US Pat. No. 9,240,768

DUPLEXER WITH TRANSMISSION AND RECEPTION FILTERS EACH INCLUDING RESONATORS FORMED ON DIFFERENT CHIPS

TAIYO YUDEN CO., LTD., T...

1. A duplexer including a transmission filter and a reception filter, a passband of one filter of the transmission filter
and the reception filter being lower than a passband of the other of the transmission filter and the reception filter, wherein:
each of the transmission filter and the reception filter includes a series resonator and a parallel resonator connected in
a ladder shape,

first resonators that are the series resonator of the one filter and the parallel resonator of the other filter and are formed
on a first chip,

second resonators that are the series resonator of the other filter and the parallel resonator of the one filter and are formed
on a second chip that is different from the first chip, and

wherein a temperature coefficient of frequency of the first resonators is smaller than a temperature coefficient of frequency
of the second resonators.

US Pat. No. 9,240,769

PIEZOELECTRIC THIN FILM RESONATOR, FILTER, COMMUNICATION MODULE AND COMMUNICATION DEVICE

TAIYO YUDEN CO., LTD., T...

1. A piezoelectric thin film resonator comprising:
a substrate;
a lower electrode provided on the substrate;
a piezoelectric film provided on the lower electrode; and
an upper electrode provided on the piezoelectric film,
wherein, at least a portion of the upper electrode and that of the lower electrode oppose each other through the piezoelectric
film, and at least a portion of a periphery of the upper electrode sticks out from an upper end portion of the piezoelectric
film and has a hood-like shape, and at least the portion of the periphery of the upper electrode sticking out like a hood
has a reversely tapered shape extending from an edge, or a location adjacent to the edge, of the piezoelectric film.

US Pat. No. 9,281,465

PIEZOELECTRIC ELEMENT AND METHOD OF MANUFACTURING THE SAME

TAIYO YUDEN CO., LTD., T...

1. A piezoelectric element comprising first internal electrodes and second electrodes, as well as piezoelectric ceramic layers
that are made of ceramics and arranged between the first internal electrodes and second internal electrodes, wherein manganese
is present and distributed more abundantly in areas of the piezoelectric ceramic layers immediately adjacent to the first
internal electrodes and second internal electrodes, than at center areas of the piezoelectric ceramic layers between and away
from the first internal electrodes and second internal electrodes,
wherein the piezoelectric ceramic layers have an alkali-containing niobate perovskite structure as a main phase,
wherein the piezoelectric ceramic layers contain silicon at a ratio of 0.2 mol or more but 3.0 mol or less relative to 100
mol of the main phase.

US Pat. No. 9,148,118

ACOUSTIC WAVE FILTER AND MODULE

TAIYO YUDEN CO., LTD., T...

1. An acoustic wave filter comprising:
multimode filters, each including an IDT, connected in parallel;
a ceiling that is commonly located above at least two multimode filters of the multimode filters so as to form a cavity between
the IDT and the ceiling, electrically connected to the multimode filters, and formed of a metal; and

at least two terminals, each electrically connected to the ceiling for connecting the ceiling to an external ground, said
at least two terminals being located directly above the at least two multimode filters, respectively, so that each of said
at least two terminals is directly above a corresponding one of said at least two multimode filters.

US Pat. No. 9,118,303

FILTER, DUPLEXER, AND COMMUNICATION MODULE

TAIYO YUDEN CO., LTD., T...

1. A filter comprising:
acoustic wave resonators located in a first path connected between an input terminal and an output terminal; and
a cancel circuit including a second path and a first acoustic wave resonator, the second path having a first and a second
nodes, each of which is located in the first path so that the second path is parallelly connected to at least a part of the
acoustic wave resonators, and one end of the first acoustic wave resonator being connected to a third node that is located
between the first and the second nodes in the second path and another end of the first acoustic wave resonator being connected
to ground.

US Pat. No. 9,076,595

CAPACITOR

Taiyo Yuden Co., Ltd., T...

1. A capacitor, comprising:
a dielectric layer having a first plane, a second plane opposite to the first plane, and a plurality of through-holes communicated
with the first plane and the second plane; the plurality of through-holes including a first through-hole and a second through-hole,
the first through-hole including a first hole diameter part having a first hole diameter and a second hole diameter part having
a second hole diameter smaller than the first hole diameter at a second plane side;

a first external conductor layer disposed on the first plane;
a second external conductor layer disposed on the second plane;
a first internal electrode formed in the first through-hole, connected to the first external electrode layer, disposed in
the second hole diameter part at a tip and separated from the second external electrode layer; and

a second internal electrode formed in the second through-hole, connected to the second external electrode layer, and separated
from the first external electrode layer.

US Pat. No. 9,054,674

ACOUSTIC WAVE FILTER, COMMUNICATION MODULE, AND METHOD FOR MANUFACTURING THE FILTER

TAIYO YUDEN CO., LTD., T...

10. A duplexer comprising filters, at least one of the filters including:
a substrate;
resonators that are arranged on the substrate and excite acoustic waves;
a ground terminal on the substrate;
interconnection lines interconnecting the resonators and connecting predetermined ends of the resonators to the ground terminal;
and

shield electrodes disposed so that respective ones of the shield electrodes are close to and face corresponding ones of the
interconnection lines,

wherein the shield electrodes are formed into a single shield electrode having openings, and respective ones of the openings
are formed above corresponding ones of the resonators.

US Pat. No. 9,065,539

CIRCUIT MODULE

TAIYO YUDEN CO., LTD., T...

1. A circuit module, comprising:
a circuit substrate formed by stacking conductive layers and insulating layers;
a high-frequency integrated circuit that has a reception circuit and a transceiver circuit that are mounted on a main surface
of the circuit substrate, the reception circuit processing reception signals for a satellite positioning system and the transceiver
circuit processing high-frequency signals for mobile phone communication;

one or more front end components for the satellite positioning system arranged on a path of the reception signals between
a satellite positioning system antenna and the high-frequency integrated circuit; and

one or more front end components for a mobile phone arranged on a path of the high-frequency signals between a mobile phone
communication antenna and the high-frequency integrated circuit,

wherein at least one of the front end components for the mobile phone is mounted on the main surface of the circuit substrate,
wherein at least one of the front end components for the satellite positioning system is embedded in the circuit substrate,
wherein the one or more front end components for the satellite positioning system includes a filter that allows the reception
signals for the satellite positioning system to pass through,

wherein the filter is embedded in the circuit substrate,
wherein the one or more front end components for the satellite positioning system includes an amplifier that amplifies the
reception signals for the satellite positioning system,

wherein the filter allows reception signals amplified by the amplifier to pass through, and
wherein a distance between the filter and the amplifier is greater than a distance between the filter and the front end components
for the mobile phone and greater than a distance between the filter and the high-frequency integrated circuit in a plan view.

US Pat. No. 9,252,832

HIGH-FREQUENCY CIRCUIT AND COMMUNICATION DEVICE

TAIYO YUDEN CO., LTD., T...

1. A high-frequency circuit comprising:
first duplexers, each including:
a first transmit filter having a first transmit band,
a first receive filter having a first receive band, and
a first common terminal to which a first end of the first transmit filter and a first end of the first receive filter are
commonly connected;

a first switch that selects and connects one of the first common terminals to a first antenna;
an LPF (low pass filter) or BPF (band pass filter) that is connected between the first antenna and the first switch, and passes
a signal in the first transmit band and the first receive band; and

a second duplexer including:
a second transmit filter having a second transmit band higher in frequency than the first transmit band,
a second receive filter having a second receive band higher in frequency than the first receive band, and
a second common terminal that is connected to a second antenna and to which a first end of the second transmit filter and
a first end of the second receive filter are commonly connected,

wherein a transmit of a transmit signal of the first transmit band and a receive of a receive signal of the second receive
band are performed simultaneously, and

wherein a frequency of a second order harmonics or a third order harmonics of the transmit signal overlaps the second receive
band.

US Pat. No. 9,101,050

CIRCUIT MODULE HAVING ELECTRICAL SHIELD

Taiyo Yuden Co., Ltd., T...

1. A circuit module, comprising:
a circuit substrate having a mount surface;
a mount component mounted on the mount surface;
a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from
a main surface of the sealing body to the mount surface, the trench including a side wall configured of a first section at
a mount surface side and a second section at a main surface side, the first section and the second section are adjacent to
each other, the first section having a first slope against the mount surface in a cross section perpendicular to the mount
surface and perpendicular to an extending direction of the trench, when a connection point between the first section and the
second section is defined as a first point and a connection point between the second section and the main surface is defined
as a second point, a straight line connecting the first point and the second point having a second slope gentler than the
first slope against the mount surface; and

a shield covering the sealing body and having an inner shield section formed within the trench and an outer shield section
disposed on the main surface and the inner shield,

wherein the first point is disposed at a position higher than a mounted height of the mount component disposed adjacent to
the trench, and

wherein the mount component includes a plurality of mount components, and
the trench is formed between the plurality of mount components such that the plurality of mount components are separated.


US Pat. No. 9,231,553

ACOUSTIC WAVE FILTER

TAIYO YUDEN CO., LTD., T...

1. An acoustic wave filter, comprising:
a piezoelectric substrate;
a comb-shaped electrode formed on said piezoelectric substrate;
a wiring portion connected to said comb-shaped electrode; and
a dielectric layer formed to cover said comb-shaped electrode,
wherein said wiring portion comprises a lower layer wiring portion disposed in a same layer as said comb-shaped electrode
and an upper layer wiring portion disposed over said lower layer wiring portion,

wherein said upper layer wiring portion has an upper portion and a lower portion, and a width of the upper portion of said
upper layer wiring portion is greater than a width of the lower portion of said upper layer wiring portion,

wherein the width of the lower portion of the upper layer wiring portion is smaller than a width of the lower layer wiring
portion, and

wherein the width of the upper portion of the upper layer wiring portion is greater than the width of the lower layer wiring
portion.

US Pat. No. 9,177,092

METHOD FOR ARRANGING AND WIRING RECONFIGURABLE SEMICONDUCTOR DEVICE, PROGRAM THEREFOR, AND ARRANGING AND WIRING APPARATUS

TAIYO YUDEN CO., LTD., T...

1. An arrangement and wiring method of a reconfigurable semiconductor device, characterized by comprising:
generating a net list based on a circuit description in which a circuit configuration is described;
extracting a sequential circuit data set which is to be scanned from the net list;
generating a first truth value table data set so as to write into a first set among plurality of memory cell units from the
sequential circuit data set which is to be scanned; and

generating a second truth value table data set so as to write into a second set among the plurality of memory cell units from
a combination logic circuit data set of the net list;

wherein the reconfigurable device includes the plurality of memory cell units configuring arrays and are connected to each
other, and the memory cell units operate as a logic element when truth value table data is written in configured so as to
output a logic calculation of an input value specified by a plurality of addresses to a data line, and/or operate as a connection
element when truth value table data is written in configured so as to output an input value specified by a certain address
to a data line connected to an address of another memory cell unit, and

wherein a memory cell unit to which the first truth value table data set is allotted is simulated with an execution in synchronization
with a clock, and/or the plurality of the second truth value table data sets are simulated with an execution in non-synchronization
with the clock, and whether the semiconductor device realizes a certain operation speed is evaluated.

US Pat. No. 9,148,115

FILTER AND DUPLEXER

TAIYO YUDEN CO., LTD., T...

1. A filter comprising:
a filter circuit connected between a first terminal and two second balanced terminals and including a first DMS filter and
a second DMS filter, one terminal of the first DMS filter being connected to one of the two second balanced terminals, and
one terminal of the second DMS filter is connected to another of the two second balanced terminals; and

a matching circuit including a first inductor and a second inductor, the first inductor being connected in series between
the one terminal of the first DMS filter and the one of the two second balanced terminals, and the second inductor being connected
in series between the one terminal of the second DMS filter and the another of the two second balanced terminals, wherein

a first impedance viewed from the one of the two second balanced terminals toward the matching circuit is less than a second
impedance viewed from a node between the one terminal of the first DMS filter and the one of the two second balanced terminals
toward the filter circuit, and a third impedance viewed from the another of the two second balanced terminals toward the matching
circuit is less than a fourth impedance viewed from a node between the one terminal of the second DMS filter and the another
of the two second balanced terminals toward the filter circuit.

US Pat. No. 9,197,190

ELECTRONIC COMPONENT MODULE

TAIYO YUDEN CO., LTD., T...

1. An electronic component module comprising:
a multi-layered wiring board formed by stacking insulating layers, an inner wiring layer formed between the insulating layers,
and a surface wiring layer formed on an outermost insulating layer of the insulating layers; and

an acoustic wave device located inside the multi-layered wiring board,
wherein the acoustic wave device includes a substrate, a functional element and a sealing portion, the functional element
being located on the substrate and exciting an acoustic wave, the sealing portion being located on an upper surface of the
substrate and sealing the functional element so as to form an air-space above the functional element,

wherein a terminal portion of the surface wiring layer does not overlap with the air-space of the acoustic wave device as
viewed from a stacking direction of the multi-layered wiring board, the terminal portion being a region to which a terminal
of an electronic component is fixed in the surface wiring layer,

wherein each of the insulating layers extends to outside of the substrate, and at least one of the insulating layer is located
between an upper surface of the acoustic wave device and the surface wiring layer.

US Pat. No. 9,148,121

ACOUSTIC WAVE FILTER, DUPLEXER, AND MODULE

TAIYO YUDEN CO., LTD., T...

1. An acoustic wave filter comprising:
at least a parallel resonator, wherein
at least one of the parallel resonator includes a first piezoelectric substance, a first IDT (Interdigital Transducer) located
on the first piezoelectric substance, and first reflectors located on the first piezoelectric substance so as to sandwich
the IDT, and

G is less than 0 and greater than or equal to ?0.05?IDT where D1=0.25(?ref+?IDT)+G, a distance between a center of a first electrode finger that is an electrode finger closest to the first reflector among
electrode fingers of the first IDT and a center of a second electrode finger that is an electrode finger closest to the first
IDT among electrode fingers of the first reflector is D1, a period of the electrode fingers of the first IDT is ?IDT, and a period of the electrode fingers of the first reflector is ?ref.

US Pat. No. 9,252,732

ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME

TAIYO YUDEN CO., LTD., T...

1. An acoustic wave device comprising:
a piezoelectric substrate;
a dielectric layer formed on an upper surface of the piezoelectric substrate;
a first transmission filter that is connected between a first transmission terminal and a first antenna terminal and that
includes first comb-tooth electrodes formed on an upper surface of the dielectric layer;

a second transmission filter that is connected between a second transmission terminal and a second antenna terminal and that
includes second comb-tooth electrodes formed on the upper surface of the dielectric layer;

a first reception filter that is connected between a first reception terminal and the first antenna terminal; and
a second reception filter that is connected between a second reception terminal and the second antenna terminal,
wherein the dielectric layer has a first thickness between a lower surface of the first comb-tooth electrodes and the upper
surface of the piezoelectric substrate and has a second thickness between a lower surface of the second comb-tooth electrodes
and the upper surface of the piezoelectric substrate, the first and second thicknesses being different from each other,

wherein the first comb-tooth electrodes and the second comb-tooth electrodes excite a surface acoustic wave or a boundary
acoustic wave propagated on a surface of the dielectric layer.

US Pat. No. 9,214,209

SEMICONDUCTOR DEVICE

TAIYO YUDEN CO., LTD., T...

1. A semiconductor device, comprising:
N (N is an integer equal to two or more) number of address lines;
N number of data lines; and
a plurality of storage sections, each of the storage sections including:
an address decoder which decodes an address inputted from the N number of address lines, and outputs a word selection signal
to a word line; and

a plurality of storage elements, each of which being connected to the word line and the data lines, storing data configuring
a truth table, and inputting and outputting the data to and from the data lines based on the word selection signal inputted
from the word line,

wherein the N number of address lines of one storage section are respectively connected to the data lines of the N number
of other storage sections, and the N number of data lines of one storage section are respectively connected to the address
lines of the N number of other storage sections,

wherein the address decoder includes a row decoder and a column decoder,
wherein the row decoder decodes an address inputted from the M (M is an integer equal to five or less) number of address lines,
and outputs the word selection signal to the word line, and

wherein the column decoder decodes an address inputted from the L (L is an integer of N?5) number of address lines and outputs
a data selection signal which selects the N number of data lines outputted from the plurality of storage elements.

US Pat. No. 9,236,848

FILTER, DUPLEXER, COMMUNICATION MODULE AND COMMUNICATION DEVICE

TAIYO YUDEN CO., LTD., T...

1. A filter comprising:
a primary transducer connected to a primary terminal;
a secondary transducer connected to a plurality of secondary terminals; and
a coupling transducer for mechanically coupling the primary transducer and the secondary transducer,
wherein each of the primary transducer, the secondary transducer, and the coupling transducer comprises an upper electrode,
a lower electrode arranged below the upper electrode, and a piezoelectric film interposed between the upper electrode and
the lower electrode,

wherein the primary transducer and the secondary transducer are arranged on the upper electrode of the coupling transducer,
wherein the lower electrode of the primary transducer, the lower electrode of the secondary transducer, and the upper electrode
of the coupling transducer are grounded,

wherein the primary transducer includes two top electrodes connected in parallel to the primary terminal,
wherein the secondary transducer includes a plurality of top electrodes respectively connected to the plurality of secondary
terminals,

wherein the primary transducer includes two excitation portions,
wherein the secondary transducer includes a plurality of excitation portions, and
wherein, with respect to the primary transducer and the secondary transducer, respective areas of the two excitation portions
and respective areas of the plurality of excitation portions are equal to one another.

US Pat. No. 9,177,726

MULTILAYER CERAMIC CAPACITOR

TAIYO YUDEN CO., LTD., T...

1. A multilayer ceramic capacitor with a laminate constituted by dielectric layers alternately laminated with internal electrode
layers, said multilayer ceramic capacitor satisfies conditions of 1.5×D1 direction, D2 represents an average grain size of dielectric grains present at a center position in the laminate in the laminating direction,
and D3 represents an average grain size of dielectric grains present at an intermediate position equidistant from the outermost layer
position and the center position in the laminate in the laminating direction.

US Pat. No. 9,083,303

ACOUSTIC WAVE DEVICE

TAIYO YUDEN CO., LTD., T...

1. An acoustic wave device comprising:
a substrate;
a dielectric film formed on the substrate; and
a pair of IDT electrodes opposing each other provided between the substrate and the dielectric film,
wherein at least one of the substrate and the dielectric film is piezoelectric,
wherein the IDT electrodes each include an electrode finger that extends in at least one direction,
wherein the dielectric film has a sloped area in a gap portion that is an area between a tip of the electrode finger of one
of the IDT electrodes and the other IDT electrode that is opposing to said one of the IDT electrodes in the direction of extension
of the electrode finger, so that a film thickness of the dielectric film changes in said gap, and

wherein a film thickness difference caused by the change in the film thickness of the dielectric film in said sloped area
is greater than a thickness of the IDT electrodes.

US Pat. No. 9,070,963

DUPLEXER

TAIYO YUDEN CO., LTD., T...

2. A duplexer comprising:
a reception filter that is connected between a reception terminal and an antenna terminal;
a transmission filter that is connected between a transmission terminal and the antenna terminal;
a chip in which the reception filter is formed; and
a wiring substrate, the chip being mounted on an upper surface of the wiring substrate,
wherein the reception terminal, the transmission terminal and the antenna terminal are formed on a lower surface of the wiring
substrate; a reception electrode is electrically connected to the reception terminal, a transmission electrode is electrically
connected to the transmission terminal; an antenna electrode is electrically connected to the antenna terminal; a circular
metal layer surrounds the reception electrode, the transmission electrode and the antenna electrode, and is electrically connected
to a ground; the reception electrode, the transmission electrode, the antenna electrode and the circular metal layer are formed
on the upper surface of the wiring substrate; and between a side of the circular metal layer that is closest to the reception
terminal and the transmission terminal and an opposite side of the circular metal layer, the reception electrode is located
closer to said side of the circular metal layer that is closest to the reception terminal and the transmission terminal than
the opposite side,

wherein a shortest distance between the reception electrode and said side of the circular metal layer that is closest to the
reception terminal and the transmission terminal is larger than a width of said side of the circular metal layer, and

wherein the shortest distance between the reception electrode and said side of the circular metal layer is larger than a shortest
distance between the transmission electrode and said side of the circular metal layer.

US Pat. No. 9,257,223

INDUCTOR

TAIYO YUDEN CO., LTD., T...

1. An inductor that uses soft magnetic alloy powder-containing resin that contains amorphous soft magnetic alloy powder, which
resin is used as a sealing material that seals a coil wound around a winding core of a core, wherein:
the soft magnetic alloy powder-containing resin contains two groups of large and small particles separately dispersed in a
cured resin, and seals the coil without compression, said two groups of large and small particles having a first peak and
a second peak in their particle size distribution, respectively;

a particle size corresponding to the second peak is equal to or smaller than one-half a particle size corresponding to the
first peak, and an magnitude ratio (abundance ratio) of the second peak and first peak is 0.2 or more but 0.6 or less; and

a top flange is formed integrally on a top end of the winding core, and a bottom flange is formed integrally on a bottom end
of the winding core, wherein the bottom flange is larger than the top flange to inhibit dripping of the sealing material when
the material is applied.

