1. An electrochemical or chemical treatment device for high aspect ratio circuit board with through hole, comprising:an electroplating tank;
a solution storage tank;
a positioning frame, the positioning frame locates the circuit board inside the electroplating tank for the electroplating tank to be divided into a solution accumulated area and a suction area by the positioning frame and the circuit board;
a priming piping sucking solution from the solution storage tank to the solution accumulated area;
a suction cap corresponding to the suction area; and
a suction piping connected to the suction cap, using the negative pressure produced by suction to make the solution flow through the through hole of the circuit board, and then sucks the solution back to the solution storage tank;
whereby when the positioning frame is located inside the electroplating tank, the priming piping begins to prime the solution into the solution accumulated area of the electroplating tank, after the solution has reached the working liquid level, the suction piping sucks the solution by the suction cap and transmits the solution back to the solution storage tank, and then forms a loop system for the through hole of the circuit board to do electrochemical treatment or chemical treatment continuously.