US Pat. No. 10,455,708

MULTILAYERED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A multilayered substrate, comprising:an insulating layer;
a conductive pattern embedded, at least partially, in the insulating layer;
a metal pattern formed in a protruding manner on the outermost surface of the insulating layer; and
a bump being electrically connected to the conductive pattern and penetrating the insulating layer,
wherein the bump comprises:
a low melting point metal layer having a melting point lower than a melting point of the conductive pattern; and
a high melting point metal layer having a melting point higher than the melting point of the low melting point metal layer and having a latitudinal cross-sectional area smaller than a latitudinal cross-sectional area of the low melting point metal layer,
wherein the high melting point metal layer is interposed within the insulating layer between the at least partially embedded conductive pattern and the low melting point metal layer,
wherein an interface between the high melting point layer and the embedded conductive pattern is formed within the insulating layer, and
wherein the metal pattern is directly coupled with the low melting point metal layer.

US Pat. No. 9,504,169

PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A printed circuit board having an embedded electronic device, comprising:
a core substrate having circuit layers formed on both a top surface and a bottom surface thereof;
a taper-shaped cavity formed on the core substrate; and
an electronic device embedded in the cavity,
wherein a width of the cavity is formed to gradually decrease in a direction toward the bottom surface of the core substrate
from the top surface of the core substrate, and a width of the cavity of a lower surface at the bottom surface of the core
substrate is formed to be smaller than that of a lower portion of the electronic device, and

wherein an edge of the lower portion of the electronic device is in contact with a tapered surface of the cavity.

US Pat. No. 9,502,177

MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON

Samsung Electro-Mechanics...

1. A multilayer ceramic capacitor, comprising:
a ceramic body containing a dielectric within which is located a first plurality of internal electrodes and a second plurality
of internal electrodes, the first and second plurality of electrodes interleaved with facing each other so as to form a capacitance;

a first external electrode disposed on the one side surface of the ceramic body and electrically connected to the first plurality
of internal electrodes, and a second external electrode disposed on a second side surface of the ceramic body and electrically
connected to the second plurality of internal electrodes,

wherein 0.2?L1/L?0.96,

where L is a length in a length direction of the ceramic body, and L1 is a length of the first and second external electrodes in the length direction of the ceramic body, and

an overlapped area of the first and second internal electrodes is substantially equal to (L2×W)?(2×S2),

where L2 is a length of the first and second internal electrodes, W is a width of the ceramic body and S2 is an area of a margin part of the ceramic body in a width direction of the ceramic body corresponding to a region between
one end of each of the first and second internal electrodes and the other end thereof in the length direction.

US Pat. No. 9,171,780

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Samsung Electro-Mechanics...

1. A method for manufacturing a semiconductor package, comprising:
preparing a rectangular frame of a material of a molding having a plurality of quadrangular holes;
attaching a plurality of semiconductor chips and the frame on one surface of a tape;
forming a molding part on the tape to cover the semiconductor chip and the frame;
peeling the tape;
forming a resin layer at a portion at which the tape is peeled;
forming a wiring on the resin layer to be connected to the semiconductor chip; and
singulating the semiconductor package as individual semiconductor packages by a sawing process.

US Pat. No. 9,955,614

SHEET FOR SHIELDING AGAINST ELECTROMAGNETIC WAVES AND WIRELESS POWER CHARGING DEVICE

SAMSUNG ELECTRO-MECHANICS...

1. A sheet for shielding against electromagnetic waves, the sheet comprising:a plurality of magnetic layers including silicon (Si); and
an organosilane layer interposed between the plurality of magnetic layers, and directly bonded with two of the plurality of magnetic layers by silicon-oxygen bonds,
wherein the sheet has a thickness of 1 ?m or less.

US Pat. No. 10,154,594

PRINTED CIRCUIT BOARD

Samsung Electro-Mechanics...

1. A printed circuit board comprising:a circuit board comprising first insulating layers, first metal layers, and a cavity between an upper surface of the circuit board and a lower surface of the circuit board that are substantially parallel to each other; and
a connection board comprising second insulating layers substantially parallel with second metal layers, the second metal layers comprising metal patterns,
wherein the connection board is disposed in the cavity with the second insulating layers and the second metal layers of the connection board substantially perpendicular to the first metal layers and first insulation layers of the circuit board, and the second metal layers of the connection board extending from an upper surface to a lower surface of the connection board,
wherein the second metal layers of the connection board are connected to an electronic component to provide an electrical connection between the upper surface of the circuit board and the lower surface of the connection board.

US Pat. No. 9,907,182

METHOD OF MANUFACTURING INSULATION FILM AND PRINTED CIRCUIT BOARD

Samsung Electro-Mechanics...

1. A method of manufacturing an insulation film, comprising:
coating a resin composite on a lower protective film, the resin composite comprising an inorganic filler dispersed therein;
precipitating the inorganic filler in the coated resin composite toward the lower protective film, by gravity,
forming an insulating layer by drying the coated resin composite; and
laminating an upper protective film on the insulating layer.

US Pat. No. 9,136,059

MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor comprising:
a ceramic body including a plurality of dielectric layers and having first and second main surfaces facing each other, first
and second side surfaces facing each other, and first and second end surfaces facing each other;

a capacitor part formed in the ceramic body and including a first internal electrode having a lead exposed to the first side
surface and a second internal electrode exposed to the second end surface;

first to third internal connecting conductors formed in the ceramic body and having at least one polarity; and
first to fourth external electrodes formed outwardly of the ceramic body and electrically connected to the first and second
internal electrodes and the first to third internal connecting conductors,

wherein the first and second internal connecting conductors and the third internal connecting conductor are connected in parallel,
and

the first to third internal connecting conductors and the capacitor part are connected in series.

US Pat. No. 9,832,885

CIRCUIT BOARD, ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING CIRCUIT BOARD

Samsung Electro-Mechanics...

1. A circuit board comprising:
a first insulating layer;
a circuit pattern disposed on an upper surface of the first insulating layer and comprising a circuit patter portion and a
connection pad portion;

a second insulating layer made of a solder resist and formed on the first insulating layer and the circuit pattern so as to
cover the circuit pattern, the second insulating layer having an opening formed therein to expose at least a portion of the
connection pad portion; and

a contact pad formed on an upper surface of the second insulating layer and on an inner wall of the opening, one end of the
contact pad being in contact with the connection pad portion to be electrically connected to the connection pad portion.

US Pat. No. 9,178,483

MULTILAYER CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

SAMSUNG ELECTRO-MECHANICS...

6. A board having a multilayer chip electronic component, comprising:
a printed circuit board having first to third electrode pads disposed thereon; and
the multilayer chip electronic component mounted on the printed circuit board,
wherein the multilayer chip electronic component includes: a ceramic body including a plurality of dielectric layers and having
first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second
end surfaces opposing each other, an inductor part disposed within the ceramic body and including first and second internal
electrodes, the first internal electrode being exposed to the first side surface and the first end surface, and the second
internal electrode being exposed to the first side surface and the second end surface, a capacitor part disposed within the
ceramic body and including third to fifth internal electrodes, the third internal electrode being exposed to the first and
second side surfaces, the fourth internal electrode being exposed to the first end surface, and the fifth internal electrode
being exposed to the second end surface, and first and second external electrodes respectively disposed on the first and second
end surfaces of the ceramic body and electrically connected to the first and second internal electrodes and the fourth and
fifth internal electrodes, a third external electrode extended from the second main surface of the ceramic body to the first
and second side surfaces and connected to the third internal electrode, and a fourth external electrode extended from the
first main surface of the ceramic body to the first and second side surfaces and connected to the first and second internal
electrodes, the capacitor part being composed of first and second capacitor parts and the inductor part and the capacitor
part being connected to each other.

US Pat. No. 10,064,291

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Samsung Electro-Mechanics...

1. A circuit board comprising:an insulating part;
a thermally conductive structure comprising a first structure and a second structure; and
an insulator configured to insulate the first structure from the second structure, wherein the first structure and the second structure are composed of thermally conductive material, a part of the thermally conductive structure is inserted to the insulating part, and the second structure transfers signals to or from an electronic component disposed above the thermally conductive structure, and a first contact via in contact with the first structure is thermally insulated from a second contact via in contact with the second structure.

US Pat. No. 9,110,156

APPARATUS AND SYSTEM FOR MEASURING VELOCITY OF ULTRASOUND SIGNAL

SAMSUNG ELECTRO-MECHANICS...

1. An apparatus for measuring velocity of an ultrasound signal, comprising:
a transmitting module transmitting ultrasound signals to targets;
a receiving module receiving the ultrasound signals reflected from the targets;
an image generating module using the received ultrasound signals to generate a plurality of ultrasonic images having different
sound velocities; and

a sound velocity determining module using the plurality of generated ultrasonic images to determine optimal sound velocity
for scanning the targets,

wherein the sound velocity determining module comprises:
a noise removing unit removing speckle noises from the plurality of generated ultrasonic images,
an image segmenting unit segmenting the plurality of ultrasonic images from which noise is removed into each of the plurality
of blocks,

a block selector selecting a predetermined number of blocks from the plurality of segmented blocks, and
a sound velocity determining unit comparing the blocks of the plurality of ultrasonic images selected in the block selector
to determine the optimal sound velocity for scanning the targets,

wherein the sound velocity determining unit detects the edge regions of blocks selected for each ultrasonic image, sums the
luminance of the detected edge regions, and compares the luminance of the edge regions summed for each ultrasonic image to
determine the sound velocity of the ultrasonic images having the smallest luminance in the summed edge regions as the optimal
sound velocity for scanning the targets.

US Pat. No. 10,091,871

METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD

Samsung Electro-Mechanics...

1. A multilayer rigid flexible printed circuit board having a rigid portion and a flexible portion, the multilayer rigid flexible printed circuit board comprising:a first flexible film including a first circuit pattern on one or both surfaces;
a second flexible film disposed on the first flexible film and including a second circuit pattern on a portion of the second flexible film, positioned in the rigid portion;
a pattern stack disposed on a part of the portion of the second flexible film to be adjacent to the flexible portion, and having a metal pattern and a protective pattern on the metal pattern;
a first insulating layer disposed on the portion of the second flexible film and covering the pattern stack and including a third circuit pattern on the first insulating layer; and
at least one second insulating layer disposed on the first insulating layer and including a fourth circuit pattern on the at least one first insulating layer.

US Pat. No. 9,066,395

POWER SUPPLY DEVICE AND CONTROL CIRCUIT THEREOF

SAMSUNG ELECTRO-MECHANICS...

1. A control circuit of a power supply device for switching power input to a primary side to supply the power to a predetermined
load connected to a secondary side electrically insulated from the primary side,
wherein the control circuit generates a predetermined PWM signal to apply the PWM signal to a dimming switch connected to
an end of the load and controls a switching frequency of the primary side, based on a control voltage generated according
to a feedback signal according to the power supplied to the load and the PWM signal, and

the control voltage maintains a constant difference between a minimum voltage level and a maximum voltage level regardless
of a duty of the PWM signal,

wherein the control circuit comprises:
a dimming unit applying the PWM signal to the dimming switch and generating the control voltage;
a current generating unit generating a current whose amount is varied according to a level of the control voltage of the dimming
unit;

a signal generating unit generating a pulse signal having a frequency determined according to the current generated by the
current generating unit; and

a driving unit generating a switching control signal according to the pulse signal.

US Pat. No. 9,900,987

COIL COMPONENT AND BOARD FOR MOUNTING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A coil component comprising:
a magnetic body including first and second coil portions disposed on one surface of a substrate and disposed on opposite sides
of a central portion of the magnetic body, and third and fourth coil portions disposed on the other surface of the substrate
and disposed on the opposite sides of the central portion of the magnetic body; and

first to fourth external electrodes disposed on an external surface of the magnetic body and connected to the first to fourth
coil portions,

wherein the first coil portion and the third coil portion have a first core portion, the second coil portion and the fourth
coil portion have a second core portion, and a peripheral portion disposed outwardly of the first to fourth coil portions
has greater permeability than that of the first and second core portions, and

the first coil portion and the third coil portion are connected to each other by a via, and the second coil portion and the
fourth coil portion are connected to each other by another via.

US Pat. No. 9,900,989

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A printed circuit board comprising:
a core substrate;
a first insulation layer stacked on the core substrate and formed with a circuit layer including a via and a pad;
a prepreg layer stacked on a surface of the first insulation layer;
a second insulation layer formed on a surface of the prepreg layer; and
an outer layer circuit layer formed on the second insulation layer,
wherein the second insulation layer and the prepreg layer are different materials from each other,
wherein the prepreg layer and the second insulation layer integrally form an insulation layer such that no other circuit layer
is formed between the circuit layer of the first insulation layer and the outer layer circuit layer, and

wherein a cavity penetrating the prepreg layer and the second insulation layer and using the first insulation layer as a bottom
surface thereof is formed.

US Pat. No. 9,252,655

PHASE SHIFT CIRCUIT AND POWER FACTOR CORRECTION CIRCUIT INCLUDING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A phase shift circuit, comprising:
a ramp generation unit charging or discharging a capacitor connected to a switch device to generate a ramp signal;
a reference signal generation unit generating a predetermined reference signal from the ramp signal; and
a comparison unit comparing the ramp signal with the reference signal to generate a clock signal,
wherein at least one of the reference signal generation unit and the comparison unit changes a negative or positive value
of offset components included in the reference signal or the ramp signal within every operating period of the switch device.

US Pat. No. 10,580,582

MULTILAYER ELECTRONIC COMPONENT

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer electronic component comprising:a multilayer capacitor including a pair of external electrodes respectively disposed on both ends opposing each other; and
a pair of frame terminals having coupling holes allowing the external electrodes of the multilayer capacitor to be inserted, and separating the multilayer capacitor from a mounting surface,
wherein band portions of the external electrodes are bonded to inner surfaces of the coupling holes, and
wherein the coupling holes extend to an outer surface of the frame terminals, respectively.

US Pat. No. 10,104,776

CHIP RESISTOR ELEMENT

SAMSUNG ELECTRO-MECHANICS...

1. A chip resistor element comprising:an insulating substrate having first and second surfaces opposing each other;
a resistor layer disposed on the first surface of the insulating substrate;
first and second internal electrodes disposed on respective sides of the resistor layer on the first surface of the insulating substrate and connected to the resistor layer;
a resistor protection layer covering the resistor layer and extending onto portions of the first and second internal electrodes;
first electrode protection layers disposed on the first and second internal electrodes so as to be overlapped with portions of the resistor protection layer and containing first conductive powder particles and a resin;
second electrode protection layers disposed on the first electrode protection layers and containing second conductive powder particles and a resin, wherein a content of the resin in the second electrode protection layer is lower than a content of the resin in the first electrode protection layer; and
first and second external electrodes respectively disposed on the first and second internal electrodes so as to cover the second electrode protection layers, and connected to the resistor protection layer.

US Pat. No. 10,098,232

EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. An embedded board comprising:a first insulating layer;
a first circuit layer formed inside the first insulating layer;
a second circuit layer formed on an upper part of the first circuit layer, and the second circuit layer being disposed on the first insulating layer;
a second insulating layer disposed on a top surface of the first insulating layer, wherein the second circuit layer is disposed in the second insulating layer;
a first electronic element arranged inside the second insulating layer, the first electronic element being spaced apart from the second circuit layer;
a metal pillar formed between the first circuit layer and the second circuit layer or the first electronic element; and
a first via formed on an upper part of the second circuit layer inside the second insulating layer, at least a portion of a top surface of the first via in contact with a protection layer formed on an upper surface of the second insulating layer, and the remainder of the top surface of the first via exposed in an opening of the protection layer,
wherein the top surface of the first insulating layer comprises a polished plane exposing a top of the metal pillar.

US Pat. No. 10,045,444

PRINTED CIRCUIT BOARD, PACKAGE AND METHOD OF MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A printed circuit board, comprising:a core board comprising, on a first surface thereof, an element mounting part and an element non-mounting part;
an insulation layer disposed on the element non-mounting part;
a copper-clad laminate plate disposed on the insulation layer;
a first penetration via extending through the insulation layer and the copper-clad laminate plate;
a second penetration via disposed in the core board and connected to the first penetration via, wherein
the first penetration via comprises a wall on which a plating layer is formed, an exposed circuit pattern on which a metal post is formed, and an enclosure bounded by the plating layer and the metal post,
the enclosure is filled with a plug ink, and
the wall of the first penetration via is connected with a copper layer of the copper-clad laminate plate.

US Pat. No. 9,999,141

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A printed circuit board, comprising:a first insulating layer having a first circuit embedded in a first surface thereof;
a second insulating layer disposed on a second surface of the first insulating layer, the second insulating layer having a cavity therein and a groove formed to be extended into a side at a bottom of the cavity;
an electronic component mounted inside the cavity with an adhesion member; and
a third insulating layer disposed on the second insulating layer to embed the electronic component,
wherein the adhesion member is disposed between the bottom of the cavity and the electronic component, fills the groove, and contacts the bottom of the cavity and the electric component.

US Pat. No. 9,066,399

ILLUMINATION DRIVING APPARATUS FOR LIGHT EMITTING DIODE AND METHOD THEREOF

SAMSUNG ELECTRO-MECHANICS...

1. An illumination driving apparatus for a light emitting diode, the apparatus comprising:
a light emitting unit including M number of light emitting diodes (LEDs) connected in series and driven by an output voltage
rectified in a rectifying unit;

an LED switch unit including N number of LED switches connected in parallel with at least N number of the M number of LEDs,
respectively, the N number of LED switches being connected in series with one another;

an LED switch control signal generating unit comparing the output voltage of the rectifying unit with each of the first to
Nth preset reference voltages to generate N number of LED switch control signals controlling the LED switch unit; and

an LED switch controlling unit transferring the N number of LED switch control signals to the LED switch unit so as to change
turn on or turn off operations of the N number of LED switches in respective N periods of the output voltage of the rectifying
unit.