US Pat. No. 9,196,816

PIEZOELECTRIC OSCILLATION DEVICE WITH ELASTIC BODY AND TOUCH PANEL HAVING SAME

Taiyo Yuden Co., Ltd., T...

1. A piezoelectric oscillation device, comprising: a support substrate; and a piezoelectric oscillation element that causes
the support substrate to vibrate,
wherein the piezoelectric oscillation element is a bimorph piezoelectric oscillation element,
wherein one main surface of the piezoelectric oscillation element is entirely bonded to the support substrate through an elastic
body having a tensile elasticity of 20 to 100 MPa as measured in accordance with JIS K7161, and

wherein the piezoelectric oscillation device further comprises:
a terminal substrate disposed on the same surface of the support substrate as a surface to which the piezoelectric oscillation
element is bonded, the terminal substrate having a terminal electrode;

a wiring line that connects the terminal electrode of the terminal substrate to an electrode of the piezoelectric oscillation
element; and

a wiring protective layer disposed between the wiring line and the support substrate, the wiring protective layer being made
of an elastic material.

US Pat. No. 9,526,165

MULTILAYER CIRCUIT SUBSTRATE

TAIYO YUDEN CO., LTD., T...

1. A multilayer circuit substrate formed by alternately stacking insulating layers and conductive layers, comprising:
a first signal line and a first ground conductor spaced apart from the first signal line formed in a first conductive layer;
and

a second signal line and a second ground conductor spaced apart from the second signal line formed in a second conductive
layer, the second conductive layer facing the first conductive layer through an insulating layer,

wherein the first signal line intersects with the second signal line in a plan view of the multilayer circuit substrate, and
wherein a space between the first ground conductor and first signal line is smaller in an intersection area of the first and
second signal lines than a space in a non-intersection area,

wherein a space between the second ground conductor and second signal line is smaller in the intersection area than a space
in the non-intersection area,

wherein in the non-intersection area, in the plan view, the first signal line in the first conductive layer is disposed directly
above the second ground conductor in the second conductive layer, and

wherein in the non-intersection area, in the plan view, the second signal line in the second conductive layer is disposed
directly under the first ground conductor in the first conductive layer.

US Pat. No. 9,230,742

CAPACITOR

Taiyo Yuden Co., Ltd., T...

1. A capacitor, comprising:
a dielectric layer having a first plane, and a second plane opposite to the first plane;
a first through-hole communicated with the first plane and the second plane, having difference in level on an inside wall;
a second through-hole communicated with the first plane and the second plane;
a first external conductor layer disposed on the first plane;
a second external conductor layer disposed on the second plane;
a first internal electrode formed in the first through-hole, connected to the first external electrode layer, and separated
from the second external electrode layer; and

a second internal electrode formed in the second through-hole, connected to the second external electrode layer, and separated
from the first external electrode layer.

US Pat. No. 9,214,277

CAPACITOR HAVING A PLURALITY OF MINUTE INTERNAL ELECTRODE PORTIONS FILLED BY A DIELECTRIC LAYER

Taiyo Yuden Co., Ltd., T...

1. A capacitor, comprising:
a dielectric layer including
a first surface,
a second surface facing the first surface, and
a plurality of through-holes communicating between the first surface and the second surface, the plurality of through-holes
including a first plurality of through-hole portions, a second plurality of through-hole portions, and a third plurality of
through-hole portions, the first surface and the second surface communicating with each other through the first plurality
of through-hole portions, the second plurality of through-hole portions, and the third plurality of through-hole portions;

a first external electrode layer disposed on the first surface;
a second external electrode layer disposed on the second surface;
a plurality of first internal electrode portions provided in the first plurality of through-hole portions, one end of each
of the first internal electrode portions being connected to the first external electrode layer, the other end of each of the
first internal electrode portions being insulated from the second external electrode layer;

a plurality of second internal electrode portions provided in the second plurality of through-hole portions, one end of each
of the second internal electrode portions being connected to the second external electrode layer, the other end of each of
the second internal electrode portions being insulated from the first external electrode layer; and

a plurality of close contact portions bringing at least one of the first external electrode layer and the second external
electrode layer into close contact with the dielectric layer, the plurality of close contact portions being provided in the
third plurality of through-hole portions, the plurality of close contact portions including a plurality of resin material
layers; wherein each of the plurality of resin material layers are connected to the first external electrode layer and the
second external electrode layer, the plurality of resin material layers filling the third plurality of through-hole portions.

US Pat. No. 9,184,725

ACOUSTIC WAVE DEVICE

TAIYO YUDEN CO., LTD., T...

1. An acoustic wave device comprising:
a substrate;
a lower electrode formed on the substrate;
at least two piezoelectric films formed on the lower electrode;
an insulating film located between the at least two piezoelectric films; and
an upper electrode formed on the at least two piezoelectric films,
wherein outer peripheries of upper and lower surfaces of an uppermost piezoelectric film out of the at least two piezoelectric
films in a region in which the lower electrode and the upper electrode face each other are positioned further in than an outer
periphery of the upper electrode,

wherein in a region in which the outer peripheries of the upper and lower surfaces of the uppermost piezoelectric film are
positioned further in than the outer periphery of the upper electrode, outer peripheries of upper and lower surfaces of a
lowermost piezoelectric film out of the at least two piezoelectric films are positioned further out than the outer periphery
of the upper electrode; and

wherein no electrode is formed between the lower electrode and the upper electrode.

US Pat. No. 9,287,850

COMMUNICATION MODULE COMPRISED OF MULTIPLE INTERDIGITAL TRANSDUCER DUPLEXERS FOR WIRELESS COMMUNICATION UNIT

TAIYO YUDEN CO., LTD., T...

1. A communication module comprising
a plurality of duplexers for different transmit-receive bands, each duplexer having a first filter and a second filter, the
first filter of each duplexer being one of a transmit filter and a receive filter, and the second filter of each duplexer
being another of the transmit filter and the receive filter,

wherein IDT electrodes of the first filters of at least two of the plurality of duplexers having different transmit-receive
bands are composed of a same material, have a same thickness, and are provided on a same single piezoelectric substrate,

wherein IDT electrodes of the second filters of said at least two of the plurality of duplexers are provided on one or more
of piezoelectric substrates that are different from said single piezoelectric substrate on which the IDT electrodes of the
first filters are provided, and

wherein the IDT electrodes of the first filters of said at least two of the plurality of duplexers and the IDT electrodes
of the second filters of said at least two of the plurality of duplexers are composed of different materials and have different
thickness.

US Pat. No. 9,093,981

CIRCUIT SUBSTRATE

TAIYO YUDEN CO., LTD., T...

1. A circuit substrate comprising:
a laminate substrate in which a conductive layer and an insulating layer are laminated;
an antenna terminal disposed in the laminate substrate;
a plurality of filter chips each having an acoustic wave filter and being provided inside of the laminate substrate, the plurality
of filter chips including a transmit filter chip having a transmit filter and a receive filter chip having a receive filter,
said transmit filter and said receive filter constituting a duplexer, and one of the filter chips being electrically connected
to said antenna terminal; and

an active component that is provided on a surface of the laminate substrate and is connected with said one of the filter chips,
at least a part of the active component overlapping with a projected region that is a region of said one of the filter chips
projected in a thickness direction of the laminate substrate.

US Pat. No. 9,363,897

SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT

Taiyo Yuden Co., Ltd., T...

1. A substrate with built-in electronic component, comprising:
a component storage layer including an electronic component and a cover portion having an insulating property and a core material
in which a cavity for storing the electronic component and the cover portion is formed, the electronic component including
a terminal surface and a main body, the cover portion including a first surface formed to be flush with the terminal surface,
covering the main body of the electronic component, and having a first linear expansion coefficient; and

a first buildup layer and a second buildup layer each including an insulating layer and a via portion, the insulating layer
being formed to come into close contact with the cover portion and having a second linear expansion coefficient larger than
the first linear expansion coefficient, the via portion being provided in the insulating layer and being connected to the
terminal surface, the first buildup layer and the second buildup layer being provided with the component storage layer sandwiched
there between, wherein

the insulating layer of the first buildup layer is formed to come into close contact with the terminal surface and the first
surface,

the core material includes a second surface which is flush with the terminal surface and the first surface and is entirely
made of metal, the second surface entirely comes into close contact with the insulating layer of the first buildup layer,
and

the main body of the electronic component includes a third surface which faces the insulating layer of the first buildup layer,
the third surface being covered by the cover portion,

the insulating layer of the first buildup layer includes a first insulating layer being formed on the component storage layer
to come into close contact with the terminal surface and the first surface and a second insulating layer being formed on the
first insulating layer,

the first buildup layer includes a ground wiring being formed between the first insulating layer and the second insulating
layer,

the via portion of the first buildup layer is provided in the first insulating layer and includes a first via portion being
directly connected to the terminal surface and the ground wiring and a second via portion being directly connected to the
ground wiring being connected to the first via portion and the second surface,

the ground wiring is maintained at ground potential, and
the entirety of the core material, the second via portion, the first via portion and the terminal surface being connected
to the first via portion are also maintained at ground potential by being electrically connected to the ground wiring.

US Pat. No. 9,293,244

MAGNETIC MATERIAL AND COIL COMPONENT USING THE SAME

TAIYO YUDEN CO., LTD., T...

1. A method of manufacturing a magnetic material, comprising:
selecting metal grains which are made of a Fe—Cr—Si alloy and whose FeMetal/(FeMetal+FeOxide) ratio as measured before shaping by XPS is 0.2 or more wherein FeOxide is the sum of integral values at peaks of 709.6 eV, 710.7 eV and 710.9 eV, and FeMetal is a peak integral value at 706.9 eV; and

shaping a formed body using the metal grains; and
heating the formed body to obtain a grain compact as a magnetic material,
wherein the step of selecting the metal grains comprises providing metal grains; measuring the FeMetal/(FeMetal+FeOxide) ratio; if the ratio is not 0.2 or more, treating the metal grains with acid or with heat in a reducing ambience.

US Pat. No. 9,209,775

ELECTRONIC CIRCUIT

TAIYO YUDEN CO., LTD., T...

1. An electronic circuit comprising:
a switch that includes a plurality of ports, and selects a port to be connected to an antenna from among the plurality of
ports;

a first filter that is connected between a first port in the plurality of ports and a first terminal, and has a pass band
which overlaps with a transmission band of a first band;

a second filter that is connected between a second port in the plurality of ports and a second terminal, and has a pass band
which overlaps with a transmission band of a second band;

a third filter that is connected between a third port in the plurality of ports and a third terminal, and has a pass band
which overlaps with a reception band of the first band and a reception band of the second band;

wherein when a signal in the first band is transmitted and received, the switch selects the first port and the third port,
and

when a signal in the second band is transmitted and received, the switch selects the second port and the third port.

US Pat. No. 9,219,467

DUPLEXER, FILTER AND COMMUNICATION MODULE

TAIYO YUDEN CO., LTD., T...

17. A filter comprising:
a plurality of acoustic wave resonators connected between an input terminal and an output terminal; and
a cancel circuit that is connected in parallel with at least one of the plurality of acoustic wave resonators via two nodes,
said two nodes being respectively provided on an input side and an output side of the at least one of the plurality of acoustic
wave resonators,

wherein the cancel circuit includes an acoustic wave resonator, and further includes a first acoustic wave resonator or a
first electrostatic capacitor that is provided on at least one of an input side and an output side of said acoustic wave resonator
in the cancel circuit, said first acoustic wave resonator or first electrostatic capacitor being connected in series with
the acoustic wave resonator in the cancel circuit,

wherein the cancel circuit further includes a second acoustic wave resonator or a second electrostatic capacitor on at least
one of the input side and the output side of the acoustic wave resonator in the cancel circuit, the second acoustic wave resonator
or second electrostatic capacitor being connected in parallel with the acoustic wave resonator in the cancel circuit.

US Pat. No. 9,214,445

ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME

TAIYO YUDEN CO., LTD., T...

1. An electronic component comprising:
a substrate formed of ceramic and including pads on an upper surface thereof;
a plurality of components flip-chip mounted on the upper surface of the substrate with bumps thereof being respectively bonded
to the pads; and

a plurality of additional films located on a lower surface of the substrate and overlapping with the pads that are bonded
to the bumps with respect to each of pairs of the pad and the bump that are bonded together to mount the plurality of components,
the plurality of additional films thereby overlapping all of the pairs of the pad and the bump that are bonded together,

wherein
the plurality of additional films are provided to correspond to the plurality of components, respectively, and
each of the plurality of additional films overlaps with a whole of the pads that are bonded to the bumps of corresponding
component and is smaller than the corresponding component.

US Pat. No. 9,166,552

FILTER AND DUPLEXER

TAIYO YUDEN CO., LTD., T...

14. A filter comprising:
one or a plurality of parallel resonators coupled between an inputting terminal and an outputting terminal in parallel; and
one or a plurality of film bulk acoustic resonators that act as a series resonator and are coupled between the inputting terminal
and the outputting terminal in series,

at least one of the one or plurality of film bulk acoustic resonators having a substrate, a lower electrode provided on the
substrate, a piezoelectric membrane provided on the lower electrode, and an upper electrode provided on the piezoelectric
membrane,

wherein:
at least one of the lower electrode and the upper electrode has a thick membrane region having a thickness larger than a thickness
of a center portion of a resonance region at an edge of the resonance region, the resonance region being a region where the
lower electrode and the upper electrode face with each other through the piezoelectric membrane;

a width of the thick membrane region is smaller than a wavelength of an acoustic wave propagating in a direction crossing
a thickness direction of the piezoelectric membrane; and

the one or plurality of parallel resonators comprising: a substrate, a lower electrode provided on the substrate; a piezoelectric
membrane provided on the lower electrode; and an upper electrode provided on the piezoelectric membrane, wherein at least
one of the lower electrode and the upper electrode has a thick membrane region having a thickness larger than a thickness
of a center portion of a resonance region at an edge of the resonance region, the resonance region being a region where the
lower electrode and the upper electrode face with each other through the piezoelectric membrane; and

a width of the thick membrane region of the one or plurality of the parallel resonators is larger than a width of the thick
membrane region of the at least one of the one or plurality of the film bulk acoustic resonators.

US Pat. No. 9,114,850

MOTOR DRIVE CONTROL DEVICE

MICROSPACE CORPORATION, ...

1. A motor drive control device of an electric power-assisted vehicle having a gear shifter and a motor in which a first ratio
of a number of drive rotations in the motor to a number of rotations of a pedal changes according to changes in a gear ratio
of the gear shifter, the device comprising:
a gear ratio obtaining part that obtains a gear ratio of the gear shifter; and
a calculating part that calculates an assist torque, which is a target value for a drive torque of the motor, from a pedal
input torque, based on the gear ratio obtained from the gear ratio obtaining part.

US Pat. No. 9,287,847

MODULE

TAIYO YUDEN CO., LTD., T...

1. A module comprising:
a diplexer that includes a first terminal, a second terminal, and a common terminal coupled to an antenna;
a first switch that is coupled to the first terminal, includes first ports, and selects, from the first ports, and connects
one port to the diplexer;

a first duplexer that is coupled to at least one of the first ports;
a second duplexer that is coupled to the second terminal and has a passband different from a passband of the first duplexer;
and

a first impedance portion that is coupled to another port of the first ports,
wherein the another port of the first ports is not coupled to a filter or a duplexer through the first impedance portion.

US Pat. No. 9,190,220

DYE-SENSITIZED SOLAR CELL

TAIYO YUDEN CO., LTD., T...

1. A dye-sensitized solar cell having multiple photoelectric conversion elements, where each element has a negative electrode
on which a dye-sensitized generation layer is provided, as well as a positive electrode opposingly positioned in a manner
sandwiching the generation layer, and an electrolytic solution is sealed in a space formed by a sealant provided around the
negative electrode and positive electrode; wherein:
the multiple photoelectric conversion elements are positioned around the dye-sensitized solar cell except at its approximate
center;

multiple wiring layers corresponding to the positive electrodes of multiple photoelectric conversion elements are positioned,
via an insulation layer, on a non-optical receiving side of the dye-sensitized solar cell; and

the dye-sensitized solar cell comprises:
a negative electrode terminal part which is connected to the negative electrode of one of the multiple photoelectric conversion
elements and used for taking out the electrodes at the approximate center;

a first electrode coupling means for electrically connecting the positive electrode and corresponding wiring layer;
a positive electrode terminal part which is formed on the wiring layer connected to the positive electrode of another element
among the multiple photoelectric conversion elements other than the one of the multiple photoelectric conversion elements
and which is used for taking out the electrodes at the approximate center; and

a second electrode coupling means for connecting adjacent photoelectric conversion elements by electrically connecting the
negative electrode of an element on which the negative electrode terminal part is not provided, with a wiring layer on which
the positive electrode terminal part is not provided, on an outer periphery side of the dye-sensitized solar cell, wherein
the wiring layer is formed at a position overlapping as viewed from above, via the insulation layer, with both the positive
electrode of the corresponding photoelectric conversion element and the positive electrode of another photoelectric conversion
element adjacent to the corresponding photoelectric conversion element.

US Pat. No. 9,730,324

VARIABLE CAPACITANCE DEVICE AND ANTENNA DEVICE

TAIYO YUDEN CO., LTD., T...

1. A variable capacitance device, comprising:
a supporting substrate having a plurality of variable capacitance elements formed thereon, the plurality of variable capacitance
elements being connected in series,

wherein each of the plurality of variable capacitance elements comprises:
a lower electrode formed over said supporting substrate;
a dielectric formed on said lower electrode; and
an upper electrode formed on said dielectric,
wherein each of the plurality of variable capacitance elements has a separate lower electrode, or at least some of the plurality
of variable capacitance elements share a lower electrode, thereby forming a plural set of the lower electrodes that serves
as the lower electrodes of the respective variable capacitance elements,

wherein the variable capacitance device further comprises an insulating moisture-resistant film and a conductive adhesive
film that are formed after the upper electrodes for the respective variable capacitance elements have been formed, whereby
the insulating moisture-resistant film and the conductive adhesive film are in layers that are positioned at a level higher
than a layer in which the upper electrodes are formed, and

wherein said conductive adhesive film and said insulating moisture-resistant film have a gap in a plan view between at least
some of regions where said plural set of the lower electrodes are respectively formed so as to avoid electrical leakage between
said at least some of regions through said conductive adhesive film.

US Pat. No. 9,287,026

MAGNETIC MATERIAL AND COIL COMPONENT

Taiyo Yuden Co., Ltd., T...

1. A magnetic material that has multiple metal grains constituted by Fe—Si-M soft magnetic alloy (where M is a metal element
that oxidizes more easily than Fe), as well as oxide film constituted by an oxide of the soft magnetic alloy and formed on
a surface of the metal grains, wherein the magnetic material has bonding parts where adjacent metal grains are bonded together
via the oxide film formed on their surface, as well as bonding parts where metal grains are directly bonded together in areas
having no oxide film, and resin material is filled in at least some of voids generating as a result of accumulation of the
metal grains.

US Pat. No. 9,282,632

MULTILAYER CIRCUIT SUBSTRATE

TAIYO YUDEN CO., LTD., T...

1. A multilayer circuit substrate formed by alternately stacking insulating layers and conductive layers, comprising:
a first conductive layer having a first transmission line and a second transmission line formed therein;
a second conductive layer facing the first conductive layer through an insulating layer; and
a third conductive layer facing the second conductive layer through an insulating layer, the third conductive layer having
a bypass line electrically connected to the second transmission line of the first conductive layer through a via conductor
so as to allow the second transmission line to intersect with the first transmission line,

wherein the second conductive layer has a ground conductor formed at least in a position that overlaps the bypass line in
a plan view, and

wherein the first transmission line is formed such that a line width thereof at an intersection with the second transmission
line is made smaller than that in other portions.

US Pat. No. 9,281,125

DIELECTRIC CERAMIC, MULTI-LAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

TAIYO YUDEN CO., LTD., T...

1. A dielectric ceramic whose sintered grains constituting dielectric have an average grain size of 0.2 to 1.0 ?m and an oxygen
defect concentration of more than 0.2% but no more than 0.5%, wherein the dielectric contains barium titanate and an oxide
of an acceptor element which includes one or more of non-rare earth elements selected from the group consisting of Sc, Cr,
Mn, Fe, Co, Ni, Cu, Zn, Mg, and Al, as well as one or more of rare earth elements selected from the group consisting of Dy,
Ho, Er, Yb, and Lu, where all barium-containing titanate contained in the dielectric is represented by chemical formula Ba1Ti1O3, and the acceptor element is contained by p mol per 100 mol of Ba1Ti1O3, and p representing p mol number of the acceptor element is in a range of 0

US Pat. No. 9,135,941

DYE FOR OPTICAL INFORMATION RECORDING MEDIUM AND OPTICAL INFORMATION RECORDING MEDIUM

TAIYO YUDEN CO., LTD., T...

