US Patent No. 10,015,877

CIRCUIT BOARD COMPRISING HEAT TRANSFER STRUCTURE


Patent No. 10,015,877
Issue Date July 03, 2018
Title Circuit Board Comprising Heat Transfer Structure
Inventorship Tae Hong Min, Suwon-si (KR)
Myung Sam Kang, Hwaseong-si (KR)
Jin Hyuk Jang, Hanam-si (KR)
Young Gwan Ko, Seoul (KR)
Assignee Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)

Claim of US Patent No. 10,015,877

1. A circuit board comprising:a core layer including graphite or graphene and having a cavity formed therein;
a first heat transfer structure disposed in the cavity and having a greater thermal conductivity in a thickness direction of the circuit board than in a planar direction of the circuit board;
an insulating member covering the core layer and the first heat transfer structure;
a first primer layer comprising silanic primers and disposed on substantially entire surfaces of the first heat transfer structure in such a way that the first primer layer connects the first heat transfer structure to the core layer and/or to the insulating member; and
a via formed in the insulating member and penetrating through the first primer layer to have a first surface in contact with the first heat transfer structure,
wherein at least a portion of the first heat transfer structure comprises a plurality of unit layers,
wherein the unit layers each include graphite or graphene, and
wherein a second primer layer is disposed on at least one surface of at least one unit layer.