US Pat. No. 9,287,218

CHIP LEVEL EMI SHIELDING STRUCTURE AND MANUFACTURE METHOD THEREOF

Universal Scientific Indu...

1. A chip level EMI shielding structure, comprising:
a semiconductor substrate having a thickness bounded by opposing first and second surfaces;
a plurality of ground conductor lines disposed on the first surface of the semiconductor substrate, each of the ground conductor
lines positioned on an edge of the semiconductor substrate;

at least one chip disposed on the first surface of the semiconductor substrate;
a protective layer directly contacting and covering the chip, ground conductor lines, and portions of the first surface of
the semiconductor substrate surrounding the chip and ground conductor lines;

a plurality of metal conductor lines each having a surface portion spaced from the semiconductor substrate and overlaying
an outer surface of the protective layer, each of the metal conductor lines having an extending portion extending through
the protective layer and connected electrically to the chip;

a ground layer disposed on the second surface of the semiconductor substrate extending between a first connection structure
and a second connection structure respectively disposed on lateral walls of the semiconductor substrate for electrically connecting
the ground conductor lines and the ground layer.

US Pat. No. 9,513,683

CONTROL CIRCUITRY USED IN A COMPUTING SYSTEM, AND POWER SUPPLY HAVING THE CONTROL CIRCUITRY

UNIVERSAL SCIENTIFIC INDU...

1. A control circuitry used in a computing system, for enabling or disabling a standby module of a power supply, electrically
coupled to two nodes of the standby module, comprising:
a determination circuit, for judging a setting that whether the computing system being turned off requires a standby voltage;
a transistor, a control end thereof is electrically coupled to the determination circuit, wherein when the determination circuit
judges the setting that the computing system being turned off requires the standby voltage correspondingly, the determination
circuit turns on the transistor, otherwise, the determination circuit turns off the transistor; and

an optical coupler, electrically coupled to the transistor, wherein when the transistor is turned on, the optical coupler
shorts the two nodes of the standby module to enable the standby module, and when the transistor is turned off, the optical
coupler disconnects the two nodes of the standby module to disable the standby module.

US Pat. No. 9,167,686

3D STACKED PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Universal Scientific Indu...

1. A 3D stacked package structure, comprising:
a first unit including a first substrate and at least one first electronic component disposed on and electrically connected
to the first substrate, wherein the first substrate has at least one runner formed on the periphery thereof and passing through
the first substrate, and the first substrate has at least one first conductive pad disposed on the bottom surface of the first
substrate and adjacent to the periphery of the first substrate;

a molding unit including a top portion disposed on the first substrate to cover the first electronic component, the top portion
extending to an edge of the first substrate, a frame disposed on the bottom surface of the first substrate and adjacent to
the periphery of the first substrate, and at least one connection disposed inside the runner and connected between the top
portion and the frame;

a conductive unit including at least one conductor passing through the frame and electrically connected to the first conductive
pad; and

a second unit, wherein the first unit is stacked on the second unit, and the first unit is electrically connected to the second
unit through the conductor.

US Pat. No. 9,468,111

HOUSING ASSEMBLY AND SOLID STATE DRIVE HAVING THE SAME

UNIVERSAL SCIENTIFIC INDU...

1. A housing assembly comprising a top housing, a bottom housing, and an accommodation defined by the top housing covered
with the bottom housing; the top housing having a top plate, and a first sidewall extending from a periphery of the top plate
and approaching the bottom housing; the bottom housing having a bottom plate, and a second sidewall extending from a periphery
of the bottom plate and approaching the top housing; the second sidewall having at least one engagement slit for being mated
with a printed circuit board, which is received in the accommodation; wherein
the engagement slit is defined by an upper edge and a lower edge;
the second sidewall includes an inclination wall extending from the lower edge of the engagement slit and distancing from
the accommodation outwardly and downwardly, and a slot being adjacent to the inclination wall;

the first sidewall includes a fringe protrusion approaching the accommodation and corresponding with the inclination wall;
whereby the fringe protrusion of the first sidewall keeps sliding along the inclination wall of the second sidewall so as
to engage with a distal end of the inclination wall, while the top housing covers the bottom housing; and

the slot exposes wholly or partially, after the top housing engages with the bottom housing, and
wherein the bottom housing defines an indentation at a conjunction between the bottom plate and the second sidewall; the indentation
corresponds to and sits below the inclination wall, and a top of the indentation overlies the distal edge of the inclination
wall; whereby the fringe protrusion of the first sidewall keeps sliding along the inclination wall of the second sidewall
so as to reach the indentation below the inclination wall, while the top housing covers the bottom housing.

US Pat. No. 9,384,646

MOTION MONITORING METHOD AND DEVICE

UNIVERSAL SCIENTIFIC INDU...

1. A motion monitoring method, comprising the steps of:
a) providing a motion monitoring device, wherein the motion monitoring device comprises a monitoring unit, an alert unit,
a display unit, and a wireless communication unit;

b) wearing the motion monitoring device on a user's body to allow the monitoring unit to start monitoring the user's motion;
c) sending an alert signal from the alert unit under control of the monitoring unit and displaying on the display unit a user
data pertaining to the user's medical records when the monitoring unit detects that the user's motion variation is less than
a standard value or unchanged within a predetermined period of time; and

d) sending a distress signal from the wireless communication unit when the alert unit has been operating for a period of time.

US Pat. No. 9,332,646

ELECTRONIC PACKAGE MODULE AND METHOD OF MANUFACTURING THE SAME

Universal Scientific Indu...

