US Patent No. 10,015,878

DECOUPLING ARRANGEMENT


Patent No. 10,015,878
Issue Date July 03, 2018
Title Decoupling Arrangement
Inventorship William L. Barber, Bampton (GB)
Keith Pinson, Swindon (GB)
Andrew P. Collins, Hillsboro, OR (US)
Boping Wu, Folsom, CA (US)
Isaac Ali, Bristol (GB)
Colin L. Perry, Swindon (GB)
Assignee INTEL CORPORATION, Santa Clara, CA (US)

Claim of US Patent No. 10,015,878

1. An apparatus, comprising:a decoupling arrangement to reduce an inductance between a port and a decoupling component, the decoupling arrangement comprising:
a first current path to electrically couple the port to the decoupling component, the first current path comprising a conductive trace in a first layer of a multi-layer substrate; and
a second current path to electrically couple the port to the decoupling component, the second current path comprising a conductive trace in a second layer of the multi-layer substrate, the first and second current paths comprising vertically spaced current paths that substantially cover one another.