US Pat. No. 9,379,153

METHOD FOR FORMING IMAGE SENSING DEVICE

VisEra TECHNOLOGIES COMPA...

1. A method for forming an image sensing device, comprising:
providing a molding apparatus;
disposing a lens in the molding apparatus;
injecting an injection material into a chamber of the molding apparatus to form a shell which is connected to the lens; and
assembling the shell with an image sensing element,
wherein the lens is formed before injecting the injection material into the chamber; and
wherein the injection material is doped with a plurality of metal particles.

US Pat. No. 9,350,906

ENCAPSULANT MODULE WITH OPAQUE COATING

OMNIVISION TECHNOLOGIES, ...

1. An encapsulant module for an image sensor device, comprising:
an outer frame comprising an enclosing wall and a first opening open to an exterior of the encapsulant module surrounded by
the enclosing wall;

a set of lenses directly connecting to the enclosing wall and configured with an aperture module;
an opaque coating overlying the enclosing wall and the aperture module, wherein the opaque coating comprises a coating opening
aligned with an aperture opening of the aperture module such that the opaque coating shields parts of regions over the set
of lenses; and

a flat transparent substrate, between the set of lenses and the first opening, wherein the footprint of the transparent substrate
is substantially the same as that of the set of lenses.

US Pat. No. 9,252,179

IMAGE SENSOR STRUCTURES

VisEra Technologies Compa...

1. An image sensor structure, comprising:
a substrate comprising a central area and a peripheral area;
a sensing area comprising a plurality of pixels located at the central area of the substrate;
a plurality of bond pads disposed at the peripheral area of the substrate; and
a plurality of protrusions disposed between the bond pads and the sensing area and surrounding the sensing area, wherein each
protrusion has one largest distance between any two points thereof under a plan view, and such largest distances are getting
smaller from the peripheral area to the central area.

US Pat. No. 9,128,218

MICROLENS STRUCTURE AND FABRICATION METHOD THEREOF

VisEra Technologies Compa...

1. A method of forming a microlens structure, comprising:
forming a microlens element having a first refraction index;
conformally depositing a first film on the microlens element by a chemical vapor deposition at a process temperature lower
than 200° C. to form a SiO2 film, wherein the first film has a second refraction index less than the first refraction index, and an initial film of the
first film of the SiO2 film is formed by a plasma enhanced chemical vapor deposition process using a gas source of tetraethyl orthosilicate (TEOS)
and O2, a radio frequency (RF) power less than 250 watt and an O2 flow rate of 250-1000 standard cubic centimeter per minute (sccm); and

conformally depositing a second film on the first film, wherein the second film has a third refraction index less than the
second refraction index and greater than a refraction index of air.

US Pat. No. 9,348,019

HYBRID IMAGE-SENSING APPARATUS HAVING FILTERS PERMITTING INCIDENT LIGHT IN INFRARED REGION TO BE PASSED TO TIME-OF-FLIGHT PIXEL

VISERA TECHNOLOGIES COMPA...

1. An image-sensing apparatus, comprising:
an optical filter array including a two-band passing filter and an infrared filter;
an RGB pixel array placed below the two-band passing filter; and
a ToF pixel array adjacent to the RGB pixel array and placed below the two-band passing filter and the infrared filter, wherein
a combination of the two-band passing filter and the infrared passing filter permits only the incident light in the infrared
region to pass to the ToF pixel array, and wherein a transparent filling layer is placed between the ToF pixel array and the
infrared filter.

US Pat. No. 9,293,488

IMAGE SENSING DEVICE

VisEra Technologies Compa...

1. An image sensing device, comprising:
a semiconductor substrate with a photo-sensing element;
a passive layer disposed over the semiconductor substrate, having a first refractive index;
a color pattern disposed over the passive layer, wherein the color pattern aligns to the photo-sensing element and has a color
selected from the group consisting of red (R), green (G), blue (B), and white (W), and a second refractive index; and

an electromagnetic wave guiding element disposed in at least one of the color pattern and the passive layer, wherein the electromagnetic
wave guiding element has a third refractive index, and the third refractive index is greater than the first refractive index
or the second refractive index, and a first difference between the third refractive index and the first refractive index is
at least 0.2, and a second difference between the third refractive index and the second refractive index is at least 0.2,

wherein a top surface area of the electromagnetic wave guiding element is substantially equal to or less than a bottom surface
area of the electromagnetic wave guiding element.

US Pat. No. 9,425,227

IMAGING SENSOR USING INFRARED-PASS FILTER FOR GREEN DEDUCTION

VisEra Technologies Compa...

1. An imaging sensor, comprising:
a filter array for extracting a plurality of color components of an incident light; and
photoelectric elements for receiving the incident light via the filter array,
wherein the filter array comprises:
a green filter for extracting a green component from the plurality of color components;
a red filter for extracting a red component from the plurality of color components;
a blue filter for extracting a blue component from the plurality of color components; and
a first infrared filter for extracting a first infrared component, wherein the first infrared filter comprises a material
of the green filter and a material of an infrared high-pass filter of a specific wavelength.

US Pat. No. 9,219,893

METHOD FOR CORRECTING PIXEL INFORMATION OF COLOR PIXELS ON A COLOR FILTER ARRAY OF AN IMAGE SENSOR

VisEra Technologies Compa...

17. A method for correcting pixel information of color pixels on a color filter array of an image sensor, the color filter
array including a plurality of pixel arrays, each pixel array consisting of a four (4) N×N pixel units, N being an integer
equal to or larger than 2, each N×N pixel unit having a plurality of white pixels and at least one color pixel, the at least
one color pixel including one or more red pixels, one or more green pixels, one or more blue pixels, or any combination thereof,
the number of the at least one color pixel in each of the four (4) N×N pixel units being the same, the number of the at least
one color pixel in each of the four (4) N×N pixel units being smaller than the number of the plurality of white pixels in
each of the four (4) N×N pixel units, the method comprising:
establishing an M×M distance factor table having M×M distance factors (dfij);

selecting M×M pixels of the color filter array, wherein the M×M pixels of the color filter array cover at least two red pixels,
at least two green pixels, at least two blue pixels, and a target pixel, and the target pixel is a center pixel of the M×M
pixels of the color filter array; and

calculating a blue-color contribution (Baverage) from the at least two blue pixels to the target pixel in the MxM pixels of the color filter array by using the distance
factors of the M×M distance factor table and measured pixel information (Bij) of each of the at least two blue pixels.