1. An electronic package module comprising:
a circuit board having a supporting surface;
at least one first electronic component disposed on the supporting surface;
at least one second electronic component disposed on the supporting surface; and
at least one molding compound arranged on the supporting surface and partially covering thereon, the molding compound solely
encapsulating the at least one first electronic component;

wherein the at least one molding compound includes an opening, and the at least one second electronic component is disposed
at the opening; and

wherein the at least one molding compound includes a top surface and a side connecting the top surface, the side is positioned
between the top surface and the supporting surface, and the at least one molding compound gradually shrinks from the top surface
to the supporting surface.

US Pat. No. 9,294,156

HANDHELD DEVICE HAVING MULTIPLE NFC READING DIRECTIONS

UNIVERSAL SCIENTIFIC INDU...

1. A handheld device having multiple near-field communication (NFC) reading directions, comprising:
a communication unit having an input end and an output end for connection with a first circuit and a second circuit in parallel;
a first NFC antenna mounted to the first circuit; and
a second NFC antenna mounted to the second circuit and having a radio frequency (RF) transmission direction different from
that of the first NFC antenna;

wherein an equivalent inductance between the output end and the input end matches the communication unit,
wherein the second NFC antenna is mounted inside the handheld device and is a winding-type antenna wound around a bar-shaped
strut, the strut being longitudinally perpendicular to a top side of the handheld device.

US Pat. No. 9,089,046

ELECTRONIC MODULE AND METHOD FOR SAME

UNIVERSAL SCIENTIFIC INDU...

1. An electronic module, comprising:
a circuit board with a first plane and at least one grounding pad, wherein the at least one grounding pad is located on the
first plane;

a plurality of electronic components mounted on the first plane and electrically connected with the circuit board;
a plurality of molding layers covering the electronic components and the first plane, wherein a trench appears between two
adjacent molding layers, and at least one grounding pad is located at the bottom of the trench;

at least one first conductive layer covered the side wall of the trench and the at least one grounding pad, and electrically
connected with the at least one grounding pad;

at least one insulating filler is filled in the trench; and
one second conductive layer covering the molding layers and the at least one insulating filler and electrically connected
with the first conductive layer, wherein the at least one insulating filler is positioned between the second conductive layer
and the first conductive layer.

US Pat. No. 9,136,814

METHOD AND SYSTEM OF EQUALIZATION PRE-PREOCESSING FOR SOUND RECEIVNG SYSTEM

UNIVERSAL SCIENTIFIC INDU...

7. An equalization pre-processing system for a sound receiving system, adapted for analyzing a first sensitivity response
and a second sensitivity response respectively outputted by a first sound receptor unit and a second sound receptor unit through
a measuring module, the system comprising:
an equivalent circuit model establishing unit, for establishing a first equivalent circuit model based on the internal structure
parameters and the material parameters of the first sound receptor unit so as to generate a first simulated sensitivity response;

an equalizing unit, determining the accuracy of the first simulated sensitivity response and equalizing the second sensitivity
response according to the first sensitivity response to generate a corresponding sensitivity response difference data;

a storage unit, coupled to the equalizing unit, storing the sensitivity response difference data between the first sensitivity
response and the second sensitivity response;

a sound receiving system simulation unit, obtaining a third sensitivity response in corresponding to the first sound receptor
unit in the sound receiving system through simulating a first sound receiving system equivalent circuit model, wherein the
first sound receiving system equivalent circuit model is established by the first equivalent circuit model and a waveguide
equivalent circuit model associated with a waveguide;

a compensation unit, coupled to the storage unit and the sound receiving system simulation unit, compensating the third sensitivity
response according to the sensitivity response difference data between the first sensitivity response and the second sensitivity
response so as to generate a fourth sensitivity response in corresponding to the second sound receptor unit in the sound receiving
system for characterizing the second sound receptor unit in the sound receiving system.

US Pat. No. 9,144,183

EMI COMPARTMENT SHIELDING STRUCTURE AND FABRICATING METHOD THEREOF

Universal Scientific Indu...

1. An electronic package module having integrated EMI compartment shielding structure, comprising:
a substrate having mounting surface, comprising a ground pad exposedly arranged thereon;
at least one electronic element disposed on the mounting surface;
an encapsulating member disposed on the mounting surface, covering the ground pad and encapsulating at least one of the electronic
element, the encapsulating member having at least one peripheral surface,

wherein a trench is disposed in the encapsulating member to define at least two package compartments, the trench at least
partially exposes the ground pad,

wherein the terminal portions of the trench is arranged within the encapsulating member proximal to yet without compromising
the peripheral surface thereof;

wherein at least one notch is disposed into the encapsulating member from the peripheral surface thereof corresponding to
the location of the terminal portions of the trench;

a compartment structure disposed in the trench covering the trench surface,
wherein the compartment structure electrically connects the ground pad,
wherein the notch exposes the lateral surface of the compartment structure across the thickness of the encapsulating member;
and

a conformal shield disposed on the encapsulating member,
wherein the conformal shield electrically connects the compartment structure through the notch.

US Pat. No. 9,425,502

WIRELESS MODULE WITH INTEGRATED ANTENNA BY USING RIGID-FLEX BOARD

UNIVERSAL SCIENTIFIC INDU...

1. A wireless module with integrated antenna by using rigid-flex board, comprising:
a flex substrate comprising opposing first surface and second surface, a signal layer and a ground layer;
an antenna integrated in one side of said flex substrate, said antenna comprising a radiator and a feed-in segment and a grounding
segment extended from said radiator and respectively electrically connected to said signal layer and said ground layer;

a first rigid substrate directly stacked on at least a part of said first surface of said flex substrate at an opposite side
remote from said antenna; and

a communication unit integrated in said first rigid substrate and electrically connected to said signal layer;
wherein said antenna and said signal layer are located on said first surface.

