US Pat. No. 10,064,282

THERMOFORMED PLASTIC COVER FOR ELECTRONICS AND RELATED METHOD OF MANUFACTURE

TACTOTEK OY, Oulunsalo (...

1. A multilayer structure for an electronic device, comprising:a flexible substrate film for accommodating electronics,
at least one electronic component directly contacting said flexible substrate film,
a number of conductive traces provided on said flexible substrate film for electrically powering and/or connecting electronics including said at least one electronic component, and
at least one cover attached to said flexible substrate film on top of said at least one electronic component by at least one of adhesive, solder, or mechanical fixing with a fastener, said at least one cover being overmolded with thermoplastic material.

US Pat. No. 9,945,700

ILLUMINATED INDICATOR STRUCTURES FOR ELECTRONIC DEVICES

TactoTek Oy, Oulunsalo (...

1. A cover assembly for an electronic device, the cover assembly comprising:a substantially opaque cover having a pair of oppositely directed major faces respectively defining an outer face and an inner face, the cover defining an optical indicator opening via which backlighting illumination is passable through the cover;
a matrix layer on the inner face of the cover, the matrix layer overlapping the optical indicator opening and being of an optically conductive material; and
a backlighting arrangement comprising one or more lighting devices embedded in the matrix layer to provide backlighting illumination to the optical indicator opening via the matrix layer, the one or more lighting devices being offset from the optical indicator opening such that none of the one or more lighting devices is located in a line of sight through the optical indicator opening, when viewed in a direction transverse to the outer face of the cover member at the optical indicator opening.

US Pat. No. 10,257,925

METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY

TACTOTEK OY, Oulunsalo (...

1. A method for manufacturing an electronic assembly, the method comprising:obtaining a first substrate film for accommodating electronics;
printing a first electrical contact pad on the first substrate film;
coupling an electrically conductive member to the first electrical contact pad; and
molding, in a cavity defined by a mold structure, a second material layer onto the first substrate film to embed the electrically conductive member in the second material layer, wherein the electrically conductive member extends through the cavity during molding to be in contact with an element on an opposite side of the cavity with respect to the first electrical contact pad such that at least a part of the electrically conductive member is accessible after molding to provide an electrical connection to the first electrical contact pad through the second material layer.

US Pat. No. 9,297,675

ILLUMINATED INDICATOR STRUCTURES FOR ELECTRONIC DEVICES

Tactotek Oy, Kempele (FI...

1. An assembly for forming part of an electronic device, the assembly comprising:
a substantially opaque cover member configured for incorporation in the electronic device to obscure one or more other components
of the electronic device from view, the cover member having an outer face and an opposite, inner face, with a thickness dimension
of the cover member extending transversely between the outer face and the inner face;

one or more indicator structures in the cover member, each indicator structure having a periphery that defines a corresponding
indicator shape in the cover member, each indicator structure being substantially translucent to allow passage of backlighting
illumination across the thickness dimension of the cover member via the indicator structure;

an optical matrix layer attached to the inner face of the cover member and being coextensive with at least a part of the cover
member that includes the one or more indicator structures, the optical matrix layer being of an optically conductive material;
and

a plurality of lighting devices embedded in the optical matrix layer and positioned such that two or more peripheral lighting
devices are provided for each indicator structure, each peripheral lighting device being located at or adjacent the periphery
of an associated indicator structure and being configured to provide backlighting illumination for the associated indicator
structure, each peripheral lighting device being laterally offset from the periphery of the associated indicator structure,
to be obscured by the cover member when the outer face of the cover member is viewed in a direction substantially parallel
to the thickness dimension of the cover member at the respective indicator structure.

US Pat. No. 10,091,887

MULTI-MATERIAL STRUCTURE WITH EMBEDDED ELECTRONICS

TACTOTEK OY, Oulunsalo (...

1. A multilayer structure for an electronic device, comprising:a flexible substrate film for accommodating electronics, the flexible substrate film having a first surface area and an adjacent second surface area;
a number of electronic components provided on the first surface area of the flexible substrate film;
a number of conductive traces printed on the flexible substrate film for electrically connecting the electronic components together;
a first thermoplastic material overmolded to the number of electronic components and the related first surface area of the flexible substrate film accommodating the electronic components; and
a second thermoplastic material overmolding the adjacent second surface area and at least part of the first surface area so that at least part of the electronic components and the first thermoplastic material thereon are substantially embedded between the flexible substrate film and the second thermoplastic material,
wherein the first thermoplastic material exhibits a first elasticity and the second thermoplastic material exhibits a second, different elasticity, and
wherein the first thermoplastic material is configured to prevent the first surface area of the flexible substrate from deformation and the second thermoplastic material is configured to allow the flexible substrate to be bendable.

US Pat. No. 9,869,810

METHOD FOR MANUFACTURING ELECTRONIC PRODUCTS, RELATED ARRANGEMENT AND PRODUCT

TACTOTEK OY, Oulunsalo (...

1. A method for manufacturing an electronic product, comprising:
obtaining a flexible, optically substantially transparent or translucent, substrate sheet;
printing, by an additive printed electronics process, a plurality of electrical conductors on the substrate sheet;
printing or disposing a plurality of electronic components including optoelectronic light emissive components on the substrate
sheet, at least some of the printed conductors being configured to provide electrical current thereto; and

attaching a flexible, optically substantially transparent, lightguide sheet to the substrate sheet to establish a multi-layer
structure, the light emitted by the light emissive components being received by the lightguide sheet, propagating therewithin,
and then being at least partly emitted to the environment through the substrate sheet,

wherein the light emitted by the light emissive components is contained entirely within the lightguide sheet by total internal
reflection until being at least partly emitted to the environment by outcoupling via the outcoupling-affecting element, and

wherein the outcoupling-affecting element comprises an adhesive.

US Pat. No. 9,801,273

MULTILAYER STRUCTURE AND RELATED METHOD OF MANUFACTURE FOR ELECTRONICS

TactoTek Oy, Kempele (FI...

1. A multilayer structure comprising:
a flexible substrate film having a first side and a second side, the flexible substrate film being capable of accommodating
electronics, conductive traces, and electronic components such as SMDs (surface-mount device), on the first side thereof,
and

a plastic layer molded onto the first side of the flxible subtrate film and protruding at one or more locations through the
flexible substrate film onto the second side, forming one or more protrusions on the second side having a predetermined function.

