US Pat. No. 10,250,041

POWER CONTROL SYSTEM, POWER CONTROL DEVICE, AND METHOD FOR CONTROLLING POWER CONTROL SYSTEM

KYOCERA Corporation, Kyo...

1. A power control system comprising:a storage cell;
a power generation device that generates power while a current sensor detects forward power flow; and
a power control device including
a first power converter configured to convert AC power from a commercial power grid to DC power and supply the DC power to the storage cell during an interconnected operation, and
a supply unit configured to supply power generated by the power generation device to the storage cell during an independent operation;
an independent operation switch opened during the interconnected operation and closed during the independent operation to cause output from the first power converter to flow in a direction of the forward power flow through the current sensor; and
an interconnected operation switch that is open during the independent operation to prevent output from the commercial power grid to flow in the direction of the forward power flow through the current sensor,
wherein the first power converter is a single device and is a two-way inverter,
wherein a first input/output unit of the first power converter is connected to the storage cell, and
wherein a second input/output unit of the first power converter is connected to the commercial power grid via the interconnected operation switch and is connected to the current sensor via the independent operation switch.

US Pat. No. 10,250,040

DISTRIBUTING POWER BETWEEN DATA CENTERS

International Business Ma...

1. A data center, comprising:at least one power generator configured to generate electric power from renewable energy, wherein the data center operates using only the electric power generated from the renewable energy;
at least one device driven by the electric power generated from the renewable energy;
a storage battery configured to store the electric power generated from the renewable energy; and
a controller configured to:
determine a value B(T0) for an amount of the electric power stored in the storage battery at a time T0;
predict a value c(t) for an amount of the electric power generated from the renewable energy consumed by the at least one device over a time t between the time T0 and a time T1;
predict a value g(t) for an amount of the electric power generated from the renewable energy over the time t;
predict a value B(T1) for an amount of the electric power stored in the storage battery at the time T1 based on B(T0), c(t), and g(t); and
switch an operating mode of the device based on the predicted value B(T1).

US Pat. No. 10,250,038

CENTRAL VOLTAGE CONTROL DEVICE AND MEASURING DEVICE

MITSUBISHI ELECTRIC CORPO...

1. A central voltage control device in a voltage control system including a first measuring device configured to measure a voltage and electric power of a power distribution line of a high-voltage system and transmit the measured voltage and the measured electric power as measurement information, a second measuring device configured to measure the voltage of the power distribution line and transmit deviation information, which is information indicating whether the measured voltage deviates from a proper voltage range, an information amount of the deviation information being smaller than an information amount of the measurement information, and a voltage controller configured to control the voltage of the power distribution line, the central voltage control device comprising:a power-distribution estimating unit to estimate a power distribution in the power distribution line on the basis of the measurement information received from the first measuring device;
a voltage-distribution estimating unit to estimate a voltage distribution in the power distribution line on the basis of the power distribution;
a control-amount determining unit to determine a control amount of the voltage controller when there is a part where a voltage deviates from the proper voltage range in the voltage distribution; and
a correcting unit to correct the power distribution in the power distribution line on the basis of the deviation information received from the second measuring device, wherein
when the power distribution in the power distribution line is corrected by the correcting unit, the voltage-distribution estimating unit estimates the voltage distribution of the power distribution line using the corrected power distribution.

US Pat. No. 10,250,037

HARMONIC CURRENT COMPENSATOR AND AIR-CONDITIONING SYSTEM

Mitsubishi Electric Corpo...

1. A harmonic current compensator connected in parallel with a load to a system power supply and configured to supply a compensation current to limit a harmonic component contained in a load current to be input from the system power supply to the load, the harmonic current compensator comprising:a load current detection portion configured to detect the load current;
a compensation current detection portion configured to detect the compensation current;
a control amount computing portion configured to compute a control amount of the compensation current based on the harmonic component contained in the load current detected by the load current detection portion and the compensation current detected by the compensation current detection portion; and
a limiter configured to, when the control amount computed by the control amount computing portion exceeds a preset value, limit the control amount, wherein
the limiter is configured to limit the control amount computed by the control amount computing portion to less than or equal to the preset value,
the preset value is such a value that a value of the compensation current based on the control signal generated by the control amount limited to the preset value does not exceed an overcurrent level of the compensation current.

US Pat. No. 10,250,036

PEER-TO-PEER: AC POWER GRID COMPENSATION ARCHITECTURE

RHOMBUS ENERGY SOLUTIONS,...

1. A peer-to-peer power compensation architecture for utility power systems, comprising:a “ring-pathed” power transmission supply line, a first leg connecting a utility power source to a utility customer load, a second leg connecting the utility power source to a secondary power source, and a third leg connecting the secondary power source to the utility customer load;
an injected sinusoidal signal traveling on the first and third legs, the injected signal having a predetermined amplitude, frequency and phase characteristics, wherein at least one of the characteristics being varied as function of a voltage level and a power factor of supplied power from the respective leg; and
at least one controllable power hub having an inverter, coupled to at least the first leg and the third leg, the inverter having at least one DC or AC-based power source, wherein the injected signal's characteristics from the respective leg are evaluated to determine if the power hub's power should be introduced to the leg to compensate for an under-voltage condition.

US Pat. No. 10,250,035

HOLISTIC OPTIMIZATION OF DISTRIBUTION AUTOMATION USING SURVIVABILITY MODELING TO SUPPORT STORM HARDENING

1. A method for selecting improvements to an original distributed automation power grid to improve storm survivability, the method comprising:(a) identifying the original distributed automation power grid as a current circuit;
(b) by a processor, based on a topology and a geography of the current circuit, and further based on information describing a plurality of historical storms, determining a link set associated with one of the plurality of historical storms, and determining costs and marginal survivability benefits associated with each link set, each link set representing links that would restore connectivity of the current circuit after damage by the associated storm;
(c) based on the costs and benefits, selecting a link set from the plurality of link sets;
(d) updating the current circuit by adding the selected link set to the current circuit to define a new circuit, and updating the costs and benefits of others of the plurality of link sets;
(e) by the processor, creating a phased-recovery survivability model of the current circuit;
(f) by the processor, determining a distribution automation survivability metric for the current circuit using the phased-recovery survivability model;
(g) replacing the current circuit with the new circuit and repeating the operations (b) through (f) until the distribution automation survivability metric of the current circuit meets a target distribution automation survivability metric; and
(h) selecting link sets to be added to the current circuit as improvements to the original distributed automation power grid to improve storm survivability, wherein the information describing the plurality of historical storms comprises, for each storm, a storm radius of impact and a storm center, and wherein determining a link set associated with each storm further comprises performing the following for each storm:
mapping a representation of the current circuit into a labeled graph, wherein labels of the labeled graph represent susceptibilities of nodes as a function of the storm radius of impact and the storm center;
obtaining a disconnected graph by removing nodes of the labeled graph within the storm radius of impact around the storm center; and
determining the link set associated with the storm by determining a set of links outside the storm radius of impact around the storm center that, when added to the disconnected graph, restore connectivity.

US Pat. No. 10,250,034

DISTRIBUTED UTILITY RESOURCE PLANNING AND FORECAST

ABB SCHWEIZ AG, Baden (C...

1. A system for forecasting and managing energy usage comprising:A central server to store weather forecasts, historical weather information, historical energy usage, and by factor information in one or more databases;
A plurality of distributed forecast devices each in communication with the central server via a first network connection and an associated set of two or more of a plurality of interval meters, each one of the plurality of the interval meters is associated with a different account, via a second network connection, wherein each of the plurality of distributed forecast devices is located remote from the central server and located remote from the set of two or more of the plurality of interval meters, wherein each of the plurality of distributed forecast devices is configured to;
receive, from the central server, weather forecasts, historical weather information, historical energy usage, and loss factor information specific to an account of the associated interval meter;
receiving interval meter data from the set of two or more remote interval meters, wherein the interval meter data from each one of said remote interval meters includes an amount of energy used by the associated accounts;
determine an energy usage forecast for one or more energy resources associated with the account over a predetermined amount of time into the future based on the associated interval meter data, the weather forecasts, historical weather information, historical energy usage, and loss factor information;
transmit the energy usage forecast to the central server via the first network connection; and
wherein the central server is configured to manage the energy resources based on the energy usage forecasts.

US Pat. No. 10,250,033

TRANSIENT VOLTAGE SUPPRESSOR HAVING BUILT-IN-TEST CAPABILITY FOR SOLID STATE POWER CONTROLLERS

HAMILTON SUNDSTRAND CORPO...

1. A transient protection circuit configured for use in a solid state power controller (SSPC) comprising a plurality of power channels, the transient protection circuit comprising:a shared transient voltage suppressor communicatively coupled to ground; and
a shared protection line communicatively coupled to the shared transient voltage suppressor;
wherein the shared protection line is configured to be communicatively coupled to and shared by the plurality of power channels;
wherein the plurality of power channels are communicatively coupled to a shared feed line;
wherein each of the plurality of power channels is communicatively coupled to a non-shared load line;
wherein, when the shared protection line is communicatively coupled to and shared by the plurality of power channels, positive pulses above a threshold originated from the non-shared load line of any one of the plurality of power channels are dissipated through the any one of the plurality of power channels to the shared feed line;
wherein, when the shared protection line is communicatively coupled to and shared by the plurality of power channels, negative pulses above a threshold originated from the non-shared load line of any one of the plurality of power channels are dissipated through the shared protection line and the shared transient voltage suppressor.

US Pat. No. 10,250,031

MAGNETIC COIL DRIVING CIRCUIT FOR MAGNETIC CONTACTOR

LSIS CO., LTD., Anyang-s...

1. A magnetic coil driving circuit for magnetic contactor, the magnetic coil driving circuit comprising:a semiconductor switch connected in series to a magnetic coil and configured to magnetize the magnetic coil upon turning on and demagnetize the magnetic coil upon turning off;
a pulse width modulation unit connected to the semiconductor switch and configured to output a pulse signal to the semiconductor switch as a control signal for turning on or off the semiconductor switch;
a control unit connected to the pulse width modulation unit and configured to output a control signal for changing a pulse width of the pulse signal in order to perform control to increase the amount of electric current flowing through the magnetic coil when the magnetic coil is initially magnetized and perform control to decrease the amount of electric current flowing through the magnetic coil when the magnetization of the magnetic coil is maintained; and
a temperature detection and protection unit connected to the semiconductor switch and configured to detect a temperature inside the magnetic contactor, output an output signal for turning off the semiconductor switch in a high-temperature state when the temperature exceeds an allowable temperature, and to make the semiconductor switch be controlled by the pulse signal from the pulse width modulation unit in a normal state when the temperature is within the allowable temperature.

US Pat. No. 10,250,030

POWER DISTRIBUTION UNIT WITH MODULAR CHARGING PORTS

Core Brands, LLC, Petalu...

1. A power distribution unit for providing electricity to an electronic device, comprising:a housing defining a module slot and including at least one electrical socket and a module connector positioned within the module slot;
a module including at least one connector port, the module receivable within the module slot and including a housing connector, wherein the housing connector operably connectable to the module connector when the module is inserted into the module slot; and
a cable connectable to the module connector of the housing and the housing connector of the module to connect the housing to the module.

US Pat. No. 10,250,029

DEVICE OVERVOLTAGE DETECTOR

Infineon Technologies AG,...

1. A semiconductor component comprising:a device; and
an overvoltage detection structure that includes a current path comprising a Zener diode connected in series with a fuse,
wherein the Zener diode is configured to conduct a current in response to an overvoltage condition at the device,
wherein the fuse is configured to break the current path of the overvoltage detection structure in response to the Zener diode conducting the current,
wherein the device and the Zener diode are formed on a same semiconductor die and each comprise a terminal, and
wherein the fuse is external to the semiconductor die and comprises a wire that is connected to the terminal of the Zener diode and electrically couples the terminal of the Zener diode to the terminal of the device.

US Pat. No. 10,250,028

ELECTRICAL SWITCH

SIEMENS AKTIENGESELLSCHAF...

1. An electrical switch for switching an electric current between a feed and an outgoer, wherein the electrical switch is mountable in a switchgear assembly and, as a result, an electrical connection can be made with the electrical switch by a feed and an outgoer of the switchgear assembly, the electrical switch comprising:an internal voltage tap to supply power to a switch-internal electronics system; and
a changeover switch, configured to adjust the electrical connection between the feed or the outgoer, and the internal voltage tap, wherein the changeover switch additionally includes an isolating position.

US Pat. No. 10,250,027

CIRCUIT PROTECTION SYSTEM AND METHOD

1. A Power over Ethernet (PoE) cable medium circuit protection module comprising:an over-current and/or over-voltage circuit module and/or a heat circuit protector which measures or detects heat rise of said PoE cable medium,
wherein said over-current and/or over-voltage circuit module comprises (1) a plurality of clamping diodes, fuses, and/or light-emitting diodes, and (2) a plurality of jumpers and/or a plurality of DIP switches and/or a combination of jumpers and DIP switches to set a predetermined power level for said over-current and/or over-voltage circuit module, thereby prohibiting transmission of electrical power over said PoE cable medium which exceeds said predetermined power level and/or preventing excessive heat build-up on said PoE cable medium.

US Pat. No. 10,250,026

HIGH VOLTAGE JOINT

BRUGG KABEL AG, Brugg (C...

1. A device for connecting an end of a HV cable to an HV installation, comprisinga) a pre-fabricated pipe-like unit, which comprises
b) a connection piece made out of an electrically conducting material and
c) an insulator tube which is connected to the connection piece in a fluid-tight way and
d) a fluid-filled cable connector which is a part of the pre-fabricated pipe-like unit and which is connected to the connection piece in a fluid-tight way and which can provide a connection of a metallic layer of a fluid-filled cable to the pipe-like unit if the fluid-filled cable is connected to the pipe-like unit.

US Pat. No. 10,250,025

NON-PENETRATING ANCHOR SYSTEM AND METHOD

LIGHTING PROTECTIONS SYST...

1. An apparatus for conducting a lightning strike away from a structure to be protected therefrom, the apparatus comprising:a first anchor, sized and shaped to receive a cable sized to carry electrical current received from a lightning strike;
a first pad preformed as a solid comprising an elastomeric polymer separate and distinct from materials forming exterior surfaces of the structure, the first pad adhered to the first anchor and treated to adhere to the structure non-penetratingly and as an exclusive connection between an exterior surface of the structure and the anchor, with sufficient force to support the cable; and
a first bracket sized and shaped to constrain the cable between the anchor and the first bracket in rigid mechanical contact therewith.

US Pat. No. 10,250,024

CABLE BREAKOUT SUPPORT

Tyco Electronics UK LTD, ...

1. A cable breakout support for a trunking, the cable breakout support comprising:a clip for clipping to a cable breakout of a cable bundle supported in the trunking;
a clip fitting for connecting to the clip; and
a clamp for clamping to the trunking, the clamp comprising:
at least two trunk fittings for fitting to at least two bulbous longitudinal edges of the trunking, each trunk fitting including:
a trunk socket having a first end and a second end opposite the first end, wherein the trunk socket is open ended; and
a slot formed at the first end of the trunk socket, wherein the slot is configured to receive one of the at least two bulbous longitudinal edges of the trunking;
at least two collets, each collet configured to insert into the trunk socket of a corresponding one of the at least two trunk fittings, each collet including:
a further slot, wherein the further slot is configured to align with the slot of the corresponding one of the at least two trunk fittings and engage the one of the at least two bulbous longitudinal edges of the trunking; and
a tapered portion, wherein the tapered portion becomes increasingly wider along a longitudinal axis of the collet towards an open end of the further slot, and wherein the tapered portion is configured to be compressed around the one of the at least two bulbous longitudinal edges of the trunking when the collet is fully inserted into the trunk socket of the corresponding one of the at least two trunk fittings; and
a screw thread disposed at an end of the collet and opposite the further slot; and
at least two nuts, each nut configured to screw onto a corresponding one of the at least two collets at the second end of the trunk socket of the corresponding one of the at least two trunk fittings, and each nut configured to draw the tapered portion of the corresponding one of the at least two collets into the trunk socket of the corresponding one of the at least two trunk fittings and reduce a space defined by the further slot of the corresponding one of the at least two collets around the one of the at least two bulbous longitudinal edges of the trunking, thereby enabling the corresponding one of the at least two collets to clamp onto the one of the at least two bulbous longitudinal edges of the trunking.

US Pat. No. 10,250,023

TWO-PART SNAP-TOGETHER FEEDTHROUGHS

The Boeing Company, Chic...

1. A feedthrough, comprising:a first part comprising:
a first body configured to be disposed in a first portion of an opening in a panel;
a first lumen disposed within the first body; and
a first engagement area; and
a second part comprising:
a second body configured to be disposed in a second portion of the opening in the panel;
a second lumen disposed within the second body; and
a second engagement area configured to engage the first engagement area to hold the first part relative to the second part such that the first lumen and the second lumen are disposed generally concentrically with each other, wherein engaging the first engagement area with the second engagement area causes deformation of the first part, the second part, or both the first part and the second part.

US Pat. No. 10,250,020

ELECTRICAL BUS INTERLACED TECHNIQUE FOR A SHARED RESOURCE DISTRIBUTED ELECTRICAL POWER DISTRIBUTION SYSTEM

Rosendin Electric, Inc., ...

1. A radial bus Shared Resource Distributed electrical power Distribution System (SRDDS), comprising:one or more electrical power distribution platforms including at least a first electrical power distribution platform;
a radial power distribution bus to distribute AC electrical power to downstream electrical loads, where the one or more electrical power distribution platforms are coupled to the radial power distribution bus in an interlaced fashion via two or more fast acting electrical switching devices to supply AC electrical power to the downstream electrical loads, and where the downstream electrical loads are dual corded and are configured to nominally receive AC electrical power from two separate AC electrical power distribution platforms;
where the first electrical power distribution platform includes a first side with a first switchboard cabinet with two or more circuit breakers, where the first electrical power distribution platform, via a first circuit breaker in the first switchboard cabinet, electrically connects to a first fast acting electrical switching device that then electrically connects to a first set of the dual corded electrical loads, and where the first electrical power distribution platform, via a second circuit breaker in the first switchboard cabinet, electrically connects to a second fast acting electrical switching device that then electrically connects to a second set of the dual corded electrical loads;
where the first electrical power distribution platform includes a second side that is electrically and physically separated from the first side, where the second side of the first electrical power distribution platform includes a second switchboard cabinet with two or more circuit breakers, where the first electrical power distribution platform, via a third circuit breaker in the second switchboard cabinet, electrically connects to a third fast acting electrical switching device that then electrically connects to the first set of the dual corded electrical loads, and where the first electrical power distribution platform, via a fourth circuit breaker in the second switchboard cabinet electrically connects to a fourth fast acting electrical switching device that then electrically connects to a third set of the dual corded electrical loads.

US Pat. No. 10,250,019

MOTORIZED RACKING ASSEMBLY INCLUDING A CURRENT SENSOR AND A TORQUE SENSOR

EATON INTELLIGENT POWER L...

1. A racking assembly for an electrical apparatus, said electrical apparatus including a housing assembly and a number of electrical components, said housing assembly including a number of sidewalls, a pair of rails, and a contact assembly, said housing assembly sidewalls defining a substantially enclosed space, said housing assembly contact assembly coupled to one said sidewall, said number of electrical components including a movable contact assembly, said number of electrical components substantially disposed in said housing assembly enclosed space, wherein said housing assembly contact assembly and said electrical apparatus movable contact assembly are movable between a separated, first position, wherein said housing assembly contact assembly and said electrical apparatus movable contact assembly are not in electrical communication, and a coupled, second position, wherein said housing assembly contact assembly and said electrical apparatus movable contact assembly are in electrical communication, said racking assembly comprising:a drive assembly including a motor assembly;
said drive assembly disposed in the space below and between said housing assembly rails;
said motor assembly includes an electric motor including a power line and a rotating output shaft;
a carriage assembly, said carriage assembly structured to support a number of electrical components; and
wherein said motor assembly is coupled to said carriage assembly.

US Pat. No. 10,250,018

ELECTRICAL DISTRIBUTION APPARATUS AND METHODS OF ASSEMBLING SAME

ABB Schweiz AG, Baden (C...

1. An electrical distribution apparatus comprising:a backplane for supporting a plurality of electrical devices;
a bus bar assembly coupled to said backplane;
a frame that supports said backplane; and
at least one positioning member that facilitates positioning said backplane relative to said frame, said at least one positioning member at least partially supporting said backplane such that said backplane is positionable between a first position and a second position, wherein said backplane contacts said frame in the second position;
wherein said backplane comprises a first side edge and a second side edge, said at least one positioning member comprising a first flange and a second flange, said first flange extending from said first side edge and said second flange extending from said second side edge.

US Pat. No. 10,250,017

ADAPTER FOR CONTACTING A CIRCUIT BREAKER TO A BUSBAR SYSTEM

1. An adapter for connecting any one of a plurality of circuit breakers of different types to a busbar system, the adaptor comprising:a casing having a first mounting side to attach and electrically connect the adapter to at least one busbar of the busbar system, and a second mounting side to attach and electrically connect any one of the plurality of circuit breakers of different types to the casing; and
on the second mounting side is at least one rotary disk with several sets of threaded inserts, the rotary disk and threaded inserts thereof pivot around a rotational axis perpendicular to the mounting sides;
wherein each one of the several sets of threaded inserts is equipped for mounting the adaptor to a different one of the plurality of circuit breakers of different types, for each rotational position of the rotary disk one of the plurality of sets of threaded inserts is positioned in a mounting position for one of the plurality of circuit breakers of different types;
wherein the rotary disk is incorporated in the casing, wherein the rotary disk has inscriptions identifying the several sets of threaded inserts;
wherein the second mounting side has a viewing window through which exactly one of the inscriptions can be seen according to the position of the rotary disk; and
wherein the sets of threaded inserts, the inscriptions and the viewing window are positioned so that the inscription indicating a particular set of the several sets of threaded inserts is visible through the viewing window when the particular set of the several sets of threaded inserts is positioned in the mounting position.

US Pat. No. 10,250,016

IGNITION SYSTEM

NGK SPARK PLUG CO., LTD.,...

1. An ignition system comprising:a spark plug attached to an engine head;
a power supply section having a battery which has a ground terminal, and an ignition coil which transforms a voltage of the battery and supplies a transformed voltage to the spark plug,
the spark plug including:
a first insulator having an axial hole,
an internal electrode provided in the axial hole and having a terminal connected to the ignition coil, and
a metallic shell disposed around an outer circumference of the first insulator, the metallic shell having a ground electrode, the metallic shell being fixed to the engine head through engagement with a second insulator embedded in the engine head, the metallic shell electrically insulated from the engine head by the second insulator; and
an electrically conductive path connected to the metallic shell and the ground terminal, while being electrically insulated from the engine head.

US Pat. No. 10,250,015

SPARK PLUGS HAVING A CENTER ELECTRODE

ROBERT BOSCH GMBH, Stutt...

1. A spark plug, comprising:a housing;
an insulator situated in the housing;
a center electrode situated in the insulator; and
a ground electrode situated on the housing;
wherein the ground electrode and the center electrode are situated with respect to each other in such a way that the ground electrode and the center electrode form a spark gap, the center electrode rests with an electrode head on a seat developed on an inner side of insulator, and the center electrode has an electrode base body and a core situated in the electrode base body, the core being made of a material that has a higher heat conductivity than a material of the electrode base body, and wherein the electrode base body has a diameter that is not greater than 1.7 mm,
wherein the center electrode has:
at least one first area, in which the electrode base body and the core respectively have a constant diameter; and
at least one second area, in which the diameter of the core is continuously reduced.

US Pat. No. 10,250,014

SPARK PLUG

NGK SPARK PLUG CO., LTD.,...

1. A spark plug, comprising:a cylindrical metal shell having a front end to which a ground electrode is joined;
an insulator formed with an axial hole and having an outer circumferential surface partially surrounded by the metal shell, the axial hole including a first hole portion and a second hole portion larger in inner diameter than the first hole portion and continuous to the first hole portion via a step portion;
a center electrode having a rear end portion disposed on the step portion of the insulator and a leg portion extending from the rear end portion toward the ground electrode in an axis direction;
a metal terminal having a front end portion disposed in the second hole portion with a space left between the front end portion of the metal terminal and the rear end portion of the center electrode;
a resistor arranged between the front end portion of the metal terminal and the rear end portion of the center electrode within the second hole portion; and
a conductive seal brought into contact with the resistor and the rear end portion of the center electrode,
wherein the conductive seal comprises a side-surface seal layer being in contact with the whole of a side surface of the rear end portion and having a thickness of 10 ?m or larger in a direction perpendicular to the axis direction; and
wherein, assuming that a projection area is defined by projecting the center electrode onto the axial hole in the direction perpendicular to the axis direction around a center axis of the spark plug, a contact surface of the resistor brought into contact with the axial hole overlaps at least a part of the projection area.

US Pat. No. 10,250,013

LASER SYSTEM INCLUDING OPTICAL AMPLIFICATION SUBSYSTEM PROVIDING AN AMPLIFIED LASER OUTPUT

CIVAN ADVANCED TECHNOLOGI...

