US Pat. No. 10,512,170

HIGHLY CONDUCTIVE TRANSPARENT GLASS-BASED CIRCUIT BOARD

WUHAN HUASHANG GREEN TECH...

1. A highly conductive transparent glass-based circuit board, comprising:a glass substrate, being a glass-tempered substrate,
wherein a surface of the glass-tempered substrate faces air, and a conductive paste, printed on the surface of the glass-tempered substrate, is baked, heated, and cooled to form a conductive circuit fused with the surface of the glass substrate;
wherein the conductive circuit is made essentially of a graphene layer or a conductive layer having a graphene upper portion and a metal lower portion fused with the glass substrate, and a surface of the graphene upper portion is fused with a surface of the metal lower portion;
wherein a surface of the conductive circuit, except a region reserved for a solder pad used for welding a component, is covered with a printed-circuit-board (PCB) organic solder-resistant layer;
wherein the conductive paste includes conductive powder, low temperature glass powder, ethyl cellulose, terpineol, and dibutyl maleate at a mass ratio of 65 to 75:3:5 to 10:10 to 20:1 to 3, and the conductive powder is graphene powder or a mixture of metal powder and graphene powder; and
wherein, when the conductive powder is the mixture of metal powder and graphene powder, the graphene powder accounts for 2% to 5% by mass of the conductive paste.

US Pat. No. 10,406,782

HIGHLY CONDUCTIVE TRANSPARENT LAMINATED GLASS ARTICLE

WUHAN HUASHANG GREEN TECH...

1. A highly conductive transparent laminated glass article, comprising:two glass plates, at least one of the two glass plates being a highly conductive transparent glass-based circuit board with a glass substrate; and
an adhesive film, having a material of Poly(Vinyl Butyral) (PVB) resin and located between the two glass plates,
wherein a surface of the glass substrate is not contact with the adhesive film, and a conductive paste, printed on the surface of the glass substrate, is baked, heated, and cooled to form a conductive circuit fused with the surface of the glass substrate;
wherein the conductive circuit is made essentially of a graphene layer or a conductive layer having a graphene upper portion and a metal lower portion fused with the glass substrate, and a surface of the graphene upper portion is fused with a surface of the metal lower portion;
wherein the glass substrate is a glass-tempered substrate, and a surface of the conductive circuit, except a region reserved for a solder pad used for welding a component, is covered with a printed-circuit-board (PCB) organic solder-resistant layer;
wherein the conductive paste includes conductive powder, low temperature glass powder, ethyl cellulose, terpineol, and dibutyl maleate at a mass ratio of 65 to 75:3:5 to 10:10 to 20:1 to 3, and the conductive powder is graphene powder or a mixture of metal powder and graphene powder;
wherein, when the conductive powder is the mixture of metal powder and graphene powder, the graphene powder accounts for 2% to 5% by mass of the conductive paste; and
wherein a surface of the glass-tempered substrate faces air, and the conductive paste, printed on the surface of the glass-tempered substrate, is baked at a temperature between 120 and 150° C. for 100 to 200 seconds, placed at a temperature between 550 and 600° C. for 300 to 360 seconds, then placed at a temperature between 710 and 730° C. for 120 to 220 seconds, and finally cooled to form the conductive circuit fused with the surface of the glass-tempered substrate.