US Pat. No. 10,734,152

COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A coil component, comprising:a body having a coil part disposed therein; and
external electrodes connected to the coil part,
wherein the body includes magnetic particles,
wherein the magnetic particles include:
first magnetic particles,
second magnetic particles, and
third magnetic particles,
wherein the third magnetic particles include a smallest peak diameter among the first to third magnetic particles, and the first magnetic particles include a largest peak diameter among the first to third magnetic particles,
wherein the first magnetic particles include Fe-chromium (Cr)-silicon (Si)-boron (B)-carbon (C) based amorphous metal particles,
wherein the second magnetic particles include at least one of Fe—Cr—Si—B—C based amorphous metal particles or Fe metal particles, and
wherein the third magnetic particles include Fe—B-phosphorous (P) based amorphous metal particles.

US Pat. No. 10,021,785

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A printed circuit board comprising:a first circuit layer on an upper surface of a substrate;
an insulating layer disposed on the substrate and the first circuit layer;
a second circuit layer protrude on an upper surface of the insulating layer; and
a via configured to connect between the first circuit layer and the second circuit layer,
wherein the upper surface of the substrate comprises one portion covered by the first circuit layer and the other portion, wherein a lower part of the via is directly in contact with the other portion of the upper surface of the substrate,
wherein the first circuit layer comprises a circuit pattern, a side surface of the circuit pattern is directly in contact with a side surface of the via, and
wherein the circuit pattern has a smaller line-width than the via, and
the insulating layer is a photosensitive resin layer.

US Pat. No. 10,015,877

CIRCUIT BOARD COMPRISING HEAT TRANSFER STRUCTURE

Samsung Electro-Mechanics...

1. A circuit board comprising:a core layer including graphite or graphene and having a cavity formed therein;
a first heat transfer structure disposed in the cavity and having a greater thermal conductivity in a thickness direction of the circuit board than in a planar direction of the circuit board;
an insulating member covering the core layer and the first heat transfer structure;
a first primer layer comprising silanic primers and disposed on substantially entire surfaces of the first heat transfer structure in such a way that the first primer layer connects the first heat transfer structure to the core layer and/or to the insulating member; and
a via formed in the insulating member and penetrating through the first primer layer to have a first surface in contact with the first heat transfer structure,
wherein at least a portion of the first heat transfer structure comprises a plurality of unit layers,
wherein the unit layers each include graphite or graphene, and
wherein a second primer layer is disposed on at least one surface of at least one unit layer.

US Pat. No. 9,999,131

PRINTED CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Samsung Electro-Mechanics...

1. A printed circuit board comprising:a multilayered substrate comprising an insulation layer and an inner circuit layer laminated therein, a cavity disposed in the multilayered substrate;
a via disposed in the insulation layer and configured to electrically connect the inner circuit layer with another inner circuit layer;
a first electronic component inserted in the cavity; and
a bump pad disposed on a surface of the cavity facing the first electronic component,
wherein the bump pad comprises the insulation layer and the via exposed to a lateral side of the cavity,
wherein the via comprises a sunk portion at the lateral side of the cavity.

US Pat. No. 9,843,251

RECTIFIER AND METHOD OF CONTROLLING THE SAME

Samsung Electro-Mechanics...

1. A rectifier, comprising:
a rectifying circuit configured to rectify alternating current (AC) power into direct current (DC) power through a switching
operation;

a driver configured to apply a switching signal to the rectifying circuit; and
a signal modulator configured to:
compare a frequency of the switching signal to a first reference frequency,
select a parameter from among parameters of the switching signal based on the comparison, and
adjust the selected parameter.

US Pat. No. 9,103,682

APPARATUS FOR APPLYING MULTI-AXIAL INERTIAL FORCE

Samsung Electro-Mechanics...

1. An apparatus for applying multi-axial inertial force to an inertial sensor, the apparatus comprising:
a lower support plate connected to a driving unit to transfer rotation or vertical vibration;
a first support member fixed to stand up from the lower support plate;
a second support member positioned to be orthogonal to the first support member in a stand-up direction thereof and rotatably
coupled to the first support member; and

a third support member stacked on the second support member and coupled to the second support member so as to be rotatable
based on a rotational axis corresponding to a stacked direction,

wherein the third support member includes a device under test (DUT) seating part formed in the stacked direction, and the
inertial sensor is seated on the device under test (DUT) seating part.

US Pat. No. 9,947,468

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic electronic component comprising:a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; and
external electrodes disposed on the capacitor body and electrically connected to the internal electrodes,
wherein the capacitor body includes an active region in which internal electrodes having different polarities from each other overlap each other to form capacitance, and a margin part defined as a region of the capacitor body except for the active region,
a concentration of an additive element in the margin part being higher than in the active region, and in the margin part, the concentration of the additive element gradually decreases from a surface of the capacitor body toward the active region,
wherein a stacking direction of the internal electrodes and the dielectric layers is a thickness direction, a direction perpendicular to the thickness direction and in which ends of the internal electrodes are exposed to the surfaces of the capacitor body is a length direction, and a direction perpendicular to the thickness direction and the length direction is a width direction,
wherein a concentration of the additive element in margin parts of the capacitor body in the length direction is higher than in the active region.

US Pat. No. 9,443,818

POWER SEMICONDUCTOR MODULE

Samsung Electro-Mechanics...

1. A power semiconductor module, comprising:
a printed circuit board (PCB);
a first heat spreader and a second heat spreader mounted on the PCB and having surfaces arranged with terminal slots;
power devices mounted on the first heat spreader and connected to one another in parallel and electrically connected to the
second heat spreader;

a first terminal provided with protrusions to be inserted into each of the terminal slots of the first heat spreader and provided
with a connection terminal for connecting to an external terminal; and

a second terminal provided with protrusions to be inserted into each of the terminal slots of the second heat spreader and
provided with a connection terminal for connecting to an external terminal,

wherein the first terminal and the second terminal are electrically connected to the first heat spreader and the second heat
spreader by the protrusions.

US Pat. No. 9,096,029

ELECTRONIC DEVICE CASE, METHOD AND MOLD FOR MANUFACTURING THE SAME, AND MOBILE COMMUNICATIONS TERMINAL

SAMSUNG ELECTRO-MECHANICS...

1. A case of an electronic device including a circuit board, the case comprising:
a radiator including an antenna pattern portion configured to transmit and receive a signal;
a connection terminal separated from the antenna pattern portion and including a connection terminal portion configured to
transmit and receive the signal of the antenna pattern portion to and from the circuit board of the electronic device;

an injection-molded antenna pattern frame including the antenna pattern portion on one side, the connection terminal portion
on the other side, wherein the radiator and the connection terminal are brought into contact with each other; and

a case frame configured to cover the one side of the antenna pattern frame including the antenna pattern portion, wherein
the antenna pattern portion is embedded between the case frame and the antenna pattern frame.

US Pat. No. 9,123,472

HIGH CAPACITY MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor, comprising:
a multilayer body having a first side and a second side opposite to each other and having a third side and a fourth side connecting
the first side to the second side;

a plurality of inner electrodes formed in the multilayer body and having distal edges exposed to the first side or the second
side;

first and second side members formed on the first and second sides of the multilayer body to cover the exposed distal edges
of the inner electrodes, a maximum thickness of the first and second side members being more than 10 ?m and 30 ?m or less,
an angle (?) between a virtual line connecting the distal edges of the plurality of inner electrodes and the first side member
or the second side member being less than 90° (?/2); and

outer electrodes formed on the third side and the fourth side to be electrically connected to the inner electrodes.

US Pat. No. 9,129,750

MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

SAMSUNG ELECTRO-MECHANICS...

1. A multilayered ceramic electronic component comprising:
a ceramic body including dielectric layers having an average thickness of 0.6 ?m or less; and
first and second internal electrodes disposed in the ceramic body so as to face each other, having the dielectric layer interposed
therebetween,

wherein the ceramic body includes a capacitance formation part in which capacitance is formed and a non-capacitance formation
part provided on at least one surface of upper and lower surfaces of the capacitance formation part, and when the capacitance
formation part is divided into three regions in a thickness direction of the ceramic body, in a central region among the three
regions, dielectric grains have an average particle size of 150 nm or less, the number of dielectric grains per layer is 4
or more, and in upper and lower regions, dielectric grains have an average particle size of 200 nm or less, respectively,
and the number of dielectric grains per layer is 3 or more, and

the average particle size of the dielectric grains in the central region is different from that of the dielectric grains in
the upper and lower regions.

US Pat. No. 9,098,157

TOUCH SENSING APPARATUS

SAMSUNG ELECTRO-MECHANICS...

1. A touch sensing apparatus comprising:
a panel unit including a plurality of driving electrodes and a plurality of sensing electrodes;
a driving circuit unit applying, at different times, a driving signal and a scanning signal having a frequency different from
that of the driving signal to each of the plurality of driving electrodes;

a sensing circuit unit measuring a change in capacitance of a plurality of node capacitors in intersections of the plurality
of driving electrodes and the plurality of sensing electrodes; and

a calculation unit determining a touch based on the change in the capacitance,
the calculation unit calculating compensation data based on capacitance deviations generated in the plurality of node capacitors
by the scanning signal having a different frequency than the driving signal,

wherein the scanning signal has a frequency lower than that of the driving signal.

US Pat. No. 9,052,333

SENSOR CAPABLE OF MEASURING ACCELERATION, ANGULAR VELOCITY, AND DC ACCELERATION

SAMSUNG ELECTRO-MECHANICS...

1. A sensor capable of measuring acceleration, angular velocity and DC acceleration, the sensor comprising:
a mass body;
a membrane connected to the mass body, the membrane comprising at least one of a sensor unit configured to sense the displacement
of the mass body, and a driver unit configured to drive the mass body;

a plurality of patterned magnets provided under the mass body; and
a magnetoresistive element provided to be spaced apart from the mass body,
wherein the sensor unit is further configured to sense the acceleration or angular velocity, and
wherein the magnetoresistive element is configured to measure static DC acceleration acting on the mass body through resistance
changed according to magnetic fields of the plurality of patterned magnets.

US Pat. No. 9,813,114

SHEET FOR SHIELDING ELECTROMAGNETIC WAVES FOR WIRELESS CHARGING ELEMENT

SAMSUNG ELECTRO-MECHANICS...

1. A sheet for shielding electromagnetic waves, the sheet comprising:
a magnetic sheet formed of a metal ribbon,
wherein the metal ribbon includes a plurality of cracked portions regularly disposed therein in order to control permeability
thereof, and

the plurality of cracked portions include a plurality of metal ribbon fragments having a shape extending radially from a common
center point of each respective cracked portion.

US Pat. No. 9,390,862

COMPOSITE ELECTRONIC COMPONENT AND BOARD WITH THE SAME MOUNTED THEREON

SAMSUNG ELECTRO-MECHANICS...

1. A composite electronic component comprising:
a composite body having a capacitor and an inductor coupled to each other therein, the capacitor including a ceramic body
in which a plurality of dielectric layers and first and second internal electrodes facing each other with the dielectric layers
interposed therebetween are stacked, and the inductor including a magnetic body including a coil part;

an input terminal disposed on a first end surface of the composite body and connected to the coil part of the inductor;
output terminals including a first output terminal disposed on a second end surface of the composite body and connected to
the coil part of the inductor and a second output terminal disposed on a lower surface of the capacitor of the composite body
and connected to a lead portion of the first internal electrode of the capacitor; and

a ground terminal disposed on the lower surface of the capacitor of the composite body and connected to a lead portion of
the second internal electrode of the capacitor,

wherein the capacitor is coupled to a side surface of the inductor, and the first and second internal electrodes are disposed
to be perpendicular with respect to a mounting surface of the composite body.

US Pat. No. 10,667,419

MANUFACTURING METHOD OF AN ELECTRONIC COMPONENT MODULE

Samsung Electro-Mechanics...

1. A manufacturing method of an electronic component module, the method comprising:preparing a substrate;
mounting at least one electronic component on the substrate;
forming a mold part sealing the electronic component;
forming a via hole in the mold part; and
forming a connection conductor in the via hole by a plating process,
wherein the forming of the via hole includes increasing a degree of roughness of an inner surface of the via hole using the laser beam,
wherein each of the via holes comprises a side wall and a horizontal extension surface horizontally increasing a cross-sectional area of the via holes, and
a degree of roughness of the horizontal extension surface is greater than a degree of roughness of the side wall.

US Pat. No. 9,603,265

MULTI-LAYERED PRINTED CIRCUIT BOARD HAVING INNER-LAYER PORTION AND OUTER-LAYER PORTIONS AND MANUFACTURING METHOD THEREOF

Samsung Electro-Mechanics...

1. A multi-layered printed circuit board comprising:
an inner-layer portion having an inner-layer wired pattern formed thereon;
outer-layer portions having outer-layer wired patterns formed thereon and being laminated on either surface of the inner-layer
portion;

a first via-hole formed to penetrate one of the outer-layer portions so as to be connected to a first point of the inner-layer
wired pattern; and

a second via-hole formed to penetrate the one of the outer-layer portions so as to be connected with a second point of the
inner-layer wired pattern,

wherein the second via-hole is formed in an area of the inner-layer portion and the outer-layer portions that is subsequently
removed through external form processing.

US Pat. No. 9,194,897

ELECTRONIC WATT-HOUR METER AND ELECTRONIC WATT-HOUR MEASURING METHOD

Samsung Electro-Mechanics...

1. An electronic watt-hour meter, comprising:
a first multiplexer receiving a plurality of detected currents detected in respective polyphase power lines in parallel, to
output the received detection currents in series;

a first signal converter converting a signal output from the first multiplexer into a digital signal;
a first demultiplexer outputting a serial input from the first signal converter in parallel;
a line voltage generator generating a plurality of line voltages from the plurality of detected voltages detected in the respective
polyphase power lines, the plurality of line voltages including a reduced phase interference signal component and a reduced
random noise signal component;

a second multiplexer receiving the plurality of line voltages in parallel, to output the received line voltages in series;
a second signal converter converting a signal output from the second multiplexer into a digital signal;
a second demultiplexer outputting a serial input from the second signal converter in parallel; and
a calculating unit calculating a power value from a signal output from the first demultiplexer and a signal output from the
second demultiplexer.

US Pat. No. 9,894,790

ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF

Samsung Electro-Mechanics...

1. An electronic component module, comprising:
a substrate;
at least one electronic component mounted on the substrate;
a mold part sealing the at least one electronic component and having via holes penetrating through the mold part; and
connection conductors respectively embedded in the via holes, and having one end bonded to a surface of the substrate,
wherein each of the connection conductors comprises at least two steps, and horizontal cross-sectional areas that gradually
become smaller in a direction of the substrate,

wherein each of the via holes comprise a side wall and a horizontal extension surface horizontally increasing a cross-sectional
area of the via holes, and

a degree of roughness of the horizontal extension surface is greater than a degree of roughness of the side wall.

US Pat. No. 9,820,383

MULTILAYER CERAMIC CAPACITOR HAVING THREE EXTERNAL ELECTRODES AND BOARD HAVING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor comprising:
a ceramic body including a plurality of dielectric layers stacked therein in a width direction thereof;
an active region including a plurality of first and second internal electrodes alternately disposed, having one of the dielectric
layers interposed therebetween;

first and second lead portions extending from the first internal electrode so as to be exposed to a mounting surface of the
ceramic body, and disposed to be spaced apart from each other in a length direction of the ceramic body;

a third lead portion extending from the second internal electrode so as to be exposed to the mounting surface of the ceramic
body, and disposed between the first and second lead portions;

first and second external electrodes disposed on the mounting surface of the ceramic body to be spaced apart from each other
in the length direction thereof, and connected to the first and second lead portions, respectively; and

a third external electrode disposed on the mounting surface of the ceramic body between the first and second external electrodes,
and connected to the third lead portion;

wherein A/L is in a range of 0.64 to 1.14 (0.64?A/L?1.14), in which L is a length of the ceramic body determined in the length
direction and A is a width of the active region determined in the width direction, and

W/L is in a range of 0.7 to 1.2 (0.7?W/L?1.2), in which W is a width of the ceramic body determined in the width direction.

US Pat. No. 9,673,123

ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. An electronic device module, comprising:
a sealing part sealing an electronic component therein;
an external connection terminal disposed on one surface of the sealing part; and
a dummy bonding part configured on a surface of the sealing part and spaced apart from the external connection terminal,
wherein the sealing part comprises a coupling groove, which is disposed at the dummy bonding part and comprises a protrusion.

US Pat. No. 10,219,380

ELECTRONIC DEVICE MODULE AND MANUFACTURING METHOD THEREOF

Samsung Electro-Mechanics...

1. An electronic device module comprising:a board including external connecting electrodes and mounting electrodes;
an electronic device mounted on the mounting electrodes;
a molded portion sealing the electronic device;
connection conductors each having an end bonded to a respective external connecting electrode and penetrating through the molded portion to an opposite end thereof having an external terminal bonded thereto; and
an insulating layer disposed between the board and the molded portion,
wherein the insulating layer covers the external connecting electrodes, surrounds the connection conductors adjacent to where the connection conductors are bonded to the external connection electrodes, and abuts stepped profile surfaces of the connection conductors.

US Pat. No. 9,923,554

WIRELESS POWER TRANSMITTER

Samsung Electro-Mechanics...

1. A wireless power transmitter comprising:
an amplifier configured to amplify a power;
a transmitter configured to resonate the power amplified by the amplifier; and
a reference signal provider configured to provide a reference signal to the amplifier and to randomly change a frequency of
the reference signal

wherein the reference signal provider randomly changing the frequency comprises providing a clock signal of which a frequency
is irregularly varied, and

wherein the reference signal provider is further configured to generate the clock signal of which the frequency is irregularly
varied by irregularly varying an operation current of a relaxation oscillator.

US Pat. No. 10,141,099

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

SAMSUNG ELECTRO-MECHANICS...

1. An electronic component comprising:a magnetic body; and
an internal coil structure embedded in the magnetic body, wherein
the internal coil structure includes a first coil pattern part and a second coil pattern part formed on the first coil pattern part, and
an entire outermost coil turn of the first coil pattern part is thicker than an inner coil turn thereof, wherein the second coil pattern part has a non-uniform thickness such that a thickness from an uppermost surface of the outermost coil turn of the first coil pattern part to an uppermost surface of an outermost coil turn of the second coil pattern part is smaller than a thickness from an uppermost surface of the inner coil turn of the first coil pattern part to an uppermost surface of an inner coil turn of the second coil pattern part.