1. A laser system comprising:a seed laser; and
an optical amplification system, receiving an output of said seed laser and providing an amplified laser output, said optical amplification system comprising:
a first plurality of optical amplifier assemblies;
an optical pathway directing an output from said seed laser to said first plurality of optical amplifier assemblies;
a coherent free-space far field combiner receiving outputs in a first plane in free space from said first plurality of optical amplifier assemblies, combining said outputs in said first plane and directing said outputs to a single mode optical fiber; and
a lens receiving outputs in a second plane in free space from said first plurality of optical amplifier assemblies, said second plane being generally orthogonal to said first plane, combining said outputs in said second plane and directing said outputs to said single mode optical fiber.

US Pat. No. 10,250,011

DRIVER CIRCUITRY AND ELECTRONIC DEVICE INCLUDING A MULTIPURPOSE INDUCTOR

SONY SEMICONDUCTOR SOLUTI...

1. A driver circuitry, comprising:a buck convertor that includes a first switch, a second switch, and a diode for switched operation, and a comparator configured to drive the first switch and the second switch;
an inductor connected between the first switch and the second switch of the buck convertor and a load, wherein the inductor supplies a current to the load;
a third switch that short-circuits the load; and
a fourth switch, wherein
the third switch and the fourth switch are driven by a same signal.

US Pat. No. 10,250,010

CONTROL OF VCSEL-BASED OPTICAL COMMUNICATIONS SYSTEM

GLOBALFOUNDRIES INC., Gr...

1. A method for controlling an optical communications system operating at a first data bandwidth, the optical communications system having a vertical cavity surface emitting laser (VCSEL) transmitter and a receiver for detecting lasers from the VCSEL transmitter, the method comprising:adjusting the VCSEL transmitter of the optical communications system to operate at a second data bandwidth distinct from the first data bandwidth;
reducing a data flow rate of the receiver during operation of the optical communications system at the second data bandwidth;
determining whether a system quality metric for the receiver meets a specification requirement during operation of the optical communications system at the second data bandwidth, wherein the system quality metric comprises one of a bit error rate of the receiver, a power consumption of the receiver, or an optical modulation amplitude of the VCSEL transmitter;
in response to determining the system quality metric does not meet the specification requirement, adjusting an operational setting of the VCSEL transmitter or the receiver;
in response to determining the system quality metric meets the specification requirement, continuing operation of the optical communications system at the second data bandwidth; and
in response to receiving an override signal from a control node of the optical communications system, resuming operation of the optical communications system at the first data bandwidth.

US Pat. No. 10,250,009

FIBER LASER SYSTEM AND METHOD OF OUTPUTTING LASER BEAM

FUJIKURA LTD., Tokyo (JP...

1. A fiber laser system comprising:a plurality of fiber laser units including respective excitation light sources, a power of each of a plurality of laser beams outputted from the respective plurality of fiber laser units rising, then reaching a peak, and then decreasing to a steady level;
a combiner for combining the respective plurality of laser beams outputted from the plurality of fiber laser units;
a plurality of current sources provided so as to correspond to the respective plurality of fiber laser units such that the plurality of current sources supply respective driving currents to corresponding ones of the excitation light sources; and
a control section for controlling the plurality of current sources so that respective powers of laser beams outputted from at least two fiber laser units of the plurality of fiber laser units (i) reach the peak at respective different times and (ii) are combined at least in a period during which the powers are at the steady level.

US Pat. No. 10,250,006

SYSTEM AND METHOD FOR GENERATING WAVELENGTH-TUNABLE, ULTRA-SHORT LIGHT PULSES HAVING HIGH POWER SPECTRAL DENSITY

UNIVERSITE DE BORDEAUX, ...

1. A system for generating ultra-short light pulses that are wavelength-tunable in a spectral domain comprised between the ultraviolet and the infrared, said system comprising: —an injection module comprising a light source and a wavelength-tunable spectral filter, —the light source being configured to generate short light pulses, of a duration comprised between several hundreds of picoseconds and a hundred of nanoseconds, said short light pulses extending over a spectral band of emission having a spectral width of several tens of nanometres to several hundreds of nanometres, —the spectral filter having at least one spectral bandwidth defined by a central wavelength (Lambda3) and a spectral width (ALambda3) comprised between 10 pm and 10 nm, and the central wavelength (Lambda3) of said spectral bandwidth being tunable in a spectral range ([Lambdal; Lambda2]) comprised in the spectral band of emission of the light source, the spectral filter being configured to spectrally filter and to temporally shape said short light pulses, so that the injection module generates ultra-short light pulses, of a duration of the order of a picosecond, spectrally filtered and wavelength-tunable as a function of the central wavelength of said spectral bandwidth, wherein the injection module comprises a non-linear amplifying loop mirror; and—different optical amplifiers configured to amplify pulses in different wavelength ranges, said different optical amplifiers being arranged around a common pump at the exit of the injection module, said different optical amplifiers being configured to receive said spectrally filtered and wavelength- tunable ultra-short light pulses and to generate by optical amplification ultra-short amplified pulses, spectrally filtered and wavelength-tunable as a function of the central wavelength of said spectral bandwidth of the spectral filter and of the different optical amplifiers, and the non-linear amplifying loop mirror comprising another optical amplifier arranged on the optical path of the non-linear loop mirror and the spectral filter being arranged on the optical path of the non-linear loop mirror.

US Pat. No. 10,250,005

CABLE INSTALLATION AID FOR MULTI-STRAND ELECTRICAL CONDUCTORS

Hubbell Incorporated, Sh...

1. A method of preparing a connection for an electrical conductor comprising the steps of:cutting an insulation layer of an electrical conductor to separate the insulation layer into a first portion and a second portion, the electrical conductor including an outer diameter and a core diameter;
moving the second portion away from the first portion, thereby exposing a segment of conductor strands of the electrical conductor;
placing a strand retainer around the electrical conductor;
placing the strand retainer onto the exposed segment of conductor strands, the strand retainer has an unstressed inner diameter that is less than the electrical conductor outer diameter;
removing the insulation second portion from the electrical conductor; and
inserting the exposed conductor strands into an electrical connector.

US Pat. No. 10,250,004

METHOD OF FORMING A CONNECTOR FOR AN ELECTRICAL CABLE FOR ELECTRICALLY CONNECTING TO A CAMERA OF A VEHICLE

MAGNA ELECTRONICS INC., ...

1. A method of forming a connector for an electrical cable for electrically connecting to a camera of a vehicle, said method comprising:providing a cable having a plurality of electrically conductive wires, wherein each of said wires is electrically insulated from the others of said wires, and wherein said wires are within an outer sleeve of said cable;
stripping said outer sleeve of said cable and stripping electrically insulating material from ends of said wires to provide exposed ends of said electrically conductive wires;
providing a plurality of terminals each having a wire receiving end and a pin end opposite said wire receiving end;
providing a non-electrically conductive retaining element having a plurality of receiving portions and passageways separated by respective walls of said retaining element;
pressing said terminals into respective ones of said receiving portions and passageways of said retaining element, wherein walls of said retaining element electrically isolate said terminals from one another, and wherein said pin ends of said terminals pass through said passageways and protrude from said retaining element when said terminals are pressed into respective ones of said receiving portions and passageways of said retaining element;
electrically connecting the exposed ends of said electrically conductive wires at said wire receiving ends of said terminals,
wherein, when said terminals are pressed into respective ones of said receiving portions and passageways of said retaining element and the exposed ends of said electrically conductive wires are electrically connected at said wire receiving ends of said terminals, a wire-terminal-retainer construction is formed at the end of the cable; and
placing said wire-terminal-retainer construction in a molding device and molding a non-electrically conductive plastic resin to form a unitary connector end at and over said wire-terminal-retainer construction,
wherein said molded unitary connector end comprises (i) a connector portion that is at and partially around exposed portions of said pin ends of said terminals that protrude from said retaining element, (ii) an attaching structure for attaching the cable at the camera, and (iii) a sleeve portion that at least partially overlaps said outer sleeve of said cable and seals or bonds at said outer sleeve to seal the molded unitary connector end at said cable.

US Pat. No. 10,250,003

CEILING FAN KIT

Hunter Fan Company, Memp...

1. A downrod kit for a connecting a ceiling fan to a ceiling fan mount, the downrod kit comprising:a downrod including a sidewall defining an interior and extending between a first end and a second end, with mounting holes provided in the sidewall and an access opening provided in the sidewall; and
a set of electrical wires at least as long as the downrod;
wherein the access opening provides for accessing the set of electrical wires when passing through the interior of the downrod.

US Pat. No. 10,250,002

METHOD OF MANUFACTURING ELECTRICAL CONNECTION BLOCK

YAZAKI CORPORATION, Toky...

1. A manufacturing method of an electric connection block, the electric connection block including a bus bar formed from a press-formed product of a metal plate member and a resin-made housing insert molded integrally with the bus bar, and the bus bar including a flat plate-shaped main plate part and a standing terminal erected by bending a base end connected to a portion of the main plate part relative to the main plate part, the manufacturing method comprising:insert molding the housing integrally with the bus bar in a before-bending state where the standing terminal is located on the same plane as the main plate part such that the before-bent standing terminal faces into an opening formed in the housing; and
bending the base end of the standing terminal to thereby erect the standing terminal relative to the main plate part from the opening after the insert molding of the housing.

US Pat. No. 10,250,001

WIRE CRIMPING DEVICE

FURUKAWA ELECTRIC CO., LT...

1. A wire crimping device by which an insulated wire formed by covering a conductor with an insulating cover and provided with a wire tip formed by exposing the conductor by peeling off the insulating cover on a first end side, and a closed-barrel-type crimp terminal provided with a hollow crimping section which allows the crimping connection of the wire tip are connected to each other by crimping the crimping section and the wire tip to each other, the wire crimping device comprising:a crimper configured to crimp the crimping section into which the wire tip is inserted from a wire insertion opening which opens on a second end side of the crimping section in a terminal axis direction, the second end side being different from the first end side;
a guide configured to guide an end portion of the conductor to the wire insertion opening of the crimp terminal arranged at a predetermined position for enabling crimping by the crimper, an inner diameter of an opposedly-facing portion of the guide, which is opposite to the wire insertion opening corresponding to an inner diameter of the wire insertion opening; and
a carrier cutter configured to separate a plurality of crimp terminals from a carrier of a terminal connection strip, the carrier formed in a strip-shape, the terminal connection strip formed by connecting the plurality of crimp terminals to the carrier via connecting portions at predetermined intervals in a longest length direction of the carrier,
wherein the carrier cutter is configured to shear the connecting portions in a thickness direction of the carrier by sliding in the thickness direction of the carrier from a stand-by position where the carrier cutter overlaps with the wire insertion opening to a cutting position which is disposed on a side opposite to a side where the crimping section is arranged with respect to the carrier, the cutting position being a position where the carrier cutter does not overlap with the wire insertion opening, and the guide is disposed at a position in the carrier cutter, which is made to slide to the cutting position, which corresponds to the wire insertion opening, in the cutting position.

US Pat. No. 10,249,998

COMBINATION OUTLET AND POWER DISTRIBUTION UNIT INCORPORATING THE SAME

Server Technology, Inc., ...

1. A combination outlet module, comprising:a mounting board;
a plurality of outlet cores mounted to the mounting board, each outlet core having a core outer surface configured to mate within a first connector type;
wherein each outlet core includes a plurality of electrical terminals each coupled to the mounting board; and
at least one replaceable adapter sleeve mated with a corresponding one of the plurality of outlet cores, the adapter sleeve having a sleeve outer surface configured to mate within a second connector type.

US Pat. No. 10,249,997

JUMPER WITH SAFETY FUSE

1. A jumper kit comprising:a plurality of jumpers wherein each jumper comprises:
a first conducting wire and a second conducting wire, the first conducting wire and second conducting wire having a gauge and a rated current that is the same for each of said first conducting wire and second conducting wire but is different from the first conducting wire and second conducting wire of any of the other jumpers in the kit;
a fuse assembly interposed between the first and second conducting wires and connected thereto;
a connector assembly connected to each of the first and second conducting wires, the connector assembly comprising a plug section and a receptacle section, wherein the plug section includes:
a body,
a lead connector extending from a top of the body, and a plug extending from a base of the body; and
wherein the receptacle section includes:
a socket configured to receive the plug and conduct electricity to its corresponding conducting wire, thereby forming an electrical connection therebetween.

US Pat. No. 10,249,996

TELEVISION COMMERCIAL SILENCER ELECTRICAL WALL OUTLET RECEPTACLE TAP

1. A television commercial silencer comprising:an electrical outlet receptacle having a first outlet and a second outlet;
a switch connected to the first outlet and second outlet;
said switch having a first position, a second position and a third position;
wherein when said switch is in the first position, the first outlet is on and the second outlet is off;
wherein when said switch is in the second position, the first outlet is off and the second outlet is off;
wherein when said switch is in the third position, the first outlet is off and the second outlet is on;
said first outlet being connected to at least one speaker connected to a television;
said second outlet being connected to an audio device; and
said audio device is connected to the television commercial silencer via an audio cable.

US Pat. No. 10,249,995

SELF-CLOSING CONTACT SLEEVE

ROSENBERGER HOCHFREQUENZT...

1. A connector, comprising:a first terminal connector comprising a slot and a raised portion; and
a second terminal connector comprising a receptacle that receives said first terminal connector, wherein
in a disengaged state of said first terminal connector and said second terminal connector, a distal end of said slot is open,
in a coaxially engaged state of said first terminal connector and said second terminal connector, in which engaged state said raised portion contacts an inner wall of a distal opening of said receptacle, said distal end of said slot is closed, and
at least a portion of said slot is angled with respect to a longitudinal axis of said first terminal connector by an angle selected from the group consisting of:
an angle between 15° and 60°,
an angle between 30° and 50°, and
an angle of essentially 45°.

US Pat. No. 10,249,992

ELECTRIC VEHICLE CHARGING HANDLE, LIGHT PIPE THEREFOR, AND ASSOCIATED LIGHT VISIBILITY ENHANCING METHOD

EATON INTELLIGENT POWER L...

1. A light pipe for an EV charging handle, said EV charging handle comprising a housing having a thru hole, and a light source coupled to said housing, said light pipe comprising:a body structured to be coupled to said light source in order to transmit light from said light source through the thru hole of said housing, said body comprising:
a first side portion having a first interior surface having a first surface roughness, and
a second side portion extending from said first side portion, said second side portion having a second interior surface having a second surface roughness greater than the first surface roughness in order to increase a visibility range with which the light is transmitted through the thru hole of said housing.

US Pat. No. 10,249,991

LOW NOISE HIGH-SPEED DATA CONNECTORS

Amazon Technologies, Inc....

1. A high-speed data connector comprising:a metal shield;
a plurality of pins mounted inside the metal shield;
at least one resonant unit comprising:
a resonant structure fixed between the metal shield and at least one of the plurality of pins and in close proximity to the at least one of the plurality of pins;
a ground plane; and
an electrical connection between the resonant structure and the ground plane; and
a first dielectric material deposited within the metal shield, the first dielectric material fixing the plurality of pins in a specific orientation for mating with corresponding pins in a mating connector, the at least one resonant unit being embedded in the first dielectric material, the first dielectric material having a first permeability.

US Pat. No. 10,249,990

ELECTRICAL CONNECTOR HAVING AN IMPROVED METAL SHELL

FOXCONN INTERCONNECT TECH...

1. An electrical connector comprising:a terminal module comprising an insulative housing having a base portion and a tongue portion extending forwardly from the base portion and a plurality of conductive terminals affixed to the insulative housing, the base portion having a mounting portion at a rear end thereof, each conductive terminal having a contacting portion exposed to the tongue portion, a fixed portion affixed to the base portion, and a soldering portion extending rearward from the mounting portion; and
a shielding shell having a plurality of lateral walls and enclosing the insulative housing for forming a receiving room; wherein
the shielding shell comprises a pair of supporting legs extending upwardly and resisting against the mounting portion, wherein the shielding shell comprises a metal main shell shaped as a cylindrical shape and a sub-shell enclosing the metal shell, and the supporting legs extend rearward from the lateral walls and resist against a mounting surface of the mounting portion, wherein the supporting legs and the lateral walls are in a same plane, wherein the mounting portion comprises a pair of protruding portions extending laterally from the lateral walls, the sub-shell comprises an upper wall attached to a top wall of the metal shell and a pair of lateral portions attached to the lateral walls, and a rear end of each lateral portion resists against a front end of each protruding portion, wherein the sub-shell comprises a horizontal covering portion attached to the mounting portion and extending rearward from the upper wall and a pair of assembling legs covering the protruding portions and extending downwardly from the horizontal covering portion, wherein the top wall of the metal shell comprises a riveted joint welded together continuously, wherein the mounting portion is located at an upper surface of the base portion, and the metal shell comprises a first barrier resisting a rear surface of the mounting portion and a second barrier resisting a rear surface of the base portion and extending upwardly from a bottom surface of the metal shell, wherein the metal shell comprises a pair of resisting protrusions protruding into the receiving room, the base portion comprises a pair of resisting grooves corresponding to the resisting protrusions, and a front surface of the resisting protrusion protrudes beyond a front surface of the base portion.

US Pat. No. 10,249,987

ELECTRONIC MODULE FOR AN I/O MODULAR SYSTEM

1. An electronic module for an I/O modular system, comprising a housing, a plug-in connection for the coupling to a connection of the I/O modular system, at least one locking lever which has an actuating end arranged on the side turned away from the plug-in connection, and a locking portion, the locking lever having at least one light-conducting portion, a light source being associated with the locking lever, a light exit face being provided in the region of the actuating end of the locking lever.

US Pat. No. 10,249,985

WATERPROOF CONNECTOR

YAZAKI CORPORATION, Toky...

1. A connector comprising:a terminal which comprises an electrical contact portion, an intermediate portion, and a conductor connecting portion, is bent at the intermediate portion to be formed to have a substantially L shape in cross section, and is connected to an end of an electric wire via the conductor connecting portion;
a connector housing comprising a connector fitting portion in which the electrical contact portion is provided and which is fitted to a counterpart connector, and a mold portion which is formed to be continuous to the connector fitting portion and is in which a predetermined range comprising the intermediate portion of the terminal and an insulating sheath of the end of the electric wire as a molding target portion is buried; and
a seal member which is disposed in the insulating sheath of the end of the electric wire as the molding target portion and is to prevent moisture from intruding the conductor connecting portion from an outside of the connector housing,
wherein the connector housing comprises a pair of first reinforcing ribs and a pair of second reinforcing ribs,
wherein the pair of first reinforcing ribs are disposed opposite to a side of the connector fitting portion to be fitted to the counterpart connector, extend along an extending direction of the mold portion, and are arranged along a direction perpendicular to the extending direction of the mold portion,
wherein the pair of first reinforcing ribs are formed such that a width between the pair of first reinforcing ribs is substantially the same as a width of the terminal, wherein the pair of second reinforcing ribs are disposed on a side of the mold portion to be continuous to the connector fitting portion, the side being a side facing the counterpart connector when the connector fitting portion is fitted to the counterpart connector, extend along the extending direction of the mold portion, and are arranged along the direction perpendicular to the extending direction of the mold portion, and
wherein height positions of tip end surfaces of the pair of second reinforcing ribs are set to be substantially the same as a high position of an outer surface of the mold portion formed in a place where the seal member is disposed.

US Pat. No. 10,249,984

GRIP FOR SECURING A POWER CORD AT A RIGHT ANGLE

1. A power cord brace assembly configured for preventing an extension cord prong from breaking in an electrical outlet, said assembly comprising:a tube being configured to be removably mounted on a power cord, said tube having a front end, a back end and an outer surface being attached to and extending between said front end and said back end, said outer surface having a slot extending therethrough into an interior of said tube, said slot extending through said front end and said back end wherein the power cord is slidably movable through said slot;
a fastener being attached to said tube, said fastener securing the power cord in said tube, said fastener being positioned on said outer surface of said tube adjacent to said slot, said fastener extending over a top of said slot and engaging said tube on an opposite end of said slot relative to said fastener and inhibiting the power cord from moving outwardly through said slot; and
a plurality of legs being attached to said tube, each of said legs being configured to be abutted against a vertical wall having an outlet therein, each of said legs having a distal end, each of said legs being configured to retain said tube in a perpendicular orientation with respect to a planar surface against which said legs are abuttable, said tube being configured to retain said power cord at a perpendicular orientation with respect to the outlet to facilitate the plug to be removed from the outlet at a right angle with respect to the outlet.

US Pat. No. 10,249,983

CONNECTOR WITH INTEGRATED HEAT SINK

Molex, LLC, Lisle, IL (U...

1. A connector, comprising:a cage that defines a first port and a second port, the cage configured to be supported by a circuit board, the first and second ports being vertically stacked relative to the supporting circuit board, and the first and second ports each having four walls;
a plurality of spring finger plates, each spring finger plate forming a wall of each of the first and second ports and supporting a plurality of spring fingers, the plurality of spring fingers configured to engage a module inserted into one of the first and second ports in a first direction, the spring fingers configured to translate in a second direction, in operation, when the module is inserted into one of the first and second ports, wherein each spring finger of the plurality of spring fingers is configured to individually contact the module inserted into one of the first and second ports; and
at least one heat transfer plate in thermal communication with a spring finger plate of the plurality of spring finger plates.

US Pat. No. 10,249,982

POWER SUPPLY DEVICE

YAZAKI CORPORATION, Toky...

1. A power supply device provided on a vehicle floor for supplying power to a slide body, comprising:a wire harness for electrically connecting a power source of the vehicle and the slide body; and
a case accommodating the wire harness, wherein
the case includes a base portion and a cover portion, and
the wire harness includes a power source side connector fittable to a mating connector on a power source side end thereof, and wherein
a connector housing accommodating the power source side connector is formed at one end of the base portion,
the power source side connector is arranged fittable to the mating connector in a direction along the vehicle floor as a fitting direction, and wherein
the connector housing has a protection portion covering the power source side connector from above, and
a raising member is placed on an upper support surface of the protection portion, the raising member is configured to be in size such that an upper surface of the cover portion and an upper surface of the raising member lie in the same plane.

US Pat. No. 10,249,981

HIGH-SPEED SIGNAL TRANSMISSION CONNECTOR WITH HIGH WATER RESISTANCE

AIMMET INDUSTRIAL CO., LT...

1. A high-speed signal transmission connector with high water resistance at least comprising:a casing and a terminal block, wherein said casing has a first through-hole for placing said terminal block therein; a first inner circumference is provided on an inner rear end of the casing and a first step-like groove is formed on a rear end of the first inner circumference for placing a second seal ring therein;
a flange is provided at an rear end of the terminal block, a front surface of the flange has a second annular recess, the second seal ring is sandwiched between the first step-like groove of the first inner circumference of the casing and the second annular recess of the flange of the terminal block to block external moisture from infiltrating into the connector from a connection location of the casing and the terminal block;
the terminal block has a second through-hole with a first insulation member and a second insulation member being provided therein, a terminal is mounted inside the first insulation member and the second insulation member to insulate the terminal from the terminal block; a second inner circumference is provided on the inner rear end of the terminal block and a second step-like groove is formed on a front end of the second inner circumference for placing a third seal ring therein, the third seal ring is sandwiched between the terminal, the second step-like groove, the first insulation member and the second insulation member to block external moisture from infiltrating into the connector from a connection location of the terminal block and the terminal.

US Pat. No. 10,249,980

DEFORMABLE TRANSLATABLE SEAT FOR REDUCING STRESS ON CERAMIC PENETRATORS

Teledyne Instruments, Inc...

1. A bulkhead penetrator assembly and stress reduction apparatus for use in subsea environments, the penetrator assembly comprising:a central element having a first end and second end and having a substantially cylindrical body comprising an enlarged central portion, the enlarged central portion being ceramic and having first and second shoulders that gradually transition down respectively to the first and second ends;
a first fixture having an opening adapted to receive the first end of the central element and a metallic seal surface comprising an annular pocket;
a second fixture having an opening adapted to receive the second end of the central element and a metallic seal surface geometrically configured to abut the second shoulder of the central element;
a deformable translatable seat disposed within the pocket of the first fixture and adjacent to the first shoulder of the central element, the deformable translatable seat comprising a deformable material geometrically configured in cooperation with adjoining surfaces of the first fixture and the first shoulder to abut the first shoulder of the central element;
wherein the annular pocket forms a recessed space in the metallic seal surface of the first fixture for receiving the deformable translatable seat; and
wherein the annular pocket in which the deformable translatable seat is disposed is relatively larger than the deformable translatable seat and is adapted to provide for a change in size of the deformable translatable seat by deformation of the deformable translatable seat, and is further adapted to provide for translation of the deformable translatable seat by movement of the deformable translatable seat within the relatively larger annular pocket.

US Pat. No. 10,249,979

WATERPROOF COMPONENT WITH WIRING STRUCTURE

YAZAKI CORPORATION, Mina...