US Pat. No. 10,485,094

MULTILAYER STRUCTURE WITH EMBEDDED SENSING FUNCTIONALITIES AND RELATED METHOD OF MANUFACTURE

TACTOTEK OY, Oulunsalo (...

1. An integrated multilayer structure suitable for use in sensing applications, the multilayer structure comprising:at least one plastic layer having a first side and a second side opposite the first side;
at least one film layer provided on both of the first and second sides of the at least one plastic layer;
the at least one film layer on the first side of the at least one plastic layer comprising electronics incorporating reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, the sensing electronics comprising at least one electrode and a galvanic connection element configured to connect the electrode to an associated control circuitry driving the at least one electrode; and
the at least one film layer on the second side of the at least one plastic layer comprising one or more features including at least one conductive feature, the one or more features being configured to shape an electromagnetic field to adapt a sensitivity or a directionality of a sensing response of the sensing electronics on the first side of the at least one plastic layer.

US Pat. No. 10,057,989

MULTILAYER STRUCTURE AND RELATED METHOD OF MANUFACTURE FOR ELECTRONICS

TACTOTEK OY, Oulunsalo (...

1. A multilayer structure, comprising:a substrate film having a first side and an opposite second side, the substrate film comprising electrically insulating material;
a number of conductive traces printed by printed electronics technology on at least the first side of the substrate film, the number of conductive traces configured to establish a desired circuit design;
a connector element provided on the substrate film, a first side of the connector element facing structure internals and a second opposite side of the connector element facing the environment on the second side of the substrate film via at least one hole defined in the substrate film, the connector element comprising a number of electrically conductive contact members connected to the circuit on the first side of the substrate film and configured to contact one or more electrical contact members of an external element responsive to mating the external element with the connector element; and
a plastic layer molded onto the first side of the substrate film and the first side of the connector element covering the first side of the connector element and the circuit.

US Pat. No. 10,061,732

ENABLING ARRANGEMENT FOR AN ELECTRONIC DEVICE WITH HOUSING-INTEGRATED FUNCTIONALITIES AND METHOD THEREFOR

TACTOTEK OY, Oulunsalo (...

1. A housing structure defining at least part of a cover of a host device, the housing structure comprising:at least one substrate provided with a plurality of functional elements and a system-on-a-chip;
housing material molded into a target shape so as to at least partially embed the plurality of functional elements and the system-on-a-chip provided on the at least one substrate, the at least one substrate preformed to a selected shape by thermoforming prior to molding of the housing material thereon, the system-on-a-chip comprising:
a connector with a plurality of connecting elements to establish a connection between the plurality of functional elements and the system-on-a-chip,
a communications interface connected to the host device of the housing structure to enable the host device to utilize a number of functionalities associated with functional elements provided in the housing structure,
a memory for storing and retrieval of instructions, and
a processing unit configured to transform signals transferred between the plurality of functional elements of the housing structure and the host device from a known format to another predetermined format according to stored instructions.

US Pat. No. 10,055,530

ARRANGEMENT AND METHOD FOR FACILITATING ELECTRONICS DESIGN IN CONNECTION WITH 3D STRUCTURES

TACTOTEK OY, Oulunsalo (...

1. A method for facilitating circuit layout design in connection with three-dimensional (3D) target structure designs, to be executed by one or more at least functionally connected computer devices, comprising:obtaining and storing information in a data repository, the information characterizing materials and/or processes applicable in producing circuits of electrically conductive structures on electrically insulating substrates subjected to processing,
receiving design input characterizing:
a 3D target structure design to be produced from a substrate by a process involving 3D forming,
a target circuit design, defined in a 2D and/or a 3D domain, to be provided on the substrate,
the substrate, and
the 3D forming process,
determining a mapping between locations of the 3D target structure design and the substrate, including a location of the target circuit design, through utilization of a selected mapping technique,
applying the received design input and information corresponding to the received design input in the data repository, wherein the mapping technique is further configured to take elongation of the substrate during producing the 3D target structure design from the substrate into account in the mapping,
establishing and providing an output, including at least one computer-readable file, comprising human and/or machine readable instructions indicative of the mapping, to manufacturing equipment, including at least one of a printing, electronics assembly, and a forming equipment, and
receiving at least part of the output in a manufacturing equipment and providing, by the equipment, the circuit design onto the substrate in accordance with the received output prior to processing of the substrate.

US Pat. No. 9,915,556

ILLUMINATED INDICATOR STRUCTURES FOR ELECTRONIC DEVICES

TactoTek Oy, Oulunsalo (...

1. A cover assembly for an electronic device, the cover assembly comprising:
a substantially opaque cover having a pair of oppositely directed major faces respectively defining an outer face and an inner
face, the cover defining an optical indicator opening via which backlighting illumination is passable through the cover;

a matrix layer on the inner face of the cover, the matrix layer overlapping the optical indicator opening and being of an
optically conductive material; and

a backlighting arrangement comprising one or more lighting devices embedded in the matrix layer to provide backlighting illumination
to the optical indicator opening via the matrix layer, the one or more lighting devices being offset from the optical indicator
opening such that none of the one or more lighting devices is located in a line of sight through the optical indicator opening,
when viewed in a direction transverse to the outer face of the cover member at the optical indicator opening.

US Pat. No. 9,990,455

ARRANGEMENT AND METHOD FOR FACILITATING ELECTRONICS DESIGN IN CONNECTION WITH 3D STRUCTURES

TACTOTEK OY, Oulunsalo (...

1. An apparatus for facilitating circuit layout design in connection with three-dimensional (3D) target designs, the apparatus comprising:at least one communication interface;
at least one processor; and
a memory storing instructions which, when executed by the at least one processor, cause the apparatus to:
obtain and store information in a data repository hosted by the memory, the information characterizing materials and/or processes applicable in producing circuits of electrically conductive structures on electrically insulating substrates subjected to processing,
receive design input characterizing:
a 3D target design to be produced from a substrate,
a target circuit design, defined in a 2D and/or a 3D domain, to be provided on the substrate, the target circuit design including components and/or electrical traces in terms of intended properties, including one or more of material, conductivity/resistance, dimensions, manufacturing method, connections and/or location, of the target circuit design, and
the substrate, including material and thickness or dimensions of the substrate,
determine a mapping between locations of the 3D target design and the substrate, including a location of the target circuit design, through utilization of a selected mapping technique,
apply the received design input and information corresponding to the received design input in the data repository, wherein the mapping technique is further configured to take elongation of the substrate during producing the 3D target design from the substrate, through 3D forming, into account in the mapping, and
establish and provide digital output, as including at least one computer-readable file, comprising human and/or machine readable instructions indicative of the mapping, to manufacturing equipment, including at least one of a printing, electronics assembly and a forming equipment,
wherein the computer-readable file is provided to the manufacturing equipment for manufacturing an electrical component.