US Pat. No. 9,384,899

TANTALUM CAPACITOR AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A tantalum capacitor comprising:
a negative electrode lead frame;
a capacitor body mounted on an upper surface of the negative electrode lead frame and containing a tantalum powder and having
a tantalum wire protruding to one end surface of the capacitor body;

a positive electrode lead frame including a positive electrode terminal part, a vertical support part vertically extended
from one leading edge of the positive electrode terminal part, and a positive electrode connection part extended from the
vertical support part toward the positive electrode terminal part and connected to the tantalum wire; and

a molding part formed to allow a lower surface of the positive electrode terminal part of the positive electrode lead frame
and a lower surface of the negative electrode lead frame to be exposed to an outside of the molding part, while enclosing
the capacitor body.

US Pat. No. 9,236,847

COMMON MODE FILTER

SAMSUNG ELECTRO-MECHANICS...

1. A common mode filter comprising:
a magnetic substrate;
a dielectric layer laminated on the magnetic substrate;
an external electrode formed on the dielectric layer in such a way that one surface thereof is exposed to an outside;
conductive patterns formed in a single-layer structure, wherein each of the conductive patterns has one end thereof connected
with the external electrode, is protruded from one surface of the dielectric layer in such a way that the conductive patterns
are located on a same plane as the external electrode, and comprises a plurality of straight-line parts and a plurality of
connection parts formed in curved lines and connecting the plurality of straight-line parts with each other;

a magnetic layer, comprising magnetic powder and resin material and formed on the one surface of the dielectric layer and
the conductive patterns so as to fill a separate space between the straight-line parts that are adjacent to each other and
a separate space between the connection parts that are adjacent to each other; and

an insulator film interposed between the conductive patterns and the magnetic layer so as to insulate the conductive patterns
from the magnetic layer.

US Pat. No. 10,104,767

PRINTED CIRCUIT BOARD

Samsung Electro-Mechanics...

1. A printed circuit board comprising:a strip substrate sectioned into unit areas by dicing lines;
electronic components respectively installed in each of the unit areas; and
a separation space disposed between adjacent dicing lines, among the dicing lines, that are disposed between adjacent unit areas, among the unit areas, such that the separation space is disposed around each of the unit areas,
wherein the separation space is configured to be removed by dicing of the unit areas at the dicing lines, and a ratio of cross-sectional areas of portions occupied by the electronic components to a cross-sectional area of a portion occupied by the unit areas and the separation space is greater than or equal to 0.2 and less than or equal to 0.5.

US Pat. No. 10,075,643

SHAKINESS CORRECTING METHOD AND APPARATUS

Samsung Electro-Mechanics...

1. A shakiness correcting method, comprising:generating, based on motion sensing data, first filtering data to be applied to a first mode;
generating, based on the motion sensing data, second filtering data to be applied to a second mode;
selectively performing shakiness correction on one of the first filtering data and the second filtering data according to mode selection information; and
directly feeding the selected one of the first filtering data and the second filtering data to an optical image stabilization corrector to perform optical correction,
wherein the generating of the first filtering data and the generating of the second filtering data are performed in a mutually parallel manner, and
a lens is aligned in a central position in response to the mode selection being changed.

US Pat. No. 9,972,430

COIL COMPONENT

SAMSUNG ELECTRO-MECHANICS...

1. A coil component comprising:a magnetic substrate;
an insulating layer on the magnetic substrate and having conductive coils formed in the insulating layer; and
a reinforcing layer on the insulating layer and having a coefficient of thermal expansion lower than a coefficient of thermal expansion of the insulating layer,
wherein the reinforcing layer is formed of a polymer resin or a mixture of the polymer resin and an inorganic filler,
wherein the reinforcing layer has a composition different than that of the insulating layer,
wherein the reinforcing layer is formed of a non-magnetic material, and
wherein the magnetic substrate is formed of sintered ferrite.

US Pat. No. 9,812,259

MULTILAYER CERAMIC CAPACITOR, METHOD OF MANUFACTURING THE SAME, AND BOARD HAVING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor, comprising:
an active part including dielectric layers and internal electrodes which are alternately stacked therein in a stacking direction;
and

cover parts disposed on an upper surface and a lower surface of the active part, respectively,
wherein each of the cover parts includes an active part protective cover and an exterior cover, each of the active part protective
covers being disposed adjacent to the active part and each of the exterior covers extending in the stacking direction to an
external surface of the multilayer ceramic capacitor,

wherein a porosity of each of the exterior covers is higher than a porosity of each of the active part protective covers,
respectively, and

wherein the porosity of at least one of the exterior covers is about 12 vol % to 43 vol %.

US Pat. No. 9,613,752

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING BOARD THEREFOR

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic electronic component, comprising:
a ceramic body having a hexahedral shape, including dielectric layers;
first and second internal electrodes stacked in a thickness direction in the ceramic body to face each other, having the respective
dielectric layers interposed therebetween; and

first and second external electrodes disposed on opposite surfaces of the ceramic body in a length direction and electrically
connected to the first and second internal electrodes, respectively,

wherein the ceramic body satisfies T/W1.0, in which T is a thickness of the ceramic body determined in the thickness direction of the ceramic body and W is a width
of the ceramic body determined in a width direction,

0.01?a/T?0.07 is satisfied, in which ‘a’ is a radius of curvature of a round corner of a cross-section in a width-thickness
plane, and

the dielectric layers are stacked in the thickness direction in an amount of 500 layers or more.

US Pat. No. 9,484,153

MULTILAYER CERAMIC ELECTRONIC COMPONENT HAVING A PLURALITY OF INTERNAL ELECTRODES AND METHOD FOR MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic electronic component comprising:
a ceramic body including a plurality of dielectric layers; and
a plurality of first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween
within the ceramic body and having different widths,

wherein three or more of the plurality of first and second internal electrodes form a single block,
a plurality of blocks are iteratively laminated, each block laminate being identical, and
the lowest internal electrode disposed in one block, among the plurality of first and second electrodes disposed in the one
block, and the highest internal electrode disposed in the other block adjacent to the one block have the same width, and 0.76?T2/T1?0.97,
where T1 is the greatest distance between the uppermost internal electrode and the lowermost internal electrode, among the
plurality of first and second internal electrodes, and T2 is the shortest distance therebetween, in a cross-section taken
in width-thickness (W-T) directions in a region of the ceramic body where the first and second internal electrodes overlap.

US Pat. No. 9,165,712

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic electronic component comprising:
a ceramic main body;
a plurality of internal electrodes laminated within the ceramic main body;
external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes
at opposing side surfaces of the ceramic main body extending along a thickness direction in which the internal electrodes
are laminated, the external electrodes extending along the entire opposing side surfaces in the thickness direction and a
portion of opposing upper and lower surfaces at the ends of the ceramic main body in the thickness direction; and

plating layers disposed on outer surfaces of the external electrodes,
wherein the external electrodes comprise a same material disposed on the opposing side surfaces and the opposing upper and
lower surfaces,

the external electrodes have an average thickness of 10 ?m or less, and
when a thickness of the external electrodes in a central portion of the ceramic main body in a thickness direction is Tc and
a thickness of the external electrodes at a point spaced apart from a central portion of a capacitance formation region in
a thickness direction in which the internal electrodes are laminated to contribute to capacitance formation by a distance
equal to 25% of a thickness of the capacitance formation region of the ceramic main body is T1, 0.8?|T1/Tc|<1.0 is satisfied;

wherein when the thinnest point of the external electrodes at edge portions of the ceramic main body is T3, 0.2<|T3/Tc|<1.0 is satisfied; and

when a thickness of the external electrodes in a central portion of the ceramic main body in a thickness direction is Tc and
a thickness of the external electrodes at an outermost internal electrode of the ceramic main body in which the internal electrodes
are laminated to contribute to capacitance formation is T2, 0.5?|T2/Tc|<1.0 is satisfied.

US Pat. No. 9,159,693

HYBRID SUBSTRATE WITH HIGH DENSITY AND LOW DENSITY SUBSTRATE AREAS, AND METHOD OF MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A hybrid substrate with high density and low density substrate areas, comprising:
a low density substrate layer having a cavity formed at an intermediate area thereof and a low density area having a low pattern
density around the cavity;

a high density substrate layer mounted in the cavity of the low density substrate layer and formed of a high density area
having a higher pattern density than that of the low density area;

an insulating support layer comprising an area in which an insulating material is deposited on upper portions, lower portions
or the upper and lower portions of the high density substrate layer and the low density substrate layer,

the insulating support layer constituted by a filled area filled in a space between the high density substrate layer and the
cavity, and a deposition area formed on the upper portion or the lower portion of the high density substrate layer and low
density substrate layer;

insulating layer vias passing through the area of the insulating support layer and connected to patterns of the high density
substrate layer and the low density substrate layer;

an outer pattern layer comprising first circuit patterns connected to the insulating layer vias and being formed on the area
of the insulating support layer; and

a protection layer formed on the remaining lower or upper portion of the high density substrate layer and low density substrate
layer, on which the insulating support layer is not formed to expose second circuit patterns formed on the remaining lower
or upper portion of the high density substrate layer and low density substrate layer.

US Pat. No. 9,123,688

SEMICONDUCTOR MODULE PACKAGE

Samsung Electro-Mechanics...

1. A semiconductor module package, comprising:
a first module including a first heat radiation substrate and one or more first semiconductor elements and having a first
N terminal and a first P terminal formed at one end thereof;

a second module including a second heat radiation substrate and one or more second semiconductor elements, having a second
N terminal and a second P terminal formed at one end thereof, and disposed so as to face the first module;

a third module including a third heat radiation substrate and one or more third semiconductor elements and having a third
N terminal and a third P terminal formed at one end thereof;

a fourth module including a fourth heat radiation substrate and one or more fourth semiconductor elements, having a fourth
N terminal and a fourth P terminal formed at one end thereof, and disposed so as to face the third module;

a fifth module including a fifth heat radiation substrate and one or more fifth semiconductor elements and having a fifth
N terminal and a fifth P terminal formed at one end thereof;

a sixth module including a sixth heat radiation substrate and one or more sixth semiconductor elements, having a sixth N terminal
and a sixth P terminal formed at one end thereof, and disposed so as to face the fifth module;

a first output terminal formed by electrically connecting the first module to the second module;
a second output terminal formed by electrically connecting the third module to the fourth module; and
a third output terminal formed by electrically connecting the fifth module to the sixth module.

US Pat. No. 10,299,373

METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD

Samsung Electro-Mechanics...

1. A multilayer rigid flexible printed circuit board having a rigid portion and a flexible portion, the multilayer rigid flexible printed circuit board comprising:a first flexible film including a first circuit pattern on one or both surfaces;
a second flexible film disposed on the first flexible film and including a second circuit pattern on a portion of the second flexible film, positioned in the rigid portion;
a bonding sheet between the first flexible film and the second flexible film;
a pattern stack disposed on a part of the portion of the second flexible film to be adjacent to the flexible portion, and having a metal pattern and a protective pattern on the metal pattern;
a first insulating layer disposed on the portion of the second flexible film and covering the pattern stack and including a third circuit pattern on the first insulating layer.

US Pat. No. 9,159,491

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING BOARD THEREFOR

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic electronic component comprising:
a ceramic body including dielectric layers; and
first and second internal electrodes formed within the ceramic body and disposed to face each other having the respective
dielectric layers interposed therebetween,

wherein in a cross-section of the ceramic body in a length-thickness (L-T) direction, when an area of non-electrode regions
in cover part internal electrodes among the first and second internal electrodes is defined as Acover and an area of non-electrode regions in center part internal electrodes among the first and second internal electrodes is
defined as Acenter, a ratio of Acenter to Acover satisfies 0.33?Acenter/Acover?0.95.

US Pat. No. 9,100,682

TERRESTRIAL BROADCASTING RECEIVING MODULE

Samsung Electro-Mechanics...

1. A terrestrial broadcasting receiving module comprising:
an antenna receiving a wireless signal including a very high frequency (VHF) band signal and an ultra high frequency (UHF)
band signal;

a distributing unit receiving the wireless signal from the antenna and distributing and outputting the wireless signal into
a wireless signal including the VHF band signal and a wireless signal including the UHF band signal;

a VHF processing unit tuning a VHF band with respect to the wireless signal including the VHF band signal distributed through
the distributing unit and generating and outputting a VHF intermediate frequency signal;

a UHF processing unit tuning a UHF band with respect to the wireless signal including the UHF band signal distributed through
the distributing unit and generating and outputting a UHF intermediate frequency signal; and

a demodulating unit demodulating the VHF intermediate frequency signal output from the VHF processing unit and the UHF intermediate
frequency signal output from the UHF processing unit,

wherein the distributing unit includes:
a blocking filter blocking a wireless signal for a cellular phone among the wireless signal received from the antenna;
a band pass filter passing the VHF band signal among a wireless signal passing through the blocking filter therethrough; and
a high pass filter passing the UHF band signal among the wireless signal received from the antenna therethrough, and
wherein the blocking filter includes:
a first inductor having one terminal connected to an output terminal of the antenna and the other terminal connected to the
band pass filter; and

a first capacitor having one terminal connected to the output terminal of the antenna and the other terminal connected to
the band pass filter.

US Pat. No. 10,141,097

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. An electronic component comprising:a magnetic body;
a coil pattern embedded in the magnetic body and including internal coil parts having a spiral shape and lead parts connected to ends of the internal coil parts and externally exposed from the magnetic body; and
external electrodes disposed on outer surfaces of the magnetic body and connected to the lead parts,
wherein a thickness of each of the lead parts is thinner than a thickness of each of the internal coil parts,
the lead parts do not overlap the internal coil parts when viewed in a thickness direction of the magnetic body,
the lead parts extend to be exposed only at opposite end surfaces of the magnetic body,
0.6?b/a<1 is satisfied, in which a is the thickness of the internal coil part and b is the thickness of the lead part,
a thickness of each of cover regions covering an upper portion and a lower portion of the coil pattern in the magnetic body is 150 ?m or less, and
the external electrodes are formed of a conductive paste.

US Pat. No. 10,141,110

MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor comprising:a ceramic body in which a plurality of dielectric layers are stacked and first and second internal electrodes are alternately disposed with respective dielectric layers interposed therebetween; and
first and second external electrodes disposed on first and second surfaces of the ceramic body opposite each other in a length direction, respectively, extending onto portions of a mounting surface of the ceramic body and portions of third and fourth surfaces of the ceramic body opposite each other in a width direction, respectively,
wherein the first internal electrode includes a first body portion disposed to be spaced apart from an edge of the dielectric layer in the length direction and first and second edges of the dielectric layer in the width direction and a first lead portion extending from the first body portion to be exposed to the first surface of the ceramic body in the length direction and portions of the third and fourth surfaces of the ceramic body in the width direction,
the second internal electrode includes a second body portion disposed to be spaced apart from the edge of the dielectric layer in the length direction and the first and second edges of the dielectric layer in the width direction and a second lead portion extending from the second body portion to be exposed to the second surface of the ceramic body in the length direction and portions of the third and fourth surfaces of the ceramic body in the width direction, and
first and second insulating layers are disposed on the third and fourth surfaces of the ceramic body opposite each other in the width direction, respectively, and each has a length shorter than a length of the ceramic body such that the first and second lead portions each contact the first and second insulating layers and a respective one of the first and second external electrodes on the third and fourth surfaces of the ceramic body.

US Pat. No. 9,509,169

WIRELESS CHARGING DEVICE AND CONTROL METHOD THEREOF

Samsung Electro-Mechanics...

1. A wireless charging device, comprising:
a receiving coil;
a first receiving module configured to receive power in a magnetic induction scheme from the receiving coil;
a second receiving module configured to receive power in a magnetic resonance scheme from the receiving coil;
a switching unit configured to repeatedly change between a first connection state, in which the first receiving module is
electrically connected to the receiving coil, and a second connection state, in which the second receiving module is electrically
connected to the receiving coil; and

a switching controlling unit configured to receive a stop signal or an operating signal from whichever one of the first receiving
module and the second receiving module is electrically connected to the receiving module,

wherein the first receiving module is further configured to, in response to being connected to the receiving coil, compare
an operating frequency band of the received power and a preset first frequency band, provide the stop signal to the switching
controlling unit in response to the operating frequency band matching the first frequency band, and provide the operating
signal to the switching controlling unit in response to the operating frequency band not matching the first frequency band,
and

the second receiving module is further configured to, in response to being connected to the receiving coil, compare an operating
frequency band of the received power and a preset second frequency band, provide the stop signal to the switching controlling
unit in response to the operating frequency band matching the second frequency band, and provide the operating signal to the
switching controlling unit in response to the operating frequency band not matching the second frequency band.

US Pat. No. 9,240,281

MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor comprising:
a ceramic body including a plurality of dielectric layers and having first and second main surfaces opposing each other, first
and second side surfaces opposing each other, and first and second end surfaces opposing each other;

a first capacitor part formed in the ceramic body and including a first internal electrode exposed to the first end surface
and a second internal electrode having a lead-out portion exposed to the second side surface and a second capacitor part including
a third internal electrode having a lead-out portion exposed to the first side surface and a fourth internal electrode exposed
to the second end surface;

an internal connection conductor formed in the ceramic body and exposed to the first and second side surfaces; and
first to fourth external electrodes formed on external surfaces of the ceramic body and electrically connected to the first
to fourth internal electrodes and the internal connection conductor,

wherein the internal connection conductor is connected to the first and second capacitor parts in series.

US Pat. No. 9,097,958

CAMERA MODULE

Samsung Electro-Mechanics...

1. A camera module comprising:
a housing including a lens barrel disposed therein;
a first shield can coupled to the housing so that a lower end portion of an outer surface of the housing is exposed;
a circuit board mounted at the lower end portion of the housing;
soldering parts formed on the circuit board in order to electrically connect an actuator for driving the lens barrel and the
circuit board to each other; and

a second shield can covering the first shield can, the lower end portion of the housing and the soldering parts,
wherein the second shield can is provided with protrusion parts pressing an outer surface of the first shield can, and
wherein an inner surface of the second shield can is spaced apart from the outer surface of the first shield can and the soldering
parts in a direction perpendicular to an optical axis of the lens barrel.