US Pat. No. 9,461,362

MULTI-BAND ANTENNA

UNIVERSAL SCIENTIFIC INDU...

1. A multi-band antenna, comprising:
a feeding portion, one end of the feeding portion electrically connected to a signal source;
a shorting portion, one end of the shorting portion electrically connected to a ground plane;
a radiating portion, electrically connected to another end of the shorting portion and another end of the feeding portion,
wherein the radiating portion comprises a first radiating portion and a second radiating portion; and

a loop radiating portion, electrically connected to the feeding portion, wherein the first radiating portion, the second radiating
portion and the loop radiating portion operatively determine a first resonant frequency, a second resonant frequency and a
third resonant frequency respectively.

US Pat. No. 9,190,945

VOLTAGE REGULATOR, UNDER-VOLTAGE PROTECTION CIRCUIT THEREOF AND VOLTAGE REGULATION SYSTEM

UNIVERSAL SCIENTIFIC INDU...

1. A voltage regulator, configured for regulating the electrical power generated by a rotor coil of a batteryless alternator,
comprising:
an under-voltage protection circuit coupled between the batteryless alternator and a ground, the under-voltage protection
circuit comprising:

a voltage detection unit coupled to the batteryless alternator, operative to generate a first control signal according to
an output voltage of the batteryless alternator;

a plurality of switching circuits respectively coupled between the rotor coil of the batteryless alternator and the ground,
the switching circuits being controlled by the first control signal; and

a power switch, respectively coupled to one of the switching circuits and the rotor coil of the batteryless alternator; and
an exciting current regulating unit coupled to the power switch, operatively controlling the operation of the power switch
according to the output voltage to regulate the current flow through the rotor coil;

wherein the voltage detection unit detects whether the output voltage is lower than a threshold, and the voltage detection
unit outputs the first control signal according to the detection result to sequentially control the operations of the switching
circuits so as to selectively cut off the power switch;

wherein when the voltage detection unit detects that the output voltage is lower than the threshold while the exciting current
regulating unit turns on the power switch, the voltage detection unit sequentially controls the switching circuits cutting
off the power switch.

US Pat. No. 9,171,770

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

Universal Scientific Indu...

7. A electronic device having at least one module, comprising:
a substrate;
at least one component disposed on the substrate;
a molding encapsulating the component and a portion of the substrate, wherein the molding has a first hole and a second hole
to respectively expose a ground pad and a power pad of the component; and

a first conductive layer conformingly covering a majority of an upper surface of the molding, wherein the first conductive
layer includes a ground region and a power region separated from each other by a pattern, the ground region is electrically
connected to the ground pad through the first hole, and the power region is electrically connected to the power pad through
the second hole;

a passivation layer covering said first conductive layer and having an opening to expose a portion of the ground region; and
a second conductive layer covering said passivation layer and electrically connected to the ground region through the opening.

US Pat. No. 9,271,436

ELECTRONIC PACKAGED DEVICE AND MANUFACTURING METHOD THEREOF

UNIVERSAL SCIENTIFIC INDU...

1. An electronic package device manufacturing method, comprising:
configuring a plurality of electronic components on a surface of a substrate carrier; forming an encapsulating member on the
surface of the substrate carrier to cover the electronic components; separating the substrate carrier from the encapsulating
member; forming a plurality of first trenches and a plurality of first grounding trenches on a first surface of the encapsulating
member; disposing conductive material on the first surface of the encapsulating member, in the first trenches, and in the
first grounding trenches to form a conductive layer and a plurality of grounding structures; patterning the conductive layer
on the first surface to form a circuit layer, wherein the circuit layer includes at least one grounding pad electrically connected
to the grounding structures; forming a plurality of second trenches on a second surface of the encapsulating member corresponding
to the first trenches, the second surface being opposite the first surface of the encapsulating member; forming conductive
material in the second trenches, and electrically connecting the conductive material in the second trenches and the conductive
material in the first trenches to cooperatively form at least one shielding structure in the first and the second trenches;
separating the encapsulating member into a plurality of packaged units by cutting through the grounding structures of the
encapsulating member; and forming an electromagnetic shielding layer on external surfaces of each of the packaged units with
conductive material; wherein the electromagnetic shielding layer is electrically connected to the at least one grounding pad.

US Pat. No. 9,541,956

SUPPORTING STRUCTURE AND DOCKING STATION USING THE SAME

UNIVERSAL SCIENTIFIC INDU...

1. A supporting structure adapted to be arranged on a housing, comprising:
an elastic member;
a sliding member having an inclined plane and connected to the elastic member, when the elastic member receives a force, the
elastic element forces the sliding member to move along a first axis line;

a swing element having a first end portion and a second end portion opposite thereto, wherein when the first end portion rotates
relative to a pivot point, the swing element drives the sliding member to move along the first axis line;

a lifting element arranged over a travel path of the inclined plane and having an abutting portion, wherein when the sliding
member moves, the inclined plane faces toward the lifting element, and when the lifting element receives another force so
that the abutting portion abuts against the inclined plane, the sliding member stops moving and the lifting element is fixed
at a height position;

a damper mated with the sliding member to slow down a velocity of the sliding member; and
a return element having one end connected to the housing and the other end connected to the swing element;
when the swing element moves back to an initial position through the return element, the swing element drives the sliding
member to return to an original position.

US Pat. No. 9,459,885

SMART CARD MODULE AND OPERATING METHOD THEREOF

UNIVERSAL SCIENTIFIC INDU...