1. A waterproof component configured to insert an electric wire into an attachment hole penetrating a wall portion to lock, the waterproof component comprising:a housing body including:
an attachment hole insertion portion configured to be inserted into the attachment hole, a mat seal accommodating chamber having a bottom wall being formed inside the attachment hole insertion portion;
an abutting portion configured to abut a first peripheral surface of the attachment hole;
a locking claw provided in an elastically deformable manner on an insertion tip side of the attachment hole insertion portion, the locking claw being configured to be locked to a second peripheral surface of the attachment hole opposite to the first peripheral surface; and
a cover locking portion provided on the insertion tip side of the attachment hole insertion portion;
a mat seal accommodated in the mat seal accommodating chamber, the mat seal having an electric wire press-fitting hole configured to receive an electric wire therein;
a mat seal cover locked to the cover locking portion, the mat seal cover interposing the mat seal between the mat seal cover and the bottom wall to hold the mat seal in the mat seal accommodating chamber; and
an elastic ring disposed on an outer periphery of the attachment hole insertion portion, the elastic ring being in contact with an inner peripheral surface of the attachment hole.

US Pat. No. 10,249,978

MODULAR CONNECTOR WITH CARRIER HAVING AN APERTURE FORMED ON CROSS MEMBER

Molex, LLC, Lisle, IL (U...

1. A connector comprising:a connector module, the connector module including a housing, a plurality of terminals retained in the housing, the housing further including a boss;
a carrier, the carrier including a pair of side portions, the carrier further including cross members that connect the side portions and define an opening, an aperture formed in a cross member;
a frame, the frame configured for operatively securing the carrier, the frame having a second opening corresponding the opening formed in the carrier; and
wherein the connector module is attached to the frame, a portion of the housing extends into the openings and the boss formed on the housing engages the aperture formed in the cross member of the carrier to align the connector module to the frame.

US Pat. No. 10,249,977

CONNECTOR, CONNECTOR COVER, AND WIRE HARNESS

YAZAKI CORPORATION, Mina...

1. A connector comprising:a connector housing provided with a terminal and capable of being fitted in an attachment hole formed in an attachment panel in an axial direction; and
a cover attached to the connector housing and having a first axial end and a second axial end opposite the first axial end, the cover causing a wiring material connected with the terminal to enter into the first axial end of the cover in the axial direction and causing the wiring material to be offset in a width direction and a height direction that are orthogonal to the axial direction and exit the cover at the second axial end of the cover such that the wiring material enters the cover and exits the cover in substantially the same axial direction, wherein
the cover includes a grip portion formed in such a shape that the grip portion is capable of being gripped at a position where the grip portion is exposed in an insertion hole which is formed in an opposite panel arranged to face the attachment panel in the axial direction, through which the connector housing is capable of passing, and which is located at a position deviated from the attachment hole in the width and height directions, in a state where the connector housing is fitted in the attachment hole.

US Pat. No. 10,249,976

CONNECTOR HOUSING ASSEMBLY WITH A DRESS COVER HAVING FINGER FEATURE AND RIBS

Sumitomo Wiring Systems, ...

1. A connector housing assembly housing a wire and terminal connector, the connector housing assembly configured to prevent detachment of a dress cover and connector housing comprising:a connector housing having a pair of first sidewalls and a bottom surface defining a first storage space, the connector housing further including a first ridge disposed on an outer surface of each of the pair of first sidewalls, wherein the first ridge has a back side, the back side extending along an axis defined by a height of the connector housing;
a dress cover having a pair of second sidewalls, a front wall, a back wall, and a top surface defining a second storage space, the dress cover further including a tab and a pair of first stabilizing ribs disposed on the inner surface of opposite second sidewalls, the tab extending from a bottom of each of the pair of second sidewalls wherein the tab includes a front edge and a back edge, wherein the back side of a respective first ridge engages the front edge of a respective tab so as to withstand the cantilevered force of a hanging wire, wherein each of the first stabilizing ribs extend into the second storage space to a free end, the free ends defining a first gap, the first gap configured to receive the wire, the first gap having a width that prevents the wire from contacting the second sidewalls so as to limit the side-to-side movement of the wire, minimizing bending of the wire.

US Pat. No. 10,249,971

CIRCUIT BOARD WITH WIRE CONDUCTIVE PADS AND METHOD FOR FIXING THE WIRE CONDUCTIVE PADS TO THE CIRCUIT BOARD

1. A circuit board with wire conductive pads being provided for insertion of a wire, and comprising:a circuit board including at least one contact point;
each of the wire conductive pads including a main body and an elastic locking piece;
wherein the main body is in the form of a hollow column made of conductive material, disposed at the contact point of the circuit board, and includes a peripheral wall defining an insertion space, the peripheral wall includes an outer surface, an opposite inner surface and two lateral surfaces connected between two ends of the outer surface and the inner surface; and
the elastic locking piece is formed on the peripheral wall and inserted into the insertion space in an inclined manner, so as to press the wire against the peripheral wall when the wire is inserted in the insertion space;
the elastic locking piece includes a force-accumulation section, a force-receiving section and a pressing section, the force-accumulation section is a reversely bent section, the force-receiving section extends towards the insertion space in an inclined manner, a turning angle of the force-receiving section is different from that of the pressing section, and the pressing section serves to press the wire against the inner surface of the peripheral wall.

US Pat. No. 10,249,970

MEMORY DEVICE WITH PLURALITY OF INTERFACE CONNECTORS

SILICON MOTION, INC., Jh...

1. A memory device, comprising:a substrate, which comprises a first edge, a second edge, a third edge and a fourth edge, wherein the first edge is parallel to the third edge, the second edge is parallel to the fourth edge, the first edge is perpendicular to the second edge, and a length of the first edge is shorter than a length of the second edge;
a first interface connector, disposed on the first edge, wherein the first interface connector comprises a plurality of first edge-board contacts, and the first edge-board contacts extend toward a first direction;
a second interface connector, disposed on the second edge, the second interface connector comprises a plurality of second edge-board contacts, and the second edge-board contacts extend toward a second direction; and
a plurality of memory chips, disposed on the substrate, wherein the second interface connector is located between the memory chips and the first interface connector in the first direction,
wherein the first interface connector is adapted to be inserted into a first interface slot, the second interface connector is adapted to be inserted into a second interface slot,
wherein the memory device is selectively connects to the first interface slot or the second interface slot.

US Pat. No. 10,249,969

CONNECTOR

Molex, LLC, Lisle, IL (U...

1. A connector comprising:a housing having a mating surface and a mounting surface, the mating surface being configured to be mated to a mating connector, the mounting surface being configured to be mounted to a substrate, the housing having a recess defined therein at the mating surface, the recess defining a bottom wall, first and second side walls and first and second end walls, the housing having a protrusion which protrudes upwardly from the bottom wall of the recess, the protrusion being separated from each of the first and second side walls and each of the first and second end walls, the protrusion having first and second end portions, each of the first and second end portions having an upper surface, an end surface and first and second side surfaces;
a plurality of terminals mounted in the housing; and
first and second inner reinforcing brackets, each of the first and second inner reinforcing brackets having a body part, an end plate, first and second side plates, and first and second connecting legs, the end plate being connected to an outer end of the body part, an upper end of the first side plate being connected to a first side end of the body part, an upper end of the second side plate being connected to a second side end of the body part, the first connecting leg being connected to a lower end of the first side plate and extending to a free end thereof, the second connecting leg being connected to a lower end of the second side plate and extending to a free end thereof,
wherein the first inner reinforcing bracket is integrated with the first end portion of the housing whereby the body part of the first inner reinforcing bracket is disposed on the upper surface of the first end portion, the end plate of the first inner reinforcing bracket is disposed on the end surface of the first end portion, the first side plate of the first inner reinforcing bracket is disposed on the first side surface of the first end portion, the second side plate of the first inner reinforcing bracket is disposed on the second side surface of the first end portion, whereby surfaces of the body part, the end plate and the first and second side plates of the first inner reinforcing bracket are only exposed on a side of the mating surface of the housing, whereby the first and second connecting legs of the first inner reinforcing bracket are disposed on the bottom wall of the housing, and whereby surfaces of the first and second connecting legs of the first inner reinforcing bracket are only exposed on a side of the mounting surface of the housing and are configured to be mounted to the substrate, and
wherein the second inner reinforcing bracket is integrated with the second end portion of the housing whereby the body part of the second inner reinforcing bracket is disposed on the upper surface of the second end portion, the end plate of the second inner reinforcing bracket is disposed on the end surface of the second end portion, the first side plate of the second inner reinforcing bracket is disposed on the first side surface of the second end portion, the second side plate of the second inner reinforcing bracket is disposed on the second side surface of the second end portion, whereby surfaces of the body part, the end plate and the first and second side plates of the second inner reinforcing bracket are only exposed on the side of the mating surface of the housing, whereby the first and second connecting legs of the second inner reinforcing bracket are disposed on the bottom wall of the housing, and whereby surfaces of the first and second connecting legs of the second inner reinforcing bracket are only exposed on the side of the mounting surface of the housing and are configured to be mounted to the substrate.

US Pat. No. 10,249,968

PLUG-AND-SOCKET CONNECTOR

ROSENBERGER HOCHFREQUENZT...

1. A connector, comprisinga first terminal connector;
a second terminal connector; and
an intermediate component comprising an outer conductor and an inner conductor in coaxial arrangement to said outer conductor, said outer conductor comprising a first end and a second end,
exclusively one of said first end and said second end comprising a counterpart detent portion, and
each of said first terminal connector and said second terminal connector comprising a detent portion selectively engageable with said counterpart detent portion.

US Pat. No. 10,249,967

ELECTRONIC DEVICE AND CONNECTING METHOD

DELTA ELECTRONICS, INC., ...

1. An electronic device connected to a wire, comprising:a printed circuit board, having a hole;
a hollow tube, extended through the hole and comprising at least one concave structure, wherein the concave structure contacts the wire;
a plurality of blades, connected to the hollow tube and separated from each other, wherein a reflex angle is formed between the inner wall of the hollow tube and each of the blades, and the printed circuit board is disposed between the concave structure and the blades; and
a solder, connected to the blades and the printed circuit board, wherein the wire is inserted into the hollow tube and electrically connected to the printed circuit board, wherein half of the blades are parallel and attached to the printed circuit board, and half of the blades are inclined relative to the printed circuit board, wherein each of the inclined blades is a flat plate, and the opposite surfaces of each of the inclined blades are exposed from the solder.

US Pat. No. 10,249,966

BATTERY WIRING MODULE

Sumitomo Wiring Systems, ...

1. A battery wiring module comprising:wiring that is to be electrically connected to an on-board secondary battery;
a housing that is to be attached to the secondary battery and includes a wiring housing portion that houses the wiring; and
a covering for closing an opening of the wiring housing portion,
wherein information indicators that indicate operational information are provided on top and back faces of the covering,
the information indicators are formed at same positions on the top and back faces of the covering, and an information indicator on one of the top and back faces has a recessed portion to indicate operational information, and an information indicator on the other of the top and back faces has a protruding portion to indicate operational information, and
the information indicators are formed such that a contour of the recessed portion is located inside a contour of the protruding portion when seen in a plate thickness direction of the covering.

US Pat. No. 10,249,965

BUSBAR

Yazaki Corporation, Mina...

1. A busbar comprising:a plate-shaped body section configured to connect adjacent electrode terminals of a plurality of unit cells; and
a wire connection section integrally provided on and extended from the body section, and configured to connect an end portion of a wire,
wherein the body section comprises a first plate section, a second plate section, and at least one folding-back section connecting the first plate section and the second plate section;
wherein the first plate section and the second plate section are stacked mutually by folding-back the at least one folding-back section;
wherein the first plate section has an outer shape that is positioned to a busbar accommodation section of a wire routing member made of insulation resin;
wherein a maximum width dimension of the second plate section in a direction parallel to the at least one folding-back section is smaller than that of the first plate section in the direction parallel to the at least one folding-back section;
wherein the first plate section has:
a long-side edge section which serves a longer side of the first plate section, which faces the at least one folding-back section, and which extends in a direction parallel to an extending direction of the at least one folding-back section; and
a pair of short-side edge sections which serve short sides of the first plate section and which extend from both ends of the long-side edge section in a direction substantially perpendicular to an extending direction of the long-side edge section;
wherein two corner sections, each having substantially right angle, are formed by the long-side edge section and the short-side edge sections of the first plate section, respectively,
wherein the second plate section has:
a long-side edge section which serves a longer side of the second plate section, which faces the at least one folding-back section, and which extends in a direction parallel to the extending direction of the at least one folding-back section; and
a pair of short-side edge sections which serve short sides of the second plate section and which extend from both ends of the long-side edge section in a direction substantially perpendicular to an extending direction of the long-side edge section:
wherein two corner sections, each having substantially right angle, are formed by the long-side edge section and the short-side edge sections of the second plate section, respectively,
wherein when the second plate section is folded and stacked to the first plate section by the at least one folding-back section, one of the pair of short-side edge sections of the second plate section is stacked on one of the pair of short-side edge sections of the first plate section; and
wherein a deviation amount between the one of the pair of short-side edge sections of the second plate section and the one of the pair of short-side edge sections of the first plate section at a vicinity of corresponding corner sections of the first plate section and the second plate section in the extending direction of the at least one folding back section is defined as ?, a dimension of the long-side edge section of the first plate section is defined as L1, a dimension of the long-side edge section of the second plate section is defined as L2, and a following formula is satisfied:
L2=L1?2×?.

US Pat. No. 10,249,964

TERMINAL BLOCK

DINKLE ENTERPRISE CO., LT...

1. A terminal block for coupling with at least a conductive wire, the terminal block comprising:an insulation base (100), a docking chamber (101) being defined in the insulation base (100), a plurality of connecting holes (102) for coupling with the conductive wire and a plurality of through holes (103) corresponding to the respective connecting holes (102) being defined on a lateral surface of the insulation base (100), the respective through holes (103) being communicated with the docking chamber (101) and arranged adjacent to the respective corresponding connecting holes (102); and
a circuit board (200) arranged under the insulation base (100) and outside the docking chamber (101), a plurality of LEDs (210) corresponding to the respective through holes (103) being arranged on the circuit board (200), the LEDs (210) being accommodated in the docking chamber (101) and the respective LEDs (210) being able to illuminate through the respective through holes (103),
wherein an opening (104) is defined on the docking chamber (101) and the circuit board (200) is inserted into the docking chamber (101) through the opening (104).

US Pat. No. 10,249,962

WIRELESS ACCESS POINT IN PEDESTAL OR HAND HOLE

CenturyLink Intellectual ...

1. A method, comprising:providing an antenna within a signal distribution device, the signal distribution device comprising a container disposed in a ground surface, a top portion of the container being substantially level with a top portion of the ground surface, wherein the antenna is in line of sight of one or more wireless transceivers each mounted on an exterior surface of a customer premises of one or more customer premises; and
communicatively coupling the antenna to one or more of at least one conduit, at least one optical fiber, at least one conductive signal line, or at least one power line via the container.

US Pat. No. 10,249,961

TRANSMIT DEVICE AND METHOD THEREOF

Huawei Technologies Co., ...

1. A transmit device, comprising:a logical antenna port configured to provide a broadcast component signal;
an antenna array having M number of rows and N number of columns of antenna elements, wherein each antenna element comprises a physical antenna port in one polarization;
a processor, configured to:
select Q number of columns among the N number of columns, where Q?N;
determine a phase centre location (PCL) for the logical antenna port, wherein the PCL is arranged in a point on a vertical axis (A) located in the Q number of columns; and
map the logical antenna port on the physical antenna ports of the Q number of columns based on the determined PCL;
wherein the antenna array is configured to transmit the broadcast component signal on the mapped physical antenna ports of the Q number of columns.

US Pat. No. 10,249,960

DISTRIBUTED ANTENNA SYSTEM AND METHOD OF MANUFACTURING A DISTRIBUTED ANTENNA SYSTEM

Alcatel Lucent, Nozay (F...

1. A distributed antenna system facilitating at least one of transmitting radio frequency (RF) signals and receiving RF signals, wherein said antenna system comprises at least one corrugated elliptical waveguide having an elliptical cross-section, wherein a length of a major axis of the elliptical cross-section is different from a length of a minor axis of the elliptical cross-section, wherein said waveguide comprises a plurality of openings distributed along a longitudinal axis of the elliptical waveguide, wherein different openings are provided at different length coordinates and arranged at different angular positions with respect to the major axis of the elliptical cross-section, wherein the plurality of openings include at least one of different size openings and different shape openings.

US Pat. No. 10,249,959

PATTERNED CONDUCTIVE INK FILM ABSORBER FOR A FOLDABLE TRANSPORTABLE SHELTER

1. An improved low-cost thin-profile radio frequency energy absorber and reflector assembly, comprising: a patterned conductive ink roll film absorber component capable of radio frequency absorption and scattering of various radio energy waves of varying frequencies; a thin fluted air-core plastic extruded sheet component capable of providing structural rigidity and air space for radio energy wave control; a thin metal reflective sheet component capable of providing reflection of radio energy waves; an assembly of the above three layers of components bonded together in a way where the layered assembly can be utilized either independently or integrated into any other type of built-up panel assembly, and is capable of providing control and protection properties related to radio frequency, infrared, electromagnetic pulse, electromagnetic interference, and thermal insulation values.

US Pat. No. 10,249,955

ANTENNA STRUCTURE FOR DISTRIBUTED ANTENNA SYSTEM

CommScope Technologies LL...

1. An antenna structure comprising:a ground plane;
a transmit balanced to unbalanced (BALUN) circuit comprising a first transmit connector coupled to a combined transmit port, and a second transmit connector coupled to the combined transit port;
a receive BALUN circuit comprising a first receive connector coupled to a combined receive port, and a second receive connector coupled to the combined receive port;
a transmit antenna element comprising a first transmit antenna sub-element coupled to the first transmit connector and a second transmit antenna sub-element coupled to the second transmit connector; and
a receive antenna element independent from the transmit antenna element and comprising a first receive antenna sub-element coupled to the first receive connector and a second receive antenna sub-element coupled to the second receive connector, wherein the transmit antenna element and the receive antenna element are orthogonally-polarized with respect to each other.

US Pat. No. 10,249,954

DIPOLE ANTENNA

ARCADYAN TECHNOLOGY CORPO...

1. A dipole antenna, adapted for applications using frequency with wavelength ?, comprising:a substrate, being formed as a flat rectangular with a width W of at least 2.5 mm and a length L according to the formula: L/W=?(±10%), while being made of an insulating material;
a first region, made of a conducting material and being disposed on the substrate at an offset location neighboring to a side of the substrate; and
a second region, made of a conducting material and being disposed on the substrate at an offset location neighboring to another side of the substrate that is corresponding to the first region;
wherein, an adjacent region is defined using a portion of the first region and a portion of the second region that are disposed neighboring to each other and is used for enabling a coupling effect, and the portion of the first region in the adjacent region is spaced from the portion of the second region in the adjacent region by an interval G,
wherein the longitudinal sides of the portion of the first and the second regions that are arranged parallel to the length direction of the substrate of the length L are disposed spacing from each other by an interval G, while enabling the interval G to be formed conforming to the following formula:
G?0.25W.

US Pat. No. 10,249,953

DIRECTIVE FIXED BEAM RAMP EBG ANTENNA

RAYTHEON COMPANY, Waltha...

1. An antenna comprising:a substrate having first and second opposing surfaces with the first surface having a cavity provided therein, the cavity having a ramp portion, a base portion, a sidewall portion, and a back wall portion;
a ground plane disposed over selected portions of the first surface away from the cavity;
a first electromagnetic band gap (EBG) structure disposed about the base portion of the cavity, the EBG structure having a plurality of unit cells; and
a radiating element disposed above the first EBG structure.

US Pat. No. 10,249,950

SYSTEMS AND METHODS FOR REDUCED CONTROL INPUTS IN TUNABLE META-DEVICES

Searete LLC, Bellevue, W...

1. An antenna system, comprising:a plurality of antenna elements;
a feed to convey an electromagnetic (EM) signal;
a tunable port network coupling the feed to the plurality of antenna elements, wherein the tunable port network comprises a plurality of tunable impedance elements that each have a nonlinear response to impedance tuning,
wherein the plurality of tunable impedance elements can be numerically approximated by nonlinear impedance-tuning parameter curves with a cumulative number of selectable nonlinear coefficients; and
a plurality of control inputs to nonlinearly vary impedance values of the tunable impedance elements with nonlinear responses to impedance tuning to allow for selection of each of a plurality of distinct impedance patterns of the tunable port network,
wherein each of the plurality of distinct impedance patterns of the tunable port network corresponds to one of a plurality of distinct field patterns attainable by the antenna system, and
wherein the number of distinct field patterns attainable is a function of the number of control inputs and the cumulative number of selectable nonlinear coefficients associated with the plurality of tunable impedance elements.

US Pat. No. 10,249,949

MICROWAVE MODULATION DEVICE

INNOLUX CORPORATION, Mia...

1. A microwave modulation device, comprising:a first radiator;
a second radiator disposed on the first radiator;
a third radiator disposed on the second radiator;
a first support structure disposed between the first radiator and the second radiator; and
a modulation structure disposed between the second radiator and the third radiator,
wherein a microwave-transmission layer is located in a space defined by the first radiator, the second radiator, and the first support structure,
wherein the microwave-transmission layer is gas, substantially vacuum, liquid, or heat-insulating material.

US Pat. No. 10,249,948

PHASED ARRAY ANTENNAS FOR HIGH ALTITUDE PLATFORMS

The Boeing Company, Chic...

1. An aircraft comprising:a fuselage (230);
wings (232, 234) coupled to the fuselage;
a plurality of planar phased array antennas (106, 132, 134, 210-218, 260) coupled to a transceiver (104) and fixedly attached to the fuselage or at least one of the wings, the plurality of planar phased array antennas including a first planar phased array antenna (132, 210-218) having a first normal vector (220-228, 262, 264) and a second planar phased array antenna (134, 210-218) having a second normal vector (220-228, 262, 264), wherein the first normal vector is not parallel to the second normal vector, wherein the first planar phased array antenna (132) is configured to receive (702) a first signal corresponding to a communication link (336), and wherein the second planar phased array antenna (134) is configured to transmit (704) a second signal corresponding to the communication link; and
the transceiver, the transceiver configured to couple to a feeder link antenna (110), the feeder link antenna configured to receive (952) flight path data associated with a flight path via a communication uplink, wherein a flight controller (112) is configured to operate the aircraft based on the flight path data.

US Pat. No. 10,249,947

MULTI-MODE CONDUCTIVE LIQUID ANTENNA

The United States of Amer...

1. A multi-mode antenna comprising:a liquid that is electrically conductive;
a nonconductive, straight tube designed to contain the conductive liquid, wherein the straight tube has a top end and a bottom end;
a helical coil comprised of non-conductive tubing designed to contain the conductive liquid wherein the helical coil tubing has a top end and a bottom end; and
a pump fluidically coupled to the bottom ends of the straight tube and the helical coil, wherein the pump is configured to pump the conductive liquid between the straight tube and the helical coil, such that when the conductive liquid fills the straight tube and the helical coil tubing is drained, the multi-mode antenna functions as a monopole antenna, and such that when the conductive liquid fills the helical coil tubing and the straight tube is drained, the multi-mode antenna functions as a helical antenna.

US Pat. No. 10,249,946

ADAPTATION OF AN ANTENNA CIRCUIT FOR A NEAR-FIELD COMMUNICATION TERMINAL

STMicroelectronics (Rouss...

7. An antenna circuit, comprising:a first capacitive element and an inductive element electrically coupled to each other by a first node;
a second capacitive element having a first electrode electrically coupled to the first capacitive element and the inductive element by the first node; and
a controller including a differential amplifier having a first input, a second input, and an output, the output connected to the second input and to a second electrode of said second capacitive element, the controller being configured to detect a voltage at the first node, by the first input of the amplifier, and apply a first signal, representative of the voltage at the first node, to the second electrode of said second capacitive element,
wherein the antenna circuit is tuned for near field communications.

US Pat. No. 10,249,944

SYSTEMS, APPARATUS, AND METHODS TO IMPROVE ANTENNA PERFORMANCE IN ELECTRONIC DEVICES

Antwave Intellectual Prop...

1. A dielectric transparent antenna, comprising: at least one layer of solid dielectric transparent substrate; at least one electric circuit with a ground connection; and at least one wave launcher located at an edge of the dielectric transparent substrate on two sides and positioned in irregular manner, wherein the wave launcher is located between the dielectric transparent substrate and the electric circuit with a separation space (h), wherein the wave launcher couples energy to the dielectric transparent substrate, the wave launcher enables the dielectric transparent substrate to radiate electromagnetic wave with a TMN0 mode-like resonant frequency; wherein the space (h) is equal or greater than 1/10 wavelength of antenna's resonant frequency and filled with air; and wherein the energy reinforces inside the dielectric transparent substrate to create the resonance frequency that is minimum to no interference in radiations in order to improve performance of the antenna as the radiation is not blocked by metals.

US Pat. No. 10,249,943

PRINTED CIRCUIT BOARD ASSEMBLY WITH FOAM DIELECTRIC MATERIAL

Massachusetts Institute O...