US Pat. No. 10,485,105

SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A substrate, comprising:a core layer having a tapered through hole extending therethrough between first and second opposing surfaces thereof, the tapered through hole having a first diameter opening at one end thereof, in one surface of the first and second opposing surfaces, larger than a second diameter opening at another end thereof, in another surface of the first and second opposing surfaces;
a plating layer disposed on an inner surface of the tapered through hole of the core layer and on only the one surface, from among the first and second opposing surfaces, having the first diameter opening of the through hole;
a metal layer disposed on only the one surface, from among the first and second opposing surfaces of the core layer, having the first diameter opening of the through hole, and the metal layer having an opening aligned with the through hole and having a width greater than a width of the through hole such that the metal layer is spaced apart from the through hole and in contact with the plating layer disposed on the one surface;
a via disposed in the through hole; and
first and second connection pads distinct from the metal layer, disposed on opposing ends of the via, and each extending externally from a respective one of the first and second opposing surfaces of the core layer.

US Pat. No. 10,141,115

THIN FILM CAPACITOR INCLUDING ALTERNATIVELY DISPOSED DIELECTRIC LAYERS HAVING DIFFERENT THICKNESSES

SAMSUNG ELECTRO-MECHANICS...

1. A thin film capacitor comprising:a body having first and second electrode layers and first and second dielectric layers alternately stacked on a substrate, each of the number of the first dielectric layers, the number of the second dielectric layers, the number of the first electrode layers, and the number of the second electrode layers being two or greater; and
first and second vias electrically connected to the first and second electrode layers, respectively,
wherein a thickness of the first dielectric layer is 1.2 to 3 times that of the second dielectric layer.

US Pat. No. 9,986,640

COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A coil component comprising:a plurality of conductive patterns embedded in a plurality of insulating layers and stacked on each other, each conductive pattern including a coil conductor and a via pad; and
a plurality of vias connecting the via pads embedded in the plurality of insulating layers,
wherein portions or overall regions of the via pads embedded in two immediately adjacent insulating layers among the plurality of insulating layers overlap each other in a direction along which the plurality of conductive patterns are stacked on each other,
the vias are alternately disposed, and
a coil conductor and a via pad that are both embedded in one of the plurality of insulating layers are spaced-apart from each other.

US Pat. No. 9,252,212

POWER SEMICONDUCTOR DEVICE

SAMSUNG ELECTRO-MECHANICS...

1. A power semiconductor device, comprising:
an active region in which a current flows through a channel formed when the device being turned on;
a termination region disposed around the active region and extending along a first direction away from the active region;
a first semiconductor region of a first conductive type disposed in the termination region and extending along the first direction;
and

a second semiconductor region of a second conductive type formed on the termination region and extending along the first direction,
the first semiconductor region and the second semiconductor region being disposed alternately along a second direction crossing
the first direction, wherein:

a product of an impurity concentration of the first semiconductor region and a width of the first semiconductor region is
equal to a product of an impurity concentration of the second semiconductor region and a width of the second semiconductor
region, and

an impurity concentration of the first semiconductor region and an impurity concentration of the second semiconductor region
gradually become lower as the first semiconductor region and the second semiconductor region become farther from the active
region.

US Pat. No. 9,165,715

MULTILAYER CERAMIC CAPACITOR WITH ELECTRODES HAVING LEAD-OUT PARTS AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor comprising:
a ceramic body in which a plurality of dielectric layers are stacked;
a plurality of first and second internal electrodes alternately formed on the plurality of dielectric layers and including
first and second lead-out parts having an overlap area exposed to one surface of the ceramic body, respectively;

first and second external electrodes formed on one surface of the ceramic body and electrically connected to the first and
second lead-out parts, respectively; and

a first insulating layer formed on one surface of the ceramic body to cover exposed portions of the first and second lead-out
parts,

wherein the first and second lead-out parts are formed to have concave-convex portions only alternating with each other in
the overlap area,

a length of a main part of the first internal electrodes is greater than a sum of a length of the concave-convex portion of
the first lead-out part and a length of the rest of the first lead-out part not formed to have a concave-convex portion, and

a length of a main part of the second internal electrodes is greater than a sum of a width of the concave-convex portion of
the second lead-out part and a length of the rest of the second lead-out part not formed to have a concave-convex portion.

US Pat. No. 10,542,626

MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer electronic component comprising:a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween and having first and second surfaces opposing each other in a thickness direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a length direction, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other in a width direction, one end of each of the first and second internal electrodes being exposed through the third and fourth surfaces, respectively;
first and second external electrodes including first and second connected portions respectively disposed on the third and fourth surfaces of the capacitor body and first and second band portions respectively extending from the first and second connected portions to portions of the first surface of the capacitor body, respectively;
a first connection terminal disposed on the first band portion; and
a second connection terminal disposed on the second band portion,
wherein 0.05?A1/A2?0.504, where A1 is an area of the first or second connection terminal in a thickness-width direction, and A2 is an area of the first or second band portion in a width-length direction.

US Pat. No. 9,324,496

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic electronic component, comprising:
a ceramic body including a dielectric layer and having first and third surfaces opposing each other in a length direction
of the dielectric layer and second and fourth surfaces opposing each other in a width direction thereof;

a multilayer part including a first internal electrode and a second internal electrode disposed to oppose each other, while
having the dielectric layer interposed therebetween in the ceramic body, and exposed to the first and third surfaces opposing
each other in a length direction of the ceramic body, respectively; and

first and second external electrodes disposed on the first and third surfaces opposing each other in a length direction of
the ceramic body,

wherein one or more residual carbon removing path parts are formed to be protruded from both sides of the first and second
internal electrodes in a width direction of the ceramic body, and exposed to the second and fourth surfaces opposing each
other in a width direction thereof, respectively,
wherein the multilayer ceramic electronic component further comprises a margin part including epoxy to cover the second and
fourth surfaces opposing each other in a width direction of the ceramic body to which the residual carbon removing path parts
are exposed, and
wherein the residual carbon removing path parts are provided in plural, and the plurality of residual carbon removing path
parts are spaced apart from each other by predetermined intervals on both sides of the first and second internal electrodes.

US Pat. No. 9,287,363

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME AND POWER SEMICONDUCTOR DEVICE INCLUDING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A method of manufacturing a semiconductor device, the method comprising:
preparing a substrate formed of SiC;
depositing crystalline or amorphous silicon (Si) on one surface of the substrate to form a first semiconductor layer; and
performing a heat treatment under a nitrogen atmosphere to form a second semiconductor layer formed of SiCN between the substrate
and the first semiconductor layer.

US Pat. No. 9,264,061

APPARATUS AND METHOD FOR GENERATING SINUSOIDAL WAVES, AND SYSTEM FOR DRIVING PIEZOELECTRIC ACTUATOR USING THE SAME

Samsung Electro-Mechanics...

14. A method for generating sinusoidal waves,
comprising:
receiving a target frequency;
loading at least some of a plurality of sampling points included in a look-up table by using an integer ratio calculated based
on the target frequency and a predetermined base frequency;

correcting a digital value of at least one sampling point among the loaded sampling points with a digital value of a sampling
point having a maximum value among the plurality of sampling points included in the look-up table; and

generating sinusoidal waves according to the changed sampling points.

US Pat. No. 9,157,926

ANGULAR VELOCITY SENSOR

Samsung Electro-Mechanics...

1. An angular velocity sensor comprising:
first and second mass bodies;
a first frame provided at an outer side of the first and second mass bodies;
a first flexible part respectively connecting the first and second mass bodies to the first frame;
a second flexible part respectively connecting the first and second mass bodies to the first frame;
a second frame provided at an outer side of the first frame and having an inside space to accommodate the first frame;
a third flexible part connecting the first and second frames to each other; and
a fourth flexible part connecting the first and second frames to each other,
wherein the first and second mass bodies are respectively disposed at both sides of the fourth flexible part,
the third flexible part has a width in a Y axis direction larger than a thickness in a Z axis direction, and
the fourth flexible part has a thickness in the Z axis direction larger than a width in a X axis direction.

US Pat. No. 9,478,334

MAGNETIC MODULE FOR POWER INDUCTOR, POWER INDUCTOR, AND MANUFACTURING METHOD THEREOF

Samsung Electro-Mechanics...

1. A power inductor comprising:
a main body; and
first and second external electrodes formed on both end portions of the main body,
wherein the main body includes: upper and lower cover layers; at least one coil support layer having a through hole formed
in a center thereof, at least one first recess portion formed in both lateral surfaces thereof and a plurality of second recess
portions formed in respective corners thereof, and disposed between the upper and lower cover layers; and first and second
coil layers formed on both surfaces of the coil support layer and having respective one ends thereof connected to the first
and second external electrodes,

wherein the first recess portion of the coil support layer communicates with the second recess portions of the coil support
layer, in which the second recess portions are grooved in farther than the first recess portion in a width direction of the
coil support layer.

US Pat. No. 9,462,697

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF

Samsung Electro-Mechanics...

1. An electronic component embedded substrate comprising:
a first insulating layer having a cavity;
an electronic component inserted in the cavity and having at least one external electrode;
a first metal pattern formed on one surface of the first insulating layer configured to mount the electronic component thereon
and comprising at least one guide hole exposing a portion of the external electrode;

a second insulating layer formed on the one surface of the first insulating layer covering the first metal pattern;
a first circuit pattern formed on one surface of the second insulating layer; and
a first via passing through the guide hole of the first metal pattern and electrically connecting the external electrode exposed
through the guide hole and the first circuit pattern,

wherein an opening of the guide hole is smaller than an opening of the cavity, and
wherein the opening of the guide hole is smaller than the external electrode.

US Pat. No. 9,060,734

FIXED FOCUS TRANSDUCER ARRAY AND ULTRASONIC WAVE TRANSCEIVING APPARATUS USING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A fixed focus transducer array, comprising:
a central piezoelectric transducer; and
a plurality of peripheral piezoelectric transducers symmetrically disposed around the central piezoelectric transducer;
wherein the central piezoelectric transducer and the plurality of peripheral piezoelectric transducers focus ultrasonic signals
onto a single focal point with each ultrasonic signal propagating at a speed determined in accordance with the natural frequency
of the respective piezoelectric transducer such that the ultrasonic signals transduced by the central piezoelectric transducer
and the plurality of peripheral piezoelectric transducers simultaneously arrive at the single focal point, and

wherein the speed of the ultrasonic signal transduced by the central piezoelectric transducer is different from the speeds
of the ultrasonic signals transduced by the plurality of peripheral piezoelectric transducers.

US Pat. No. 9,099,249

MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING MULTILAYERED CERAMIC CAPACITOR THEREON, AND PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR

SAMSUNG ELECTRO-MECHANICS...

1. A multilayered ceramic capacitor, comprising:
a ceramic body having a plurality of dielectric layers laminated therein;
an active layer including a plurality of first and second internal electrodes having the respective dielectric layers interposed
therebetween to form capacitance, the first and second internal electrodes being alternately exposed through both end surfaces
of the ceramic body;

an upper cover layer formed above the active layer;
a lower cover layer formed below the active layer and having a thickness larger than a thickness of the upper cover layer;
first and second external electrodes covering both end surfaces of the ceramic body; and
a plurality of first and second dummy electrodes extended from the first and second external electrodes inwardly in a length
direction to thereby face the first and second internal electrodes, respectively, in the active layer,

wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as the thickness of the lower cover
layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as the thickness of the upper cover
layer, a ratio of deviation between a center portion of the active layer and a center portion of the ceramic body, (B+C)/A,
satisfies 1.063?(B+C)/A?1.745,

wherein the lower cover layer includes dummy patterns, the dummy patterns including first and second dummy patterns extended
from the first and second external electrodes inwardly in the length direction to thereby face each other, respectively,

wherein when E is defined as an overall thickness of the dummy patterns, a ratio of the overall thickness E of the dummy patterns
to the thickness B of the lower cover layer, E/B, satisfies 0.3?E/B<1.

US Pat. No. 10,135,296

COIL STRUCTURE FOR WIRELESS POWER TRANSMISSIONS AND WIRELESS POWER TRANSMITTER INCLUDING THE SAME

Samsung Electro-Mechanics...

1. A coil structure for wireless power transmissions comprising:a body comprising an upper surface and a side surface extending from the upper surface;
an upper transmission coil disposed on the upper surface and configured to generate an electromagnetic field passing through the upper surface;
at least one side transmission coil wound around a perimeter of the side surface and configured to generate an electromagnetic field passing through the side surface; and
a magnetic shield layer formed in an upper portion of the body below the upper surface, and configured to block the magnetic field generated by the upper transmission coil from propagating toward a lower portion of the body.

US Pat. No. 9,673,066

APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE MODULE

Samsung Electro-Mechanics...

1. An apparatus for manufacturing a semiconductor package module, the apparatus comprising:
a lower mold installed with a board having an element mounted thereon;
an upper mold disposed above the board to accommodate the board;
a filler supplier disposed in at least one of the upper mold and the lower mold, the filler supplier supplying a filler to
a molding space between the board and the upper mold; and

a pattern forming member provided in an inner surface of the upper mold that provides an uneven pattern on a molded part,
wherein the pattern forming member comprises:
a main uneven pattern; and
a sub-uneven pattern smaller than the main uneven pattern and disposed in the main uneven pattern.

US Pat. No. 9,230,955

INTEGRATED CIRCUIT AND WIRELESS COMMUNICATION APPARATUS

Samsung Electro-Mechanics...

1. An integrated circuit, comprising:
b sub-circuits (b is an integer equal to or greater than 1) that are connected in series between a first terminal and a second
terminal and have capacitance 2b-1 times larger than predetermined unit capacitance,

wherein the b-th sub-circuit includes 2b-1 configurations, which are connected in parallel, each including at least two capacitors connected in series and at least two
stacked switch elements,

at least the two stacked switch elements are operated to all switched for each sub-circuit, and
at least one switch element of at least the two stacked switch elements is provided between at least the two capacitors.

US Pat. No. 9,232,577

POWER DRIVER FOR LIGHT EMITTING DIODE ILLUMINATION AND CONTROL METHOD THEREOF

Samsung Electro-Mechanics...

1. A power driver for Light Emitting Diode (LED) illumination, comprising:
a power correction unit receiving an AC voltage, rectifying the received AC voltage into a DC voltage, and correcting a power
factor of the rectified DC voltage; and

a DC/DC converter unit receiving the DC voltage from the power correction unit and converting the received DC voltage into
a DC voltage which has a magnitude different from the received DC voltage and is supplied to an LED module,

wherein the DC/DC converter unit comprises a skip control unit, to which a current flowing in the LED module driven by receiving
an output from the DC/DC converter unit is fed back, to detect a magnitude of the current and to output a signal for a skip
mode control depending on the detected magnitude of the current.

US Pat. No. 9,136,702

ELECTROSTATIC DISCHARGE PROTECTION DEVICE AND COMPOSITE ELECTRONIC COMPONENT INCLUDING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. An electrostatic discharge protection device comprising:
a substrate;
a pair of electrodes spaced apart from each other on the substrate and
a layer of insulating material on the pair of electrodes,
wherein at least one electrode of the pair of electrodes includes a protruding portion, a bottom surface of the protruding
portion noncontacing the substrate and covered with the insulating material, and wherein the protruding portion of the at
least one electrode of the pair of electrodes is formed as a cone-shaped portion by a photolithography process.

US Pat. No. 9,865,399

ELECTRONIC COMPONENT HAVING MULTILAYER STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. An electronic component comprising:
a laminate having a plurality of stacked different types of multi-layered ceramic capacitors; and
an external electrode made of a conductive resin for connecting each ceramic body,
wherein two multi-layered ceramic capacitors stacked from at a lowermost surface of the laminate sequentially are selected
among a T-HMC structure multi-layered ceramic capacitor, a T-HMC-open structure multi-layered ceramic capacitor, and a T-HMC-Float
structure multi-layered ceramic capacitor, and

the remaining except two multi-layered ceramic capacitors stacked from the lowermost surface sequentially are normal structure
multi-layered ceramic capacitors.

US Pat. No. 9,793,250

PACKAGE BOARD, METHOD FOR MANUFACTURING THE SAME AND PACKAGE ON PACKAGE HAVING THE SAME

Samsung Electro-Mechanics...

1. A package board, comprising:
a first insulating layer having a cavity formed therein, the cavity penetrating through the first insulating layer;
a first connection pad penetrating through the first insulating layer and formed to be spaced apart from an inner wall of
the cavity; and

a second insulating layer formed beneath the first insulating layer,
wherein the first connection pad comprises:
a metal post; and
a barrier layer disposed between the metal post and the second insulating layer, bonded directly to a lower surface of the
metal post, and made of a material different from that of the metal post.

US Pat. No. 9,530,043

CELL ANALYSIS APPARATUS AND METHOD

Samsung Electro-Mechanics...

1. A cell analysis method comprising:
recognizing shapes of cells or cell colonies;
calculating a size of each of the cell colonies;
determining whether or not the cell colonies are overlapped with each other;
dividing a recognized cell colony image region in recognition of overlapping thereby allowing for accurate colony size determination;
and

sorting the cell colonies by size and calculating the number of cell colonies exceeding a preset size,
wherein the size of the cell colony is calculated as an area of a circle formed by an outline of the cell colony, and
among a plurality of circles formed by the outlined of the cell colony, an area of a largest circle is set as the size of
the cell colony.

US Pat. No. 9,236,178

COIL COMPONENT AND MANUFACTURING METHOD THEREOF

Samsung Electro-Mechanics...

1. A coil component comprising:
an electrode body including coil electrodes disposed therein, the coil electrodes having an insulating film deposited on a
surface thereof;

external terminals formed at both side portions of the electrode body and connected to the coil electrodes;
an insulating layer bonded to a lower surface of the coil electrodes; and
a magnetic substrate disposed to a lower surface of the electrode body,
wherein the electrode body is made of an insulating material with which magnetic powders are mixed, and
wherein the insulating layer is disposed between the magnetic substrate and the coil electrodes and between the magnetic substrate
and the external terminals.

US Pat. No. 9,202,624

CONDUCTIVE PASTE COMPOSITION FOR EXTERNAL ELECTRODE AND MULTILAYER CERAMIC ELECTRONIC COMPONENT FABRICATED USING THE SAME

Samsung Electro-Mechanics...

1. A conductive paste composition for an external electrode, comprising:
a conductive metal powder; and
a resin mixture including a polyvinyl formal resin and at least one resin selected from a group consisting of an epoxy-based
resin and a phenoxy-based resin.

