US Pat. No. 9,445,371

APPARATUS AND METHODS FOR WIDEBAND ENVELOPE TRACKING SYSTEMS

SKYWORKS SOLUTIONS, INC.,...

1. A method of envelope tracking in a power amplifier system, the method comprising:
generating a regulated voltage from a battery voltage using a DC-to-DC converter;
generating a first envelope current based on a first digital envelope signal, including level-shifting a plurality of bits
of the first digital envelope signal using a plurality of level-shifters, providing the plurality of level-shifted bits to
a plurality of resistors, and generating the first envelope current based on a flow of current through the plurality of resistors;

providing the first envelope current as an input to a first error amplifier, the first error amplifier electrically connected
with negative feedback; and

generating a first power amplifier supply voltage by combining the regulated voltage from the DC-to-DC converter and an output
of the first error amplifier using a first AC combiner.

US Pat. No. 9,412,630

SECURING MECHANISM AND METHOD FOR WAFER BONDER

Skyworks Solutions, Inc.,...

1. A method for bonding a wafer to a plate, the method comprising:
applying an adhesive between a wafer and a plate so as to form an assembly of the wafer and the plate;
positioning the assembly on a bonding area;
positioning a lid over the bonding area, the lid having an outside surface and an inside surface, the inside surface configured
to facilitate application of pressure to the assembly;

applying a pushing force on the outside surface of the lid so as to secure the lid in a substantially fixed orientation, the
inside surface of the lid and the bonding area forming at least part of a bonding chamber dimensioned to hold the assembly
when the lid is positioned over the bonding area and secured in the substantially fixed orientation, the pushing force directed
along a direction having a component that is perpendicular to a plane defined by the wafer, the pushing force applied external
to the bonding chamber; and

bonding the assembly by applying at least heat to the assembly.

US Pat. No. 9,305,859

INTEGRATED CIRCUIT DIE WITH LOW THERMAL RESISTANCE

ADVANCED ANALOGIC TECHNOL...

1. An integrated circuit die comprising:
a semiconductor substrate;
a stack of dielectric layers formed on a surface of said semiconductor substrate, said stack including a contact layer, at
least one interlayer dielectric layer, and a passivation layer, said contact layer adjoining said semiconductor substrate,
a principal surface of said die having an exposed surface of said passivation layer, said at least one interlayer dielectric
layer being sandwiched between said contact layer and said passivation layer;

a stack of metal layers, each of said metal layers being at an interface between two of said dielectric layers, a first metal
layer being located at an upper surface of said contact layer, a top metal layer being located at a lower surface of said
passivation layer;

a plurality of thermal vias, each of said thermal vias being filled with metal, said thermal vias being grouped in two-dimensional
arrays, said thermal vias including a first array of thermal vias contacting said surface of said semiconductor substrate,
terminating at said surface of said semiconductor substrate, and extending from said semiconductor substrate through said
contact layer to said first metal layer, and a second array of thermal vias extending from said top metal layer through one
of said at least one interlayer dielectric layers adjoining said passivation layer;

an under bump metal (UBM) layer located at said principal surface of said die and contacting the top metal layer; and
a first metal bump attached to said UBM layer, a thermal path being formed from said semiconductor substrate through said
thermal vias and said metal layers to said first metal bump, an area of contact between said first array of thermal vias and
said surface of said semiconductor substrate being horizontally offset from a location of said first metal bump, said first
array of thermal vias contacting said surface of said semiconductor substrate over an area that is not directly beneath the
first metal bump, each of said metal layers extending both directly above said area of contact between said first array of
thermal vias and said surface of said semiconductor substrate and directly below said first metal bump.

US Pat. No. 9,484,305

OFFSET CONTACTS FOR REDUCED OFF CAPACITANCE IN TRANSISTOR SWITCHES

Skyworks Solutions, Inc.,...

1. A semiconductor die comprising:
a semiconductor substrate;
first and second elongated doped regions, said first region serving as a source of a first transistor, said second region
serving as a drain of the first transistor and a source of a second transistor;

a plurality of straight elongated gate structures including a first gate structure disposed between the first and second regions
and serving as a gate of the first transistor and a second gate structure disposed adjacent to the second region and serving
as a gate of the second transistor, the second gate structure being parallel with the first gate structure;

a first set of evenly-spaced electrical contact pads disposed on the first region, the first set of electrical contact pads
including contact pads having a side dimension d1; and

a second set of evenly-spaced electrical contact pads disposed on the second region, the second set of contact pads including
contact pads having the side dimension d1, the second set of contact pads being offset with respect to the first set of contact pads in a longitudinal direction of
the first and second regions.

US Pat. No. 9,425,852

APPARATUS AND METHODS FOR ANTENNA SHARING IN A MOBILE DEVICE

SKYWORKS SOLUTIONS, INC.,...

1. A mobile device comprising:
a plurality of antennas including a first antenna and a second antenna;
a plurality of transceivers including a WiFi transceiver; and
a switching circuit configured to control access of the plurality of transceivers to the plurality of antennas, the switching
circuit including a multi-pole multi-throw switch and a single-pole multi-throw switch, the switching circuit having a first
mode in which the switching circuit electrically connects the WiFi transceiver to the first antenna via a first transmit signal
pathway through the multi-pole multi-throw switch, and a second mode in which the switching circuit electrically connects
the WiFi transceiver to the second antenna via a second transmit signal pathway through both the multi-pole multi-throw switch
and the single-pole multi-throw switch, the multi-pole multi-throw switch including an insertion loss component along the
first transmit signal pathway to substantially match a total insertion loss of the first transmit signal pathway and a total
insertion loss of the second transmit signal pathway.

US Pat. No. 9,450,593

DITHER-LESS ERROR FEEDBACK FRACTIONAL-N FREQUENCY SYNTHESIZER SYSTEMS AND METHODS

Skyworks Solutions, Inc.,...

1. A delta sigma modulator configured to generate a cyclic output code, the delta sigma modulator comprising:
a combining circuit configured to combine an input signal, a phase-lock-loop (PLL) feedback signal provided by a divider circuit
that is configured to divide a synthesized clock signal by the cyclic output code, and a modulator feedback signal to form
a summed signal;

a quantizing circuit configured to quantize the summed signal to form the cyclic output code;
an amplifier configured to scale the cyclic output code to generate a scaled signal; and
a summing circuit configured to combine the summed signal, the cyclic output code, and the scaled signal to provide the modulator
feedback signal.

US Pat. No. 9,257,504

ISOLATION STRUCTURES FOR SEMICONDUCTOR DEVICES

ADVANCED ANALOGIC TECHNOL...

1. An isolation structure formed in a semiconductor substrate of a first conductivity type, the substrate not including an
epitaxial layer, the isolation structure comprising:
a first floor isolation region of a second conductivity type opposite to the first conductivity type submerged in the substrate;
and

a first plurality of dielectric filled trenches extending downward from a surface of the substrate and overlapping onto the
first floor isolation region, the first plurality of dielectric filled trenches and the first floor isolation region electrically
isolating a first pocket of the first conductivity type from the substrate;

a second floor isolation region of the second conductivity type submerged in the substrate and laterally displaced from the
first floor isolation region;

a second plurality of dielectric filled trenches extending downward from the surface of the substrate and overlapping onto
the second floor isolation region, the second plurality of dielectric filled trenches and the second floor isolation region
electrically isolating a second pocket of the first conductivity type from the substrate; and

a buried region of the first conductivity type having a doping concentration greater than a doping concentration of the substrate
located laterally between the first floor isolation region and the second floor isolation region.

US Pat. No. 9,214,906

SYSTEMS AND METHODS FOR PROVIDING HIGH AND LOW ENABLE MODES FOR CONTROLLING RADIO-FREQUENCY AMPLIFIERS

SKYWORKS SOLUTIONS, INC.,...

1. An enable circuit for a radio-frequency (RF) amplifier, the enable circuit comprising:
a plurality of input ports, each configured to receive a control signal; and
a logical section connected to the input ports and configured to be capable of generating a plurality of output signals based
on different combinations of the plurality of control signals, the output signals including a first set of output signals
to control a power state of the RF amplifier in a first enable mode and a second set of output signals to control the power
state the RF amplifier in a second enable mode.

US Pat. No. 9,369,158

RADIO FREQUENCY SWITCH CONTROLLER

SKYWORKS SOLUTIONS, INC.,...

1. A switch controller comprising:
a negative voltage generator including at least two sub-circuits configured to receive at least two control signals, each
sub-circuit configured to receive a respective control signal of the at least two control signals and to draw from a regulated
supply in response to an edge of the respective control signal, the negative voltage generator including one or more outputs
configured to generate one or more negative voltages;

a control signal generator configured to provide the at least two control signals to the negative voltage generator such that
the at least two control signals are separated by at least one non-zero phase difference;

a filter electrically connected to the one or more outputs of the negative voltage generator and configured to filter the
one or more negative voltages; and

a level-shifter array configured to receive the one or more negative voltages and the regulated supply.

US Pat. No. 9,054,663

APPARATUS AND METHODS FOR REDUCING CAPACITIVE LOADING OF A POWER AMPLIFIER SUPPLY CONTROL MODULE

Skyworks Solutions, Inc.,...

1. A power amplifier module comprising:
a power supply input configured to receive a supply voltage from an envelope tracking module;
a first power amplifier die including a first supply input configured to receive the supply voltage, the first power amplifier
die configured to amplify at least a first RF signal, the first RF signal having a first center frequency and an envelope
of the first RF signal having a first envelope frequency;

a second power amplifier die including a second supply input configured to receive the supply voltage, the second power amplifier
die configured to amplify at least a second RF signal;

a first inductor and a first capacitor electrically connected in parallel, the first inductor and the first capacitor electrically
connected between the power supply input and the first supply input of the first power amplifier die, the first inductor and
the first capacitor having a resonance near the first center frequency such that an impedance of the first inductor and the
first capacitor is greater at the first center frequency than at the first envelope frequency to reduce capacitive loading
of the envelope tracking module; and

a second inductor and a second capacitor electrically connected in parallel, the second inductor and the second capacitor
electrically connected between the power supply input and the second supply input of the second power amplifier die.

US Pat. No. 9,385,765

DIVERSITY RECEIVER FRONT END SYSTEM WITH PHASE-SHIFTING COMPONENTS

SKYWORKS SOLUTIONS, INC.,...

1. A receiving system comprising:
a controller configured to selectively activate one or more of a plurality of paths between an input of the receiving system
and an output of the receiving system;

a plurality of amplifiers, each one of the plurality of amplifiers disposed along a corresponding one of the plurality of
paths and configured to amplify a signal received at the amplifier; and

a plurality of phase-shift components, each one of the plurality of phase-shift components disposed along a corresponding
one of the plurality of paths and configured to phase-shift a signal passing through the phase-shift component, the plurality
of phase-shift components including a first phase-shift component disposed along a first path of the plurality of paths corresponding
to a first frequency band and configured to phase-shift a second frequency band of a signal passing through the first phase-shift
component such that a second initial signal propagated along a second path of the plurality of paths corresponding to the
second frequency band and a second reflected signal propagated along the first path are at least partially in-phase.

US Pat. No. 9,450,639

COMPLEMENTARY METAL OXIDE SEMICONDUCTOR DIFFERENTIAL ANTENNA TRANSMIT-RECEIVE SWITCHES WITH POWER COMBINING CIRCUITRY FOR ORTHOGONAL FREQUENCY-DIVISION MULTIPLEXING SYSTEMS

SKYWORKS SOLUTIONS, INC.,...

1. A radio frequency (RF) transmit-receive switch with an antenna port, first and second transmit differential ports and first
and second receive differential ports, the switch comprising:
a first transmit transistor switch connected to the first transmit differential port;
a second transmit transistor switch connected to the second transmit differential port;
a transmit coupled inductor transformer including a pair of primary terminals connected across the first transmit transistor
switch and a pair of secondary terminals connected across the second transmit transistor switch;

a first receive transistor switch connected to the first receive differential port;
a second receive transistor switch connected to the second receive differential port;
a receive coupled inductor transformer including a pair of primary terminals connected across the first receive transistor
switch and a pair of secondary terminals connected across the second receive transistor switch; and

a balun having a first balun inductive winding and a second balun inductive winding, the first balun inductive winding being
connected to the antenna port, and the second balun inductive winding defined by a first end connected to the first transmit
transistor switch and the first receive transistor switch, and a second end connected to the second transmit transistor switch
and the second receive transistor switch.

US Pat. No. 9,373,613

AMPLIFIER VOLTAGE LIMITING USING PUNCH-THROUGH EFFECT

Skyworks Solutions, Inc.,...

1. A semiconductor die comprising:
a silicon substrate;
a bipolar transistor having collector, emitter, base and sub-collector regions disposed on the substrate; and
a voltage-clamping through-silicon via (TSV) formed at a position within 20 ?m of the sub-collector region and configured
to clamp a peak voltage of the bipolar transistor at a predetermined voltage limit level, the position being selected to provide
said clamping of the peak voltage at the predetermined voltage limit level.

US Pat. No. 9,413,398

CIRCUITS AND METHODS RELATED TO POWER DETECTORS FOR RADIO-FREQUENCY APPLICATIONS

Skyworks Solutions, Inc.,...

1. A power amplifier (PA) system comprising:
a PA circuit including a driver stage and an output stage; and
a detector configured to receive a portion of a radio-frequency (RF) signal from a path between the driver stage and the output
stage and generate a slow-varying or DC voltage as an input voltage Vin representative of power associated with the RF signal,
the detector further configured to generate an output signal representative of power associated with the RF signal and compensated
for variation in at least one operating condition associated with the PA circuit, the output signal based on a compensation
current Iout resulting from a combination of a current Iin representative of the input voltage Vin and at least one operating
condition current representative of the respective at least one operating condition.

US Pat. No. 9,429,975

BAND-GAP REFERENCE CIRCUIT FOR BIASING AN RF DEVICE

SKYWORKS SOLUTIONS, INC.,...

1. A voltage reference circuit, comprising:
a precision voltage generator including a plurality of transistors and configured to provide an output voltage having a first
component that depends on a band-gap of the plurality of transistors and a second component that is proportional to absolute
temperature, the plurality of transistors including a first bipolar transistor and a second bipolar transistor, a base of
the second bipolar transistor connected to a base of the first bipolar transistor;

an enable circuit configured to selectively enable the precision voltage generator based on a voltage of an enable terminal;
and

a mode-control circuit operatively associated with the precision voltage generator and configured to selectively operate the
precision voltage generator in a low power mode based on a voltage of an input terminal.

US Pat. No. 9,189,430

APPARATUS AND METHODS FOR SERIAL INTERFACES

Skyworks Solutions, Inc.,...

1. An integrated circuit operable to communicate over a serial interface, the integrated circuit comprising:
analog circuitry;
a plurality of registers for controlling the operation of the analog circuitry, the plurality of registers accessible over
the serial interface using a shared register address space, the serial interface including an input data signal and an output
data signal, the input data signal including a slave address and a register indicator; and

a distributed slave device including a primary block, a first secondary block, and a shared register mapping table having
entries corresponding to the plurality of registers, the entries including a first set of entries corresponding to a first
portion of the registers electrically connected to the primary block and a second set of entries corresponding to a second
portion of the registers electrically connected to the first secondary block, the distributed slave device selectable over
the serial interface by a first value of the slave address, the primary block electrically connected to the serial interface
and to the first portion of the registers, and the first secondary block electrically connected to the primary block and to
the second portion of the registers, the primary block and the first secondary block configured to receive the slave address
and the register indicator from the serial interface, the primary block including a multiplexer configured to generate the
output data signal of the serial interface based on selecting amongst a plurality of block outputs including an output provided
by the primary block and an output provided by the first secondary block.

US Pat. No. 9,473,019

VARIABLE SWITCHED CAPACITOR DC-DC VOLTAGE CONVERTER

Skyworks Solutions, Inc.,...

1. A voltage conversion system comprising:
a capacitor circuit including capacitors;
a switch matrix configured to interconnect the capacitors differently between a positive voltage potential and an output node
in one of at least two mode configurations in response to a mode selection signal, each of the at least two mode configurations
including a first phase configuration associated with discharging the capacitor circuit and a second phase configuration associated
with charging the capacitor circuit; and

control logic configured to produce the mode selection signal based on a comparison of an output voltage at the output node
and a reference voltage, and based on a comparison involving a different voltage associated with each of the at least two
mode configurations.

US Pat. No. 9,246,443

MULTI-MODE POWER AMPLIFIER

Skyworks Solutions, Inc, ...

1. A power amplifier module comprising:
a power amplifier including a set of transistor stages and a plurality of bias circuits, at least one transistor stage from
the set of transistor stages in electrical communication with a first bias circuit and a second bias circuit from the plurality
of bias circuits, the first bias circuit configured to apply a first bias voltage to the at least one transistor stage and
the second bias circuit configured to apply a second bias voltage to the at least one transistor stage, the plurality of bias
circuits further including a third bias circuit and a fourth bias circuit, the third bias circuit configured to apply a different
bias voltage than the first bias circuit and the fourth bias circuit configured to apply a different bias voltage than the
second bias circuit, the third bias circuit and the fourth bias circuit in electrical communication with a different transistor
stage from the set of transistor stages than the first bias circuit and the second bias circuit; and

a controller configured to activate one of the first bias circuit and the second bias circuit.

US Pat. No. 9,231,533

APPARATUS AND METHODS FOR POWER AMPLIFIERS

Skyworks Solutions, Inc.,...

1. An apparatus comprising:
a substrate;
a power amplifier die on the substrate, the power amplifier die including a power amplifier configured to receive a radio
frequency signal having a fundamental frequency and to provide an amplified radio frequency signal at an output; and

an impedance matching network on the substrate and electrically connected to the output of the power amplifier, the impedance
matching network configured to provide a load line impedance between about 6? and about 10? at the fundamental frequency,
the impedance matching network including a fundamental matching circuit and a harmonic termination circuit, the fundamental
matching circuit and the termination circuit having separate electrical connections to the power amplifier die.