1. An optical information recording medium, comprising: a substrate having a spiral guide groove on one side; a reflective
layer formed on the one side of the substrate; a recording layer formed on the reflective layer; a protection layer formed
on the recording layer; and a light-transmissive layer formed on the protection layer;
wherein the recording layer contains an organic dye and an organic dye expressed by the following chemical formula is used
as the organic dye:


wherein A is selected from (a3), (a5), (a6), and (a8) under (Chemical Formula 2), while M is selected from Ni, Co and Cu:

US Pat. No. 9,099,979

HIGH-FREQUENCY CIRCUIT MODULE

Taiyo Yuden Co., Ltd., T...

1. A high-frequency circuit module comprising:
a circuit board including an insulating layer and a conductive layer that are alternately stacked;
a high-frequency IC installed at the circuit board to transmit and receive a high-frequency signal;
a power amplifier IC installed at the circuit board to amplify a transmission signal received from the high-frequency IC;
and

a duplexer installed between the high-frequency IC and the power amplifier IC to separate the transmission signal output from
the power amplifier IC and input to an antenna and a received signal output from the antenna and input to the high-frequency
IC from each other,

wherein at least one of the high-frequency IC and the power amplifier IC is embedded in the circuit board.

US Pat. No. 9,301,407

METHOD OF MANUFACTURING SUBSTRATE HAVING CAVITY

TAIYO YUDEN CO., LTD., T...

1. A method of manufacturing a substrate having a cavity for installing an electronic part therein, comprising:
forming a penetrating hole for inserting a dummy part made of metal, said penetrating hole penetrating through a base layer;
inserting the dummy part in the penetrating hole such that a ring-shaped gap is formed between an inner wall of the penetrating
hole and an outer wall of the dummy part;

filling said ring-shaped gap with an insulating portion made of synthetic resin;
forming a lower insulating layer made of synthetic resin onto a bottom surface of the base layer so as to cover a bottom surface
of the dummy part and so as to be continuous with the insulating portion;

forming an upper insulating layer made of synthetic resin onto a top surface of the base layer so as to cover a top surface
of the dummy part and so as to be continuous with the insulating portion;

forming, by mechanical cutting, an exposing hole in either the upper insulating layer to expose the top surface of the dummy
part or the lower insulating layer to expose the bottom surface of the dummy part; and

chemically etching the dummy part so as to remove said dummy part exposed through the exposing hole, thereby forming said
cavity.

US Pat. No. 9,105,407

MULTI-LAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

TAIYO YUDEN CO., LTD., T...

1. A multi-layer ceramic capacitor constituted by ceramic dielectric layers alternately laminated with conductive layers,
wherein:
each of the ceramic dielectric layers is constituted by sintered grains comprised of core-shell grains each having a core-shell
structure wherein a core of primary component is enclosed by a shell of auxiliary solid-solution component, and uniform solid-solution
grains each constituted by solid solution without a core;

an area ratio of the core-shell grains to all the sintered grains constituting each ceramic dielectric layer is 5 to 15% as
measured in an observed cross section of a randomly selected portion of the ceramic dielectric layer; and

a grain size representing an average grain size of all the sintered grains including the core-shell grains and uniform solid-solution
grains is 0.3 to 0.5 ?m.

US Pat. No. 9,129,737

LAMINATED INDUCTOR

TAIYO YUDEN CO., LTD., T...

1. A laminated inductor comprising:
a laminate having an insulating part constituted by non-magnetic layers, as well as a coil part constituted by conductors
positioned between the non-magnetic layers; and

external electrodes that are electrically connected to ends of the coil part and positioned on exterior surfaces of the laminate;
wherein the external electrodes each have a first electrode layer whose primary constituent is Ag, as well as a second electrode
whose primary constituent is Cu and which is positioned on an outer side of the first electrode layer and has a thickness
of 4 ?m or more, and a total thickness of the first electrode layer and second electrode layer is 5 ?m or more, said second
electrode consisting of metal including Cu without Ni, and unavoidable impurities if any.

US Pat. No. 9,281,133

ELECTRODE FOR ELECTROCHEMICAL DEVICE, ELECTROCHEMICAL DEVICE, AND METHOD FOR MANUFACTURING ELECTRODE FOR ELECTROCHEMICAL DEVICE

TAIYO YUDEN CO., LTD., T...

1. An electrode for an electrochemical device comprising:
a current collector that has a main face as well as a side face, said side face having a concave-convex shape whose convex
part is constituted by a projection extending along the main face, said projection forming a support portion; and

an electrode layer that contains active material and is formed on and in contact with the main face including a surface formed
by the support portion,

wherein the support portion is formed along a periphery of the electrode layer.

US Pat. No. 9,190,202

LAMINATED INDUCTOR

TAIYO YUDEN CO., LTD., T...

1. A laminated inductor having a component body that provides a mounting surface on one face of the component body, and at
least a pair of external electrodes formed on the mounting surface, wherein:
the component body has a laminate constituted by multiple insulator layers, a spiral coil conductor formed in the laminate,
and leader parts that electrically connect the coil conductor and the external electrodes, respectively;

the coil conductor comprises multiple conductor patterns formed in the insulator layers and via hole conductors that penetrate
through the insulator layers and electrically connect the multiple conductor patterns in a direction parallel to the mounting
surface, constituting turn units, wherein a coil axis runs roughly in parallel with the mounting surface and roughly perpendicularly
to the turn units, said turn units having sides roughly in parallel with and perpendicular to the mounting surface, respectively;
and

all of the via hole conductors are formed only on a side farthest away from the mounting surface among the sides of the turn
units,

wherein the conductor pattern comprises a combination of a C-shaped pattern constituted by a polygonal shape having three
or more apexes and having a part of one side missing, and a bar-shaped pattern constituted by a roughly straight line shape,
the bar-shaped pattern is longer than a length of the missing part of the C-shaped pattern, and the bar-shaped pattern constitutes
at least a part of the side farthest away from the mounting surface.

US Pat. No. 9,287,046

MULTI-LAYER CERAMIC CAPACITOR

TAIYO YUDEN CO., LTD., T...

1. A multi-layer ceramic capacitor that contains a laminate constituted by dielectric layers and internal electrode layers
alternately layered with one another, as well as cover layers formed as outermost layers at a top and bottom of the laminate
in a layering direction, wherein:
the dielectric layers are constituted by a sintered compact that contains a mol of ReO3/2, b mol of SiO2, c mol of MOx, d mol of ZrO2, and e mol of MgO (where Re is a rare earth element, M is a metal element (except for Ba, Ti, Si, Zr, Mg and rare earth elements),
and x is a valance) per 100 mol of BaTiO3; and

a, b, c, d, and e mentioned above which indicate mol numbers of respective constituents per 100 mol of BaTiO3 are as follows:

0.1?a?1.0,
0.1?b?1.5,
0.1?c?0.4,
0?d?1.0, and
0?e?0.03.

US Pat. No. 9,287,877

RECONFIGURABLE SEMICONDUCTOR DEVICE

TAIYO YUDEN CO., LTD., T...

1. A semiconductor device capable of reconfiguration, comprising a plurality of electric circuit units disposed in an array,
each of the electric circuit units comprising an analog digital converter, a digital analog converter, and an analog switch,
and an operational amplifier,
wherein a plurality of functional blocks obtained by dividing an analog circuit, which is a target of reconfiguration, are
configured by at least some of the plurality of electric circuit units, respectively, by configuring the analog digital converter,
the digital analog converter and the operational amplifier of the electric circuit units in each of said some of the plurality
of electric circuit units, and

wherein said some of the plurality of electric circuit units that are configured to correspond to the plurality of functional
blocks, respectively, are connected to each other by the analog switch included in each of said some of the plurality of electric
circuit units such that the analog circuit, which is the target of reconfiguration is realized by said some of the plurality
of electric circuit units that connected to each other,

wherein the semiconductor device further comprises:
a logic unit, the logic unit including a plurality of memory cell units which configure an array and are connected to each
other, and the memory cell units operate as a logic element when truth value table data is written in, which is configured
so that a logic calculation of an input value specified by a plurality of addresses is output to a data line, and/or operate
as a connection element when truth value table data is written in, which is configured so that an input value specified by
a certain address is output to a data line to be connected to an address of another memory cell unit; and

for each memory cell unit, an address decoder which decodes an address input from N (N being an integer of 2 or more) number
of address lines, and outputs a word selection signal to a word line;

wherein each memory cell unit is connected to the word line and the data line, stores data configuring the truth value table,
and has a plurality of storage elements which input and output the data to the data line by the word selection signal input
from the word line, and

wherein the respective N number of address lines of the memory cell units are connected to the data line of the other N number
of memory cell units.

US Pat. No. 9,253,386

CAMERA MODULE

TAIYO YUDEN CO., LTD., T...

1. A camera module, comprising:
an embedded-component substrate having electronic components embedded therein;
an imaging device bonded to the embedded-component substrate; and
lenses disposed above the imaging device,
wherein a recessed portion having a greater depth than a thickness of the imaging device is formed in an uppermost surface
of the embedded-component substrate,

wherein the imaging device is bonded to a bottom of the recessed portion such that a surface of the imaging device is lower
than the uppermost surface of the embedded-component substrate, thereby creating an opening above the surface of the imaging
device,

wherein a connection pad on the imaging device is connected to a conductor pad disposed on the uppermost surface of the embedded-component
substrate by a bonding wire that goes through the opening,

wherein the embedded-component substrate comprises:
a core layer made of a conductive material, the core layer being the thickest layer among layers in the embedded-component
substrate;

a first insulating layer that is disposed on one surface in a thickness direction of the core layer and that has wiring therein;
and

a second insulating layer that is disposed on another surface in the thickness direction of the core layer and that has wiring
therein,

wherein the recessed portion includes a through-hole formed in the first insulating layer and a through-hole formed in the
core layer, and

wherein the imaging device is embedded within the through-hole in the core layer.

US Pat. No. 9,203,377

DUPLEXER

TAIYO YUDEN CO., LTD., T...

1. A duplexer comprising:
a first filter of which a first end is coupled to a common terminal, and a second end is coupled to a first terminal; and
a second filter having a passband higher than a passband of the first filter, a first end of the second filter being coupled
to the common terminal, and a second end of the second filter being coupled to a second terminal, wherein

a phase shifter is located neither between the first filter and the common terminal nor between the second filter and the
common terminal,

the second filter is a ladder-type filter including piezoelectric thin film resonators connected in a ladder shape,
a propagation constant in a direction perpendicular to a thickness direction of a piezoelectric thin film included in each
of the piezoelectric thin film resonators is a real number at frequencies lower than a resonance frequency of corresponding
one of the piezoelectric thin film resonators,

a resonator at a first stage as viewed from a side of the common terminal is a parallel resonator in the second filter, and
the duplexer comprises no inductor of which a first end is connected to a node between the common terminal and at least one
of the first filter and the second filter, and a second end is connected to a ground.

US Pat. No. 9,287,033

MAGNETIC MATERIAL AND COIL COMPONENT USING SAME

TAIYO YUDEN CO., LTD., T...

1. A magnetic material containing multiple metal grains constituted by soft magnetic alloy and oxide film formed on a surface
of the metal grains, wherein the soft magnetic alloy and the oxide film include Fe and a metal element that oxidizes more
easily than Fe, wherein
the magnetic material forms a grain compact having first bonding parts where adjacent metal grains are contacted and directly
bonded together by alloy-to-alloy bonding in areas where no oxide film exists, second bonding parts where adjacent metal grains
are bonded together by the oxide film formed around the entire surface of said adjacent metal grains other than the first
bonding parts, and voids formed in an area other than the first and second bonding parts and surrounded by the oxide film,
said alloy-to-alloy bonding including metal bonds where regularity of atomic arrangement is satisfied.

US Pat. No. 9,082,548

POROUS CAPACITORS AND METHOD FOR MANUFACTURING THE SAME

TAIYO YUDEN CO., LTD., T...

1. A porous capacitor comprising:
a first conductor layer;
a second conductor layer opposed to the first conductor layer at a certain distance;
a dielectric layer disposed between the first conductor layer and the second conductor layer, the dielectric layer being made
of an oxidized valve metal and having a large number of holes substantially orthogonal to the first conductor layer and the
second conductor layer;

first electrodes made of a conductive material filled in at least part of the large number of holes, the first electrodes
being electrically connected to the first conductor layer and insulated from the second conductor layer via void spaces between
insulated ends of the first electrode and the second conductor layer, with levels of the insulated ends of the first electrodes
being uneven with each other within a certain range; and

second electrodes made of a conductive material filled in at least part of the large number of holes, the second electrodes
being electrically connected to the second conductor layer and insulated from the first conductor layer,

wherein the first conductor layer is configured to vary an electrical resistivity at the end of each of the holes on the first
conductor layer.

US Pat. No. 9,294,068

FILTER CIRCUIT AND MODULE

TAIYO YUDEN CO., LTD., T...

1. A filter circuit comprising:
a first band-pass filter, a second band-pass filter, a third band-pass filter and a fourth band-pass filter each having an
input terminal and an output terminal;

a first terminal to which the output terminal of the first band-pass filter and the output terminal of the second band-pass
filter are connected in common;

a second terminal to which the output terminal of the third band-pass filter and the output terminal of the fourth band-pass
filter are connected in common;

a third terminal to which the input terminal of the first band-pass filter and the input terminal of the fourth band-pass
filter are connected in common; and

a fourth terminal to which the input terminal of the second band-pass filter and the input terminal of the third band-pass
filter are connected in common,

wherein whole pass bands of the first band-pass filter, the second band-pass filter, the third band-pass filter and the fourth
band-pass filter differ from each other.

US Pat. No. 9,248,927

WORK INSERTION DEVICE

TAIYO YUDEN CO., LTD., T...

1. A work insertion device for sequentially inserting works such as electronic components into concaved parts arranged side
by side on a tape, said work insertion device comprising:
a transfer disk whose rotation center line is inclined upward to form a sharp angle with a vertical line, and which has many
storage holes capable of storing the works wherein the holes are formed through an outer periphery part and arranged at an
equal angular interval in a circumferential direction, where the many storage holes are evenly divided into multiple storage
hole groups each including multiple storage holes;

a disk driving mechanism for intermittently turning the transfer disk in units of an angle formed by two lines connecting
centers of two adjacent storage hole groups on the transfer disk and a rotation center of the transfer disk;

a work storage chamber capable of storing many of the works in bulk state, which is positioned in a manner facing upward-facing
openings of the multiple storage holes constituting at least one storage hole group on the transfer disk, and which is used
to directly store works in the multiple storage holes constituting the storage hole group, through the upward-facing openings
of the holes, as the transfer disk turns intermittently;

a work anti-drop means for preventing the works stored in the multiple storage holes constituting the storage hole group from
dropping out through downward-facing openings of the holes as the storage hole group on the transfer disk in which works are
already stored travels to a work insertion location away from the work storage chamber;

a work push-out means for forcibly pushing out the works stored in the multiple storage holes constituting the storage hole
group through the downward-facing openings of the holes when the storage hole group of the transfer disk in which works are
already stored stops at the work insertion location; and

a work guiding means, which includes multiple guiding passages that incline downward toward the multiple concaved parts in
the tape from the downward-facing openings of the multiple storage holes constituting the storage hole group stopped at the
work insertion location, for guiding the works pushed out through the downward-facing openings of the multiple storage holes,
into the multiple concaved parts, through the multiple guiding passages.

US Pat. No. 9,190,216

NON-AQUEOUS ELECTROLYTE SOLUTION FOR ELECTRIC DOUBLE-LAYER CAPACITOR

TAIYO YUDEN CO., LTD., T...

1. A non-aqueous electrolyte solution for a double-layer capacitor which is a non-aqueous electrolyte solution constituted
by a non-aqueous solvent in which electrolyte salt is dissolved, wherein
the non-aqueous solvent is a mixed solvent of chained sulfone and cyclic lactone compound, wherein a mass ratio of the chained
sulfone and the cyclic lactone compound is in a range of 6:4 to 1:9,

the chained sulfone is selected from the group consisting of ethylisopropyl sulfone, ethylmethyl sulfone, isopropylmethyl
sulfone, ethylisobutyl sulfone, isobutylisopropyl sulfone, isobutyl sec-butylsulfone, butylisobutyl sulfone, and combinations
thereof, and

the cyclic lactone compound is selected from the group consisting of ?-butyrolactone, ?-valerolactone, ?-valerolactone, and
combinations thereof.

US Pat. No. 9,148,119

FILTER AND DUPLEXER

TAIYO YUDEN CO., LTD., T...

1. A filter comprising:
first series resonators that are connected in series between an input terminal and an output terminal;
first parallel resonators that are connected in parallel between the input terminal and the output terminal, the first series
resonators and the first parallel resonators forming a ladder-type filter;

a first inductor that is connected in parallel to at least one first series resonator;
one or more second parallel resonators that are provided separately from the first parallel resonators, are connected between
the input terminal and the output terminal, and have a resonance frequency and an anti-resonance frequency at frequencies
lower than a passband formed by the first series resonators and the first parallel resonators; wherein

a unit of an attenuation region is formed by a first attenuation pole, a second attenuation pole, and a third attenuation
pole, the first attenuation pole is formed by the at least one first series resonator and the first inductor, the second attenuation
pole is formed by a resonant response of the one or more second parallel resonators, and the third attenuation pole is formed
by a secondary resonant response of the one or more second parallel resonators,

wherein each of the first series resonators and the first parallel resonators includes an IDT and reflectors arranged at both
sides of the IDT.

US Pat. No. 9,146,091

DISPLACEMENT MEASUREMENT APPARATUS AND DISPLACEMENT MEASUREMENT METHOD

Taiyo Yuden Co., Ltd., T...

1. A displacement measurement apparatus, comprising:
a light source;
a pair of diffraction gratings that light emitted from the light source enters, the pair of diffraction gratings opposing
each other while being relatively movable along an optical axis;

a first optical sensor that detects interference light obtained by diffracted light emitted from a diffraction grating device
of each of the pair of diffraction gratings;

a second optical sensor that detects non-interference light emitted from the pair of diffraction gratings; and
an operation circuit that corrects a signal obtained by the first optical sensor based on a signal obtained by the second
optical sensor,

wherein the operation circuit is configured to determine whether a detection value of the signal obtained by the second optical
sensor is within a redetermined range of a percentage of a change with respect to a reference value; and

wherein the operation circuit is configured such that, if the operation circuit determines that the detection value is out
of the range, it multiplies a detection value of the signal obtained by the first optical sensor by a coefficient corresponding
to the percentage of a change, and outputs the obtained value.

US Pat. No. 9,252,739

MODULE SUBSTRATE AND MODULE

TAIYO YUDEN CO., LTD., T...

1. A module substrate comprising:
a multilayered wiring substrate that includes wiring layers; and
embedded duplexers that are embedded in the multilayered wiring substrate and electrically connected to the wiring layers,
wherein

the embedded duplexers include duplexers supporting at least two bands of Band1, Band2, Band5, and Band8, wherein:
a wiring layer formed on a surface of the multilayered wiring substrate out of the wiring layers includes a terminal portion
that allows an external duplexer supporting at least one of Band3, Band4, Band1, Band13, Band17, and Band20 to be mounted
thereon;

Band1 includes a transmit band of 1920˜1980 MHz and a receive band of 2110˜2170 MHz;
Band2 includes a transmit band of 1850˜1910 MHz and a receive band of 1930˜1990 MHz;
Band5 includes a transmit band of 824˜849 MHz and a receive band of 869˜894 MHz;
Band8 includes a transmit band of 880˜915 MHz and a receive band of 925˜960 MHz;
Band3 includes a transmit band of 1710˜1785 MHz and a receive band of 1805˜1880 MHz;
Band4 includes a transmit band of 1710˜1755 MHz and a receive band of 2110˜2155 MHz;
Band1 includes a transmit band of 2500˜2570 MHz and a receive band of 2620˜2690 MHz;
Band13 includes a transmit band of 777˜787 MHz and a receive band of 746˜756 MHz;
Band17 includes a transmit band of 704˜716 MHz and a receive band of 734˜746 MHz; and
Band20 includes a transmit band of 832˜862 MHz and a receive band of 791˜821 MHz.

US Pat. No. 9,124,238

DUPLEXER

TAIYO YUDEN CO., LTD., T...