US Pat. No. 9,332,235

IMAGING CAPTURE APPARATUS HAVING PLURALITY OF IMAGE SENSORS GENERATING RESPECTIVE IMAGE SIGNALS BASED ON EMITTED LIGHT AREAS

VisEra Technologies Compa...

1. An imaging apparatus, comprising:
a first filter transmitting a first light in a first range of wavelengths and reflecting a first reflected light out of the
first range of wavelengths, wherein an incident light is split to the first light and the first reflected light;

a first image sensor receiving the first light to generate a first image signal;
a second filter receiving the first reflected light, transmitting a second light in a second range of wavelengths and reflecting
a second reflected light out of the second range of wavelengths, wherein the first reflected light is split to the second
light and the second reflected light by the second filter;

a second image sensor receiving the second light to generate a second image signal; and
a third image sensor receiving the second reflected light to generate a third image signal,
wherein the first filter is separated from the second filter,
wherein the first image sensor comprises a plurality of first sensing units arranged in an array, and the first sensing units
respectively generate a plurality of first pixel signals according to the first light,

wherein the first light emitted to the first image sensor forms a circular first light area within an area of the first image
sensor, and a square area is defined within the first light area and formed by only a portion of the plurality of the first
sensing units, the first image signal is formed by the first pixel signals generated by the portion of the plurality of the
first sensing units, which are wholly located in the square area, and

wherein four corners of the square area are adjacent to a circumference of the circular first light area.

US Pat. No. 9,281,333

SOLID-STATE IMAGING DEVICES HAVING LIGHT SHIELDING PARTITIONS WITH VARIABLE DIMENSIONS

VisEra TECHNOLOGIES COMPA...

11. A solid-state imaging device, comprising:
a substrate containing a plurality of photoelectric conversion elements;
a color filter layer disposed above the photoelectric conversion elements;
a passivation layer disposed below the color filter layer;
a light shielding layer disposed between the color filter layer and the substrate, and having a plurality of first light shielding
partitions extended along a first direction and a plurality of second light shielding partitions extended along a second direction
perpendicular to the first direction; and

a microlens structure disposed above the color filter layer,
wherein each distance from a center of the light shielding layer to an edge of the light shielding layer between two adjacent
first light shielding partitions is different along the second direction and each distance from the center of the light shielding
layer to the edge of the light shielding layer between two adjacent second light shielding partitions is different along the
first direction, and

wherein the passivation layer has a thickness that is greater than a height of the light shielding layer.

US Pat. No. 9,502,461

METHODS OF FABRICATING CAMERA MODULE AND SPACER OF A LENS STRUCTURE IN THE CAMERA MODULE

VISERA TECHNOLOGIES COMPA...

1. A method for fabricating a camera module, comprising:
providing a first carrier;
forming a first base pattern on the first carrier;
attaching a first dry film photoresist on the first carrier and the first base pattern;
performing a lamination process to planarize the first dry film photoresist;
patterning the first dry film photoresist to form a first spacer;
providing a first transparent substrate having a plurality of first lenses formed on a first surface of the first transparent
substrate;

stripping the first spacer from the first carrier;
attaching the first spacer on the first surface of the first transparent substrate to surround each of the first lenses to
form a first lens structure; and

bonding a plurality of image sensor device chips.

US Pat. No. 9,412,775

SOLID-STATE IMAGING DEVICES AND METHODS OF FABRICATING THE SAME

VISERA TECHNOLOGIES COMPA...

1. A solid-state imaging device, comprising:
a substrate containing a first photoelectric conversion element and a second photoelectric conversion element formed therein;
a color filter layer having a first color filter component disposed above the first photoelectric conversion element and a
second color filter component disposed above the second photoelectric conversion element;

a light-shielding partition disposed between the first color filter component and the second color filter component, wherein
the light-shielding partition has a height lower than that of the first and second color filter components and does not overlap
with the first and second color filter components, and the light-shielding partition is separated from the first color filter
component and the second color filter component;

a buffer layer disposed between the first color filter component and the second color filter component and above the light-shielding
partition, wherein the buffer layer has a refractive index lower than that of the color filter layer; and

a microlens structure disposed above the color filter layer, wherein the buffer layer has the refractive index higher than
that of the microlens structure.

US Pat. No. 9,231,012

IMAGE SENSOR PACKAGE

VISERA TECHNOLOGIES COMPA...

1. A package for an image sensor, comprising:
a first substrate comprising an upper surface and a lower surface opposite the upper surface;
a via formed in the first substrate;
a driving circuit formed on the upper surface of the first substrate and electrically connected to the via;
a second substrate comprising a first surface and a second surface opposite the first surface, wherein the second substrate
is bonded to the first substrate through conductive pads, a photosensitive device is formed on the first surface of the second
substrate, and the photosensitive device is electrically connected to the driving circuit;

a support member formed on the second surface of the second substrate;
a covering plate disposed on the second surface of the second substrate; and
a solder ball formed on the lower surface of the first substrate and electrically connected to the via.

US Pat. No. 9,240,428

IMAGE SENSOR AND MANUFACTURING METHOD THEREOF

VisEra Technologies Compa...

8. A manufacturing method of image sensors, comprising:
forming a filter unit on a sensing layer;
emitting a light beam to the filter unit to give the filter unit a gradient refractive index; and
forming a microlens on the filter unit.

US Pat. No. 9,972,651

SPECTRUM-INSPECTION DEVICE

VISERA TECHNOLOGIES COMPA...