US Pat. No. 9,105,488

DEVICES AND METHODOLOGIES RELATED TO STRUCTURES HAVING HBT AND FET

Skyworks Solutions, Inc.,...

1. A semiconductor structure, comprising:
a heterojunction bipolar transistor (HBT) including first and second collector layers located over a substrate, the first
collector layer including a p-type semiconductor material, the second collector layer including an n-type semiconductor material
and located between the substrate and the first collector layer; and

a p-type field effect transistor (FET) located over the substrate, the FET including a channel corresponding to a first semiconductor
portion formed in the semiconductor material that forms the first collector layer of the HBT and further including a second
semiconductor portion formed in the semiconductor material that forms the second collector layer, an etch stop layer segment
being located over the first collector layer of the HBT and the channel of the FET, between a base layer of the HBT and the
first collector layer.

US Pat. No. 9,252,107

SEMICONDUCTOR PACKAGE HAVING A METAL PAINT LAYER

Skyworks Solutions, Inc.,...

1. A radio-frequency (RF) module comprising:
a packaging substrate configured to receive a plurality of components;
one or more RF components mounted on a surface of the packaging substrate;
a ground plane disposed below the surface of the packaging substrate;
a plurality of shielding-components disposed relative to the one or more RF components and electrically connected to the ground
plane;

an overmold structure formed over the surface of the packaging substrate and dimensioned to substantially encapsulate the
one or more RF components and the shielding-components; and

a conductive paint layer disposed on the upper surface of the overmold structure so that the conductive paint layer, the shielding-components,
and the ground plane are electrically connected to provide RF-shielding for a region associated with the one or more RF components,
the conductive paint layer including approximately 15-30% by weight of silver flakes and 15-25% by weight of acetone.

US Pat. No. 9,294,054

APPARATUS AND METHODS FOR ENVELOPE TRACKERS

SKYWORKS SOLUTIONS, INC.,...

1. A mobile device comprising:
a power amplifier configured to amplify a radio frequency (RF) input signal to generate an RF output signal, wherein the power
amplifier is configured to receive power from a power amplifier supply voltage;

a voltage converter configured to convert a battery voltage into a regulated voltage, the voltage converter configured to
control a magnitude of the regulated voltage based on an error signal;

an error amplifier configured to generate an output current based on an envelope of the RF input signal and to generate the
power amplifier supply voltage using the output current and the regulated voltage, the error amplifier including a first input
configured to receive an envelope signal that changes in relation to the envelope of the RF input signal and a second input,
the error amplifier further configured to control the error signal; and

a feedback circuit electrically connected between the second input of the error amplifier and the power amplifier supply voltage.

US Pat. No. 9,408,154

PROGRAMMABLE TRANSMIT CONTINUOUS-TIME FILTER

Skyworks Solutions, Inc.,...

1. A system comprising:
a programmable-current first continuous time filter (CTF) stage having first amplifier circuitry and first current circuitry,
the first current circuitry configured to provide a first bias current to the first amplifier circuitry, the first bias current
generated in response to first digital programming data;

a programmable-current second CTF stage having an input configured to receive an output of the programmable-current first
CTF stage, second amplifier circuitry, and second current circuitry, the second current circuitry configured to provide a
second bias current to the second amplifier circuitry, the second bias current generated in response to second digital programming
data different from the first digital programming data; and

control logic configured to generate the first and second digital programming data in response to one or more transmitter
control signals.

US Pat. No. 9,065,382

CIRCUITS AND METHODS FOR INCREASING OUTPUT FREQUENCY OF AN LC OSCILLATOR

Skyworks Solutions, Inc.,...

1. A radio-frequency (RF) module comprising:
a packaging substrate configured to receive a plurality of components, the packaging substrate further configured to receive
and connect a plurality of wirebonds to a common electrical potential;

a die mounted on the substrate, the die including an oscillator circuit that includes differential outputs, the die further
including first and second bond pads formed on an upper surface of the die and electrically connected to the differential
outputs;

a first wirebond extending from the first bond pad to the packaging substrate and that connects the first bond pad with the
common electrical potential of the packaging substrate, the first wirebond having an inductance of L1;

a second wirebond extending from the second bond pad to the packaging substrate and that connects the second bond pad with
the common electrical potential of the packaging substrate, the second wirebond having an inductance of L2, the first and second wirebonds being electrically parallel, the first and second wirebonds being spaced from one another
and defining respective first and second planes;

a third wirebond that electrically connects the first and second bond pads, the third wirebond having an inductance of L3, the first, second and third wirebonds in combination having an inductance L? that is lower than an inductance L? corresponding
to a combination of L1 and L2 without L3, the third wirebond extending between first and second terminals of the die and defining a third plane.

US Pat. No. 9,450,579

RADIO FREQUENCY DEVICES HAVING REDUCED INTERMODULATION DISTORTION

Skyworks Solutions, Inc.,...

1. A semiconductor die comprising:
a semiconductor substrate;
a first switch circuit formed on the semiconductor substrate connected between an antenna node and a transmit node;
a second switch circuit formed on the semiconductor substrate and connected between the antenna node and a receive node;
a first capacitor formed on the semiconductor substrate and connected in series with the first switch circuit between the
first switch circuit and the antenna node;

a second capacitor formed on the semiconductor substrate and connected in series with the second switch circuit between the
second switch circuit and the antenna node; and

a first shunt arm formed on the semiconductor substrate and connected to the first switch circuit and the transmit node, the
first shunt arm including a third switch circuit connected to ground.

US Pat. No. 9,258,156

BASEBAND ENVELOPE PREDISTORTER

Skyworks Solutions, Inc.,...

1. A digital predistortion circuit comprising:
digital interface circuitry configured to receive a digital input signal having a signal bandwidth (BW) centered about a frequency
f0and provide a digital transmission signal based on the digital input signal;

digital predistortion circuitry configured to generate a digital correction signal based at least in part on the digital input
signal;

one or more first signal transmission paths configured to transmit the digital transmission signal and including one or more
first digital-to-analog converters (DACs) configured to convert the digital transmission signal to an analog transmission
signal, operation of the one or more first DACs being substantially centered about f0;

one or more second signal transmission paths configured to transmit the digital correction signal, the one or more second
signal transmission paths being separate from the one or more first signal transmission paths and including one or more second
DACs configured to convert the digital correction signal to an analog correction signal, operation of the one or more second
DACs being substantially centered about 0 Hz.

US Pat. No. 9,071,335

RADIO-FREQUENCY MODULES HAVING TUNED SHIELDING-WIREBONDS

Skyworks Solutions, Inc.,...

1. A radio-frequency (RF) module comprising:
a packaging substrate configured to receive a plurality of components;
a plurality of RF components mounted on the packaging substrate and configured to facilitate processing of an RF signal; and
an RF shield disposed relative to at least one of the RF components, the RF shield including a segment configured to provide
a base-level of shielding, the RF shield configured to provide selective shielding capability based on either or both of an
RF emission pattern and height dimensions associated with the RF components, the selective shielding capability provided by
an enhanced segment of the RF shield configured to provide an enhanced level of shielding that is greater than the base-level.

US Pat. No. 9,418,950

MULTIPLE BAND MULTIPLE MODE TRANSCEIVER FRONT END FLIP-CHIP ARCHITECTURE AND CIRCUITRY WITH INTEGRATED POWER AMPLIFIERS

SKYWORKS SOLUTIONS, INC.,...

1. An integrated circuit architecture defined by a die structure with a plurality of exposed conductive pads arranged in a
grid of rows and columns, the integrated circuit architecture comprising:
a first operating frequency region of the die structure including a first transmit chain with at least one first operating
frequency power amplifier and a first receive chain including at least one first operating frequency low noise amplifier;

a second operating frequency region of the die structure including a second transmit chain with at least one second operating
frequency power amplifier and a second receive chain including at least one second operating frequency low noise amplifier;
and

a shared region of the die structure defined by an overlapping segment of the first operating frequency region and the second
operating frequency region, the shared region including at least one of a shared power input conductive pad connected to the
first transmit chain, the second transmit chain, the first receive chain, and the second receive chain, and a shared power
detection output conductive pad connected to the first transmit chain and the second transmit chain;

a shared voltage regulator disposed in the shared region of the die structure and connected to the shared power input pad,
the shared voltage regulator including a first operating frequency regulated power output connected to the first transmit
chain and the first receive chain, and a second operating frequency regulated power output connected to the second transmit
chain and the second receive chain.

US Pat. No. 9,231,606

DITHER-LESS ERROR FEEDBACK FRACTIONAL-N FREQUENCY SYNTHESIZER SYSTEMS AND METHODS

Skyworks Solutions, Inc.,...

1. A dither-less delta-sigma modulator configured to generate a cyclic output code, the dither-less delta-sigma modulator
comprising a feedback filtering network including a first feedback loop, a second feedback loop that includes a gain circuit
configured to introduce a small error signal into the first feedback loop to disrupt tonal behavior due to the cyclic output
code, and a third feedback loop that includes a filter electrical coupled to the gain circuit and configured to periodically
cancel the small error signal in the second feedback loop to reduce static error.

US Pat. No. 9,106,183

VARIABLE SWITCHED DC-TO-DC VOLTAGE CONVERTER

Skyworks Solutions, Inc.,...

1. A multi-chip module comprising:
a power amplifier die including one or more power amplifiers; and
a controller die including control logic of a direct current to direct current (DC-DC) converter, the control logic configured
to compare a plurality of voltages generated from a supply voltage to a reference voltage that is independent of the supply
voltage and to generate one or more control signals based at least partly on the comparisons, the DC-DC converter configured
to generate an output voltage based on the one or more control signals and provide the output voltage to the power amplifier
die.

US Pat. No. 9,197,128

APPARATUS AND METHODS FOR VOLTAGE CONVERTER BYPASS CIRCUITS

SKYWORKS SOLUTIONS, INC.,...

1. A voltage conversion system comprising:
a voltage converter including an inductor, a plurality of switches, and a bypass circuit, the bypass circuit including a first
p-type field effect transistor, a second p-type field effect transistor, a first n-type field effect transistor, and a second
n-type field effect transistor, the first and second n-type field effect transistors electrically connected in series between
a first end and a second end of the inductor, and the first and second p-type field effect transistor transistors electrically
connected in series between the first end and the second end of the inductor; and

a control circuit configured to selectively open or close the plurality of switches to control an inductor current through
the inductor, the control circuit further configured to selectively activate the bypass circuit to reduce ringing of the inductor
current.

US Pat. No. 9,124,230

DB-LINEAR VOLTAGE-TO-CURRENT CONVERTER

Skyworks Solutions, Inc.,...

1. A method comprising:
multiplying a first current and a current proportional to absolute temperature to generate a second current;
applying an exponential transfer function to the second current to generate an output current; and
imposing at least one of an upper limit and a lower limit on the output current, imposing the lower limit including directly
coupling a first reference-current source to an output terminal and generating a first reference current with the first reference-current
source to set the lower limit, and imposing the upper limit including coupling a second reference-current source to a first
input of an operational amplifier, connecting an output and a second input of the operational amplifier via a feedback loop,
applying the output current to the second input of the operational amplifier, coupling first and second current mirrors between
the second input of the operational amplifier and the output terminal, and generating a second reference current with the
second reference-current source to set the upper limit.

US Pat. No. 9,068,918

ELECTRON RADIATION MONITORING SYSTEM TO PREVENT GOLD SPITTING AND RESIST CROSS-LINKING DURING EVAPORATION

SKYWORKS SOLUTIONS, INC.,...

1. A system for detecting impurities in a metal slug from which metal is evaporated during operation of an electron-beam metal
evaporation and deposition apparatus, the system comprising:
an electrode to be positioned within a vacuum chamber of the electron-beam metal evaporation and deposition apparatus and
to collect electrons backscattered from the metal slug;

one or more insulating standoffs to support the electrode in a position in which there is an unobstructed straight line path
between a portion of the electrode and a surface of the metal slug and to provide an unobstructed straight line path between
a surface of the metal slug and a wafer positioned for processing in the electron-beam metal evaporation and deposition apparatus;

an electrical meter to receive a first signal from the electrode and output a second signal responsive to the receipt of the
first signal; and

a controller programmed to receive the second signal from the electrical meter and provide an indication of an impurity concentration
in the metal slug responsive to a characteristic of the second signal.

US Pat. No. 9,450,541

SYSTEMS AND METHODS RELATED TO LINEAR AND EFFICIENT BROADBAND POWER AMPLIFIERS

Skyworks Solutions, Inc.,...

1. A power amplifier (PA) system comprising:
an input circuit configured to receive a radio-frequency (RF) signal at an input port and split the RF signal into a first
portion and a second portion;

a Doherty amplifier circuit including a carrier amplification path coupled to the input circuit to receive the first portion
and a peaking amplification path coupled to the input circuit to receive the second portion, the input circuit including an
isolation resistance implemented between a first node along a first path coupling the input port to the carrier amplification
path and a second node along a second path coupling the input port to the peaking amplification path, the isolation resistance
being selected to prevent or reduce a source-pulling effect between the carrier amplification path and the peaking amplification
path; and

an output circuit coupled to the Doherty amplifier circuit, the output circuit being configured to combine outputs of the
carrier amplification path and the peaking amplification path to yield an amplified RF signal.

US Pat. No. 9,257,940

APPARATUS AND METHODS FOR CAPACITIVE LOAD REDUCTION

SKYWORKS SOLUTIONS, INC.,...

1. A power amplifier system comprising:
a first power amplifier configured to receive a power amplifier supply voltage, the first power amplifier having an enabled
state and a disabled state;

a supply control circuit configured to control a voltage level of the power amplifier supply voltage;
a first switchable capacitor;
a first field effect transistor (FET) electrically connected in series with the first switchable capacitor between the power
amplifier supply voltage and a first voltage; and

a power amplifier control circuit configured to control a voltage level of a gate of the first FET, the power amplifier control
circuit configured to bias the first FET in a linear mode of operation when the first power amplifier is enabled to provide
stability to the first power amplifier, the power amplifier control circuit further configured to turn off the first FET when
the first power amplifier is disabled to reduce a capacitive loading of the supply control circuit.

US Pat. No. 9,246,437

SWITCHING SYSTEM WITH LINEARIZING CIRCUIT

SKYWORKS SOLUTIONS, INC.,...

1. A switching system, comprising:
a switch including one or more transistors; and
a linearizing circuit including a reference resistance and a replica switching element circuit including one or more transistors,
the linearizing circuit configured to control the replica switching element circuit to maintain a voltage drop across the
replica switching element circuit at a level that corresponds to a voltage drop across the reference resistance, an output
of the linearizing circuit responsive to the replica control signal to promote linearization of the switch, the switch responsive
to one or more local oscillator (LO) signals of a radio-frequency circuit.

US Pat. No. 9,467,124

VOLTAGE GENERATOR WITH CHARGE PUMP AND RELATED METHODS AND APPARATUS

SKYWORKS SOLUTIONS, INC.,...

12. An electronic system comprising:
a voltage generator including a hysteretically-controlled charge pump;
a level shifter configured to receive an output voltage from the voltage generator; and
a semiconductor-on-insulator radio frequency (RF) switch configured to receive a signal from the level shifter.

US Pat. No. 9,276,570

RADIO-FREQUENCY SWITCH HAVING GATE NODE VOLTAGE COMPENSATION NETWORK

Skyworks Solutions, Inc.,...

1. A radio-frequency (RF) switch comprising:
a first field-effect transistor (FET) having a first gate node;
a second FET connected in series with the first FET, the second FET having a second gate node;
a third FET connected in series with the second FET, the third FET having a third gate node;
a first capacitor that blocks DC current flow between the first gate node and the second gate node and passes AC current between
the first gate node and the second gate node;

a second capacitor directly connected at a first end to the second gate node and directly connected at a second end to the
third gate node; and

a first resistor directly connected at a first end to the first gate node and directly connected at a second end to a gate
bias voltage node coupled to the first, second and third gate nodes, the first resistor being in parallel with the first capacitor.

US Pat. No. 9,236,851

PHASE-LOCKED LOOP BASED CONTROLLER FOR ADJUSTING AN ADAPTIVE CONTINUOUS-TIME FILTER

Skyworks Solutions, Inc.,...

1. An apparatus comprising:
an adaptive continuous-time filter including a first array of elements and a control input configured to receive an output
word that generates a filter response to account for effects of semiconductor process variation in the first array of elements;
and

a controller configured to generate a digital word responsive to a time constant, to compare a select bit of the digital word
to a corresponding reference word to generate a control bit, to apply the control bit to an adjustable element to modify the
time constant, and to provide the output word to the adaptive continuous-time filter.

US Pat. No. 9,153,551

INTEGRATED CIRCUIT PACKAGE INCLUDING IN-SITU FORMED CAVITY

SKYWORKS SOLUTIONS, INC.,...

1. A flip chip packaged component comprising:
a die having a first surface;
a dielectric barrier disposed on the first surface of the die, the dielectric barrier at least partially surrounding a designated
location on the first surface of the die;

a plurality of bumps disposed on the first surface of the die, the plurality of bumps being located on an opposite side of
the dielectric barrier from the designated location;

a substrate including a plurality of bonding pads on a second surface of the substrate, the die bonded to the substrate in
a flip chip configuration, the plurality of bumps bonded to the plurality of bonding pads, the dielectric barrier contacting
the substrate;

a cavity defined by the first surface of the die, the dielectric barrier, and the substrate, the cavity being proximate the
designated location on the first surface of the die; and

a molding compound encapsulating the die and at least a portion of the substrate, the molding compound underfilling a portion
of the die and contacting the opposite side of the dielectric barrier from the designated location, the dielectric barrier
preventing the molding compound from entering the cavity.