15. A duplexer, comprising:
a transmitting filter connected between an antenna terminal and a transmitting terminal;
a receiving filter disposed between the antenna terminal and a receiving terminal;
a package substrate that has a first substrate, a die attach layer that is patterned onto the first substrate, a second substrate,
and an inner layer located between the first substrate and the second substrate;

a double-mode filter that constitutes a portion of the receiving filter;
a common ground terminal that makes an input ground and an output ground of the double-mode filter commonly grounded, the
common ground terminal constituting a portion of the die attach layer;

an input-side ground terminal of the input ground of the double-mode filter, the input-side ground terminal constituting a
portion of the inner layer; and

an output-side ground terminal of the output ground of the double-mode filter, the output-side ground terminal being formed
separately from the input-side ground terminal and constituting a portion of the inner layer;

wherein the input-side ground terminal and the output-side ground terminal of the double-mode filter in the inner layer are
separated by a slit,

wherein the receiving filter has bumps for connecting to the input-side ground terminal/output-side ground terminal, and the
bumps for connecting to the input-side ground terminal/output-side ground terminal overlap with at least a portion of the
input-side ground terminal or the output-side ground terminal, and

wherein the bumps for connecting to the input-side ground terminal/output-side ground terminal do not overlap with the slit.

US Pat. No. 9,270,263

SWITCHING DEVICE AND MODULE

TAIYO YUDEN CO., LTD., T...

1. A switching device comprising:
a switch that selects and connects one of at least three terminals including a first terminal, a second terminal, and a third
terminal to a common terminal; and

a compensating circuit that shifts a phase of at least one of a first signal transmitted through the second terminal and a
second signal transmitted through the third terminal so that the first signal and the second signal compensate each other
and unifies and outputs the first signal and the second signal to a fourth terminal as a third signal, or that branches a
third signal input to the fourth terminal into the first signal and the second signal,

wherein the switching device is configured to have at least either of the following features (a) or (b): (a) when the switch
selects and connects the first terminal to the common terminal and when a fourth signal is input to the first terminal and
output from the common terminal, each of the first signal and the second signal is a part of the fourth signal input to the
first terminal and the compensating circuit unifies and outputs the first signal and the second signal to the fourth terminal
as the third signal, or (b) when the switch selects and connects the first terminal to the common terminal and when a fourth
signal is input to the common terminal and output from the first terminal, the compensating circuit branches the third signal
input to the fourth terminal into the first signal and the second signal, and each of the first signal and the second signal
is added into the fourth signal output from the first terminal.

US Pat. No. 9,148,106

ACOUSTIC WAVE DEVICE

TAIYO YUDEN CO., LTD., T...

1. An acoustic wave device comprising:
an acoustic wave filter chip that is mounted on a multilayered substrate including wiring layers;
a first wiring that is electrically coupled to an internal circuit of the acoustic wave filter chip and formed in a first
wiring layer of the multilayered substrate;

a second wiring that is formed in a second wiring layer separate from the first wiring layer; and
a via wiring that penetrates at least a part of the multilayered substrate and connects the first wiring to the second wiring;
wherein

the first wiring, the second wiring, and the via wiring forms a first inductor of which a direction of magnetic flux extends
along a planar direction of a surface of the multilayered substrate.

US Pat. No. 9,136,817

FILTER MODULE AND DUPLEXER MODULE

TAIYO YUDEN CO., LTD., T...

1. A filter module comprising:
reception filters connected between an antenna terminal and a reception terminal, the reception filters filtering a receive
signal from the antenna terminal and outputting the filtered receive signal to the reception terminal; and

a module substrate, wherein
a first reception filter that is at least one reception filter of the reception filters is embedded in the module substrate,
and

a second reception filter that is at least another one reception filter is mounted on a surface of the module substrate so
as to overlap the first reception filter.

US Pat. No. 9,183,871

OPTICAL RECORDING DEVICE, OPTICAL RECORDING METHOD AND MULTI-LAYER DISK

TAIYO YUDEN CO., LTD., T...

1. An optical recording device that records to a multi-layer disk having multiple recording layers, said optical recording
device comprising:
an optical pickup that selectively irradiates laser light to the recording layers via an objective lens; and
a control part that performs controls in such a way as to:
set in each of the multiple recording layers a data area where user data is recorded and a calibration area used for an intensity
calibration process of the laser light for recording, including a main calibration area and at least one sub calibration area,
according to a same layout that applies to all of the multiple recording layers;

use the main calibration area to perform a first calibration process for implementing initial recording to the data area in
each of the multiple recording layers one by one from a recording layer farthest away from or closest to an objective lens
of an optical pickup;

record dummy data to a remainder of the main calibration area; and
use the at least one sub calibration area to perform a second calibration process for additional recording to the data area,
wherein the control part performs controls in such a way that, when the recording layer to which data will be recorded next
is referred to as a target recording layer and the recording layer to which data was recorded immediately before the target
recording layer is referred to as an adjacent recording layer, and when second user data of a larger size than first user
data already recorded to the data area of the adjacent recording layer will be recorded to a data area of the target recording
layer, then the second user data is divided into a first block corresponding to a size of the first user data and a second
block for other data, and the calibration process for the first block is performed as the first calibration process using
the main calibration area, while the calibration process for the second block is performed as the second calibration process
using the sub calibration area.

US Pat. No. 9,117,993

PIEZOELECTRIC ELEMENT AND STACKED PIEZOELECTRIC STRUCTURE

TAIYO YUDEN CO., LTD., T...

1. A stacked piezoelectric structure made by stacking multiple piezoelectric elements, where each of the multiple piezoelectric
elements comprises:
a laminated structure made by alternately laminating multiple first piezoelectric layers having first internal electrodes
led out to a first area and multiple second piezoelectric layers having second internal electrodes led out to a second area
different from the first area;

a pair of covers constituted by piezoelectric bodies that are provided at both ends of the laminated structure in the laminating
direction;

a pair of cover electrodes provided on the respective exposed sides of the pair of covers, in a manner covering an area at
least near the center of the corresponding cover, wherein an insulation layer is formed around each cover electrode which
has an area smaller than that of the first or second internal electrode;

a first external electrode that applies drive voltage of first polarity to each of the first internal electrodes; and
a second external electrode that applies drive voltage of second polarity to each of the second internal electrodes;
wherein said piezoelectric element is such that:
when each of the pair of cover electrodes is adjoining the first internal electrode, the cover electrode adjoining the first
internal electrode is connected to the second external electrode; and

when each of the pair of cover electrodes is adjoining the second internal electrode, the cover electrode adjoining the second
internal electrode is connected to the first external electrode,

wherein the cover electrodes of adjacent piezoelectric elements, which cover electrodes face toward and are connected to each
other, are connected to the external electrodes that apply drive voltage of a same polarity which is one of the first or second
polarity, and the other external electrodes of the adjacent piezoelectric elements that apply drive voltage of the other polarity
are connected to each other by a bridge formed using a conductive paste; and

the first external electrodes of the adjacent piezoelectric elements become flush with each other, and the second external
electrodes of the adjacent piezoelectric elements become flush with each other.

US Pat. No. 9,807,916

CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME

Taiyo Yuden Co., Ltd., (...

1. A circuit module, comprising:
a wiring substrate having a mount surface, a conductor pattern, and an insulating protective layer, the mount surface having
a first area and a second area, the conductor pattern being formed along a boundary between the first area and the second
area on the mount surface, the insulating protective layer being formed on the whole area of the mount surface, the conductor
pattern including a first metal layer and a second metal layer having a laser reflectance property higher than that of the
first metal layer being formed on a surface of the first metal layer, the insulating protective layer covering the mount surface
and the conductor pattern;

a plurality of electronic components mounted on the first area and the second area;
an insulating sealing layer having a trench, the insulating sealing layer covering the plurality of electronic components
and the protective layer, the trench having a depth such that the trench penetrates the protective layer to reach a surface
of the conductor pattern; and

a conductive shield having a first shield portion and a second shield portion, the first shield portion covering an outer
surface of the sealing layer, the second shield portion being electrically connected to the conductor pattern.

US Pat. No. 9,190,210

LAMINATED CERAMIC CAPACITOR

TAIYO YUDEN CO., LTD., T...

1. A laminated ceramic capacitor, comprising:
a laminate block made of alternately stacked ceramic dielectric layers and internal electrodes and having a top and bottom
with respect to the stacking direction, two side faces opposite to each other from which layers of the internal electrodes
are exposed, and a front and rear from which layers of the internal electrodes are exposed;

a pair of cover layers placed on the top and bottom of the laminate block;
ceramic bodies formed on both side faces of the laminate block; and
a pair of external electrodes that are electrically connected to the internal electrodes at the front and rear of the laminate
block,

wherein the average grain size of ceramic dielectric grains constituting the ceramic bodies is smaller than the average grain
size of ceramic dielectric grains constituting the ceramic dielectric layers in the laminate block,

wherein the average grain size of ceramic dielectric grains constituting the cover layers is smaller than the average grain
size of ceramic dielectric grains constituting the ceramic dielectric layers, but larger than the average grain size of ceramic
dielectric grains constituting the ceramic bodies.

US Pat. No. 9,305,717

ELECTROCHEMICAL DEVICE HAVING ELECTRIC STORAGE ELEMENT AND ELECTROYE SEALED IN INSULATING CASE

TAIYO YUDEN CO., LTD., T...

1. An electrochemical device comprising:
a lid;
a case having a via hole and forming a solution chamber between the case and the lid;
an electric storage element accommodated in the solution chamber;
an electrolyte accommodated in the solution chamber;
a wiring having a via hole part which is provided in the via hole and connects an interior and exterior of the solution chamber;
and

a conductive bonding material layer fixing the electric storage element onto the case and electrically connecting the electric
storage element and the via hole part, where the conductive bonding material layer has a contact area that contacts the case
and a non-contact area that does not contact the case, wherein the contact area contacts the case in a via hole-surrounding
area defined around the via hole, and the non-contact area is formed within a parameter of the contact area in a manner surrounding
the via hole-surrounding area and away from the via hole as viewed from above, wherein the conductive bonding material layer
extends over the contact area and the non-contact area.

US Pat. No. 9,306,532

FILTER CIRCUIT

TAIYO YUDEN CO., LTD., T...

1. A substrate structure for a filter circuit, comprising
a substrate;
a first terminal on the substrate to be connected to the filter and an antenna;
a second terminal on the substrate to be connected to the filter and a receiving circuit;
a third terminal on the substrate to be connected to the filter and a transmission circuit;
a first inductor, a second inductor, and a third inductor, the first, second, and third inductors being connected in series,
forming a serial chain of the first to third inductors, between the first terminal and the third terminal, one end of said
serial chain of the first to third inductors being directly connected to the first terminal and another end of said serial
chain of the first to third inductors being directly connected to the third terminal, the second inductor being provided in
the substrate, the first and third inductors being provided on the substrate;

a fourth inductor in the substrate, the fourth inductor having one end connected to a connecting node connecting the first
inductor to the second inductor, and having the other end grounded; and

a fifth inductor in the substrate, the fifth inductor having one end connected to a connecting node connecting the second
inductor to the third inductor, and having the other end grounded.

US Pat. No. 9,306,275

MULTI-ANTENNA AND ELECTRONIC DEVICE

TAIYO YUDEN CO., LTD., T...

1. A multi-antenna, comprising:
a passive element with an electrical length such that a resonance mode thereof is in a target frequency band; and
first and second feed elements, each of the first and second feed elements having an electrical length such that each of the
first and second feed elements does not resonate in said target frequency band, the first and second feed elements being capacitively
coupled with the passive element.

US Pat. No. 9,894,816

CIRCUIT MODULE

TAIYO YUDEN CO., LTD., T...

1. A circuit module, comprising:
a circuit board having a ground;
one or more electronic components provided on the circuit board;
a resin mold provided on the circuit board so as to seal the one or more electronic components in an insulating manner;
a conductive shield covering a top surface and side surfaces of the resin mold; and
a plurality of conductive poles provided in the resin mold, the plurality of conductive poles connecting a top surface of
the conductive shield and the ground of the circuit board,

wherein all of a plurality of rectangular regions on the top surface of the conductive shield have two sides with lengths
of a and b satisfying Formula (1) expressed as:

where fmax is a predetermined maximum usable frequency, ?r is a relative dielectric constant of the resin mold, m and n are any integers, and c is a light speed, each of the plurality
of rectangular regions being defined by side surfaces of the conductive shield and one or more of the plurality of conductive
poles, each of the plurality of rectangular regions including none of the plurality of conductive poles, and
wherein the plurality of conductive poles are arranged such that a distance between two closest conductive poles is equal
to or less than one-fourth of a wavelength at the predetermined maximum usable frequency in the resin mold.

US Pat. No. 9,112,478

DUPLEXER

TAIYO YUDEN CO., LTD., T...

1. A duplexer comprising:
a transmission filter connected between a common terminal and a transmission terminal; and
a reception filter connected between the common terminal and a reception terminal, wherein
the reception filter includes resonators located on a piezoelectric substrate,
at least one resonator of the resonators is connected in parallel between the common terminal and the reception terminal and
connected to a ground, and a resonator located at a side closest to the common terminal out of the at least one resonator
of the resonators is divided into two or more divided resonators, and

a resonance frequency fr of the divided resonators is in a range of fr=2×(fTL to fTH)?(fRL to fRH) when a pass band of the transmission filter is fTL to fTH and a pass band of the reception filter is fRL to fRH.

US Pat. No. 9,107,305

MULTILAYER SUBSTRATE

TAIYO YUDEN CO., LTD., T...

1. A RF module comprising:
a terminal connected to an antenna;
a core formed in a multilayer substrate configured by stacking conductive layers and insulation layers, the core being one
of the conductive layers and serving as a ground layer;

a first signal line included in one of the conductive layers adjacent to the core so that a first insulation layer that is
one of the insulation layers is interposed between the core and the first signal line, the first signal line being used for
transmission of RF signals received and transmitted by the antenna; and

a filter that filters the RF signals,
wherein the core has a recess portion that faces the first signal line, an outline shape of the recess portion in a plan view
being laterally extended in a direction along which the first signal line extends so as to follow the first signal line for
at least a prescribed distance in the plan view.

US Pat. No. 9,058,936

MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD THEREOF

TAIYO YUDEN CO., LTD., T...

1. A multilayer ceramic capacitor, comprising:
multiple dielectric layers;
internal electrodes which are embedded between the dielectric layers and whose primary constituent is Cu; and
external electrodes each connected electrically to one end of the internal electrodes;
wherein the dielectric layer contains a primary constituent of CaZrO3 compound as well as secondary constituents that include at least Mn, Li, B, and Si, and when its composition is expressed
by 100CaxZrO3+aMnO2+bLiO1/2+cBO3/2+dSiO2+eAlO3/2, contents of the respective constituents are as follows relative to 100 mol of CaxZrO3 (where 1.005?x?1.06):

1.5?a?4.5 mol

0.8?b/(c+d)?2.0

0.9?d/c?1.5

0?e?0.3 mol;

and when 10?(b+c+d)?14.9, an upper limit of x is defined by a line passing through (10, 1.03) and (14.9, 1.06), and a lower
limit of x is defined by a line passing through (10, 1.005) and (14.9, 1.02), wherein the coordinates indicate ((b+c+d), x)
(where if CaO is contained as a secondary constituent, then x represents a value of Ca/Zr based on a total sum of the primary
constituent of CaZrO3 and this CaO constituent).

US Pat. No. 9,120,531

MOTOR DRIVING CONTROL APPARATUS

MICROSPACE CORPORATION, ...

1. A motor driving control apparatus comprising:
a memory; and
a processor configured to use the memory and execute a process, the process comprising:
executing smoothing processing using values of pedal input torque, which is inputted from a pedal of an electrically assisted
bicycle, at a plurality of points to calculate a first smoothed torque value;

calculating a rate of points at which the pedal input torque is zero among the plurality of points;
first performing calculation processing of mixing the first smoothed torque value and the pedal input torque in accordance
with the rate to calculate assist torque; and

second performing processing to drive a motor of the electrically assisted bicycle using the assist torque.

US Pat. No. 9,162,730

MOTOR DRIVING CONTROL APPARATUS

MICROSPACE CORPORATION, ...

1. A motor drive control apparatus, comprising:
a speed processing unit configured to generate a first value by converting a second value corresponding to a current speed;
a torque processing unit configured to generate a third value by converting a fourth value corresponding to a target torque;
and

a drive unit configured to control switching by a switch included in a complementary switching amplifier by an average duty
ratio corresponding to a sum of the first value and the third value to drive a motor connected to the complementary switching
amplifier.

US Pat. No. 9,293,261

MULTILAYER CERAMIC CAPACITOR

TAIYO YUDEN CO., LTD., T...

5. A multilayer ceramic capacitor comprising a capacitor body of a structure where multiple internal electrode layers are
laminated via dielectric layers, wherein a part constituted by two adjacent internal electrode layers in a laminating direction
and one dielectric layer present between the two internal electrode layers is defined as a unit capacitor, and capacitances
of multiple unit capacitors arranged in the laminating direction exhibit a distribution that gradually increases from both
ends of the multiple unit capacitors in the laminating direction toward an inside thereof, reaching apexes of increase, respectively,
and gradually decreasing from the respective two apexes toward a center of the multiple unit capacitors in the laminating
direction,
wherein when an average capacitance of the unit capacitors at both ends in the laminating direction is expressed as Co, average
capacitance of the unit capacitors corresponding to the two apexes of increase is expressed as Cp, and capacitance of the
unit capacitor at the center in the laminating direction is expressed as Cs, then a difference between (Cp?Co)/Co (%) and
(Cp?Cs)/Cs (%) is 1.3% or more.

US Pat. No. 9,136,780

CONTROLLER FOR DRIVING A MOTOR AND ELECTRIC POWER-ASSISTED VEHICLE

TAIYO YUDEN CO., LTD., T...

1. A controller for driving a motor, comprising:
an input part that receives, from each of two brake sensors, a signal indicating that a corresponding brake is in an ON state
or a signal indicating that the brake is in an OFF state;

a control coefficient computing part computing a control coefficient that determines a value of a control parameter that controls
the motor relative to a target value of the control parameter, the target value being a value of the control parameter at
which the motor achieves a desired power generation efficiency, the control coefficient computing part increasing the control
coefficient along a first slope when a first signal indicating that only one of the brakes is in the ON state is received
from the input part, the control coefficient computing part increasing the control coefficient along a second slope when a
second signal indicating that both of the brakes are in the ON state is received from the input part, the second slope rising
faster than the first slope; and

a control part that derives a value of the control parameter in accordance with the target value of the control parameter
and the control coefficient computed by the control coefficient computing part, the control part forwarding the derived value
of the control parameter to the motor to control driving of the motor.

US Pat. No. 9,935,612

LADDER-TYPE FILTER, DUPLEXER, AND MODULE

TAIYO YUDEN CO., LTD., T...

1. A ladder-type filter comprising:one or more series resonators connected in series between an input terminal and an output terminal;
three or more parallel resonators connected in parallel between the input terminal and the output terminal; and
a path that electrically connects ground terminals of the three or more parallel resonators to each other, electrically connects to ground through only a ground terminal of a parallel resonator located closest to the input terminal or to the output terminal, and includes at least two inductors connected in series in at least two positions of positions between the ground terminals of the three or more parallel resonators,
wherein the at least two inductors include a first inductor and a second inductor located closer to the ground than the first inductor and has an inductance less than an inductance of the first inductor.

US Pat. No. 9,306,539

RESONATOR, FILTER, AND DUPLEXER

TAIYO YUDEN CO., LTD., T...

1. A resonator comprising:
a first comb-shaped electrode formed on a piezoelectric substrate and including a first bus bar, first electrode fingers coupled
to the first bus bar and extending in an extension direction, and first dummy electrode fingers coupled to the first bus bar;
and

a second comb-shaped electrode formed on the piezoelectric substrate and including a second bus bar, second electrode fingers
coupled to the second bus bar, extending in the extension direction, and facing the first dummy electrode fingers through
first gaps, and second dummy electrode fingers coupled to the second bus bar and facing the first electrode fingers through
second gaps, wherein

?D is greater than or equal to 0.5? and less than or equal to 3.5? (0.5???D?3.5?) where ?D represents a distance in the extension
direction between at least two gaps that are at least adjoining two of the first gaps and/or at least adjoining two of the
second gaps, and ? represents a pitch of the first electrode finger and the second electrode finger.

US Pat. No. 9,451,690

HIGH FREQUENCY CIRCUIT MODULE

TAIYO YUDEN CO., LTD., T...

1. A high frequency circuit module, comprising:
a multilayer circuit substrate formed by alternately stacking insulating layers and conductive layers; and
a high frequency switch having input/output terminals for high frequency signals formed on a main surface thereof,
wherein the high frequency switch is embedded in the multilayer circuit substrate,
wherein, in the multilayer circuit substrate, a first conductive layer is located above, and faces, the main surface of the
high frequency switch through an insulating layer, the first conductive layer having circuit patterns connected to the input/output
terminals through via conductors, and

wherein, in the multilayer circuit substrate, at least one second conductive layer is disposed above, and faces, the first
conductive layer through an insulating layer, the second conductive layer being patterned to have an opening in which a conductor
is not present, such that the patterned second conductive layer overlaps a part of the high frequency switch in a plan view,
but does not overlap the input/output terminals of the high frequency switch in the plan view, thereby mitigating stray capacitances
between the input/output terminals and the second conductive layer.

US Pat. No. 9,065,420

FABRICATION METHOD OF ACOUSTIC WAVE DEVICE

TAIYO YUDEN CO., LTD., T...