1. An assembly, comprising:a top sublaminate;
a bottom sublaminate;
a foam dielectric material disposed between the top sublaminate and the bottom sublaminate; and
a via passing through the foam dielectric material, so as to electrically connect a first signal trace on the top sublaminate to a second signal trace on the bottom sublaminate.

US Pat. No. 10,249,942

TWO-WHEELED MOTOR VEHICLE

YAMAHA HATSUDOKI KABUSHIK...

1. A two-wheeled motor vehicle, comprising:a main frame on which a metal structure that reflects electromagnetic waves is mounted, the metal structure including an engine unit; and
first and second antennas, disposed outside the main frame in a width direction of the vehicle, for road-to-vehicle and vehicle-to-vehicle communications, wherein
each of the first and second antennas is a linear antenna, which includes a ground plane and a linear radiation conductor, and
the first and second antennas are placed opposite to each other on two different sides of the metal structure of the main frame, the first and second antennas being so arranged that at least two thirds of the linear radiation conductor of the first antenna and at least two thirds of the linear radiation conductor of the second antenna overlap the engine unit in a side view of the vehicle, so as to form an emission pattern for the first and second antennas that has a larger transmission power in a forward/rearward direction than in the width direction of the vehicle.

US Pat. No. 10,249,941

RADAR SYSTEM FOR A MOTOR VEHICLE

Ford Global Technologies,...

1. A radar system for a motor vehicle, comprising:a mounting bracket including a pivot rod;
a radar support bracket carried on said mounting bracket and displaceable between a deployed position and a deflected position, wherein said radar support bracket includes a first lug and a second lug rotatably received on said pivot rod;
a biasing element biasing said radar support bracket toward said deployed position; and
a radar module carried on said radar support bracket.

US Pat. No. 10,249,940

SIGNAL DISTRIBUTING/COMBINING APPARATUS IN ANTENNA APPARATUS OF MOBILE COMMUNICATION BASE STATION

KMW INC., Hwaseong-si (K...

1. A signal distributing/combining apparatus in an antenna device of a mobile communication base station, the signal distributing/combining apparatus comprising:a circuit board configured to have an upper surface formed with a signal distributing/combining conductor pattern for a high frequency signal distributing/combining operation; and
a support plate configured to have an upper mounting surface of a size corresponding to the circuit board, to mate with the circuit board so that an underside of the circuit board is in close contact with the upper mounting surface for supporting the circuit board, and to fixedly mate with the antenna device at a reflection plate on a bottom side of the support plate,
wherein the support plate is provided with a plurality of cable holders for supporting and fixating coaxial cables for signal transmission, which are connected from outside of the signal distributing/combining apparatus, the signal distributing/combining conductor pattern is formed with a plurality of signal input/output portions, and the plurality of cable holders is formed on the signal distributing/combining conductor pattern at portions corresponding to at least some of the plurality of signal input/output portions, the cable holders having a structure formed elongated longitudinally and corresponding to outer conductors of the coaxial cables in order to mount the coaxial cable by inserting the outer conductors.

US Pat. No. 10,249,939

ANTENNA DEVICES

HEWLETT-PACKARD DEVELOPME...

1. A communication device comprising:a first antenna device for a signal having a frequency within an operation band, the first antenna device comprising:
a ground element;
a radiating element short-circuited to the ground element;
a positive feed connected to the radiating element;
a ground feed coupled to the ground element by a capacitive element, the capacitive element is a substantially open circuit for signals having a frequency lower than the operation band and the capacitive element is a substantially short circuit for signals having a frequency within or higher than the operation band; and
a proximity sensor coupled to the ground element such that the ground element forms an electrode to allow the proximity sensor to capacitively sense whether an object is in proximity of the electrode;
a second antenna device; and
an output power controller to selectively reduce output power of a signal applied to the second antenna device in response to the object being sensed by the proximity sensor of the first antenna device.

US Pat. No. 10,249,937

ELECTRONIC DEVICE ANTENNA WITH SUPPRESSED PARASITIC RESONANCE

Apple Inc., Cupertino, C...

1. An electronic device, comprising:an inverted-F antenna having an inverted-F antenna resonating element arm and having a grounding clip;
a metal housing that serves as antenna ground for the inverted-F antenna;
at least one metal structure that is electrically coupled to the metal housing and that forms at least a portion of a return path coupling the inverted-F antenna resonating element arm to the antenna ground;
a fastener that presses the grounding clip against the at least one metal structure; and
an insulating structure interposed between a portion of the fastener and the grounding clip, wherein the housing comprises aluminum, has an anodized coating in a first region, and has a second region without any of the anodized coating to which the at least one metal structure is electrically coupled.

US Pat. No. 10,249,934

WIRELESSLY-COMMUNICABLE MEMORY CARD

TOSHIBA MEMORY CORPORATIO...

1. A memory card, comprising:a substrate;
a nonvolatile memory on the substrate;
a memory controller on the substrate and configured to control access to the nonvolatile memory;
an interface terminal for external wired connection, on the substrate;
an antenna, a region surrounded by the antenna including a first region that overlaps with the substrate and a second region that does not overlap with the substrate; and
a communication controller on the substrate, electrically connected to the antenna, and configured to wirelessly communicate with an external device through the antenna, using power generated at the antenna by an electromagnetic induction caused by the external device.

US Pat. No. 10,249,933

ANTENNA DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME

Samsung Electronics Co., ...

1. An antenna device for an electronic device including a first housing and a second housing rotatably coupled to the first housing about a hinge axis, the antenna device comprising:an antenna carrier mounted on an inner face of the first housing;
a radiation conductor disposed in the first housing; and
a reflection member disposed adjacent to the radiation conductor in the first housing,
wherein,
radio waves transceived by the radiation conductor are radiated via the reflection member,
the antenna carrier includes a body portion mounted on the inner face of the first housing and an extension portion protruding from a side face of the body portion, and
the radiation conductor and the refection member are mounted on the side face and the extension portion, respectively.

US Pat. No. 10,249,931

ANTENNA MODULE AND WIRELESS CONTROL SYSTEM INCLUDING THE SAME

LG INNOTEK CO., LTD., Se...

1. An antenna module comprising:a first antenna unit;
a second antenna unit, the second antenna unit and the first antenna unit being symmetrically disposed with respect to a wall interposed therebetween; and
an antenna connection unit that penetrates the wall, is fitted to a hole formed on the wall and connects the first antenna unit with the second antenna unit,
wherein the first antenna unit is connected to one end of the antenna connection unit through a first coupler, and the second antenna unit is connected to the other end of the antenna connection unit through a second coupler;
wherein the antenna connection unit comprises an antenna line, an insulating layer that surrounds the antenna line, a ground layer that surrounds the insulating layer, and a sheath that surrounds the ground layer;
wherein each of the first antenna unit and the second antenna unit includes a ground, a reflection plate disposed on the ground and an antenna disposed on the reflection plate,
wherein each of the first coupler and the second coupler includes a female section and a male section, and the female section and the male section are coupled by being engaged with each other,
wherein one of the female section and the male section in each of the first coupler and the second coupler is connected to the ground in each of the first antenna unit and the second antenna unit, respectively, and
wherein the other of the female section and the male section in each of the first coupler and the second coupler is connected to the ground layer in the antenna connection unit.

US Pat. No. 10,249,924

COMPACT VIA STRUCTURES AND METHOD OF MAKING SAME

INTEL CORPORATION, Santa...

1. A device comprising:a substrate including a layer of first dielectric material;
a sidewall structure forming a hole region that extends at least partially through the layer of first dielectric material of the substrate, the sidewall structure comprising second dielectric material;
a first via extending at least partially through the layer of first dielectric material, the first via adjacent to the sidewall structure; and
a second via extending at least partially through the layer of first dielectric material, the second via adjacent to the sidewall structure;
wherein a cross-sectional profile of the first via conforms to a sector of a first circle, wherein a cross-sectional profile of the second via conforms to a sector of a second circle offset from the first circle, and wherein a cross-sectional profile of the sidewall structure conforms to a sector of a third circle overlapping both the first circle and second circle, wherein a diameter of the first circle is equal to a diameter of the second circle and equal to a diameter of the third circle and wherein the third circle is part of the hole region formed by the sidewall structure having the second dielectric material located between the first via and second via.

US Pat. No. 10,249,923

ULTRA WIDE BAND FIXED PHASE SHIFTER BASED ON CAPACITIVE LOAD AND HAVING N PHYSICALLY SEPARATED PHASE SHIFT UNITS WITH ORTHOCOUPLERS THEREIN

NANJING MILEWEI CORP., N...

1. An ultra wide band fixed phase shifter based on capacitive loads, comprising:N physically separated phase shift units, (N?1) phase shift states being implemented by accessing respective signal input ends and respective signal output ends of different phase shift units, wherein:
each phase shift unit comprises a respective orthocoupler, respective first and second transmission lines, and respective first and second capacitive loads, wherein the corresponding orthocoupler comprises an input end, a coupling end, a direct-connection end and an isolation end, one end of the respective first transmission line serves as the signal input end of the respective phase shift unit and the other end is connected with the input end of the corresponding orthocoupler, one end of the respective second transmission line serves as the signal output end of the respective phase shift unit and the other end is connected with the isolation end of the corresponding orthocoupler;
one end of the first capacitive load is connected with the coupling end of the corresponding orthocoupler and the other end is grounded;
one end of the second capacitive load is connected with the direct-connection end of the corresponding orthocoupler and the other end is grounded,
wherein the respective orthocoupler is an ultra wide band orthocoupler cascaded by corresponding spiral inductor coupling units including two or more stages;
each stage of the two or more stages of spiral inductor coupling unit comprises two mutually coupled spiral inductors;
two adjacent stages of the two or more stages of spiral inductor coupling units are respectively connected in series with one of the two mutually coupled spiral inductors in a post-stage of the two or more stages of the spiral inductor coupling units through the two mutually coupled spiral inductors in a prior-stage of the two or more stages of the spiral inductor coupling units to implement a prior-post stage cascade;
one end of one spiral inductor cascaded in a first stage of the two or more stages of the spiral inductor coupling units in the respective orthocoupler and located outside the respective orthocoupler is the coupling end of the respective orthocoupler and one end of the other spiral inductor located outside the respective orthocoupler is the input end of the respective orthocoupler;
one end of one spiral inductor cascaded in a last stage of the two or more stages of the spiral inductor coupling units in the respective orthocoupler and located outside the respective orthocoupler is the direct-connection end of the respective orthocoupler and one end of the other spiral inductor located outside the respective orthocoupler is the isolation end of the respective orthocoupler; and
the coupling interval or microstrip band width of each spiral inductor coupling unit in the respective orthocoupler from the exterior of the respective orthocoupler to the interior of the respective orthocoupler decreases gradually.

US Pat. No. 10,249,920

BATTERY CELL ASSEMBLY

LG Chem, Ltd., Seoul (KR...

1. A battery cell assembly, comprising:a pouch battery cell having an external pouch housing and first and second electrical terminals extending from the external pouch housing; the external pouch housing having a central housing pouch portion and a peripheral lip member extending around a periphery of the central housing pouch portion; the peripheral lip member having a first peripheral lip pouch portion with a first extension pouch portion, a first arcuate-shaped pouch portion, and a first end pouch portion; the first extension pouch portion extending outwardly from the central housing pouch portion in a first direction, the first arcuate-shaped pouch portion being coupled to and between the first extension pouch portion and the first end pouch portion; and
a first tube contacting the first extension pouch portion and the first arcuate-shaped pouch portion of the peripheral lip member of the external pouch housing, the first arcuate-shaped pouch portion being wrapped around a portion of a periphery of a first tube portion of the first tube, the first end pouch portion of the peripheral lip pouch portion of the peripheral lip member having a weld interface with a top surface of the first extension pouch portion such that the first peripheral lip pouch portion extends 360 degrees to define and enclose a first interior space that is sized and shaped to receive the first tube portion of the first tube therein, and the first tube portion of the first tube being disposed within the first interior space; and
wherein the external housing is constructed of a sheet, the sheet being formed by laminating a polymer film on a metal sheet made of aluminum.

US Pat. No. 10,249,919

BATTERY CELL HAVING IMPROVED COOLING PERFORMANCE

LG Chem, Ltd., (KR)

1. A battery cell configured to have a structure in whichan electrode stack, which is configured to have a structure in which positive electrodes and negative electrodes are stacked in a height direction on a basis of a ground in a state in which separators are disposed respectively between the positive electrodes and the negative electrodes, is mounted in a battery case in a sealed state,
the battery case is formed in a pipe shape having a hollow part, the battery case having a top surface and a bottom surface opposite the top surface, the hollow part extending completely through the battery case and completely through the top and bottom surfaces, and
the electrode stack is formed in a shape corresponding to the shape of the battery case,
wherein the battery cell has a positive electrode input/output terminal and a negative electrode input/output terminal protruding from opposite ends of the battery case.

US Pat. No. 10,249,918

BATTERY PACKS FOR ELECTRIC TOOLS

MAKITA CORPORATION, Anjo...

1. A battery pack for detachably mounting to a tool main body of an electric tool for serving as a power source, the battery pack comprising:a case;
a battery device disposed within the case, the battery device including a cell holder configured to accommodate a plurality of battery cells that are dischargeable and chargeable, the cell holder including a plurality of cell accommodation portions, each one of the plurality of cell accommodation portions being contoured to an outer peripheral surface of one of the plurality of battery cells and configured to accommodate one of the plurality of battery cells;
an intervening member attaching portion recessed in at least one cell accommodation portion and contoured to a shape of the outer peripheral surface of one of the plurality of battery cells; and
an intervening member and a thermistor disposed between the cell holder and at least one of the plurality of battery cells, the thermistor including a temperature detection element and conductive wires, the intervening member and the thermistor being arranged in an order of the intervening member and the thermistor from a side of the cell holder, the thermistor being attached at a proximal end to the cell holder and having an elongated length contoured to the shape of the outer peripheral surface of one of the plurality of battery cells, the temperature detection element being disposed on a distal end of the thermistor and the conductive wires extending across the contoured elongated length of the thermistor, the proximal end of the thermistor curving away from the outer peripheral surface of the one of the plurality of battery cells and towards the cell holder, wherein:
the intervening member is entirely disposed along the contoured intervening member attaching portion, and disposed between the intervening member attaching portion and the outer peripheral surface of the battery cell accommodated in the cell accommodation portion; and
the temperature detection element has an electric resistance that changes depending on a temperature, and the temperature detection element is supported by the cell holder and the intervening member so as to elastically contact with the at least one of the plurality of battery cells.

US Pat. No. 10,249,917

POWER SOURCE DEVICE

YAZAKI CORPORATION, Toky...

1. A power source device comprising:a battery assembly comprising a plurality of battery cells which are aligned;
a bus bar module formed by linking a plurality of bus bar storing portions which store a plurality of bus bars which link and connect electrodes of the battery assembly;
a smoke exhausting duct provided on one side of the battery assembly; and
a control board provided on a portion of the smoke exhausting duct and electrically connected to a voltage detection terminal for detecting a voltage of each of the battery cells, a seat portion of the control board covering the portion of the smoke exhausting duct and defining an interior surface of the smoke exhausting duct,
wherein the portion of the smoke exhausting duct is in a flattened shape having side walls of a smaller height and a wide portion of a larger width in comparison with another portion of the smoke exhausting duct.

US Pat. No. 10,249,902

SECONDARY BATTERY TRANSFER DEVICE AND METHOD FOR DETECTING RECEIPT FAILURE OF SECONDARY BATTERY

LG Chem, Ltd., Seoul (KR...

5. A secondary battery transfer apparatus comprising:a carrier including a box-shaped supporter and plate-shaped diaphragms formed on the supporter and separated from each other, and having a receipt space formed between the upper surface of the supporter and the diaphragms to receive a secondary battery;
a transfer unit transferring the carrier;
light emitting units emitting light upward via a gap between the diaphragms from the upper surface of the supporter; and
a light receiving unit located above the carrier, receiving the light emitted from the light emitting units, and outputting the quantity of the received light.

US Pat. No. 10,249,895

APPARATUS AND METHOD FOR DIAGNOSING STATE OF FUEL CELL STACK

HYUNDAI MOTOR COMPANY, S...

1. An apparatus comprising:a stack voltage monitor (SVM) configured to
measure a voltage of each channel of a plurality of channels of a fuel cell stack, each channel of the plurality of channels including a predetermined number of unit cells, and
calculate impedances of a subset of the plurality of channels having voltages affecting diagnosis of the fuel cell stack; and
a controller configured to diagnose a state of the fuel cell stack based on the calculated impedances, wherein the SVM is configured to estimate a distribution of impedances of all the channels of the fuel cell stack based on a distribution of the calculated impedances of the subset of the plurality of channels.

US Pat. No. 10,249,894

FUEL CELL SYSTEM

NISSAN MOTOR CO., LTD., ...

1. A fuel cell system comprising:a first fuel cell stack;
a second fuel cell stack with lower output voltage than the first fuel cell stack, a pre-switching stack configured by the first fuel cell stack or the second fuel cell stack, a step-up stack configured by the first fuel cell stack or the second fuel cell stack, a post-switching stack configured by at least the first fuel cell stack; and
an electricity control device configured to step up voltage of the step-up stack with the pre-switching stack connected to a load and then switch to a connection state where the post-switching stack is connected to the load.

US Pat. No. 10,249,893

FUEL CELL ARCHITECTURES, MONITORING SYSTEMS, AND CONTROL LOGIC FOR CHARACTERIZING FLUID FLOW IN FUEL CELL STACKS

GM Global Technology Oper...

1. A method for operating a fuel cell system of a motor vehicle, the motor vehicle including a vehicle controller, a plurality of road wheels, and a traction motor operable to drive at least one of the road wheels, the method comprising:transmitting, via the vehicle controller, a command signal to the fuel cell system to generate electricity to power the traction motor and thereby drive at least one of the road wheels;
determining, via the vehicle controller, a voltage-property correlation between voltage change of the fuel cell system and flow property change of a fluid in the fuel cell system;
determining, from the voltage-property correlation, a calibrated voltage drop corresponding to the flow property change of the fluid;
monitoring a system voltage of the fuel cell system;
detecting a voltage magnitude change in the system voltage; and
responsive to a determination that the voltage magnitude change is greater than the calibrated voltage drop, outputting a signal indicating detection of the flow property change, a signal to the fuel cell system to discontinue generating electricity, and/or a signal to close an anode valve operable to regulate transmission of anode exhaust gas from of the fuel cell system.

US Pat. No. 10,249,883

SOFC CATHODE COMPOSITIONS WITH IMPROVED RESISTANCE TO SOFC DEGRADATION

BLOOM ENERGY CORPORATION,...

1. A solid oxide fuel cell (SOFC), comprising:a solid oxide electrolyte comprising a zirconia-based ceramic;
an anode electrode; and
a cathode electrode comprising an electrically conductive component and an ionically conductive component, wherein the ionically conductive component comprises a zirconia-based ceramic containing scandia, 0.25-1.25 mol % ceria, and 0.25-1.25 mol % ytterbia, yttria, or a combination of ytterbia and yttria.

US Pat. No. 10,249,878

NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY

TOYOTA JIDOSHA KABUSHIKI ...

1. A non-aqueous electrolyte secondary battery comprising:a case;
a non-aqueous electrolyte solution; and
an electrode group,
the non-aqueous electrolyte solution and the electrode group being housed in the case,
the non-aqueous electrolyte solution including an aprotic solvent and a supporting electrolyte salt,
the electrode group including a positive electrode, a negative electrode, a separator and a low spring constant film,
each of the positive electrode, the negative electrode, the separator and the low spring constant film at least partially including a porous structure,
the positive electrode, the negative electrode, the separator and the low spring constant film being impregnated with the non-aqueous electrolyte solution,
in the electrode group, the positive electrode and the negative electrode being stacked so as to face each other with the separator and the low spring constant film interposed therebetween,
the positive electrode or the negative electrode having a first spring constant that is the lowest spring constant of the positive electrode, the negative electrode and the separator,
the low spring constant film having a second spring constant, and
the second spring constant being lower than the first spring constant.

US Pat. No. 10,249,873

COMPOSITE POSITIVE ACTIVE MATERIAL, POSITIVE ELECTRODE INCLUDING THE SAME, AND LITHIUM BATTERY INCLUDING THE POSITIVE ELECTRODE

SAMSUNG ELECTRONICS CO. L...

1. A composite positive active material comprising a composite represented by Formula 1:?Li2MO3.(1??)[xLi2MnO3.(1?x)LidNiaCObM?cO2]  Formula 1wherein, in Formula 1,M is Ti or Zr;
M? is Mn, V, Mg, Ga, Si, W, Mo, Fe, Cr, Cu, Zn, Ti, Al, B, or a combination thereof;
0

US Pat. No. 10,249,868

SECONDARY BATTERY INCLUDING CAP PLATE INCLUDING INVERSION PLATE

Samsung SDI Co., Ltd., Y...

1. A secondary battery comprising:an electrode assembly;
a case accommodating the electrode assembly;
a cap plate sealing the case and comprising an inversion plate;
an insulation plate comprising a short-circuit hole corresponding to the inversion plate and a first air hole spaced apart from the short-circuit hole and located along a top surface of the cap plate, the insulation plate being coupled to the top surface of the cap plate; and
a terminal plate coupled to a top surface of the insulation plate and electrically coupled to the electrode assembly,
wherein the first air hole is a hole coupling from a top portion of the inversion plate to the outside of the insulation plate, and
wherein the first air hole and the short-circuit hole extend in respective directions that are different from one another.

US Pat. No. 10,249,867

PRISMATIC SECONDARY BATTERY AND ASSEMBLED BATTERY USING THE SAME

SANYO Electric Co., Ltd.,...

1. A prismatic secondary battery comprising:a first flat-shaped winding electrode body in which a first positive electrode plate and a first negative electrode plate are wound with a first separator interposed therebetween;
a second flat-shaped winding electrode body in which a second positive electrode plate and a second negative electrode plate are wound with a second separator interposed therebetween;
a prismatic outer body that has an opening and that houses the first flat-shaped winding electrode body and the second flat-shaped winding electrode body;
a sealing plate that seals the opening;
a positive electrode terminal that is electrically connected to the first positive electrode plate and the second positive electrode plate and attached to the sealing plate;
a positive electrode current collector that electrically connects the first positive electrode plate and the second positive electrode plate and the positive electrode terminal;
a negative electrode terminal that is electrically connected to the first negative electrode plate and the second negative electrode plate and attached to the sealing plate; and
a negative electrode current collector that electrically connects the first negative electrode plate and the second negative electrode plate and the negative electrode terminal,
wherein the first flat-shaped winding electrode body includes a plurality of first positive electrode tab portions and a plurality of first negative electrode tab portions at one end in a direction in which a winding axis of the first flat-shaped winding electrode body extends, and
wherein the second flat-shaped winding electrode body includes a plurality of second positive electrode tab portions and a plurality of second negative electrode tab portions at one end in a direction in which a winding axis of the second flat-shaped winding electrode body extends,
the first flat-shaped winding electrode body and the second flat-shaped winding electrode body are housed in the prismatic outer body so that the winding axis of the first flat-shaped winding electrode body and the winding axis of the second flat-shaped winding electrode body are disposed in a direction substantially perpendicular to the sealing plate,
the plurality of first positive electrode tab portions and the plurality of first negative electrode tab portions are located on one end of the first flat-shaped winding electrode body closer to the sealing plate than the other end, and
the plurality of second positive electrode tab portions and the plurality of second negative electrode tab portions are located on one end of the second flat-shaped winding electrode body closer to the sealing plate than the other end,
wherein the positive electrode current collector includes a first connecting portion connected to the positive electrode terminal, and a second connecting portion welded to the plurality of first positive electrode tab portions,
the first connecting portion is spaced away from the second connecting portion in a longitudinal direction of the sealing plate, and
a distance between the sealing plate and the second connecting portion is greater than a distance between the sealing plate and the first connecting portion in the direction substantially perpendicular to the sealing plate.

US Pat. No. 10,249,865

BUS BAR MODULE

YAZAKI CORPORATION, Mina...

1. A bus bar module comprising:a plurality of bus bar cases made of a resin, each bus bar case configured to house a bus bar to connect a positive electrode of a battery cell and a negative electrode of an adjacent battery cell among battery cells arrayed such that the positive electrodes and the negative electrodes of the battery cells are arranged alternately;
a first engagement portion provided to one of the plurality of bus bar cases;
a first connecting member having flexibility and configured to connect the plurality of bus bar cases;
a plurality of insulating covers made of a resin, the insulating covers configured to cover openings of the plurality of bus bar cases and including a second engagement portion to be engaged with the first engagement portion;
a second connecting member having flexibility and configured to connect the plurality of insulating covers; and
a pair of first ribs provided to extend downward from an inner surface of each of the insulating covers located adjacent to each other while interposing the second connecting member in between, the pair of first ribs configured to be in contact respectively with inner surfaces of paired walls of the corresponding bus bar case, the walls extending in a direction of arrangement of the bus bar cases and facing each other, wherein
the insulating covers are provided with a second rib facing the second engagement portion in such a manner that the first engagement portion on the bus bar case is nipped between the second rib and the second engagement portion.