1. A smart card module adapted to a first peripheral platform to be function as a first electronic system, wherein the first
peripheral platform has a plurality of first interface connectors for respectively electrically connecting to a plurality
of first peripheral devices, the first interface connectors respectively correspond to a plurality of first predetermined
operating functions, and the first peripheral platform includes a first transmitting port, the smart card module comprising:
a connecting port corresponding to the first transmitting port; and
a processing unit electrically connected to the connecting port and having a plurality of functional chips;
wherein when the connecting port is electrically connected to the first transmitting port, the processing unit receives a
first identification data provided by the first peripheral platform through the connecting port, the first identification
data corresponds to the first predetermined operating functions, the processing unit determines the first predetermined operating
functions required by the first interface connectors, and executes some of the functional chips according to the first predetermined
operating functions to enable the first interface connectors, and the executed functional chips respectively correspond to
the first predetermined operating functions.

US Pat. No. 9,543,654

NFC ANTENNA

UNIVERSAL SCIENTIFIC INDU...

1. A near field communication (NFC) antenna, comprising:
a first radiating portion, formed by a first conducting wire surrounding an axis core, the first radiating portion comprising
a first signal input terminal and a first signal output terminal; and

a second radiating portion, formed by a second conducting wire surrounding the same axis core based on a surrounding direction
which the first radiating portion surrounds the axis core, the second radiating portion comprising a second signal input terminal
and an open end, the second signal input terminal is electrically connected to the first signal input terminal, and the open
end is disposed proximate to the first signal output terminal.

US Pat. No. 9,241,358

WIRELESS NETWORK CONFIGURATION METHOD AND SYSTEM FOR SMART APPLIANCE

UNIVERSAL SCIENTIFIC INDU...

1. A wireless network configuration method for a smart appliance, the method comprising the steps of:
a)turning on a smart appliance to start an access point mode (AP mode), and create a connection to a portable electronic device;
b) using the portable electronic device to exercise remote control and choose a wireless network access point (wireless network
AP) intended to create a connection to the smart appliance, wherein, if a service set identifier (SSID) and a login password
of the wireless network AP are stored in the portable electronic, device, the portable electronic device will send the SSID
and the login password to the smart appliance; and

c)attempting to create a connection to the wireless network AP upon receipt of the SSID and the login password of the wireless
network AP by the smart appliance, and switching from the AP mode to a hidden SSID mode automatically by the smart appliance
upon completion of connection, such that the smart appliance remains connected to the portable electronic device but is not
on an available wireless network list of the portable electronic device.

US Pat. No. 9,780,041

METHOD FOR MAKING EMI SHIELDING LAYER ON A PACKAGE

Universal Scientific Indu...

1. A method for making EMI shielding layer on a package, comprising the steps of:
a) disposing a UV curable adhesive on a light-transmissive substrate;
b) placing said package on said UV curable adhesive in such a way that said UV curable adhesive adheres to a surface of said
package having solder pads to cover the solder pads;

c) irradiating UV light toward said light-transmissive substrate to cure said UV curable adhesive;
d) forming an EMI shielding layer on said package; and
e) thermally releasing said UV curable adhesive by placing the package in a high temperature liquid to thermal release the
UV curable adhesive,

wherein said high temperature liquid has a temperature higher than 170° C.

US Pat. No. 9,814,166

METHOD OF MANUFACTURING ELECTRONIC PACKAGE MODULE

UNIVERSAL SCIENTIFIC INDU...

1. A method of manufacturing an electronic package module, comprising:
providing a circuit substrate comprising:
a mountable surface;
at least one ground pad on the mountable surface; and
at least one patterned predetermined region defined on the mountable surface;
mounting at least one electronic component on at least one portion of the mountable surface other than the predetermined region;
attaching at least one tape in the patterned predetermined region conforming to the shape of the patterned predetermined region;
forming a molding over the mountable surface, wherein the molding covers the tape and the at least one electronic component;
removing the molding formed on the patterned predetermined region;
forming an electromagnetic shielding layer over the molding to electrically connect to the ground pad; and
removing the tape, wherein removing the tape comprises providing heat to facilitate the removal of the tape,
wherein after removing the tape, the method further comprises:
mounting at least one optical component in the predetermined region.

US Pat. No. 9,653,809

ANTENNA MODULE AND ANTENNA THEREOF

Universal Scientific Indu...

1. An antenna, comprising:
a first radiation element;
a second radiation element having one end thereof connected with said first radiation element, said second radiation element
comprising a vertical section, a first coupling section and a second coupling section, said vertical section having two opposite
ends thereof respectively connected with said first radiation element and said first coupling section in a perpendicular manner
relative to said first radiation element and said first coupling section, said second coupling section having one end thereof
connected with said first coupling section, said first coupling section and said second coupling section having a respective
top side thereof spaced from and facing toward said first radiation element;

a third radiation element comprising a first connection section, a second connection section and a third connection section,
said first connection section having one end thereof connected with an opposite end of said second radiation element, said
first connection section being kept perpendicular relative to said second radiation element, said second connection section
having one end thereof connected with an opposite end of said first connection section, said third connection section being
connected with said second connection section and located at an internal side of said second connection section and abutted
against an opposite end of said second connection section, said third connection section being received a feeding signal,
wherein a line width of said first connection section is about 1.5 to 3 times over the line width of said second coupling
section;

a short-circuit portion located at an external side of said second connection section of said third radiation element, and
having a first segment and a second segment, said first segment connected with said second connection section, and kept perpendicular
relative to said second connection section, said second segment connected with said first segment, and kept perpendicular
relative to said first segment; and

a ground plane connected with said second segment of said short-circuit portion.

