the element; and
forming electrical conductors on spaced apart portions overlying the first surface and on spaced apart portions within the resist openings within the first opening that are exposed through the mask openings, each conductor extending along an axial direction of the first opening, the electrical conductors being fully separated from one another within the first opening.