1. A fabrication method of an acoustic wave device comprising:
forming acoustic wave elements on a first substrate;
forming protrusion electrodes and seal rings on the first substrate simultaneously by an electrolytic plating method, the
protrusion electrodes being electrically connected to the acoustic wave elements, each of the seal rings surrounding related
acoustic wave elements out of the acoustic wave elements and related protrusion electrodes out of the protrusion electrodes
electrically connected to the related acoustic wave elements; and

cutting a plating power-supply line used in the electrolytic plating method in a step of dividing the first substrate into
pieces, each including a corresponding one of the seal rings so as to electrically separate the related acoustic wave elements
from the corresponding one of the seal rings.

US Pat. No. 9,560,740

CIRCUIT MODULE AND METHOD OF MANUFACTURING SAME

TAIYO YUDEN CO., LTD., T...

1. A circuit module, comprising:
a substrate having a plurality of electronic components mounted thereon, said substrate further having a conductive pattern
that defines respective shielded areas where the electronic components are mounted;

a sealing layer covering the substrate and the electronic components, said sealing layer having grooves formed therein along
said conductive pattern; and

a conductive shield, including:
a first shielding section covering a top surface of the sealing layer;
a second shielding section covering side faces of the sealing layer; and
a third shielding section filling the grooves in the sealing layer,
wherein the grooves in the sealing layer are shaped such that the third shielding section has at least one end thereof connected
to the second shielding section, the third shielding section thereby acting as shielding walls partitioning the respective
shielded areas, and that said at least one end of the third shielding section has a width wider than other portions of the
third shielding section.

US Pat. No. 9,306,538

COMPOSITE ELECTRONIC COMPONENT

TAIYO YUDEN CO., LTD., T...

1. A composite electronic component, comprising:
a circuit board having a rectangular planar shape;
a plurality of packages that include acoustic wave filters respectively, located on a top surface of the circuit board;
a dummy package that is located on the top surface of the circuit board and between two packages among the plurality of packages
and apart from a center part of the circuit board; and

a lid that is located above the plurality of packages and the dummy package,
wherein at least five of the plurality of packages and the dummy package are arranged in a longitudinal direction of the rectangular
planar shape of the circuit board, and the plurality of packages and the dummy package are not arranged in a width direction
of the rectangular planar shape.

US Pat. No. 9,299,495

CAPACITOR

TAIYO YUDEN CO., LTD., T...

1. A capacitor, comprising:
a dielectric layer having a first plane, a second plane opposite to the first plane, and a plurality of through-holes communicated
with the first plane and the second plane;

a first external electrode layer disposed on the first plane;
a second external electrode layer disposed on the second plane;
a first internal electrode having a first electrode portion and a second electrode portion, the first electrode portion being
formed of a first conductive material, the second electrode portion being formed of a second conductive material, the second
electrode material connecting the first electrode portion with the first external electrode layer, the second conductive material
having a smaller Young's modulus than the first conductive material, the first internal electrode being housed in a part of
the plurality of through-holes; and

a second internal electrode housed in another part of the plurality of through-holes, the second internal electrode being
connected to the second external electrode layer.

US Pat. No. 10,021,791

MULTILAYER WIRING SUBSTRATE

TAIYO YUDEN CO., LTD., T...

1. A multilayer wiring substrate, comprising:a first wiring substrate having a first core member made of metal with cavities therein;
a second wiring substrate having a second core member made of metal; and
a bonding layer between the first wiring substrate and the second wiring substrate to bond a bottom surface of the first wiring substrate to a top surface of the second wiring substrate, the bonding layer having a first patterned conductive layer on a top surface thereof and a second patterned conductive layer on a bottom surface thereof,
wherein the first wiring substrate further comprises a top wiring layer having component connection terminals and covering a top surface of the first core member, the top wiring layer having a multilayer wiring structure in which a plurality of wiring sections are stacked on each other via an insulating film in between on the top of the first core member,
wherein electronic components are housed in the respective cavities and electrically connected to the top wiring layer,
wherein the first wiring substrate further comprises a bottom wiring layer between the first core member and the bonding layer, connected to the first patterned conductive layer of the bonding layer, the bottom wiring layer having a multilayer wiring structure in which a plurality of wiring sections are stacked on each other via an insulating film in between on the bottom of the first core member,
wherein the second wiring substrate further comprises a top wiring layer between the second core member and the bonding layer, connected to the second patterned conductive layer of the bonding layer, the top wiring layer having a multilayer wiring structure in which a plurality of wiring sections are stacked on each other via an insulating film in between on the top of the second core member, and
wherein the second wiring substrate further comprises a bottom wiring layer between the second core member and the bonding layer, the bottom wiring layer having a multilayer wiring structure in which a plurality of wiring sections are stacked on each other via an insulating film in between on the bottom of the second core member.

US Pat. No. 9,473,105

ACOUSTIC WAVE DEVICE AND METHOD OF FABRICATING THE SAME

TAIYO YUDEN CO., LTD., T...

1. An acoustic wave device comprising:
a substrate;
a functional element formed on the substrate and including an excitation electrode that excites an acoustic wave;
a columnar electrode formed on the substrate and electrically connected to the excitation electrode;
a metal frame body formed on the substrate and surrounding the functional element and the columnar electrode in a plan view
and electrically isolated from the columnar electrode; and

a ceramic substrate sealing the functional element in combination with the metal frame body, a first metal layer bonded to
the columnar electrode and a second metal layer bonded to the metal frame body being formed on a surface of the ceramic substrate,
the first metal layer being located between the columnar electrode and the ceramic substrate, the second metal layer being
located between the metal frame body and the ceramic substrate.

US Pat. No. 9,349,517

COIL COMPONENT

TAIYO YUDEN CO., LTD., T...

1. A coil component of the type where a helical coil covered with a magnetic body is directly contacting the magnetic body,
said coil component characterized in that the magnetic body is mainly constituted by magnetic alloy grains, other than ferrite
grains, and does not contain a glass component, wherein the magnetic alloy grains consist of grains made of a magnetic alloy
and an oxide of the magnetic alloy, said oxide being film covering the surface of the grains, said magnetic alloy grains being
bonded together by the oxide film without any other binder and by metal-to-metal bonding of the grains made of the magnetic
alloy where no oxide film is formed.

US Pat. No. 9,350,357

RECONFIGURABLE SEMICONDUCTOR DEVICE

TAIYO YUDEN CO., LTD., T...

1. A reconfigurable semiconductor device, comprising:
a plurality of logic units connected to each other by address lines or data lines,
wherein each of the logic units includes:
a plurality of address lines;
a plurality of data lines;
a first address decoder that decodes an address inputted from some of the plurality of address lines;
a second address decoder that decodes an address inputted from the other of the plurality of address lines;
a first memory cell unit having a plurality of memory cells, the first memory cell receiving the address decoded by the first
address decoder and selecting, among the plurality of memory cells, a predetermined number of memory cells in accordance with
the decoded address; and

a second memory cell unit having a plurality of memory cells, the first memory cell receiving the address decoded by the second
address decoder and selecting, among the plurality of memory cells, a predetermined number of memory cells in accordance with
the decoded address.

US Pat. No. 9,502,181

LOW-HEIGHT MULTILAYER CERAMIC CAPACITOR

TAIYO YUDEN CO., LTD., T...

1. A low-height multilayer ceramic capacitor whose height is smaller than its width and which comprises a dielectric chip
of roughly rectangular solid shape having an external electrode at each end of the chip in a length direction of the chip,
wherein:
the dielectric chip has multiple internal electrode layers laminated in the height direction alternately with capacity-forming
dielectric layers, and has protective dielectric layers each overlaying the respective internal electrode layers provided
on both top and bottom sides of the dielectric chip relative to the height direction;

the external electrodes each have an end face covering an end face of the dielectric chip in the length direction, as well
as a wraparound part extending from the end face of the external electrodes and covering at least part of both top and bottom
faces of the dielectric chip relative to the height direction;

ends of some of the multiple internal electrode layers are connected to the end face of one of the external electrodes, while
ends of the other multiple internal electrode layers are connected to the end face of the other external electrode; and,

provided that a thickness of each of the protective dielectric layers of the dielectric chip is given by t11c and a thickness of the wraparound part of each of the external electrodes is given by t12b, t11c and t12b meet a condition “t11c wherein a height of the low-height multilayer ceramic capacitor is 150 ?m or less.

US Pat. No. 9,484,372

SUBSTRATE FOR EMBEDDING IMAGING DEVICE AND METHOD FOR MANUFACTURING SAME, AND IMAGING APPARATUS

TAIYO YUDEN CO., LTD., T...

1. A substrate for embedding an imaging device, comprising:
a core layer;
a first multilayered wiring layer that is formed onto the core layer, the core layer and the first multilayered wiring layer
having a cavity penetrating therethrough;

a second multilayered wiring layer that is formed onto the core layer on a side opposite to the first multilayered wiring
layer and that includes a conductive pattern formed at a position facing the cavity;

a resin portion that is arranged inside the cavity and includes a bottom surface supported by and directly connected to the
second multilayered wiring layer, a side face supported by and directly connected to the core layer, and a curved surface
formed on a side opposite to the bottom surface; and

an imaging device adhered along the curved surface inside the cavity.

US Pat. No. 9,460,843

ELECTRONIC COMPONENT

TAIYO YUDEN CO., LTD., T...

1. An electronic component comprising:
a shaft;
a flange formed at an end of the shaft and constituting a core together with the shaft;
a coiled conductor wound around the shaft; and
an electrode terminal formed on the flange and connected electrically to an end of the coiled conductor;
wherein the shaft and flange are made of a metal magnetic material, and the shaft is more densely filled with the metal magnetic
material than the flange,

wherein a/b, where a represents a fill ratio of metal magnetic material of the flange and b represents a fill ratio of metal
magnetic material of the shaft, is 0.9 to 0.97.

US Pat. No. 9,356,573

PIEZOELECTRIC THIN FILM RESONATOR, FILTER AND DUPLEXER INCLUDING A FILM INSERTED IN THE PIEZOELECTRIC FILM

TAIYO YUDEN CO., LTD., T...

1. A piezoelectric thin film resonator comprising:
a substrate;
a piezoelectric film that is provided on the substrate;
a lower electrode and an upper electrode that sandwich at least a part of the piezoelectric film and face with each other;
and

an inserted film that is inserted in the piezoelectric film, is provided in an outer circumference region of a resonance region
in which the lower electrode and the upper electrode sandwich the piezoelectric film and face with each other and is not provided
in a center region of the resonance region,

wherein:
an angle between an edge face of the lower electrode and a lower face of the lower electrode in the resonance region is an
acute angle; and

a width of the inserted film in the resonance region on a side for extracting the upper electrode from the resonance region
is larger than another width of the inserted film in the resonance region on a side for extracting the lower electrode from
the resonance region.

US Pat. No. 9,165,705

LAMINATED INDUCTOR

TAIYO YUDEN CO., LTD., T...

1. A laminated inductor comprising:
an internal conductor forming region comprising a magnetic part formed with soft magnetic alloy grains, as well as internal
conductor embedded in layers in the magnetic part; and

a top cover region and a bottom cover region formed on a top and bottom of and in contact with the internal conductor forming
region, respectively, to cover the internal conductor forming region as top and bottom layers,

wherein the top cover region and bottom cover region are constituted by a magnetic body without internal conductors,
average-sized soft magnetic alloy grains constituting at least one of the top cover region and bottom cover region are larger
than average-sized soft magnetic alloy grains constituting the magnetic part, and

at least some of the soft magnetic alloy grains of the at least one of the top cover region and bottom cover region are bonded
together via an insulating material.

US Pat. No. 9,101,044

CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME

Taiyo Yuden Co., Ltd, To...

1. A circuit module, comprising:
a substrate having a mount surface;
a mount component mounted on the mount surface;
a sealing body having a main surface and an outer peripheral surface, the sealing body sealing the mount component, the main
surface sandwiching the mount component between the main surface and the mount surface, the outer peripheral surface covering
the mount component on the mount surface;

a trench having a groove-like shape, the trench being recessed from the main surface of the sealing body to the mount surface,
the trench having two end portions adjacent to and spaced apart from the outer peripheral surface, the trench having an intermediate
portion extending continuously along the mount surface from one end portion to the other end portion with the end portions
being spaced apart from one another in a direction parallel to the sealing body main surface, the two end portions each having
either a stepped configuration or a lower portion thereof that extends up toward the sealing body main surface in an inclined
or a curved manner and being formed to be shallower than the intermediate portion of the trench extending between the two
end portions, the intermediate portion having a constant depth; and

a shield having an external shield portion covering the main surface and the outer peripheral surface of the sealing body,
and an internal shield portion being filled in the trench with the external shield portion along the outer peripheral surface
being spaced from the internal shield portion in the two end portions of the trench.

US Pat. No. 9,101,075

SUBSTRATE WITH BUILT-IN COMPONENT

Taiyo Yuden Co., Ltd, To...

1. A substrate with built-in component, comprising:
a metal core layer having a cavity for storing a component, the cavity being formed by a single aperture;
a wiring layer that is laminated on the core layer and has a plurality of vias for an interlayer connection, the vias being
formed at regions opposing to the cavity; and

an electronic component including a plurality of terminals electrically connected to the plurality of vias, and a component
body that is stored in the cavity and has a support surface for supporting the plurality of terminals, the plurality of terminals
being disposed eccentrically from a center of the support surface to a first direction, and the component body being disposed
eccentrically from a center of the cavity to a second direction opposite to the first direction;

wherein the cavity has a first aperture portion having an approximate rectangular shape, the support surface has an approximate
rectangular planar shape, the plurality of terminals are disposed along a peripheral of the support surface; and

the cavity has a plurality of second aperture portions formed at four corners of the first aperture portion and protruded
outward from the four corners.

US Pat. No. 9,444,429

PIEZOELECTRIC THIN-FILM RESONATOR, METHOD FOR FABRICATING SAME, FILTER AND DUPLEXER HAVING AN INTERPOSED FILM

TAIYO YUDEN CO., LTD., T...

1. A piezoelectric thin-film resonator comprising:
a substrate;
a piezoelectric film having a lower piezoelectric film provided on the substrate and an upper piezoelectric film provided
on the lower piezoelectric film;

a lower electrode and an upper electrode that face each other through at least a part of the piezoelectric film;
an interposed film that is interposed between the lower piezoelectric film and the upper piezoelectric film and is located
in an outer circumferential part of a resonance region in which the lower electrode and the upper electrode face each other
through the piezoelectric film, while the interposed film is not provided in a central part of the resonance region;

an upper surface of the lower piezoelectric film having a first roughness in a region in which the interposed film is not
provided and a second roughness in another region in which the interposed film is provided, the first roughness being smaller
than the second roughness.

US Pat. No. 9,087,979

ACOUSTIC WAVE DEVICE

TAIYO YUDEN CO., LTD., T...

1. An acoustic wave device comprising:
a piezoelectric film made of an aluminum nitride film containing a divalent element and one of a tetravalent or pentavalent
element; and

electrodes connected to the piezoelectric film to excite an acoustic wave propagating through the piezoelectric film,
wherein the divalent element and one of the tetravalent or pentavalent element are substituted for aluminum atoms of the aluminum
nitride film.

US Pat. No. 9,053,865

LAMINATED CERAMIC CAPACITOR

TAIYO YUDEN CO., LTD., T...

1. A dielectric ceramic composition constituted by a primary component constituted by BaTiO3 and auxiliary components constituted by Re, Mn, V, Mo, Cu, B, Li, Ca, and Sr, wherein it is expressed by BaTiO3+aRe2O3+bMnO+cV2O5+dMoO3+eCuO+fB2O3+gLi2O+xSrO+yCaO (where Re represents at least one type of element selected from Eu, Gd, Dy, Ho, Er, Yb, and Y, and a to g, x,
and y represent mol numbers relative to 100 mol of the primary component constituted by BaTiO3) and, when a mol ratio of (Ba+Sr+Ca)/Ti contained in the dielectric ceramic composition is given by m, 0.10?a?0.50, 0.20?b?0.80,
0?c?0.12, 0?d?0.07, 0.04?c+d?0.12, 0?e?1.00, 0.50?f?2.00, 0.6?(100 (m?1) +2 g)/2f?1.3, 0.5?100 (m?1)/2 g?5.1, 0?x?1.5, and
0?y?1.5.

US Pat. No. 9,117,590

LAMINATED CERAMIC ELECTRONIC COMPONENT

TAIYO YUDEN CO., LTD., T...

1. A laminated ceramic electronic component having ceramic layers and electrode layers stacked with the ceramic layers, wherein
a thickness of each electrode layer is 0.5 ?m or less and an average size of crystal grains constituting the electrode layer
is 0.1 ?m or less, wherein a surface roughness based on a maximum height of an interface between each ceramic layer and each
electrode layer is one-third the thickness of the electrode layer or less.

US Pat. No. 9,071,224

FILTER AND DUPLEXER

TAIYO YUDEN CO., LTD., T...

1. A filter comprising:
a plurality of piezoelectric thin film resonators, each having a multilayered film including a lower electrode located on
a substrate, a piezoelectric film located on the lower electrode, and an upper electrode located on the piezoelectric film
so as to face the lower electrode, wherein

at least two piezoelectric thin film resonators each have a thick film portion in at least a part of an outer peripheral portion
of a resonance region, the thick film portion being absent in an inner area of the resonance region that is surrounded by
said outer peripheral portion, and the multilayered film in the thick film portion is thicker than the multilayered film in
any other areas in the resonance region, the resonance region being defined as a region where the lower electrode and the
upper electrode face each other across the piezoelectric film for each of said at least two piezoelectric thin film resonators,
and

respective lengths of the thick film portions from edges of the resonance regions are different from each other in the at
least two piezoelectric thin film resonators.

US Pat. No. 9,601,350

BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE BONDING METHOD, BONDING-SUBSTRATE FABRICATION APPARATUS, AND SUBSTRATE ASSEMBLY

BONDTECH CO., LTD., Kyot...

1. A bonding substrate fabrication method for fabricating a substrate (“bonding substrate”) on which a bonding surface is
formed, the bonding substrate fabrication method comprising:
a first surface treatment step of surface-treating a surface of a substrate by irradiation with radiated particles including
energetic particles; and

a second surface treatment step of surface-treating the substrate surface by irradiation with radiated particles including
metal particles;

wherein the bonding substrate is fabricated as a result of implementing the first surface treatment step and second surface
treatment step; and

implementation of the first surface treatment step and the second surface treatment step is controlled so that the metal particles
will be distributed in a base material of a surface layer of the bonding substrate, and the implementation is controlled without
forming a metal layer on the surface of the bonding substrate.

US Pat. No. 9,428,172

MOTOR DRIVE CONTROL DEVICE

MICROSPACE CORPORATION, ...

1. A motor drive control device for an electric power-assisted vehicle provided with a motor drive system and a pedal drive
system each of which is provided with a one-way clutch, the device comprising:
a first calculating part that calculates a pedal rotation conversion speed that is converted from a pedal rotation;
a second calculating part that, during a period in which a first target torque is not detected, calculates a second target
torque for a motor based on the pedal rotation conversion speed, the first target torque being calculated based on a pedal
torque;

a first processing part that generates a first value by converting a rotational speed of the motor to a duty cycle;
a second processing part that generates a second value by converting the second target torque to a duty cycle; and
a driver that controls switching of a switch provided in a complementary switching amplifier, based on an average duty cycle
derived from a sum of the first value and the second value, the driver driving a motor that is connected to the complementary
switching amplifier,

wherein the second calculating part calculates the second target torque in accordance with the first target torque during
a period in which the first target torque is detected.

US Pat. No. 9,318,265

MULTILAYER CERAMIC CAPACITOR PROVIDED WITH EXTERNAL ELECTRODES PARTIALLY COVERED BY SOLDER NON-ADHESION FILM

TAIYO YUDEN CO., LTD., T...

1. A multilayer ceramic capacitor comprising a dielectric chip made of dielectric ceramics and having a roughly rectangular
shape, as well as external electrodes respectively positioned on opposing ends thereof, where ends of parts of multiple internal
electrode layers built into the dielectric chip in a manner not contacting each other are connected to one external electrode,
while ends of the other parts are connected to the other external electrode, wherein:
each of the external electrodes has an end face of roughly rectangular shape covering an end face of the dielectric chip,
a side face of roughly quadrangular cylinder shape covering a part of four side faces of the dielectric chip, and a curved
face of roughly arc cross-section present between the end face and side face; and

each of the external electrodes has a solder non-adhesion film made of material to which solder does not adhere, said solder
non-adhesion film continuously and exclusively covering an entire surface of the end face and a part or an entire surface
of the curved face without covering the side face wherein a distance between an edge of the solder non-adhesion film on one
end of the capacitor and an edge of the solder non-adhesion film on the other end of the capacitor, which corresponds to an
outer edge distance of solder to be attached to each external electrode, is shorter than a length of the dielectric chip.

US Pat. No. 9,161,438

STRESS BUFFER LAYER AND METHOD FOR PRODUCING SAME

TAIYO YUDEN CO., LTD., T...