US Pat. No. 10,249,860

CARTRIDGE FRAME HAVING DOUBLE SIDEWALL STRUCTURE AND BATTERY MODULE HAVING THE SAME

LG Chem, Ltd., (KR)

1. A cartridge frame which is inserted between a plurality of unit battery cells stacked, the cartridge frame comprising:an inter-cell separation plate with a planar shape inserted between adjacent unit battery cells to separate the adjacent unit battery cells; and
a sidewall part extending in a direction perpendicular to the planar surface of the inter-cell separation plate at an edge other than an edge of a direction in which an electrode terminal of the battery cell is drawn, among edges of the inter-cell separation plate,
wherein for at least a portion of the sidewall part, an inner sidewall coming into contact with a side surface of the unit battery cell is made from metal, and an outer sidewall facing the inner sidewall is made from plastic.

US Pat. No. 10,249,859

BATTERY BUILT-IN BOARD AND METHOD FOR MANUFACTURING THE SAME

SHINKO ELECTRIC INDUSTRIE...

1. A battery built-in board comprising:a battery component comprising a battery and an insulation part covering the battery;
an insulation layer covering the battery component; and
a wiring layer formed on an upper surface of the insulation layer,
wherein rigidity of the insulation part is lower than that of the insulation layer,
wherein the battery comprises:
a plus electrode;
a minus electrode;
a cathode connected to the plus electrode;
an anode connected to the minus electrode;
an electrolyte layer provided between the anode and cathode;
a protective layer covering the cathode, the anode, and the electrolyte layer; and
a substrate on which the plus electrode, the minus electrode, the cathode, the anode, the electrolyte layer, and the protective layer are formed,
wherein the battery component further comprises:
a first connection electrode connected to the plus electrode; and
a second connection electrode connected to the minus electrode,
wherein the insulation part is formed on the protective layer, the first connection electrode, the second connection electrode, the plus electrode, the minus electrode, the cathode, the anode, the electrolyte layer, and the protective layer are embedded in the insulation part with an upper surface of the first connection electrode and an upper surface of the second connection electrode exposed from the insulation part,
wherein a first via hole and a second via hole are formed in the insulation layer, the first via hole communicating with the upper surface of the first connection electrode, and the second via hole communicating with the upper surface of the second connection electrode, and
wherein a first via conductor is provided in the first via hole and connects the wiring layer to the first connection electrode, and a second via conductor is provided in the second via hole and connects the wiring layer to the second connection electrode.

US Pat. No. 10,249,852

SECONDARY BATTERY INCLUDING CONNECTOR COUPLED TO ELECTRODE ASSEMBLY AND CURRENT COLLECTOR

Samsung SDI Co., Ltd., Y...

1. A secondary battery comprising:a case having an internal space;
an electrode assembly inserted into the case and including a first electrode plate, a second electrode plate, and a separator between the first electrode plate and the second electrode plate;
an electrode tab electrically connected to the electrode assembly;
a cap plate sealing the case;
a current collector electrically connected to the electrode tab;
an electrode terminal electrically connected to the current collector and configured to pass through the cap plate to protrude toward the outside along an extension direction of the electrode terminal; and
a connector having an end coupled to the electrode assembly and an other end coupled to the current collector, the connector comprising a fastening portion having a protrusion shaped as a triangular pillar and extending through the current collector along the extension direction of the electrode terminal.

US Pat. No. 10,249,851

STACKED BATTERY

TOYOTA JIDOSHA KABUSHIKI ...

1. A stacked battery comprising:a first electrode body including
a plurality of positive electrode plates,
a plurality of negative electrode plates, and
a plurality of separators,
each of the positive electrode plates and each of negative electrode plates being alternately stacked with each of the separators interposed between each of the positive electrode plates and each of the negative electrode plates;
a second electrode body including
a plurality of positive electrode plates,
a plurality of negative electrode plates, and
a plurality of separators,
each of the positive electrode plates and each of negative electrode plates being alternately stacked with each of the separators interposed between each of the positive electrode plates and each of the negative electrode plates;
the second electrode body provided above the first electrode body,
each positive electrode plate including a positive electrode protruding portion protruding more laterally than the negative electrode plate,
each negative electrode plate including a negative electrode protruding portion protruding more laterally than the positive electrode plate;
a first current collecting case being electrically conductive, the first current collecting case including a first facing portion facing the first electrode body in a stacking direction of the first electrode body and the second electrode body;
a second current collecting case being electrically conductive, the second current collecting case housing the first electrode body, the second current collecting case being disposed between the first electrode body and the second electrode body, the second current collecting case being configured to be electrically insulated from the first current collecting case, the second current collecting case including a second facing portion facing one of the first electrode body and the second electrode body in the stacking direction; and
a third current collecting case being electrically conductive, the third current collecting case housing the second electrode body, the third current collecting case being configured to be electrically insulated from the second electrode body, the third current collecting case including a third facing portion facing the second electrode body in the stacking direction,
the first current collecting case, the second current collecting case, and the third current collecting case being stacked in this order in the stacking direction,
the first current collecting case including a first positive electrode wall portion, the first positive electrode wall portion extending from an edge portion of the first facing portion such that the first positive electrode wall portion covers a first side portion where the positive electrode protruding portion of the first electrode body is located, an inner surface of the first positive electrode wall portion being electrically connected to an edge side of the positive electrode protruding portion of the first electrode body,
the second current collecting case including a second positive electrode wall portion, the second positive electrode wall portion extending from an edge portion of the second facing portion such that the second positive electrode wall portion covers a first side portion where the positive electrode protruding portion of the second electrode body is located, an inner surface of the second positive electrode wall portion being electrically connected to an edge side of the positive electrode protruding portion of the second electrode body, the second current collecting case including a first negative electrode wall portion, the first negative electrode wall portion extending from an edge portion of the second facing portion such that the first negative electrode wall portion covers a second side portion where the negative electrode protruding portion of the first electrode body is located, an inner surface of the first negative electrode wall portion being electrically connected to an edge side of the negative electrode protruding portion of the first electrode body,
the third current collecting case including a second negative electrode wall portion, the second negative electrode wall portion extending from an edge portion of the third facing portion such that the second negative electrode wall portion covers a second side portion where the negative electrode protruding portion of the second electrode body is located, an inner surface of the second negative electrode wall portion being electrically connected to an edge side of the negative electrode protruding portion of the second electrode body.

US Pat. No. 10,249,848

ORGANIC LIGHT-EMITTING PANEL AND METHOD FOR PRODUCING SAME

JOLED INC., Tokyo (JP)

1. An organic light-emitting panel, comprising:a first electrode that is light-reflecting;
a functional layer having a single layer or multi-layer structure, located on the first electrode;
an organic light-emitting layer located on the functional layer, the organic light-emitting layer including a red organic light-emitting layer portion defining a red organic light-emitting element, a green organic light-emitting layer portion defining a green organic light-emitting element, and a blue organic light-emitting layer portion defining a blue organic light-emitting element;
a second electrode that is light-transmitting, located above the organic light-emitting layer;
a first layer located on the second electrode;
a second layer located on the first layer;
a sealing layer located on the second layer, the sealing layer composed of aluminum oxide;
a resin sealing layer located on the sealing layer; and
a substrate located on the resin sealing layer, the substrate being adhered to the sealing layer via the resin sealing layer, wherein
a refractive index of the second electrode is at least 2.0 and no greater than 2.4,
a refractive index of the first layer is at least 1.3 and no greater than 1.6,
a refractive index of the second layer is at least 1.7 and no greater than 2.1,
the refractive index of the first layer is lower than the refractive index of the second electrode, and a difference between the refractive index of the first layer and the refractive index of the second electrode is at least 0.4 and no greater than 1.1,
the refractive index of the first layer is lower than the refractive index of the second layer, and a difference between the refractive index of the first layer and the refractive index of the second layer is at least 0.1 and no greater than 0.8,
the first layer includes metal fluoride and has thickness of at least 75 nm and no greater than 120 nm,
a thickness of the functional layer is different below each of the red organic light-emitting layer portion, the green organic light-emitting layer portion, and the blue organic light-emitting layer portion, the thickness being set such that a resonator structure within each of the red organic light-emitting element, the green organic light-emitting element, and the blue organic light-emitting element is either a 1st cavity structure or a 2nd cavity structure,
a maximum thickness of the functional layer is no greater than 70 nm, and
the thickness of the first layer, the difference between the refractive index of the first layer and the refractive index of the second electrode, and the difference between the refractive index of the first layer and the refractive index of the second layer produce interference between light travelling along a first optical pathway and light travelling along a second optical pathway, the light travelling along the first optical pathway not being reflected at an interface between the second electrode and the first layer, the light travelling along the second optical pathway being reflected at the interface between the second electrode and the first layer and reflected by the first electrode.

US Pat. No. 10,249,844

LIGHT-EMITTING DISPLAY PANEL

INNOLUX CORPORATION, Mia...

1. A light-emitting display panel, comprising:a substrate comprising a display area and a peripheral area surrounding the display area, and the substrate having a top surface;
a light-emitting display structure disposed on the display area;
a first section wall disposed on the peripheral area and surrounding the light-emitting display structure, wherein the first section wall is dash-circular shape;
an enclosed wall disposed on the peripheral area, wherein the enclosed wall surrounds the first section wall and is positioned outside the first section wall; and
a first inorganic material layer covering the light-emitting display structure and a portion of the top surface outside the enclosed wall.

US Pat. No. 10,249,843

DISPLAY DEVICE WITH LIGHT TRANSMISSION AREA

Samsung Display Co., Ltd....

1. A display device, comprising:a substrate comprising a first area displaying an image and a second area adjacent to the first area, the second area transmitting external light;
a first electrode and a second electrode disposed in the first area and overlapping each other;
an emission layer disposed between the first electrode and the second electrode in the first area;
a first semiconductor layer disposed in the first area; and
a second semiconductor layer disposed in the second area,
wherein the second semiconductor layer is not connected to the first electrode and the second electrode.

US Pat. No. 10,249,836

PHOTODETECTOR

Tsinghua University, Bei...

1. A photodetector comprising:a substrate,
an interdigital electrode layer comprising a first interdigital electrode and a second interdigital electrode, wherein the first interdigital electrode and the second interdigital electrode are spaced from and staggered with each other; and
a photoactive layer;
wherein the interdigital electrode layer is sandwiched between the substrate and the photoactive layer, the first interdigital electrode comprises a first connection part and a plurality of first interdigital parts in connection with the first connection part, and the plurality of first interdigital parts are parallel with and spaced apart from each other; the second interdigital electrode comprises a second connection part and a plurality of second interdigital parts in connection with the second connection part, and the plurality of second interdigital parts are parallel with and spaced apart from each other; the plurality of first interdigital parts and the plurality of second interdigital parts are staggered and spaced apart from each other, a distance between adjacent one of the plurality of first interdigital parts and one of the plurality of the second interdigital parts is about 20 ?m.

US Pat. No. 10,249,835

DISPLAY DEVICE AND PORTABLE TERMINAL

Samsung Display Co., Ltd....

1. A display device comprising:a display panel comprising a first portion, a second portion extending from the first portion, and a third portion extending from the second portion and facing the first portion, at least one of the first portion, the second portion, and the third portion comprising a display area configured to display an image;
a body configured to be located between the first and third portions and being configured to be separably coupled to the display panel in a first state, being configured to be separably coupled to the display panel in a second state, and being configured to be separated from each of the first portion, the second portion, and the third portion of the display panel, the body comprising a first surface, a second surface facing the first surface, a third surface connecting the first and second surfaces, and a fourth surface facing the third surface;
a driver configured to drive the display panel; and
a printed circuit board configured to apply a signal to the driver to drive the display panel, wherein the display panel covers the first, second, and third surfaces of the body in the first state, and wherein the display panel covers the first, second, and fourth surfaces of the body in the second state.

US Pat. No. 10,249,830

CARBAZOLE-BASED COMPOUND AND ORGANIC LIGHT-EMITTING DEVICE INCLUDING THE SAME

Samsung Display Co., Ltd....

1. A carbazole-based compound represented by Formula 1:
wherein, in Formulae 1 and 2,
R1 to R8 are each independently selected from a group represented by Formula 2, hydrogen, deuterium, —F, —Cl, —Br, —I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid group or a salt thereof, a substituted or unsubstituted C1-C60 alkyl group, a substituted or unsubstituted C2-C60 alkenyl group, a substituted or unsubstituted C2-C60 alkynyl group, a substituted or unsubstituted C1-C60 alkoxy group, a substituted or unsubstituted C3-C10 cycloalkyl group, a substituted or unsubstituted C1-C10 heterocycloalkyl group, a substituted or unsubstituted C3-C10 cycloalkenyl group, a substituted or unsubstituted C1-C10 heterocycloalkenyl group, a substituted or unsubstituted C6-C60 aryl group, a substituted or unsubstituted C6-C60 aryloxy group, a substituted or unsubstituted C6-C60 arylthio group, a substituted or unsubstituted C1-C60 heteroaryl group, a substituted or unsubstituted monovalent non-aromatic condensed polycyclic group, a substituted or unsubstituted monovalent non-aromatic condensed heteropolycyclic group, and —Si(Q1)(Q2)(Q3), and at least one selected from R1 to R8 is a group represented by Formula 2,
ring A and ring B are each independently selected from a benzene, a naphthalene, an anthracene, and a phenanthrene,
R9 is selected from a group represented by Formula 2 and *-(L2)a2-Ar1,
L1 and L2 are each independently selected from a substituted or unsubstituted C3-C10 cycloalkylene group, a substituted or unsubstituted C1-C10 heterocycloalkylene group, a substituted or unsubstituted C3-C10 cycloalkenylene group, a substituted or unsubstituted C1-C10 heterocycloalkenylene group, a substituted or unsubstituted C6-C60 arylene group, a substituted or unsubstituted C1-C60 heteroarylene group, a substituted or unsubstituted divalent non-aromatic condensed polycyclic group, and a substituted or unsubstituted divalent non-aromatic condensed heteropolycyclic group,
a1 and a2 are each independently selected from 0, 1, 2, 3, 4, and 5,
Ar1 is selected from a substituted or unsubstituted C1-C60 alkyl group, a substituted or unsubstituted C2-C60 alkenyl group, a substituted or unsubstituted C2-C60 alkynyl group, a substituted or unsubstituted C1-C60 alkoxy group, a substituted or unsubstituted C3-C10 cycloalkyl group, a substituted or unsubstituted C1-C10 heterocycloalkyl group, a substituted or unsubstituted C3-C10 cycloalkenyl group, a substituted or unsubstituted C1-C10 heterocycloalkenyl group, a substituted or unsubstituted C6-C60 aryl group, a substituted or unsubstituted C1-C60 heteroaryl group, a substituted or unsubstituted monovalent non-aromatic condensed polycyclic group, and a substituted or unsubstituted monovalent non-aromatic condensed heteropolycyclic group,
R11 and R12 are each independently selected from hydrogen, deuterium, —F, —Cl, —Br, —I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid group or a salt thereof, a substituted or unsubstituted C1-C60 alkyl group, a substituted or unsubstituted C2-C60 alkenyl group, a substituted or unsubstituted C2-C60 alkynyl group, a substituted or unsubstituted C1-C60 alkoxy group, a substituted or unsubstituted C3-C10 cycloalkyl group, a substituted or unsubstituted C1-C10 heterocycloalkyl group, a substituted or unsubstituted C3-C10 cycloalkenyl group, a substituted or unsubstituted C1-C10 heterocycloalkenyl group, a substituted or unsubstituted C6-C60 aryl group, a substituted or unsubstituted C6-C60 aryloxy group, a substituted or unsubstituted C6-C60 arylthio group, a substituted or unsubstituted C1-C60 heteroaryl group, a substituted or unsubstituted monovalent non-aromatic condensed polycyclic group, a substituted or unsubstituted monovalent non-aromatic condensed heteropolycyclic group, and —Si(Q4)(Q5)(Q6),
b11 and b12 are each independently an integer selected from 0 to 9, and
at least one substituent of the substituted C3-C10 cycloalkylene group, substituted C1-C10 heterocycloalkylene group, substituted C3-C10 cycloalkenylene group, substituted C1-C10 heterocycloalkenylene group, substituted C6-C60 arylene group, substituted C1-C60 heteroarylene group, substituted divalent non-aromatic condensed polycyclic group, substituted divalent non-aromatic condensed heteropolycyclic group, substituted C1-C60 alkyl group, substituted C2-C60 alkenyl group, substituted C2-C60 alkynyl group, substituted C1-C60 alkoxy group, substituted C3-C10 cycloalkyl group, substituted C1-C10 heterocycloalkyl group, substituted C3-C10 cycloalkenyl group, substituted C1-C10 heterocycloalkenyl group, substituted C6-C60 aryl group, substituted C6-C60 aryloxy group, substituted C6-C60 arylthio group, substituted C1-C60 heteroaryl group, substituted monovalent non-aromatic condensed polycyclic group, and substituted monovalent non -aromatic condensed heteropolycyclic group is selected from the group consisting of:
deuterium, —F, —Cl, —Br, —I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid group or a salt thereof, a C1-C60 alkyl group, a C2-C60 alkenyl group, a C2-C60 alkynyl group, and a C1-C60 alkoxy group;
a C1-C60 alkyl group, a C2-C60 alkenyl group, a C2-C60 alkynyl group, and a C1-C60 alkoxy group, each substituted with at least one selected from deuterium, —F, —Cl, —Br, —I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid group or a salt thereof, a C3-C10 cycloalkyl group, a C1-C10 heterocycloalkyl group, a C3-C10 cycloalkenyl group, a C1-C10 heterocycloalkenyl group, a C6-C60 aryl group, a C6-C60 aryloxy group, a C6-C60 arylthio group, a C1-C60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, a monovalent non-aromatic condensed heteropolycyclic group, —Si(Q11)(Q12)(Q13), —N(Q14)(Q15), and —B(Q16)(Q17);
a C3-C10 cycloalkyl group, a C1-C10 heterocycloalkyl group, a C3-C10 cycloalkenyl group, a C1-C10 heterocycloalkenyl group, a C6-C60 aryl group, a C6-C60 aryloxy group, a C6-C60 arylthio group, a C1-C60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, a monovalent non-aromatic condensed heteropolycyclic group, a phenyl group, a biphenyl group, and a terphenyl group;
a C3-C10 cycloalkyl group, a C1-C10 heterocycloalkyl group, a C3-C10 cycloalkenyl group, a C1-C10 heterocycloalkenyl group, a C6-C60 aryl group, a C6-C60 aryloxy group, a C6-C60 arylthio group, a C1-C60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, a monovalent non-aromatic condensed heteropolycyclic group, a phenyl group, a biphenyl group, and a terphenyl group, each substituted with at least one selected from deuterium, —F, —CI, —Br, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid group or a salt thereof, a C1-C60 alkyl group, a C2-C60 alkenyl group, a C2-C60 alkynyl group, a C1-C60 alkoxy group, a C3-C10 cycloalkyl group, a C1-C10 heterocycloalkyl group, a C3-Cio cycloalkenyl group, a C1-C10 heterocycloalkenyl group, a C6-C60 aryl group, a C6-C60 aryloxy group, a C6-C60 arylthio group, a C1-C60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, a monovalent non-aromatic condensed heteropolycyclic group, —Si(Q21)(Q22)(Q23), —N(Q24)(Q25), and —B(Q26)(Q27); and
—Si(Q31)(Q32)(Q33), —N(Q34)(Q35), and —B(Q36)(Q37),
wherein Q1 to Q6, Q11 to Q17, Q21 to Q27, and Q31 to Q37 are each independently selected from hydrogen, deuterium, —F, —Cl, —Br, —I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid group or a salt thereof, a C1-C60 alkyl group, a C2-C60 alkenyl group, a C2-C60 alkynyl group, a C1-C60 alkoxy group, a C3-C10 cycloalkyl group, a C1-C10 heterocycloalkyl group, a C3-C10 cycloalkenyl group, a C1-C10 heterocycloalkenyl group, a C6-C60 aryl group, a C1-C60 heteroaryl group, a monovalent non-aromatic condensed polycyclic group, a monovalent non-aromatic condensed heteropolycyclic group, a phenyl group, a biphenyl group, and a terphenyl group,
wherein, when R3 or R6 is a group represented by Formula 2; ring A and B are both a benzene; and a2 is 0, Ar1 is selected from a substituted or unsubstituted C1-C60 alkyl group, a substituted or unsubstituted C2-C60 alkenyl group, a substituted or unsubstituted C2-C60 alkynyl group, a substituted or unsubstituted C1-C60 alkoxy group, a substituted or unsubstituted C3-C10 cycloalkyl group, a substituted or unsubstituted C1-C10 heterocycloalkyl group, a substituted or unsubstituted C3-C10 cycloalkenyl group, a substituted or unsubstituted C1-C10 heterocycloalkenyl group, a substituted or unsubstituted monovalent non-aromatic condensed polycyclic group, and a substituted or unsubstituted monovalent non-aromatic condensed heteropolycyclic group, a substituted or unsubstituted biphenyl group, a substituted or unsubstituted terphenyl group, a substituted or unsubstituted pentalenyl group, a substituted or unsubstituted indenyl group, a substituted or unsubstituted naphthyl group, a substituted or unsubstituted azulenyl group, a substituted or unsubstituted heptalenyl group, a substituted or unsubstituted indacenyl group, a substituted or unsubstituted acenaphthyl group, a substituted or unsubstituted fluorenyl group, a substituted or unsubstituted spiro-bifluorenyl group, a substituted or unsubstituted benzofluorenyl group, a substituted or unsubstituted dibenzofluorenyl group, a substituted or unsubstituted phenalenyl group, a substituted or unsubstituted phenanthrenyl group, a substituted or unsubstituted anthracenyl group, a substituted or unsubstituted fluoranthenyl group, a substituted or unsubstituted triphenylenyl group, a substituted or unsubstituted pyrenyl group, a substituted or unsubstituted chrysenyl group, a substituted or unsubstituted naphthacenyl group, a substituted or unsubstituted picenyl group, a substituted or unsubstituted perylenyl group, a substituted or unsubstituted pentaphenyl group, a substituted or unsubstituted hexacenyl group, a substituted or unsubstituted pentacenyl group, a substituted or unsubstituted rubicenyl group, a substituted or unsubstituted coronenyl group, a substituted or unsubstituted ovalenyl group, a substituted or unsubstituted pyrrolyl group, a substituted or unsubstituted thiophenyl group, a substituted or unsubstituted furanyl group, a substituted or unsubstituted imidazolyl group, a substituted or unsubstituted pyrazolyl group, a substituted or unsubstituted thiazolyl group, a substituted or unsubstituted isothiazolyl group, a substituted or unsubstituted oxazolyl group, a substituted or unsubstituted isoxazolyl group, a substituted or unsubstituted pyrazinyl group, a substituted or unsubstituted pyridazinyl group, a substituted or unsubstituted isoindolyl group, a substituted or unsubstituted indolyl group, a substituted or unsubstituted indazolyl group, a substituted or unsubstituted purinyl group, a substituted or unsubstituted quinolinyl group, a substituted or unsubstituted isoquinolinyl group, a substituted or unsubstituted benzoquinolinyl group, a substituted or unsubstituted phthalazinyl group, a substituted or unsubstituted naphthyridinyl group, a substituted or unsubstituted quinoxalinyl group, a substituted or unsubstituted quinazolinyl group, a substituted or unsubstituted cinnolinyl group, a substituted or unsubstituted carbazolyl group, a substituted or unsubstituted phenanthridinyl group, a substituted or unsubstituted acridinyl group, a substituted or unsubstituted phenanthrolinyl group, a substituted or unsubstituted phenazinyl group, a substituted or unsubstituted benzimidazolyl group, a substituted or unsubstituted benzofuranyl group, a substituted or unsubstituted dibenzofuranyl group, a substituted or unsubstituted benzothiophenyl group, a substituted or unsubstituted dibenzothiophenyl group, a substituted or unsubstituted isobenzothiazolyl group, a substituted or unsubstituted benzoxazolyl group, a substituted or unsubstituted isobenzoxazolyl group, a substituted or unsubstituted triazolyl group, a substituted or unsubstituted tetrazolyl group, a substituted or unsubstituted oxadiazolyl group, a substituted or unsubstituted benzocarbazolyl group, a substituted or unsubstituted dibenzocarbazolyl group, a substituted or unsubstituted thiadiazolyl group, a substituted or unsubstituted imidazopyridinyl group, a substituted or unsubstituted imidazopyrimidinyl group, a substituted or unsubstituted indenocarbazolyl group, a substituted or unsubstituted indolocarbazolyl group, a substituted or unsubstituted indolodibenzofuranyl group, a substituted or unsubstituted indolodibenzothiophenyl group, and a substituted or unsubstituted indolodibenzosilolyl group,
where at least one substituent of the substituted biphenyl group, substituted terphenyl group, substituted pentalenyl group, substituted indenyl group, substituted naphthyl group, substituted azulenyl group, substituted heptalenyl group, substituted indacenyl group, substituted acenaphthyl group, substituted fluorenyl group, substituted spiro-bifluorenyl group, substituted benzofluorenyl group, substituted dibenzofluorenyl group, substituted phenalenyl group, substituted phenanthrenyl group, substituted anthracenyl group, substituted fluoranthenyl group, substituted triphenylenyl group, substituted pyrenyl group, substituted chrysenyl group, substituted naphthacenyl group, substituted picenyl group, substituted perylenyl group, substituted pentaphenyl group, substituted hexacenyl group, substituted pentacenyl group, substituted rubicenyl group, substituted coronenyl group, substituted ovalenyl group, substituted pyrrolyl group, substituted thiophenyl group, substituted furanyl group, substituted imidazolyl group, substituted pyrazolyl group, substituted thiazolyl group, substituted isothiazolyl group, substituted oxazolyl group, substituted isoxazolyl group, substituted pyrazinyl group, substituted pyridazinyl group, substituted isoindolyl group, substituted indolyl group, substituted indazolyl group, substituted purinyl group, substituted quinolinyl group, substituted isoquinolinyl group, substituted benzoquinolinyl group, substituted phthalazinyl group, substituted naphthyridinyl group, substituted quinoxalinyl group, substituted quinazolinyl group, substituted cinnolinyl group, substituted carbazolyl group, substituted phenanthridinyl group, substituted acridinyl group, substituted phenanthrolinyl group, substituted phenazinyl group, substituted benzimidazolyl group, substituted benzofuranyl group, substituted dibenzofuranyl group, substituted benzothiophenyl group, substituted dibenzothiophenyl group, substituted isobenzothiazolyl group, substituted benzoxazolyl group, substituted isobenzoxazolyl group, substituted triazolyl group, substituted tetrazolyl group, substituted oxadiazolyl group, substituted benzocarbazolyl group, substituted dibenzocarbazolyl group, substituted thiadiazolyl group, substituted imidazopyridinyl group, substituted imidazopyrimidinyl group, substituted an indenocarbazolyl group, substituted indolocarbazolyl group, substituted indolodibenzofuranyl group, substituted indolodibenzothiophenyl group, and substituted indolodibenzosilolyl group is selected from the group consisting of:
deuterium, —F, —Cl, —Br, —I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid group or a salt thereof, a C1-C20 alkyl group, and a C1-C20 alkoxy group;
a phenyl group, a biphenyl group, a terphenyl group, a naphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a triphenylenyl group, a pyrenyl group, a chrysenyl group, a pyrrolyl group, a thiophenyl group, a furanyl group, an imidazolyl group, a pyrazolyl group, a thiazolyl group, an isothiazolyl group, an oxazolyl group, an isoxazolyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, a quinolinyl group, an isoquinolinyl group, a benzoquinolinyl group, a quinoxalinyl group, a quinazolinyl group, a carbazolyl group, a benzimidazolyl group, a benzofuranyl group, a benzothiophenyl group, an isobenzothiazolyl group, a benzoxazolyl group, an isobenzoxazolyl group, an oxadiazolyl group, a triazine group, a dibenzofuranyl group, a dibenzothiophenyl group, an imidazopyridinyl group, and an imidazopyrimidinyl group;
a phenyl group; a biphenyl group, a terphenyl group, a naphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a triphenylenyl group, a pyrenyl group, a chrysenyl group, a pyrrolyl group, a thiophenyl group, a furanyl group, an imidazolyl group, a pyrazolyl group, a thiazolyl group, an isothiazolyl group, an oxazolyl group, an isoxazolyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, a quinolinyl group, an isoquinolinyl group, a benzoquinolinyl group, a quinoxalinyl group, a quinazolinyl group, a carbazolyl group, a benzimidazolyl group, a benzofuranyl group, a benzothiophenyl group, an isobenzothiazolyl group, a benzoxazolyl group, an isobenzoxazolyl group, an oxadiazolyl group, a triazinyl group, a dibenzofuranyl group, a dibenzothiophenyl group, an imidazopyridinyl group, and an imidazopyrimidinyl group, each substituted with at least one selected from deuterium, —F, —CI, —Br, —I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid group or a salt thereof, a C1-C10 alkyl group, a C1-C10 alkoxy group, a biphenyl group, a terphenyl group, a naphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a triphenylenyl group, a pyrenyl group, a chrysenyl group, a pyrrolyl group, a thiophenyl group, a furanyl group, an imidazolyl group, a pyrazolyl group, a thiazolyl group, an isothiazolyl group, an oxazolyl group, an isoxazolyl group, a pyrazinyl group, a pyridazinyl group, a quinolinyl group, an isoquinolinyl group, a benzoquinolinyl group, a quinoxalinyl group, a quinazolinyl group, a carbazolyl group, a benzimidazolyl group, a benzofuranyl group, a benzothiophenyl group, an isobenzothiazolyl group, a benzoxazolyl group, an isobenzoxazolyl group, an oxadiazolyl group, a dibenzofuranyl group, a dibenzothiophenyl group, an imidazopyridinyl group, an imidazopyrimidinyl group, and —Si (Q31)(Q32)(Q33); and
—Si(Q1)(Q2)(Q3),
wherein Q1 to Q3 and Q31 to Q33 are each independently selected from a C1-C10 alkyl group, a C1-C10 alkoxy group, a phenyl group, a biphenyl group, a terphenyl group, and a naphthyl group, and
when R3 or R6 is a group represented by Formula 2; ring A and B are both a benzene; and a2 is selected from 1, 2, 3, 4, and 5, L2 is selected from the group consisting of:
a pentalenylene group, an indenylene group, a naphthylene group, an azulenylene group, a heptalenylene group, an indacenylene group, an acenaphthylene group, a fluorenylene group, a spiro-fluorenylene group, a benzofluorenylene group, a dibenzofluorenylene group, a phenalenylene group, a phenanthrenylene group, an anthracenylene group, a fluoranthenylene group, a triphenylenylene group, a pyrenylene group, a chrysenylene group, a naphthacenylene group, a picenylene group, a perylenylene group, a pentaphenylene group, a hexacenylene group, a pentacenylene group, a rubicenylene group, a coronenylene group, an ovalenylene group, a pyrrolylene group, a thiophenylene group, a furanylene group, an imidazolylene group, a pyrazolylene group, a thiazolylene group, an isothiazolylene group, an oxazolylene group, an isoxazolylene group, a pyrazinylene group, a pyridazinylene group, an isoindolylene group, an indolylene group, an indazolylene group, a purinylene group, a quinolinylene group, an isoquinolinylene group, a benzoquinolinylene group, a phthalazinylene group, a naphthyridinylene group, a quinoxalinylene group, a quinazolinylene group, a cinnolinylene group, a carbazolylene group, a phenanthridinylene group, an acridinylene group, a phenanthrolinylene group, a phenazinylene group, a benzimidazolylene group, a benzofuranylene group, a benzothiophenylene group, an isobenzothiazolylene group, a benzoxazolylene group, an isobenzoxazolylene group, a triazolylene group, a tetrazolylene group, an oxadiazolylene group, a dibenzofuranylene group, a dibenzothiophenylene group, a benzocarbazolylene group, a dibenzocarbazolylene group, a thiadiazolylene group, an imidazopyridinylene group, an imidazopyrimidinylene group, an indenocarbazolylene group, an indolocarbazolylene group, an indolodibenzofuranylene group, an indolodibenzothiophenylene group, and an indolodibenzosilolylene group; and
a pentalenylene group, an indenylene group, a naphthylene group, an azulenylene group, a heptalenylene group, an indacenylene group, an acenaphthylene group, a fluorenylene group, a spiro-fluorenylene group, a benzofluorenylene group, a dibenzofluorenylene group, a phenalenylene group, a phenanthrenylene group, an anthracenylene group, a fluoranthenylene group, a triphenylenylene group, a pyrenylene group, a chrysenylene group, a naphthacenylene group, a picenylene group, a perylenylene group, a pentaphenylene group, a hexacenylene group, a pentacenylene group, a rubicenylene group, a coronenylene group, an ovalenylene group, a pyrrolylene group, a thiophenylene group, a furanylene group, an imidazolylene group, a pyrazolylene group, a thiazolylene group, an isothiazolylene group, an oxazolylene group, an isoxazolylene group, a pyrazinylene group, a pyridazinylene group, an isoindolylene group, an indolylene group, an indazolylene group, a purinylene group, a quinolinylene group, an isoquinolinylene group, a benzoquinolinylene group, a phthalazinylene group, a naphthyridinylene group, a quinoxalinylene group, a quinazolinylene group, a cinnolinylene group, a carbazolylene group, a phenanthridinylene group, an acridinylene group, a phenanthrolinylene group, a phenazinylene group, a benzimidazolylene group, a benzofuranylene group, a benzothiophenylene group, an isobenzothiazolylene group, a benzoxazolylene group, an isobenzoxazolylene group, a triazolylene group, a tetrazolylene group, an oxadiazolylene group, a dibenzofuranylene group, a dibenzothiophenylene group, a benzocarbazolylene group, a dibenzocarbazolylene group, a thiadiazolylene group, an imidazopyridinylene group, an imidazopyrimidinylene group, an indenocarbazolylene group, an indolocarbazolylene group, an indolodibenzofuranylene group, an indolodibenzothiophenylene group, and an indolodibenzosilolylene group, each substituted with at least one selected from deuterium, —F, —Cl, —Br, —I, a hydroxyl group, a cyano group, a nitro group, an amino group, an amidino group, a hydrazine group, a hydrazone group, a carboxylic acid group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid group or a salt thereof, a C1-C20 alkyl group, a C1-C20 alkoxy group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclopentenyl group, a cyclohexenyl group, a phenyl group, a biphenyl group, a terphenyl group, a pentalenyl group, an indenyl group, a naphthyl group, an azulenyl group, a heptalenyl group, an indacenyl group, an acenaphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenalenyl group, a phenanthrenyl group, an anthracenyl group, a fluoranthenyl group, a triphenylenyl group, a pyrenyl group, a chrysenyl group, a naphthacenyl group, a picenyl group, a perylenyl group, a pentaphenyl group, a hexacenyl group, a pentacenyl group, a rubicenyl group, a coronenyl group, an ovalenyl group, a pyrrolyl group, a thiophenyl group, a furanyl group, an imidazolyl group, a pyrazolyl group, a thiazolyl group, an isothiazolyl group, an oxazolyl group, an isoxazolyl group, a pyridinyl group, a pyrazinyl group, a pyrimidinyl group, a pyridazinyl group, an isoindolyl group, an indolyl group, an indazolyl group, a purinyl group, a quinolinyl group, an isoquinolinyl group, a benzoquinolinyl group, a phthalazinyl group, a naphthyridinyl group, a quinoxalinyl group, a quinazolinyl group, a cinnolinyl group, a carbazolyl group, a phenanthridinyl group, an acridinyl group, a phenanthrolinyl group, a phenazinyl group, a benzimidazolyl group, a benzofuranyl group, a benzothiophenyl group, an isobenzothiazolyl group, a benzoxazolyl group, an isobenzoxazolyl group, a triazolyl group, a tetrazolyl group, an oxadiazolyl group, a triazinyl group, a dibenzofuranyl group, a dibenzothiophenyl group, a benzocarbazolyl group, a dibenzocarbazolyl group, a thiadiazolyl group, an imidazopyridinyl group, an imidazopyrimidinyl group, an indenocarbazolyl group, an indolocarbazolyl group, an indolodibenzofuranyl group, an indolodibenzothiophenyl group, an indolodibenzosilolyl —Si(Q31 )(Q32 )(Q33),
wherein Q31 to Q33 are each independently selected from a C1-C20 alkyl group, a C1-C20 alkoxy group, a phenyl group, a biphenyl group, a terphenyl group, a naphthyl group, a fluorenyl group, a spiro-fluorenyl group, a benzofluorenyl group, a dibenzofluorenyl group, a phenanthrenyl group, an anthracenyl group, a triphenylenyl group, a pyrenyl group, a chrysenyl group, and a carbazolyl group.