US Pat. No. 9,159,495

MULTILAYER CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF AND BOARD FOR MOUNTING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic electronic component comprising:
a ceramic body including a plurality of dielectric layers stacked in a thickness direction thereof and satisfying T/W>1.0
when it is defined that a width thereof is W and a thickness thereof is T;

a plurality of first and second internal electrodes disposed in the ceramic body so as to face each other, having the dielectric
layer interposed therebetween, and alternately exposed through both end surfaces of the ceramic body; and

first and second external electrodes including head parts formed on both end surfaces of the ceramic body and two band parts
connected to the head parts and formed on portions of upper and lower main surfaces of the ceramic body so as to be spaced
apart from each other in a width direction thereof, and electrically connected to the first and second internal electrodes,
respectively.

US Pat. No. 10,553,363

MULTILAYER CERAMIC CAPACITOR HAVING VIA ELECTRODE AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor (MLCC), comprising:a ceramic body having a plurality of dielectric layers, first internal electrodes, and second internal electrodes, the first and second internal electrodes being alternately disposed with at least one among the plurality of dielectric layers being interposed therebetween on a substrate;
an outer insulating layer including a side portion disposed on a side surface of the ceramic body to cover each of the first internal electrodes and each of the second internal electrodes, and an upper portion connecting the side portion and an uppermost one of the inner insulating layers to each other;
a protective layer covering the side portion of the outer insulating layer and at least a portion of the upper portion of the outer insulating layer; and
a first external electrode and a second external electrode, disposed on an exterior of the ceramic body,
wherein a plurality of via electrodes are disposed in the ceramic body,
a first via electrode among the plurality of via electrodes connects the first internal electrodes to the first external electrode, and penetrates through the ceramic body from a surface of the ceramic body to the first internal electrode disposed most adjacently to the substrate,
a second via electrode among the plurality of via electrodes connects the second internal electrodes to the second external electrode, and penetrates through the ceramic body from the surface of the ceramic body to the second internal electrode disposed most adjacently to the substrate,
the plurality of via electrodes have a stepped shape, and a distance in a length direction from a first vertical edge of each step to a second vertical edge of each step in the plurality of via electrodes is increased in a direction from the substrate toward an upper portion of the ceramic body,
inner insulating layers respectively cover all side surfaces of the plurality of via electrodes,
at least one of the inner insulating layers is in direct contact with a side surface of one of the first internal electrodes and one of the second internal electrodes adjacent to the one of the first internal electrodes, and
the stepped shape of the plurality of via electrodes defines a shape of stacked cylinders, and, for each of the plurality of via electrodes, the respective stacked cylinders have the same center.

US Pat. No. 10,321,571

COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A composite electronic component, comprising:a multilayer capacitor including a first body and first and second external electrodes respectively disposed on first and second end surfaces of the first body;
a tantalum capacitor including a second body and a tantalum wire exposed to a first end surface of the second body, and disposed adjacently to the multilayer capacitor;
first electrode parts electrically connected to the first and second external electrodes of the multilayer capacitor;
a second electrode part electrically connected to the second body of the tantalum capacitor; and
an encapsulant encapsulating the multilayer capacitor and the tantalum capacitor,
wherein the second electrode part connected to the tantalum capacitor has a composition different from the first electrode parts connected to the first and second external electrodes of the multilayer capacitor, and the encapsulant is disposed such that portions of each of the separate first and second electrode parts, connected to the multilayer capacitor and the tantalum capacitor respectively and having different respective compositions, are exposed externally from the encapsulant.

US Pat. No. 9,769,869

NON-CONTACT TYPE POWER SUPPLY APPARATUS AND NON-CONTACT TYPE POWER SUPPLY METHOD

Samsung Electro-Mechanics...

1. A non-contact type power supply apparatus comprising:
a power unit configured to contactlessly transmit power to one or more power receiving apparatuses;
a communicating unit configured to communicate with the one or more power receiving apparatuses; and
a controlling unit configured to:
terminate communications with the one or more power receiving apparatuses in response to a communications signal level of
the one or more power receiving apparatuses transmitted to the communicating unit being equal to or less than a reference
signal level,

calculate distances from the one or more power receiving apparatuses to the non-contact type power supply apparatus based
on the communication signal level, and

control transmitting the power in an order from a power receiving apparatus estimated as being at a closest distance to a
power receiving apparatus estimated as being at a farthest distance.

US Pat. No. 9,642,260

EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. An embedded multilayer ceramic electronic component comprising:
a ceramic body including a dielectric layer and having first and second main surfaces opposing each other, first and second
side surfaces opposing each other, and first and second end surfaces opposing each other;

a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body,
having the dielectric layer therebetween; and

first and second external electrodes formed on both end portions of the ceramic body,
wherein the first external electrode includes a first base electrode and a first terminal electrode formed on the first base
electrode, the second external electrode includes a second base electrode and a second terminal electrode formed on the second
base electrode, the first and second external electrodes are extended to the first and second main surfaces of the ceramic
body, and when a thickness of the ceramic body is defined as ts, a maximum thickness of the first and second external electrodes
formed on the first and second main surfaces of the ceramic body is defined as tb, a minimum distance of the first and second
external electrodes formed on the first and second end surfaces of the ceramic body in a length direction of the ceramic body
is defined as ta, tb/ts and ta/tb satisfy 0.1?tb/ts?1.0 and 0.5?ta/tb?2.0, respectively, and

the first and second terminal electrodes are formed of plated copper (Cu).

US Pat. No. 9,201,212

LENS MODULE

Samsung Electro-Mechanics...

1. A lens module comprising:
a first lens having positive refractive power;
a second lens having refractive power, both surfaces thereof being convex;
a third lens having refractive power;
a fourth lens having positive refractive power of which an object-side surface is concave;
a fifth lens having refractive power; and
a sixth lens having positive refractive power and having one or more inflection point formed on an image-side surface thereof,
wherein the first, second, third, fourth, fifth and sixth lenses are disposed in a sequential order from the first lens to
the sixth lens.

US Pat. No. 9,161,460

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A printed circuit board (PCB), comprising:
a base substrate comprising a metal pattern for a circuit; and
a surface roughness provided on the metal pattern,
wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a
black oxide layer in a needle structure formed on the first surface roughness,

wherein the anchor structure has a neck portion and a head portion having larger surface area than the neck portion, and
wherein a bismaleimide-triazine resin layer is formed on the black oxide layer in the needle structure, which is formed on
the anchor structure, and

wherein an interlayer adhesion between the metal pattern and the bismaleimide-triazine resin layer is more than 0.4 kgf/cm.

US Pat. No. 10,842,021

PRINTED CIRCUIT BOARD

SAMSUNG ELECTRO-MECHANICS...

1. A printed circuit board, comprising:a magnetic member including a magnetic layer;
a first coil pattern disposed above the magnetic member, and including a planar spiral structure;
a second coil pattern disposed below the magnetic member, and including a planar spiral structure;
a core layer having a through portion; and
a build-up layer covering at least a portion of each of the core layer, the magnetic member, and the first coil pattern, and disposed in at least a portion of the through portion.

US Pat. No. 10,104,777

MULTILAYER CAPACITOR AND BOARD HAVING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer capacitor comprising:a capacitor body including a plurality of dielectric layers stacked in a direction perpendicular to a mounting surface of the capacitor body;
first and second external electrodes extending from opposing surfaces of the capacitor body in a length direction to portions of the mounting surface of the capacitor body, respectively;
a plurality of first and second internal electrodes disposed to face each other, with at least one of the dielectric layers interposed therebetween in the capacitor body, and electrically connected to the first and second external electrodes, respectively; and
a plurality of first and second equivalent series inductance (ESL) control patterns disposed at positions closer to the mounting surface of the capacitor body than the first and second internal electrodes, respectively, to face each other, with at least one of the dielectric layers interposed therebetween in the capacitor body, and exposed to the mounting surface of the capacitor body, to thereby be electrically connected to the first and second external electrodes, respectively,
wherein the first and second internal electrodes have an area larger than that of the first and second ESL control patterns, respectively, and
wherein at least one of the first or second internal electrodes and at least one of the first or second ESL control patterns, respectively, are disposed on a same dielectric layer of the dielectric layers.

US Pat. No. 9,857,258

PRESSURE SENSOR TO SENSE MULTI-DIRECTIONAL MOVEMENT

Samsung Electro-Mechanics...

1. A pressure sensor, comprising:
a sensor accommodated in a frame of a base substrate;
an elastic support portion elastically connecting the sensor to the frame and configured to provide multidirectional movement
to the sensor;

a membrane disposed on a surface of the sensor; and
a pressure detector disposed on the membrane and configured to detect a variation in pressure based on a movement of the membrane.

US Pat. No. 9,691,838

CHIP RESISTOR

SAMSUNG ELECTRO-MECHANICS...

1. A chip resistor comprising:
a substrate;
a first electrode disposed on a surface of the substrate;
a second electrode disposed on a surface of the substrate to be separated from the first electrode;
a first resistor electrically connecting the first electrode to the second electrode; and
a second resistor electrically connecting the first electrode to the second electrode,
wherein thermo electromotive force generated from the first resistor is less than thermo electromotive force generated from
the second resistor when temperatures of the first electrode and the second electrode are different from each other, and

a temperature coefficient of resistivity (TCR) of the second resistor is lower than a TCR of the first resistor.

US Pat. No. 9,673,513

RADIATOR FRAME HAVING ANTENNA PATTERN EMBEDDED THEREIN AND ELECTRONIC DEVICE INCLUDING THE SAME

Samsung Electro-Mechanics...

1. A radiator frame comprising:
a main radiator including an antenna pattern part configured to transmit or receive a signal, an internal terminal part on
one end of the antenna pattern part and configured to contact and thereby electrically connect the antenna pattern part to
a signal circuit carried by a substrate, and an external terminal part on another end of the antenna pattern part and configured
to contact and thereby electrically connect to an auxiliary radiator to improve radiation performance of the antenna pattern
part; and

a molded frame around the main radiator, the molded frame configured to expose the internal terminal part at a first surface
of the molded frame, and configured to expose the external terminal part at a second surface of the molded frame,

wherein the internal terminal part, the antenna pattern part and the external terminal part are formed integrally as one piece,
the antenna pattern part is exposed at the second surface of the molded frame, and the antenna pattern part includes a support
part that is connected to the external terminal part and embedded in the molded frame.

US Pat. No. 9,484,806

DRIVING APPARATUS FOR DRIVING POWER FACTOR CORRECTION CIRCUIT

SAMSUNG ELECTRO-MECHANICS...

1. A driving apparatus for driving an interleaved power factor correction circuit including a first main switch and a second
main switch performing a switching operation with a predetermined phase difference, a first auxiliary switch performing a
first switching operation of being turned on before the first main switch is turned on, and turned off before the first main
switch is turned off, and a second auxiliary switch performing a second switching operation of being turned on before the
second main switch is turned on, and turned off before the second main switch is turned off and a first inductor connected
between an input power terminal to which input power is applied and the first main switch and a second inductor connected
between the input power terminal and the second main switch, wherein a first current from the first inductor can flow to the
first main or auxiliary switch and a second current from the second inductor can flow to the second main or auxiliary switch
wherein the first auxiliary switch performs a switching operation of being turned on at a time at which the second switching
operation is terminated, and the second auxiliary switch performs a switching operation of being turned on at a time at which
the first switching operation is terminated, the apparatus comprising:
an input unit obtaining an input signal;
a current sensing unit obtaining information regarding a current of the interleaved power factor correction circuit; and
an output unit outputting a first control signal with respect to the first main switch, a third control signal with respect
to the second main switch, a second control signal with respect to the first auxiliary switch, and a fourth control signal
with respect to the second auxiliary switch, based on the input signal and the current information.

US Pat. No. 9,472,340

COIL TYPE UNIT FOR WIRELESS POWER TRANSMISSION, WIRELESS POWER TRANSMISSION DEVICE, ELECTRONIC DEVICE AND MANUFACTURING METHOD OF COIL TYPE UNIT FOR WIRELESS POWER TRANSMISSION

Samsung Electro-Mechanics...

1. A coil type unit for wireless power transmission, comprising:
a coil portion having a coil pattern formed on a substrate;
a magnetic portion having a conductive pattern;
an adhesive portion interposed between the magnetic portion and the coil portion to bond the magnetic portion and the coil
portion to each other; and

a conductive hole formed in the substrate for electrically connecting both ends of the coil pattern and the conductive pattern,
wherein the adhesive portion is formed on one surface of the magnetic portion having the conductive pattern formed thereon
while being formed in an area other than the area in which the conductive pattern is formed, and

wherein the adhesive portion is formed to have the same thickness as the conductive pattern.

US Pat. No. 9,390,844

CHIP RESISTOR

SAMSUNG ELECTRO-MECHANICS...

1. A chip resistor comprising:
a body having a plurality of substrates stacked therein;
a plurality of resistors formed in the body, each resistor interposed between respective substrates, and extended beyond both
end surfaces of the body; and

first and second electrodes covering both end surfaces of the body, respectively, and connected to both end portions of the
resistors, respectively,

wherein each resistor is substantially rectangular having a constant width over a length, and
a thickness of a gap between an uppermost resistor among the plurality of resistors and an upper surface of the body is substantially
the same as a thickness of a gap between a lowermost resistor among the plurality of resistors and a lower surface of the
body.

US Pat. No. 9,390,853

MULTILAYER CERAMIC CAPACITOR AND MOUNTING BOARD THEREFOR

Samsung Electro-Mechanics...

1. A multilayer ceramic capacitor comprising:
a ceramic body including a plurality of dielectric layers and having first and second main surfaces opposing each other in
a thickness direction of the ceramic body, third and fourth end surfaces in a length direction thereof, and fifth and sixth
side surfaces in a width direction thereof;

a plurality of first and second internal electrodes disposed in the ceramic body, having the dielectric layer interposed therebetween,
to be alternately exposed to the third and fourth end surfaces; and

first and second external electrodes formed only on the end surfaces and the main surfaces of the ceramic body in the length
and thickness directions and electrically connected to the first and second internal electrodes,

wherein when a width of the first or second external electrode is defined as A and a length of a margin part of the ceramic
body in the length direction is defined as B, a ratio (A/B) of the width of the first or second external electrode to the
length of the margin part of the ceramic body in the length direction is 3.3 or less (A/B?3.3), and

wherein the width of the first and second external electrodes is narrower than that of the ceramic body.

US Pat. No. 9,318,352

POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A method for manufacturing a power module package, comprising:
preparing first and second lead frames disposed to face each other;
forming ceramic coating layers on a portion of a first surface of both the first and second lead frames by firing; and
mounting semiconductor devices on second surfaces of the first and second lead frames,
wherein the ceramic coating layers are directly formed on the first surface of the first and second lead frames.

US Pat. No. 9,233,878

DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR CONTAINING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A dielectric ceramic composition comprising a base powder (M being configured of Mg and Ti) represented by (1-x)BaTiO3-xBiMO3 containing a first main component represented by BaTiO3 and a second main component represented by BiMO3, wherein x satisfies 0.005?x?0.5, 0.1 to 5.0 mol % of a first accessory component, an oxide or a carbonate containing at
least one of Mn, V, Cr, Fe, Ni, Co, Cu and Zn, based on 100 mol % of the base powder, and 0.1 to 5.0 mol % of a second accessory
component, an oxide containing Si or a glass compound containing Si, based on 100 mol % of the base powder.

US Pat. No. 9,054,601

MAXIMUM POWER POINT TRACKER, POWER CONVERSION CONTROLLER, POWER CONVERSION DEVICE HAVING INSULATING STRUCTURE, AND METHOD FOR TRACKING MAXIMUM POWER POINT THEREOF

SAMSUNG ELECTRO-MECHANICS...

1. A power conversion device, comprising:
a DC/AC converter including a primary DC chopper unit having a primary switch, a transformer, and an AC/AC conversion unit
including a secondary switch;

a current detector detecting current from an input stage of the DC/AC converter and providing a detected current value;
a voltage detector detecting a system voltage from an output stage of the DC/AC converter; and
a power conversion controller generating a primary pulse width modulation (PWM) signal to be provided to the primary DC chopper
unit and secondary first and second PWM signals, having mutually opposing phases, to be provided to the AC/AC conversion unit
by using the detected current value and the system voltage,

wherein the power conversion controller comprises:
a maximum power point tracker setting a current command value to allow power to track a maximum power point through the input
stage of the DC/AC converter by using the detected current value obtained from the input stage of the DC/AC converter;

a first pulse width modulation (PWM) controller generating the primary PWM signal for switching the primary switch by using
the current command value from the maximum power point tracker and a pre-set carrier signal;

a phase detector detecting a phase of the system voltage detected from the output stage of the DC/AC converter to provide
phase information; and

a second PWM controller generating the secondary first and second PWM signals having the mutually opposing phases by using
the phase information from the phase detector.

US Pat. No. 10,181,367

RESISTOR ELEMENT, METHOD OF MANUFACTURING THE SAME, AND RESISTOR ELEMENT ASSEMBLY

SAMSUNG ELECTRO-MECHANICS...

1. A resistor element comprising: a first terminal and a second terminal on opposite end portions of a base substrate, respectively; a first resistance layer electrically connected to the first terminal, comprising a thick film resistor; and a second resistance layer electrically connected to the first resistance layer and to the second terminal, comprising a thin film resistor, wherein the first resistance layer is on a first surface of the base substrate, and the second resistance layer is on a second surface of the base substrate opposing the first surface, wherein the first resistance layer and the second resistance layer are electrically connected to each other by a conductive via penetrating through the base substrate, and wherein the thick film resistor contains a ruthenium (Ru) oxide, and the thin film resistor contains at least one of a nickel chromium (NiCr) alloy, a titanium nitride (TiN) alloy, and a tantalum nitride (TaN) alloy.

US Pat. No. 9,659,709

COMMON MODE FILTER AND MANUFACTURING METHOD THEREOF

SAMSUNG ELECTRO-MECHANICS...

1. A common mode filter comprising:
a substrate:
a filter layer disposed on the substrate and configured to remove a signal noise;
an electrode column formed to be bent along a perimetric portion of the filter layer and electrically connected with the filter
layer;

an electrode pad formed to have a larger longitudinal cross-sectional area than the electrode column and integrally coupled
on the electrode column; and

a magnetic layer formed on a layer on which the electrode column and the electrode pad are formed.