US Pat. No. 9,674,991

ELECTRONIC PACKAGED DEVICE

UNIVERSAL SCIENTIFIC INDU...

1. An electronic packaged device, comprising: a circuit layer including at least two grounding pads; a plurality of electronic
components electrically connected to the circuit layer; an encapsulating member covering at least one electronic component,
the encapsulating member having portions defining a trench to separate the encapsulating member into at least two encapsulating
compartments; at least one grounding structure electrically connected to the at least two grounding pads; a shielding structure
arranged between the encapsulating compartments; and an electromagnetic shielding layer disposed on the external surfaces
of the encapsulating member and electrically connected to the at least two grounding pads; wherein the trench is defined as
a first trench and a second trench, the shielding structure includes a first portion and a second portion, the first portion
is defined as conductive material filled in the first trench, and the second portion is defined as conductive material covering
outer surface of the second trench, the first portion is electrically connected to the second portion, and the second portion
is electrically connected to the electromagnetic shielding layer.

US Pat. No. 9,666,944

ANTENNA FOR WIRELESS COMMUNICATION

UNIVERSAL SCIENTIFIC INDU...

1. A wireless communication structure, comprising:
a plate, having a first surface, a second surface opposite to the first surface, and a lateral surface extending between the
first surface and the second surface;

a first antenna, located in the plate;
a first magnetic material layer, adjacent to the lateral surface of the plate;
a second magnetic material layer, located on the second surface of the plate; and
a connection layer, wherein the first surface of the plate and the first magnetic material layer are attached to a surface
of the connection layer.

US Pat. No. 9,853,832

WIRELESS ETHERNET NETWORK CONTROLLING METHOD AND WIRELESS ETHERNET NETWORK SYSTEM

UNIVERSAL SCIENTIFIC INDU...

1. A wireless Ethernet network controlling method, used for connecting a mobile device to an Ethernet though a wireless dock,
the method comprising:
connecting an Ethernet physical layer (PHY) to the Ethernet; wirelessly linking a first wireless network interface card (NIC)
of the wireless dock with a second wireless NIC of the mobile device;

a control server unit of the wireless dock receiving an operation status setting signal from a virtual Ethernet NIC of the
mobile device through the first wireless NIC, and the control server unit transmitting the operation status setting signal
to the Ethernet PHY for setting-up the operation of the Ethernet PHY;

and a virtual local area network (VLAN) unit processing the data packets transmitted between the Ethernet PHY and the first
wireless NIC;

wherein the step of wirelessly linking the first wireless network interface card (NIC) of the wireless dock with the second
wireless NIC of the mobile device comprises:

utilizing a driver to establish the virtual Ethernet NIC in the mobile device, wherein the virtual Ethernet NIC and the control
server unit are linking through the second wireless NIC and the first wireless NIC;

the driver is a computer program:
wherein in the step of the virtual local area network (VLAN) unit processing the data packets transmitted between the Ethernet
PHY and the first wireless NIC, when the wireless dock of the mobile device sends data packets from the Ethernet PHY to the
mobile device, the VLAN unit tags each data packet with a VLAN tag and then sends the tagged data packets to the second wireless
NIC of the mobile device through the first wireless NIC: when the mobile device sends data packets to the wireless dock of
the mobile device, the VLAN unit untags each data packet having the VLAN tag and sends the untagged data packets to the Ethernet
PHY.

US Pat. No. 9,748,881

VOLTAGE REGULATOR, OPERATION METHOD THEREOF, VOLTAGE REGULATING SYSTEM, AND MOBILE VEHICLE

UNIVERSAL SCIENTIFIC INDU...

10. A mobile vehicle, comprising:
a main body;
an alternator mounted on the main body, the alternator comprising a rotor coil, a first output terminal, a second output terminal,
a third output terminal and a ground terminal; the alternator operatively generating a voltage level of the phase signal outputted
by the third output terminal;

a battery coupled to the alternator, configured for outputting a supply voltage;
a starter unit comprising a starter switch, the starter switch being coupled to the battery; and
a voltage regulator mounted on the main body, the voltage regulator coupled to the alternator and the battery, the voltage
regulator comprising:

a voltage detection unit having a voltage detection terminal coupled to the third output terminal of the alternator, and operatively
detecting the voltage level of the phase signal of the alternator and generating an enable signal; and

a startup assisting unit coupled to the alternator, the rotor coil of the alternator, and the battery, the startup assisting
unit receiving the supply voltage from the battery and operatively generating a first exciting current responsive to the enable
signal for exciting the rotor coil;

wherein, when the voltage detection unit detects that the voltage level of the phase signal of the alternator is greater than
a predetermined voltage threshold, the voltage detection unit outputs the enable signal to cause the startup assisting unit
to generate the first exciting current to the rotor coil of the alternator, so that the alternator is able to establish voltage
under a low rotational speed;

wherein the startup assisting unit comprises:
a first resistor, the first terminal of the first resistor being coupled to the battery;
a second resistor, the first terminal of the second resistor being coupled to the battery and the second terminal of the second
resistor being coupled to the voltage detection unit;

a current amplifying unit having an input terminal, an output terminal and a control terminal, the input terminal being coupled
to the second terminal of the first resistor, the output terminal being coupled to the rotor coil of the alternator, and the
control terminal being coupled to the voltage detection unit to receive the enable signal; and

a first diode, an anode thereof being coupled to the output terminal of the current amplifying unit, and an cathode thereof
being coupled to the rotor coil of the alternator;

wherein the current amplifying unit generates the first exciting current according to the enable signal.

US Pat. No. 9,945,900

TESTING DEVICE FOR RADIO FREQUENCY FRONT END AND RADIO FREQUENCY FRONT END TESTING METHOD

UNIVERSAL SCIENTIFIC INDU...