US Pat. No. 10,249,823

FULLERENE DERIVATIVES AND PHOTOELECTRIC DEVICES AND IMAGE SENSORS

Samsung Electronics Co., ...

1. A compound, comprising:a fullerene derivative represented by Chemical Formula 1:

wherein, in Chemical Formula 1,
Ra is hydrogen or a C1 to C10 alkyl group,
R1 to R5 are independently one of
a substituted or unsubstituted C1 to C10 alkyl group, or
a substituted or unsubstituted C6 to C12 aryl group, and
at least one of R1 to R5 is
a C1 to C10 alkyl group substituted with at least one of a fluorine and a cyano group, or
a C6 to C12 aryl group substituted with at least one of a fluorine and a cyano group.

US Pat. No. 10,249,812

FILTER AND MULTIPLEXER

TAIYO YUDEN CO., LTD., T...

1. A filter comprising:an input terminal;
an output terminal; and
a ladder circuit that includes one or more series acoustic wave resonators connected in series between the input terminal and the output terminal and one or more parallel acoustic wave resonators connected in parallel between the input terminal and the output terminal, and in which characteristic impedance of at least one point in a pathway between the input terminal and the output terminal at a center frequency of a passband is greater than input impedance of the input terminal and output impedance of the output terminal at the center frequency of the passband.

US Pat. No. 10,249,811

PIEZOELECTRIC DRIVING DEVICE, ROBOT, AND DRIVING METHOD OF THE SAME

Seiko Epson Corporation, ...

1. A piezoelectric driving device comprising:a first vibrating plate;
a first electrode that is provided on the first vibrating plate;
a piezoelectric member that is provided above the first vibrating plate;
a second electrode that is provided on the piezoelectric member;
a second vibrating plate that is provided above the first and second electrodes, the second vibrating plate having top and bottom surfaces opposite to each other, the bottom surface facing the first and second electrodes; and
a wiring pattern that is provided on the bottom surface of the second vibrating plate, the wiring pattern including a wiring member, the wiring member being located at a first area of the bottom surface,
wherein the first area correspond to the second electrode in a plan view, and
the wiring member of the wiring pattern is electrically connected to the second electrode.

US Pat. No. 10,249,810

STRUCTURALLY EMBEDDED AND INHOSPITABLE ENVIRONMENT SYSTEMS AND DEVICES HAVING AUTONOMOUS ELECTRICAL POWER SOURCES

1. An electrically-energized device, comprising:at least one of an electrically-energized sensor and an electrically-energized communication element;
an electrical power source configured to provide electrical energy to power the at least one of the electrically-energized sensor and the electrically-energized communication element, the electrical power source including one or more electrical power source components, at least one of the one or more electrical power source components comprising:
a first conductor formed of a first conductive material and having a first surface and a second surface, the first surface of the first conductor facing away from a build surface and being conditioned to have a first work function value,
a dielectric layer with a thickness in a range of 200 angstroms or less formed over the conditioned first surface of the first conductor, and
a second conductor formed of a second conductive material and having a first surface with a second work function value, and having a second surface, and being arranged over the dielectric layer such that the first surface of the second conductor faces the dielectric layer,
the first conductor, the dielectric layer and the second conductor forming a layered structure of the electrical power source component;
a first electrical lead and a second electrical lead electrically connecting the at least one of the electrically-energized sensor and the electrically-energized communication element with the electrical power source,
the first work function value and the second work function value being in a range of 5.0 electron volts (eV) or less, and
the first work function value being at least 1.0 eV less than the second work function value.

US Pat. No. 10,249,809

ELECTRIC POWER GENERATION

1. A system comprising: a feed water pump; a line linking the feed water pump to a boiler, the boiler heating cold fluid from the feed water pump to produce hot fluid; a line linking the boiler to a turbine and a feed water reheater, the line providing a first portion of the hot fluid from the boiler to the turbine and a second portion of the hot fluid from the boiler to the feed water reheater; and a first generator unit for receiving hot fluid only from the feed water reheater and condensate from a condenser, the first generator unit generating electric power from a difference between a temperature of the hot fluid from the feed water reheater and the temperature of the condensate from the condenser.

US Pat. No. 10,249,808

SURFACE DOPING OF NANOSTRUCTURES

The Regents of the Univer...

1. A material comprising:a plurality of tellurium nanowires, the plurality of tellurium nanowires comprising a p-type semiconductor, the plurality of tellurium nanowires consisting essentially of tellurium; and
S2? or SH? species disposed on surfaces of each of the plurality of tellurium nanowires, charge carriers comprising electrons being transferred between the S2? or SH? species and the plurality of tellurium nanowires, the S2? or SH? species shifting the Fermi level of each the plurality of tellurium nanowires towards the conduction band, and the S2? or SH? species changing the plurality of tellurium nanowires to an n-type semiconductor.

US Pat. No. 10,249,792

PROTECTIVE CAPPING LAYER FOR SPALLED GALLIUM NITRIDE

INTERNATIONAL BUSINESS MA...

1. A method of producing a semiconductor device comprising:forming a stack including a semiconductor material comprising:
a Group III nitride semiconductor material formed on a growth substrate,
a protective layer formed over the Group III nitride semiconductor material, and
a handle layer and a stressor layer formed over the protective layer; and
spalling the stack to separate the growth substrate from the stack.

US Pat. No. 10,249,787

COMPONENT HAVING A MULTIPLE QUANTUM WELL STRUCTURE

OSRAM OPTO SEMICONDUCTORS...

1. A component having a semiconductor layer sequence comprising a p-conductive semiconductor layer, an n-conductive semiconductor layer and an active zone arranged between the p-conductive semiconductor layer and the n-conductive semiconductor layer, whereinthe active zone comprises a multiple quantum well structure, which, from the p-conductive semiconductor layer towards the n-conductive semiconductor layer, comprises a plurality of p-side barrier layers with intermediate quantum well layers and a plurality of n-side barrier layers with intermediate quantum layers,
in the semiconductor layer sequence on the side of the p-conductive semiconductor layer, recesses are formed which have sidewalls, wherein the quantum well layers and/or the plurality of n- and p-side barrier layers extend at least in places conformally with the sidewalls of the recesses,
the plurality of the n- and p-side barrier layers have layer thicknesses that increase monotonically from the p-conductive semiconductor layer towards the n-conductive semiconductor layer, such that the active zone has a gradient with increasing layer thickness of the barrier layers towards the n-conductive semiconductor layer, and
the n-side barrier layers have a greater average layer thickness than the p-side barrier layers.

US Pat. No. 10,249,786

THIN FILM AND SUBSTRATE-REMOVED GROUP III-NITRIDE BASED DEVICES AND METHOD

PALO ALTO RESEARCH CENTER...

1. A method of thinning a bulk aluminum nitride substrate, comprising:providing a bulk aluminum nitride (AlN) substrate with at least one epitaxially grown group-III-nitride layer on a first side of the substrate;
applying a slurry having a high pH to a second side of the substrate opposite the first side;
chemical mechanically polishing the second side of the substrate using the slurry to remove at least a portion of the substrate, resulting in a thinned layer with a thickness less than 50 microns; and
bonding the epitaxial layer to a non-native substrate.

US Pat. No. 10,249,781

APPARATUS FOR COUNTING SINGLE PHOTONS AND METHOD THEREOF

1. An apparatus for counting single photons, comprising:an edge combiner configured to detect an edge of each of applied clocks using a plurality of Phase-Locked Loops (PLL) to generate a combined signal;
a sampling unit configured to sample all events occurring in each SPAD of a single photon detection diode (SPAD) array using an OR tree and an XOR tree; and
a calculation unit configured to count the sampled events based on the combined signal to count single photons.

US Pat. No. 10,249,780

HIGH QUALITY ALSB FOR RADIATION DETECTION

STC.UNM, Albuquerque, NM...

1. A radiation detector, comprising:a substrate comprising Si; anda thin film disposed over the substrate, wherein the thin film comprises UHV-MBE grown AlSb and a background carrier concentration of less than 1015 cm?3.

US Pat. No. 10,249,778

SOLAR CELL STRUCTURE FOR WIRELESS CHARGING

Industrial Technology Res...

1. A solar cell structure for wireless charging, comprising:a plane substrate; and
at least one thin film solar cell, disposed on a first surface of the plane substrate, wherein the at least one thin film solar cell has a first winding coil structure with two ends and having a central axis, the at least one thin film solar cell comprises:
a back electrode, formed on the plane substrate;
a light absorption layer, formed on the back electrode; and
a transparent electrode layer, formed on the light absorption layer, wherein the back electrode, the light absorption layer, and the transparent electrode layer are the first winding coil structure, and the central axis of the first winding coil structure is perpendicular to the first surface of the plane substrate.

US Pat. No. 10,249,770

SOLAR CELL MODULE

LG INNOTEK CO., LTD., Se...

1. A solar cell module comprising:a support substrate;
a back electrode layer on the support substrate;
a light absorbing layer on the back electrode layer;
a front electrode layer on the light absorbing layer; and
a bus bar,
wherein the back electrode layer is configured to be formed with a groove upon which a portion of the bus bar is disposed, the groove being formed by a top surface of the back electrode layer on the support substrate, and first at second lateral surfaces of the back electrode layer, wherein the bus bar is in contact with a top surface and the first lateral surface of the back electrode layer, and the second lateral surface of the back electrode layer is exposed by the groove; and
wherein top surface includes molybdenum diselenide (MoSe2), and the first and second lateral surfaces each includes molybdenum (Mo) and molybdenum diselenide.

US Pat. No. 10,249,762

VERTICALLY ALIGNED NANOWIRE CHANNELS WITH SOURCE/DRAIN INTERCONNECTS FOR NANOSHEET TRANSISTORS

International Business Ma...

1. A method for forming a semiconductor structure, the method comprising:forming a structure comprising at least an alternating stack of semiconductor layers and metal gate material layers formed on a substrate, a metal gate formed on and in contact with a top layer of the alternating stack, a source region and a drain region in contact with the alternating stack, and dielectric layers formed on and in contact with a top surface of the source and drain regions, respectively;
removing a portion of the semiconductor layers and metal gate material layers, wherein the removing forms trenches exposing at least sidewalls of the source and drain regions;
forming a first plurality of interconnects between and in contact with the semiconductor layers and the source region; and
forming a second plurality of interconnects between and in contact with the semiconductor layers and the drain region.

US Pat. No. 10,249,756

SEMICONDUCTOR DEVICE INCLUDING MEMORY AND LOGIC CIRCUIT HAVING FETS WITH FERROELECTRIC LAYER AND MANUFACTURING METHODS THEREOF

Taiwan Semiconductor Manu...

1. A semiconductor device, comprising:a memory circuit including:
a word line;
a bit line;
a common line; and
a memory transistor having a gate coupled to the word line, a drain coupled to the bit line and a source coupled to the common line; and
a logic circuit including:
a logic transistor having a gate, a drain and a source, wherein:
the gate of the memory transistor has a gate electrode layer formed on a gate dielectric layer, the gate dielectric layer including a first insulating layer and a first ferroelectric (FE) material layer, and
the gate of the logic transistor has a gate electrode layer formed on a gate dielectric layer, the gate dielectric layer including a second insulating layer and a second FE material layer,
wherein a thickness of the first insulating layer is different from a thickness of the second insulating layer.

US Pat. No. 10,249,752

SEMICONDUCTOR DEVICES HAVING SEGMENTED RING STRUCTURES

Semiconductor Components ...

1. A semiconducting device comprising:a semiconductor substrate of a first conductivity type;
a first layer of the first conductivity type overlying the semiconductor substrate;
an active region; and
one or more ring structures surrounding the active region, the ring structures each comprising:
two or more first segments each comprising a first super-junction trench, wherein the first super-junction trench comprises:
a first semiconducting region having a second conductivity type;
a second semiconducting region adjacent to the first semiconducting region, wherein the second semiconducting region has a third conductivity type that is different than the second conductivity type;
a first buffer region adjacent to the second semiconducting region;
a third semiconducting region adjacent to the first buffer region, wherein the third semiconducting region has the third conductivity type; and
a fourth semiconducting region adjacent to the third semiconducting region, wherein the fourth semiconducting region has the second conductivity type; and
two or more second segments each comprising a fifth semiconducting region having the first conductivity type,
wherein the first segments and the second segments have different structures and are alternatively arranged to form the ring structure.

US Pat. No. 10,249,749

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

FUJITSU LIMITED, Kawasak...

1. A semiconductor device comprising:a buffer layer;
a channel layer over the buffer layer;
a carrier supply layer over the channel layer;
a first recess and a second recess that are formed in the channel layer and the carrier supply layer, and that reach the buffer layer;
a first nitride semiconductor layer in the first recess;
a second nitride semiconductor layer in the second recess;
a source electrode over the first nitride semiconductor layer;
a drain electrode over the second nitride semiconductor layer; and
a gate electrode over the carrier supply layer between the first recess and the second recess,
wherein each of the first nitride semiconductor layer and the second nitride semiconductor layer includes
a first region containing donors, and
a second region under the first region,
wherein an interface between the first region and the second region is positioned deeper than two-dimensional electron gas on a surface side of the channel layer, and
wherein energy at a bottom of a conduction band of the second region is higher than energy at a bottom of a conduction band of the first region.