US Pat. No. 9,525,394

BAND PASS FILTER

Samsung Electro-Mechanics...

1. A band pass filter comprising:
a first substrate having a first surface and comprising capacitors and first conductive patterns provided on and facing the
first surface; and

a second substrate laminated with the first substrate and provided on and facing a second surface of the first substrate opposite
the first surface, the second substrate connected to the first conductive patterns through via holes,

wherein an attenuation frequency is determined according to the amount and shape of the via holes,
at least one of the first conductive patterns is an inductor which extends from at least one of the capacitors to at least
one of the via holes, and wherein the second substrate comprises a non-conductive region provided to be adjacent to a region
in contact with the via holes, and

at least one of the capacitors at least partially overlaps one or more of the first conductive patterns in a plan view.

US Pat. No. 9,384,894

DIELECTRIC COMPOSITION TO BE SINTERED AT LOW TEMPERATURE, MULTILAYER CERAMIC ELECTRONIC COMPONENT CONTAINING THE SAME, AND METHOD OF MANUFACTURING THE MULTILAYER CERAMIC ELECTRONIC COMPONENT

SAMSUNG ELECTRO-MECHANICS...

6. A multilayer ceramic electronic component, comprising:
a multilayer body formed by stacking a plurality of dielectric layers containing BaTiO3 as a major component and as a minor component;

first and second internal electrodes alternately stacked on the dielectric layers and having different polarities;
a first external electrode formed on a surface of the multilayer body to be electrically connected to the first internal electrodes;
and

a second external electrode formed on a surface of the multilayer body opposing the surface thereof having the first external
electrode formed thereon to be electrically connected to the second internal electrodes,

wherein
the minor component is contained in a content of 0.1 mol % to 2.0 mol % based on 100 mol % of the major component, and
the minor component is at least one selected from a group consisting of Li6CuO4, Li2CuO2, and Li2Cu2O3, or a mixture thereof.

US Pat. No. 9,105,616

EXTERNAL CONNECTION TERMINAL, SEMICONDUCTOR PACKAGE HAVING EXTERNAL CONNECTION TERMINAL, AND METHODS FOR MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. An external connection terminal part, comprising:
an insulating material; and
metal plating patterns formed on both sides of the insulating material, wherein a whole lower and upper surfaces of the insulating
material are exposed.

US Pat. No. 10,617,008

CAPACITOR AND BOARD HAVING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A capacitor comprising:a body including a plurality of dielectric layers;
first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween;
a first insulating region, disposed in each of the first internal electrodes, including a first connection electrode disposed therein; and
a second insulating region, disposed in each of the second internal electrodes, including a second connection electrode disposed therein,
wherein D1×Td and D2×Td are greater than 20 ?m2 and 60 ?m2 or less, where Td is a thickness of the dielectric layer, and D1 and D2 are widths of the first and second insulating regions, respectively,
the first and second connection electrodes are exposed to a side surface of the body, and
the capacitor further comprises an insulating layer disposed on the side surface of the body to cover the first and second connection electrodes.

US Pat. No. 10,448,512

PRINTED CIRCUIT BOARD

Samsung Electro-Mechanics...

1. A printed circuit board comprising:a core board comprising an insulating layer, the insulating layer having a cavity formed therein;
a first insulating layer disposed on a surface of the core board;
a second insulating layer comprising a different material from the first insulating layer disposed on an opposite surface of the core board from the first insulating layer;
an electronic element disposed in the cavity; and
an insulating member disposed between inner surfaces of the cavity and the electronic element,
wherein the second insulating layer is disposed in contact with the electronic element,
a modulus of elasticity of the insulating member is lower than a modulus of elasticity of the first insulating layer,
the electronic element has a surface on which electrodes are disposed,
the first insulating layer comprises glass fiber impregnated with resin, and
the glass fiber impregnated with resin is disposed in contact with the insulating layer of the core board and the surface of the electronic element on which the electrodes are disposed.

US Pat. No. 10,181,380

MULTILAYER ELECTRONIC COMPONENT HAVING FIRST AND SECOND INTERNAL ELCTRODE PATTERNS ALTERNATELY STACKED, AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer electronic component comprising:a body including a multilayer structure in which first and second internal electrode patterns are alternately stacked, containing a dielectric material, and having outer surfaces including first and second outer surfaces opposing each other in a first direction, third and fourth outer surfaces opposing each other in a second direction, and fifth and sixth outer surfaces opposing each other in a third direction;
first and second external electrodes disposed, respectively, on the third and fourth outer surfaces among the outer surfaces of the body, and electrically connected to the first and second internal electrode patterns, respectively; and
first and second side parts disposed, respectively, on the fifth and sixth outer surfaces among the outer surfaces of the body,
wherein the first internal electrode patterns are exposed to the third outer surface and the fifth outer surface of the body on which the first external electrode and the first side part are disposed, respectively,
the second internal electrode patterns are exposed to the fourth outer surface and the sixth outer surface of the body on which the second external electrode and the second side part are disposed, respectively,
both the first side part and the second external electrode are directly disposed on the fifth outer surface, and both the second side part and the first external electrode are directly disposed on the sixth outer surface, and
a length of each of the first and second side parts in the second direction is smaller than a distance between the third and fourth outer surfaces opposing each other in the second direction.

US Pat. No. 10,110,259

BAND SELECTION SWITCH APPARATUS OF POWER AMPLIFIER SYSTEM

Samsung Electro-Mechanics...

1. A band selection switch apparatus, comprising:a first switch comprising a first series switch disposed between a transmission input terminal and a first transmission and reception terminal;
a second switch comprising a second series switch disposed between the transmission input terminal and a first transmission terminal; and
a third switch comprising a third series switch disposed between a first reception output terminal and the first transmission and reception terminal,
wherein the first series switch comprises
a first series switch circuit comprising first series switch elements connected between the transmission input terminal and a first intermediate node;
a second series switch circuit comprising second series switch elements connected between the first intermediate node and the first transmission and reception terminal and configured to perform a switching operation in synchronization with a switching operation performed by the first series switch circuit; and
a first shunt switch circuit comprising first shunt switch elements connected between the first intermediate node and a ground and configured to perform a switching operation complementarily with the switching operation performed by the first series switch circuit.

US Pat. No. 9,974,183

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic electronic component comprising:a ceramic body including:
an active part including a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed to respective end surfaces of the ceramic body, with dielectric layers interposed therebetween;
an upper cover part formed above the active part; and
a lower cover part formed below the active part and having a thickness greater than that of the upper cover part;
first and second external electrodes electrically connected to the first and second internal electrodes, respectively, on respective end surfaces of the ceramic body in a length direction, on a lower surface of the ceramic body in a thickness direction, and are not on an upper surface of the ceramic body in the thickness direction;
first and second insulating layers on respective end surfaces of the first and second external electrodes in the length direction, extending from respective positions horizontally corresponding to upper corner portions of the ceramic body in a thickness direction down to a level in the thickness direction horizontally corresponding to upper third portion of the lower cover part; and
first and second plating layers on respective end surfaces of the first and second external electrodes in the length direction, respectively extending up to the level down to which the first and second insulating layers extend, and respectively below, in the thickness direction, the first and second insulating layers.

US Pat. No. 9,812,247

ELECTRONIC COMPONENT

SAMSUNG ELECTRO-MECHANICS...

1. A thin film-type electronic component comprising:
a magnetic body;
first and second internal coil parts embedded in the magnetic body and spaced apart from each other by a predetermined distance
in a thickness direction of the magnetic body;

third and fourth internal coil parts embedded in the magnetic body and spaced apart from each other by a predetermined distance
in the thickness direction, wherein the first and second internal coil parts are spaced apart from the third and fourth internal
coil parts by a predetermined distance in a length direction of the magnetic body; and

a spacer part disposed between the first and second internal coil parts on one side and the third and fourth internal coil
parts on the other side,

wherein at least a portion of the spacer part extends continuously from a point above at least one of the first and third
internal coil parts in the thickness direction to another point below at least one of the second and fourth internal coil
parts in the thickness direction.

US Pat. No. 9,812,256

COIL ASSEMBLY

Samsung Electro-Mechanics...

1. A coil assembly comprising:
a coil part comprising stamped coils; and
a connection substrate having one end thereof disposed inside the coil part and the other end disposed outside the coil part,
wherein one end of each of the stamped coils is connected to a first surface of the connection substrate and the other end
is connected to a second surface of the connection substrate.

US Pat. No. 9,699,885

CIRCUIT BOARD INCLUDING HEAT DISSIPATION STRUCTURE

Samsung Electro-Mechanics...

1. A circuit board comprising:
an insulating part;
a first heat transfer structure comprising a plurality of metal layers and a plurality of insulating layers and having at
least a portion thereof inserted into the insulating part, each of the plurality of insulting layers alternately stacked with
each of the plurality of the metal layers, each of the plurality of metal layers formed in a direction of thickness of the
circuit board;

a metal pattern formed on the insulating part;
a copper plating layer covering surfaces of the first heat transfer structure so as to connect the plurality of metal layers
with one another; and

a via formed in the insulating part and having one surface thereof in contact with the copper layer and an opposite surface
of the one surface thereof in contact with a surface of the metal pattern.

US Pat. No. 9,673,524

COMPACT LOOP-TYPE ANTENNA DEVICE

Samsung Electro-Mechanics...

1. An antenna apparatus, comprising:
a core member comprising a support part, first protrusion portions disposed on one surface of the support part, second protrusion
portions disposed on the other surface of the support part, opposite to the one surface of the support part; and

a coil portion wound around the core member,
wherein the second protrusion portions have end surfaces provided as mounting surfaces, respectively, and
wherein one of the first protrusion portions has an inclined nonparallel surface relative to a longitudinal direction of the
support part.

US Pat. No. 9,629,260

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A printed circuit board, comprising:
a base substrate;
a through via formed to penetrate through the base substrate; and
circuit patterns formed on one side and another side of the base substrate and formed to be thinner than an inner wall of
the through via,

wherein the inner wall of the through via comprises at least one seed layer and a plurality of plating layers, and
wherein insulating layers are formed on the through via and the circuit patterns to entirely cover the through via and the
circuit patterns.

US Pat. No. 9,472,316

DIELECTRIC COMPOSITION FOR LOW-TEMPERATURE SINTERING, MULTILAYER CERAMIC ELECTRONIC COMPONENT CONTAINING THE SAME, AND METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT

SAMSUNG ELECTRO-MECHANICS...

1. A dielectric composition for low-temperature sintering, the dielectric composition comprising:
BaTiO3 as a main ingredient; and

a Li2O—BaO compound as an accessory ingredient,

wherein the accessory ingredient is contained in an amount of 0.2 mol % to 0.8 mol %, on the basis of 100 mol % of the main
ingredient, and

wherein the Li2O—BaO compound is (2-2x)Li2O-xBaO,

where x is 0.1 to 0.9.

US Pat. No. 9,251,957

MULTILAYER CERAMIC CONDENSER AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic condenser, comprising:
a multilayer main body having a first side, a second side, a third side and a fourth side, the multilayer main body including:
a plurality of inner electrodes exposed to the second side and the fourth side; and
a dielectric layer between the inner electrodes, the dielectric layer being formed by a first ceramic dielectric powder;
a first outer electrode and a second outer electrode formed on the first side and the third side of the multilayer main body;
and

a first side part and a second side part formed on the second side and the fourth side of the multilayer main body covering
the dielectric layer of the main body, the first side part and the second side part being formed by a second ceramic dielectric
powder having a smaller mean particle diameter than that of the first ceramic dielectric powder,

wherein a Brunauer-Emmett-Teller (“BET”) specific surface area of the second ceramic dielectric powder is set to be larger
by 1 to 50 m2/g than that of the first ceramic dielectric powder.

US Pat. No. 9,164,124

APPARATUS AND METHOD FOR CONTROLLING AUTOMATIC GAIN OF INERTIAL SENSOR

Samsung Electro-Mechanics...

1. An automatic gain control apparatus of an inertial sensor, comprising:
an inertial sensor that detects accelerations and angular velocities of the corresponding axes based on vibrations of driving
masses and Coriolis forces for each axis;

a driving unit that vibrates the driving mass in a direction of the corresponding axis by applied driving voltage;
a detection unit that detects a driving displacement of the driving mass vibrated by the driving unit;
a state determination unit that compares the detected driving displacement with a preset target value to determine a state
of the driving mass and generates an AGC control signal according to the state of the driving mass; and

a control unit that includes an AGC controlling to compensate for the driving displacement of the driving mass when the state
of the driving mass is abnormal and performs a control to wake-up the AGC or convert the AGC into a sleep mode according to
the AGC control signal input from the state determination unit to operate the AGC at the corresponding driving rate.

US Pat. No. 9,081,400

APPARATUS AND METHOD FOR OUTPUTTING SIGNAL

SAMSUNG ELECTRO-MECHANICS...

1. An apparatus for outputting a signal, comprising:
a reference signal generating unit outputting a first temperature coefficient signal having a positive temperature coefficient
and a second temperature coefficient signal having a negative temperature coefficient; and

an output unit outputting an output signal having a plurality of temperature coefficients based on the first temperature coefficient
signal and the second temperature coefficient signal,

wherein the output unit includes a PCTAT signal generating unit outputting a third temperature coefficient signal having a
positive temperature coefficient and a negative temperature coefficient, based on the first temperature coefficient signal
and the second temperature coefficient signal,

wherein the PCTAT signal generating unit includes:
a bias voltage receiving unit to which a bias voltage is applied by the first temperature coefficient signal and the second
temperature coefficient signal;

a current mirror unit for the bias voltage receiving unit; and
a PCTAT signal output unit outputting a third temperature coefficient signal through the current mirror unit.

US Pat. No. 10,448,502

ELECTRONIC COMPONENT AND BOARD HAVING ELECTRONIC COMPONENT MOUNTED THEREON

SAMSUNG ELECTRO-MECHANICS...

1. An electronic component comprising:a body including a dielectric material and internal electrodes embedded in the dielectric material;
first and second external electrodes respectively connected to the internal electrodes and disposed on the body;
a first substrate connected to the first and second external electrodes and disposed on one side of the body;
a second substrate connected to the first substrate and disposed on one side of the first substrate; and
a first connection electrode disposed on the first substrate and connected to the first external electrode; and
a second connection electrode disposed on the first substrate and connected to the second external electrode,
wherein the first and second substrates have different Young's modulus,
the body, the first substrate, and the second substrate are disposed sequentially,
an entirety of the first substrate is disposed between the second substrate and the body,
an entirety of the second substrate is disposed on a side of the first substrate opposing a side of the first substrate facing the body, and
wherein the second substrate includes a first surface facing the first substrate and a second surface opposing the first surface, third and fourth connection electrodes being disposed on or exposed from the second surface and electrically connected to the first and second external electrodes, respectively.

US Pat. No. 10,135,416

COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

SAMSUNG ELECTRO-MECHANICS...

8. A board having a composite electronic component, the board comprising:a printed circuit board on which a plurality of electrode pads are formed;
a composite electronic component mounted on the printed circuit board; and
solders connecting the electrode pads and the composite electronic component to each other,
wherein the composite electronic component includes:
a common mode filter including a first body having a common mode choke coil;
a multilayer ceramic capacitor array coupled to the common mode filter and including a second body in which a plurality of dielectric layers are stacked;
first and third external electrodes disposed on a side surface of the first body and electrically connected to the common mode choke coil;
second and fourth external electrodes disposed on an opposing side surface of the first body and electrically connected to the common mode choke coil;
first and second dummy electrodes respectively disposed on the side surface and the opposing side surface of the first body and spaced apart from the first to fourth external electrodes;
fifth and seventh external electrodes disposed on a side surface of the second body;
sixth and eighth external electrodes disposed on an opposing side surface of the second body; and
third and fourth dummy electrodes respectively disposed on the side surface and the opposing side surface of the second body and spaced apart from the fifth to eighth external electrodes;
wherein the first external electrode is coupled to the third dummy electrode, the second external electrode is coupled to the fourth dummy electrode, the third external electrode is coupled to the fifth external electrode, the fourth external electrode is coupled to the sixth external electrode, the first dummy electrode is coupled to the seventh external electrode, and the second dummy electrode is coupled to the eighth external electrode, and
wherein inside the multilayer ceramic capacitor array, a plurality of dummy dielectric layers on which no internal electrodes are disposed are inserted between dielectric layers on which internal electrodes are disposed.

US Pat. No. 10,135,421

BULK-ACOUSTIC WAVE FILTER DEVICE

Samsung Electro-Mechanics...

1. A bulk-acoustic wave filter device, comprising:a first substrate;
a first filter disposed on the first substrate, within a cavity of the bulk-acoustic wave filter device;
a second substrate coupled to the first substrate;
a second filter disposed on the second substrate, within the cavity and facing the first filter;
a first inductor layer disposed on the first substrate and around the first filter;
a second inductor layer disposed on the second substrate and around the second filter, and bonded to the first inductor layer; and
a sealing member sealing the cavity, together with the first and second inductor layers.

US Pat. No. 10,020,107

HYBRID INDUCTOR

Samsung Electro-Mechanics...

1. A hybrid inductor comprising: a board; a first inductor provided in the board and comprising conductive patterns disposed at different heights; and a second inductor mounted on the board and an end of the second inductor being connected to the conductive patterns.

US Pat. No. 9,947,470

CERAMIC DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR CONTAINING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor comprising:a ceramic body in which dielectric layers and first and second internal electrodes are alternately stacked; and
first and second external electrodes formed on opposing end portions of the ceramic body and electrically connected to the first and second internal electrodes,
wherein the dielectric layers contain a ceramic dielectric composition containing a base material powder represented by one or more of (Ca1-xSrx)(Zr1-yTiy)O3, Ca(Zr1-yTiy)O3, Sr(Zr1-yTiy)O3, (Ca1-xSrx)ZrO3, and (Ca1-xSrx)TiO3, in which x and y satisfy 0?x?1.0 and 0.2?y?0.9, respectively,
wherein the ceramic dielectric composition further contains 0.1 at % to 1.0 at % of a second accessory ingredient, an oxide or carbonate containing at least one of magnesium (Mg) and aluminum (Al), based on 100 at % of the base material powder, and
wherein the ceramic dielectric composition further contains a third accessory ingredient, an oxide or carbonate containing at least one of cerium (Ce), niobium (Nb), lanthanum (La), and antimony (Sb), and a fourth accessory ingredient, different from the second accessory ingredient, an oxide or carbonate containing at least one of silicon (Si), barium (Ba), calcium (Ca), and aluminum (Al), or a glass compound containing silicon (Si).