1. A spectrum-inspection device, comprising:a multi-band pass filter allowing a first waveband, a second waveband, and a third waveband of a light beam to pass through, wherein the light beam passing through the multi-band pass filter forms a multi-band beam;
a filter array, disposed under the multi-band pass filter, comprising:
a first filter allowing wavelengths of the multi-band beam longer than a first wavelength to pass through;
a second filter allowing wavelengths of the multi-band beam longer than a second wavelength to pass through; and
a third filter allowing wavelengths of the multi-band beam longer than a third wavelength to pass through; and
a sensing layer, disposed under the filter array, generating a first strength signal, a second strength signal, and a third strength signal according to a strength of the multi-band beam passing through the filter array and falling on the sensing layer,
wherein the second waveband is between the first wavelength and the second wavelength, and the third waveband is between the second wavelength and the third wavelength,
wherein a first strength value is generated according to the first strength signal, a second strength value is generated according to the second strength signal, and a third strength value is generated according to the third strength signal,
wherein a first spectrum value corresponding to the first waveband is obtained according to the first strength value, a second spectrum value corresponding to the second waveband is obtained by the second strength value minus the first strength value, a third spectrum value corresponding to the third waveband is obtained by the third strength value minus the second strength value.

US Pat. No. 9,502,453

SOLID-STATE IMAGING DEVICES

VISERA TECHNOLOGIES COMPA...

1. A solid-state imaging device, comprising:
a color filter including a first color filter segment having a first height measured from a bottom surface of the first color
filter segment to a top surface of the first color filter segment; and a second color filter segment having a second height
measured from a bottom surface of the second color filter segment to a top surface of the second color filter segment;

a partition disposed between the first and second color filter segments and having a third height measured from a bottom surface
of the partition to a top surface of the partition, wherein the partition has a refractive index lower than those of the first
and second color filter segments, and the third height is smaller than the first and second heights; and

a color filter underlying layer disposed between the color filter and a semiconductor substrate,
wherein the color filter underlying layer is surrounded by the partition and the color filter underlying layer comprises an
anti-current leakage layer formed on the semiconductor substrate and an anti-reflection layer formed on the anti-current leakage
layer, and the color filter is in direct contact with the anti-reflection layer,

wherein the partition is formed on the semiconductor substrate and the bottom of the partition is disposed on the top surface
of the semiconductor substrate, and

wherein each of the first and second color filter segments includes a flat bottom surface, a side surface in contact with
the partition and an upper portion above the side surface, each of the upper portions includes an inclined surface from the
top surface of the partition toward each of the top surfaces of the first and second color filter segments, the inclined surfaces
of the first and second color filter segments are connected at a contact point directly on the top surface of the partition
and completely cover the top surface of the partition.

US Pat. No. 9,559,137

COLOR FILTER OF ILLUMINATION IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME

VISERA TECHNOLOGIES COMPA...

1. A color filter of an illumination image sensor, comprising:
a light shield portion constructed by grid photoresist patterns, wherein the light shield portion covers a periphery region
of an illumination image sensor chip, wherein the grid photoresist patterns are arranged in an array, and wherein the two
adjacent grid photoresist patterns are separated from each other by a gap.

US Pat. No. 9,516,286

COLOR CORRECTION DEVICES AND METHODS

VisEra Technologies Compa...

1. A color correction device for an image sensor which is divided into a plurality of regions, comprising:
a quantum efficiency measurement circuit generating a color signal according to a sensing signal from each of a plurality
of pixels of the image sensor;

an addressing circuit receiving the color signal corresponding to each pixel, obtaining a location of each pixel on the image
sensor, and averaging all of the color signals corresponding to the pixels whose locations are disposed in one of the regions
to obtain an average color signal;

a correction circuit receiving the average color signal to obtain a color correction matrix of the one of the regions and
correcting the color signals of the pixels whose locations are in the one of the regions by the color correction matrix; and

a classifier circuit receiving the sensing signal corresponding to each pixel to determine a type of a light source which
is illuminating the image source and generating an ideal color information signal according to a result of determining the
type of the light source.

US Pat. No. 9,484,385

METHOD FOR FABRICATING AN IMAGE SENSOR PACKAGE

VisEra Technologies Compa...

1. A method for fabricating an image sensor package, comprising:
providing a first substrate comprising a via therein, wherein the first substrate comprises an upper surface and a lower surface
opposite the upper surface;

forming a driving circuit on the upper surface of the first substrate and electrically connected to the via;
bonding a second substrate to the first substrate, wherein the second substrate comprises a first surface and a second surface
opposite the first surface, and wherein a photosensitive device is on the first surface and is electrically connected to the
driving circuit;

forming a support member on the second surface of the second substrate; and
disposing a covering plate on the second surface of the second substrate.

US Pat. No. 9,564,462

IMAGE-SENSOR STRUCTURES

VISERA TECHNOLOGIES COMPA...

1. An image-sensor structure, comprising:
a substrate;
a plurality of photoelectric conversion units formed in the substrate; and
a plurality of single layer color filter patterns comprising a red filter pattern having a first refractive index, a green
filter pattern having a second refractive index and a blue filter pattern having a third refractive index formed above the
substrate and the photoelectric conversion units,

wherein at least one of the color filter patterns contains a single component having a specific refractive index such that
the second refractive index of the green filter pattern is higher than the first refractive index of the red filter pattern
and the third refractive index of the blue filter pattern,

wherein each of the color filter patterns comprise a mixture of at least one kind of pigment and at least one compound, and
wherein the amount of the single component in each of the color filter patterns is based on the weight of the mixture in the
red filter pattern, the green filter pattern or the blue filter pattern.

US Pat. No. 9,513,411

DOUBLE-LENS STRUCTURES AND FABRICATION METHODS THEREOF

VISERA TECHNOLOGIES COMPA...

1. A double-lens structure, comprising:
a first lens structure formed of a color filter layer having a first refractive index; and
a second lens structure formed of a micro-lens layer having a second refractive index and disposed directly on and contacting
the first lens structure,

wherein an incident light enters the second lens structure and then passes through the first lens structure, and the first
refractive index of the color filter layer is greater than the second refractive index of the micro-lens layer, and

wherein a surface of the first lens structure and a surface of the second lens structure that contact each other have corresponding
shapes so as to form a surface-contact between the first lens structure and the second lens structure,

wherein the first lens structure formed of the color filter layer has a first convex profile surface and the second lens structure
formed of the micro-lens layer has a second convex profile surface disposed above the first convex profile surface of the
first lens structure, and the incident light enters the second lens structure from the second convex profile surface.