US Pat. No. 10,249,748

NITRIDE SEMICONDUCTOR DEVICE

Panasonic Corporation, O...

1. A nitride semiconductor device, comprising:a substrate of a first conductivity type having a first surface and a second surface on a side of the substrate opposite the first surface;
a first nitride semiconductor layer of the first conductivity type which is disposed on the first surface of the substrate and includes an acceptor impurity;
a second nitride semiconductor layer of a second conductivity type disposed on the first nitride semiconductor layer, the second conductivity type being opposite to the first conductivity type;
a first electrode disposed on the second surface of the substrate;
a second electrode disposed on the first nitride semiconductor layer; and
a gate electrode disposed on the second nitride semiconductor layer.

US Pat. No. 10,249,745

METHOD FOR MAKING A SEMICONDUCTOR DEVICE INCLUDING A RESONANT TUNNELING DIODE STRUCTURE HAVING A SUPERLATTICE

ATOMERA INCORPORATED, Lo...

1. A method for making a semiconductor device comprising:forming at least one double-barrier resonant tunneling diode (DBRTD) by
forming a first doped semiconductor layer,
forming a first barrier layer on the first doped semiconductor layer and comprising a first superlattice, the first superlattice comprising a plurality of stacked groups of layers, each group of layers comprising a plurality of stacked base semiconductor monolayers defining a base semiconductor portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions,
forming an intrinsic semiconductor layer on the first barrier layer,
forming a second barrier layer on the intrinsic semiconductor layer, and
forming a second doped semiconductor layer on the second barrier layer.

US Pat. No. 10,249,741

SYSTEM AND METHOD FOR ION-SELECTIVE, FIELD EFFECT TRANSISTOR ON FLEXIBLE SUBSTRATE

1. A flexible ion-selective field effect transistor comprising:a flexible substrate;
a thin film transistor disposed on the flexible substrate, the thin film transistor including a source, a drain, a gate, and an active channel layer, the gate is isolated from the atmosphere; and
a surface sensing layer in electronic communication with the gate,
wherein the flexible ion-selective field effect transistor has a structure that provides a flexible thin film transistor display, wherein the flexible thin film transistor display is provided when the surface sensing layer is only in electronic communication with the source or the drain, wherein the surface sensing layer serves as a transparent top electrode of the flexible thin film transistor display.

US Pat. No. 10,249,735

THIN FILM TRANSISTOR, METHOD FOR MANUFACTURING THE SAME, ARRAY SUBSTRATE, AND DISPLAY DEVICE

BOE TECHNOLOGY GROUP CO.,...

1. A method for manufacturing a thin film transistor (TFT), comprising steps of:forming a pattern of a gate electrode on a base substrate;
forming a gate insulation layer with an even surface;
forming a pattern of a polysilicon semiconductor layer;
depositing an amorphous silicon highly-doped P+layer;
patterning the amorphous silicon highly-doped P+layer to form a pattern of the amorphous silicon highly-doped P+layer at a source electrode contact region and a drain electrode contact region on the polysilicon semiconductor layer; and
forming patterns of a source electrode and a drain electrode, wherein the pattern of the amorphous silicon highly-doped P+layer contacts directly the patterns of the source electrode and the drain electrode, and the pattern of the amorphous silicon highly-doped P+layer contacts directly the polysilicon semiconductor layer;
wherein the step of forming the pattern of the polysilicon semiconductor layer comprises:
depositing an amorphous silicon layer;
patterning the amorphous silicon layer to form a pattern of the amorphous silicon layer; and
crystallizing the pattern of the amorphous silicon layer to form the pattern of the polysilicon semiconductor layer; and
wherein the forming the gate insulation layer with the even surface comprises:
depositing a gate insulation layer film on the base substrate and the pattern of the gate electrode; and
removing a protrusion on the gate insulation layer film to form the gate insulation layer with the even surface, wherein the distance between an upper surface of the protrusion of the gate insulation layer film and an upper surface of the base substrate is greater than the sum of the thickness of the gate insulation layer with an even surface and the thickness of the gate electrode.

US Pat. No. 10,249,729

METHOD FOR FABRICATING METAL REPLACEMENT GATE SEMICONDUCTOR DEVICE USING DUMMY GATE AND COMPOSITE SPACER STRUCTURE

UNITED MICROELECTRONICS C...

1. A method for fabricating a semiconductor device, comprising:providing a silicon substrate;
forming a first gate dielectric layer on the silicon substrate;
forming a dummy gate on the first gate dielectric layer;
conformally depositing a composite spacer film on the dummy gate and the silicon substrate, wherein the composite spacer film comprises a first nitride-containing layer, an oxide layer on the first nitride-containing layer, and a second nitride-containing layer on the oxide layer;
conformally depositing a hard mask layer on the composite spacer film;
anisotropically etching the hard mask layer and the composite spacer film, thereby forming a composite spacer structure on each sidewall of the dummy gate;
forming a recessed region in the silicon substrate and adjacent to the composite spacer structure;
forming a SiGe epitaxial layer in the recessed region;
removing the hard mask layer from the composite spacer structure;
conformally depositing a contact etch stop layer (CESL) on the composite spacer structure and the SiGe epitaxial layer;
depositing an inter-layer dielectric (ILD) layer on the CESL;
subjecting the ILD layer to a polishing process so as to expose a top surface of the dummy gate;
removing the dummy gate and a first portion of the first nitride-containing layer, thereby forming a gate trench and exposing the first gate dielectric layer; and
removing the first gate dielectric layer from the gate trench, and selectively removing a second portion of the first nitride-containing layer and the oxide layer from the composite spacer structure, while leaving the second nitride-containing layer intact.

US Pat. No. 10,249,726

METHODS OF FORMING A PROTECTION LAYER ON A SEMICONDUCTOR DEVICE AND THE RESULTING DEVICE

GLOBALFOUNDRIES Inc., Gr...

1. A transistor device, comprising:a gate structure;
first and second spacers positioned adjacent opposite sides of said gate structure, said first and second spacers having upper surfaces; and
a multi-layer gate cap structure positioned above said gate structure and said upper surfaces of said first and second spacers, wherein said multi-layer gate cap structure comprises:
a first gate cap material layer positioned on an upper surface of said gate structure and on said upper surfaces of said first and second spacers;
a first high-k protection layer positioned on an upper surface of said first gate cap material layer; and
a second gate cap material layer positioned on an upper surface of said first high-k protection layer, wherein said first and second spacers, said first and second gate cap layers, and said high-k protection layer comprise dielectric materials, and said first and second gate cap layers comprise different materials than said first high-k protection layer.

US Pat. No. 10,249,718

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, INVERTER CIRCUIT, DRIVING DEVICE, VEHICLE, AND ELEVATOR

Kabushiki Kaisha Toshiba,...

1. A semiconductor device comprising:a metal layer;
an n-type first silicon carbide region; and
a second silicon carbide region of metal containing at least one element selected from the group consisting of nickel (Ni), palladium (Pd), and platinum (Pt), and positioned between the metal layer and the first silicon carbide region,
wherein
the at least one element is present at a carbon site of a crystal structure of silicon carbide.

US Pat. No. 10,249,715

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE

Renesas Electronics Corpo...

1. A semiconductor device, comprising:a first nitride semiconductor layer formed above a substrate;
a second nitride semiconductor layer formed over the first nitride semiconductor layer;
a third nitride semiconductor layer formed over the second nitride semiconductor layer;
a fourth nitride semiconductor layer formed over the third nitride semiconductor layer;
a trench that extends up to the middle of the third nitride semiconductor layer while penetrating through the fourth nitride semiconductor layer;
a gate electrode disposed in the trench with a gate insulating film in between;
a first electrode and a second electrode formed above the fourth nitride semiconductor layer on both sides of the gate electrode; and
a coupling electrode electrically coupled to the first nitride semiconductor layer,
wherein electron affinity of the second nitride semiconductor layer is equal to or larger than electron affinity of the first nitride semiconductor layer,
wherein electron affinity of the third nitride semiconductor layer is equal to or larger than the electron affinity of the first nitride semiconductor layer,
wherein electron affinity of the fourth nitride semiconductor layer is smaller than the electron affinity of the first nitride semiconductor layer,
wherein the coupling electrode is electrically isolated from the first electrode, and
wherein a voltage applied to the coupling electrode is different from a voltage applied to the first electrode.

US Pat. No. 10,249,710

METHODS, APPARATUS, AND SYSTEM FOR IMPROVED NANOWIRE/NANOSHEET SPACERS

GLOBALFOUNDRIES INC., Gr...

1. A semiconductor structure, comprising:a semiconductor substrate;
at least one fin, wherein the at least one fin comprises one or more first layers comprising a first material and one or more second layers comprising a second material, wherein the first layers and the second layers are interspersed and the first layers laterally extend further than the second layers;
a dummy gate structure comprising a first spacer material disposed on sidewalls of the dummy gate;
a second spacer material disposed adjacent to each of the second layers, wherein sidewalls of the fin comprise exposed portions of each of the first layers and the second spacer material, and the second spacer material differs from the first spacer material; and
an epitaxial source/drain material disposed on at least the exposed portions of each of the first layers.

US Pat. No. 10,249,706

SEMICONDUCTOR STRUCTURE

UNITED MICROELECTRONICS C...

1. A semiconductor structure, comprising:a substrate having a cell region defined thereon;
a plurality of lower electrode structures located in the cell region;
an top support structure, contacting a top region of the lower electrode structure; and
at least one middle support structure located between the substrate and the top support structure, contacting a middle region of the lower electrode structure, wherein when viewed in a top view, the top support structure and the middle support structure do not completely overlapped with each other, wherein a vertical height from a top surface of the substrate to the upper support structure is H1, and a vertical height from the top surface of the substrate to the middle support structure is H2, and wherein H2/H1 is between 0.4 and 0.6.

US Pat. No. 10,249,703

METAL RESISTORS HAVING NITRIDIZED METAL SURFACE LAYERS WITH DIFFERENT NITROGEN CONTENT

International Business Ma...

1. A method of forming a semiconductor structure, said method comprising:providing a dielectric-containing substrate comprising at least an interconnect dielectric material layer;
forming a first metal layer portion on a first portion of a topmost surface of said interconnect dielectric material layer, and a second metal layer portion on a second portion of said topmost surface of said interconnect dielectric material layer;
performing a first nitridation process to provide a first nitridized metal surface layer having a first nitrogen content within said first metal layer portion, wherein said first metal layer portion and said first nitridized metal surface layer provide a first metal resistor structure; and
performing a second nitridation process to provide a second nitridized metal surface layer having a second nitrogen content that differs from said first nitrogen content within said second metal layer portion, wherein said second metal layer portion and said second nitridized metal surface layer provide a second metal resistor structure.

US Pat. No. 10,249,699

ORGANIC LIGHT EMITTING DIODE SUBSTRATE, METHOD OF FABRICATING THE SAME AND DISPLAY APPARATUS HAVING THE SAME

BOE TECHNOLOGY GROUP CO.,...

1. An organic light emitting diode (OLED) substrate, comprising:a base substrate;
an organic electroluminescence unit on the base substrate;
a thin film encapsulation layer on the organic electroluminescence unit; and
a plurality of first electrodes and a plurality of second electrodes in the thin film encapsulation layer,
wherein the thin film encapsulation layer comprises N numbers of inorganic film layers and N numbers of organic film layers, where N is an integer equal to or larger than 2, the N numbers of inorganic film layers and the N numbers of organic film layers are alternately stacked on the organic electroluminescence unit along a direction away from the base substrate, and each of the N numbers of organic film layers is stacked on a respective one of the N numbers of inorganic film layers,
and wherein the plurality of first electrodes are embedded in one of the N numbers of organic film layers, and the plurality of second electrodes are embedded in another one of the N numbers of organic film layers.

US Pat. No. 10,249,697

DISPLAY PANEL AND DISPLAY DEVICE

Wuhan China Star Optoelec...

1. A display panel, comprising:an active area; and
two GOA driving circuit areas which are arranged respectively on a right side and a left side of the active area,
wherein the display panel is bent along bending positions formed by gaps between the active area and each of the GOA driving circuit areas,
wherein a serpentine metal line connecting a GOA driving circuit and an internal circuit of the active area is arranged in the display panel at a position corresponding to each of the bending positions,
wherein the serpentine metal line is contained in a jumper joint structure of different layers of metal lines,
wherein the jumper joint structure of different layers of metal lines comprises:
a first metal layer, which is in a same layer as a first lead line of the GOA driving circuit and a second lead line of the internal circuit of the active area, wherein metal jumper lines without contacting each other, are arranged between the first lead line and the second lead line;
a first insulating layer, arranged on the first metal layer;
an inorganic dielectric layer, arranged on the first insulating layer, and having via holes at positions corresponding to two ends of each of the metal jumper lines;
jumpers without contacting each other, arranged on the inorganic dielectric layer and connected to the corresponding metal jumper lines in sequence through the via holes to form the serpentine metal line; and
an organic dielectric layer, arranged on the jumpers and the exposed inorganic dielectric layer.

US Pat. No. 10,249,694

ORGANIC EL DISPLAY DEVICE

SHARP KABUSHIKI KAISHA, ...

1. An organic EL display device comprising:a first resin substrate;
a basecoat film provided on the first resin substrate;
an organic EL element provided over the basecoat film;
a first sealing film covering the organic EL element;
a second resin substrate facing the first resin substrate, and provided closer to the first sealing film with an adhesive layer interposed between the second resin substrate and the first sealing film; and
a second sealing film provided outside the first sealing film, and enhancing adhesion between the basecoat film and a stack including the first sealing film and the adhesive layer, wherein
in a plan view, a peripheral edge of the first resin substrate is located inside a peripheral edge of the second resin substrate,
the second sealing layer covers at least a portion of each of the adhesive layer, the first resin substrate, and the basecoat film,
in the plan view, a peripheral edge of the adhesive layer is located inside the peripheral edge of the first resin substrate, and
a resin layer is provided between the second sealing film and a stack including the adhesive layer and the first resin substrate such that the resin layer covers a step between the adhesive layer and the first resin substrate.

US Pat. No. 10,249,692

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

Seoul Viosys Co., Ltd., ...

1. A display device comprising:a base substrate;
a display element disposed on the base substrate;
a thin film encapsulation layer covering the display element;
a first organic layer disposed on the thin film encapsulation layer;
an inorganic layer disposed on the first organic layer;
touch electrodes disposed on the inorganic layer; and
a second organic layer disposed on the inorganic layer, the second organic layer covering the touch electrodes,
wherein the second organic layer is in contact with the inorganic layer.

US Pat. No. 10,249,690

DISPLAY DEVICE HAVING A SUPPRESSION

SHARP KABUSHIKI KAISHA, ...

1. A display device including a display portion, the display device comprising:a flexible substrate in which the display portion is provided;
an inorganic film with a plurality of layers provided on the substrate;
a display element portion that is provided on the inorganic film and is provided to form the display portion; and
a suppression portion that is provided outside the display portion and suppresses progression of cracking that has occurred in a peripheral portion of the substrate,
wherein the plurality of layers of the inorganic film includes a first inorganic film and a second inorganic film formed on the first inorganic film, and
the suppression portion is constituted by a semiconductor layer formed between the first inorganic film and the second inorganic film.

US Pat. No. 10,249,689

COLOR-CONVERSION PANEL, METHOD OF MANUFACTURING THE PANEL, AND DISPLAY DEVICE INCLUDING THE PANEL

Samsung Display Co., Ltd....

1. A color conversion panel comprising:a substrate;
a first color filter and a second color filter adjacent to the first color filter disposed on the substrate;
a first color conversion layer disposed on the first color filter and comprising a first side and second side, wherein a material of the first side is identical to the second side, and wherein the first side is disposed between the first color filter and the second side in a first direction, and wherein the first direction is perpendicular to the substrate;
a second color conversion layer disposed on the second color filter;
a third color layer disposed on the substrate and comprising a first face and a second face, wherein a material of the first face is identical to a material of the second face, wherein the first face is disposed between the substrate and the second face in the first direction, and wherein the second face is disposed farther than the first side from the substrate;
a light blocking member disposed between the first color filter and the second color filter and comprising a first edge and a second edge,
wherein the second edge is disposed between the first edge and the first side in the first direction, is disposed farther than the first face from the substrate, and is disposed closer than the second face to the substrate,
wherein each of the first color conversion layer and the second color conversion layer includes at least two quantum dots representing different colors, and
wherein the first color filter displays a different color from the second color filter.

US Pat. No. 10,249,687

SELF-LIGHT EMITTING DISPLAY UNIT AND ELECTRONIC DEVICE

Sony Corporation, Tokyo ...

1. An organic EL display device comprising:a pixel layer including a first color pixel, a second color pixel and a third color pixel; and
a pixel circuit layer including a first color pixel circuit, a second color pixel circuit, and a third color pixel circuit,
wherein
the first color pixel has a first anode electrode,
the second color pixel has a second anode electrode,
the third color pixel has a third anode electrode,
the first color pixel circuit includes a first capacitor including a first electrode and a second electrode, a first sampling transistor, and a first drive transistor including a control terminal, a first current terminal and a second current terminal configured to flow a drive current to the first color pixel,
the second color pixel circuit includes a second capacitor including a third electrode and a fourth electrode, a second sampling transistor, and a second drive transistor including a control terminal, a first current terminal and a second current terminal configured to flow a drive current to the second color pixel,
the third color pixel circuit includes a third capacitor including a fifth electrode and a sixth electrode, a third sampling transistor, and a third drive transistor including a control terminal, a first current terminal and a second current terminal configured to flow a drive current to the third color pixel,
a portion of the first anode electrode overlaps with a portion of the first capacitor and a portion of the first driving transistor in a plan view,
a portion of the second anode electrode overlaps with a portion of the second capacitor and a portion of the first driving transistor in the plan view,
a shape of the second electrode is different from a shape of the fourth electrode in the plan view,
a first layer comprises the first electrode, the third electrode, and the first current terminal and the second current terminal of the first and the second driving transistor,
a second layer, formed distinctly from the first layer, comprises the second electrode and the fourth electrode, and
a third layer, formed distinctly from the first layer and the second layer, comprises the control terminals of the first and second driving transistors.

US Pat. No. 10,249,686

ORGANIC LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME

Wuhan China Star Optoelec...

1. An organic light-emitting device, comprising:a substrate layer, a first electrode layer, light-emitting layers, and a second electrode arranged in layers defining a display zone of the organic light-emitting device;
the display zone comprising a plurality of primary pixels; each of the plurality of primary pixels comprising a first subpixel, a second subpixel, and a third subpixel; the first subpixel being a white subpixel; the second subpixel comprising a first light-emitting material for synthesizing white light; the third subpixel comprising a second light-emitting material; and
the organic light-emitting device further comprising a third light-emitting material for synthesizing the white light; the first light-emitting material comprising an original color zone and a synthesized color zone; the first light-emitting material for synthesizing the white light corresponding to the synthesized color zone and one portion of the third light-emitting material being layered or mixed to form the white subpixel;
the other portion of the third light-emitting material and the second light-emitting material being layered; a transmission distance of an exciton produced by the second light-emitting material being smaller than a thickness of the second light-emitting material; the third light-emitting material being formed in a zone corresponding to the white subpixel and the third subpixel;
wherein all function layers apart from the light-emitting layers of all of the subpixels are integrally formed.

US Pat. No. 10,249,682

NON-VOLATILE MEMORY SYSTEM WITH SERIALLY CONNECTED NON-VOLATILE REVERSIBLE RESISTANCE-SWITCHING MEMORY CELLS

SANDISK TECHNOLOGIES LLC,...

1. A non-volatile storage apparatus, comprising:a first plurality of serially connected non-volatile reversible resistance-switching memory cells comprising a dielectric region having a set of pockets, physically separate active regions positioned in the pockets and a barrier layer in contact with the active regions to form reversible resistance-switching interfaces;
a first plurality of word lines, each of the memory cells of the plurality are connected to a different word line of the first plurality of word lines, the word lines are surrounded by the dielectric region;
a first bit line connected to a first end of the first plurality of serially connected non-volatile reversible resistance-switching memory cells; and
a first switch connected to a second end of the first plurality of serially connected non-volatile reversible resistance-switching memory cells.

US Pat. No. 10,249,681

CROSS-POINT MEMORY ARRAY DEVICE AND METHOD OF MANUFACTURING THE SAME

SK HYNIX INC., Icheon (K...

1. A cross-point memory array device comprising:a plurality of first conductive line patterns disposed on a substrate, the plurality of first conductive line patterns extending in a first direction;
an insulating layer disposed on the first conductive line patterns, the insulating layer including a plurality of insulating film patterns and a plurality of switching film patterns;
a plurality of memory structures disposed on the plurality of switching film patterns, respectively; and
a plurality of second conductive line patterns disposed on the plurality of memory structures, the plurality of second conductive line patterns extending in a second direction that is nonparallel to the first direction,
wherein each of the plurality of switching film patterns has a variable resistance characteristic,
wherein the plurality of insulating film patterns comprise an oxide material and the plurality of switching film patterns comprise the oxide material with an dopant,
wherein the device further comprises a plurality of resistive element structures electrically connected in series to the plurality of switching film patterns, respectively, and to the plurality of memory structures, respectively,
wherein the plurality of resistive element structures each have an electrical resistance, and
wherein the plurality of resistive element structures prevent an operating current flowing through the switching film patterns and the memory structures from exceeding an upper limit.

US Pat. No. 10,249,679

METHOD OF WIRELESS COMMUNICATION USING THERMOELECTRIC GENERATORS

STMICROELECTRONICS (ROUSS...

1. A method, comprising:generating a first signal by a first device, the first signal having a first value or a second value;
electrically powering a first thermoelectric generator as a function of the first signal to generate a first thermal gradient in the first thermoelectric generator, wherein the first thermoelectric generator comprises a plurality of semiconducting regions disposed at least in part in an interconnect region of a first integrated circuit, the interconnect region being disposed above a semiconducting substrate of the first integrated circuit, wherein the interconnect region comprises a plurality of metallization layers disposed in one or more insulation materials, the plurality of semiconducting regions underlies the plurality of metallization layers, and wherein a first metallization layer of the plurality of metallization layers extends between a second metallization layer of the plurality of metallization layers and the plurality of semiconducting regions in a direction that is perpendicular to a major surface of the semiconducting substrate;
generating a second thermal gradient in a second thermoelectric generator, the second thermal gradient caused by the first thermal gradient; and
generating a second signal by a second device on a basis of electrical energy produced by the second thermoelectric generator in response to the second thermal gradient, the second signal having a third value or a fourth value, wherein when the first signal has the first value the second signal has the third value, and when the first signal has the second value the second signal has the fourth value.

US Pat. No. 10,249,676

IMAGE PICKUP APPARATUS

OLYMPUS CORPORATION, Tok...

1. An image pickup apparatus comprising:an image pickup device including a light receiving surface where a light receiving portion is formed, an opposite surface opposing the light receiving surface, and an inclined surface inclined at an acute first angle to the light receiving surface, the image pickup device being provided with a plurality of light receiving surface electrodes electrically connected with the light receiving portion, the plurality of light receiving surface electrodes being formed on the light receiving surface;
a transparent member joined so as to cover the light receiving surface; and
a wiring board including a plurality of second bond electrodes disposed on a main surface,
wherein the transparent member and the plurality of light receiving surface electrodes are extended to an outside of an end side of the inclined surface, and back surfaces of the plurality of light receiving surface electrodes are exposed from a side of the opposite surface,
the image pickup device includes a plurality of extended wiring patterns disposed on the opposite surface, the plurality of extended wiring patterns being electrically connected to respective back surfaces of the plurality of light receiving surface electrodes, the plurality of extended wiring patterns extending from the plurality of light receiving surface electrodes through the inclined surface and to the opposite surface, each of the extended wiring patterns including a first bond electrode on the opposite surface, and
the main surface of the wiring board and the opposite surface of the image pickup device are arranged in parallel, and the first bond electrode and each of the plurality of second bond electrodes are bonded through a bump to electrically connect the first bond electrodes to the second bond electrodes and to mechanically connect the wiring board to the image pickup device.

US Pat. No. 10,249,675

BACKSIDE ILLUMINATED IMAGE SENSOR WITH SELF-ALIGNED METAL PAD STRUCTURES

OmniVision Technolgies, I...

1. An image sensor, comprising:a semiconductor material having a front side and a back side opposite the front side;
a dielectric layer disposed on the front side of the semiconductor material;
a poly layer disposed on the dielectric layer;
an interlayer dielectric material covering both the poly layer and the dielectric layer;
an inter-metal layer disposed on the interlayer dielectric material, wherein a metal interconnect is disposed in the inter-metal layer; and
a contact pad trench extending from the back side of the semiconductor material into the semiconductor material, wherein the contact pad trench comprises:
a contact pad disposed in the contact pad trench, wherein the contact pad and the metal interconnect are coupled with a plurality of contact plugs; and
at least an air gap between the contact pad and side walls of the contact pad trench.