1. A stress buffer layer comprising:
a plate-like base material made of an anodic oxide of a valve metal that has been subject to anodic oxidation, the base material
having a top surface and a bottom surface each covered by a pair of insulating material layers made of an insulating material
having a Young's modulus smaller than the anodic oxide of the valve metal, the base material having many through holes penetrating
through the top surface and the bottom surface which are formed during the anodic oxidation of the valve metal; and

an internal electrode filled in the many through holes and conductively connected directly or indirectly to an electronic
component, wherein both ends of the internal electrode are formed so as to be substantially on the same plane as the top and
bottom surfaces of the base material at a point in time immediately before the internal electrode is connected to the electronic
component.

US Pat. No. 9,147,527

VARIABLE CAPACITY COMPOSITE COMPONENT

TAIYO YUDEN CO., LTD., T...

1. A variable capacity composite component which is a variable capacitor element comprising an N number of variable capacitors
(where N =2n, wherein n is a natural number) arranged and connected in series on a support substrate, where each variable
capacitor comprises a first electrode on a first signal terminal side and a second electrode on a second signal terminal side
as well as a dielectric layer sandwiched by the two electrodes and whose dielectric constant changes due to an applied voltage,
said variable capacity composite component having:
while the first electrode of one of a pair of adjacent variable capacitors is electrically connected to the second electrode
of the other variable capacitor in the pair, a first bias line including a resistance component, electrically connected to
the first electrode of a 2i+1t? variable capacitor (where i is a natural number equal to or smaller than n) or second electrode
of a 2ith variable capacitor from the variable capacitor on the first signal terminal side, and also connected to the first
bias terminal; and

a second bias line including resistance component, electrically connected to the first electrode of a 2ith variable capacitor
or second electrode of a 2i?1t? variable capacitor from the variable capacitor on the first signal terminal side, and also
connected to the second bias terminal;

wherein a resistance value of the second bias line is adjusted to 0.45 to 0.55 times a resistance value of the first bias
line connected to the first electrode of a first variable capacitor from the first signal terminal side and also connected
to the first bias terminal, as well as a resistance value of the first bias line connected to the second electrode of an Nth
variable capacitor and also connected to the first bias terminal.

US Pat. No. 9,558,810

SEMICONDUCTOR DEVICE

TAIYO YUDEN CO., LTD., T...

1. A semiconductor device capable of reconfiguration, characterized by comprising a plurality of logic units which are connected
to each other by an address line or a data line, wherein
each of the logic units includes:
a plurality of address lines;
a plurality of data lines;
a clock signal line to receive a system clock signal;
a first and a second memory cell units which operate synchronously with the clock signal;
a first address decoder which decodes an address signal and outputs a decode signal to the first memory cell unit;
a second address decoder which decodes an address signal and outputs a decode signal to the second memory cell unit; and
an address transition detection unit which generates an internal clock signal and outputs the internal clock signal to the
first memory cell unit, when a transition of the address signal input from the plurality of address lines is detected, wherein
the first memory cell unit operates synchronously with the internal clock signal, and the second memory cell unit operates
synchronously with the system clock signal.

US Pat. No. 9,397,634

FILTER, DUPLEXER AND COMMUNICATION MODULE

TAIYO YUDEN CO., LTD., T...

1. A filter comprising a plurality of series resonators connected to a signal line in series and a plurality of parallel resonators
connected to the signal line in parallel,
wherein two parallel resonators that are adjacent to each other are connected, in parallel, to a first portion of the signal
line that connects a pair of two adjacent series resonators among the plurality of series resonators, and at least one parallel
resonator is connected, in parallel, to a second portion of the signal line that connects a different pair of two adjacent
series resonators,

a first inductor is connected to one parallel resonator of said two parallel resonators in series,
a second inductor is connected to one parallel resonator of said at least one parallel resonator in series,
a third inductor is connected to said two parallel resonators and said at least one parallel resonator, and
an inductance of each of said first, second and third inductors is set such that a total inductance of said first and third
inductors and a total inductance of said second and third inductors are not equal to each other.

US Pat. No. 9,312,070

MULTILAYER CERAMIC CAPACITOR

TAIYO YUDEN CO., LTD., T...

1. A multilayer ceramic capacitor having multiple laminated dielectric ceramic layers made of a dielectric ceramic, internal
electrodes formed between the dielectric ceramic layers, and external electrodes electrically connected to the internal electrodes,
each internal electrode including non-contiguous parts along a direction in which the internal electrode extends as a result
of sintering, wherein:
ceramic grains having a crystal axis ratio c/a are present in the non-contiguous parts of the internal electrodes between
the dielectric ceramic layers by an area ratio of 15% or more in the non-contiguous parts as measured in a cross section in
a thickness direction of the non-contiguous parts of the internal electrodes, wherein the crystal axis ratio c/a of the ceramic
grains present in the non-contiguous parts of each internal electrode is higher than that of all ceramic grains constituting
the dielectric ceramic layer in contact with the internal electrode.

US Pat. No. 9,160,301

ACOUSTIC WAVE DEVICE

TAIYO YUDEN CO., LTD., T...

1. An acoustic wave device comprising:
a multilayer structure that laminates a plurality of layers and has a plurality of surfaces for forming wiring which respective
principal surfaces of the plurality of layers provide;

a chip that includes an acoustic wave filter and is mounted on a first surface, the first surface being a front surface of
the multilayer structure;

a resin unit that is formed on the first surface and seals the chip;
a wiring pattern that is formed in contact with a second surface different from the first surface and is electrically connected
to at least one of resonators which constitute the acoustic wave filter;

a ground pattern that is formed in contact with the second surface along at least a part of the wiring pattern, the ground
pattern being away from the wiring pattern in a planar direction of the second surface, the ground pattern including a first
portion surrounding the wiring pattern; and

an external terminal that is formed on a third surface different from the first and the second surfaces and is electrically
connected to the wiring pattern and the ground pattern, the third surface being disposed on an opposite side of the first
surface with respect to the second surface,

wherein a part of the wiring pattern that comes closest to the first portion of the ground pattern in the planar direction
of the second surface and that is located in contact with the second surface is substantially formed in parallel with the
first portion of the ground pattern.

US Pat. No. 9,124,242

FILTER, DUPLEXER, COMMUNICATION MODULE AND COMMUNICATION DEVICE

TAIYO YUDEN CO., LTD., T...

1. A filter comprising:
a plurality of primary resonators connected to a serial arm;
a plurality of secondary resonators connected to a parallel arm;
a primary inductor connected to at least one of the plurality of primary resonators in parallel; and
a secondary inductor connected to at least one of the plurality of secondary resonators in parallel,
wherein
the secondary resonator to which the secondary inductor is connected in parallel is connected to a segment of the serial arm,
said segment being outside of a segment of the serial arm to which the primary inductor is connected in parallel, and

wherein an inductance of the secondary inductor is larger than an inductance of the primary inductor.

US Pat. No. 9,112,134

RESONATOR, FREQUENCY FILTER, DUPLEXER, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING RESONATOR

TAIYO YUDEN CO., LTD., T...

1. A resonator, comprising:
a supporting substrate;
a piezoelectric layer made of a piezoelectric material;
a pair of excitation electrodes that is formed on an upper surface of the piezoelectric layer, the pair of excitation electrodes
being provided to excite bulk acoustic waves in the piezoelectric layer; and

a bonding layer that has a cavity formed therein so as to face the pair of excitation electrodes through the piezoelectric
layer, the bonding layer being provided to bond the supporting substrate to a lower surface of the piezoelectric layer,

wherein said cavity starts from a top of the bonding layer and does not penetrate through a bottom of the bonding layer.

US Pat. No. 9,093,976

SWITCHING DEVICE AND MODULE

TAIYO YUDEN CO., LTD., T...

1. A switching device having a plurality of input-output terminals and a common terminal that are to be connected to external
devices, the switching device comprising:
a switch connected to the plurality of input-output terminals and the common terminal, the switch selecting one of the plurality
of input-output terminals and connecting said selected one of the plurality of input-output terminals to the common terminal;
and

a delay line that is connected in parallel to the switch between two input-output terminals among the plurality of input-output
terminals, the delay line comprising:

a first IDT that is formed on a piezoelectric layer and that converts a first electrical signal input from one of the two
input-output terminals into an acoustic wave propagating through the piezoelectric layer; and

a second IDT that is formed on the piezoelectric layer and that receives and converts the acoustic wave propagating through
the piezoelectric layer into a second electrical signal and outputs the second electrical signal to another of the two input-output
terminals.

US Pat. No. 9,065,419

LADDER FILTER, DUPLEXER AND MODULE

TAIYO YUDEN CO., LTD., T...

1. A module including at least one ladder filter comprising:
at least one series resonator connected in series between an input terminal and an output terminal;
at least one parallel resonator connected in parallel with the at least one series resonator; and
an inductor connected in parallel with the at least one series resonator,
the at least one series resonator and the inductor generating a first attenuation pole at a frequency equal to or lower than
a pass band defined by the at least one series resonator and the at least one parallel resonator,

the first attenuation pole being located at a frequency that is higher than a resonance frequency of a parallel resonator
that is included in the at least one parallel resonator and has a highest resonance frequency and that is equal to or lower
than a high-frequency end of the pass band.

US Pat. No. 9,608,193

ACOUSTIC WAVE DEVICE AND METHOD OF FABRICATING THE SAME

TAIYO YUDEN CO., LTD., T...

1. An acoustic wave device comprising:
a piezoelectric substrate made of a piezoelectric crystal having cleavage directions that intersect with each other, the piezoelectric
substrate being formed such that four sides of an upper surface of the piezoelectric substrate are parallel to said cleavage
directions of the piezoelectric crystal; and

a plurality of electrodes that are formed on the upper surface of the piezoelectric substrate and excites an acoustic wave
propagating in a propagation direction different from the cleavage directions, each of the plurality of electrodes including
electrode fingers and bus bars to which the electrode fingers are coupled,

wherein an extending direction of each of the four sides is different from the propagation direction,
wherein the plurality of electrodes are arranged in a direction inclined from the four sides of the upper surface of the piezoelectric
substrate, and

wherein a length of the bus bars of a central electrode among the plurality of electrodes is longer than a length of a shortest
side among the four sides.

US Pat. No. 9,536,666

MULTI-LAYER CERAMIC CAPACITOR

TAIYO YUDEN CO., LTD., T...

1. A multi-layer ceramic capacitor having a laminate of dielectric layers and internal electrode layers laminated alternately
with one another, as well as cover lavers formed as outermost lavers at a top and bottom of the laminate in a laminating direction,
wherein:
the dielectric layers are constituted by a sintered compact containing a barium titanate and a silicon compound; and
a fresnoite phase having an average grain size of 1?m or less is present in the dielectric layers,
wherein an abundance of fresnoite phase in the dielectric layers is 0.5 to 3%, said abundance being defined as an average
ratio of an area of the fresnoite phase to the entire area observed in a cross section of the dielectric layer.

US Pat. No. 9,509,276

ACOUSTIC WAVE DEVICE AND METHOD OF FABRICATING THE SAME

TAIYO YUDEN CO., LTD., T...

1. An acoustic wave device comprising:
a substrate;
a functional element formed on the substrate and including an excitation electrode that excites an acoustic wave;
a columnar electrode formed on the substrate and electrically connected to the excitation electrode;
a metal frame body formed on the substrate and surrounding the functional element and the columnar electrode in a plan view
and electrically isolated from the columnar electrode; and

a ceramic substrate sealing the functional element in combination with the metal frame body, a first metal layer bonded to
the columnar electrode and a second metal layer bonded to the metal frame body being formed on a surface of the ceramic substrate,
the first metal layer being located between the columnar electrode and the ceramic substrate, the second metal layer being
located between the metal frame body and the ceramic substrate.

US Pat. No. 9,136,823

DUPLEXER

TAIYO YUDEN CO., LTD., T...

1. A duplexer comprising:
a reception filter that is connected between a reception terminal and an antenna terminal and includes one or a plurality
of series reception resonators that are acoustic wave resonators; and

a transmission filter that is connected between a transmission terminal and the antenna terminal and includes one or a plurality
of acoustic wave transmission resonators,

a resonance frequency of a first series reception resonator that is one of the one or the plurality of series reception resonators
and is closest to the antenna terminal in the reception filter being higher than 103% of an upper limit frequency of a reception
band of the reception filter.

US Pat. No. 9,117,595

ELECTRONIC COMPONENT WITH TERMINAL STRIPS

TAIYO YUDEN CO., LTD., T...

1. An electronic component with terminal strips, which comprises an electronic component having external electrodes on its
opposing ends, as well as a terminal strip joined to each of the external electrodes, and which is configured to mount the
electronic component onto a board or other mating part by both terminal strips, wherein:
each of the terminal strips has a plate-like joint being joined via a solder to an end face of each of the external electrodes,
a plate-like leg continuing from the plate-like joint, a plate-like mounting part continuing from the plate-like leg, and
two plate-like supports continuing from the plate-like leg;

the two plate-like supports are formed by bending inwardly, as viewed from above, two plate-like parts projecting in a line-symmetrical
manner with reference to a direction perpendicular to an axis of the electronic component, from both side edges of the plate-like
leg as viewed in a direction of the axis of the electronic component, such that at least a tip of a thickness surface on the
electronic component side of each plate-like part is positioned below the electronic component and in contact with a bottom
face of the corresponding external electrode; and

the electronic component is supported from below by at least the tips of the thickness surfaces on the electronic component
sides of the four plate-like supports.

US Pat. No. 9,093,221

CERAMIC POWDER AND MULTI-LAYER CERAMIC CAPACITOR

TAIYO YUDEN CO., LTD., T...

1. A ceramic powder that contains sintered barium titanate powder having a perovskite structure with a median size of 200
nm or smaller as measured by SEM observation, wherein the barium titanate powder is such that the percentage of barium titanate
particles having twin defects in the barium titanate powder is less than 10% as measured by TEM observation and that its crystal
lattice c/a is 1.0075 or more.

US Pat. No. 9,602,075

ELECTRONIC MODULE HAVING AN INTERCONNECTION SUBSTRATE WITH A BURIED ELECTRONIC DEVICE THEREIN

TAIYO YUDEN CO., LTD., T...

1. A module comprising:
an electronic device comprising:
a first substrate;
a first function part formed on a first surface of the first substrate;
an adhesive layer formed on the first surface so as to surround the first function part;
a second substrate that is bonded to the first substrate by the adhesive layer so as to form a gap between the first and second
substrates;

a first via interconnection that pierces the first substrate to connect the first surface and a second surface of the first
substrate opposite to the first surface together;

a second via interconnection that pierces the second substrate to connect a third surface of the second substrate opposite
to the first substrate and a fourth surface of the second substrate opposite to the third surface together;

a first terminal that is provided on the second surface and is connected to the first via interconnection; and
a second terminal that is provided on the fourth surface and is connected to the second via interconnection,
the first function part being connected to at least one of the first via interconnection and the second via interconnection,
an interconnection substrate in which the electronic device is buried;
a third terminal that is provided on a fifth surface of the interconnection substrate closer to the second surface;
a fourth terminal that is provided on a sixth surface of the interconnection substrate closer to the fourth surface;
a first interconnection line that connects the third terminal to the first terminal, is located between the second surface
and the fifth surface and does not pass through a region of the interconnection substrate located just beside the electronic
device; and

a second interconnection line that connects the fourth terminal to the second terminal, is located between the fourth surface
and the sixth surface and does not pass through the region of the interconnection substrate.

US Pat. No. 9,590,288

MULTILAYER CIRCUIT SUBSTRATE

TAIYO YUDEN CO., LTD., T...

1. A multilayer circuit substrate formed by stacking insulating layers and conductive layers, comprising:
a first signal line and a first ground conductor spaced apart from the first signal line formed in a first conductive layer;
and

a second signal line and a second ground conductor spaced apart from the second signal line formed in a second conductive
layer, the second conductive layer facing the first conductive layer across an insulating layer,

wherein the first signal line intersects the second signal line in a plan view of the multilayer circuit substrate,
wherein a space between the first ground conductor and first signal line is smaller in an intersection area of the first and
second signal lines than a space in a non-intersection area,

wherein a space between the second ground conductor and second signal line is smaller in the intersection area than a space
in the non-intersection area,

wherein the first signal line is formed at a smaller line width in the intersection area than in the non-intersection area,
wherein the second signal line has the same line width throughout the intersection area and the non-intersection area,
wherein in the non-intersection area, in the plan view, the first signal line in the first conductive layer is disposed directly
above the second ground conductor in the second conductive layer, and

wherein in the non-intersection area, in the plan view, the second signal line in the second conductive layer is disposed
directly under the first ground conductor in the first conductive layer.

US Pat. No. 9,472,341

METHOD FOR MANUFACTURING MAGNETIC GRAIN COMPACT

TAIYO YUDEN CO., LTD., T...

1. A method for manufacturing a magnetic grain compact, comprising:
providing multiple metal grains constituted by soft magnetic alloy containing Fe, Si, and a metal element M that oxidizes
more easily than Fe;

compacting the metal grains; and
forming oxide film on a surface of the metal grains, and forming first bonding parts where adjacent metal grains are directly
contacted and bonded together by metal bonding, and second bonding parts where adjacent metal grains are bonded together by
bonding of the oxide film formed around the entire surface of said adjacent metal grains other than the first bonding parts,
by applying heat treatment to the compacted metal grains, thereby obtaining a magnetic grain compact.

US Pat. No. 9,450,173

PIEZOELECTRIC CERAMIC AND PIEZOELECTRIC ELEMENT

TAIYO YUDEN CO., LTD., T...

1. A piezoelectric ceramic constituted by a polycrystal whose main phase is an alkali-containing niobate perovskite structure,
where both elemental nickel and elemental manganese are present as a sub phase at grain boundaries of the main phase,
wherein the main phase is expressed by a composition formula (LixNayK1-x-y)a(Nb1-zTaz)O3 (in the formula, 0.04
wherein 0.2 mol to 3.0 mol of elemental silicon is contained as a silicon-containing sub-phase, besides the main phase, relative
to 100 mol of the main phase

wherein 0.2 mol to 3.0 mol of elemental lithium is contained as a lithium-containing sub-phase, besides the main phase, relative
to 100 mol of the main phase, said silicon-containing and lithium-containing sub-phases being dispersed at grain boundaries
of the main phase.

US Pat. No. 9,369,110

FILTER, DUPLEXER AND COMMUNICATION MODULE

TAIYO YUDEN CO., LTD., T...

1. A filter comprising a plurality of series resonators connected to a signal line in series and a plurality of parallel resonators
connected to the signal line in parallel,
wherein two parallel resonators that are adjacent to each other are connected, in parallel, to a first portion of the signal
line that connects a pair of two adjacent series resonators among the plurality of series resonators, and at least one parallel
resonator is connected, in parallel, to a second portion of the signal line that connects a different pair of two adjacent
series resonators,

a first inductor is connected to one parallel resonator of said two parallel resonators in series,
a second inductor is connected to one parallel resonator of said at least one parallel resonator in series,
a third inductor is connected to said two parallel resonators and said at least one parallel resonator, and
an inductance of each of said first, second and third inductors is set such that a total inductance of said first and third
inductors and a total inductance of said second and third inductors are not equal to each other.

US Pat. No. 9,166,765

HIGH-FREQUENCY CIRCUIT MODULE

TAIYO YUDEN CO., LTD., T...

1. A high-frequency circuit module, comprising:
a circuit substrate having laminated insulating layers and conductive layers;
a high-frequency IC that performs a transmission process and a reception process for a high-frequency signal;
a power amplifier IC that amplifies a transmission signal from the high-frequency IC; and
a duplexer that separates a transmission signal and a reception signal, the transmission signal being outputted from the power
amplifier IC toward an antenna, the reception signal being inputted from the antenna toward the high-frequency IC,

wherein a wiring length of a signal line that is used for sending a transmission signal that has been amplified by the power
amplifier IC to the duplexer is shorter than a signal line that is used for sending to the power amplifier IC a transmission
signal that is outputted from the high-frequency IC and that has not been amplified,

wherein the power amplifier IC is mounted in a peripheral portion of the circuit substrate, and
wherein the circuit substrate comprises:
a core layer that is thicker than other conductive layers;
a terminal electrode formed in a peripheral portion on a bottom surface of the circuit substrate;
a ground electrode that is formed in a region inside of an area where the terminal electrode is formed on the bottom surface
of the circuit substrate; and

a via conductor for heat dissipation that connects the ground electrode to the core layer.

US Pat. No. 9,160,300

ACOUSTIC WAVE DEVICE

TAIYO YUDEN CO., LTD., T...

1. An acoustic wave device comprising:
an electrode that is located on a substrate and excites an acoustic wave; and
an oxide silicon film that is doped with an element and provided so as to cover the electrode, wherein
a normalized reflectance of the oxide silicon film doped with the element is equal to or larger than 0.96, the normalized
reflectance of the oxide silicon film doped with the element being obtained by normalizing a local maximum value of a reflectance
when a light is caused to enter an upper surface of the oxide silicon film doped with the element by a reflectance when the
light having a wavelength at the local maximum value is caused to enter an upper surface of the substrate directly.