US Pat. No. 9,853,083

METHOD FOR FABRICATING AN IMAGE-SENSOR STRUCTURE

Visera Technologies Compa...

1. A method for fabricating an image-sensor structure, comprising:
providing a substrate having a first surface and a second surface and comprising a sensing area;
forming a first metal layer above the first surface of the substrate and surrounding the sensing area; and
forming a protection layer above the first surface of the substrate and overlying the sensing area and a part of the first
metal layer to expose an exposed area of the first metal layer, wherein the exposed area comprises a first portion having
a first width, a second portion having a second width, a third portion having a third width and a fourth portion having a
fourth width, wherein the first width of the first portion, the second width of the second portion, the third width of the
third portion and the fourth width of the fourth portion of the exposed area of the first metal layer are respectively greater
than 35 ?m.

US Pat. No. 9,525,005

IMAGE SENSOR DEVICE, CIS STRUCTURE, AND METHOD FOR FORMING THE SAME

VISERA TECHNOLOGIES COMPA...

1. A CIS structure, comprising:
a translucent structure;
a reflective structure surrounding the translucent structure, comprising:
a first reflective layer, surrounding the translucent structure and having a refractive index N1;

a second reflective layer, surrounding the first reflective layer and having a refractive index N2;

a third reflective layer, surrounding the second reflective layer and having a refractive index N3, wherein N1>N2>N3;

a first protecting layer, surrounding the third reflective layer, wherein the first protecting layer and the second reflective
layer are formed of the same material; and

a second protecting layer, surrounding the third reflective layer, wherein the second protecting layer and the first reflective
layer are formed of the same material; and

a micro lens, disposed on a side of the translucent structure.

US Pat. No. 9,876,995

IMAGE SENSOR

VISERA TECHNOLOGIES COMPA...

1. An image sensor, comprising
a sensor array layer formed of a plurality of normal sensor units and a plurality of spectrometer sensor units;
a first guided mode resonance (GMR) structure having a first grating pitch and disposed on the sensor array layer to cover
N (where N is a positive integer) of the spectrometer sensor units;

a second GMR structure having a second grating pitch and disposed on the sensor array layer to cover N of the spectrometer
sensor units; and

a plurality of color filter units disposed on the sensor array layer to cover the normal sensor units; and
a clear structure having no gratings and disposed on the sensor array layer to cover N of the spectrometer sensor units.

US Pat. No. 9,837,455

IMAGE SENSOR

Visera Technologies Compa...

1. An image sensor, comprising:
a sensing layer;
a plurality of filter units disposed on the sensing layer;
a grating structure, disposed on the plurality of filter units, comprising a plurality of grating portions, and
a grid structure, disposed on the sensing layer, surrounding each of the plurality of filter units,
wherein the plurality of grating portions form a plurality of grating groups, and each of the plurality of grating groups
is separated from each other, and

wherein each of the plurality of grating groups is surrounded by a flat top surface, and the flat top surface is aligned to
the grid structure.

US Pat. No. 9,640,576

IMAGE SENSING DEVICE AND METHOD FOR FABRICATING THE SAME

VISERA TECHNOLOGIES COMPA...

1. An image sensing device, comprising:
an active layer with a plurality of photo-sensing elements;
a color pattern disposed over one of the photo-sensing elements, wherein the color pattern has a color selected from the group
consisting of red (R), green (G), and blue (B);

a microlens disposed on the color pattern;
a transmissive material including a surface; and
a transmissive pattern, included within the transmissive material, being adjacent to the color pattern and over another one
of the photo-sensing elements, wherein the transmissive pattern comprises a color filter portion and a microlens portion,
and an absolute value of a difference of refractive indexes between the microlens and the color pattern is less than 0.3,
and there is no difference of refractive indexes between the microlens portion and the color filter portion of the transmissive
pattern, wherein the color pattern is formed between a bottom surface of the microlens and the active layer, and the color
filter portion of the transmissive pattern is formed between a bottom surface of the microlens portion of the transmissive
pattern and the active layer; wherein

there is a height difference between top surfaces of the microlens and the transmissive material.

US Pat. No. 9,117,714

WAFER LEVEL PACKAGE AND MASK FOR FABRICATING THE SAME

VisEra TECHNOLOGIES COMPA...

1. A wafer level package, comprising:
a semiconductor wafer integrated with a plurality of semiconductor chips, wherein the semiconductor chips comprise an image
sensing structure and a microlens array over the image sensing structure;

a circuit-free area defined over the semiconductor wafer to electrically isolate the semiconductor chips;
a dam structure substantially formed over the circuit-free area, wherein a portion of the dam structure formed around an edge
of the semiconductor wafer is formed with a plurality via holes therein; and

a transparent substrate formed over the semiconductor wafer, defining a plurality of cavities between the semiconductor chips
and the transparent substrate, wherein the transparent substrate is supported by the dam structure.

US Pat. No. 9,825,078

CAMERA DEVICE HAVING AN IMAGE SENSOR COMPRISING A CONDUCTIVE LAYER AND A REFLECTION LAYER STACKED TOGETHER TO FORM A LIGHT PIPE STRUCTURE ACCOMMODATING A FILTER UNIT

Visera Technologies Compa...

1. An image sensor, comprising:
a sensing layer;
a filter unit disposed on the sensing layer;
a conductive layer, surrounding and contacting the filter unit, and disposed on the sensing layer; and
a reflection layer, surrounding and contacting the filter unit, and disposed on the conductive layer,
wherein the conductive layer and the reflection layer stacked together form a light pipe structure accommodating the filter
unit so as to allow light transmitting to the sensing layer and minimize light passing through the filter unit.

US Pat. No. 9,666,620

STACKED FILTER AND IMAGE SENSOR CONTAINING THE SAME

VisEra Technologies Compa...