US Pat. No. 9,801,286

MULTILAYER STRUCTURE AND RELATED METHOD OF MANUFACTURE FOR ELECTRONICS

TactoTek Oy, Kempele (FI...

1. A multilayer structure (100), comprising
a preferably flexible substrate film (102) having a first side and opposite second side,

a number of conductive traces (108), optionally defining contact pads and/or conductors, preferably printed on the first side of the substrate film for establishing
a desired predetermined circuit design,

plastic layer (104) molded onto the first side of the substrate film (102) so as to enclose the circuit between the plastic layer and the first side of the substrate film (102), and

a preferably flexible connector (114) for providing external electrical connection to the embedded circuit on the first side from the second, opposite side of
the substrate film (102), one end of the connector being attached to a predetermined contact area (116) on the first side whereas the other end (114B) is located on the second side of the substrate for coupling with an external element (118), an intermediate portion connecting the two ends being fed through an opening (115) in the substrate film (102), wherein the opening (115) extending through the thickness of the substrate film (102) is preferably dimensioned so as to accommodate the connector (114) without substantial additional clearance.

US Pat. No. 10,194,526

ELECTRICAL NODE, METHOD FOR MANUFACTURING AN ELECTRICAL NODE, ELECTRICAL NODE STRIP OR SHEET, AND MULTILAYER STRUCTURE COMPRISING THE NODE

TACTOTEK OY, Oulunsalo (...

1. An electrical node comprising a first substrate film defining a cavity, a first material layer arranged to at least partly fill the cavity, and to embed or at least partly cover at least one electrical element arranged into the cavity; and a thermal management element selected from the group consisting of: a heat sink, a thermal slug, and a thermal well, wherein the thermal management element is arranged completely inside the cavity and embedded into the first material layer.

US Pat. No. 10,119,869

METHOD FOR MANUFACTURING A STRAIN GAUGE DEVICE, A STRAIN GAUGE DEVICE, AND THE USE OF THE DEVICE

TACTOTEK OY, Oulunsalo (...

1. A method for manufacturing a strain gauge device, the method comprising:obtaining a first substrate including a first formable substrate film for accommodating electronic components,
printing by a printed electronics method a strain gauge on the first substrate, and
injection molding a molded material layer over the strain gauge, thereby embedding the strain gauge in the molded material layer.

US Pat. No. 9,864,127

ARRANGEMENT FOR A TOUCHSCREEN AND RELATED METHOD OF MANUFACTURE

TACTOTEK OY, Dulunsalo (...

1. A touchscreen arrangement, comprising:
a flexible, optionally transparent, substrate film of plastics, the substrate comprising support electronics, or roll-to-roll
processed printed electronics including a number of printed conductors, for providing power, control and/or communications
connection to further electronic components;

a number of emitters and detectors arranged on the substrate into contact with the support electronics, for emitting and detecting
light, respectively;

a lightguide layer of plastics molded onto the substrate such that the emitters and detectors, and optionally at least part
of the support electronics, are substantially embedded in the over-molded lightguide material of the lightguide layer, the
properties of the lightguide layer including the refractive index of the lightguide material being selected and the emitters
and detectors being configured so as to enable, when in use, total internal reflection (TIR) propagation of light within the
lightguide layer between the emitters and detectors and recognition of a touch on the basis of a drop in the TIR performance
as determined from the detected light, wherein the touchscreen arrangement is adapted to recognize touch from a FTIR (frustrated
TIR)-induced drop in the light intensity level as captured by one or more detectors in contrast to an adaptively determined
basic reception level, which is configured over time, optionally in intervals or constantly, according to changes in the intensity
of the light detected by the one or more detectors, during a TIR condition; and

a non-deformable material layer directly upon the lightguide layer configured to adjust friction of a touch surface to enhance
touch feel or change a slide of an actuation element thereon.

US Pat. No. 10,251,278

MULTI-MATERIAL STRUCTURE WITH EMBEDDED ELECTRONICS

TACTOTEK OY, Oulunsalo (...

1. A method for manufacturing a multilayer structure for an electronic device, the method comprising: obtaining a flexible substrate film for accommodating electronics; printing a number of conductor traces on the flexible substrate film for electrically connecting electronic components with each other and/or a number of predefined areas on the flexible substrate; providing a number of electronic components on a first surface area of the flexible substrate film, wherein the flexible substrate film further comprises a second surface area adjacent to the first surface area; overmolding a first thermoplastic material to the number of electronic components and the related first surface area of the flexible substrate film accommodating the components; and overmolding a second thermoplastic material on the adjacent second surface area and on at least part of the first surface area so that at least part of the electronic components and the first thermoplastic material thereon are substantially embedded between the flexible substrate film and the second thermoplastic material, wherein the first thermoplastic exhibits a first elasticity and the second thermoplastic material exhibits a second, different elasticity; wherein the first thermoplastic material is configured to prevent the first surface area of the flexible substrate from deformation and the second thermoplastic material is configured to allow the flexible substrate to bendable.

US Pat. No. 10,288,800

MULTILAYER STRUCTURE WITH EMBEDDED LIGHT SOURCE AND LIGHT-GUIDING FEATURES AND RELATED METHOD OF MANUFACTURE

TACTOTEK OY, Oulunsalo (...

1. An integrated multilayer structure comprising:a substrate film having a first side and an opposing second side;
electronics comprising at least one light source, provided upon the first side of the substrate film and a number of electrical conductors, printed by printed electronics technology, at least electrically coupled to the at least one light source, the at least one light source being configured to emit light at least in selected one or more frequencies or wavelengths, including visible light;
an optically transmissive element comprising thermoplastic optically transmissive, having regard to the selected frequencies or wavelengths, material having a first refractive index and produced, through utilization of molding from said optically transmissive thermoplastic material, onto the first side of the substrate film so as to at least partially embed the at least one light source therewithin; and
optical cladding comprising material having a lower refractive index than the first refractive index and provided adjacent the optically transmissive element upon the first side of the substrate film,
wherein the at least one light source, the optically transmissive element and the optical cladding have been mutually configured so as to convey light emitted by the light source within the optically transmissive material of the optically transmissive element, at least portion of the conveyed light undergoing a substantially total internal reflection when incident upon the optical cladding.