US Pat. No. 9,473,073

VARIABLE SWITCHED DC-TO-DC VOLTAGE CONVERTER

Skyworks Solutions, Inc.,...

1. An apparatus comprising:
a capacitor circuit including capacitors;
a switch matrix configured to charge and to discharge the capacitors in each of at least two mode configurations, the switch
matrix configured to operate in a selected one of the at least two mode configurations responsive to one or more mode selection
signals, the switch matrix including at least a first switch that includes sub-switches in parallel with each other, and at
least one of the sub-switches is configured to receive a different switch control signal than another of the sub-switches;
and

control logic configured to generate a first signal indicative of whether a voltage corresponding to a first mode of the at
least two mode configurations is greater than a reference voltage and to produce the one or more mode selection signals based
on the first signal.

US Pat. No. 9,407,215

CIRCUITS AND METHODS RELATED TO LOW-NOISE AMPLIFIERS HAVING IMPROVED LINEARITY

SKYWORKS SOLUTIONS, INC.,...

1. A radio-frequency (RF) amplifier circuit comprising:
a first amplifying transistor configured to amplify an RF signal;
a switchable inductance circuit that couples the first amplifying transistor to a signal ground, the switchable inductance
circuit configured to be capable of having a selected one of a plurality of different inductance values that yield different
linearity levels for the RF amplifier circuit; and

a processing device configured to determine a linearity mode of the RF amplifier circuit and to control the switchable inductance
circuit to have the selected one of the plurality of different inductance values based on the determined linearity mode.

US Pat. No. 9,355,444

SYSTEMS AND METHODS FOR PROCESSING PACKAGED RADIO-FREQUENCY MODULES IDENTIFIED AS BEING POTENTIALLY DEFECTIVE

Skyworks Solutions, Inc.,...

1. A method of identifying potentially defective individual packaged modules, the method comprising:
receiving a Printed Circuit Board (PCB) including a set of individual module substrates;
capturing an image of a first side of the PCB;
determining, using the image, whether the set of individual module substrates includes inked individual module substrates,
the inked individual module substrates including ink markings on the first side of the PCB and the ink markings identifying
the inked individual module substrates as potentially defective; and

in response to determining that the set of individual module substrates includes inked individual module substrates, creating
a map of the inked individual module substrates and marking, with a laser, locations on a second side of the PCB corresponding
to inked individual module substrates, the locations identified via the map, the second side of the PCB substantially parallel
to the first side of the PCB.

US Pat. No. 9,136,803

APPARATUS AND METHODS FOR BIASING A POWER AMPLIFIER

SKYWORKS SOLUTIONS, INC.,...

1. A mobile device comprising:
a transmitter configured to generate a radio frequency (RF) signal and an enable signal;
a power amplifier configured to receive the RF signal and a bias current, the power amplifier having an enabled state and
a disabled state, the power amplifier configured to amplify the RF signal in the enabled state; and

a bias circuit configured to receive the enable signal and to generate the bias current of the power amplifier based on the
enable signal, the bias circuit including a time-dependent signal generator configured to shape the enable signal to generate
a control current, a current amplifier configured to amplify the control current to generate a correction current, and a primary
biasing circuit configured to generate the bias current based on the correction current, the bias circuit configured to adjust
a magnitude of the bias current over time to compensate for a variation in gain of the power amplifier associated with transitioning
the power amplifier from the disabled state to the enabled state, the time-dependent signal generator including a resistor-capacitor
(RC) network including an input configured to receive the enable signal and an output configured to generate the control current,
the RC network including a first resistor and a first capacitor electrically connected in series between the input of the
time-dependent signal generator and the output of the time-dependent signal generator, the RC network further including a
second resistor having a first end electrically connected to the input of the time-dependent signal generator and a second
end electrically connected to the output of the time-dependent signal generator.

US Pat. No. 9,118,277

APPARATUS AND METHODS FOR ENVELOPE TRACKING IN RADIO FREQUENCY SYSTEMS

SKYWORKS SOLUTIONS, INC.,...

1. An envelope tracker for supplying power to a power amplifier that amplifies a radio frequency (RF) signal, the envelope
tracker comprising:
an output configured to generate a power amplifier supply voltage;
a digital control circuit configured to generate a plurality of control signals based on a digital envelope signal corresponding
to a digital representation of an envelope of the RF signal;

a buck converter including an output electrically connected to the output of the envelope tracker, the plurality of control
signals configured to control one or more switches of the buck converter;

a push digital-to-analog converter (DAC) including an output electrically connected to the output of the envelope tracker,
the plurality of control signals further configured to control a magnitude of a first current generated at the output of the
push DAC; and

a pull DAC including an output electrically connected to the output of the envelope tracker, the plurality of control signals
further configured to control a magnitude of a second current generated at the output of the pull DAC, the plurality of control
signals configured to control the buck converter to track low frequency components of the digital envelope signal, and to
control the push DAC and the pull DAC to track high frequency components of the digital envelope signal.

US Pat. No. 9,362,925

CIRCUITS AND METHODS FOR ELIMINATING REFERENCE SPURS IN FRACTIONAL-N FREQUENCY SYNTHESIS

Skyworks Solutions, Inc.,...

1. A circuit comprising:
a phase frequency detector (PFD) configured to receive a reference signal and a feedback signal, the PFD further configured
to generate a first signal based on the reference signal and the feedback signal; and

a compensation circuit configured to receive the first signal, the compensation circuit including a charging circuit, a charge
pump, and a voltage-to-current converter positioned between the charging circuit and the charge pump, the charging circuit
including a capacitance element, a charging switch configured to facilitate charging of the capacitance element in response
to the first signal, and a drain switch configured to facilitate draining of the charge in the capacitance element, the compensation
circuit further configured to generate a compensation signal based on the received first signal.

US Pat. No. 9,294,073

CMOS RF SWITCH DEVICE AND METHOD FOR BIASING THE SAME

Skyworks Solutions, Inc.,...

1. A method for controlling amplification radio frequency signals, the method comprising:
determining whether to amplify a radio frequency (RF) signal by a first gain achievable by a first circuit or a second gain
achievable by a second circuit, amplification of the first and second circuits respectively configured to be turned on or
off by first and second switches, each of the first and second switches being a triple-well CMOS switch and including an isolated
well about a source, a gate, and a drain of the respective switch, the first switch in the on state and the second switch
in the off state resulting in the RF signal being amplified by the first gain, and the first switch in the off state and the
second switch in the on state resulting in the RF signal being amplified by the second gain;

applying or inducing application of a first bias voltage to the isolated well of the first switch upon determination that
the RF signal is to be amplified by the first gain; and

applying or inducing application of a second bias voltage different than the first bias voltage to the isolated well of the
first switch upon determination that the RF signal is to be amplified by the second gain.

US Pat. No. 9,263,175

RARE EARTH REDUCED GARNET SYSTEMS AND RELATED MICROWAVE APPLICATIONS

Skyworks Solutions, Inc.,...

1. A synthetic garnet material comprising a structure including dodecahedral sites, Bismuth occupying at least some of the
dodecahedral sites, the garnet material having a dielectric constant value of at least 21, the synthetic garnet material being
substantially free of rare earth and having the formula Bi1.4Ca1.6Zr0.55V0.525Fe3.925O12.

US Pat. No. 9,214,967

CIRCUITS AND METHODS FOR REDUCING INSERTION LOSS EFFECTS ASSOCIATED WITH RADIO-FREQUENCY POWER COUPLERS

Skyworks Solutions, Inc.,...

1. A radio-frequency (RF) circuit comprising:
a first amplification path including an output match network for a first RF signal in a first band;
a second amplification path including an output match network for a second RF signal in a second band;
a power detector including a first coupler configured to detect power along the first amplification path, and a second coupler
configured to detect power along the second amplification path, the first coupler and the second coupler implemented in a
daisy-chain configuration; and

an adjustment circuit including an inductance implemented between the second output match network and the second coupler of
the second path, the adjustment circuit configured to move a frequency response feature associated with the first amplification
path and resulting at least in part from the second coupler, away from the first band.

US Pat. No. 9,328,029

METHODS OF PREPARING NOVEL ENHANCED HIGH Q MATERIAL COMPOSITIONS

Skyworks Solutions, Inc.,...

1. A method of modifying the Q of a ceramic material having an orthorhombic tungsten bronze structure, said method comprising
substituting one or more Al atoms with one or more ions, the substituted ceramic material having a primary phase and one of
additional phases comprising a perovskite.

US Pat. No. 9,265,113

SINGLE WIRE SERIAL INTERFACE

Skyworks Solutions, Inc.,...

1. A power integrated circuit device having at least one input and at least one output, comprising:
a core circuit that produces the at least one output of the power integrated circuit; and
an interface in communication with the core circuit, the interface including (i) counter circuitry that generates a count
value based on pulses encoded in an input signal received via a single input of the power integrated circuit, (ii) latch driver
circuitry that asserts a latch signal when the input signal is maintained high for a period that exceeds a predetermined latch
timeout value, (iii) a latch that stores the count value based on the latch signal being asserted, (iv) decoder circuitry
that associates the count value in the latch with a corresponding lighting control state that is communicated to a light source
via the at least one output, and (v) sensing circuitry that determines whether the input signal is high or low so that the
count value is maintained while the input signal is high, and the count value is reset in response to the input signal being
low for a period that exceeds a predetermined timeout value, the predetermined timeout value being longer than a width of
one of the pulses.

US Pat. No. 9,214,979

DUAL MODE POWER AMPLIFIER CONTROL INTERFACE WITH A MULTI-MODE GENERAL PURPOSE INPUT/OUTPUT INTERFACE

Skyworks Solutions, Inc.,...

1. A power amplifier module comprising:
a power amplifier configured to amplify a radio frequency (RF) signal;
a power amplifier controller; and
a digital control interface configured to provide a set of control signals to the power amplifier controller, the power amplifier
controller configured to control the power amplifier based on the set of control signals, the digital control interface including
a voltage input/output (VIO) pin, a serial interface module, and a general purpose input/output (GPIO) interface module, the
serial interface module including a serial interface core configured to provide a serial interface when active, the serial
interface core activated in response to a first voltage signal received by the VIO pin, and the GPIO interface module configured
to provide a GPIO interface responsive to a second voltage signal received by the VIO pin, the serial interface core deactivated
in response to the second voltage signal.

US Pat. No. 9,093,969

SYSTEMS, CIRCUITS AND METHODS RELATED TO CONTROLLERS FOR RADIO-FREQUENCY POWER AMPLIFIERS

Skyworks Solutions, Inc.,...

1. A radio-frequency power amplifier control circuit, comprising:
a first circuit configured to generate a replica base current from a base current provided to a power amplifier (PA), the
replica base current representative of a collector current of the PA scaled by a beta parameter;

a second circuit configured to generate a beta-tracking reference current from a temperature-compensated voltage and a base
resistance associated with the PA; and

a current steering circuit configured to generate a proportional current based on the replica base current and the beta-tracking
reference current.

US Pat. No. 9,712,125

POWER AMPLIFICATION SYSTEM WITH SHARED COMMON BASE BIASING

Skyworks Solutions, Inc.,...

1. A power amplification system comprising:
a plurality of cascode amplifier sections, each one of the plurality of cascode amplifier sections including a first transistor
and a second transistor;

a plurality of common emitter biasing components, each one of the plurality of common emitter biasing components coupled to
a base of the first transistor of a respective one of the plurality of cascode amplifier sections and controllable to bias
the first transistor of the respective one of the plurality of cascode amplifier sections;

a common base biasing component coupled to a base of the second transistor of each of the plurality of cascode amplifier sections
and controllable to bias the second transistor of each of the plurality of cascode amplifier sections; and

a controller configured to control the plurality of common emitter biasing components based on a band select signal.

US Pat. No. 9,419,667

APPARATUS AND METHODS RELATED TO CONFORMAL COATING IMPLEMENTED WITH SURFACE MOUNT DEVICES

Skyworks Solutions, Inc.,...

1. A method for fabricating a radio-frequency (RF) module, the method comprising:
providing a packaging substrate configured to receive a plurality of components, the packaging substrate including a ground
plane;

mounting a surface mount device (SMD) on the packaging substrate, the SMD including a metal layer that faces upward when mounted
and the SMD including an RF filter;

forming an overmold over the packaging substrate, the overmold covering the SMD;
forming an opening through the overmold at a region over the SMD to expose at least a portion of the metal layer; and
forming a conductive layer over the overmold, the conductive layer filling at least a portion of the opening to provide an
electrical path between the conductive layer, the metal layer of the SMD, and the ground plane.

US Pat. No. 9,225,349

DITHER-LESS MULTI-STAGE NOISE SHAPING FRACTIONAL-N FREQUENCY SYNTHESIZER SYSTEMS AND METHODS

Skyworks Solutions, Inc.,...

1. A circuit assembly for use in multi-stage noise shaping (MASH) modulator configured to generate a cyclic code sequence,
the circuit assembly comprising:
a first dither-less delta-sigma modulator providing a first cyclic output code and including a first modulator feedback loop
and a first scaling feedback loop that includes a first gain circuit configured to introduce a first scaled version of the
first cyclic output code into the first modulator feedback loop to disrupt tonal behavior due to the first cyclic output code,
the first dither-less delta-sigma modulator further including a first filter configured to process a first error signal provided
by the first modulator feedback loop to provide a first modulator feedback signal; and

a second dither-less delta-sigma modulator providing a second cyclic output code and including a second modulator feedback
loop and a second scaling feedback loop that includes a second gain circuit configured to introduce a second scaled version
of the second cyclic output code into the second modulator feedback loop to disrupt tonal behavior due to the second cyclic
output code, the second dither-less delta-sigma modulator further including a second filter configured to process a second
error signal provided by the second modulator feedback loop to provide a second modulator feedback signal.

US Pat. No. 9,788,466

APPARATUS AND METHODS RELATED TO GROUND PATHS IMPLEMENTED WITH SURFACE MOUNT DEVICES

Skyworks Solutions, Inc.,...

1. A radio-frequency (RF) module comprising:
a packaging substrate configured to receive a plurality of components, the packaging substrate including a ground plane;
a conductive layer implemented over the packaging substrate;
a surface mount device (SMD) mounted on the packaging substrate, the surface mount device configured to electrically connect
the conductive layer with the ground plane, the surface mount device providing RF shielding between first and second regions
about the surface mount device, the first and second regions being within the radio-frequency module, and the first and second
regions being on opposite sides of the surface mount device;

an overmold formed over the packaging substrate, the overmold encapsulating the surface mount device; and
an opening defined in the overmold at a region over the surface mount device, the opening having sufficient depth to expose
a region of the surface mount device and the opening having a chamfer profile.

US Pat. No. 9,419,568

CIRCUITS AND METHODS RELATED TO POWER AMPLIFIER EFFICIENCY BASED ON MULTI-HARMONIC APPROXIMATION

Skyworks Solutions, Inc.,...

1. An output network circuit for multi-harmonic control of a radio-frequency (RF) power amplifier, the circuit comprising:
an impedance matching network having an input and an output, and configured for a fundamental frequency (f0) of the power amplifier;

a broadband harmonic trap having an input and an output, the output of the broadband harmonic trap coupled to the input node
of the impedance matching network, the broadband harmonic trap configured to substantially trap a plurality of harmonics associated
with the fundamental frequency; and

a dipole network having an input and an output, the output of the dipole network coupled to the input node of the broadband
harmonic trap, the input of the dipole network coupled to an output of an amplifying transistor of the RF power amplifier,
the dipole network configured to tune reactances resulting from the operation of the broadband harmonic trap.

US Pat. No. 9,313,079

CIRCUITS, SYSTEMS, AND METHODS FOR MANAGING AUTOMATIC GAIN CONTROL IN QUADRATURE SIGNAL PATHS OF A RECEIVER

Skyworks Solutions, Inc.,...

1. A circuit comprising:
an analog controller configured to generate an analog control signal in response to receiving a gain value from a baseband
system and a first calibration value;

a digital controller configured to generate a digital control signal based on the gain value from the baseband system, a delayed
analog control signal created from the analog control signal, and a second calibration value; and

a switching element configured to control the distribution of the gain value from the baseband system to the analog controller
and the digital controller.

US Pat. No. 9,070,732

BIPOLAR TRANSISTOR HAVING COLLECTOR WITH DOPING SPIKE

Skyworks Solutions, Inc.,...

1. A bipolar transistor comprising a collector having a first end and a second end opposite the first end, a sub-collector
abutting the second end of the collector, a base abutting the first end of the collector at a base-collector junction, and
an emitter, the collector having a doping spike disposed closer to the base-collector junction than to the second end of the
collector, the doping spike extending substantially an entire length of the collector in a direction substantially parallel
to the base-collector junction, and the collector also having a doped portion disposed between the doping spike and the base,
the bipolar transistor being a single heterojunction bipolar transistor.

US Pat. No. 9,455,755

AGGREGATE SIGNAL AMPLIFICATION DEVICE AND METHOD

Skyworks Solutions, Inc.,...

1. A device for amplifying aggregate signals comprising:
at least one filter that receives either an aggregate signal having a plurality of signal components of different frequency
bands and separates the aggregate signal into a plurality of sub-signals of different frequency bands onto a plurality of
outputs or an non-aggregate signal having a single signal component that is provided to at least one of the plurality of outputs;

a plurality of amplifiers that are connected to the plurality of outputs to receive the plurality of sub-signals from the
plurality of different outputs and amplify the plurality of sub-signals; and

a network connected between the plurality of outputs, the network having components selected to terminate at least a portion
of the signals on the plurality of outputs that have a frequency outside of the frequency band corresponding to the output
the network being switchable between a first configuration where the network components are terminating at least a portion
of the signals on the plurality of outputs when an aggregate signal is received and a second configuration where the network
components are not terminating at least a portion of the signal on the plurality of outputs when a non-aggregate signal is
received.