1. A testing device for a radio frequency front end, used for testing a radio frequency front end module, the testing device for a radio frequency front end comprising:a processing module, receiving a testing control signal from a computer device;
a first multiplexing module including:
a first input terminal;
a first control terminal;
a second control terminal;
a third control terminal;
a first output channel terminal;
a second output channel terminal;
a third output channel terminal; and
a fourth output channel terminal, wherein the first control terminal, the second control terminal and the third control terminal of the first multiplexing module are electrically connected to the processing module; and
a second multiplexing module, including:
a first input terminal;
a first control terminal;
a second control terminal;
a third control terminal;
a first output channel terminal;
a second output channel terminal;
a third output channel terminal; and
a fourth output channel terminal, wherein the first control terminal, the second control terminal and the third control terminal of the second multiplexing module are electrically connected to the processing module;
a radio frequency front end signal module, including a first signal terminal and a second signal terminal, wherein the radio frequency front end signal module provides a first signal and a second signal through the first signal terminal and the second signal terminal, respectively; the first signal terminal of the radio frequency front end signal module is electrically connected to the first input terminal of the first multiplexing module; the second signal terminal of the radio frequency front end signal module is electrically connected to the first input terminal of the second multiplexing module;
wherein the first output channel terminal of the first multiplexing module and the first output channel terminal of the second multiplexing module are electrically connected to a first device under test; the second output channel terminal of the first multiplexing module and the second output channel terminal of the second multiplexing module are electrically connected to a second device under test; the third output channel terminal of the first multiplexing module and the third output channel terminal of the second multiplexing module are electrically connected to a third device under test; and the fourth output channel terminal of the first multiplexing module and the fourth output channel terminal of the second multiplexing module are electrically connected to a fourth device under test.

US Pat. No. 9,983,649

BATTERY-DRIVEN ELECTRONIC DEVICE

UNIVERSAL SCIENTIFIC INDU...

1. A battery-driven electronic device, comprising:a battery, outputting a battery voltage;
a plurality of loads;
a system unit; and
a battery energy manager, being connected with the battery, the loads and the system unit, and detecting the battery voltage, and having a low-voltage threshold and a cutoff threshold, wherein the low-voltage threshold is higher than the cutoff threshold, when the battery voltage is equal to or lower than the low-voltage threshold, the battery energy manager stops supplying power from the battery to at least one of the loads and outputs a suspension command to make the system unit perform a suspension process, and when the battery voltage is equal to or lower than the cutoff threshold, the battery energy manager stops supplying power to the loads and the system unit,
wherein the battery energy manager comprises a switch, a first voltage detecting unit, and a second voltage detecting unit, the switch is connected with the battery and the system unit, the first voltage detecting unit and the second voltage detecting unit detect the battery voltage, respectively, when the battery voltage is equal to or lower than the low-voltage threshold, the first voltage detecting unit stops supplying power to at least one of the loads and outputs the suspension command, when the battery voltage is equal to or lower than the cutoff threshold, the second voltage detecting unit controls the switch to cut off, so as to form an open circuit between the battery and the system unit.

US Pat. No. 9,881,875

ELECTRONIC MODULE AND METHOD OF MAKING THE SAME

UNIVERSAL SCIENTIFIC INDU...

1. A method of manufacturing an electronic module, comprising:
providing a circuit substrate including a first surface, at least one first ground pad, and a first predetermined area, wherein
the first ground pad and the first predetermined area are disposed on the first surface, and wherein the first ground pad
surrounds the first predetermined area and does not overlap with the first predetermined area;

forming a first tape onto the first predetermined area;
disposing at least one first electronic component on the first surface outside the first predetermined area;
forming a first molding member on the first surface, wherein the first molding member covers the first tape and the first
electronic component;

removing the first molding member on the first predetermined area; and
removing the first tape.

US Pat. No. 10,205,222

ELECTRONIC MODULE

UNIVERSAL SCIENTIFIC INDU...

1. An electronic module, comprising:an integrated circuit (IC);
a substrate having a top surface, a bottom surface and a lateral surface, the IC electrically connected to the bottom surface;
an antenna disposed on at least two of the top surface, the bottom surface and the lateral surface;
a frame board disposed on the bottom surface for electrically connecting the IC and the substrate to a circuit board;
a grounding layer within the substrate; and
a grounding plane within the frame board and electrically connected to the grounding layer.

US Pat. No. 9,966,663

DUAL-BAND ANTENNA MODULE

UNIVERSAL SCIENTIFIC INDU...

1. A dual-band antenna module comprising:a circuit board having a reference ground plane arranged therein;
a ground coupling portion disposed on the circuit board and electrically connected to the reference ground plane;
a first antenna disposed on the circuit board and spaced from the ground coupling portion, wherein the first antenna and the ground coupling portion are configured to couple with each other, the first antenna includes a first radiation unit, a first feeding portion disposed on the first radiation unit, a U-shaped conductive frame disposed on the first radiation unit, and the U-shaped conductive frame opening toward the circuit board; and
a second antenna spaced from the first antenna, wherein the second antenna includes a second radiation unit, a high-frequency impedance portion, and a second feeding portion disposed on the second radiation unit, the second radiation unit and the high-frequency impedance portion are respectively disposed on two opposite surfaces of the circuit board to resonate to each other, and the second radiation unit includes a ground extension portion electrically connected to the reference ground plane.

US Pat. No. 10,166,660

SCREW LOCKING CONTROL SYSTEM AND OPERATING SYSTEM USING THE SAME

UNIVERSAL SCIENTIFIC INDU...