US Pat. No. 9,496,084

METHOD OF MANUFACTURING CHIP ELECTRONIC COMPONENT

SAMSUNG ELECTRO-MECHANICS...

1. A manufacturing method of a chip electronic component, the manufacturing method comprising:
forming a coil pattern part on at least one surface of an insulating substrate;
forming a thin polymer insulating film to follow a surface shape of the coil pattern part;
forming a first primer insulating layer on one surface of a first magnetic sheet, and forming a second primer insulating layer
on one surface of a second magnetic sheet;

after forming the first primer insulating layer on the one surface of the first magnetic sheet and forming the second primer
insulating layer on the one surface of the second magnetic sheet, interposing the insulating substrate on which the coil pattern
part is formed between the first and second magnetic sheets such that the first and second primer insulating layers are facing
each other, and pressing the first and second magnetic sheets to form a magnetic body such that the first and second primer
insulating layers are converted to additional insulating films on the coil pattern part; and

forming an external electrode on at least one end surface of the magnetic body so as to be connected to the coil pattern part.

US Pat. No. 9,370,886

RADIATOR FRAME HAVING ANTENNA PATTERN EMBEDDED THEREIN, ELECTRONIC DEVICE INCLUDING THE SAME, AND MOLD FOR MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A radiator frame, comprising:
a radiator including an antenna pattern part configured to transmit or receive a signal and a terminal connection portion
configured to electrically connect the antenna pattern part and a circuit substrate; and

a molded frame formed by injection-molding a material to incorporate the radiator so that the terminal connection portion
is exposed at a first surface of the molded frame and the antenna pattern part is exposed at a second surface of the molded
frame opposite to the first surface,

wherein the antenna pattern part includes one or more supporting holes arranged to fix the antenna pattern part to an injection-molding
mold, and

the supporting holes are at least partially filled with the molded frame material extending from the first surface of the
molded frame.

US Pat. No. 9,204,533

ASYMMETRICAL MULTILAYER SUBSTRATE, RF MODULE, AND METHOD FOR MANUFACTURING ASYMMETRICAL MULTILAYER SUBSTRATE

Samsung Electro-Mechanics...

19. An RF module which uses an asymmetrical multilayer substrate in which an RF signal transmission line is formed, the asymmetrical
multilayer substrate including:
a core layer in which through-hole for passing through and connecting upper and lower portions thereof is formed;
a first pattern layer formed on one of upper and lower portions of the core layer, and including a first signal line pattern
connected with the through-hole;

a second pattern layer formed on the other of the upper and lower portions of the core layer, and including a second metal
plate providing a capacitance between itself and a pattern of an adjacent outer pattern layer and a second routing line pattern
connected with the through-hole;

a first insulating layer formed on the second pattern layer so as to have a thinner thickness than a thickness of the core
layer and including a first via connected with the second routing line pattern; and

a third pattern layer formed on the first insulating layer and including a third signal line pattern connected with the first
via,

wherein an impedance transformation circuit including an impedance load on a transmission line and a parasitic capacitance
load on the transmission line is formed for impedance matching in signal transmission between the signal line patterns formed
in the upper and lower side directions of the core layer, and the impedance load includes impedances of the through-hole,
the second routing line pattern and the first via Which are forming the transmission line, and the parasitic capacitance load
includes the capacitance provided by the second metal plate.

US Pat. No. 9,202,798

POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A method for manufacturing a power module package, the method comprising:
preparing a substrate in which a fastening unit with a groove for insertedly fastening an external connection terminal formed
therein is buried at a predetermined depth in a thickness direction;

mounting a semiconductor chip on the substrate;
insertedly fastening one end of the external connection terminal into the groove of the fastening unit; and
forming a case formed on the substrate so as to cover one surface of the substrate and the semiconductor chip and expose the
other end of the external connection terminal to the outside,

wherein the preparing of the substrate in which the fastening unit is buried at the predetermined depth in the thickness direction
includes:

preparing an insulating material;
forming a trench of a predetermined depth on one surface of the insulating material;
disposing a circuit layer from which a portion corresponding to the trench is removed, on one surface of the insulating material;
disposing a metal layer on the other surface of the insulating material; and
inserting the fastening unit into the trench and integrating the insulating material, the circuit layer, the metal layer,
and the fastening unit.

US Pat. No. 9,099,234

FILTER FOR REMOVING NOISE AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A filter for removing noise, which comprises:
a lower magnetic body;
an insulating layer provided on the lower magnetic body and including at least one conductor; and
an upper magnetic body including a primary ferrite composite provided on the insulating layer and a secondary ferrite composite
provided on the primary ferrite composite to cover a pore formed on one surface of the primary ferrite composite,

wherein the secondary ferrite composite is contacted with the one surface of the primary ferrite composite including the pore,
wherein the pore has a recessed shape from the one surface of the primary ferrite composite to another surface of the primary
ferrite composite and is filled with the secondary ferrite composite.

US Pat. No. 9,099,243

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic electronic component comprising:
a ceramic body including a dielectric layer; and
an internal electrode formed in the ceramic body,
wherein, on a cross section of the ceramic body in a width-thickness direction, a thickness Te of the internal electrode is
within a range of 0.1 ?m to 1.0 ?m (0.1 ?m?Te?1.0 ?m), and

when the internal electrode is divided into three regions including a central region and both edge regions in a width direction
of the ceramic body and a ratio of an actual total length of the internal electrode corresponding to the sum of lengths of
electrode portions to an ideal total length of the internal electrode is defined as connectivity S of the internal electrode,
connectivity S of the internal electrode in the edge regions thereof is within a range of 75% to 98% (75%?S?98%), and a ratio
of the connectivity of the internal electrode in the edge regions thereof to connectivity of the internal electrode in the
central region thereof is within a range of 0.9 to 0.98.

US Pat. No. 9,059,612

SPINDLE MOTOR

SAMSUNG ELECTRO-MECHANICS...

1. A spindle motor comprising:
a sleeve fixedly installed on a base member;
a shaft rotatably supported by the sleeve;
a rotor hub fixedly installed on an upper end portion of the shaft to rotate together therewith; and
a thrust plate fixedly coupled to the sleeve so as to be disposed to face a lower surface of the rotor hub and having a ring
shape,

wherein the thrust plate includes a channel part formed therein in order to reduce a difference in pressure between a bearing
clearance on an inner side thereof and a bearing clearance on an outer side thereof, and

the channel part is configured of grooves formed in a lower surface of the thrust plate and an inner peripheral surface thereof.

US Pat. No. 10,003,723

CAMERA MODULE INCLUDING LENS MODULE ACTUATOR

Samsung Electro-Mechanics...

1. A camera module, comprising:a coil positioned on a first surface of a fixed unit;
a magnet positioned on a movable unit and facing the coil; and
a position sensor positioned on a second surface of the fixed unit and configured to sense a position of the movable unit,
wherein the first and second surfaces are transverse to each other, and the second surface lacks coils disposed thereon.

US Pat. No. 9,947,459

SURFACE MOUNTED ELECTRONIC COMPONENT

SAMSUNG ELECTRO-MECHANICS...

1. A surface mounted electronic component comprising:a first frame terminal including a first end surface frame extending in a first direction and first upper and lower surface frames extending from upper and lower ends of the first end surface frame in a second direction;
a second frame terminal including a second end surface frame opposing the first end surface frame and extending in the first direction and second upper and lower surface frames extending from upper and lower ends of the second end surface frame in a third direction opposite to the second direction;
a first electronic component disposed between the first and second end surface frames below the first and second upper surface frames; and
a second electronic component disposed above the first and second upper surface frames, such that the first and second end surface frames do not extend in the first direction to overlap a surface of the second electronic component,
wherein the first and second frame terminals each have a vertically symmetric structure, such that the first upper and lower surface frames extend the same distance in the second direction, and the second upper and lower surface frames extend the same distance in the third direction; wherein the first and second electronic components each have a first and a second external electrodes; and
wherein the first external electrode of the first electronic component is electrically connected to the first upper surface frame, and the second frame terminal is configured to enable disposing a third electronic component adjacent the first electronic component, wherein a connection frame electrically connects the second external electrode of the first electronic component with a first external electrode of the third electronic component, a second external electrode of the third electronic component being connected to the second frame terminal such that the first electronic component and the third electronic component are electrically in series.

US Pat. No. 9,470,635

SYSTEM OF MEASURING WARPAGE AND METHOD OF MEASURING WARPAGE

Samsung Electro-Mechanics...

1. A system of measuring a warpage, comprising:
a light source that irradiates light reflected from a surface of a sample of which the warpage is measured;
a heating plate part having the sample disposed thereon and diffusing heat;
a reference grating part that is spaced apart from the sample at a predetermined distance and transmits light reflected from
the surface of the sample;

a camera that acquires light transmitting the reference grating part to photograph an image;
a server that analyzes the image photographed by the camera to calculate the warpage of the sample; and
a control part provided with an intake part that removes a fume generated from the sample,
wherein the reference grating part includes:
a reference grating plate in which grids are formed on a transparent plate at a predetermined distance;
a frame that fixes the reference grating plate; and
at least one first suction hole that is mounted in the frame and is connected with the intake part by a first exhaust pipe.

US Pat. No. 9,287,041

COIL DEVICE, AND WIRELESS POWER TRANSMITTER AND WIRELESS POWER RECEIVER HAVING THE SAME

Samsung Electro-Mechanics...

14. A wireless power receiver, comprising:
a case having a reception space and varying a charging area upon a user's selection;
a coil part, having, in the reception space of the case, a coil body formed of a wound conductor having a predetermined length,
wherein a gap between turns of the wound conductor of the coil body varies as the charging area of the case varies such that
the coil part wirelessly receives power; and

a connection unit transmitting the power received in the coil part to an external device.

US Pat. No. 9,253,873

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A printed circuit board, comprising:
a core layer having a first circuit wiring layer formed on one surface or both surfaces thereof;
an insulating layer laminated, as at least one layer, on one surface or both surfaces of the core layer, the insulating layer
including

a conductive core, being an electromagnetic wave shielding layer having a continuous form in the insulating layer;
a second circuit wiring layer formed on one surface of the insulating layer; and
a via penetrating through the insulating layer and through the conductive core, electrically connecting the first circuit
wiring layer to the second circuit wiring layer, and electrically insulated from the conductive core,

wherein the insulating layer is contacting the first circuit wiring layer or the second circuit wiring layer.

US Pat. No. 9,163,206

CULTURE APPARATUS AND METHOD OF REPLACING CULTURE MEDIUM

Samsung Electro-Mechanics...

1. A culture apparatus comprising:
a first pipe having a discharge channel formed at one end thereof and immersed in a culture dish;
a second pipe having a suction channel formed at one end thereof and immersed in the culture dish;
a connection channel connecting the first pipe and the second pipe,
wherein:
the first pipe is disposed in a position higher than that of the second pipe based on the connection channel,
the first pipe and the second pipe are extended in the same direction,
the discharge channel is extended in a direction perpendicular to a length direction of the first pipe,
the suction channel is extended in a direction perpendicular to a length direction of the first pipe,
the discharge channel, the suction channel, and the connection channel are disposed in parallel with each other,
the other end of the first pipe and the other end of the second pipe are open, and
the culture apparatus further comprises a closing member plugging the other end of the first pipe and the other end of the
second pipe.

US Pat. No. 9,158,091

LENS MODULE

Samsung Electro-Mechanics...

1. A lens module comprising:
a first lens having positive refractive power;
a second lens having positive refractive power;
a third lens having a shape in which an object-side surface thereof is concave;
a fourth lens having refractive power of which an object-side surface is convex;
a fifth lens having negative refractive power; and
a sixth lens having negative refractive power, having a shape in which an image-side surface thereof is concave, and having
at least one point of inflection formed on the image-side surface thereof.

US Pat. No. 9,105,378

GRAPHENE TRANSPARENT ELECTRODE AND METHOD FOR MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A method for manufacturing a graphene transparent electrode, comprising:
providing a graphene oxide solution:
forming a metal thin film on a glass substrate;
coating the graphene oxide solution on the metal thin film, followed by drying;
primarily reducing the obtained graphene oxide by using a reducing agent, to obtain reduced graphene oxide;
secondarily reducing the reduced graphene oxide by heat treatment under the inert atmosphere, to form a reduced layer;
compressing a transparent film on the reduced layer formed on the metal thin film; and
separating the compressed transparent film and the reduced layer from the glass substrate by etching the metal thin film by
an etching solution.

US Pat. No. 9,097,521

DISTANCE MEASUREMENT APPARATUS AND METHOD

SAMSUNG ELECTRO-MECHANICS...

1. A distance measurement apparatus, the apparatus comprising:
a light source to output light;
a switch array including a plurality of cells, and to control a position at which the light output from the light source is
irradiated, by switching operations of respective cells of the plurality of cells of the switch array;

a light detector including only a single cell, and to sense the light reflected from a target object; and
a controller that sequentially controls the switching operations of the plurality of cells of the switch array,
the controller to generate distance information corresponding to a distance between the light source and the target object,
based on the light sensed by the light detector.

US Pat. No. 10,559,413

COIL ELECTRONIC COMPONENT

SAMSUNG ELECTRO-MECHANICS...

1. A coil electronic component comprising:a first coil wound in a first direction and having a magnetic core;
a second coil sharing the magnetic core of the first coil, the second coil being wound in the first direction or in a second direction different from the first direction;
a main board disposed between the first coil and the second coil;
a first external electrode and a second external electrode connected to the first coil; and
a third external electrode and a fourth external electrode connected to the second coil,
wherein the first coil comprises a first coil pattern disposed on a first surface of a first insulating layer and connected to the first external electrode and a second coil pattern disposed on a second surface of the first insulating layer and connected to the second external electrode,
the second coil comprises a third coil pattern disposed on a first surface of a second insulating layer and connected to the third external electrode and a fourth coil pattern disposed on a second surface of the second insulating layer and connected to the fourth external electrode,
the first insulating layer comprises a through-hole forming the magnetic core of the first coil, and the second insulating layer comprises a through-hole forming a magnetic core of the second coil,
the first and second insulating layers are not disposed directly on the main board,
each of the first insulating layer and the second insulating layer has a thickness of about 10 ?m or more to about 50 ?m or less, and
each of the thicknesses of the first insulating layer and the second insulating layer is smaller than a thickness of the main board.

US Pat. No. 10,547,287

FILTER AND FRONT END MODULE INCLUDING THE SAME

Samsung Electro-Mechanics...

1. A filter, comprising:one or more series units; and
a shunt unit disposed between the one or more series units and ground,
wherein the one or more series units comprise series resonators which are configured to be selectively operated, and each of the plurality of series resonators includes a film bulk acoustic resonator,
wherein the one or more series resonators comprise a first series resonator and a second series resonator,
wherein the one or more series units comprise a first switch connected to the first series resonator in series, and a second switch connected to the second series resonator in series, and
wherein the first series resonator and the second series resonator are connected to each other in parallel through the first switch and the second switch.

US Pat. No. 10,192,683

MULTILAYER CAPACITOR AND BOARD HAVING THE MULTILAYER CAPACITOR MOUNTED THEREON

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer capacitor, comprising:a capacitor body including dielectric layers and a plurality of first internal electrodes and second internal electrodes, the plurality of first internal electrodes and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween, the capacitor body further having a first surface and a second surface opposing each other, a third surface and a fourth surface each connected to each of the first surface and the second surface and the third surface and the fourth surface opposing each other, and a fifth surface and a sixth surface each connected to each of the first surface and the second surface, each of the fifth surface and the sixth surface connected to each of the third surface and the fourth surface, and the fifth surface and the sixth surface opposing each other, the first internal electrodes and the second internal electrodes being exposed through at least the third surface and the fourth surface, respectively;
an insulating layer disposed on the first surface of the capacitor body;
a buffer layer at least partially covering the insulating layer;
a first terminal electrode and a second terminal electrode extended from the third surface and the fourth surface of the capacitor body to the buffer layer, respectively, and spaced apart from each other; and
a first external electrode and a second external electrode disposed on the third surface and the fourth surface of the capacitor body, respectively, so that on a same side of the capacitor body at least a portion of at least one of the insulating layer or the buffer layer is arranged between at least one of the first external electrode or the second external electrode and at least one of the first terminal electrode or the second terminal electrode, respectively.

US Pat. No. 10,009,007

BULK ACOUSTIC WAVE RESONATOR WITH A MOLYBDENUM TANTALUM ALLOY ELECTRODE AND FILTER INCLUDING THE SAME

Samsung Electro-Mechanics...

1. A bulk acoustic wave resonator comprising:a substrate;
a first electrode and a second electrode disposed on the substrate; and
a piezoelectric layer disposed between the first electrode and the second electrode,
wherein at least one of the first electrode and the second electrode includes an alloy of molybdenum and tantalum, wherein a content of the tantalum (Ta) is 0.1 to 30 atm %.

US Pat. No. 9,907,157

NOISE BLOCKING PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Samsung Electro-Mechanics...

1. A printed circuit board comprising:
a core layer comprising a cavity provided therein;
an electronic component disposed in the cavity;
a conductive partition formed on side surfaces of the cavity;
a conductive shielding layer formed on either one of a lower surface of the electronic component and an upper surface of the
electronic component;

insulating layers disposed on and below the core layer; and
discharging vias penetrating through the insulating layers and electrically connected to the conductive partition,
wherein the conductive shielding layer contacts the discharging vias, and
wherein a space formed between the conductive partition and the electronic component is filled with one of the insulating
layers.

US Pat. No. 9,894,764

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A printed circuit board comprising:
an insulating layer;
a circuit layer embedded in the insulating layer;
a solder resist layer disposed on one surface of the insulating layer, the solder resist layer having a cavity of a through-hole
shape to expose a part of the circuit layer from the insulating layer; and

a metal post embedded in the solder resist layer and exposed to outside via an opening of the solder resist layer,
wherein the metal post comprises a first post metal layer, a post barrier layer, and a second post metal layer disposed in
that order, and

wherein the post barrier layer is formed of a material that is different from that of the first post metal layer and the second
post metal layer.