US Pat. No. 9,654,881

ELECTROACOUSTIC TRANSDUCER

TAIYO YUDEN CO., LTD., T...

1. An electroacoustic transducer comprising:
a housing;
a piezoelectric speaker that includes a planar vibration plate with a first surface and a second surface on the opposite side
of the first surface, and a piezoelectric element joined to at least one of the first surface and second surface, and which
divides an interior of the housing into a first space facing the first surface and a second space facing the second surface;

a dynamic speaker placed in the first space; and
a support member which is constituted by a part of the housing or by a member different from the housing, and which has a
supporting part facing the first surface or second surface, and which elastically supports only a periphery of the first surface
or second surface with the supporting part, wherein the periphery of the first surface or second surface is fixed to the support
part via an elastically deformable first adhesive layer which is constituted by double-sided adhesive tape.

US Pat. No. 9,560,743

MULTILAYER CIRCUIT SUBSTRATE HAVING CORE LAYER WITH THROUGH-HOLE

TAIYO YUDEN CO., LTD., T...

1. A multilayer circuit substrate obtained by alternately stacking insulator layers and conductor layers,
wherein the conductor layers contain a core layer having a greater thickness than any of other conductor layers and located
in an inner layer of the multilayer circuit substrate,

wherein a first conductor layer facing the core layer through an insulator layer has a first signal wire that transmits high
frequency signals,

wherein a through-hole is formed in the core layer along the first signal wire in a location facing the first signal wire,
wherein the through-hole is formed in a long hole shape elongated along an extending direction of the first signal wire as
seen in a plan view, and an entirety of said through-hole is filled with an insulator.

US Pat. No. 9,484,883

ACOUSTIC WAVE DEVICE AND FABRICATION METHOD OF THE SAME

TAIYO YUDEN CO., LTD., T...

1. An acoustic wave device comprising:
a substrate;
an input pad that is located on a first surface of the substrate, and to which a high-frequency signal is input;
a resonator that is connected to the input pad, and to which the high-frequency signal input to the input pad is input, the
resonator including an electrode located in contact with the first surface of the substrate;

an input line pattern that is located on the first surface of the substrate and that connects the resonator to the input pad;
and

an insulating layer that is located in an entire area under the input pad on the first surface of the substrate and in an
entire area under the input line pattern on the first surface of the substrate, and that has a relative permittivity smaller
than that of the substrate, the insulating layer being absent under the electrode included in the resonator on the first surface
of the substrate and extending beyond edges of the input pad and the input line pattern.

US Pat. No. 9,478,213

ACOUSTIC WAVE DEVICE BUILT-IN MODULE AND COMMUNICATION DEVICE

TAIYO YUDEN CO., LTD., T...

1. An acoustic wave device built-in module comprising:
a multilayer wiring board formed by stacking an insulating layer and a wiring layer;
an acoustic wave device embedded in the multilayer wiring board; and
an electronic component located on the multilayer wiring board and electrically coupled to the acoustic wave device, wherein
the acoustic wave device includes:
an electrode that is located on a substrate and excites an acoustic wave; and
a sealing portion that includes a frame body located on the substrate so as to surround the electrode and a lid located on
the frame body so as to form an air space above the electrode, and

a center portion of the lid is recessed downwardly toward the substrate relative to a peripheral portion of the lid.

US Pat. No. 9,466,422

METHOD OF MANUFACTURING A LAMINATED ELECTRONIC COMPONENT

TAIYO YUDEN CO., LTD., T...

1. A manufacturing method for a laminated electronic component having a laminate constituted by multiple insulator layers
as well as internal electrodes formed between these layers, said manufacturing method comprising:
step (i) to form a resist film on a conductive base plate;
step (ii) to form an opening of specified pattern in the resist film by photolithography, wherein the opening of specified
pattern is formed such that a width of the opening increases continuously or in stages in a direction away from the base plate;

step (iii) to form a conductor pattern by filling a conductor in the opening, by plating, to a level lower than a height of
the resist film that defines the opening;

step (iv) to remove the resist film;
step (v) to press the conductor pattern together with an insulation sheet being a precursor to the insulator layer, in order
to transfer the conductor pattern from the conductive base plate onto the insulation sheet;

step (vi) to repeat steps (i) to (v) to produce multiple pattern-transferred insulation sheets; and
step (vii) to laminate the pattern-transferred insulation sheets.

US Pat. No. 9,385,686

ACOUSTIC WAVE DEVICE

TAIYO YUDEN CO., LTD., T...

1. An acoustic wave filter, comprising:
a piezoelectric substrate;
an insulating pattern directly formed on a top surface of said piezoelectric substrate, said insulating pattern having a higher
thermal conductivity than said piezoelectric substrate and being patterned to partially expose the top surface of the piezoelectric
substrate;

a first acoustic wave resonator including a first interdigital transducer, said first interdigital transducer being directly
formed on said insulating pattern; and

a second acoustic wave resonator including a second interdigital transducer, said second interdigital transducer being directly
formed on said partially exposed top surface of said piezoelectric substrate.

US Pat. No. 9,368,281

LAMINATED CERAMIC ELECTRONIC COMPONENT

TAIYO YUDEN CO., LTD., T...

1. A laminated ceramic electronic component having a sintered chip of roughly rectangular solid shape constituted by ceramics
and many layered conductors arranged therein in a manner facing each other, with the ceramics constituting the sintered chip
divided into many layered ceramic parts present between the layered conductors and a cylindrical ceramic part present in a
manner surrounding the entire layered conductors;
wherein the cylindrical ceramic part of the ceramics includes, in a manner not exposed to a surface of the cylindrical ceramic
part nor contacting the layered conductors, a high-void-ratio part which has a void ratio higher than a void ratio at any
part of the cylindrical ceramic part other than the high-void-ratio part and which also has at least two layer-parts facing
each other and extending in a direction parallel to a lamination direction of the layered conductors along sides of the layered
conductors, in which high-void-ratio part pores are randomly distributed.

US Pat. No. 9,344,059

PIEZOELECTRIC THIN FILM RESONATOR, FILTER, AND DUPLEXER INCLUDING A FILM INSERTED INTO THE PIEZOELECTRIC FILM

TAIYO YUDEN CO., LTD., T...

1. A piezoelectric thin film resonator comprising:
a substrate;
a piezoelectric film located on the substrate;
a lower electrode and an upper electrode facing each other across at least a part of the piezoelectric film; and
an insertion film that is inserted into the piezoelectric film, is located in at least a part of an outer periphery region
in a resonance region in which the lower electrode and the upper electrode face each other across the piezoelectric film,
and is not located in a center region of the resonance region,

wherein the insertion film is located from the at least a part of the outer periphery region to an outside of the resonance
region,

wherein the insertion film is exposed from a side surface of the piezoelectric film.

US Pat. No. 9,166,557

PIEZOELECTRIC THIN FILM RESONATOR AND FILTER

TAIYO YUDEN CO., LTD., T...

1. A piezoelectric thin film resonator comprising:
a substrate;
a piezoelectric film located on the substrate;
a lower electrode and an upper electrode located to sandwich the piezoelectric film;
a load film formed of a plurality of separate patterns in a resonance region in which the lower electrode and the upper electrode
face each other across the piezoelectric film, the resonance region being defined by a region in a plan view where all of
the lower electrode, the upper electrode, and the piezoelectric film overlap with each other,

wherein each of the plurality of separate patterns is formed so as to surround a center of the resonance region, and each
of the plurality of separate patterns is disposed to intersect with a same virtual straight line extending from the center
of the resonance region to an outside of the resonance region.

US Pat. No. 9,160,298

ACOUSTIC WAVE DEVICE

TAIYO YUDEN CO., LTD., T...

1. An acoustic wave device, comprising:
a substrate;
a lower electrode that is located on the substrate;
a piezoelectric film that is located on the lower electrode and made of aluminum nitride of which a ratio of a lattice constant
in a c-axis direction to a lattice constant in an a-axis direction is smaller than 1.6; and

an upper electrode that is located on the piezoelectric film and faces the lower electrode across the piezoelectric film,
wherein the piezoelectric film is made of aluminum nitride to which at least one of titanium, zirconium and hafnium is added.

US Pat. No. 9,148,107

METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE

TAIYO YUDEN CO., LTD., T...

1. A method for manufacturing an acoustic wave device comprising:
bonding a piezoelectric substrate to a first surface of a first support substrate;
thinning a whole of the piezoelectric substrate in a thickness direction of the piezoelectric substrate after the bonding
to thus form a piezoelectric layer;

forming a first electrode on a first surface of the piezoelectric layer after the thinning of the piezoelectric substrate,
the first surface of the piezoelectric layer being an opposite surface to a second surface of the piezoelectric layer located
at a side of the first support substrate;

forming holes in the first support substrate located below the first electrode; and
bonding a second support substrate to a second surface of the first support substrate opposite to the first surface of the
first support substrate after the forming of holes.

US Pat. No. 9,093,213

COMMON MODE CHOKE COIL

TAIYO YUDEN CO., LTD., T...

1. A common mode choke coil comprising:
a nonmagnetic layer made of glass,
magnetic layers placed in a manner sandwiching the nonmagnetic layer, and
two or more coil conductors embedded in a base material constituted by the nonmagnetic layer and the magnetic layers,
wherein Mg segregation is present in the nonmagnetic layer and the Mg segregation accounts for 0.5 to 16 percent of the total
area as observed on an electron micrograph of a section of the nonmagnetic layer, wherein Mg segregation is an aggregation
of Mg which is not introduced as part of the glass, but which exists independently of the glass, and a size of the Mg segregation
is 0.2 to 10 ?m.

US Pat. No. 9,455,209

CIRCUIT MODULE AND PRODUCTION METHOD THEREFOR

TAIYO YUDEN CO., LTD., T...

1. A circuit module, comprising:
a wiring substrate including a mounting surface having a first area and a second area and a terminal surface on the other
side of the mounting surface;

a plurality of electronic components mounted on the first area and the second area;
a sealing layer that covers the plurality of electronic components, is formed of an insulation material, and includes a groove
portion formed along a boundary between the first area and the second area;

a conductive shield including a first shield portion that covers an outer surface of the sealing layer and a second shield
portion provided in the groove portion; and

a conductive layer including a wiring portion that is provided on the mounting surface and electrically connects the terminal
surface and the second shield portion, and a thickening portion that is provided in the wiring portion and partially thickens
a connection area of the wiring portion with respect to the second shield portion.

US Pat. No. 9,406,448

ELECTRODE FOR ELECTROCHEMICAL DEVICE, ELECTROCHEMICAL DEVICE, AND METHOD FOR MANUFACTURING ELECTRODE FOR ELECTROCHEMICAL DEVICE

TAIYO YUDEN CO., LTD., T...

1. An electrode for an electrochemical device comprising:
a current collector having a main face and side face;
an electrode layer containing active material mixed with a binder, and formed on the main face of the current collector; and
an active material layer consisting essentially of the active material and formed on the side face of the current collector
where the electrode layer is not formed wherein a concentration of the active material is higher in the active material layer
than that in the electrode layer.

US Pat. No. 9,160,825

COMMUNICATION MODULE

TAIYO YUDEN CO., LTD., T...

1. A communication module, comprising:
a circuit substrate having (a) a first high-frequency processing section that processes high-frequency signals related to
mobile phone communication, (b) a system section having a baseband processing area that processes baseband signals related
to mobile phone communication and an application processing area that processes various types of mobile phone application
operations, and (c) a power circuit section that includes a first power circuit section that supplies power to the first high-frequency
processing section and a second power circuit section that supplies power to the system section;

a sealing member formed on an entire main surface of the circuit substrate, the sealing member covering electronic components
mounted on said main surface;

a shield layer that is conductive and formed on a surface of the sealing member;
a first shield wall that fills a groove formed from a main surface of the sealing member toward the main surface of the circuit
substrate, the groove demarcating a mounting area of either one or both of the system section and the power circuit section
and a mounting area of the first high-frequency processing section, the first shield wall being connected to the shield layer;
and

a second shield wall that fills a groove formed from the main surface of the sealing member toward the main surface of the
circuit substrate, the groove demarcating a mounting area of the first power circuit section and a mounting area of the second
power circuit section, the second shield wall being connected to the shield layer.

US Pat. No. 9,055,671

SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT

Taiyo Yuden Co., Ltd, To...

1. A substrate with built-in electronic component, comprising:
a core layer that includes a cavity containing an insulating material;
an insulating layer that includes a ground wiring and a signal wiring and is formed on the core layer; and
a plurality of electronic components that each include a first terminal and a second terminal and are stored in the cavity,
the plurality of electronic components each being formed thinner along the depth direction of the cavity than the core layer,
the plurality of electronic components each having one end portion and the other end portion, the first terminal being formed
at the one end portion and connected to the ground wiring and including a first connecting surface connected to the ground
wiring, the second terminal being formed at the other end portion and connected to the signal wiring and including a second
connecting surface connected to the signal wiring, the plurality of electronic components having at least one of arrangements
in which the first terminals are opposed to each other and in which the second terminals are opposed to each other, wherein

the core layer includes a flat surface formed to be flush with the first connecting surface and second connecting surface.

US Pat. No. 9,571,062

MODULE

TAIYO YUDEN CO., LTD., T...

1. A module comprising:
a duplexer including an antenna terminal;
a first wiring connecting the antenna terminal to an antenna;
a second wiring coupled to the antenna terminal without the first wiring; and
an inductor coupled to the second wiring,
wherein
the duplexer is mounted on a substrate,
the first wiring and the second wiring are located in the substrate, and
the inductor is included in a chip component mounted on the substrate.
US Pat. No. 9,536,667

CERAMIC POWDER AND MULTI-LAYER CERAMIC CAPACITOR

TAIYO YUDEN CO., LTD., T...

1. A multi-layer ceramic capacitor made by alternately layering a dielectric layer constituted by a sintered body of a ceramic
powder, and an internal electrode layer, said ceramic powder containing sintered barium titanate powder having a perovskite
structure with a median size of 200 nm or smaller as measured by SEM observation, wherein the barium titanate powder is such
that the percentage of barium titanate particles having twin defects in the barium titanate powder is less than 10% as measured
by TEM observation and that its crystal lattice c/a is 1.0075 or more.

US Pat. No. 9,425,798

RECONFIGURABLE SEMICONDUCTOR DEVICE

TAIYO YUDEN CO., LTD., T...

1. A semiconductor device capable of reconfiguration, comprising:
a plurality of logic units which configure an array and are connected to each other,
wherein each logic unit includes a pair of a first and a second memory cell units,
each of the first and the second memory cell units operates as a logic element when truth value table data is written in,
which is configured so that a logic calculation of an input value specified by a plurality of addresses is output to a data
line, and/or operates as a connection element when truth value table data is written in, which is configured so that an input
value specified by a certain address is output to a data line to be connected to an address of another memory cell unit,

a latter stage of the first memory cell unit includes a sequential circuit which synchronizes with a clock, and
the logic units include, for each pair of the first and the second memory cell units, a selection unit which selectively outputs
an address to the first or the second memory cell unit in accordance with an operation switch signal.

US Pat. No. 9,425,800

RECONFIGURABLE LOGIC DEVICE

TAIYO YUDEN CO., LTD., T...

1. A reconfigurable logic device for forming a plurality of logic circuits in accordance with configuration data, comprising:
a plurality of multi-lookup table units,
wherein each of the multi-lookup table units includes:
a rewritable configuration memory that stores configuration data for the multi-lookup table unit; and
data input lines;
data output lines; and
a reconfigurable logic multiplexer connected to the rewritable configuration memory, the reconfigurable logic multiplexer
performing one of or both of:

in accordance with the configuration data, selectively linking at least some of the data input lines to at least some of the
data output lines so that data inputted to said at least some of the data input lines are transmitted to said at least some
of the data output lines, and

in accordance with the configuration data, outputting, to at least some of the data output lines, data obtained by performing
a logical operation on data received from at least some of the data input lines, and

wherein the multi-lookup table units that are adjacent to one another are connected through the data input lines and the data
output lines of the respective multi-lookup table units.

US Pat. No. 9,406,866

PIEZOELECTRIC DEVICE WITH PIEZOELECTRIC CERAMIC LAYER HAVING AG SEGREGATED IN VOIDS IN SINTERED BODY OF PEROVSKITE COMPOSITION

TAIYO YUDEN CO., LTD., T...

1. A piezoelectric device having a piezoelectric ceramic layer obtained by sintering a piezoelectric ceramic composition that
contains a perovskite composition and Ag component, as well as a conductor layer sandwiching the piezoelectric ceramic layer,
wherein the piezoelectric ceramic layer has Ag segregated in voids present in a sintered compact of the perovskite composition,
wherein the perovskite composition contains a zirconate-titanate type perovskite composition expressed by Formula (1) below,
as well as an Ag component, and the Ag component is contained by 0.05 to 0.3 parts by mass per 100 parts by mass of the zirconate-titanate
type perovskite composition in terms of oxides:
(Pba.Rex){Zrb.Tic.(Ni1/3Nb2/3)d.(Zn1/3Nb2/3)e}O3  (1)

wherein Re represents at least one of La and Nd, and a to e and x meet the respective requirements below:
0.95?a?1.05

0?x?0.05

0.35?b?0.45

0.35?c?0.45

0
0.07?e?0.20

b+c+d+e=1.

US Pat. No. 9,318,275

ELECTROCHEMICAL DEVICE

TAIYO YUDEN CO., LTD., T...

1. An electrochemical device comprising:
a case with a concaved section constituting an opening;
a lid coupled to an opening side of the case to form a closed section between itself and the concaved section; and
an electric storage element that includes
a first electrode sheet having a first principal surface and a first rim surface formed around the first principal surface,
said first rim surface being constituted by a planar or curved tapered surface formed by removing a periphery edge of the
first principal surface,

a second electrode sheet having a second principal surface facing the first principal surface and a second rim surface formed
around the second principal surface, said second rim surface being constituted by a planar or curved tapered surface formed
by removing a periphery edge of the second principal surface, and

a porous separator sheet installed between the first principal surface and second principal surface and capable of retaining
an electrolyte,

said electric storage element being sealed inside the closed section and constituted in a chargeable/dischargeable manner;
wherein the separator sheet has:
a first part placed between the first electrode sheet and second electrode sheet and crushed by the first principal surface
and second principal surface;

a second part extending outward from the first electrode sheet and second electrode sheet; and
a third part provided at least in one part of the second part and placed in contact entirely with at least one of the first
rim surface and second rim surface by being pressed against at least one of the first rim surface and second rim surface,
said third part being capable of supplementing the electrolyte;

wherein at least one of the first rim surface and second rim surface is provided between an outer side surface of the first
electrode sheet and the first principal surface or between an outer side surface of the second electrode sheet and the second
principal surface.

US Pat. No. 9,147,828

PIEZOELECTRIC DRIVE ELEMENT AND PIEZOELECTRIC DRIVE UNIT

TAIYO YUDEN CO., LTD., T...

1. A piezoelectric drive element, comprising:
a composite ceramic that combines a first piezoelectric ceramic having spring characteristics such that its elastic constant
decreases as a vibration speed increases, with a second piezoelectric ceramic having spring characteristics such that its
elastic constant increases as a vibration speed increases; and

external electrodes provided on side faces of the complex ceramics in a manner facing each other across the complex ceramics;
wherein an AC electric field at and near a resonance frequency is applied to the external electrodes to drive the piezoelectric
drive element,

wherein the first piezoelectric ceramic is a PZT-based lead piezoelectric ceramic, BaTiO3, (Ba1/2Na1/2)TiO3, (Ba1/2K1/2)TiO3, {(K1-xNax)1-yLiy}(Nb1-z-wTazSbw)O3 (0?x?1, 0?y?0.2, 0?z?0.4, 0?w?0.2), or a solid solution ceramic containing at least two of the foregoing, while the second
piezoelectric ceramic is Sr2-xCaxNaNb5O15 (0?x?2), Sr2NaNb5O15, Ca2NaNb5O15, Sr2KNb5O15, Ba2LiNb5O15, Ba2NaNb5O15, Ba2KNb5O15, K3Li2Nb5O15, Ba2Bi1/3Nb5O15, Pb2NaNb5O15, Pb2KNb5O15, or a solid solution ceramic of tungsten bronze type containing at least two of the foregoing,

wherein a volume fraction of the first piezoelectric ceramic and second piezoelectric ceramic is adjusted to suppress resonance
frequency fluctuation relative to change in vibration speed.

US Pat. No. 9,071,225

ELECTRONIC CIRCUIT AND ELECTRONIC MODULE

TAIYO YUDEN CO., LTD., T...