1. A stacked filter for an image sensor including an infrared (IR) pixel, comprising:
a first filter layer disposed at the IR pixel, allowing light with wavelengths of a first band to be transmitted through;
and

a second filter layer stacked with the first filter layer, allowing light with wavelengths of a second band to be transmitted
through,

wherein a portion of the second band is lower than the first band, the first band partially overlaps the second band at a
third band, the third band is narrower than the first band and the second band, and the stacked filter allows light with the
wavelengths of the third band to be transmitted through, and the first band is from a first wavelength to a second wavelength,
the second band is from a third wavelength to a fourth wavelength, and the third band is from the first wavelength to the
fourth wavelength.

US Pat. No. 9,906,706

IMAGE SENSOR AND IMAGING DEVICE

VISERA TECHNOLOGIES COMPA...

1. An image sensor, comprising:
a sensor array layer comprising a plurality of normal sensor units and a pair of autofocus sensor units;
a plurality of color filter units disposed on the sensor array layer to cover the plurality of normal sensor units;
an IR-pass filter unit disposed on the sensor array layer to cover the pair of autofocus sensor units;
a micro-lens layer comprising a plurality of micro-lenses disposed on the color filter units and the IR-pass filter unit,
wherein one of the pair of autofocus sensor units detects infrared light came from a first side, and the other of the pair
of autofocus sensor units detects infrared light came from a second side opposite to the first side to perform a phase detection
autofocus function,

wherein the one of the pair of autofocus sensor units is adjacent to the other of the pair of autofocus sensor units, and
wherein the plurality of micro-lenses comprise a plurality of first micro-lenses and a second micro-lens, wherein any of the
plurality of first micro-lenses is disposed on one of the plurality of the color filter units to cover one of the plurality
of normal sensor units, and the second micro-lens is disposed on the IR-pass filter unit to cover the pair of autofocus sensor
units.

US Pat. No. 9,754,984

IMAGE-SENSOR STRUCTURES

VISERA TECHNOLOGIES COMPA...

1. An image-sensor structure, comprising:
a substrate;
a plurality of photoelectric conversion units formed in the substrate;
a plurality of separated color filters formed above the substrate and the photoelectric conversion units;
a first light shielding layer surrounding the separated color filters; and
a first conductive polymer element filled between the individual separated color filters and between the all separated color
filters and the first light shielding layer, wherein the first conductive polymer element is electrically connected to a grounding
pad.

US Pat. No. 9,704,901

SOLID-STATE IMAGING DEVICES

VISERA TECHNOLOGIES COMPA...

1. A solid-state imaging device, comprising:
a semiconductor substrate containing a plurality of photoelectric conversion elements;
a color filter layer including a first color filter component and a second color filter component disposed above the semiconductor
substrate, wherein the first color filter component is separated from the second color filter component; and

a microlens structure including a first microlens element disposed on the first color filter component and a second microlens
element disposed on the second color filter component, wherein the first microlens element is separated from the second microlens
element, the first color filter component has a thickness that is different from a thickness of the second color filter component,
and the first microlens element has a height that is different from a height of the second microlens element; and

a gap between the first and second color filter components and between the first and second microlens elements, wherein the
gap is filled with air.

US Pat. No. 9,634,049

SOLID-STATE IMAGING DEVICES WITH ENHANCED ANGULAR RESPONSE

Visera Technologies Compa...

1. A solid-state imaging device, comprising:
a substrate containing a plurality of photoelectric conversion elements that are arranged into a pixel array;
a color filter layer including a plurality of color filter segments disposed above the photoelectric conversion elements;
and

a partition grid including a plurality of partitions, each of the partitions disposed between two adjacent color filter segments,
and the color filter layer and the partition grid disposed in the same layer,

wherein the partitions include a first partition disposed at a center line of the pixel array and a second partition disposed
at an edge of the pixel array, the second partition has a top width that is larger than the top width of the first partition,
and the second partition does not cover the plurality of photoelectric conversion elements, and

wherein the partitions from the center line to the edge of the pixel array have heights that are different from one another,
and the heights of the partitions gradually increase from the center line to the edge of the pixel array.

US Pat. No. 10,056,417

IMAGE-SENSOR STRUCTURES

Visera Technologies Compa...

1. An image-sensor structure, comprising:a substrate with a plurality of photoelectric conversion units formed therein;
a plurality of color filters formed above the substrate, wherein the color filters are divided into red color filters, green color filters, blue color filters and infrared pass filters;
a plurality of microlenses correspondingly formed above the color filters;
a first transparent material layer formed above the microlenses;
a first filter blocking infrared (IR) light partially formed above the first transparent material layer, exposing a part of the first transparent material layer corresponding to the infrared pass filters;
a second filter allowing transmission of visible light formed above the first filter, exposing the part of the first transparent material layer corresponding to the infrared pass filters;
a second transparent material layer formed above the part of the first transparent material layer corresponding to the infrared pass filters; and
a lens module formed above the second filter and the second transparent material layer.

US Pat. No. 10,054,719

METHODS FOR FARBRICATING DOUBLE-LENS STRUCTURES

VisEra Technologies Compa...

1. A method for fabricating a double-lens structure, comprising:forming a color filter layer having a first refractive index on a substrate;
forming a first hard mask on the color filter layer, wherein the first hard mask has a convex profile;
etching the color filter layer by using the first hard mask to form a first lens structure having a first convex profile surface;
forming a micro-lens material layer having a second refractive index on the first lens structure;
forming a second hard mask on the micro-lens material layer, wherein the second hard mask has a convex profile; and
etching the micro-lens material layer by using the second hard mask to form a second lens structure having a second convex profile surface,
wherein the first refractive index of the color filter layer is greater than the second refractive index of the micro-lens material layer, and wherein the first hard mask has a thickness smaller than a thickness of the color filter layer, after the step of etching the color filter layer by using the first hard mask to form the first lens structure, a lower portion of the color filter layer is not etched and bottoms of adjacent zones of the first lens structure are connected together.

US Pat. No. 9,991,302

OPTICAL SENSOR WITH COLOR FILTERS HAVING INCLINED SIDEWALLS

VisEra Technologies Compa...