US Pat. No. 10,285,261

ELECTRICAL NODE, METHOD FOR MANUFACTURING AN ELECTRICAL NODE, ELECTRICAL NODE STRIP OR SHEET, AND MULTILAYER STRUCTURE COMPRISING THE NODE

TACTOTEK OY, Oulunsalo (...

1. An electrical node, comprising:a first substrate film defining a cavity;
a first material layer arranged to at least partly fill the cavity, and to embed or at least partly cover at least one electrical element arranged into the cavity; and
a second substrate, having a first side and a second side, comprising the at least one electrical element on the first side, wherein the second substrate is arranged so that the entire first side and the at least one electrical element are positioned into the cavity and embedded in the first material layer;
wherein the first material layer comprises elastic material, to reduce thermal expansion related stresses between elements adjacent thereto.

US Pat. No. 10,248,277

MULTILAYER STRUCTURE WITH EMBEDDED MULTILAYER ELECTRONICS

TACTOTEK OY, Oulunsalo (...

1. An integrated multilayer assembly for an electronic device comprising:a first substrate film configured to accommodate electrical features on at least a first side thereof, the first substrate film having the first side and a second side opposite the first side;
a second substrate film configured to accommodate electrical features on at least a first side thereof, the second substrate film having the first side and a second side opposite the first side, the first sides of the first and second substrate films being configured to face each other, at least one of the first or second substrate films preformed to a three-dimensional, non-planer, shape;
at least one electrical feature on the first side of the first substrate film;
at least one other electrical feature on the first side of the second substrate film, wherein at least one of the at least one electrical feature or the at least one other electrical feature is a mounted electronic component; and
a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.

US Pat. No. 10,383,232

THERMOFORMED PLASTIC COVER FOR ELECTRONICS AND RELATED METHOD OF MANUFACTURE

TACTOTEK OY, Oulunsalo (...

1. A method for manufacturing a multilayer structure for an electronic device, comprising:obtaining a flexible substrate film for accommodating electronics, providing a number of conductor traces on the flexible substrate film for electrically powering and/or connecting electronic components,
providing at least one electronic component on the flexible substrate film,
placing at least one thermoformed cover on top of the at least one electronic component,
attaching the at least one thermoformed cover to the flexible substrate film,
molding a thermoplastic material on the at least one thermoformed cover and substrate film accommodating the electronic components after attaching the at least one thermoformed cover to the flexible substrate film; and
providing a number of through-holes to the thermoformed cover to enable light emitted, detected and/or sensed by the at least one component to propagate there within and outcouple therefrom.

US Pat. No. 10,455,702

METHOD FOR MANUFACTURING A MULTILAYER STRUCTURE FOR HOSTING ELECTRONICS

TACTOTEK OY, Oulunsalo (...

1. A method for manufacturing a multilayer structure, comprising:obtaining a first substrate film for accommodating electronics, the first substrate film having a planar shape including a first side and an opposite second side, the first substrate film comprising an electrically insulating material;
providing at least on electronic component and at least one conductor on at least the second side of the first substrate film, the at least one electronic component being functionally connected to the first side of the first substrate film;
thermoforming the first substrate film to at least locally or more widely exhibit a selected non-planar three-dimensional shape subsequent to providing the at least one electronic component on the at least the second side of the first substrate film; and
molding plastic material on the first side of the first substrate film so as to at least partially cover the first side of the first substrate film.

US Pat. No. 10,491,115

ARRANGEMENT AND METHOD FOR DELIVERING A CURRENT-CONTROLLED VOLTAGE

TACTOTEK OY, Oulunsalo (...

6. A method involving printed electronic traces for delivering a current-controlled voltage to a target component, the method comprising at least the steps of:providing a target component;
providing printed conductive traces;
providing a voltage source (Vsupply);
providing a measuring circuit including a current sense amplifier and a first resistor;
producing a current-controlled voltage (VOUT2, Vout) that is selected between multiple non-zero voltages based on a current (IR,LED, ILED) that is being passed through the target component;
detecting a current (IR,LED) with the measuring circuit, the current being at least indicative of the current that is being passed through the target component;
coupling the voltage source to the target component;
providing a voltage regulation circuit including a first transistor and a voltage regulator;
wherein producing the current-controlled voltage includes:
setting a first output voltage (VOUT1) of the measuring circuit according to the detected current;
delivering the first output voltage to the voltage regulation circuit;
setting a second output voltage (VOUT2) of the voltage regulation circuit according to the first output voltage; and
coupling the second output voltage to the target component;
wherein the detecting of the current is carried out through the first resistor and the current sense amplifier and the first output voltage is provided by the current sense amplifier, the method further comprising:
controlling the first transistor through the first output voltage;
adjusting an adjustment voltage of the voltage regulator through the first transistor; and
producing, with the voltage regulator, a second output voltage that is coupled to the target component, the second output voltage then being dependent on the detected current.

US Pat. No. 10,561,019

ECOLOGICAL MULTILAYER STRUCTURE FOR HOSTING ELECTRONICS AND RELATED METHOD OF MANUFACTURE

TACTOTEK OY, Oulunsalo (...

1. An integrated multilayer structure for hosting electronics, comprising:a 3d-formable first substrate comprising organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side,
a plastic layer, comprising thermoplastic, molded onto said second side of the first substrate so as to at least partially cover it, and
a light source provided on the second side of the first substrate, said light source being at least partially embedded in the molded material of the plastic layer.

US Pat. No. 10,408,391

ILLUMINATED STRUCTURE AND RELATED METHOD OF MANUFACTURE

TACTOTEK OY, Oulunsalo (...