US Pat. No. 9,203,529

VIA PLACEMENT IN RADIO FREQUENCY SHIELDING APPLICATIONS

Skyworks Solutions, Inc.,...

1. A wireless device comprising:
an antenna configured to facilitate at least one of transmitting or receiving a radio-frequency (RF) signal;
a packaged module in communication with the antenna, the packaged module including a ground contact configured to receive
a ground potential; a plurality of vias in a substrate, the plurality of vias disposed along a periphery of the packaged module,
and vias of the plurality of vias being spaced closer together along the periphery of the packaged module in a hot spot than
in a low radiating area; a conductive trace disposed along the periphery of the substrate and in a different layer of the
substrate than the plurality of vias; an RF circuit coupled to a major surface of the substrate; and a conductive layer disposed
over the RF circuit, the conductive layer electrically coupled to the plurality of vias and the ground contact such that the
plurality of vias and the conductive layer form at least a portion of an RF isolation structure around the RF circuit, and
the conductive trace being included in an electrical connection between the conductive layer and the ground contact; and

an other module in communication with the packaged module.

US Pat. No. 9,443,803

DEVICES AND METHODS RELATED TO A SPUTTERED TITANIUM TUNGSTEN LAYER FORMED OVER A COPPER INTERCONNECT STACK STRUCTURE

Skyworks Solutions, Inc.,...

1. A metalized structure for a compound semiconductor device, the structure comprising:
a stack disposed over a substrate associated with the compound semiconductor device, the stack including an ohmic metal layer,
a barrier disposed over the ohmic metal layer, and a copper (Cu) layer disposed over the barrier, the barrier including a
first titanium (Ti) layer, a barrier layer disposed over the first Ti layer, and a second titanium (Ti) layer disposed over
the barrier layer, the barrier configured to reduce migration of metal atoms between the ohmic metal layer and the Cu layer;
and

a sputtered titanium tungsten (TiW) layer disposed over the stack and at least partially covering a top surface and a side
surface of the stack.

US Pat. No. 9,054,065

BIPOLAR TRANSISTOR HAVING COLLECTOR WITH GRADING

Skyworks Solutions, Inc.,...

21. A power amplifier module comprising a bipolar transistor having a collector, a base, and an emitter, the collector having
a doping concentration of at least 5×1016 cm?3 at a junction with the base such that the power amplifier has an alternative channel power ratio (ACPR2) of no greater than
about ?65 dBc, the collector also having at least a first grading having a minimum doping concentration of about one order
of magnitude less than the doping concentration at the junction with the base, the first grading being a continuous grading
and having a doping concentration that increases away from the base.

US Pat. No. 9,372,222

SYSTEM AND METHOD FOR CHARACTERIZING A PROCESS BY WHICH A SEMICONDUCTOR DEVICE IS FORMED

SKYWORKS SOLUTIONS, INC.,...

1. A semiconductor process sensor, the semiconductor process sensor comprising:
a constant reference voltage source configured to generate a constant reference voltage signal; and
a process sensor element coupled to the constant reference voltage source and configured to receive the constant reference
voltage signal, sense a process parameter indicative of a semiconductor process by which the semiconductor process sensor
was formed, and generate, based upon the sensed process parameter, a process measurement signal that characterizes the semiconductor
process by which the semiconductor process sensor was formed as one of nominal, above-nominal, or below-nominal.

US Pat. No. 9,295,157

RACETRACK DESIGN IN RADIO FREQUENCY SHIELDING APPLICATIONS

Skyworks Solutions, Inc.,...

1. A packaged module comprising:
a substrate configured to receive at least one component;
a radio frequency (RF) component coupled to a major surface of the substrate; and
an RF isolation structure including a racetrack disposed below the major surface of the substrate such that the major surface
of the substrate is between the racetrack and the RF component, the racetrack configured at a ground potential and disposed
around the RF component in the substrate, and the racetrack having at least one break and at least one narrowed section, the
RF isolation structure further including a conductive layer disposed above the RF component and one or more conductive features
disposed between the racetrack and the conductive layer, the one or more conductive features configured to provide at least
a portion of an electrical connection from the racetrack to the conductive layer.

US Pat. No. 9,202,747

SEGMENTED CONDUCTIVE TOP LAYER FOR RADIO FREQUENCY ISOLATION

Skyworks Solutions, Inc.,...

1. An apparatus, comprising:
a substrate;
first and second radio frequency devices mounted on a surface of the substrate;
a first conductive ground layer disposed at least partially below the first radio frequency device;
a plurality of wirebond structures disposed on the surface of the substrate between the first radio frequency device and the
second radio frequency device;

a molding dimensioned to encapsulate the first and second radio frequency devices and at least a portion of each of the wirebond
structures;

a first conductive top layer disposed at least partially above the first radio frequency device and in electrical contact
with one or more of the plurality of wirebond structures such that the first conductive ground layer, the one or more of the
plurality of wirebond structures, and the first conductive top layer form a radio frequency barrier between the first radio
frequency device and the second radio frequency device; and

a second conductive top layer disposed at least partially above the second radio frequency device, the second conductive top
layer being at least partially electrically isolated from the first conductive top layer.

US Pat. No. 9,083,455

REDUCED CLOCK FEED-THROUGH SYSTEMS, METHODS AND APPARATUS

Skyworks Solutions, Inc.,...

1. An apparatus comprising:
a controllable electrical source including at least two sub-circuits, each sub-circuit configured to receive a respective
control signal and draw from a supply in response to receiving the respective control signal; and

a control signal generator configured to provide at least two control signals separated by at least one non-zero phase difference;
and

a dither generator configured to dither at least one of the at least two control signals provided by the control signal generator.

US Pat. No. 9,295,128

SINGLE WIRE SERIAL INTERFACE

Skyworks Solutions, Inc.,...

1. A backlight driver, comprising:
circuitry configured to count pulses in a received signal to yield a count value, generate a control state for a light source
in response to the pulses, generate an output that controls the light source in response to the control state, and reset the
control state in response to the received signal having a state that exceeds a timeout duration, the timeout duration being
longer than a width of at least one of the pulses.

US Pat. No. 9,287,226

APPARATUS AND METHODS FOR REDUCING IMPACT OF HIGH RF LOSS PLATING

SKYWORKS SOLUTIONS, INC.,...

1. An electronic circuit module configured to reduce signal losses, the electronic circuit module comprising:
an electronic circuit device including a first lead, a second lead, a radio frequency (RF) output, and an integrated circuit
die associated with a passive component; and

a conductive path having a first bonding pad electrically connected to the first lead and a second bonding pad located on
the conductive path between the first bonding pad and an output of the electronic circuit module and electrically connected
to the second lead, the electronic circuit device configured such that the passive component electrically connects to the
first lead and the RF output of the electronic circuit device electrically connects to the second lead.

US Pat. No. 9,048,284

INTEGRATED RF FRONT END SYSTEM

Skyworks Solutions, Inc.,...

1. An integrated front-end module comprising:
a silicon substrate having a high-resistivity portion;
a bipolar transistor featuring a silicon or silicon-germanium alloy base disposed on the substrate above the high-resistivity
portion;

one or more passive devices disposed on the substrate above the high-resistivity portion; and
a low-resistivity well located between the bipolar transistor and the one or more passive devices, the low-resistivity well
providing at least partial electrical isolation between the bipolar transistor and the one or more passive devices.

US Pat. No. 9,362,960

WIRELESS DEVICES HAVING REDUCED CLOCK FEED-THROUGH

SKYWORKS SOLUTIONS, INC.,...

1. A wireless device comprising:
one or more front-end modules configured to facilitate processing of a plurality of radio-frequency (RF) signals;
an antenna;
an RF switch configured to route at least a portion of the plurality of RF signals between the antenna and the one or more
front-end modules based on a mode of operation of the wireless device; and

a switch controller configured to control the RF switch, the switch controller including a controllable electrical source
having at least two sub-circuits configured to receive at least two control signals, each sub-circuit configured to receive
a respective control signal of the at least two control signals and to draw from a supply in response to an edge of the respective
control signal, the switch controller further including a control signal generator configured to provide the at least two
control signals to the controllable electrical source such that the at least two control signals are separated by at least
one non-zero phase difference.

US Pat. No. 9,059,702

SWITCH LINEARIZATION BY NON-LINEAR COMPENSATION OF A FIELD-EFFECT TRANSISTOR

Skyworks Solutions, Inc.,...

1. A radio-frequency (RF) switch comprising:
a plurality of field-effect transistors (FETs) disposed between a first node and a second node, each of the plurality of FETs
having a respective source, drain, gate, and body, the plurality of FETs including a first FET connected in series with a
second FET; and

a compensation circuit including a non-linear capacitor connected at a first end to both the source of the first FET and the
drain of the second FET, and further connected at a second end to a ground reference, the compensation circuit configured
to compensate a non-linearity effect generated by at least one of the plurality of FETs.

US Pat. No. 9,372,495

DB-LINEAR VOLTAGE-TO-CURRENT CONVERTER

Skyworks Solutions, Inc.,...

1. A current limiter comprising:
a first reference-current source directly coupled to an output terminal, the first reference-current source configured to
generate a first reference current;

an amplifier having a first input, a second input, and an amplifier output, the second input and the amplifier output electrically
connected via a feedback loop, the second input configured to receive an input current;

a second reference-current source electrically coupled to the first input of the amplifier, the second reference-current source
configured to generate a second reference current; and

first and second current mirrors electrically coupled between the second input of the amplifier and the output terminal, the
output terminal outputting a limited current such that the first reference current sets a lower limit and the second reference
current sets an upper limit.

US Pat. No. 9,048,786

SWITCHING SYSTEM WITH LINEARIZING CIRCUIT

Skyworks Solutions, Inc.,...

1. A switching system, comprising:
a switch including one or more transistors and a control terminal; and
a linearizing circuit including a reference resistance, a replica switching element circuit having one or more transistors,
and a switch control output electrically coupled to the control terminal of the switch, the linearizing circuit providing
a replica control signal to the replica switching element circuit to control the replica switching element circuit to maintain
a voltage drop across the replica switching element circuit at a level that corresponds to a voltage drop across the reference
resistance, the switch control output responsive to the replica control signal thereby promoting linearization of operation
of the switch, the linearizing circuit further including an operational amplifier configured to provide the replica control
signal, a first input of the operational amplifier being coupled to a first terminal of the replica switching element circuit,
a second input of the operational amplifier being coupled to a first terminal of the reference resistance, and an output of
the operational amplifier being configured to provide the replica control signal.

US Pat. No. 9,331,653

APPARATUS AND METHODS FOR ENVELOPE SHAPING IN POWER AMPLIFIER SYSTEMS

SKYWORKS SOLUTIONS, INC.,...

1. A power amplifier system comprising:
a modulator configured to generate a radio frequency (RF) signal;
a power amplifier configured to amplify the RF signal to generate an amplified RF signal, the power amplifier configured to
receive a power amplifier supply voltage for powering the power amplifier;

an envelope tracker configured to generate the power amplifier supply voltage, the envelope tracker configured to control
a voltage level of the power amplifier supply voltage based on a shaped envelope signal;

an envelope shaping circuit configured to generate the shaped envelope signal by shaping an envelope signal corresponding
to an envelope of the RF signal, the envelope shaping circuit including a shaping table configured to maintain a substantially
constant distortion in at least one of a transmit band or a receive band across voltage changes in the envelope signal, the
shaping table calibrated at a first RF power level; and

a gain control circuit including a gain adjustment table configured to boost the gain of the power amplifier for one or more
output power levels greater than the first RF power level, the gain control circuit configured to enhance a combined power
efficiency of the modulator and the power amplifier.

US Pat. No. 9,296,194

DEBONDERS AND RELATED DEVICES AND METHODS FOR SEMICONDUCTOR FABRICATION

Skyworks Solutions, Inc.,...

1. A debonding method comprising:
positioning on a vacuum chuck an assembly including a wafer bonded to a plate having a first diameter that is larger than
a second diameter of the wafer, the assembly configured such that the plate includes a peripheral area not covered by the
wafer, the wafer facing a recess in the vacuum chuck and the peripheral area engaging the vacuum chuck;

applying heat to the assembly positioned on the vacuum chuck; and
applying a suction to the vacuum chuck to cause the wafer to pull away from the plate, the plate inhibited from following
the wafer due to the vacuum chuck supporting the peripheral area.

US Pat. No. 9,088,298

MIXED MODE TIME INTERLEAVED DIGITAL-TO-ANALOG CONVERTER FOR RADIO-FREQUENCY APPLICATIONS

Skyworks Solutions, Inc.,...

1. A digital-to-analog converter (DAC) comprising:
a first circuit configured to perform a first operation to yield an increased bandwidth of the DAC, the first circuit including
a mixing circuit configured to perform a mix mode operation; and

a second circuit configured to perform a second operation on a digital signal to yield a converted analog signal, the second
circuit further configured to reduce or remove an image within the increased bandwidth, the second circuit including a time-interleaved
DAC (TIDAC) circuit in communication with the mixing circuit, the TIDAC circuit including a plurality of sample-and-hold (S/H)
circuits, each S/H circuit configured to receive a corresponding portion of the digital signal and generate a corresponding
portion of the converted analog signal.

US Pat. No. 9,294,043

APPARATUS AND METHODS FOR CALIBRATING ENVELOPE TRACKERS

SKYWORKS SOLUTIONS, INC.,...

1. A power amplifier system comprising:
a variable gain amplifier (VGA) configured to amplify a radio frequency (RF) input signal to generate an amplified RF input
signal, the VGA having a variable gain;

a power amplifier configured to amplify the amplified RF input signal to generate an RF output signal, the power amplifier
configured to receive power from a supply voltage;

an envelope tracker configured to generate the supply voltage, the envelope tracker including a scaling module configured
to generate a scaled envelope signal based on a power control level (PCL) signal and an envelope signal that changes in relation
to an envelope of the RF input signal, the envelope tracker further including an envelope shaping table including shaping
data relating a plurality of scaled envelope signal amplitudes to a plurality of supply voltage levels, the envelope tracker
configured to control the voltage level of the supply voltage based on the scaled envelope signal and the envelope shaping
table; and

a calibration module including calibration data, the calibration module configured to control the variable gain of the VGA
with the calibration data to compensate for an envelope amplitude misalignment of the envelope tracker.

US Pat. No. 9,373,955

DEVICES AND METHODS RELATED TO ELECTROSTATIC DISCHARGE-PROTECTED CMOS SWITCHES

SKYWORKS SOLUTIONS, INC.,...

1. A radio-frequency (RF) switching apparatus, comprising:
a switch implemented as a CMOS device, the switch including a resistive body-floating circuit configured to provide desired
power handling capability of the switch;

an electrostatic discharge (ESD) protection circuit disposed relative to the switch and configured to provide ESD protection
for the switch; and

a controller configured to control the switch, the controller and the switch being integrated, and the controller including
a bandgap reference, a low dropout voltage regulator (LDO), and digital logic.

US Pat. No. 9,918,386

SURFACE MOUNT DEVICE STACKING FOR REDUCED FORM FACTOR

Skyworks Solutions, Inc.,...

1. A packaged module for use in a wireless communication device, the packaged module comprising:
a substrate;
a first die supported by the substrate and including at least a microprocessor and radio frequency receiver circuitry;
a stacked filter assembly supported by the substrate and configured as a filter circuit that is in communication with the
radio frequency receiver circuitry, the stacked filter assembly including a plurality of passive components, each passive
component of the plurality of passive components packaged as a surface mount device, the plurality of passive components including
a first passive component supported by and in direct communication with the substrate, a second passive component supported
by the substrate, and a third passive component having a first end supported above the substrate by the first passive component
and a second end supported by the second passive component; and

an overmold which encloses the first die and the stacked filter assembly.

US Pat. No. 9,202,748

SEGMENTED CONDUCTIVE GROUND PLANE FOR RADIO FREQUENCY ISOLATION

Skyworks Solutions, Inc.,...

1. An apparatus, comprising:
a substrate;
first and second radio frequency devices mounted on the substrate;
a plurality of wirebond structures disposed on the substrate between the first radio frequency device and the second radio
frequency device;

a first conductive ground layer disposed at least partially below the first radio frequency device and in electrical contact
with one or more of the plurality of wirebond structures;

a second conductive ground layer disposed at least partially below the second radio frequency device, the second conductive
ground layer being at least partially electrically isolated from the first conductive ground layer;

a molding dimensioned to at least partially encapsulate the first and second radio frequency devices and each of the one or
more of the plurality of wirebond structures; and

a first conductive top layer disposed above a top surface of the molding and in electrical contact with the one or more of
the plurality of wirebond structures, such that the first conductive top layer, the plurality of wirebond structures, and
the first conductive ground layer at least partially form a radio frequency barrier between the first radio frequency device
and the second radio frequency device.

US Pat. No. 9,571,152

APPARATUS AND METHODS FOR CALIBRATION OF ENVELOPE TRACKERS

SKYWORKS SOLUTIONS, INC.,...

1. A power amplifier system comprising:
a variable gain amplifier configured to amplify a radio frequency input signal to generate an amplified radio frequency input
signal, the variable gain amplifier having a variable gain that is controllable by a gain control level signal;

a power amplifier configured to amplify the amplified radio frequency input signal to generate a radio frequency output signal,
the power amplifier configured to receive power from a supply voltage; and

an envelope tracker configured to generate the supply voltage, the envelope tracker including a scaling module configured
to generate a scaled envelope signal based on a power control level signal and an envelope signal that changes in relation
to an envelope of the radio frequency input signal, the envelope tracker further including a calibration module configured
to control an amount of scaling of the scaled envelope signal based on calibration data to compensate for an envelope amplitude
misalignment of the envelope tracker, the envelope tracker further configured to control a voltage level of the supply voltage
based on the scaled envelope signal.