1. An optical sensor, comprising:a sensing layer comprising a photodiode;
a first color filter comprising a first lower portion disposed on the sensing layer, and a first upper portion disposed on the first lower portion, wherein the first upper portion comprises a first bottom interface connected to the first lower portion, a first inclined surface inclined relative to the first bottom interface, and a second inclined surface opposite to the first inclined surface and inclined relative to the first bottom interface;
a shading structure surrounding the first lower portion; and
a grid structure surrounding the first upper portion, wherein the grid structure comprises a first grid layer disposed on the shading structure, a second grid layer disposed on the first grid layer, and a third grid layer disposed on the second grid layer,
wherein a refractive index of the first grid layer is greater than a refractive index of the second grid layer, and a refractive index of the second grid layer is greater than a refractive index of the third grid layer,
wherein between the first inclined surface and the first bottom interface is a first acute angle, and between the second inclined surface and the first bottom interface is a second acute angle.

US Pat. No. 9,978,789

IMAGE-SENSING DEVICE

VISERA TECHNOLOGIES COMPA...

1. An image-sensing device, comprising:a semiconductor substrate comprising a photo-sensing element;
a passive layer disposed over the semiconductor substrate; and
a light-collecting element disposed over the passive layer, comprising:
a first loop having a first width;
a second loop surrounding the first loop, having a second width that is less than the first width;
a third loop surrounding the first and second loops, having a third width that is less than the second width, wherein the light-collecting element aligns with the photo-sensing element, and the first, second, and third loops are made of different materials having different refractive indices.

US Pat. No. 10,091,488

3D IMAGE SENSOR AND 3D IMAGE-CAPTURING DEVICE

VISERA TECHNOLOGIES COMPA...

1. A 3D image sensor, comprising:a sensing layer comprising a plurality of sensing units;
a grid layer disposed on the sensing layer, comprising an opacity material and a plurality of transparent elements penetrating through the opacity material; and
a plurality of microlenses disposed on the grid layer, wherein each of the microlenses is located over two adjacent transparent elements.

US Pat. No. 9,948,839

IMAGE SENSOR AND IMAGE CAPTURE DEVICE

Visera Technologies Compa...

1. An image sensor, comprising:a sensing layer comprising a plurality of sensing units configured to sense a light beam;
a transparent plate located above the sensing layer;
a first guided-mode resonance structure, disposed on a first area of the transparent plate, blocking a first waveband of the light beam from passing through;
a top color filter unit disposed on a color filter area of the transparent plate;
a flat layer, disposed on the sensing layer, under the top color filter unit;
a plurality of microlenses, disposed on the flat layer, under the color filter area; and
a plurality of color filter units disposed on the sensing layer, under the first area of the transparent plate.

US Pat. No. 10,119,915

DETECTION DEVICE FOR SPECIMENS

VISERA TECHNOLOGIES COMPA...

1. A detection device for specimens, comprising:an image sensor;
a light-guiding structure, disposed on the image sensor, comprising:
a light-guiding layer disposed on the image sensor; and
a top layer disposed on the light-guiding layer;
a carrier, disposed on the light-guiding structure, having a plurality of wells arranged in a second array located over the top layer, wherein each of the wells is configured to receive and hold a specimen solely within the well, and
a light source adjacent to a side surface of the light-guiding layer and configured to emit an excitation beam into the light-guiding layer, wherein a portion of the excitation beam is transmitted from the light source along the light-guiding layer to the plurality of wells and another portion of the excitation beam is transmitted from the light source to the microlenses and is reflected by the microlenses to the plurality of wells,
wherein the top layer includes a plurality of guiding portions, disposed on the light-guiding layer, arranged in a first array, and the wells located over the guiding portions,
wherein the excitation beam is transmitted to the specimens via the top layer,
wherein the carrier comprises a top surface and a bottom surface and the plurality of wells is arranged in contact with the top surface of the carrier and the bottom surface of the carrier is opposite of the top surface, and
wherein the specimens emit induced beams when the specimens are irradiated by the excitation beam, and the detection device is configured so that the induced beams are transmitted from at least one well then through the bottom surface of the carrier and then to the image sensor via the top layer and the light-guiding layer, in sequence.

US Pat. No. 10,151,862

COLOR FILTER ARRAY HAVING LOW DENSITY OF BLUE COLOR

VISERA TECHNOLOGIES COMPA...

1. A color filter array, comprising:a plurality of 3×3 arrays, wherein each 3×3 array comprises a plurality of color filter units,
wherein the color filter units in each 3×3 array comprise a blue filter and a plurality of other filters, and the blue filter is disposed in the center of each 3×3 array,
wherein a number of the blue filter is fewer than that of each kind of the other filters in each 3×3 array, and
wherein the plurality of 3×3 arrays are arranged directly next to each other in both a lateral direction and a transverse direction,
wherein the other filters in each 3×3 array comprise two red filters, two green filters, and four white/transparent filters, and
wherein the two red filters are disposed horizontally adjacent to the blue filter, and the two green filters are disposed vertically adjacent to the blue filter, and the four white/transparent filters are disposed at four corners of the 3×3 array.

US Pat. No. 10,148,919

IMAGE SENSOR HAVING YELLOW FILTER UNITS

VISERA TECHNOLOGIES COMPA...

1. An image sensor, comprising:a sensing layer for sensing a light beam, the sensing layer comprising:
a substrate;
a plurality of sensing units, configured to generate intensity signals according to intensity of the light beam falling thereon, embedded in the substrate in an array; and
a passivation layer disposed on the substrate; and
a plurality of pixel groups disposed on the passivation layer, wherein each of the pixel groups comprises:
a yellow filter unit allowing a green light component and a red light component of the light beam to pass through,
a green filter unit allowing the green light component of the light beam to pass through; and
a blue filter unit allowing a blue light component of the light beam to pass through,
wherein each of the filter units is disposed over one of the plurality of sensing units; and
wherein the yellow filter unit is a high-pass filter allowing wavelengths of the light beam longer than a specific wavelength to pass through, and the specific wavelength is defined as a 50% transmittance wavelength in a range from about 470 nm to 540 nm.

US Pat. No. 10,192,916

METHODS OF FABRICATING SOLID-STATE IMAGING DEVICES HAVING FLAT MICROLENSES

VISERA TECHNOLOGIES COMPA...