1. A stacked light-emitting multilayer structure, comprising:a substantially opaque cover member with a number of elongated indicator elements extending through the cover member, the cover member having an outer face towards the environment and a substantially opposite inner face towards the internals of the structure, each elongated indicator element having a periphery that defines a corresponding indicator shape in the cover member, each indicator element comprising an at least optically translucent material to transmit light incident thereon and enable backlight arriving at the inner face to exit via the outer face;
a flexible substrate film layer of at least one film, 3D-shaped to define a number of elongated recesses, each elongated recess substantially aligned with a respective one of the number of indicator elements of the cover member, the film layer hosting, in each of the formed recesses, a plurality of substantially aligned light sources disposed thereon spread along the length of the recess and configured to emit light substantially towards the cover member; and
a thermoplastic optically transmissive light-guiding material layer molded onto the film layer between the film layer and the cover layer so as to embed said plurality of light sources while defining a plurality of elongated protrusions aligned with the recesses and the indicator elements, each of said protrusions being configured to convey the light emitted by the underlying light sources of the corresponding recess of film layer towards the cover member, supporting substantially total internal reflection based propagation of light therewithin enabled by an interface between the side walls of the protrusions and neighbouring material.

US Pat. No. 10,234,340

MULTILAYER STRUCTURE FOR CAPACITIVE PRESSURE SENSING

TACTOTEK OY, Oulunsalo (...

8. A multilayer structure comprising:a flexible substrate film;
a plurality of flexible sensor pads printed on the flexible substrate film;
an electronic circuit further provided on the flexible substrate film to control capacitive measurements via the plurality of flexible sensor pads to obtain an indication of pressure subjected to the multilayer structure and to monitor a capacitance between each flexible sensor pad of the plurality of flexible sensor pads and a sole of a user placed upon the structure and functionally forming a capacitor with at least one flexible sensor pad of the plurality of flexible sensor pads;
conductor traces printed on the flexible substrate film to electrically connect the electronic circuit and flexible sensor pads of the plurality of flexible sensor pads, the electronic circuit and a portion of the conductor traces overmolded with a first material layer;
a Surface-Mount Device (SMD) attached to the flexible substrate film;
a power supply element for powering electricity-driven components including the electronic circuit; and
a second material layer being a plastic layer molded upon the flexible substrate film substantially embedding the plurality of flexible sensor pads, the conductor traces, the SMD, and the electronic circuit therewithin, the SMD configured to be attached to the flexible substrate film as the at least one plastic layer is molded upon the flexible substrate film.

US Pat. No. 10,575,407

SYSTEM FOR CARRYING OUT A MANUFACTURING METHOD ON AN ELECTRO CHEMICAL STRUCTURE

TACTOTEK OY, Oulunsalo (...

1. A system for carrying out a manufacturing method of an electromechanical structure, the system comprising:a first entity configured to produce conductors on a planar, flat film;
a second entity configured to attach electronic elements at locations on the planar, flat film in relation to a three-dimensional shape of the planar, flat film, the electronic elements including a number of surface mount technology components, the locations of the electronic elements on the planar, flat film selected such that the locations omit substantial deformation during subsequent forming of the planar, flat film into the three-dimensional shape;
a third entity configured to form the planar, flat film into the three-dimensional shape when the electronic elements are supported on the planar, flat film, the third entity including at least one of a continuously roll-fed machine, an automatically in-precut-pieces-fed machine, a computer numerical control machine, a thermoforming machine, a vacuum former machine, a pressure forming machine, or a blow molding machine; and
a fourth entity configured to mold a material on the film by injection molding, the fourth entity including at least one of a hydraulic, mechanical, electric, or hybrid injection molding machine, wherein the first, second, third, and fourth entities are arranged to manufacture the electromechanical structure.

US Pat. No. 10,225,932

INTERFACING ARRANGEMENT, METHOD FOR MANUFACTURING AN INTERFACING ARRANGEMENT, AND MULTILAYER STRUCTURE HOSTING AN INTERFACING ARRANGEMENT

TACTOTEK OY, Oulunsalo (...

1. An interface arrangement for providing electrical or electromagnetic connection between an external system and a host structure of the interface arrangement, the interface arrangement comprising:a first substrate film defining a cavity;
a first material layer arranged to at least partly fill the cavity, and to embed or at least partly cover at least one electrical element at least partly arranged into the cavity, wherein the at least one electrical element comprises at least a converter element configured for adapting signals to be transferred between the external system and electronics of the host structure; and
a first connection element configured for connecting to the external system, wherein the first connection element is further at least functionally connected to the converter element.

US Pat. No. 10,401,547

ILLUMINATED MULTILAYER STRUCTURE WITH EMBEDDED AREA LIGHT SOURCE

TACTOTEK OY, Oulunsalo (...

1. A multilayer assembly for an electronic device comprises:a substrate film includes thermoplastic material and has a first side and a second side, the substrate film configured to accommodate electronics at least on the first side thereof;
an area light source provided on the first side of the substrate film and configured to emit light of a predetermined frequency or a predetermined frequency band the predetermined frequency or predetermined frequency band including visible light;
a lightguide layer of molded plastic provided on the first side of the substrate film and at least partially embedding the area light source, the lightguide layer being of material configured to enable light to pass therethrough, wherein the lightguide layer is configured to transmit light emitted by the area light source so that the transmitted light propagates within the lightguide layer and is outcoupled from a first surface of the lightguide layer, the first surface of the lightguide layer being an outer surface of the lightguide layer, wherein the outer surface of the lightguide layer is substantially opposite to a second surface of the lightguide layer, the second surface facing the first side of the substrate film and the area light source thereon, the area light source being at least partially embedded in the lightguide layer via the second surface; and
a masking layer provided on the outer surface of the lightguide layer containing substantially opaque material to block external view of at least some internals of the multilayer assembly, wherein the masking layer defines a window for letting the light emitted by the area light source and propagated within the lightguide layer to pass through the masking layer towards an environment, wherein the area light source is located substantially opposite to the window.

US Pat. No. 10,645,796

ELECTRICAL NODE, METHOD FOR MANUFACTURING ELECTRICAL NODE AND MULTILAYER STRUCTURE COMPRISING ELECTRICAL NODE

TACTOTEK OY, Oulunsalo (...

1. A multilayer structure comprising:at least one electrical node including:
a substrate for accommodating at least one functional element, said substrate having a first side and an opposite second side, said substrate further hosting a number of connecting elements for at least one electrically or electromagnetically connecting the at least one functional element with an external structure;
the at least one functional element comprising at least one electronic component and a number of conductive traces connecting thereto, provided to the substrate and projecting from the first side of the substrate; and
a first material layer having a modulus of elasticity of about 2000 MPA or less and defining a protective covering at least upon said at least one functional element, said first material layer defining at least a portion of the exterior surface of the node;
wherein the first material layer is arranged to reduce at least one of thermal expansion or mechanical deformation related stresses between one or more elements included in the node, adjacent the node or at least at a proximity thereto, between the connecting elements and at least one element of the external structure; and
the external structure including:
a host substrate supporting the at least one electrical node thereon by abutting the second side of the substrate of the electrical node; and
a plastic material layer molded or casted, from a source material, directly on the host substrate and the at least one electrical node, thereby at least partially embedding the at least one electrical node therein.