US Pat. No. 9,059,332

CONTINUOUS TUNABLE LC RESONATOR USING A FET AS A VARACTOR

Skyworks Solutions, Inc.,...

1. A varactor, comprising:
a bipolar junction transistor (BJT) including a base and an emitter; and
a field effect transistor (FET) integrated with at least a portion of the BJT, in which a back gate of the FET shares an electrical
connection with the base of the BJT, and in which a reverse voltage applied to the back gate of the FET creates a continuously
variable capacitance in a channel of the FET formed at least partially in an emitter layer of the BJT.

US Pat. No. 9,419,073

INTEGRATED RF FRONT END SYSTEM

Skyworks Solutions, Inc.,...

1. A front-end module (FEM) comprising:
a silicon substrate including a high-resistivity portion;
a bipolar transistor disposed on the substrate above the high-resistivity portion; and
a low-resistivity well located between the bipolar transistor and a passive device, the low-resistivity well providing at
least partial electrical isolation between the bipolar transistor and the passive device.

US Pat. No. 9,673,707

APPARATUS AND METHODS FOR BYPASSING AN INDUCTOR OF A VOLTAGE CONVERTER

SKYWORKS SOLUTIONS, INC.,...

1. A wireless device comprising:
a voltage converter configured to generate one or more converted voltages based on controlling a current through an inductor,
the inductor including a first end electrically connected to a first node and a second end electrically connected to a second
node; and

a bypass circuit that selectively bypasses the inductor based on a state of a bypass control signal, the bypass circuit including
a first p-type field effect transistor and a second p-type field effect transistor electrically connected in series between
the first node and the second node, the first p-type field effect transistor including a body electrically connected to a
first voltage, and the second p-type field effect transistor including a body electrically connected to a second voltage greater
than the first voltage.

US Pat. No. 9,473,109

APPARATUS AND METHODS FOR DIGITAL STEP ATTENUATORS WITH SMALL OUTPUT GLITCH

SKYWORKS SOLUTIONS, INC.,...

17. A switching circuit for a digital step attenuator, the switching circuit comprising:
a switch input;
a switch output;
a switch control input configured to receive a switch control signal;
a field effect transistor (FET) switch including a source electrically connected to the switch input, a drain electrically
connected the switch output, and a gate;

a gate resistor electrically connected between the switch control input and the gate of the FET switch;
a first gate resistor bypass switch electrically connected in parallel with the gate resistor; and
a pulse generation circuit configured to generate a pulse operable to turn on the first gate resistor bypass switch and bypass
the gate resistor in response to a transition of the switch control signal.

US Pat. No. 9,093,506

PROCESS FOR FABRICATING GALLIUM ARSENIDE DEVICES WITH COPPER CONTACT LAYER

SKYWORKS SOLUTIONS, INC.,...

10. A method of manufacturing an electronic device incorporating a GaAs integrated circuit, said method comprising:
identifying a plurality of GaAs wafers configured to receive a copper backside, each of the wafers mounted on a respective
carrier;

depositing a thickness of copper on a backside of each of the GaAs wafers;
removing a portion of said copper from each of the GaAs wafers;
depositing a protective layer on the backside of each of the GaAs wafers;
debonding each of the GaAs wafers from said respective carrier; and
incorporating at least one of the plurality of GaAs wafers into an electronic device.

US Pat. No. 9,450,570

VARIABLE FREQUENCY CIRCUIT CONTROLLER

Skyworks Solutions, Inc.,...

1. An apparatus comprising:
a controller including a variable frequency circuit configured to spread energy of spurious tones through a frequency domain
of a variable frequency signal, the controller configured to generate a control signal based on the variable frequency signal;

an attenuator component in communication with the controller, the attenuator component configured to attenuate a radio frequency
(RF) signal based on the control signal; and

an amplifier configured to generate an RF output signal based on the attenuated RF signal, the amplifier, the controller,
and the attenuator component being implemented on a single integrated circuit.

US Pat. No. 9,247,607

SINGLE WIRE SERIAL INTERFACE UTILIZING COUNT OF ENCODED CLOCK PULSES WITH RESET

Skyworks Solutions, Inc.,...

1. A power integrated circuit for controlling a light source, the power integrated circuit comprising:
a counter that generates a count value based on pulses encoded in a signal received at a single input of the power integrated
circuit;

output circuitry that outputs, via at least one output of the power integrated circuit, at least one lighting control state
utilized to control the light source based at least in part on the count value; and

sensing circuitry that determines whether the signal is high or low so that (i) the at least one lighting control state is
maintained while the signal is high, and (ii) the count value is reset in response to the signal being low for a period that
exceeds a predetermined timeout value, the predetermined timeout value being longer than a width of one of the pulses.

US Pat. No. 9,888,564

SIGNAL PATH IN RADIO-FREQUENCY MODULE HAVING LAMINATE SUBSTRATE

Skyworks Solutions, Inc.,...

1. A laminate substrate for mounting radio-frequency components, the laminate substrate comprising:
a plurality of layers vertically stacked on top of each other;
a plurality of conductor pads, a respective conductor pad positioned within a respective layer of the laminate substrate including
an input pad on a first layer, an output pad on a second layer such that the output pad does not completely overlap with the
input pad, and at least one intermediate pad on a third layer between the input and output pads, the at least one intermediate
pad defining a cutout reducing overlap between the at least one intermediate pad and one or more neighboring conductor pads;
and

a plurality of connection features between the plurality of conductor pads to provide a signal path between the input pad
and the output pad.

US Pat. No. 9,552,917

MATERIALS, DEVICES AND METHODS RELATED TO BELOW-RESONANCE RADIO-FREQUENCY CIRCULATORS AND ISOLATORS

Skyworks Solutions, Inc.,...

1. A synthetic garnet material comprising a structure represented by the formula Y3-x-2y?zBixCa2y+zFe5-y-z-aVyZrzAlaO12, bismuth occupying x formula units of dodecahedral sites, zirconium occupying z formula units of octahedral sites, vanadium
occupying y formula units of tetrahedral sites, calcium occupying 2y+z formula units of the dodecahedral sites to compensate
for a valency imbalance resulting from the presence of zirconium and vanadium, aluminum occupying a formula units of the tetrahedral
sites while having the octahedral sites substantially free of aluminum, the quantity a being greater than zero, such that
saturation magnetization of the material decreases in a substantially linear manner as the quantity a increases to an upper
limit value of at least 0.6.

US Pat. No. 9,461,596

DOHERTY POWER AMPLIFIER WITH INTEGRATED PRE-DISTORTION

Skyworks Solutions, Inc.,...

1. An N-way Doherty amplifier comprising:
a main amplifier;
(N?1) peaking amplifiers where N is equal to or greater than 2; and
individual pre-distortion circuits monolithically integrated into the main amplifier and into each peaking amplifier to reduce
amplitude modulation to amplitude modulation (AM-AM) distortion and amplitude modulation to phase modulation (AM-PM) distortion
in the amplifiers in which they are integrated.

US Pat. No. 9,397,721

SYSTEMS AND METHODS FOR REDUCING FILTER INSERTION LOSS WHILE MAINTAINING OUT-OF BAND ATTENUATION

SKYWORKS SOLUTIONS, INC.,...

1. A system for processing radio-frequency (RF) signals, the system comprising:
a plurality of signal paths configured to accommodate multiple frequency bands including bands B1, B2, B3 and B4 associated with a 3GPP communication standard, each of the multiple frequency bands having a passband; and

a plurality of filter circuits, a corresponding filter circuit of the plurality of filter circuits disposed along each of
the signal paths, at least one segmented filter circuit of the plurality of filter circuits segmented into two or more segments
configured to provide attenuation of out-of-band interferers, the plurality of filter circuits arranged to partition at least
one receive band of the multiple frequency bands into two overlapping frequency segments received on different ones of the
signal paths, the plurality of filter circuits arranged to partition bands B1, B2, B3 and B4 such that receive (Rx) bands of bands B1, B2, and B3 each include two overlapping frequency segments received on different ones of the signal paths.

US Pat. No. 9,054,575

VARIABLE SWITCHED CAPACITOR DC-DC VOLTAGE CONVERTER

Skyworks Solutions, Inc.,...

1. A voltage converter comprising:
a switch matrix having a plurality of mode configurations, each of the plurality of mode configurations corresponding to one
of a plurality of voltage levels of an output signal, the switch matrix being configured to operate in a selected one of the
plurality of mode configurations in response to a mode selection signal;

a capacitor circuit including capacitors, the switch matrix configured to interconnect the capacitors differently between
a voltage potential and an output node in different mode configurations of the plurality of mode configurations;

a comparator circuit configured to produce a direction comparison signal based on a comparison of the output signal with a
reference signal, the comparator circuit also including a plurality of comparators each having a first input configured to
receive a different voltage than the other of the plurality of comparators; and

control logic configured to produce the mode selection signal based on the direction comparison signal and one or more outputs
of the plurality of comparators.

US Pat. No. 9,948,241

APPARATUS AND METHODS FOR REDUCING INDUCTOR RINGING OF A VOLTAGE CONVERTER

SKYWORKS SOLUTIONS, INC.,...

1. A voltage converter comprising:an inductor connected between a first node and a second node;
a plurality of switches including a first switch connected between a battery voltage and the first node, a second switch connected between the first node and a ground voltage, a third switch connected between the second node and the ground voltage, and a fourth switch connected between the second node and the output; and
a bypass circuit having an activated state and a deactivated state, the bypass circuit including a first pair of transistors connected between the first node and the second node and configured to turn on to bypass the inductor in the activated state and to turn off in the deactivated state.

US Pat. No. 9,306,526

LOW-LOSS HIGH-ISOLATION SWITCHING ARCHITECTURE

SKYWORKS SOLUTIONS, INC.,...

1. A switching circuit comprising:
a first signal path between a transmit terminal and a first antenna terminal, the first final path including a first switch
and an insertion loss component electrically connected in series;

a second signal path between the transmit terminal and a second antenna terminal, the second signal path including a second
switch and a third switch electrically connected in series, the switching circuit configured to be capable of operating in
a first mode in which the transmit terminal is provided with access to the first antenna terminal through the first signal
path with a first insertion loss or the second antenna terminal through the second signal path with a second insertion loss,
the insertion loss component including fourth switch implemented such that the first insertion loss substantially matches
the second insertion loss; and

a third signal path between a transceiver terminal and the second antenna terminal, the switching circuit further configured
to be capable of operating in a second mode in which the transmit terminal is provided with access to the first antenna terminal
and the transceiver terminal is concurrently provided with access to the second antenna terminal.

US Pat. No. 9,576,906

METHODS RELATED TO A SPUTTERED TITANIUM TUNGSTEN LAYER FORMED OVER A COPPER INTERCONNECT STACK STRUCTURE

Skyworks Solutions, Inc.,...

1. A method for forming a metalized structure for a compound semiconductor device, the method comprising:
forming a resist mask that defines an opening over a substrate associated with the compound semiconductor device;
forming a stack within the opening and over the substrate, the stack including an ohmic metal layer, a barrier disposed over
the ohmic metal layer, and a copper layer disposed over the barrier, the barrier including a first titanium layer, a barrier
layer disposed over the first titanium layer, and a second titanium layer disposed over the barrier layer and a copper (Cu)
layer formed over the barrier layer; and

sputtering a titanium tungsten (TiW) layer over the stack and at least partially covering a to surface and a side surface
of the stack in a manner that allows the resist mask to be removed by a liftoff process.

US Pat. No. 9,473,083

APPARATUS AND METHODS FOR RADIO FREQUENCY AMPLIFIERS

SKYWORKS SOLUTIONS, INC.,...

1. An electronic amplification circuit comprising:
a first bipolar transistor including an emitter, a base electrically connected to a radio frequency (RF) input node, and a
collector electrically connected to an RF output node;

a second bipolar transistor including an emitter, a base electrically connected to the emitter of the first bipolar transistor,
and a collector electrically connected to the RF output node;

a first bias circuit including a first resistor electrically connected between the base of the first bipolar transistor and
the RF output node;

a second bias circuit including a first diode, a second diode, and a second resistor electrically connected in series between
the base of the first bipolar transistor and a power low node;

an inductor; and
a third bias circuit electrically connected in series with the inductor between the base of the second bipolar transistor
and the power low node.

US Pat. No. 9,461,153

DEVICES AND METHODS RELATED TO A BARRIER FOR METALLIZATION OF A GALLIUM BASED SEMICONDUCTOR

Skyworks Solutions, Inc.,...

1. A metallization structure comprising:
a selected semiconductor layer that includes wide bandgap semiconductor lattice-matched to gallium arsenide (GaAs) and that
is part of an emitter of a heterojunction bipolar transistor (HBT), the emitter having a ledge that includes indium gallium
phosphide (InGaP);

a first GaAs layer underneath the selected semiconductor layer and that is part of a base of the HBT;
a first metal layer disposed over and in electrical communication with the first GaAs layer, forming a base terminal of the
HBT;

a tantalum nitride (TaN) layer formed over the selected semiconductor layer; and
a second metal layer formed over the TaN layer, forming an emitter terminal of the HBT, and having a portion covering the
TaN layer that is nested within a region defined by a footprint of the first metal layer, the TaN layer arranged to separate
the second metal layer from the selected semiconductor layer, and the TaN layer forming a barrier between the second metal
layer and the selected semiconductor layer, the metallization structure forming a capacitor having a capacitance density of
at least 2.0 fF/?m2 when capacitance is measured between the first metal layer and the second metal layer.

US Pat. No. 9,209,770

APPARATUS AND METHODS FOR POWER CONTROL IN MOBILE COMMUNICATION DEVICES

SKYWORKS SOLUTIONS, INC.,...

1. A transmitter comprising:
a transmit chain including a first digital-to-analog converter and a gain-step amplifier, the transmit chain configured to
receive a digital in-phase (I) signal and a digital quadrature-phase (Q) signal and to generate a modulated analog transmit
signal;

a power detector configured to generate a power signal indicative of a power level of the modulated analog transmit signal;
and

a transmit chain controller configured to receive a feedback-path gain control factor and the power signal, the transmit chain
controller configured to cancel a modulation envelope of the modulated analog transmit signal to control a transmit power
of the transmit chain independent of a data pattern, the transmit chain controller including a control signal generator configured
to receive an inverse of the feedback-path gain control factor and to generate a plurality of power control signals including
a first power control signal implemented to adjust a gain level of the first digital-to-analog converter and a second power
control signal implemented to adjust an amount of gain per step of the gain-step amplifier, the control signal generator further
configured to control the first power control signal based on the inverse of the feedback-path gain control factor.

US Pat. No. 9,203,657

APPARATUS AND METHODS FOR FIXED DC BIAS TO IMPROVE LINEARITY IN SIGNAL PROCESSING CIRCUITS

Skyworks Solutions, Inc.,...

1. A circuit assembly comprising:
a first series combination of a first fixed current source and a first signal processing circuit that includes a first biasing
circuit and a first bias current source configured to provide a first constant current to the first biasing circuit to set
a first operating point for the first signal processing circuit, a first switch electrically connected between the first signal
processing circuit and the first fixed current source, the first fixed current source configured to provide additional current
to the first biasing circuit when the first switch is closed, the first signal processing circuit configured to receive a
radio frequency (RF) input signal and to generate a first output signal, an RF output signal of the circuit assembly including
the first output signal;

a peak detector configured to detect a plurality of thresholds in the RF output signal and to close the first switch when
a first threshold is detected; and

a second series combination of a second fixed current source and a second signal processing circuit that includes a second
biasing circuit and a second bias current source configured to provide a second constant current to the second biasing circuit
to set a second operating point for the second signal processing circuit, a second switch electrically connected between the
second signal processing circuit and the second fixed current source, the second fixed current source configured to provide
additional current to the second biasing circuit when the second switch is closed, the second signal processing circuit configured
to receive the RF input signal and to generate a second output signal; and

a third switch electrically connected between the first and second signal processing circuits, the RF output signal of the
circuit assembly including a combination of the first and second output signals when the third switch is closed, the peak
detector further configured to close the second switch when a second threshold is detected and close the third switch when
a third threshold is detected.

US Pat. No. 9,064,746

DEVICES AND METHODS RELATED TO FIELD-EFFECT TRANSISTOR STRUCTURES FOR RADIO-FREQUENCY APPLICATIONS

Skyworks Solutions, Inc.,...

1. A transistor, comprising:
a semiconductor substrate;
a plurality of first diffusion regions formed on the semiconductor substrate;
a plurality of second diffusion regions formed on the semiconductor substrate; and
a gate layer disposed over the first and second diffusion regions, the gate layer defining a first opening over each of the
first diffusion regions and a second opening over each of the second diffusion regions, at least some of the first and second
openings having a shape other than a rectangle, neighboring pairs of the first and second openings being arranged such that
the first opening in a respective neighboring pair is approximately perpendicular to the second opening in the respective
neighboring pair, a neighboring pair of first and second openings including a first facing portion for the first opening and
a second facing portion for the second opening, the first facing portion and the second facing portion defining a “v” shaped
facing area therebetween.

US Pat. No. 9,506,968

SYSTEMS AND METHODS RELATED TO NEAR-FIELD ELECTROMAGNETIC SCANNERS

SKYWORKS SOLUTIONS, INC.,...

1. A system for scanning for electromagnetic (EM) emission, the system comprising:
a fixture system configured to hold a device under test (DUT) and provide electrical connections for the DUT;
an operating system connected to the fixture system and configured to allow operation of the DUT; and
a measurement system configured to obtain field strength measurements representative of a field distribution over a plurality
of selected areas of the DUT during the operation of the DUT, each of the selected areas being smaller than an overall lateral
area of the DUT, the measurement system including a magnetic field probe, the magnetic field probe including a loop, the loop
including a first end connected to a distal end of an inner conductor and a second end connected to a distal end of an outer
conductive shield, the inner conductor and the outer conductive shield arranged in a coaxial configuration, the loop configured
so that a change in magnetic field flux through the loop induces a detectable common mode current.