1. A method of fabricating a solid-state imaging device, comprising:providing a semiconductor substrate having a plurality of photoelectric conversion elements;
forming a color filter layer above the semiconductor substrate;
forming a lens material layer on the color filter layer;
forming a hard mask having a lens-shaped pattern on the lens material layer;
etching both the hard mask and the lens material layer to form a microlens with a flat top surface from the lens material layer and to leave a portion of the hard mask on the flat top surface of the microlens, wherein the etching of both the hard mask and the lens material layer is performed using a first dry-etching process using a fluorine-containing etchant; and
removing the portion of the hard mask that remains on the microlens.

US Pat. No. 10,145,740

SENSING MULTIPLE PEAK WAVELENGTHS USING COMBINATION OF DUAL-BAND FILTERS

VISERA TECHNOLOGIES COMPA...

1. A spectrum-inspection device, comprising:a sensor unit array comprising a first sensor unit and a second sensor unit;
a dual-band pass filter disposed on the sensor unit array to cover the first sensor unit and the second sensor unit, wherein the dual-band pass filter allows a first waveband and a second waveband of a light beam to pass through;
a filter disposed on the dual-band pass filter to cover the second sensor unit, wherein the filter allows wavelengths of a light beam longer than a first wavelength to pass through;
a second dual-band pass filter disposed on the sensor unit array; and
a second filter disposed on the second dual-band pass filter,
wherein the first wavelength is longer than a peak wavelength of the first waveband and shorter than a peak wavelength of the second waveband,
the sensor unit array comprises a third sensor unit and a fourth sensor unit,
the second dual-band pass filter covers the third sensor unit and the fourth sensor unit and allows a third waveband and a fourth waveband of a light beam to pass through,
the second filter covers the fourth sensor unit and allows wavelengths of a light beam longer than a second wavelength to pass through, and
the second wavelength is longer than a peak wavelength of the third waveband and shorter than a peak wavelength of the fourth waveband, and
the peak wavelength of the third waveband is longer than the peak wavelength of the first waveband and shorter than the peak wavelength of the second waveband, and the peak wavelength of the fourth waveband is longer than the peak wavelength of the second waveband.

US Pat. No. 10,192,915

OPTICAL SENSOR AND MANUFACTURING METHOD THEREOF

Visera Technologies Compa...

1. An optical sensor, comprising:a sensing layer comprising an active area, a shading area around the active area, and a peripheral area around the shading area;
a first shading filter disposed on the shading area; and
a second shading filter disposed on the first shading filter,
wherein one of the first shading filter and the second shading filter extends from the shading area and is disposed over the active area, and
wherein when a light beam is emitted to the shading area, the second shading filter is configured to block a first component of the light beam, and the first shading filter is configured to block a second component of the light beam.

US Pat. No. 10,170,511

SOLID-STATE IMAGING DEVICES HAVING A MICROLENS LAYER WITH DUMMY STRUCTURES

VISERA TECHNOLOGIES COMPA...

1. A solid-state imaging device, having a sensing region, a pad region and a peripheral region located between the sensing region and the pad region, comprising:a semiconductor substrate;
a plurality of photoelectric conversion elements disposed in the semiconductor substrate and in the sensing region;
a bond pad disposed on the semiconductor substrate and in the pad region;
a microlens layer, including a microlens array and a first dummy structure, disposed above the semiconductor substrate, wherein the microlens array is disposed in the sensing region, the first dummy structure is disposed in the pad region, and the first dummy structure includes a plurality of first microlens elements disposed to surround an area of the bond pad; and
a passivation film conformally formed on a top surface of the microlens layer.

US Pat. No. 10,170,516

IMAGE SENSING DEVICE AND METHOD FOR FABRICATING THE SAME

VISERA TECHNOLOGIES COMPA...

1. An image sensing device, comprising:a substrate, comprising a pixel array having a plurality of pixels;
a light guide structure, disposed over the substrate, forming a plurality of light pipes and a plurality of reflecting portions defining the light pipes, wherein the light pipes are aligned with the pixels of the pixel array;
a microlens array, disposed between the substrate and the light guide structure; the microlens array including a plurality of microlenses; and
a color filter array, disposed between the substrate and the microlens array,
wherein the substrate, the light guide structure, the microlens array and the color filter array are formed on a single die, and
wherein each light reflecting portion extends to and contacts an outer edge of at least one of the plurality of microlenses.

US Pat. No. 10,249,661

IMAGING DEVICES WITH DUMMY PATTERNS

VISERA TECHNOLOGIES COMPA...

1. An imaging device, comprising:a plurality of photoelectric conversion elements formed on a substrate in an active area of the imaging device;
a microlens structure disposed above the photoelectric conversion elements;
a dummy pattern disposed above the substrate in a peripheral area of the imaging device surrounding the active area, wherein the dummy pattern includes a plurality of protruding elements and the shape of the protruding element comprises a cylinder, a prism, a cone or a pyramid; and
a passivation film conformally formed on the microlens structure and the dummy pattern, wherein the passivation film on a top of the dummy pattern has a surface area smaller than a surface area of the peripheral area outside of the microlens structure,
wherein the dummy pattern is randomly arranged in the peripheral area, and a portion of the peripheral area is not occupied by the dummy pattern.

US Pat. No. 10,249,771

FILTER COLLIMATORS AND METHODS FOR FORMING THE SAME

Visera Technologies Compa...

1. A filter collimator, comprising:a substrate having a photodiode;
a first light-shielding layer disposed over the substrate, having an aperture corresponding to the photodiode;
an interference-type filter film disposed between the substrate and the first light-shielding layer; and
an absorption-type filter film disposed over the substrate;
wherein when a first light is incident at a first angle relative to a normal of a top surface of the substrate, the interference-type filter film has a transmittance greater than 50% in a first waveband, and when a second light is incident at a second angle relative to the normal of the top surface of the substrate, the interference-type filter film has a transmittance greater than 50% in a second waveband, the absorption-type filter film has a transmittance greater than 50% in a third waveband, and wherein the first waveband partially overlaps the third waveband, the second waveband does not overlap the third waveband, and the second angle is greater than the first angle.