US Pat. No. 10,660,211

METHOD FOR MANUFACTURING AN ELECTROMECHANICAL STRUCTURE

TACTOTEK OY, Oulunsalo (...

1. A method for manufacturing an electromechanical structure, the method comprising:producing conductors on a flat film by a continuous roll-to-roll process;
selecting locations on the flat film to attach electronic components based on an amount of projected curvature of the flat film at the selected locations when the flat film is formed into a three-dimensional film;
attaching electronic components on the flat film at the selected locations of the flat film, the electronic components including a number of surface-mount technology (SMT) components;
forming the flat film into the three-dimensional film to minimize separation between the electronic components and curvature of the flat film at the selected locations such that the selected locations of the three-dimensional film on which the electronic components are attached have a curvature that is less than a curvature of other portions of the three-dimensional film, the electronic components not being attached to a location of the three-dimensional film having the greatest curvature; and
injection molding a layer of material on the three-dimensional film by inserting the three-dimensional film into a mold, the layer of material being attached, in the injection molding step, on the surface of the three-dimensional film to create the electromechanical structure.

US Pat. No. 10,653,004

ELECTRONIC ASSEMBLY

TACTOTEK OY, Oulunsalo (...

1. An electronic assembly comprising:a first substrate film;
a first electrical contact pad coupled to the first substrate film;
a second material layer including molded material; and
an electrically conductive member coupled to the first electrical contact pad and extending from the first electrical contact pad through the second material layer, wherein a second end of the electrically conductive member protrudes from the second material layer, such that the second end of the electrically conductive member is accessible and configured to provide an electrical connection through the second material layer to the first electrical contact pad and a first end of the electrically conductive member is covered by the first substrate film, wherein an intermediate portion of the electrically conductive member is embedded in the second material layer, wherein the electrically conductive member includes a spring loaded connector.

US Pat. No. 10,813,222

SYSTEM FOR MANUFACTURING AN ELECTROMECHANICAL STRUCTURE

TACTOTEK OY, Oulunsalo (...

1. A system for manufacturing an electromechanical structure, the system comprising:a first entity configured to produce conductors on a planar, flat film;
a second entity includes a pick-and-place machine having at least one component that is positionable to attach electronic elements at locations on the planar, flat film in relation to a three-dimensional shape of the planar, flat film, the electronic elements including a number of surface mount technology components, the locations of the electronic elements on the planar, flat film selected such that the locations omit substantial deformation during subsequent forming of the planar, flat film into the three-dimensional shape;
a third entity configured to form the planar, flat film into the three-dimensional shape when the electronic elements are supported on the planar, flat film, the third entity including at least one of a continuously roll-fed machine, an automatically in-precut-pieces-fed machine, a computer numerical control machine, a thermoforming machine, a vacuum former machine, a pressure forming machine, or a blow molding machine; and
wherein the first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.

US Pat. No. 10,675,834

INTEGRATED MULTILAYER STRUCTURE FOR USE IN SENSING APPLICATIONS AND METHOD FOR MANUFACTURING THEREOF

TACTOTEK OY, Oulunsalo (...

1. A method for manufacturing an integrated multilayer structure for sensing applications, comprising:obtaining at least one film comprising a sensing area, the at least one film including a top film and a bottom film;
arranging the at least one film with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, the reactance sensing electronics comprising at least one sensing element and an electrical connection configured to connect the at least one sensing element to an associated control circuitry;
arranging the at least one film so that the top film is positioned closer to a user than the bottom film;
molding or casting, and configuring, at least one plastic layer with a recess defined therein so that the at least one plastic layer defines an integrated, intermediate layer between the reactance sensing electronics and the sensing area and that the sensing area is superimposed with the at least one sensing element of the reactance sensing electronics; and
thermoforming at least one physical feature in a first portion of the bottom film at a location of the sensing area such that the at least one physical feature of the at least one film maintains a protrusion shape that extends from a second portion of the bottom film into the recess of the at least one plastic layer to retain the at least one sensing element on the at least one physical feature and in the recess at a position spaced a distance from the sensing area sufficient to improve a sensing sensitivity of the at least one sensing element and to locally and permanently reduce an electrical distance between the sensing area and the at least one sensing element.

US Pat. No. 10,670,800

ILLUMINATED MULTILAYER STRUCTURE WITH EMBEDDED LIGHT SOURCES

TACTOTEK OY, Oulunsalo (...

1. A multilayer assembly for an electronic device comprises:a flexible substrate film configured to accommodate electronics on at least a first side thereof, the substrate film having the first side and a second side, the substrate film including at least one material selected from the group consisting of: thermoplastic material, PMMA (Polymethyl methacrylate), Poly Carbonate (PC), polyimide, a copolymer of Methyl Methacrylate and Styrene (MS resin), glass, organic material, fibrous material, Polyethylene Terephthalate (PET), and metal, the substrate film including a three-dimensional, non-planar shape such that the substrate film has different thicknesses along a length thereof;
conductive traces printed by means of printed electronics technology on the first side of the substrate film,
light sources provided on the first side of the substrate film and configured to emit light of predetermined frequency or frequency band, including or substantially limiting to visible light,
a molded plastic lightguide layer provided onto the first side of the substrate film and at least partially embedding the light sources, the plastic lightguide layer being of optically at least one of translucent, at least one substantially transparent, material having regard to the predetermined frequency or band, wherein the plastic lightguide layer is configured to transmit light emitted by the embedded light sources so that the transmitted light propagates within the lightguide layer and is outcoupled from the plastic lightguide layer via an outer surface thereof substantially opposite to the embedded light sources, and
a masking layer provided on the outer surface of the plastic lightguide layer, containing substantially opaque material to block external view of at least some internals of the multilayer assembly including the light sources, wherein the masking layer defines a window for letting the light emitted by the embedded light sources and propagated within the plastic lightguide layer to pass through the masking layer towards the environment,
the light sources, masking layer and related window being mutually configured such that there is substantially no direct line-of-sight (LOS) path at least within a selected viewing angle from outside the assembly, including zero angle from the surface normal of the masking layer, to the light sources and optionally further electronics through the window.

