US Patent No. 10,003,170

SOLDERING SYSTEM OF SEMICONDUCTOR LASER ELEMENT


Patent No. 10,003,170
Issue Date June 19, 2018
Title Soldering System Of Semiconductor Laser Element
Inventorship Tetsuhisa Takazane, Yamanashi (JP)
Assignee FANUC CORPORATION, Yamanashi (JP)

Claim of US Patent No. 10,003,170

1. A soldering system of semiconductor laser elements, comprising: a soldering device that performs soldering of a semiconductor laser element in a semiconductor laser module having a housing and at least one of the semiconductor laser element; a robot that conveys the semiconductor laser module; a camera that can put the semiconductor laser module in a field of view thereof; and a control device that controls the robot and the camera with imaging output of the camera as one control factor,wherein the robot conveys the semiconductor laser module to an installation position of the soldering device and an imaging field of view position of the camera, and is capable of changing relative positions between the camera and a subject, under control of the control device,
wherein the camera images the semiconductor laser module which is in the imaging field of view position thereof under control of the control device, and
wherein the control device executes a quality determination mode that calculates a position of the semiconductor laser element based on the imaging output of the camera, as well as calculating parallelism between the housing of the semiconductor laser module and the semiconductor laser element based on a change in light intensity related to the imaging output when changing a relative position between the camera and the subject, and determines soldering quality of the semiconductor laser element based on the position and parallelism thus calculated.