1. An operating method for a screw locking control system, the screw locking control system comprising a host, a control unit, an electric screw driver and a holder, the control unit having a processor, a voltage detecting module, a power outlet electrically connected to the voltage detecting module, and a lighting signal control module, the processor being controlled by the host and electrically connected to the host, the voltage detecting module, and the lighting signal control module, the electric screw driver electrically connected to the power outlet, the holder having a plurality of indicator lamps electrically connected to the lighting signal control module, the holder being capable of mounting a product which is to be screw locked, the plurality of indicator lamps corresponding to each screw hole of the product to be screw locked, the indicator lamps being controlled and turned on sequentially by the lighting signal control module, the operating system comprising the steps of:a) the host transmitting a setting data of each screw locking operation to the control unit;
b) the control unit sequentially turning on the indicator lamps according to the setting data via the lighting signal control module and the electric screw driver sequentially performing each screw locking operation, the voltage detecting module detecting a voltage variance of the electric screw driver in each screw locking operation to determine whether each screw locking operation is qualified; and
c) the control unit transmitting the results of each screw locking operation to the host and displaying the results,
wherein step a) further comprises an initial data setting operation, which comprises setting a locking order first, performing each screw locking operation according to the locking order, and sending the results of each voltage variance to the host to define a preset screw locking time interval of each screw, and
wherein in step b) the voltage detecting module detects the voltage variance of the electric screw driver when the electric screw driver is turned on and turned off to define an actual screw locking time interval; the host compares the actual screw locking time interval and the preset screw locking time interval to determine whether each screw locking operation is qualified.

US Pat. No. 10,269,590

SCRUBBING APPARATUS FOR ELECTRONIC MODULE

UNIVERSAL SCIENTIFIC INDU...

1. An automatic scrubbing apparatus for an electronic module, comprising:a carrier and a fixing frame for limiting and fixing the electronic module;
a cleaning brush for brushing the electronic module;
and
a nozzle for spraying a bromine-based cleaning agent on a surface of the electronic module;
wherein the fixing frame locates above the electronic module to limit the electronic module, and a moving track of the fixing frame and a moving track of the cleaning brush do not interfere with each other.

US Pat. No. 10,481,190

TEST DEVICE WITH A BUILT-IN TEST ANTENNA

UNIVERSAL SCIENTIFIC INDU...

1. A test device with a built-in test antenna for testing a device under test having an antenna under test, the test device comprising:a test board electrically connected to a test apparatus;
a test socket disposed on the test board for carrying the device under test;
an antenna assembly including a test antenna and an antenna board, the antenna assembly being disposed inside the test socket so as to be coupled to the antenna under test;
wherein the antenna board is electrically connected to the test board, and the position of the test antenna corresponds to that of the antenna under test.

US Pat. No. 10,389,811

CLOUD DATA TRANSMISSION SYSTEM AND DYNAMIC DATA FLOW DECENTRALIZING METHOD THEREOF

UNIVERSAL SCIENTIFIC INDU...

1. A cloud data transmission system, characterized in that said cloud data transmission system comprises:at least one static relay server, connected to a plurality of user devices and configured to facilitate said plurality of user devices to conduct peer-to-peer data transmission;
at least one dynamic relay server, configured to switch a working mode according to a working load of said static relay server and share said working load of said static relay server;
a cloud server, connected to said static relay server, said dynamic relay server and said plurality of user devices and configured to dynamically coordinate the linkage among said static relay server, said dynamic relay server and said plurality of user devices so as to adjust said working load of said static relay server; and
a personal relay server, configured to enable at least two specific user devices of said plurality of user devices to conduct peer-to-peer data transmission,
wherein, when said working load of said static relay server is heavier than a predetermined load, said cloud server controls said dynamic relay server to switch from a standby mode to an active mode such that at least two of said plurality of user devices are connected to said dynamic relay server to conduct data transmission through said dynamic relay server;
wherein, said personal relay server outputs login information of said at least two specific user devices and identifier information of said personal relay server to said cloud server, such that said cloud server stores said identifier information into a personal relay server management unit and register said personal relay server as an exclusive relay server for said at least two specific user devices;
wherein said personal relay server includes:
a service register, configured to output said login information of said at least two specific user devices and said identifier information to said cloud server;
a third verification controller, configured to check said login information provided by said at least two specific user devices with said cloud server;
a third working load monitor, configured to monitor and store a present working load, and output said present working load to said cloud server; and
a third data transmitter, configured to transmit data outputted by said at least two specific user devices to destination user devices corresponding thereto.

US Pat. No. 10,373,916

SEMICONDUCTOR DEVICE PACKAGES

UNIVERSAL SCIENTIFIC INDU...

1. A semiconductor device package comprising:a substrate having a top surface and a lateral surface perpendicular to the top surface;
at least one component on the top surface of the substrate;
a package body encapsulating the at least one component and having a lateral surface; and
an electromagnetic interference (EMI) shield conformally formed on the package body and covering the lateral surface of the package body, the EMI shield having a first side portion defining a first opening;
wherein the lateral surface of the package body covered by the EMI shield is substantially coplanar with the lateral surface of the substrate,
the at least one component is configured to operate at a frequency of operation, and the EMI shield having the first opening is configured to shift a resonant frequency that corresponds to the frequency of operation of the at least one component, and
the first opening has a first length L1 determined by 0.026??L1?0.155? and ? is a wavelength related to the frequency of operation of the semiconductor device package, and the frequency of operation is in a range from approximately 5.180 GHz to approximately 5.825 GHz.

US Pat. No. 10,798,814

SIP MODULE AND MANUFACTURING METHOD OF THE SIP MODULE

UNIVERSAL SCIENTIFIC INDU...