US Pat. No. 10,667,396

MULTILAYER STRUCTURE FOR HOSTING ELECTRONICS AND RELATED METHOD OF MANUFACTURE

TACTOTEK OY, Oulunsalo (...

1. An integrated multilayer structure comprising:a first substrate film having a first side and an opposite second side, the first substrate film comprising an electrically insulating material, the second side having a number of electrical conductors thereon that exhibit predetermined characteristics at selected wavelengths;
a plastic layer on the first side of the first substrate film so as to at least partially cover the first side of the first substrate film;
an embedded color or graphics layer exhibiting a selected color, figure, icon, graphical pattern, symbol, text, numeric, alphanumeric, and/or other visual indication feature; and
circuitry provided on at least one of the first and second sides of the first substrate film, the circuitry including at least one electronic component selected from the group consisting of: an optoelectronic component, a microcontroller, a microprocessor, a signal processor, a digital signal processor, a sensor, a switch, a touch switch, a proximity switch, a programmable logic chip, a memory, a transistor, a resistor, a capacitor, an inductor, a capacitive switch, a memory array, a memory chip, a data interface, a transceiver, a wireless transceiver, a transmitter, a receiver, a wireless transmitter, and a wireless receiver, the circuitry further including at least one conductor, the circuitry being functionally connected to the first side of the first substrate film, wherein the plastic layer on the first side of the first substrate film and the at least one electronic component on the second side of the first substrate film while being functionally connected to the first side of the first substrate film defines a first configuration of the multilayer structure, the first substrate film having a planar arrangement in the first configuration, and wherein the multilayer structure is configured to transition from the first configuration to a second configuration of the multilayer structure, the second configuration different from the first configuration, the multilayer structure configured to be retained in the second configuration, the first substrate film having a non-planar arrangement in the second configuration.

US Pat. No. 10,667,401

MULTILAYER STRUCTURE AND RELATED METHOD OF MANUFACTURE FOR ELECTRONICS

TACTOTEK OY, Oulunsalo (...

1. A method for manufacturing a multilayer structure, comprising:obtaining a substrate film for accommodating electronics;
providing conductive traces on a first side of the substrate film to establish a predetermined circuit design;
providing a connector element having a planar portion that is supported on and by the first side of the substrate film to electrically connect to the predetermined circuit design, wherein the substrate film is arranged with at least one hole aligned with the planar portion of the connector element so that electrically conductive contact members of the connector element are accessible from a second opposite side of the substrate film via the at least one hole, wherein the electrically conductive contact members of the connector element each have opposing ends disposed on the first side of the substrate film; and
molding thermoplastic material on the first side of the substrate film and the connector element to cover the predetermined circuit design and a first side of the connector element.

US Pat. No. 10,642,433

MULTILAYER STRUCTURE WITH EMBEDDED MULTILAYER ELECTRONICS

TACTOTEK OY, Oulunsalo (...

1. An integrated multilayer assembly for an electronic device comprising:a first substrate film configured to accommodate electrical features on at least a first side thereof, the first substrate film having the first side and a second side opposite the first side;
a second substrate film configured to accommodate electrical features on at least a first side thereof, the second substrate film having the first side and a second side opposite the first side, the first sides of the first and second substrate films being configured to face each other;
at least one electrical feature on the first side of the first substrate film;
at least one other electrical feature on the first side of the second substrate film, wherein at least one of the at least one electrical feature or the at least one other electrical feature is a mounted electronic component; and
a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof, wherein one of the at least one electrical feature on the first substrate film comprises a first sensing element for detecting touch on the assembly surface.

US Pat. No. 10,827,609

ECOLOGICAL MULTILAYER STRUCTURE FOR HOSTING ELECTRONICS AND RELATED METHOD OF MANUFACTURE

TACTOTEK OY, Oulunsalo (...

1. An integrated multilayer structure for hosting electronics, comprising:a 3d-formable first substrate fabricated from a substantially electrically-insulative, organic material, the first substrate having a first side, and an opposite second side;
a plastic layer molded onto the second side of the first substrate to at least partially cover the first substrate, the plastic layer having a first side that faces the second side of the first substrate, and an opposite second side;
a plastic second substrate disposed on the second side of the plastic layer; and
a light source at least partially embedded in the plastic layer such that the light source is disposed between the first substrate and the second substrate, wherein the organic material of the first substrate comprises opaque material being at least locally configured to have a reduced thickness area to enable light emitted by the light source to glow through the first substrate and thereby towards an environment of the integrated multilayer structure on the first side of the first substrate.

US Pat. No. 10,986,733

METHOD FOR MANUFACTURING AN ELECTROMECHANICAL STRUCTURE

TACTOTEK OY, Oulunsalo (...

1. A method for manufacturing an electromechanical structure, the method comprising:producing conductors on a film having a flat shape;
selecting electronic components;
attaching the electronic components on the film in selected orientations to establish a first separation distance between the electronic components and the film while the film is in the flat shape;
selecting the orientations based on a projected profile of a hypothetical curved surface of the film in a predetermined three-dimensional shape to prevent the first separation distance from increasing to a second separation distance when the film is disposed in the predetermined three-dimensional shape;
forming the film, with the electronic components attached, from the flat shape into the predetermined three-dimensional shape such that the film includes a formed profile with at least one curved surface disposed in registration with the electronic components, the formed profile corresponding with the projected profile of the hypothetical curved surface wherein the at least one curved surface is spaced from the electronic components a distance less than the second separation distance for maintaining the at least one curved surface and the electronic components in close proximity to one another; and
using the film with the predetermined three-dimensional shape as an insert in an injection molding process by molding on the film such that a layer of material is attached on the surface of the film, thereby creating the electromechanical structure.

US Pat. No. 10,986,734

METHOD FOR MANUFACTURING AN ELECTROMECHANICAL STRUCTURE AND AN ARRANGEMENT FOR CARRYING OUT THE METHOD

TACTOTEK OY, Oulunsalo (...

1. A method for manufacturing an electromechanical structure, comprising:producing conductors on a flat film;
attaching a light-emitting component or a control circuit to the flat film to based on a desired three-dimensional shape of the flat film, the desired three-dimensional shape of the flat film including a hypothetical curved surface;
after attaching the light-emitting component or the control circuit, forming the flat film into a three-dimensional film having the desired three-dimensional shape including at least one curved surface corresponding to the hypothetical curved surface such that the at least one curved surface is secured to, and spaced from, the light-emitting component or the control circuit to minimize a separation distance between the light-emitting component or the control circuit and at the location of the at least one curved surface; and
injection molding a layer of material on the surface of the three-dimensional film with the three-dimensional film being used as an insert to form an electromechanical structure.