US Pat. No. 9,362,870

APPARATUS AND METHODS FOR BIASING POWER AMPLIFIERS

SKYWORKS SOLUTIONS, INC.,...

1. A power amplifier system comprising:
a power amplifier configured to receive a radio frequency (RF) input signal, and to amplify the RF input signal to generate
an RF output signal, the power amplifier further configured to receive a bias voltage that biases the power amplifier; and

a bias circuit configured to generate the bias voltage, the bias circuit including a bias circuit amplifier, a variable current
source configured to generate a reference current, and a reference transistor having a current therethrough that changes in
relation to the bias voltage, the bias circuit amplifier configured to control the bias voltage based on an error current
corresponding to a difference between the reference current and the current through the reference transistor.

US Pat. No. 9,325,535

APPARATUS AND METHODS FOR VARIABLE DC BIAS TO IMPROVE LINEARITY IN SIGNAL PROCESSING CIRCUITS

SKYWORKS SOLUTIONS, INC.,...

1. A circuit assembly comprising:
first and second signal processing circuits each including a biasing circuit and a fixed current source configured to provide
a constant current to the biasing circuit, the first and second signal processing circuits each configured to receive a radio
frequency (RF) input signal and to generate an output signal, an RF output signal of the circuit assembly including the output
signal of the first signal processing circuit;

first and second variable current sources respectively configured to provide additional current to the biasing circuits of
the first and second signal processing circuits;

a first switch in communication with the first and second signal processing circuits and configured such that the RF output
signal of the circuit assembly further includes the output signal of the second signal processing circuit when the first switch
is closed; and

a second switch separate from the second variable current source, in communication with the second variable current source
and with a peak detector that is configured to detect a plurality of thresholds in the RF output signal, to enable the first
variable current source when a first threshold is detected, to close the first switch when a second threshold is detected,
and to close the second switch when a third threshold is detected, thereby enabling the second variable current source.

US Pat. No. 9,294,055

CIRCUIT AND METHOD FOR BIASING A GALLIUM ARSENIDE (GAAS) POWER AMPLIFIER

SKYWORKS SOLUTIONS, INC.,...

1. A semiconductor die comprising:
a power amplifier configured to amplify a radio frequency input signal to generate a radio frequency output signal;
a reference voltage generator configured to receive a control voltage that controls a bias current of the power amplifier
and to generate a reference voltage by translating a voltage level of the control voltage, the reference voltage having a
voltage level greater than the voltage level of the control voltage, the reference voltage generator including a first field
effect transistor (FET) having a source configured to generate the reference voltage and a drain configured to receive a switch
bias voltage, the reference voltage generator further including a first bipolar transistor and a first resistor, the first
bipolar transistor having an emitter configured to receive the control voltage and a collector electrically connected to the
switch bias voltage through the first resistor; and

a bias circuit configured to receive the reference voltage and to convert the reference voltage to a reference current, the
bias circuit further configured mirror the reference current to control the bias current of the power amplifier.

US Pat. No. 9,054,115

METHODS FOR FABRICATING AN OVERMOLDED SEMICONDUCTOR PACKAGE WITH WIREBONDS FOR ELECTROMAGNETIC SHIELDING

Skyworks Solutions, Inc.,...

1. A method for fabricating a packaged module, the method comprising:
providing a packaging substrate having a reference potential layer;
mounting one or more components on a surface of the packaging substrate;
forming a plurality of wirebonds on the packaging substrate so as to define a perimeter around and substantially surround
the one or more components, each of the plurality of wirebonds having a first end, a second end, and a middle portion, the
first and second ends electrically connected to the reference potential layer and separated by a wirebond loop width, wirebonds
along the perimeter separated by a wirebond spacing, the wirebond loop width and the wirebond spacing selected to provide
electromagnetic shielding for a particular range of frequencies;

forming an overmold that substantially encapsulates the one or more components and the plurality of wirebonds, the overmold
including an upper surface where the middle portions of the plurality of wirebonds are exposed; and

forming a conductive layer on the upper surface of the overmold so as to be in electrical contact with the middle portions
of the plurality of wirebonds, the conductive layer in combination with the plurality of wirebonds and the reference potential
layer providing the electromagnetic shielding.

US Pat. No. 9,571,037

DIVERSITY RECEIVER FRONT END SYSTEM WITH IMPEDANCE MATCHING COMPONENTS

SKYWORKS SOLUTIONS, INC.,...

1. A receiving system comprising:
a first amplifier disposed along a first path, corresponding to a first frequency band, between an input of the receiving
system and an output of the receiving system;

a second amplifier disposed along a second path, corresponding to a second frequency band, between the input of the receiving
system and the output of the receiving system;

a controller configured to generate a first impedance tuning signal in response to a first band select signal indicating an
in-band frequency band as the first frequency band and a first out-of-band frequency band as the second frequency band and
to generate a second impedance tuning signal in response to a second band select signal indicating the in-band frequency band
as the first frequency band and a second out-of-band frequency band as the second frequency band; and

a first impedance matching circuit disposed along the first path and having an impedance selected based on the second frequency
band to reduce at least one of a noise figure of the first path for the second frequency band or a gain of the first path
for the second frequency band, the first impedance matching circuit having a tunable impedance matching circuit with an impedance
selected by the first impedance tuning signal received from the controller.

US Pat. No. 9,485,001

DIVERSITY RECEIVER FRONT END SYSTEM WITH SWITCHING NETWORK

Skyworks Solutions, Inc.,...

1. A receiving system comprising:
a first amplifier disposed along first path between an input of the receiving system and an output of the receiving system
and configured to amplify a signal received at the first amplifier;

a second amplifier disposed along a second path between the input of the receiving system and the output of the receiving
system and configured to amplify a signal received at the second amplifier;

a single-pole/single-throw (SPST) switch disposed between the first path and the second path and configured to couple the
first path and the second path; and

a controller configured to receive a band select signal and, based on the band select signal, enable one of the first amplifier
or the second amplifier and control the SPST switch.

US Pat. No. 9,450,591

ADJUSTING VOLTAGE CONTROLLED OSCILLATOR GAIN

Skyworks Solutions, Inc.,...

1. A method of adjusting a gain associated with a voltage-controlled oscillator, the method comprising:
obtaining, from a memory, a selected slope of a plurality of slopes and a selected offset of a plurality of offsets based
on an indicator of an output frequency of the voltage-controlled oscillator;

computing a charge pump control value using the selected slope and the selected offset; and
using the charge pump control value, adjusting the gain associated the voltage-controlled oscillator with a charge pump.

US Pat. No. 9,350,059

RADIO-FREQUENCY SWITCHES HAVING EXTENDED TERMINATION BANDWIDTH AND RELATED CIRCUITS, MODULES, METHODS, AND SYSTEMS

Skyworks Solutions, Inc.,...

1. A switching circuit, comprising:
an input port configured to receive a radio-frequency (RF) signal;
an output port;
a switch configured to be capable of being in an ON state in which the switch passes the RF signal from the input port to
the output port, and an OFF state in which the switch does not pass the RF signal; and

a termination circuit configured to provide desired impedance for the input port or the output port, the termination circuit
including an assembly including a resistor in electrical series with a capacitor, and an inductor in electrical series with
the assembly, an effective capacitance of the termination circuit and an inductance of the inductor being selected such that
the effective capacitance of the termination circuit resonates with an inductance of the termination circuit.

US Pat. No. 9,935,582

APPARATUS AND METHODS FOR ENVELOPE TRACKING SYSTEMS

SKYWORKS SOLUTIONS, INC.,...

1. An envelope tracking system for generating a supply voltage of a power amplifier, the envelope tracking system comprising:a digital filter configured to generate a filtered envelope signal based on a digital envelope signal representing an envelope of a radio frequency signal;
a buck converter controllable by the filtered envelope signal and including an output electrically connected to a power amplifier supply voltage, the buck converter configured to control the power amplifier supply voltage to track low frequency components of the digital envelope signal;
a digital-to-analog converter module including an output electrically connected to the output of the buck converter and configured to provide an output current, the digital-to-analog converter module configured to control the power amplifier supply voltage to track high frequency components of the digital envelope signal; and
a digital shaping and delay circuit configured to generate a shaped envelope signal based on shaping the filtered envelope signal, the shaped envelope signal operable to control a magnitude of the output current of the digital-to-analog converter module, the digital shaping and delay circuit further configured to control a delay of the shaped envelope signal to align the output of the digital-to-analog converter module and the output of the buck converter.

US Pat. No. 9,553,049

COPPER INTERCONNECTS HAVING A TITANIUM-PLATINUM-TITANIUM ASSEMBLY BETWEEN COPPER AND COMPOUND SEMICONDUCTOR

Skyworks Solutions, Inc.,...

15. A method of forming a compound semiconductor die, the method comprising:
forming an ohmic metal layer directly over a gallium arsenide (GaAs) semiconductor substrate;
forming a first chromium (Cr) only layer over the GaAs semiconductor substrate;
forming a first platinum (Pt) barrier layer directly over the first Cr only layer;
forming a second Cr only layer directly over and in contact with substantially an entire top surface of the first Pt barrier
layer;

forming a copper (Cu) layer directly over the second Cr only layer through evaporation deposition, the first and second Cr
layers, the first barrier layer, and the Cu layer forming an interconnect metalized stack having a generally trapezoidal shape
for the semiconductor device on the GaAs semiconductor substrate;

forming a third Cr only layer directly over the Cu layer and covering a top and side surface of the Cu layer; and
forming a second Pt barrier layer directly over the third Cr only layer and covering a top and side surface of the third Cr
only layer.

US Pat. No. 9,537,452

BROADBAND POWER AMPLIFIER SYSTEMS AND METHODS

Skyworks Solutions, Inc.,...

1. A power amplifier comprising:
an amplifier circuit configured to receive a radio frequency signal and provide an amplified radio frequency signal over a
frequency band of operation; and

a tunable output matching network electrically connected to the amplifier circuit to receive the amplified radio frequency
signal, the tunable output matching network including first and second passive components configured in series with each other
and with a first switch, a third passive component configured in series with a second switch, and a fourth passive component
configured in series with a third switch, the first, second, and third switches configured to operate to provide second-order
harmonic rejection for the amplified radio frequency signal when the amplifier circuit operates in a low frequency band, the
first, second, third, and fourth passive components selected from the group consisting of inductors and capacitors.

US Pat. No. 9,503,025

POWER AMPLIFIER WITH TERMINATION CIRCUIT AND RESONANT CIRCUIT

Skyworks Solutions, Inc.,...

1. A power amplifier system comprising:
a power amplifier transistor configured to receive a radio frequency signal at an input terminal and provide an amplified
radio frequency signal at an output terminal;

an envelope tracking modulator and a parallel LC circuit coupled between the envelope tracking modulator and the output terminal
of the power amplifier transistor, the envelope tracking modulator configured to provide a supply voltage to the power amplifier
transistor by way of the parallel LC circuit;

an input termination circuit coupled to the input terminal of the power amplifier transistor, the input termination circuit
configured to provide a short circuit at a second harmonic of the radio frequency signal;

a termination circuit coupled to the output terminal of the power amplifier transistor, the termination circuit configured
to provide a short circuit at a second harmonic of the amplified radio frequency signal; and

a resonant circuit coupled to the output of the power amplifier transistor, the resonant circuit configured to provide an
open circuit at a third harmonic of the amplified radio frequency signal.

US Pat. No. 9,455,669

APPARATUS AND METHODS FOR PHASE COMPENSATION IN POWER AMPLIFIERS

SKYWORKS SOLUTIONS, INC.,...

1. A method of phase compensation in a power amplifier system, the method comprising:
amplifying an input radio frequency (RF) signal to generate a first amplified RF signal using a first amplification stage
of a power amplifier;

generating a power amplifier supply voltage using an envelope tracker;
controlling a voltage level of the power amplifier supply voltage based on an envelope of the input RF signal using the envelope
tracker;

powering a second amplification stage of the power amplifier using the power amplifier supply voltage from the envelope tracker;
amplifying the first amplified RF signal to generate a second amplified signal using the second amplification stage, amplifying
the first amplified RF signal to generate the second amplified signal including receiving the first amplified RF signal at
a base of a bipolar transistor and generating the second amplified RF signal at a collector of the bipolar transistor; and

compensating for a variation in an input impedance of the second amplification stage associated with changes in the voltage
level of the power amplifier supply voltage using a compensation circuit.

US Pat. No. 9,159,743

RADIO-FREQUENCY SWITCHES HAVING SILICON-ON-INSULATOR FIELD-EFFECT TRANSISTORS WITH REDUCED LINEAR REGION RESISTANCE

Skyworks Solutions, Inc.,...

1. A radio-frequency (RF) switch comprising:
a semiconductor substrate;
an input assembly including a plurality of source regions formed on the semiconductor substrate, a source contact formed on
each of the source regions, and an input conductor that electrically connects to each of the source contacts;

an output assembly including a plurality of drain regions formed on the semiconductor substrate, a drain contact formed on
each of the drain regions, and an output conductor that electrically connects to each of the drain contacts; and

a gate layer disposed over the source and drain regions, the gate layer defining a first opening over each of the source regions
and a second opening over each of the drain regions, at least some of the first and second openings arranged in a two-dimensional
array, each of the first and second openings forming a double-diamond shaped diffusion region, the source regions, the drain
regions, and the gate layer configured as one or more field effect transistors (FETs).

US Pat. No. 9,136,795

VARIABLE SWITCHED DC-TO-DC VOLTAGE CONVERTER

Skyworks Solutions, Inc.,...

1. An apparatus comprising:
a switch matrix including switches configurable into a plurality of states corresponding to a plurality of voltage levels
of an output voltage, the switches coupled to a supply voltage, the switch matrix configured to adjust a state of at least
one of switches based at least in part on one or more switch control signals; and

control logic including a voltage level generator configured to receive the supply voltage and to generate a first voltage
from the supply voltage, the first voltage having a lower voltage level than the supply voltage, the control logic configured
to compare the first voltage with a reference voltage that is independent of the supply voltage and to generate the one or
more switch control signals based at least in part on the comparison.

US Pat. No. 9,505,632

COMPOSITIONS AND MATERIALS FOR ELECTRONIC APPLICATIONS

Skyworks Solutions, Inc.,...

1. An RF device comprising:
a composition represented by the formula
Ni1-w-x-y-zZnwCoxMnyCuzFe2-aO4-1.5a,

w being greater than or equal to 0.2 and less than or equal to 0.6;
x being greater than or equal to 0 and less than or equal to 0.2;
y being greater than or equal to 0 and less than or equal to 0.2;
z being greater than or equal to 0 and less than or equal to 0.2;
a being greater than or equal to 0 and less than or equal to 0.2; and
said RF device operates in the 13.56 MHz band.

US Pat. No. 9,406,741

THIN FILM RESISTOR HAVING IMPROVED POWER HANDLING CAPABILITY

SKYWORKS SOLUTIONS, INC.,...

8. An attenuator comprising:
a substrate;
a thin-film resistor assembly formed on a first surface of the substrate, the thin-film resistor assembly including a first
and second thin-film resistor, each thin-film resistor including a main portion with an input and an output end, and further
including at least one extension formed from the main portion configured to be capable of being connected to a reference potential,
the first and second thin-film resistors being disposed relative to each other so as to define a separation region that extends
in a direction having a component parallel to an axis defined between the input and output ends of the first and second thin-film
resistors;

one or more resistive strips disposed along and over the first and second thin-film resistors and configured to provide an
additional resistance between the input and output ends;

first and second signal ports formed adjacent to and in electrical contact with the input ends and output ends of the first
and second thin-film resistors;

first and second contact pads formed adjacent to and in electrical contact with the at least one extension of the first and
second thin-film resistors; and

a metal layer, formed on a second surface of the substrate, being in electrical contact with the first and second contact
pads, and defining an opening.

US Pat. No. 9,337,356

DEVICES AND METHODS RELATED TO ELECTROSTATIC DISCHARGE PROTECTION BENIGN TO RADIO-FREQUENCY OPERATION

Skyworks Solutions, Inc.,...

1. A device, comprising:
a semiconductor substrate having an intrinsic region;
a circuit disposed on the semiconductor substrate;
a first conductor disposed relative to the intrinsic region and electrically connected to the circuit;
a second conductor disposed relative to the intrinsic region and the first conductor, a lateral width of the first conductor
being greater than a lateral width of the second conductor, and an edge-to-edge separation between the first and second conductors
being such that a volume of the intrinsic region below the first conductor is greater than a volume of the intrinsic region
below the second conductor to increase the likelihood that a charge from an electrostatic discharge (ESD) event enters the
first conductor, the second conductor configured so that a potential difference greater than a selected value between the
first and second conductors results in a conduction path through the intrinsic region between the first and second conductors;
and

an insulating region formed between the first and second conductors having a width approximately equal to the edge-to-edge
separation, a depth of the insulating region and a depth of the intrinsic region defining a depth of the conduction path.

US Pat. No. 9,294,083

SEMICONDUCTOR DEVICES AND METHODS PROVIDING NON-LINEAR COMPENSATION OF FIELD-EFFECT TRANSISTORS

Skyworks Solutions, Inc.,...

1. A semiconductor die comprising:
a semiconductor substrate;
at least one field-effect transistor (FET) formed on the semiconductor substrate; and
a compensation circuit connected to a respective source of each of the at least one FET, the compensation circuit configured
to compensate a non-linearity effect generated by the at least one FET.

US Pat. No. 9,225,298

SYSTEM AND METHOD FOR POWER AMPLIFIER OVER-VOLTAGE PROTECTION

Skyworks Solutions, Inc.,...