1. A manufacturing method of a system in package (SiP) module, comprising the steps of:welding electronic units required by the SiP module onto a top surface of a Printed Circuit Board (PCB), and having welding spots being reserved on a bottom surface of the PCB to obtain a PCB assembly (PCBA) of the SiP module via a surface mount technology;
pasting tightly a functional film on a surface of the electronic units of the PCBA; filling on plastic materials on the top surface of the PCBA, ensuring that the plastic materials cover the electronic units and the functional film on the top surface of the PCBA, and obtaining solidified PCBA after the plastic materials are solidified; and cutting the solidified PCBA to obtain a plurality of the SiP modules;
applying metal sputtering on a periphery and a top surface of the SiP module to form an electromagnetic shielding layer; andwherein the functional film includes: a plurality of film units being spaced apart from each other by cutting channels, wherein each of the cutting channels is connected to adjacent ones of the film units and is formed with a hollow portion, and wherein each of the film units corresponds to a respective one of the SiP modules.

US Pat. No. 10,445,276

SERVER SYSTEM HAVING A HOT PLUG MOTHERBOARD

UNIVERSAL SCIENTIFIC INDU...

1. A server system having a hot plug motherboard, comprising:a motherboard module including a plurality of motherboards;
at least one midplane board being coupled to each of the motherboards via a hot plug connector, the midplane board including at least one Peripheral Component Interconnect Express (PCIe) slot, the PCIe slot being configured to be plugged with a PCIe card; and
a hard disk module including a plurality of hard disks, the plurality of hard disks being coupled to the PCIe card through a first signal wire;
wherein the plurality of motherboards includes a first motherboard, a second motherboard, a third motherboard, a fourth motherboard, a fifth motherboard and a sixth motherboard connected to each other, the third motherboard and the fourth motherboard are parallel to each other, the fifth motherboard and the sixth motherboard are parallel to each other, the third motherboard and the fourth motherboard are disposed on the fifth motherboard and the sixth motherboard, the third motherboard is disposed opposite to the fifth motherboard, the fourth motherboard is disposed opposite to the sixth motherboard, the at least one midplane board includes a first midplane including a first hot plug connector, the first midplane is coupled to a second hot plug connector of the fifth motherboard and a third hot plug connector of the sixth motherboard through the first hot plug connector, an extension board is disposed on the first midplane board, the extension board includes a fourth hot plug connector and is electrically connected to the first midplane board through a second signal wire, and the extension board is coupled to a fifth hot plug connector of the third motherboard and a sixth hot plug connector of the fourth motherboard through the fourth hot plug connector.

US Pat. No. 10,598,693

TEST SOCKET FOR A CHIP

UNIVERSAL SCIENTIFIC INDU...

1. A test socket for a chip, comprising:a recess for receiving the chip, which is surrounded by a first section, a second section, a third section and a fourth section, wherein the first section is connected to the second section and the fourth section and wherein the third section is connected to the second section and the fourth section;
a first push mechanism arranged at the first section, the first push mechanism comprising:
a first push button, wherein the first push button has a first protrusion at its top;
a first vertical elastic member connected to a bottom of the first push button;
a first pusher cooperated with the first push button, wherein the first pusher has a first pushing end extending into the recess; and
a first lateral elastic member connected to a first abutment end of the first pusher, wherein the first abutment end is opposite the first pushing end;
wherein the first vertical elastic member upwardly pushes the first push button such that the first protrusion protrudes from a top surface of the first section and the first push button engages with the first pusher such that the first pusher is not pushed by the first lateral elastic member when no force is applied to the first push button, and wherein the first push button moves downwardly and the first lateral elastic member pushes the first pusher to move toward the recess when the first protrusion of the first push button is pressed;
a second push mechanism arranged at the second section, the second push mechanism comprising:
a second push button, wherein the second push button has a second protrusion at its top;
a second vertical elastic member connected to a bottom of the second push button;
a second pusher cooperated with the second push button, wherein the second pusher has a second pushing end extending into the recess; and
a second lateral elastic member connected to a second abutment end of the second pusher, wherein the second abutment end is opposite the second pushing end;
wherein the second vertical elastic member upwardly pushes the second push button such that the second protrusion protrudes from a top surface of the second section and the second push button engages with the second pusher such that the second pusher is not pushed by the second lateral elastic member when no force is applied to the second push button, and wherein the second push button moves downwardly and the second lateral elastic member pushes the second pusher to move toward the recess when the second protrusion of the second push button is pressed.

US Pat. No. 10,643,955

METHOD OF MANUFACTURING SIP MODULE BASED ON DOUBLE PLASTIC-SEALING AND THE SIP MODULE

UNIVERSAL SCIENTIFIC INDU...

1. A manufacturing method of a system in package (SiP) module based on double plastic-sealing, the manufacturing method comprising the steps of:welding electronic units required by the SiP module onto a top surface of a Printed Circuit Board (PCB), with welding spots being reserved on a bottom surface of the PCB to obtain a PCB assembly (PCBA);
implementing a first-time filling to fill on plastic materials on a top surface of the PCBA, ensuring that the plastic materials cover the electronic units on the top surface of the PCBA, and obtaining a first-time plastic-sealing PCBA after the plastic materials are solidified;
pasting tightly a functional film on a top surface of the first-time plastic-sealing PCBA to obtain a film-pasted PCBA; and
implementing a second-time filling to fill on plastic materials on the film-pasted PCBA, ensuring that the plastic materials cover a top surface and a periphery of the film-pasted PCBA, and obtaining the SiP module after the plastic materials of the second-time filling are solidified.