US Pat. No. 10,986,735

METHOD FOR MANUFACTURING AN ELECTROMECHANICAL STRUCTURE AND AN ARRANGEMENT FOR CARRYING OUT THE METHOD

TACTOTEK OY, Oulunsalo (...

1. A method for manufacturing an electromechanical structure, comprising:producing conductors on a flat film;
determining a strain force of the flat film in a hypothetical three-dimensional shape thereof;
selecting locations of a plurality of locations along the flat film to attach electronic elements based on an amount of the strain force determined to occur in the hypothetical three-dimensional shape of the flat film;
attaching the electronic elements on the flat film at the selected locations along the flat film so that the selected locations exhibit less of the strain force when the flat film is formed into a three-dimensional film than at least some other locations along the flat film when the flat film is formed into the three-dimensional film;
forming the flat film into the three-dimensional film so that the three-dimensional film has a three-dimensional shape corresponding to the hypothetical three-dimensional shape of the flat film; and
injection molding material on the three-dimensional film.

US Pat. No. 10,946,612

INTEGRATED MULTILAYER STRUCTURE FOR USE IN SENSING APPLICATIONS AND METHOD FOR MANUFACTURING THEREOF

TACTOTEK OY, Oulunsalo (...

1. An integrated multilayer structure for use in sensing applications, the multilayer structure comprising:a plastic layer having a first side and a second side opposite the first side;
a top film layer on the first side of the plastic layer provided with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, the sensing electronics comprising a sensing element and an electrical connection configured to connect the sensing element to an associated control circuitry, in which at least a majority of the top film layer is planar;
a bottom film layer on the second side of the plastic layer having a plurality of areas including at least one non-sensing area and at least one sensing area substantially superimposed with the sensing element of the sensing electronics, the bottom film layer having a non-planar configuration and including at least one physical feature separate from the sensing element positioned at a position of the at least one sensing area to improve a sensing sensitivity of the sensing element, the at least one physical feature locally, permanently reducing an electrical distance between the bottom film layer and the sensing element such that the top and bottom film layers are closer to one another at the at least one sensing area than at the least one non-sensing area, the at least one physical feature having an inner surface and an outer surface defining a thickness of the bottom film layer therebetween, the inner surface and the outer surface being non-planar; and a recess positioned entirely below both a non-planar portion of the bottom film layer and the planar majority of the top film layer and being a bottom-most structure of the integrated multilayer structure.

US Pat. No. 10,928,583

ILLUMINATED MULTILAYER STRUCTURE WITH EMBEDDED LIGHT SOURCES

TACTOTEK OY, Oulunsalo (...

1. A multilayer assembly for an electronic device comprises:a flexible substrate film configured to accommodate electronics on at least first side thereof, said film having the first side and a second side,
a number of conductive traces printed by means of printed electronics technology on the first side of the substrate film,
a number of light sources provided on the first side of the substrate film and configured to emit light of predetermined frequency or frequency band, including or substantially limiting to visible light,
a molded plastic lightguide layer provided onto the first side of the substrate film and at least partially embedding the light sources, the plastic lightguide layer being of optically at least translucent, optionally substantially transparent, material having regard to the predetermined frequency or band, wherein the plastic lightguide layer is configured to transmit light emitted by the embedded light sources so that the transmitted light propagates within the lightguide layer and is outcoupled from the plastic lightguide layer via an outer surface thereof substantially opposite to the embedded light sources,
a masking layer provided on the outer surface of the plastic lightguide layer, containing substantially opaque material to block external view of at least some internals of the multilayer assembly including the light sources, wherein the masking layer defines a window for letting the light emitted by the embedded light sources and propagated within the plastic lightguide layer to pass through the masking layer towards the environment,
at least one diffusor located between the light sources and the environment,
a bottom layer on the second side of the substrate film, and
another diffusor, wherein the bottom layer comprises the another diffusor,
the light sources, masking layer and related window being mutually configured such that there is substantially no direct line-of-sight (LOS) path at least within a selected viewing angle from outside the assembly, including zero angle from the surface normal of the masking layer, to the light sources and optionally further electronics through the window.

US Pat. No. 10,960,641

INTEGRATED MULTILAYER STRUCTURE FOR USE IN SENSING APPLICATIONS AND METHOD FOR MANUFACTURING THEREOF

TACTOTEK OY, Oulunsalo (...

16. An integrated multilayer structure comprising:a plastic layer having a top and a bottom side opposite the top side; a bottom film layer on the bottom side of the plastic layer and including reactance sensing electronics, the sensing electronics including a sensing element, the bottom film layer having a non-planar portion and a planar portion;
a top film layer on the top side of the plastic layer having a sensing area positioned opposite the sensing element, the top film layer including a planar portion; and
a recess positioned below both the non-planar portion of the bottom film layer and the top film layer such that the recess is at the bottom of the integrated multilayer structure, and wherein a physical distance between the planar portion of the bottom film layer and the planar portion of the top film layer is greater than a physical distance between the non-planar portion of the bottom film layer and the planar portion of the top film layer.

US Pat. No. 11,032,912

SYSTEM FOR MANUFACTURING AN ELECTROMECHANICAL STRUCTURE

TACTOTEK OY, Oulunsalo (...

18. A system for manufacturing an electromechanical structure, the system comprising:a first entity configured to produce conductors on a planar, flat film;
a second entity includes a pick-and-place machine configured to attach electronic elements at locations on the planar, flat film in relation to a three-dimensional shape of the planar, flat film, the electronic elements including a number of surface mount technology components, the locations of the electronic elements on the planar, flat film selected such that the locations deform less than predetermined areas of maximum deformation introduced into the planar, flat film during forming of the planar, flat film into the three-dimensional shape;
a third entity configured to form the planar, flat film into the three-dimensional shape when the electronic elements are supported on the planar, flat film, the third entity including at least one of a continuously roll-fed machine, an automatically in-precut-pieces-fed machine, a computer numerical control machine, a thermoforming machine, a vacuum former machine, a pressure forming machine, or a blow molding machine; and
wherein the first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.