US Pat. No. 10,295,482

SPECTRUM-INSPECTION DEVICE AND METHOD FOR FORMING THE SAME

VISERA TECHNOLOGIES COMPA...

1. A spectrum-inspection device, comprising:a substrate including a first photodiode, a second photodiode and a third photodiode;
an interference-type filter disposed over the first photodiode and the second photodiode, wherein the interference-type filter allows a first light beam with wavelength of a multi-band to pass through, wherein the multi-band comprises a first waveband (a), a second waveband (b), a third waveband (c), and a fourth waveband (d);
a first absorption-type filter disposed over the first photodiode and the second photodiode, wherein the first absorption-type filter allows a second light beam with wavelength of a first region to pass through;
a second absorption-type filter disposed over the second photodiode and the third photodiode, wherein the second absorption-type filter is disposed over the first absorption-type filter, and the second absorption-type filter allows a third light beam with wavelength of a second region to pass through, and wherein the second region overlaps the first region; and
a third absorption-type filter disposed over the third photodiode, wherein the third absorption-type filter is disposed over the second absorption-type filter, and wherein the third absorption-type filter allows a fourth light beam with wavelength of a third region to pass through, and the third region overlaps at least one of the first region and the second region.

US Pat. No. 10,319,760

IMAGE SENSOR

Visera Technologies Compa...

1. An image sensor, comprising:a sensing layer;
a plurality of filter units disposed on the sensing layer; and
a grid structure, disposed on the sensing layer, surrounding each of the filter units, wherein the grid structure comprises:
a first partition wall, disposed on the sensing layer, located between two adjacent filter units;
a second partition wall, disposed directly on the first partition wall, located between the two adjacent filter units; and
a first cover element located between the first partition wall and one of the two adjacent filter units, and located between the second partition wall and the one of the two adjacent filter units,
wherein a first refractive index of the first partition wall is less than a second refractive index of the second partition wall, and a refractive index of the first cover element is less than the first refractive index,
wherein a bottom surface of the second partition wall that contacts a top surface of the first partition wall is smaller than the top surface of the first partition wall, and
wherein side surfaces of the first partition wall and the second partition wall, on a same lateral side of the first partition wall and the second partition wall, are stepped and lie in separate planes.

US Pat. No. 10,347,678

IMAGE SENSOR WITH SHIFTED MICROLENS ARRAY

Visera Technologies Compa...

1. An image sensor, comprising:a microlens array comprising a plurality of microlenses;
a sensor array comprising a plurality of photoelectric elements that are arranged into a plurality of macro pixels;
wherein each of the plurality of macro pixels comprises a first photoelectric element, a second photoelectric element, a third photoelectric element, and a fourth photoelectric element that receive incident light via a first microlens, a second microlens, a third microlens, and a fourth lens in the plurality of microlenses, respectively,
wherein the first microlens, the second microlens, the third microlens, and the fourth microlens in each of the plurality of macro pixels have a first initial offset, a second initial offset, a third initial offset, and a fourth initial offset, respectively,
wherein the first microlens and the second microlens in each of the plurality of macro pixels further have a first additional offset and a second additional offset, respectively,
wherein each of the plurality of macro pixels in the sensor array outputs an intensity signal that is used to determine distance and direction information of an object from the incident light, and
wherein a look-up table recording a plurality of intensity distributions of the intensity signal from each of the plurality of macro pixels in the sensor array is used to determine the distance and direction information of the object.

US Pat. No. 10,423,122

LENS-FREE IMAGE SENSOR USING PHASE-SHIFTING HOLOGRAM

VISERA TECHNOLOGIES COMPA...

1. An image sensor, comprising:a plurality of photoelectric elements for receiving an incident light,
wherein the photoelectric elements are arranged into a plurality of unit cells, and each of the unit cells comprises a first photoelectric element and a second photoelectric element,
wherein the first photoelectric element in each of the unit cells captures a first pixel in a first phase, and the second photoelectric element in each of the unit cells captures a second pixel in a second phase,
wherein the first phase is different from the second phase,
wherein a first phase-shifting hologram image and a second phase-shifting hologram image are obtained by respectively combining the first pixels in the first phase and the second pixels in the second phase captured by the unit cells.

US Pat. No. 10,462,431

IMAGE SENSORS

VISERA TECHNOLOGIES COMPA...

1. An image sensor, comprising:a semiconductor substrate containing a plurality of photoelectric conversion elements;
a filter array, including a first color filter, a second color filter, a third color filter and an infrared filter, disposed above the semiconductor substrate;
an isolated partition disposed in the filter array to surround one of the first, second and third color filters and the infrared filter, wherein the isolated partition has a refractive index that is lower than the refractive indexes of the first, second and third color filters and the refractive index of the infrared filter, wherein an area of the isolated partition and the one of the first filter, the second filter, the third filter and the infrared filter surrounded by the isolated partition added together is equal to the area of the other one of the first filter, the second filter, the third filter and the infrared filter that is not surrounded by the isolated partition; and
an additional isolated partition disposed in the filter array, wherein the filter array includes a red color filter, a green color filter, a blue color filter and the infrared filter, the isolated partition and the additional isolated partition surround the red and the blue color filters, respectively, and the infrared filter is in contact with the green color filter.

US Pat. No. 9,525,005

IMAGE SENSOR DEVICE, CIS STRUCTURE, AND METHOD FOR FORMING THE SAME

VISERA TECHNOLOGIES COMPA...

1. A CIS structure, comprising:
a translucent structure;
a reflective structure surrounding the translucent structure, comprising:
a first reflective layer, surrounding the translucent structure and having a refractive index N1;

a second reflective layer, surrounding the first reflective layer and having a refractive index N2;

a third reflective layer, surrounding the second reflective layer and having a refractive index N3, wherein N1>N2>N3;

a first protecting layer, surrounding the third reflective layer, wherein the first protecting layer and the second reflective
layer are formed of the same material; and

a second protecting layer, surrounding the third reflective layer, wherein the second protecting layer and the first reflective
layer are formed of the same material; and

a micro lens, disposed on a side of the translucent structure.