1. A system for power amplifier over-voltage protection, the system comprising:
a power amplifier configured to receive a radio frequency (RF) signal and to amplify the RF signal;
a transistor configured to provide a bias signal to the power amplifier so as to enable the power amplifier to amplify the
RF signal; and

a power amplifier over-voltage circuit operatively coupled to the transistor, the power amplifier over-voltage circuit configured
to turn off the transistor responsive to an over-voltage condition to thereby reduce a level of the bias signal provided to
the power amplifier to disable the power amplifier in response to the over-voltage condition.

US Pat. No. 9,143,096

APPARATUS AND METHODS FOR ENVELOPE TRACKING SYSTEMS

SKYWORKS SOLUTIONS, INC.,...

1. An envelope tracking system for generating a power amplifier supply voltage, the envelope tracking system comprising:
a DC-to-DC converter configured to generate a regulated voltage from a battery voltage, the DC-to-DC converter configured
to control a voltage magnitude of the regulated voltage using a low frequency feedback signal that is based on a low frequency
component of the power amplifier supply voltage;

a high pass filter configured to generate a high pass filtered power amplifier supply voltage based on high pass filtering
of the power amplifier supply voltage;

a first comparator configured to generate a high frequency envelope signal based on comparing the high pass filtered power
amplifier supply voltage to an envelope signal; and

an error amplifier including an inverting input configured to receive a high frequency feedback signal that is based on a
high frequency component of the power amplifier supply voltage, a non-inverting input configured to receive the high frequency
envelope signal, and an output configured to generate an output current, the error amplifier configured to generate the power
amplifier supply voltage by adjusting the magnitude of the regulated voltage using the output current.

US Pat. No. 9,092,393

DUAL MODE SERIAL/PARALLEL INTERFACE AND USE THEREOF IN IMPROVED WIRELESS DEVICES AND SWITCHING COMPONENTS

Skyworks Solutions, Inc.,...

1. A dual interface device comprising a die and a package encasing the die, the package including pins configured to receive
data, and the die including:
a plurality of signal pins;
a serial interface including a serial input electrically coupled to at least one pin of the plurality of signal pins;
a parallel interface including a parallel data input electrically coupled to the at least one pin of the plurality of signal
pins while the serial input of serial interface is electrically coupled to the at least one pin of the signal pins, the parallel
data input being electrically coupled to a pin of the pins of the package, the parallel interface including a second parallel
data input that is not electrically coupled to any of the pins of the package, the parallel interface configured to operate
in a high-impedance output mode when the serial interface is enabled;

a controller configured to provide a level shifted voltage signal to a radio frequency switch; and
a bus electrically connecting both the serial interface and the parallel interface to the controller, at least one of the
serial interface or the parallel interface configured to provide data from the at least one pin of the plurality of signal
pins to the controller via the bus.

US Pat. No. 9,628,029

SYSTEMS, CIRCUITS AND METHODS RELATED TO DYNAMIC ERROR VECTOR MAGNITUDE CORRECTIONS

Skyworks Solutions, Inc.,...

1. A power amplifier (PA) system comprising:
a power amplifier circuit including a plurality of amplification stages;
a bias system in communication with the power amplifier circuit, the bias system configured to provide bias signals to the
plurality of amplification stages;

a first correction circuit configured to generate a correction current that results in an adjusted bias signal for a selected
amplification stage, the adjusted bias signal configured to compensate for an error vector magnitude (EVM) during a dynamic
mode of operation; and

a second correction circuit configured to change the correction current based on an operating condition associated with the
power amplifier circuit, the second correction circuit being separate from the bias-system.

US Pat. No. 9,628,075

RADIO-FREQUENCY SWITCH HAVING DYNAMIC BODY COUPLING

Skyworks Solutions, Inc.,...

1. A radio-frequency switch comprising:
a first field-effect transistor disposed between first and second nodes, the first field-effect transistor having a body and
a gate;

a coupling circuit that couples the body and the gate of the first field-effect transistor, the coupling circuit including
a second field-effect transistor connected in series with a first resistor; and

an adjustable-resistance circuit connected to the body of the first field-effect transistor, the adjustable-resistance circuit
including a second resistor in series with a parallel combination of a third resistor and a bypass switch.

US Pat. No. 9,602,060

POWER AMPLIFIER ARCHITECTURES WITH INPUT POWER PROTECTION CIRCUITS

Skyworks Solutions, Inc.,...

1. A radio frequency power amplifier input power overload protection circuit having a transmit signal input and a transmit
signal output, the circuit comprising:
an input matching network;
a power detector generating a voltage output proportional to a power level of an input signal;
a directional coupler with a first port connected to the transmit signal input, a second port connected to the input matching
network, and a third port connected to the power detector;

a first power amplifier stage with an input connected to the input matching network and an output connected to the transmit
signal output; and

a control circuit connected to the power detector, a gain reduction signal being generated thereby based upon a comparison
of the voltage output from the power detector to predefined voltage levels corresponding to specific power levels of the input
signal correlated to an overload condition in at least one component in a signal transmission chain between the transmit signal
input and the transmit signal output, and overall gain of the radio frequency power amplifier circuit being reduced directly
in response to the gain reduction signal being applied to at least one component in the signal transmission chain to reduce
power overstress in each of the components in the signal transmission chain to below a predetermined threshold.

US Pat. No. 9,585,211

FLASH-LED DRIVER DISCHARGE CONTROL

Skyworks Solutions, Inc.,...

1. A discharge control assembly comprising:
a discharge circuit selectively connectable to a driver circuit, the discharge circuit configured to provide a dominant discharge
path for the driver circuit when the driver circuit is effectively decoupled from a first load in order to decay an electrical
condition of the driver circuit produced prior to the driver circuit being effectively decoupled from the first load; and

a controller configured to selectively connect the driver circuit to a combination of the discharge circuit and the first
load, and in at least one combination the discharge circuit is effectively coupled to the driver circuit when the first load
is effectively decoupled from the driver circuit, the controller further configured to effectively decouple the driver circuit
from the discharge circuit after the driver circuit has been decoupled from the first load.

US Pat. No. 9,553,617

APPARATUS AND METHODS FOR RECONFIGURABLE DIRECTIONAL COUPLERS IN AN RF TRANSCEIVER WITH CONTROLLABLE CAPACITIVE COUPLING

SKYWORKS SOLUTIONS, INC.,...

1. A directional coupler for a power signal comprising:
an input port;
an output port connected to the input port via a first phase shifter;
a coupled port connected to the input port via a first variable capacitive coupling element;
an isolation port connected to the coupled port via a second phase shifter and connected to the output port via a second variable
capacitive coupling element; and

a processor configured to adjust the first and second variable capacitive coupling elements to achieve a desired coupling
level between the input port and the coupled port.

US Pat. No. 9,496,913

SYSTEMS AND METHODS RELATED TO IMPROVED ISOLATION BETWEEN TRANSMIT AND RECEIVE RADIO-FREQUENCY SIGNALS

SKYWORKS SOLUTIONS, INC.,...

1. A system for isolating radio-frequency signals during transmit and receive operations, the system comprising:
a transmit path configured for passage of a first radio frequency signal;
a power amplifier including a first filter bank and a plurality of stages including an input stage and an output stage, the
first filter bank disposed along the transmit path after the input stage and before the output stage, the first filter bank
further configured to filter the first radio frequency signal;

one or more switches;
a first antenna connected to the transmit path via the one or more switches;
a second antenna connected to a receive path and configured to receive a second radio frequency signal, the first and second
antennas separated from each other to provide isolation between the transmit and receive paths;

a duplexer path configured to facilitate a duplexer mode where both transmit and receive operations are performed with the
first antenna, and a duplexer bypass, the one or more switches configured to allow switching between the duplexer mode and
a duplexer bypass mode where both of the first and second antennas are being used; and

an isolation detection system configured to control a state of the one or more switches based on detecting an amount of antenna
coupling between the first antenna and the second antenna, and to control switching between the duplexer mode and the duplexer
bypass mode.

US Pat. No. 9,490,751

POWER AMPLIFIER MODULES INCLUDING BIPOLAR TRANSISTOR WITH GRADING AND RELATED SYSTEMS, DEVICES, AND METHODS

Skyworks Solutions, Inc.,...

1. A power amplifier module comprising:
a first die including a power amplifier and a passive component having an electrical property that depends on a condition
of the first die, the power amplifier including a bipolar transistor having a collector, a base, and an emitter, the collector
having a doping concentration of at least about 3×1016 cm?3 at an interface with the base, the collector also having a grading in which doping concentration increases away from the base;
and

a second die in communication with the first die, the second die including a bias circuit configured to generate a bias signal
based at least partly on an indication of the electrical property of the passive component of the first die and to provide
the bias signal to the power amplifier.

US Pat. No. 9,214,387

SYSTEMS AND METHODS FOR PROVIDING INTRAMODULE RADIO FREQUENCY ISOLATION

Skyworks Solutions, Inc.,...

1. An apparatus comprising:
a substrate;
a first radio frequency (RF) devices mounted on a surface of the substrate;
a second radio frequency (RF) devices mounted on a surface of the substrate in a side-by-side configuration with respect to
the first RF device;

a first conductive ground layer disposed at least partially below the first radio frequency device;
a first plurality of wirebond structures disposed on the substrate between the first radio frequency device and the second
radio frequency device;

a molding dimensioned to encapsulate at least a portion of the first and second radio frequency devices and at least a portion
of the first plurality of wirebond structures; and

a first conductive top layer disposed at least partially above the first radio frequency device and in electrical contact
with one or more of the first plurality of wirebond structures such that the first conductive ground layer, the one or more
of the first plurality of wirebond structures, and the first conductive top layer at least partially form a radio frequency
barrier between the first radio frequency device and the second radio frequency device.

US Pat. No. 9,576,826

SYSTEMS AND METHODS FOR CONTROLLING WAFER-BREAKER DEVICES

Skyworks Solutions, Inc.,...

1. A controller for a semiconductor wafer singulation apparatus, the controller comprising a processor configured to:
receive an input signal having information about at least one singulation parameter;
generate an output signal based on the input signal to effectuate an operation associated with the singulation parameter;
and

disable manual control of the singulation parameter.

US Pat. No. 9,252,719

TRANSMITTER WITH PREDISTORTER

Skyworks Solutions, Inc.,...

1. A transmitter module comprising:
a modulator circuit configured to modulate a received signal and to provide a modulated signal;
an upconverter configured to receive the modulated signal and to generate a radio frequency (RF) signal; and
a power amplifier circuit configured to amplify the RF signal, the power amplifier circuit including an amplifier field effect
transistor, a linear capacitance configured to couple an input voltage signal to a gate of the amplifier field effect transistor,
and a predistorter field effect transistor coupled to the amplifier field effect transistor, the power amplifier circuit arranged
such that a gate-source voltage of the amplifier field effect transistor corresponds to the input voltage signal capacitively
divided between the linear capacitance and combined nonlinear capacitances of the predistorter field effect transistor and
the amplifier field effect transistor.

US Pat. No. 9,214,712

APPARATUS AND METHODS RELATED TO FERRITE BASED CIRCULATORS

Skyworks Solutions, Inc.,...

14. A wireless device, comprising:
a transmitter circuit;
a receiver circuit;
an antenna configured to transmit signals from the transmitter circuit and to receive signals for the receiver circuit; and
a passive circulator for isolating transmit and receive signals between the transmitter and receiver circuits, including (a)
a pair of ferrite plates that extend laterally and have a perimeter defining a center portion and an edge portion, the center
portion of each of the ferrite plates having a first saturation magnetization value and the edge portion of each of the ferrite
plates having a second saturation magnetization value that is less than the first saturation magnetization value; (b) a magnet
assembly including a pair of magnets disposed relative to the ferrite plates to provide a static magnetic field to the ferrite
plates to magnetize the ferrite plates, the ferrite plates disposed between the pair of magnets and the magnetization configured
to facilitate transmission of a radio-frequency signal between first and second locations along the perimeter of the ferrite
plates based on a standing wave pattern formed in the ferrite plate due to the magnetization; (c) a magnetic circuit configured
to provide a return path for the magnetic field, the magnetic circuit including a pair of disks having a diameter larger than
a lateral dimension of the magnets, the magnets disposed between the pair of disks, and at least one hollow cylinder having
an inner diameter that generally equals the diameter of the pair of disks; and (d) signal ports coupled to the transmitter
circuit, the receiver circuit, and the antenna.

US Pat. No. 9,065,457

CIRCUITS AND METHODS FOR ELIMINATING REFERENCE SPURS IN FRACTIONAL-N FREQUENCY SYNTHESIS

Skyworks Solutions, Inc.,...

1. A phase locked loop (PLL) circuit for a frequency synthesizer of a wireless device, the PLL circuit comprising:
a phase frequency detector (PFD) configured to receive a reference signal and a feedback signal, the PFD further configured
to generate a first signal representative of a phase difference between the reference signal and the feedback signal;

a compensation circuit including a charging circuit in communication with the PFD, a charge pump, and a voltage-to-current
converter in communication with the charging circuit and positioned between the charging circuit and the charge pump, the
charging circuit including a capacitance element and configured to charge the capacitance element in response to the first
signal, the voltage-to-current converter configured to generate a control signal in response to a voltage the charged capacitance
element, the voltage representative of the phase difference, the compensation circuit configured to generate a compensation
signal based on the control signal; and

a voltage-controlled oscillator (VCO) in communication with the compensation circuit, the VCO configured to generate an output
signal based on the compensation signal, the compensation signal including at least one feature for substantially eliminating
one or more reference spurs associated with the PLL.

US Pat. No. 9,054,716

APPARATUS AND METHODS FOR ADJUSTING PHASE-LOCKED LOOP GAIN

Skyworks Solutions, Inc.,...

1. A frequency synthesizer comprising:
a plurality of voltage-controlled oscillators (VCOs) of which a selected VCO provides a VCO output to a closed loop of a phase-locked
loop;

a charge pump configured to adjust a loop gain of the phase-locked loop based on a charge pump current control value; and
a charge pump controller configured to select a VCO gain adjustment model corresponding to the selected VCO based on a VCO
gain indicator, the VCO gain adjustment model representing a segment of a piecewise linear representation of a VCO correction
curve associated with the selected VCO, the charge pump controller further configured to obtain, from a memory, VCO gain model
parameters corresponding to the selected VCO gain adjustment model and to adjust the charge pump current control value based
on the VCO gain model parameters to thereby cause the loop gain of the phase-locked loop to be adjusted.

US Pat. No. 9,905,640

ISOLATION STRUCTURES FOR SEMICONDUCTOR DEVICES INCLUDING TRENCHES CONTAINING CONDUCTIVE MATERIAL

SKYWORKS SOLUTIONS (HONG ...

1. An isolation structure formed in a semiconductor substrate of a first conductivity type, the substrate not including an
epitaxial layer, the isolation structure comprising:
a floor isolation region of a second conductivity type opposite to the first conductivity type submerged in the substrate,
an uppermost surface of the floor isolation region extending laterally in a direction parallel to a surface of the substrate
at a depth below the surface of the substrate;

a first trench including walls lined with a dielectric material and containing a conductive material, the first trench extending
downward from the surface of the substrate, the dielectric material and the conductive material of the first trench overlapping
onto a portion of the floor isolation region at the depth below the surface of the substrate, the first trench and the floor
isolation region electrically isolating a pocket of the first conductivity type from the substrate, the uppermost surface
of the floor isolation region defining a lower extent of the pocket;

a dielectric filled trench disposed within the pocket and extending downward from the surface of the substrate;
a second floor isolation region of the second conductivity type submerged in the substrate and laterally displaced from the
floor isolation region;

a second trench including walls lined with a second dielectric material and containing a second conductive material, the second
trench extending downward from the surface of the substrate, the second dielectric material and the second conductive material
of the second trench overlapping onto the second floor isolation region, the second trench and the second floor isolation
region electrically isolating a second pocket of the first conductivity type from the substrate; and

a buried deep implanted region of the first conductivity type disposed between the floor isolation region and the second floor
isolation region, the buried deep implanted region completely surrounded by material of the substrate, the material of the
substrate extending over the deep buried implanted region.

US Pat. No. 9,590,569

SYSTEMS, CIRCUITS AND METHODS RELATED TO LOW POWER EFFICIENCY IMPROVEMENT IN MULTI-MODE MULTI-BAND POWER AMPLIFIERS

Skyworks Solutions, Inc.,...

1. A power-amplifier (PA) system comprising:
a first amplification path having one or more PAs configured to generate a high power radio-frequency (RF) signal from an
input RF signal when in a high power mode;

a second amplification path having one or more PAs configured to generate a low power RF signal from the input RF signal when
in a low power mode;

a routing circuit configured to receive and route the input RF signal to the first amplification path or the second amplification
path; and

a switching circuit including a first pole coupled to the first amplification path and a second pole coupled to the second
amplification path, the switching circuit configured to route the high power RF signal through the first pole or the low power
RF signal through the second pole to a selected output path among a plurality of output paths corresponding to a plurality
of operating bands.

US Pat. No. 9,422,621

REFRACTORY METAL BARRIER IN SEMICONDUCTOR DEVICES

Skyworks Solutions, Inc.,...

13. A Schottky diode comprising:
a compound semiconductor substrate; and
a metal structure disposed on the compound semiconductor substrate, the metal structure including an electron beam evaporated
refractory metal layer having a thickness less than 300 angstroms disposed on the semiconductor substrate, a first electron
beam evaporated titanium (Ti) layer disposed on the refractory metal layer, an electron beam evaporated gold (Au) layer formed
on the first Ti layer, and a second electron beam evaporated Ti layer formed on the Au layer, the refractory metal layer configured
to inhibit diffusion of the Au layer into the compound semiconductor substrate.