US Pat. No. 9,832,884

CONDUCTIVE BALL MOUNTING DEVICE

Samsung Electro-Mechanics...

1. A conductive ball mounting device for mounting a conductive ball on a printed circuit board comprising:
a mask having a thickness equal to or larger than a diameter of a conductive ball and having an opening formed in the mask
and configured to be in contact with a printed circuit board so as to mount the conductive ball on the printed circuit board,
wherein the conductive ball is absorbed and desorbed into and from the opening;

a frame having a vacuum hole formed in the frame and formed to enclose sides and an upper portion of the mask; and
a porous member formed between the frame and the upper portion of the mask,
wherein the opening has a width and a depth equal to or larger than the diameter of the conductive ball,
wherein the vacuum hole and the opening are connected with each other through the porous member, and
wherein the frame includes:
an upper frame positioned on the mask; and
a side frame positioned at the side of the mask and having an upper half coupled to the upper frame to support the upper frame.

US Pat. No. 9,455,085

MULTILAYER CERAMIC DEVICE HAVING A CRACK GUIDE PATTERN

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic device, comprising:
a device body having sides which are spaced apart from each other and a circumferential surface which connects the sides;
an internal electrode disposed in a longitudinal direction of the device body within the device body;
an external electrode having a front part which covers the sides and a band part which extends from the front part to cover
a portion of the circumferential surface; and

a crack guide pattern disposed within the device body and guiding a progress direction of cracks occurring at the circumferential
surface to the sides,

wherein the crack guide pattern includes:
a metal pattern; and
an oxide layer formed on a surface of the metal pattern,
wherein a ratio of a thickness of the oxide layer and a thickness of the crack guide pattern is larger than 0.004 and smaller
than 0.760, and

wherein the metal pattern includes nickel (Ni) metal and the oxide layer is a nickel oxide layer.

US Pat. No. 9,449,766

COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

SAMSUNG ELECTRO-MECHANICS...

20. A composite electronic component, comprising:
an input terminal receiving power converted by a power management unit;
a power stabilization unit stabilizing the power and including a composite body having a hexahedral shape and including a
capacitor and an inductor which are coupled to each other, the capacitor having a ceramic body in which a plurality of dielectric
layers and internal electrodes disposed to face each other with at least one of the dielectric layers interposed therebetween
are stacked, and the inductor having a magnetic body in which a plurality of magnetic layers having conductive patterns are
stacked;

an output terminal supplying the stabilized power; and
a ground terminal for grounding,
wherein the input terminal has a first dummy electrode disposed on a first end surface of the ceramic body and a third external
electrode disposed on a first end surface of the magnetic body and connected to the conductive pattern, the first dummy electrode
and the third external electrode being connected to each other,

the output terminal includes a first output terminal having a second dummy electrode disposed on a second end surface of the
ceramic body and a fourth external electrode disposed on a second end surface of the magnetic body and connected to the conductive
pattern, the second dummy electrode and the fourth external electrode being connected to each other, and a second output terminal
having a second external electrode formed on a second side surface of the ceramic body and electrically connected to the second
internal electrodes and a fourth dummy electrode formed on a second side surface of the magnetic body, the second external
electrode and the fourth dummy electrode being connected to each other, and

the ground terminal has a first external electrode disposed on a first side surface of the ceramic body and electrically connected
to the first internal electrodes and a third dummy electrode disposed on a first side surface of the magnetic body, the first
external electrode and the third dummy electrode being connected to each other.

US Pat. No. 9,418,789

MULTILAYER CERAMIC ELECTRONIC COMPONENT

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic electronic component comprising:
a ceramic body including an active part in which dielectric layers and internal electrodes are alternately disposed, an upper
cover part disposed on an upper portion of the active part, and a lower cover part disposed on a lower portion of the active
part;

a first dummy electrode disposed between a central portion of the upper or lower cover part in a length direction and one
end surface of the upper or lower cover part in the length direction; and

a second dummy electrode disposed between the central portion of the upper or lower cover part in the length direction and
the other end surface of the upper or lower cover part in the length direction, and spaced apart from the first dummy electrode,

wherein 0.01?G/L1?0.2, where L1 is a length of the ceramic body, and G is an interval between the first and second dummy electrodes spaced from each other,

a thickness of the first and second dummy electrodes is equal to or greater than 1.5 ?m,
the thickness of the first and second dummy electrodes is greater than that of the internal electrodes, and
an interval between the first and second dummy electrodes is greater than that between the internal electrodes.

US Pat. No. 9,355,780

MULTILAYER CERAMIC CAPACITOR, AND CIRCUIT BOARD HAVING MULTILAYER CERAMIC CAPACITOR EMBEDDED THEREIN

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor comprising:
a 1005-sized ceramic body including a dielectric layer and a cover layer;
first and second internal electrodes disposed to face each other, while having the dielectric layer interposed therebetween;
and

a first external electrode electrically connected to the first internal electrode and a second external electrode electrically
connected to the second internal electrode,

wherein in a length-thickness (L-T) cross-section of the ceramic body, in the case in which a square is defined as including
sides parallel to a central portion of a first main surface of the ceramic body, and vertices disposed in a diagonal direction
on outer surfaces of the ceramic body, the sides having a length of 30 ?m, when an area of a region of the square not occupied
by the ceramic body is defined as A-out and a thickness of the cover layer is defined as t, the following Equations are satisfied:
9 ?m2?A-out and A-out/t?3.7 ?m.

US Pat. No. 9,287,220

SEMICONDUCTOR PACKAGE

Samsung Electro-Mechanics...

1. A semiconductor package, comprising:
a first substrate having an first electronic device mounted on one surface of the first substrate and a second electronic
device mounted on another surface of the first substrate facing the one surface;

a first molding part sealing the second electronic device;
a first shielding film formed on an external surface of the first molding part; and
a second substrate bonded to the one surface of the first substrate and including an insertion part in which the first electronic
device mounted on the one surface of the first substrate is inserted,

wherein the second substrate includes a ground via, a first shielding wall which is formed along an inner wall of the second
substrate, and

a ground pattern connecting the ground via with the first shielding wall,
wherein the first substrate includes a ground layer formed therein and connected to the first shielding film and the ground
via,

wherein the first electronic device includes at least one of a passive device and an active device, and
wherein the second electronic device includes at least one of a passive device and an active device.

US Pat. No. 9,196,421

MULTILAYER CERAMIC ELECTRONIC COMPONENT

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic electronic component, comprising:
a ceramic body including dielectric layers;
external electrodes formed on external surfaces of the ceramic body; and
two internal electrodes adjacent to each other with a gap therebetween on a single dielectric layer, each of the two internal
electrodes having a first convex-shape side adjacent to the other internal electrode and a second convex-shape side opposite
to the first convex-shape side and two flat-shape sides connecting the two convex-shape side,

wherein the gap between the first convex-shape of the two internal electrodes becomes narrower toward a central portion of
the first convex-shape from the end of the first convex-shape side.

US Pat. No. 9,178,389

WIRELESS POWER TRANSMISSION SYSTEM AND METHOD OF CONTROLLING THE SAME

Samsung Electro-Mechanics...

1. A wireless power transmission apparatus, comprising:
a transmission communication unit receiving a code including a charging status of a battery;
a transmission unit generating and transmitting power for charging the battery;
a transmission control unit detecting the charging status of the battery by using the transmitted power, and, if the charging
status of the battery is in a damage section due to reflective power, controlling the transmission unit to transmit power
lower than power of a normal operation, and if the charging status of the battery is not in the damage section due to the
reflective power, controlling the transmission unit to transmit the power of the normal operation,

wherein the damage section due to the reflective power is a section in which a constant current (CC) mode in which the battery
is charged constant current is converted into a constant voltage (CV) mode in which the battery is charged with constant voltage.

US Pat. No. 9,112,353

POWER SUPPLY DEVICE

SAMSUNG ELECTRO-MECHANICS...

1. A power supply device, comprising:
a conversion unit converting an applied voltage into a predetermined level;
a switching unit performing an opening operation or a closing operation to control a current flowing in the conversion unit;
a sensing unit sensing an occurrence of overcurrent when a voltage applied to the switching unit is equal to or larger than
a reference voltage set in advance; and

a control unit performing a protection operation when the overcurrent is sensed again within a protection time set in advance
after a predetermined time is delayed from the time at which the overcurrent is sensed,

wherein the control unit comprises a time delay device that detects the time delayed from the time at which the overcurrent
is sensed to thereby allow the control unit to determine whether the predetermined time is delayed, and determines whether
the overcurrent is sensed again within the protection time,

wherein the time delay device comprises a counter that counts the number of times for each fixed time from the time at which
the overcurrent is sensed to thereby determine whether the predetermined time is delayed,

wherein the counter sequentially outputs a plurality of count signals at a high level to a plurality of output terminals by
counting the number of times for each fixed time from the time at which the overcurrent is sensed, and

wherein the time delay device further comprises a first AND gate that performs an AND operation on the plurality of count
signals output from the plurality of output terminals to output a first gate signal.

US Pat. No. 10,798,825

PRINTED CIRCUIT BOARD

Samsung Electro-Mechanics...

1. A printed circuit board comprising:an insulating material; and
a circuit, formed on a surface of the insulating material, comprising
a seed layer formed on the surface of the insulating material,
an anti-reflection layer formed on the seed layer, and
an electroplating layer formed on the anti-reflection layer.

US Pat. No. 10,147,545

CERAMIC COMPOSITION AND MULTILAYER CAPACITOR HAVING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer capacitor comprising:a capacitor body having an active region including a plurality of dielectric layers and first and second internal electrodes alternately disposed with the plurality of dielectric layers interposed therebetween and respectively exposed to opposite surfaces of the capacitor body and cover layers disposed on upper and lower surfaces of the active region; and
first and second external electrodes electrically connected to the exposed portions of the first and second internal electrodes on the capacitor body, respectively,
wherein a phosphor (P) is dispersed among a non-phosphor material in the cover layers of the capacitor body, and
wherein at least one of the uppermost internal electrode and the lowermost internal electrode, from among the alternately disposed first and second internal electrodes, has a first surface directly contacting a cover layer having the phosphor (P) dispersed therein and a second surface opposing the first surface and directly contacting a dielectric layer of the plurality of dielectric layers that does not include the phosphor (P).

US Pat. No. 10,141,267

FAN-OUT SEMICONDUCTOR PACKAGE

SAMSUNG ELECTRO-MECHANICS...

1. A fan-out semiconductor package comprising:a first connection member including a redistribution layer;
a first semiconductor chip disposed on the first connection member and having an active surface having a first connection pad disposed thereon and an inactive surface opposing the active surface;
a first encapsulant disposed on the first connection member and encapsulating at least portions of the first semiconductor chip;
a second semiconductor chip disposed on the first encapsulant and having an active surface having a second connection pad disposed thereon and an inactive surface opposing the active surface;
a second encapsulant disposed on the first encapsulant and encapsulating at least portions of the second semiconductor chip; and
a second connection member having a through-hole,
wherein the active surfaces of the first semiconductor chip and the second semiconductor chip face the first connection member,
the first connection pad and the second connection pad are electrically connected to the redistribution layer of the first connection member through a first via and a second via that do not overlap each other, respectively,
the first semiconductor chip is disposed in the through-hole of the second connection member, and
the first encapsulant encapsulates at least portions of the second connection member.

US Pat. No. 10,116,150

CONDUCTIVE PLATE AND ELECTRONIC DEVICE HAVING THE SAME

Samsung Electro-Mechanics...

1. A conductive plate of a terminal disposed on a side of a coil substrate for wirelessly charging the terminal, comprising:metal members each having a plate shape; and
an insulating layer disposed on a surface of at least one of the metal members to insulate the metal members from each other,
wherein the metal members are coupled to each other to configure a planar contour surface.

US Pat. No. 10,116,169

WIRELESS POWER TRANSMITTER AND METHOD FOR CONTROLLING RESONANCE FREQUENCY USING THE SAME

Samsung Electro-Mechanics...

1. A wireless power transmitter, comprising:resonators electrically connected to each other; and
a resonance frequency varying unit configured to vary resonance frequencies of the resonators based on a change in an amount of power to be sent to a wireless power receiver from the wireless power transmitter,
wherein upon the amount of power to be sent to the wireless power receiver being an amount greater than or equal to a first threshold value, the resonance frequency varying unit is configured to increase the resonance frequencies of the resonators, and upon the amount of power to be sent to the wireless power receiver being an amount less than or equal to a second threshold value which is smaller than the first threshold value, the resonance frequency varying unit is configured to decrease the resonance frequencies of the resonators.

US Pat. No. 10,009,011

IMPEDANCE MATCHING CIRCUIT OF POWER AMPLIFIER

Samsung Electro-Mechanics...

1. An impedance matching circuit, comprising:a multilayer substrate comprising a power amplifier;
a microstrip line disposed on a first layer substrate and connected to the power amplifier;
a spiral inductor comprising a first spiral transmission line disposed on the first layer substrate and connected to the microstrip line, a second spiral transmission line disposed on a substrate layer below the first layer substrate and connected to the first spiral transmission line, and an output pad disposed on the first layer substrate and connected to the second spiral transmission line;
a first capacitor circuit disposed outside the spiral inductor and connected between the microstrip line and a ground; and
a second capacitor circuit disposed outside the spiral inductor and connected between the output pad and the ground.

US Pat. No. 9,892,841

INDUCTOR

SAMSUNG ELECTRO-MECHANICS...

1. An inductor comprising:
a ceramic main body on which first ceramic sheets and second ceramic sheets are alternately stacked, a primary conductor pattern
being formed on each first ceramic sheet and a secondary conductor pattern being formed on each second ceramic sheet;

first vias passing through each interlayered second ceramic sheet, connecting the primary conductor patterns on both first
ceramic sheets adjacent to the interlayered second ceramic sheet and being consisted of a first inner via(s) and a first outer
via(s), the first inner via connecting inner ends of the primary conductor patterns on the both first ceramic sheets and the
first outer via connecting outer ends of the primary conductor patterns on the both first ceramic sheets;

second vias passing through each interlayered first ceramic sheet, connecting the secondary conductor patterns on both second
ceramic sheets adjacent to the interlayered first ceramic sheet and being consisted of a second inner via(s) and a second
outer via(s), the second inner via connecting inner ends of the secondary conductor patterns on the both second ceramic sheets
and the second outer via connecting outer ends of the secondary conductor patterns on the both second ceramic sheets;

external electrodes provided in a side surface(s) of the ceramic main body,
first via holes formed in a point away from the primary conductor pattern in each first ceramic sheet and consisted of a first
inner via hole(s) through which the second inner vias pass and a first outer via hole(s) formed on an outside area of the
primary conductor pattern and through which the second outer vias pass; and

second via holes formed in a point away from the secondary conductor pattern in each second ceramic sheet and consisted of
a second inner via hole(s) through which the first inner vias pass and a second outer via hole(s) formed on an outside area
of the secondary conductor pattern and through which the first outer vias pass,

wherein the first inner via hole, the second outer via hole, the first outer via hole and the second inner via hole are arrayed
in order by four ceramic sheets and the second outer via hole and the first outer via hole are located in a diagonal direction,

wherein the primary conductor pattern on the interlayered first ceramic sheet through which the second outer via passes has
a pattern detouring to the first via hole and the secondary conductor pattern on the interlayered second ceramic sheet through
which the first outer via passes has a pattern detouring to the second via hole, and

wherein the first outer via hole, disposed in the first ceramic sheet having the primary conductor pattern comprising the
pattern detouring to the first via hole, and the second outer via hole, disposed in the second ceramic sheet having the second
conductor pattern comprising the pattern detouring to the second via hole, are disposed diagonally from each other.

US Pat. No. 9,876,445

PIEZOELECTRIC ENERGY HARVESTER AND WIRELESS SWITCH INCLUDING THE SAME

Samsung Electro-Mechanics...

1. A piezoelectric energy harvester comprising:
a plate that is elastically deformable;
a piezoelectric element situated on the plate;
a magnet situated to be spaced apart from the plate; and
an insulator movably situated between the plate and the magnet,
wherein the plate is elastically deformed by a magnetic force of the magnet.

US Pat. No. 9,730,316

MOBILE DEVICE AND MANUFACTURING METHOD THEREOF

Samsung Electro-Mechanics...

1. A mobile device comprising: a multi-layer circuit board comprising a plurality of circuit pattern layers and a plurality
of dielectric layers and having a cavity formed on a lateral surface thereof toward an inside thereof; an electrode pad laminated
in the cavity and configured to be electrically connected with the circuit pattern layers; and a conductive switch formed
on an external peripheral portion of the cavity of the multi-layer circuit board in such a way that the conductive switch
is separated from the electrode pad and is contactable with the electrode pad by an external force, wherein the electrode
pad is laminated in plurality in the cavity, and wherein the conductive switch is formed to be selectively contacted with
the plurality of electrode pads.

US Pat. No. 9,673,843

FRONT END MODULE

Samsung Electro-Mechanics...

23. A front end module comprising:
a first band amplifying processor, connected to a first antenna, configured to amplify or bypass first reception signals in
a first frequency band received through the first antenna;

a second band amplifying processor, connected to a second antenna, configured to amplify or bypass second reception signals
in a second frequency band received through the second antenna; and

a controller configured to output separate control voltages to the first and second band amplifying processors to control
the first and second band amplifying processors,

wherein the first band amplifying processor is configured to transmit first transmission signals to the first antenna, the
second band amplifying processor is configured to selectively: transmit second transmission signals to the second antenna,
and to perform near field wireless communications in the second frequency band, and

wherein the controller is configured to generate third and fourth control voltages to distinguish amplification and bypass
of the second reception signals, transmission of the second transmission signals, and near field wireless communications in
the second frequency band of the second band amplifying processor from each other.

US Pat. No. 9,424,988

COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A method of manufacturing a common mode filter comprising:
preparing a lower substrate, an upper substrate, and an insulating layer having a conductor pattern inside;
laminating the lower substrate, the upper substrate, and the insulating layer;
forming a hole penetrating the insulating layer and the lower substrate or the upper substrate; and
forming a ferrite core made of ferrite in the hole.