US Pat. No. 10,249,673

REAR-FACE ILLUMINATED SOLID STATE IMAGE SENSORS

Invensas Corporation, Sa...

1. A microelectronic unit comprising:a semiconductor element having a front surface, an opposed rear surface, and a bonding contact disposed at least partially adjacent the front surface;
a packaging layer overlying the semiconductor element;
an image sensing region including light detector elements disposed adjacent a rear surface of the semiconductor element;
a terminal overlying an outermost surface of the packaging layer; and
a conductive via extending through the packaging layer and at least a portion of the bonding contact so as to form an interior wall surface within the bonding contact, the via electrically connecting the terminal and the bonding contact,
wherein the image sensing region is electrically isolated from the conductive via.

US Pat. No. 10,249,672

IMAGE PICKUP APPARATUS, SEMICONDUCTOR APPARATUS, AND IMAGE PICKUP UNIT

OLYMPUS CORPORATION, Tok...

1. An image pickup apparatus comprising:an image pickup chip including a light receiving section and electrode pads formed around the light receiving section, on a first main face, and a plurality of connection electrodes, each of which is connected to each of the electrode pads via each of a plurality of through-hole interconnections, on a second main face, the first and second main faces being separated in a height direction;
a transparent support substrate section having a larger plan-view dimension than the image pickup chip;
an adhesive layer that bonds the first main face of the image pickup chip and the support substrate section and covers the light receiving section, the adhesive layer made of an insulating resin of a benzocyclobutene (BCB) resin, an epoxy-based resin or a silicone resin, a transmittance of which is 90% or more at visible wavelengths; and
a non-conductive sealing member that covers a side face of the image pickup chip and a side face of the adhesive layer, and has a same plan-view dimension as the support substrate section, the sealing member including a same insulating resin as the adhesive layer, with which a light shielding material composed of a non-conductive pigment is mixed;
wherein the transparent support substrate has a groove on a side face thereof,
insulating resin forming the adhesive layer overflows into and is disposed in a portion of the groove at a position separated from the adhesive layer in the height direction; and
the non-conductive sealing member is disposed in another portion of the groove to at least entirely cover the side face of the image pickup chip and the side face of the adhesive layer.

US Pat. No. 10,249,669

IMAGE SENSORS HAVING TWO OR MORE LIGHT SENSITIVE SUBAREAS FOR RECEIVING TWO OR MORE IMAGES OF A SAMPLE FROM A COMPONENT

Alentic Microscience Inc....

1. An apparatus comprisingat least one component configured to provide two or more images of a sample, and
a large-area high-aspect-ratio integral image sensor having two or more light-sensitive subareas positioned to receive the two or more images from the component.

US Pat. No. 10,249,657

SOLID-STATE IMAGE SENSING DEVICE, DRIVE METHOD, AND ELECTRONIC APPARATUS

SONY SEMICONDUCTOR SOLUTI...

1. A solid-state image sensing device, comprising:a pixel area with a plurality of pixels in which a first photoelectrical conversion section photoelectrically converts first visible light of a first wavelength range, and a second photoelectrical conversion section photoelectrically converts second visible light of a second wavelength range, wherein said first photoelectrical conversion section and said second photoelectrical conversion section are at different depths as viewed from a cross-sectional direction of said pixel area; and
a drive section configured to execute a first drive operation to read each pixel signal, from each of said plurality of pixels, having a potential corresponding to charges generated in each of said first photoelectrical conversion section and said second photoelectrical conversion section,
wherein, in each of said plurality of pixels, both said first photoelectrical conversion section and said second photoelectrical conversion section are configured as divided into directions that are approximately orthogonal with each other when viewed from a planar direction of said pixel area.

US Pat. No. 10,249,656

CHARGE PACKET SIGNAL PROCESSING USING PINNED PHOTODIODE DEVICES

SEMICONDUCTOR COMPONENTS ...

1. An image sensor, comprising:an image pixel comprising a first pinned photodiode of a first dopant type, wherein the image pixel produces an output signal based an amount of charge in the first pinned photodiode of the first dopant type;
an output line coupled to the image pixel, wherein the output line conveys the output signal from the image pixel;
a charge integrator circuit that includes a plurality of charge transfer circuits that are coupled between a summing node and the output line coupled to the image pixel; and
a charge subtraction circuit that is coupled to the summing node and that includes an additional plurality of charge transfer circuits that contain a pinned photodiode of a second dopant type that is different from the first dopant type.

US Pat. No. 10,249,655

SENSOR, MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE

BOE TECHNOLOGY GROUP CO.,...

1. A sensor, comprising:a base substrate;
a thin-film transistor (TFT) disposed on the base substrate and including a source electrode;
a first insulation layer disposed on the TFT and provided with a first through hole running through the first insulation layer;
a conductive layer disposed in the first through hole and on part of the first insulation layer and electrically connected with the source electrode via the first through hole;
a bias electrode disposed on the first insulation layer and separate from the conductive layer;
a sensing active layer respectively connected with the conductive layer and the bias electrode;
an auxiliary conductive layer disposed on the conductive layer;
a passivation layer provided with a second through hole; and
a metal shield provided with a third through hole,
wherein in an direction perpendicular to the base substrate, the passivation layer is disposed between the source electrode and the first insulation layer; the second through hole is configured to run through the passivation layer and communicate with the first through hole; and the conductive layer is electrically connected with the source electrode via the first through hole and the second through hole;
wherein the metal shield is disposed between the passivation layer and the first insulation layer; the third through hole is configured to run through the metal shield and communicate with the first through hole and the second through hole; and the conductive layer is electrically connected with the source electrode via the first through hole, the second through hole and the third through hole.

US Pat. No. 10,249,650

DISPLAY DEVICE

Japan Display Inc., Toky...

1. A display device comprising:a pixel including a semiconductor layer, a first conductive layer below the semiconductor layer, and a second conductive layer above the semiconductor layer; and
an under layer below the semiconductor layer,
wherein the semiconductor layer includes a channel region which overlaps at least one of the first conductive layer and the second conductive layer in a plan view,
the first conductive layer includes a first edge located on a side of an edge of the channel region in a direction of a channel length of the semiconductor layer,
the second conductive layer includes a second edge located on a side of the edge of the channel region, and
a position of the first edge in the direction of the channel length is different from a position of the second edge in the direction of the channel length in the plan view.

US Pat. No. 10,249,644

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor Energy Labo...

1. A semiconductor device comprising:a first transistor comprising a gate electrode over a substrate;
a first electrode electrically connected to the first transistor, the first electrode being a pixel electrode;
a second transistor comprising a first gate electrode over the substrate;
a second electrode overlapping with the first gate electrode of the second transistor;
a third electrode over the substrate, the third electrode being supplied with a fixed potential, and
a fourth electrode comprising a low-resistance oxide film over the substrate;
wherein the second electrode and the third electrode are formed by processing a same light-transmitting conductive film comprising a light-transmitting material,
wherein a first capacitor is formed in a region where the first electrode and the third electrode overlap with each other with an insulating film provided therebetween, and
wherein a second capacitor is formed in a region where the third electrode and the fourth electrode overlap with each other.

US Pat. No. 10,249,633

FLASH MEMORY DEVICE

GLOBALFOUNDRIES Inc., Gr...

1. An integrated circuit product, comprising:a silicon-on-insulator (SOI) substrate comprising a semiconductor bulk substrate, a buried insulating layer positioned above said semiconductor bulk substrate, and a semiconductor layer positioned above said buried insulating layer; and
a flash memory device positioned in a first area of said SOI substrate, said flash memory device comprising:
a flash transistor device comprising a floating gate, an insulating layer positioned above said floating gate, and a control gate positioned above said insulating layer, said floating gate comprising a portion of said semiconductor layer; and
a read transistor device comprising a gate dielectric layer positioned above said semiconductor bulk substrate and a read gate electrode positioned above said gate dielectric layer; and
a fully depleted silicon-on-insulator (FDSOI) transistor device positioned in a second area of said SOI substrate that is electrically isolated from said first area, wherein said FDSOI transistor device comprises a second portion of said semiconductor layer, a high-k gate dielectric layer positioned above said second portion of said semiconductor layer, and a first metal gate layer positioned above said high-k gate dielectric layer.

US Pat. No. 10,249,629

METHOD FOR FORMING BURIED WORD LINES

UNITED MICROELECTRONICS C...

1. A method for forming buried word lines; comprising:providing a substrate, having a plurality of shallow trench isolations disposed therein;
forming a first oxide layer on the substrate;
forming a plurality of first patterned material layers on the first oxide layer, wherein a plurality of first recesses are disposed between every two adjacent first patterned material layers respectively;
forming a second patterned material layer in the first recesses;
forming a second oxide layer in the first recesses and covering at least two sidewalls of each of the first patterned material layers;
performing a first etching step to remove a portion of the first oxide layer and a portion of the second oxide layer, wherein the remaining first oxide layer and the remaining second oxide layer are defined as a plurality of oxide masks; and
using the first patterned material layers and the second patterned material layer as the protect layers, performing a second etching process, to form a plurality of second recesses in the substrate.

US Pat. No. 10,249,628

SEMICONDUCTOR DEVICE HAVING BURIED GATE STRUCTURE AND METHOD OF FABRICATING THE SAME

SAMSUNG ELECTRONICS CO., ...

1. A semiconductor device, comprising:a device isolation region defining an active region in a substrate; and
gate structures buried in the active region of the substrate,
wherein at least one of the gate structures comprises:
a gate trench;
a gate insulating layer formed on the entire inner wall of the gate trench;
a gate barrier pattern formed on the gate insulating layer disposed on a lower portion of the gate trench;
a gate electrode pattern formed on the gate barrier pattern and filling the lower portion of the gate trench; and
a gate capping insulating layer formed on the gate electrode pattern and the gate barrier pattern to fill the upper portion of the gate trench,
wherein the gate barrier pattern has a top surface which is lower than a top of the gate electrode pattern,
wherein the top surface of the gate barrier pattern is in contact with an insulating layer.

US Pat. No. 10,249,625

COATED PRINTED ELECTRONIC DEVICES EXHIBITING IMPROVED YIELD

XEROX CORPORATION, Norwa...

1. A coated, printed electronic device comprising:a plurality of contact pads arranged in a pattern,
a plurality of electrode traces arranged in another pattern, the plurality of electrode traces comprising a set of bottom electrode traces and a set of top electrode traces, each electrode trace in electrical communication with an associated contact pad of the plurality of contact pads,
a plurality of memory cells, each memory cell located at an intersection of a pair of electrode traces of the plurality of electrode traces and comprising a bottom electrode layer formed from a region of one of the bottom electrode traces, a top electrode layer formed from a region of one of the top electrode traces, and a ferroelectric layer between the bottom and top electrode layers, and
a protective layer covering the plurality of electrode traces and extending laterally beyond each edge of each electrode trace to provide a buffer zone surrounding each electrode trace, the buffer zone extending from an end of each electrode trace to cover a portion of each associated contact pad in an overlapping region, wherein each contact pad also has at least one uncovered edge, wherein the buffer zone is characterized by a buffer zone width which is no more than 2*?2*(line registration capability) in the overlapping region.

US Pat. No. 10,249,624

SEMICONDUCTOR STRUCTURE CONTAINING LOW-RESISTANCE SOURCE AND DRAIN CONTACTS

International Business Ma...

1. A method of forming a semiconductor structure, said method comprising:providing a structure comprising at least one first functional gate structure located on a first semiconductor material portion within a pFET device region of a semiconductor substrate and at least one second functional gate structure located on a second semiconductor material portion within an nFET device region of the semiconductor substrate, wherein a first epitaxial semiconductor material is located on each side of said at least one first functional gate structure and in contact with a surface of said first semiconductor material portion, and a second epitaxial semiconductor material is located on each side of said at least one second functional gate structure and in contact with a surface of said second semiconductor material portion, and wherein a high k dielectric layer is located on a topmost surface and a sidewall surface of said first epitaxial semiconductor material, and laterally surrounding a sidewall of said least one first functional gate structure;
forming a layer of a dipole metal or a metal-insulator-semiconductor oxide on said second epitaxial semiconductor material, but not said first epitaxial semiconductor material;
removing, by etching, said high k dielectric layer from a portion of said topmost surface of said first epitaxial semiconductor material to physically expose a portion of said first epitaxial semiconductor material; and
forming a first metal semiconductor alloy on said physically exposed portion of said first epitaxial semiconductor material and a second metal semiconductor alloy in direct contact with said layer of said dipole metal or said metal-insulator-semiconductor oxide.

US Pat. No. 10,249,618

POWER SEMICONDUCTOR DEVICE HAVING TRENCH GATE TYPE IGBT AND DIODE REGIONS

Mitsubishi Electric Corpo...

1. A power semiconductor device having an IGBT region that includes a plurality of cells, and a diode region for reverse conduction of said IGBT region, the power semiconductor device comprising:a semiconductor substrate having a first surface and a second surface opposite said first surface, said first surface having a portion included in said IGBT region and a portion included in said diode region, said semiconductor substrate including,
a first layer of a first conductivity type that is provided on said second surface and is at least partially included in said diode region,
a second layer of said first conductivity type that is in contact with said first layer in said diode region, and
a third layer of a second conductivity type that is provided on said first surface and away from said second surface, is at least partially included in said diode region, and is in contact with said second layer, said second conductivity type being different from said first conductivity type;
an interlayer insulating film that is provided on said first surface of said semiconductor substrate and has a diode opening that exposes part of said third layer;
a first electrode that is provided on said interlayer insulating film and is in contact with said third layer through said diode opening; and
a second electrode that is provided on said second surface of said semiconductor substrate and is in contact with said first layer,
wherein said third layer includes a first region and a plurality of second regions, said first region being provided on the whole of said first surface in said diode region, said plurality of second regions being spaced from each other on said first region, and said plurality of second regions having a higher impurity concentration than an impurity concentration of said first region when impurity concentrations in a direction parallel to said first surface of said semiconductor substrate are compared, and
wherein said first electrode is in contact with only said plurality of second regions of said third layer.

US Pat. No. 10,249,613

ELECTROSTATIC DISCHARGE DEVICE AND MANUFACTURING METHOD THEREOF, ARRAY SUBSTRATE, DISPLAY PANEL AND DEVICE

BOE TECHNOLOGY GROUP CO.,...

1. An electrostatic discharge device, comprising: a transistor with one of its source and drain serving as an input terminal of said electrostatic discharge device and the other of its source and drain serving as an output terminal of said electrostatic discharge device,wherein said transistor comprises:
a first conductive layer used as a first floating gate;
a first insulating layer covering said first conductive layer;
an active layer disposed on said first insulating layer;
a second insulating layer covering said active layer;
a second conductive layer used as a second floating gate and disposed on said second insulating layer;
a third insulating layer covering said second conductive layer; and
a third conductive layer and a fourth conductive layer disposed on said third insulating layer and on both sides of the active layer, said third conductive layer and fourth conductive layer being isolated from each other;
wherein said third conductive layer serves as one of the source and the drain and said fourth conductive layer serves as the other of the source and the drain;
said first conductive layer, said third conductive layer, and said first insulating layer, second insulating layer and third insulating layer disposed between said first conductive layer and said third conductive layer form a first capacitor;
said first conductive layer, said fourth conductive layer, and said first insulating layer, second insulating layer and third insulating layer disposed between said first conductive layer and said fourth conductive layer form a second capacitor;
said second conductive layer, said third conductive layer, and said third insulating layer disposed between said second conductive layer and said third conductive layer form a third capacitor;
said second conductive layer, said fourth conductive layer, and said third insulating layer disposed between said second conductive layer and said fourth conductive layer form a fourth capacitor.

US Pat. No. 10,249,611

DIODE STRING CONFIGURED WITH GUARD RING SILICON-CONTROLLED RECTIFIER FOR NEGATIVE ELECTROSTATIC DISCHARGE PROTECTION

Silicon Laboratories Inc....

1. A semiconductor circuit, comprising:an N-well structure formed in a substrate, wherein said N-well structure is electrically coupled to a positive voltage node;
a plurality of N+ doped regions formed in and distributed across said N-well structure each coupled to said positive voltage node;
a diode string comprising a plurality of NPN transistor diode structures formed in said N-well structure and electrically coupled in series having a first diode structure disposed at a first end of said diode string and a last diode structure disposed at a second and opposite end of said diode string, and wherein each of said plurality of diode structures is disposed between a corresponding consecutive pair of said plurality of N+ doped regions; and
a P+ guard ring comprising at least one P+ doped structure formed in said N-well structure disposed on either side of said first diode structure and electrically coupled to a reference voltage node, wherein said P+ guard ring forms a silicon-controlled rectifier (SCR) with said first diode structure.

US Pat. No. 10,249,608

ESD PROTECTION CIRCUIT

Qorvo US, Inc., Greensbo...

1. An electrostatic discharge protection circuit comprising:delay circuitry coupled between a supply voltage node and a fixed voltage node;
latch circuitry comprising:
current-limiting circuitry; and
a latch; wherein
the current-limiting circuitry and the latch are coupled between the supply voltage node and the fixed voltage node;
the current-limiting circuitry is coupled to the delay circuitry, and
the current-limiting circuitry comprises a gallium arsenide transistor and a diode coupled in series with the gallium arsenide transistor and the latch; and
discharge circuitry coupled between the supply voltage node and the fixed voltage node and to the latch, wherein the latch is configured to drive the discharge circuitry to short the supply voltage node to the fixed voltage node during an electrostatic discharge event, and the current-limiting circuitry is configured to limit latch current from the supply voltage node to the latch during normal operation.

US Pat. No. 10,249,604

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Samsung Electronics Co., ...

1. A semiconductor device comprising:a base substrate; and
a semiconductor chip on the base substrate, the semiconductor chip being an individual semiconductor chip, the semiconductor chip including:
a first layer structure and a second layer structure opposite to the first layer structure, the second layer structures is a semiconductor device portion, and
a bonding structure between the first layer structure and the second layer structure, the bonding structure including a silver-tin (Ag—Sn) compound portion and a nickel-tin (Ni—Sn) compound portion above and below the Ag—Sn compound portion, the Ag—Sn compound portion and the Ni—Sn compound portion having a same width in a horizontal direction such that edge portions of the Ag—Sn compound portion are exposed and edge portions of the Ni—Sn compound portion are exposed,
wherein the first layer structure is a chip substrate including a semiconductor substrate,
wherein the chip substrate including the semiconductor substrate is between the base substrate and the semiconductor device portion, and
wherein the individual semiconductor chip includes the chip substrate, the semiconductor device portion and the bonding structure between the chip substrate and the semiconductor device portion.

US Pat. No. 10,249,599

LAMINATED PRINTED COLOR CONVERSION PHOSPHOR SHEETS

eLux, Inc., Vancouver, W...

1. An emissive display using printed phosphor color conversion sheets, the display comprising:a backplane comprising a top surface with a first number of light emitting diode (LED) devices aligned in an array and configured to emit light in a visible spectrum with a first color;
a first transparent substrate attached to the top surface of the backplane, wherein the first transparent substrate includes a top surface having a second number of printed phosphor dots configured to emit light in the visible spectrum with a second color different than the first color, and wherein the second number of printed phosphor dots overly a first subset of the first number of the LED devices; and,
a second transparent substrate attached to the top surface of the first transparent substrate, wherein the second transparent substrate includes a pattern of a third number of printed phosphor dots overlying a second subset of the first number of LED devices, and wherein the first subset of the first number of LED devices is exclusive of the second subset of the first number of LED devices, and wherein the third number is less than the first number.

US Pat. No. 10,249,597

SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING DIE RECOVERY IN TWO-LEVEL MEMORY (2LM) STACKED DIE SUBSYSTEMS

Intel Corporation, Santa...

1. A stacked semiconductor package, comprising:a processor functional silicon die at a first layer of the stacked semiconductor package, wherein the processor functional silicon die comprises a TSV repair register comprising a re-routing string;
one or more memory dies forming a corresponding one or more memory layers of the stacked semiconductor package;
a plurality of Through Silicon Vias (TSVs) formed through the one or more memory dies, wherein each of the plurality of TSVs traverse through the one or more memory layers to the processor functional silicon die at the first layer of the stacked semiconductor package; a plurality of physical memory interfaces electrically interfacing the one or more memory dies to the processor functional silicon die at the first layer through the memory layers via the plurality of TSVs; and
a redundant physical memory interface formed by a redundant TSV traversing through the memory layers to the processor functional silicon die at the first layer through which to reroute a memory signal path from a defective physical memory interface at a defective TSV to a functional signal path traversing the redundant TSV.

US Pat. No. 10,249,596

FAN-OUT IN BALL GRID ARRAY (BGA) PACKAGE

Juniper Networks, Inc., ...

1. A device comprising:a set of at least four integrated circuits (ICs);
a first multi-chip module (MCM) substrate comprising a communication link and a first ball grid array (BGA), wherein the first BGA comprises a first pitch indicative of a distance between balls of the first BGA, wherein each IC of the set of at least four ICs is coplanar mounted to a surface of the first MCM substrate, wherein the communication link couples a first IC of the set of at least four ICs to a second IC of the set of at least four ICs, and wherein the first MCM substrate comprises organic, non-silicon insulating material;
a second MCM substrate coupled to the first MCM substrate with the first BGA, the second MCM substrate comprising a second BGA, wherein the second BGA comprises a second pitch indicative of a distance between balls of the second BGA, wherein the second pitch is greater than the first pitch, and wherein the second MCM substrate comprises organic, non-silicon insulating material; and
a printed circuit board (PCB) coupled to the second MCM substrate with the second BGA.

US Pat. No. 10,249,592

WIRE BONDED WIDE I/O SEMICONDUCTOR DEVICE

SanDisk Technologies LLC,...

1. A semiconductor device, comprising:a substrate;
an interface chip mounted to the substrate;
a group of one or more semiconductor die stacked on one of the substrate and the interface chip;
a first set of wire bonds extending between the group of one or more semiconductor die and the interface chip, at least a pair of wire bonds in the first set of wire bonds extending in straight parallel paths from a semiconductor die of group of semiconductor die and the interface chip, the first set of wire bonds supporting wide I/O data exchange between the group of one or more semiconductor die and the interface chip; and
a second set of wire bonds extending between the interface chip and the substrate, the second set of wire bonds supporting narrow I/O data exchange between the interface chip and the substrate.

US Pat. No. 10,249,591

RESIN COMPOSITION, BONDED BODY AND SEMICONDUCTOR DEVICE

MITSUBISHI MATERIALS CORP...

1. A resin composition, comprising:a binder resin; and
silver-coated particles in which a functional group is introduced to a surface,
wherein a ratio (a/b) of Young's modulus (a) of the silver-coated particles to Young's modulus (b) of the binder resin after being cured is 0.1 to 2.0, and
the Young's modulus (a) of the silver-coated particles is 0.05 to 2.0 GPa.

US Pat. No. 10,249,584

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

ABLIC INC., Chiba-Shi (J...

1. A semiconductor device, comprising:a substrate;
a wiring formed above the substrate;
a titanium nitride film formed on the wiring;
an oxide film formed on the titanium nitride film;
a silicon nitride film formed on the oxide film; and
a pad portion exposing the wiring, and formed within a region where a first opening portion formed in the silicon nitride film and a second opening portion formed in the titanium nitride film overlap with each other in a plan view, and being inside a third opening portion formed in the oxide film in the plan view,
the silicon nitride film being formed on top of and in partial contact with the titanium nitride film inside the third opening portion in the plan view.

US Pat. No. 10,249,582

RADIO FREQUENCY (RF) DEVICES WITH RESONANT CIRCUITS TO REDUCE COUPLING

NXP USA, Inc., Austin, T...

1. A device comprising:a first conductor,
a second conductor adjacent to the first conductor; and
a resonant circuit, the resonant circuit physically located at least in part between the first conductor and the second conductor, the resonant circuit electromagnetically coupled to and configured to resonate with the first conductor and the second conductor at a frequency f0, and when resonating to provide a path to a ground node for crosstalk energy and reduce electromagnetic coupling between the first conductor and the second conductor, wherein the resonant circuit comprises a first capacitor in series with an inductance, and wherein the resonant circuit includes a first end and a second end, and wherein the first end is coupled to a first ground node and wherein the second end is coupled to a second ground node.

US Pat. No. 10,249,580

STACKED SUBSTRATE INDUCTOR

QUALCOMM Incorporated, S...

1. A stacked substrate inductor, comprising:a first substrate;
a second substrate stacked on the first substrate such that an upper side of the first substrate is in direct contact with a lower side of the second substrate;
a first inductor within and in direct contact with the first substrate, the first inductor including a first core region;
a second inductor within and in direct contact with the second substrate, the second inductor including a second core region;
an inductor interconnect within and in direct contact with the second substrate, the inductor interconnect configured to electrically couple the first inductor with the second inductor,
wherein at least a portion of the first core region overlaps with at least a portion of the second core region,
wherein the second inductor comprises a plurality of second substrate inductance loops, and
wherein the second substrate encapsulates the second inductor such that each of the plurality of second substrate inductance loops is in direct contact with the second substrate.