US Pat. No. 10,660,212

ELEMENT SUBMOUNT AND METHOD FOR MANUFACTURING THE SAME

XSENSE TECHNOLOGY CORPORA...

1. An element submount, comprising:a substrate including a first surface and a second surface opposite to the first surface;
a first conductive heat-dissipating layer formed on the first surface;
a second conductive heat-dissipating layer formed on the first surface and separated from the first conductive heat-dissipating layer;
a first heat-dissipating layer formed on the second surface; and
an element bonding layer formed on the second conductive heat-dissipating layer, wherein an edge of at least one side of the element bonding layer extends beyond an edge of the second conductive heat-dissipating layer and partially covers a side of the second conductive heat-dissipating layer.