1. An electronic circuit comprising:
a plurality of duplexers that are coupled to an antenna terminal and have a pass band different from each other; and
a plurality of acoustic wave filters that are respectively coupled between the antenna terminal and the plurality of the duplexers,
the plurality of acoustic wave filters including a first acoustic wave filter and a second acoustic wave filter,

wherein filter characteristics of the first acoustic wave filter of the plurality of the acoustic wave filters are set so
as to allow passage of a signal in both a pass band for transmitting and a pass band for receiving of a first duplexer of
the plurality of the duplexers that is coupled to the first acoustic wave filter and suppress passage of a signal in both
a pass band for transmitting and a pass band for receiving of a second duplexer of the plurality of the duplexers that is
different from the first duplexer and that is coupled to the second acoustic wave filter;

each of the first acoustic wave filter and the second acoustic wave filter is a band pass filter; and
a frequency band included in a pass band of the first acoustic wave filter and a frequency band included in a pass band of
the second acoustic wave filter are used for Carrier Aggregation.

US Pat. No. 9,787,282

PIEZOELECTRIC THIN FILM RESONATOR, FILTER AND DUPLEXER

TAIYO YUDEN CO., LTD., T...

1. A piezoelectric thin film resonator comprising:
a substrate;
a piezoelectric film provided on the substrate;
a lower electrode and an upper electrode that sandwich at least a part of the piezoelectric film and face with each other;
and

an inserted film that is inserted in the piezoelectric film, the inserted film being provided on an outer circumference region
in a resonance region in which the lower electrode and the upper electrode sandwich the piezoelectric film and face with each
other, and being not provided in a center region of the resonance region, the inserted film having a cutout in the resonance
region at a side to which the lower electrode extends from the resonance region in a plan view.

US Pat. No. 9,374,060

PIEZOELECTRIC THIN FILM RESONATOR

TAIYO YUDEN CO., LTD., T...

1. A piezoelectric thin film resonator comprising:
a substrate;
a piezoelectric film that is located on the substrate and includes a first film made of an aluminum nitride film containing
an additive element and second films located on an upper surface and a lower surface of the first film and made of an aluminum
nitride film containing the additive element at a concentration lower than that of the first film; and

a lower electrode and an upper electrode that are located to sandwich the piezoelectric film.

US Pat. No. 9,601,682

ELECTROACOUSTIC TRANSDUCER

TAIYO YUDEN CO., LTD., T...

1. An electroacoustic transducer comprising:
a piezoelectric speaker having a vibration plate with a periphery, and a piezoelectric element joined to the vibration plate;
a housing for housing the piezoelectric speaker;
a support member constituted by a part of the housing or by a separate member, to support the vibration plate in multiple
areas along the periphery, wherein the support member has multiple projections to support the periphery of the vibration plate;
and

an dynamic speaker housed inside the housing, wherein a void between the multiple projections is constituted as a passage
to let sound generated by the dynamic speaker pass through.

US Pat. No. 9,590,677

VARIABLE CAPACITANCE DEVICE AND ANTENNA APPARATUS

TAIYO YUDEN CO., LTD., T...

1. A variable capacitance device, comprising:
a first pad and a second pad for receiving signals to be processed;
a plural, even number of variable capacitance elements connected in series and disposed along a straight line formed between
the first pad and the second pad, each of the variable capacitance elements being configured to change a capacitance thereof
in accordance with a voltage across the variable capacitance element;

a third pad and a fourth pad for receiving a same voltage, the third pad being disposed on a left-hand side of said straight
line and the fourth pad being on a right-hand side of said straight line;

a fifth pad and a sixth pad for grounding, the fifth pad being disposed on the left-hand side of said straight line and the
sixth pad being on the right-hand side of said straight line, a voltage differential between the third and fourth pads and
the fifth and sixth pads being a bias voltage for adjusting a total capacitance between said first pad and said second pad,

wherein for each of said plural, even number of variable capacitance elements, one end of the variable capacitance element
is connected to the third and fourth pads through two separate paths, respectively, with a first resistor interposed in series
on each path, and another end of the variable capacitance element is connected to the fifth and sixth pads through two separate
paths, respectively, with a second resistor interposed in series on each path so that in said straight line between the first
pad and the second pad, nodes connected to the third and fourth pads through the respective first resistors and nodes connected
to the fifth and sixth pads through the respective second resistors alternate.

US Pat. No. 9,531,342

PIEZOELECTRIC THIN FILM RESONATOR, FILTER AND DUPLEXER

TAIYO YUDEN CO., LTD., T...

1. A piezoelectric thin film resonator comprising:
a substrate;
a piezoelectric film provided on the substrate;
a lower electrode and an upper electrode that are opposed to each other to put at least a part of the piezoelectric film therebetween;
and

an insertion film that is inserted into the piezoelectric film in a resonance region that is defined by said at least part
of the piezoelectric film put between the lower electrode and the upper electrode, said insertion film having a thin film
part and a thick film part that is relatively thicker than the thin film part, a planar shape of the thick film part in the
resonance region being a ring shape along an outer circumference of the resonance region, or a shape in which a part of such
a ring shape is cut.

US Pat. No. 9,473,108

SURFACE ACOUSTIC WAVE DEVICE AND FILTER

TAIYO YUDEN CO., LTD., T...

12. A filter comprising resonators connected between an input terminal and an output terminal,
the resonators including a surface acoustic wave device including:
a pair of comb-like electrodes formed on a piezoelectric substrate, each of the pair of comb-like electrodes includes electrode
fingers, dummy electrode fingers and a bus bar to which the electrode fingers and the dummy electrode fingers are connected,
the electrode fingers and the dummy electrode fingers of one of the pair of comb-like electrodes facing the dummy electrode
fingers and the electrode fingers of the other of the pair of comb-like electrodes, respectively; and

additional films extending in the form of a strip in a first direction in which the electrode fingers of the pair of comb-like
electrodes are arranged side by side, each of the additional films covering at least parts of gaps defined by ends of the
electrode fingers of one of the pair of comb-like electrodes and ends of the dummy electrode fingers of the other of the pair
of comb-like electrodes.

US Pat. No. 9,406,441

MULTI-LAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

TAIYO YUDEN CO., LTD., T...

1. A multi-layer ceramic capacitor constituted by ceramic dielectric layers alternately laminated with conductive layers,
wherein:
each of the ceramic dielectric layers is constituted by sintered grains comprised of core-shell grains each having a core-shell
structure wherein a core of primary component is enclosed by a shell of auxiliary solid-solution component, and uniform solid-solution
grains each constituted by solid solution without a core;

an area ratio of the core-shell grains to all the sintered grains constituting each ceramic dielectric layer is 5 to 15% as
measured in an observed area of cross section by a transmission electron microscope (TEM) of a randomly selected portion of
the ceramic dielectric layer with interposing conductive layers; and

a grain size representing an average grain size of all the sintered grains including the core-shell grains and uniform solid-solution
grains is 0.3 to 0.5 ?m.

US Pat. No. 9,349,539

CERAMIC ELECTRONIC COMPONENT

TAIYO YUDEN CO., LTD., T...

1. A ceramic electronic component having external electrodes of multi-layer structure including an intermediate conductive
resin layer made of synthetic resin containing conductive filler, wherein:
the intermediate conductive resin layer is made of epoxy resin containing conductive filler; and
the intermediate conductive resin layer meets both a condition B/A?0.47 and a condition C/A?0.39 in a two-axis graph representing
a relationship line of a wave number and spectral intensity of the intermediate conductive resin layer as measured by attenuated
total reflectance (ATR) where:

A represents a maximum spectral intensity when, given a reference line BLa set by connecting a spectral intensity at wave
number 1400 cm?1 and spectral intensity at wave number 1560 cm?1 along the relationship line, a distance between an intersection point A1 of a detection line DLa drawn in parallel with a spectral intensity axis in a wave number range of 1500±25 cm?1 and the relationship line on one hand and an intersection point A2 of the detection line DLa and reference line BLa on the other, as calculated by (Spectral intensity at intersection point
A1)?(Spectral intensity at intersection point A2), becomes a maximum;

B represents a maximum spectral intensity when, given a reference line BLb set by connecting a spectral intensity at wave
number 1560 cm?1 and spectral intensity at wave number 1800 cm?1 along the relationship line, a distance between an intersection point B1 of a detection line DLb drawn in parallel with a spectral intensity axis in a wave number range of 1730±25 cm31 1 and the relationship line on one hand and an intersection point B2 of the detection line DLb and reference line BLb on the other, as calculated by (Spectral intensity at intersection point
B1)?(Spectral intensity at intersection point B2), becomes a maximum; and

C represents a maximum spectral intensity when, given a reference line BLc set by connecting a spectral intensity at wave
number 3075 cm31 1 and spectral intensity at wave number 3675 cm31 1 along the relationship line, a distance between an intersection point C1 of a detection line DLc drawn in parallel with a spectral intensity axis in a wave number range of 3300±300 cm31 1 and the relationship line on one hand and an intersection point C2 of the detection line DLc and reference line BLc on the other, as calculated by (Spectral intensity at intersection point
C1)?(Spectral intensity at intersection point C2), becomes a maximum.

US Pat. No. 9,147,514

WIRE-WOUND INDUCTOR

TAIYO YUDEN CO., LTD., T...

1. A wire-wound inductor comprising:
a core member having a pillar-shaped core and a pair of flange parts provided on both sides of the core;
a coil conductive wire wound around the core of the core member;
a pair of terminal electrodes provided on an outer surface of the flange parts and connected to both ends of the coil conductive
wire; and

an insulation member covering an outer periphery of the coil conductive wire;
wherein the core member is constituted by soft magnetic alloy grains, where each soft magnetic alloy grain has an oxidized
layer on its surface, and the grains are bonded together by the oxidized layers so as to structure the core member;

wherein the core member contains chromium by 2 to 15 percent by weight;
wherein the core member has a saturated magnetic flux density of 1.2 T or more, magnetic permeation ratio of 10 or more, and
height dimension of 1.5 mm or less; and

wherein the insulation member is constituted by a resin material containing soft magnetic alloy grains as magnetic powder
and has a magnetic permeation ratio of 1 to 25,

wherein the wire-wound inductor has a direct current superimposition value (Idc) which is between 2 A and 4 A as measured
when an inductance value (L value) is between 2 ?H and 5 ?H.

US Pat. No. 9,654,150

MODULE WITH DUPLEXERS COUPLED TO DIPLEXER

TAIYO YUDEN CO., LTD., T...

1. A module comprising:
a first duplexer including a common terminal coupled to a first terminal of a diplexer, the diplexer including an antenna
terminal coupled to an antenna, the first terminal, and a second terminal; and

a second duplexer including a common terminal coupled to the second terminal of the diplexer and having a passband different
from a passband of the first duplexer,

wherein a frequency at which a reactance component of an impedance is approximately zero and the impedance is less than a
reference impedance is not located in the passband of the first duplexer, the impedance being an impedance when the second
duplexer is viewed from a node at which the antenna terminal is divided into the first terminal and the second terminal in
the diplexer.

US Pat. No. 9,607,766

LAMINATED CERAMIC CAPACITOR

TAIYO YUDEN CO., LTD., T...

1. A laminated ceramic capacitor with a capacitor body having a structure in which multiple internal electrode layers are
laminated with dielectric layers placed in between, wherein when a section constituted by two internal electrode layers positioned
adjacent to each other in a laminating direction and one dielectric layer present between the two internal electrode layers
is considered a unit capacitor, then respective capacitances of multiple unit capacitors arranged in the laminating direction
are distributed in such a way that the capacitance at a center in the laminating direction is lower than the capacitances
at both ends in the laminating direction,
wherein the respective capacitances of multiple unit capacitors arranged in the laminating direction are distributed in such
a way that they gradually decrease from the unit capacitors at both ends in the laminating direction toward the unit capacitor
at the center in the laminating direction.

US Pat. No. 9,573,569

REGENERATIVE BRAKE DEVICE AND MOTOR-ASSISTED VEHICLE PROVIDED WITH THE SAME

TAIYO YUDEN CO., LTD., T...

1. A regenerative brake device for a vehicle, comprising:
a manual brake that applies a brake to a wheel of the vehicle by a manual operation of a brake lever;
a motor configured to be coupled to a wheel of the vehicle, the motor being driven by a power from a battery, and also alternatively
acting as a regenerative brake that charges the battery with an electromotive force of the motor;

a brake sensor that senses an operation amount of the brake lever inclusive of a play of the brake lever in which the manual
brake is not yet engaged; and

a power control unit that performs regenerative power control for charging the battery with the electromotive force of the
motor based on an output signal from the brake sensor so that the regenerative brake is generated in accordance with the operation
amount of the brake lever,

wherein the power control unit conducts a power control by pulse width modulation, and controls a duty ratio D in a regenerative
mode so as to satisfy (Vbatt×D) the battery, and D is the duty ratio of the pulse width modulation,

wherein the power control unit performs the regenerative power control such that a regenerative braking force is gradually
increased towards a maximum regenerative braking force as the operation amount of the brake lever increases across a manual
brake application point at and beyond which the manual brake is engaged, and

wherein the regenerative braking force continues to increase beyond the manual brake application point towards the maximum
regenerative braking force, and a rate of the increase of the regenerative braking force before the manual brake application
point is reached is larger than a rate of the increase of the regenerative braking force after the brake application point
is reached.

US Pat. No. 9,514,883

CERAMIC POWDER AND MULTI-LAYER CERAMIC CAPACITOR

TAIYO YUDEN CO., LTD., T...

1. A multi-layer ceramic capacitor made by alternately layering a dielectric layer constituted by a sintered body of a ceramic
powder, and an internal electrode layer, said ceramic powder containing barium titanate powder having a perovskite structure
with a median size of 200 nm or smaller as measured by SEM observation, wherein the barium titanate powder is such that the
percentage of barium titanate particles having twin defects in the barium titanate powder is 13% or more as measured by TEM
observation and that its crystal lattice c/a is 1.0080 or more.

US Pat. No. 9,514,259

LOGIC CONFIGURATION METHOD FOR RECONFIGURABLE SEMICONDUCTOR DEVICE

TAIYO YUDEN CO., LTD., T...

1. A logic configuration method for a reconfigurable semiconductor device having a plurality of memory units each including
a plurality of memory cells that store data,
wherein the memory units are configured to operate as logic circuits by storing, in the memory cells therein, truth table
data that outputs logic values in response to address input,

wherein the memory units each have at least 2×n input lines and output lines forming pairs, n being an integer of greater
than or equal to 2,

wherein the memory units are connected to each other by 2×n output lines from one memory unit being connected to an n number
of input lines of two other memory units, and

wherein the logic configuration method comprises:
generating a netlist having circuit connective information on the basis of a circuit description that describes a circuit
configuration to be implemented in the reconfigurable semiconductor device;

extracting a logic cone that includes sequential logics from the netlist;
determining the number of stages of memory units that are to be used to constitute the extracted logic cone on a basis of
a quotient obtained by dividing a number of input lines to the extracted logic cone by n/2; and

generating the truth table data for the memory units that constitute the extracted logic cone.

US Pat. No. 9,456,488

CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE

TAIYO YUDEN CO., LTD., (...

1. A circuit module, comprising:
a circuit substrate having a mount surface and a superficial conductor being formed on the mount surface;
a mount component mounted on the mount surface;
a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from
a main surface of the sealing body to the mount surface, the trench having two end portions being formed at two ends of the
trench in a plane parallel with the mount surface; and

a shield having an inner shield section formed within the trench and an outer shield section that covers the sealing body
and the inner shield section, the outer shield section including a first section having a flat surface as an external surface,
the first section formed on the main surface of the sealing body and a second section formed on the inner shield section and
protruded outwardly away from the mount surface and from the flat surface of the first section, wherein

the inner shield section and the outer shield section are formed integrally,
a bottom of the trench is configured of a surface of the superficial conductor, and
the two end portions of the trench reach an outer peripheral surface of the sealing body in the plane in parallel with the
mount surface.

US Pat. No. 9,688,350

MOTOR DRIVING CONTROL APPARATUS

MICROSPACE CORPORATION, ...

1. A motor driving control apparatus, comprising:
an inverter configured to drive a motor; and
a regeneration controller configured to control the inverter to generate a regenerative braking force in accordance with a
vehicle acceleration, a vehicle speed and a converted vehicle speed that is obtained by converting a pedal rotation speed
which is based on a measurement of a pedal rotation sensor.

US Pat. No. 9,590,170

METHOD OF FABRICATING ACOUSTIC WAVE DEVICE

TAIYO YUDEN CO., LTD., T...

1. A method of fabricating an acoustic wave device, the method comprising:
bonding an upper surface of a support substrate formed of sapphire to a lower surface of a piezoelectric substrate formed
of lithium tantalate, said piezoelectric substrate having an upper surface on which an IDT is to be formed;

forming a plurality of modified regions in the support substrate that are aligned along a thickness direction of the support
substrate by irradiation of a laser beam, the plurality of modified regions not being formed in the piezoelectric substrate;
and

cutting the support substrate and the piezoelectric substrate vertically at a location of the plurality of modified regions,
wherein

a shortest distance from a boundary plane between the upper surface of the support substrate and the lower surface of the
piezoelectric substrate to an edge of a closest one of the plurality of modified regions to said boundary plane is greater
than or equal to 20 ?m and less than 69 ?m.

US Pat. No. 9,496,848

PIEZOELECTRIC THIN-FILM RESONATOR, FILTER AND DUPLEXER UTILIZING A PIEZOELECTRIC FILM HAVING AN AIR SPACE

TAIYO YUDEN CO., LTD., T...

1. A piezoelectric thin-film resonator comprising:
a substrate;
a piezoelectric film provided on the substrate; and
a lower electrode and an upper electrode that face each other through the piezoelectric film,
the piezoelectric film having an air space that is provided in at least part of an outer circumferential part of a resonance
region in which the upper and lower electrodes face each other through the piezoelectric film and is not provided in a central
part of the resonance region,

wherein the air space is exposed to neither an upper surface nor a lower surface of the piezoelectric film and is not located
in a region other than the resonance region.

US Pat. No. 9,407,235

ACOUSTIC WAVE DEVICE

TAIYO YUDEN CO., LTD., T...

1. An acoustic wave device comprising:
a chip;
an acoustic wave element formed on a principal surface of the chip;
a first pad formed on the principal surface of the chip and electrically connected to the acoustic wave element;
a substrate having a principal surface facing the principal surface of the chip;
a second pad formed on the principal surface of the substrate;
a first bump formed between the first pad and the second pad and electrically connecting the first pad and the second pad;
and

a second bump formed between the chip and the substrate and making direct contact with the substrate,
wherein a width of the second bump is less than a width of the first bump.

US Pat. No. 9,055,682

CIRCUIT MODULE

Taiyo Yuden Co., Ltd, To...

1. A circuit module, comprising:
a circuit substrate being a wiring substrate having a mount surface, a surface wiring layer disposed on the mount surface,
and an inner wiring layer formed within the substrate, the surface wiring layer including a ground conductor disposed on the
mount surface and connected to a ground potential, and lands;

a first mount component mounted on the mount surface via the lands;
a second mount component mounted on the mount surface via the lands, and electrically connected to the first mount component
via the inner wiring layer;

a sealing body formed on the mount surface, covering the first mount component and the second mount component and having a
trench formed to extend downward in a depth direction from an upper end thereof at a main surface of the sealing body to a
bottom end thereof at a surface of the ground conductor and being disposed between the first mount component and the second
mount component, the trench being in contact with the ground conductor at the bottom end of the trench; and

a shield having an inner shield section formed within the trench that abuts on the surface wiring layer and an outer shield
section covering the sealing body and the inner shield section,

wherein the inner wiring layer includes a plurality of inner wiring layers, and
the first mount component and the second mount component are mutually electrically connected by an upper one of the inner
wiring layers adjacent to the surface wiring layer and crossing beneath the bottom end of the trench and the ground conductor
facing the bottom end of the trench when viewed in the depth direction of the trench.

US Pat. No. 9,713,259

COMMUNICATION MODULE

TAIYO YUDEN CO., LTD., T...

1. A circuit substrate having a built-in component, comprising:
conductive layers and insulating layers stacked together, one of the conductive layers being a core layer that is thickest
among the conductive layers and that has a penetrating hole formed therein, said core layer being configured to be grounded;
and

a component embedded in said penetrating hole,
wherein a signal wiring line that is configured to transmit high frequency signals is formed in one of the conductive layers
facing the core layer, said signal wiring line overlapping an entire length or width of the penetrating hole and thereby passing
across the penetrating hole in a plan view, and

wherein the component includes a ground conductor configured to be grounded, the ground conductor having a planar shape extending
towards peripheral edges of the component and overlapping a portion of the signal wiring line that passes across the penetrating
hole in the plan view.

US Pat. No. 9,078,370

SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT

TAIYO YUDEN CO., LTD., T...

1. A substrate with a built-in electronic component, comprising:
a core layer that has a housing portion formed therein to house an electronic component,
wherein the core layer has an opening formed therein, an entirety of the opening being filled with an insulator without having
an electronic component inserted therein during any usage of the substrate so that the opening acts as a measure to reduce
differences in rigidity among plural regions of the core layer during an entire course of usage of the substrate with the
built-in electronic component.