US Pat. No. 9,660,584

POWER AMPLIFIER MODULES INCLUDING WIRE BOND PAD AND RELATED SYSTEMS, DEVICES, AND METHODS

Skyworks Solutions, Inc.,...

1. A power amplifier module comprising:
a power amplifier configured to receive a radio frequency signal and to provide an amplified radio frequency signal;
a wire bond pad electrically connected to the power amplifier by a wire bond, the wire bond pad including a nickel layer having
a thickness that is less than 0.5 um, a palladium layer over the nickel layer, and a gold layer over the palladium layer;
and

a conductive trace having a surface with a plated portion and an unplated portion surrounding the plated portion, the wire
bond pad being disposed over the plated portion.

US Pat. No. 9,571,049

APPARATUS AND METHODS FOR POWER AMPLIFIERS

Skyworks Solutions, Inc.,...

1. A power amplifier circuit assembly comprising:
an envelope tracker configured to generate a power supply voltage;
a power amplifier configured to receive the power supply voltage and to provide an amplified radio frequency signal at an
output, the amplified radio frequency signal having a fundamental frequency; and

an impedance matching network electrically coupled to the output of the power amplifier and configured to provide a load line
impedance between about 6? and about 10? at the fundamental frequency.

US Pat. No. 9,559,096

DEVICES AND METHODOLOGIES RELATED TO STRUCTURES HAVING HBT AND FET

SKYWORKS SOLUTIONS, INC.,...

1. An apparatus comprising:
a substrate;
a heterojunction bipolar transistor (HBT) over the substrate, the HBT including a first collector layer formed in a first
semiconductor material and a second collector layer formed in a second semiconductor material; and

a p-type field effect transistor (pFET) over the substrate and including a channel, the channel corresponding to a first semiconductor
portion of the pFET formed in the first semiconductor material, the pFET further including a second semiconductor portion
formed in the second semiconductor material.

US Pat. No. 9,473,076

LINEARITY PERFORMANCE FOR MULTI-MODE POWER AMPLIFIERS

Skyworks Solutions, Inc.,...

1. A power amplifier (PA) assembly comprising:
an amplification path configured to receive and amplify a radio-frequency (RF) signal, the amplification path including a
driver stage and an output stage, each of the driver and output stages including a transistor with a base, a collector and
an emitter;

a first bias path implemented between a supply node and the base of the driver stage;
a second bias path implemented to be electrically parallel with the first bias path between the supply node and the base of
the driver stage and configured to provide an additional base bias current to the base under a selected condition;

a third bias path implemented to provide a bias signal to the base of the output stage through a common node, a ballast resistance,
and an input node associated with the base of the output stage; and

a coupling path implemented between the input node of the output stage and the common node of the third bias path and configured
to improve linearity of the output stage operating in a first mode while allowing the ballast resistance to be sufficiently
robust for the output stage operating in a second mode.

US Pat. No. 9,413,313

MULTIMODE POWER AMPLIFIER BIAS CIRCUIT WITH SELECTABLE BANDWIDTH

Skyworks Solutions, Inc.,...

1. A bias circuit for a power amplifier, the bias circuit comprising:
a first bipolar junction transistor (BJT) configured to pass a reference current, the first BJT coupled with a second BJT
that performs at least some amplification for the power amplifier, the first and second BJTs configured as a current mirror,
each of the first and second BJTs having a collector, a base, and an emitter; and

a coupling circuit that couples the collector and the base of the first BJT, the coupling circuit including a switchable element
to allow the coupling circuit to be in a first state or a second state, the first state configured to yield a first bandwidth
for the bias circuit, the second state configured to yield a second bandwidth for the bias circuit.

US Pat. No. 10,349,568

OVERMOLDED ELECTRONIC MODULE WITH AN INTEGRATED ELECTROMAGNETIC SHIELD USING SMT SHIELD WALL COMPONENTS

Skyworks Solutions, Inc.,...

1. An overmolded electronic module comprising:a module circuit board;
at least one electronic component mounted on the module circuit board;
a plurality of shield components mounted on the module circuit board, each shield component dimensioned to be at least as high as a top portion of the at least one electronic component, arranged along a periphery of the module circuit board to electromagnetically shield the at least one electronic component, and including a conductive portion being in electrical contact with a surface of the electronic module, at least some of the plurality of shield components having cut surfaces resulting from being cut along a saw street defined by the shield components after being mounted on the circuit board;
an overmold material at least partially encapsulating the at least one electronic component and the plurality of shield components; and
a top conductive shield electrically coupled to exposed conductive portions of the plurality of shield components.

US Pat. No. 9,614,269

RF COUPLER WITH ADJUSTABLE TERMINATION IMPEDANCE

SKYWORKS SOLUTIONS, INC.,...

1. A radio frequency coupler comprising:
a power input port, a power output port, a coupled port, and an isolation port;
a main transmission line electrically connected to the power input port and the power output port;
a coupled line electrically connected to the coupled port and the isolation port; and
a termination impedance circuit configured to provide an adjustable termination impedance, the termination impedance circuit
including a first bank of switched impedances connected in series with a second bank of switched impedances, each of the first
and second bank of switched impedances including a plurality of switched impedances connected in parallel with each other,
each switched impedance including a switch in series with a passive impedance element, and the termination impedance circuit
being electrically connected between a reference potential and a selected port of the radio frequency coupler, the selected
port being one of the isolation port and the coupled port.

US Pat. No. 9,576,911

RADIO FREQUENCY MODULE INCLUDING SEGMENTED CONDUCTIVE GROUND PLANE

Skyworks Solutions, Inc.,...

1. A radio frequency module comprising:
a packaging substrate configured to receive a plurality of components;
first and second radio frequency devices implemented on the packaging substrate;
a plurality of wirebond structures implemented on the packaging substrate between the first radio frequency device and the
second radio frequency device;

a first conductive ground layer disposed at least partially below the first radio frequency device;
a second conductive ground layer in electrical contact with one or more of the plurality of wirebond structures, the second
conductive ground layer being at least partially electrically isolated from the first conductive ground layer; and

a first conductive top layer in electrical contact with the one or more of the plurality of wirebond structures, the first
conductive top layer, the plurality of wirebond structures, and the second conductive ground layer forming at least a partial
radio frequency barrier between the first radio frequency device and the second radio frequency device.

US Pat. No. 9,553,551

WIDE-BAND AMPLIFIERS USING CLIPPER CIRCUITS FOR REDUCED HARMONICS

Skyworks Solutions, Inc.,...

1. A wideband amplifier comprising:
a transistor having first, second and third regions where a signal applied to the third region controls current flow between
the first and second regions;

a negative waveform clipping element coupled to the third region to shape a peak-to-peak amplitude of the signal applied to
the third region and reduce a second harmonic of the signal; and

a wideband band pass filter (BPF) or low pass filter (LPF) coupled to an output of the amplifier to reduce harmonic levels.

US Pat. No. 9,539,801

DEBONDERS WITH A RECESS AND A SIDE WALL OPENING FOR SEMICONDUCTOR FABRICATION

Skyworks Solutions, Inc.,...

1. A debonding chuck comprising:
a first surface that defines a recess configured to hold a wafer of an assembly that includes the wafer bonded to a plate
having a first diameter that is larger than a second diameter of the wafer, the assembly configured such that the plate includes
a peripheral area not covered by the wafer, and such that when the wafer of the assembly is placed within the recess, at least
a portion of the peripheral area of the plate engages at least a portion of the first surface;

a second surface disposed in the recess and separated from the first surface, the second surface including a plurality of
suction openings configured to deliver suction to the recess and an angled surface formed along a portion of a perimeter of
the second surface; and

a third surface substantially connecting the first and the second surfaces.

US Pat. No. 9,530,719

DIRECT DIE SOLDER OF GALLIUM ARSENIDE INTEGRATED CIRCUIT DIES AND METHODS OF MANUFACTURING GALLIUM ARSENIDE WAFERS

Skyworks Solutions, Inc.,...

1. An electronic circuit device comprising:
a substrate;
a die attach pad located on the substrate;
a GaAs integrated circuit die having a copper backside contact pad and having a footprint of approximately the same size as
the die attach pad, the GaAs integrated circuit die being connected to the die attach pad by a solder layer, the solder layer
being disposed between the copper backside contact pad and the die attach pad on the substrate in a manner such that the GaAs
integrated circuit die self-aligns with the die attach pad after reflow of the solder layer; and

a barrier layer formed from nickel and a palladium flash layer, said barrier layer being disposed between said copper backside
contact pad and said solder layer.

US Pat. No. 9,509,363

CIRCUITS HAVING SWITCHES PROVIDING INCREASED VOLTAGE SWING UNIFORMITY

Skyworks Solutions, Inc.,...

1. An integrated circuit (IC) formed on a die, the IC comprising:
a switch including a first field effect transistor (FET) having a first body node and a second FET having a second body node,
the first and second FETs defining an RF signal path between an input port and an output port; and

a voltage distribution circuit coupled to the switch and configured to reduce voltage distribution variation across the switch,
the voltage distribution circuit including a connection path connected between the first body node and the second body node,
the connection path including a first resistor in series with a first capacitor, the voltage distribution circuit further
including a resistive network connected between the first body node and the second body node, the resistive network including
a bias node connected between third and fourth resistors.

US Pat. No. 9,460,840

SEAL RING INDUCTOR AND METHOD OF FORMING THE SAME

Skyworks Solutions, Inc.,...

1. An electronic system comprising:
an integrated circuit (IC) including a substrate, a circuit area disposed on the substrate, and a seal ring disposed on the
substrate and surrounding the perimeter of the circuit area, the circuit area including a first capacitor configured to receive
a radio frequency (RF) signal generated by the IC and electrically connected to an antenna or a first RF circuit that is external
to the IC, the seal ring including a first coil in a first conductive layer, the first coil having a first break defining
a first end and a second end of the first coil, the first end of the first coil including a first end of the seal ring, the
first end of the seal ring forming a single electrical node at which the seal ring is electrically connected to the first
capacitor and to the antenna or the first RF circuit, the seal ring configured to operate as an inductive component.

US Pat. No. 9,419,567

PROCESS-COMPENSATED HBT POWER AMPLIFIER BIAS CIRCUITS AND METHODS

SKYWORKS SOLUTIONS, INC.,...

1. A system for biasing a power amplifier, the system comprising:
a first die including a power amplifier circuit, a semiconductor resistor, and an isolation feature, the power amplifier circuit
including a transistor formed on a semiconductor, the semiconductor resistor formed from one or more layers as a layer stack
device on the semiconductor that includes the transistor, the isolation feature configured to isolate the semiconductor resistor
from the transistor, the semiconductor resistor configured to sense a beta parameter of the power amplifier circuit, the beta
parameter dependent on characteristics of the first die; and

a second die including a bias signal generating circuit that is configured to generate a bias signal based at least in part
on a measurement of the beta parameter sensed by the semiconductor resistor of the first die.

US Pat. No. 9,374,045

SIGNAL PATH TERMINATION

Skyworks Solutions, Inc.,...

1. An apparatus comprising:
a power amplifier die including a power amplifier configured to receive a radio frequency input signal and to provide an amplified
radio frequency signal at a power amplifier output;

an output matching network electrically connected to the power amplifier output, the output matching network configured to
provide impedance matching at a fundamental frequency of the amplified radio frequency signal, and the output matching network
including a first capacitor external to the power amplifier die; and

a harmonic termination circuit electrically connected to the power amplifier output, the harmonic termination circuit configured
to terminate at a phase corresponding to a harmonic frequency of the amplified radio frequency signal, the harmonic termination
circuit including a second capacitor external to the power amplifier die, the first capacitor and the second capacitor having
separate electrical connections to the power amplifier die.

US Pat. No. 9,531,413

MULTI-BAND DEVICE HAVING SWITCH WITH INPUT SHUNT ARM

Skyworks Solutions, Inc.,...

1. A radio frequency front end with reduced band loading, the radio frequency front end comprising:
a first transmission path including a first power amplifier configured to provide a first radio frequency signal, a first
matching network, and a first multi-throw switch configured to receive the first radio frequency signal by way of the first
matching network; and

a second transmission path including a second power amplifier configured to provide a second radio frequency signal that is
within a different frequency band than the first radio frequency signal, a second matching network, and a second multi-throw
switch configured to receive the second radio frequency signal at an input by way of the second matching network, the second
multi-throw switch having a plurality of throws that are coupled to a passive impedance element, the passive impedance element
being in series with an input shunt arm between the input of the multi-throw switch and a ground potential.

US Pat. No. 9,503,026

DYNAMIC ERROR VECTOR MAGNITUDE DUTY CYCLE CORRECTION

Skyworks Solutions, Inc.,...

1. An apparatus comprising:
an amplifier configured to amplify an input signal;
a low pass filter configured to receive an indication of a duty cycle of the amplifier and to generate a correction signal
based at least partly on the indication of the duty cycle of the amplifier, the indication of duty cycle being a binary signal
having an activated state corresponding to the amplifier being enabled and a deactivated state corresponding to the amplifier
being disabled; and

a bias circuit configured to generate a bias signal based at least partly on the correction signal such that changes in the
bias signal are inversely proportional to changes in the duty cycle of the amplifier, and the bias circuit configured to bias
the amplifier using the bias signal so as to compensate for a variation in gain of the amplifier from thermal effects as the
duty cycle of the amplifier changes.

US Pat. No. 9,478,977

OVERCURRENT PROTECTION DEVICE AND OVERCURRENT PROTECTION METHOD FOR ELECTRONIC MODULES

Skyworks Solutions, Inc.,...

1. An overcurrent protection system for a voltage converter circuit, the overcurrent protection system comprising:
a detection unit configured to detect an overcurrent condition associated with an output path of the voltage converter circuit
and generate an overcurrent signal indicative of the overcurrent condition; and

a consumption system in communication with the detection unit, the consumption system configured to consume and thereby reduce
a current in the output path of the voltage converter circuit upon receipt of the overcurrent signal, the consumption system
further configured to not consume the current when the overcurrent signal ceases, the consumption system including a switchable
resistance along the output path of the voltage converter circuit, the switchable resistance configured to provide a first
resistance when there is no overcurrent condition and a second resistance during the overcurrent condition, the second resistance
greater than the first resistance.

US Pat. No. 9,467,115

CIRCUITS, DEVICES AND METHODS RELATED TO COMBINERS FOR DOHERTY POWER AMPLIFIERS

Skyworks Solutions, Inc.,...

1. A signal combiner comprising:
a balun transformer circuit having a first coil and a second coil, the first coil implemented between a first port and a second
port, the second coil implemented between a third port and a fourth port, the first port and the third port coupled by a first
capacitance, the second port and the fourth port coupled by a second capacitance, the first port configured to receive a first
signal, the fourth port configured to receive a second signal, the second port configured to yield a combination of the first
signal and the second signal; and

a termination circuit that couples the third port to a ground, the termination circuit having a reactance approximately equal
in magnitude to an impedance at the second port.

US Pat. No. 9,350,367

HIGH AGILITY FREQUENCY SYNTHESIZER PHASE-LOCKED LOOP

Skyworks Solutions, Inc.,...

1. A method for rapidly generating a signal at an output frequency for use in a communication device comprising:
providing a reference signal at a reference frequency to a first signal synthesizer configured to generate a first signal
at a first frequency;

generating the first signal with the first signal synthesizer;
providing the reference signal at the reference frequency to a second signal synthesizer configured to generate a second signal
at a second frequency;

generating the second signal with the second signal synthesizer;
providing the first signal and the second signal to a switch;
responsive to a control signal, selectively outputting either the first signal or the second signal from the switch as part
of a switching operation;

responsive to switching operation, applying a first frequency modification to the first signal or a second frequency modification
to the second signal to thereby generate a frequency specific signal at an output frequency; and

outputting the frequency specific signal without the frequency specific signal passing through any switches after the frequency
modification, such that the switching operation is the only switching operation when producing the frequency specific signal.

US Pat. No. 9,628,121

PROGRAMMABLE TRANSMIT CONTINUOUS-TIME FILTER

Skyworks Solutions, Inc.,...

1. A transmit continuous time filter system for attenuating aliasing and noise, comprising:
a first programmable-current continuous time filter stage having first current circuitry; and
control logic configured to provide first digital programming data to the first programmable-current continuous time filter
stage, the first current circuitry of the first programmable-current continuous time filter stage configured to generate a
first level of programmable bias current in response the first digital programming data having a first value and to generate
a second level of programmable bias current lower than the first level in response to the first digital programming data having
a second value different from the first value.

US Pat. No. 9,467,940

FLIP-CHIP LINEAR POWER AMPLIFIER WITH HIGH POWER ADDED EFFICIENCY

Skyworks Solutions, Inc.,...

1. A flip-chip apparatus comprising:
a radio-frequency (RF) signal path having a node driven by at least one circuit element formed on a flip-chip die;
a first termination circuit electrically coupled to the RF signal path and configured to match an impedance at a fundamental
frequency of a signal at the node, the first termination circuit including a first circuit element that is external to the
flip-chip die; and

a second termination circuit electrically coupled to the RF signal path and separate from the first termination circuit, the
second termination circuit configured to terminate at a phase corresponding to a harmonic frequency of the signal at the node,
the second termination circuit including a second circuit element that is external to the flip-chip die, the second circuit
element being a capacitor, and the second circuit element and the first circuit element being electrically connected to the
flip-chip die by way of different bumps.

US Pat. No. 9,425,833

WIRELESS DEVICES HAVING REDUCED CLOCK FEED-THROUGH

SKYWORKS SOLUTIONS, INC.,...

1. A wireless device comprising:
one or more front-end modules configured to facilitate processing of a plurality of radio-frequency (RF) signals;
an antenna;
an RF switch configured to route at least a portion of the plurality of RF signals between the antenna and the one or more
front-end modules based on a mode of operation of the wireless device; and

a switch controller configured to control the RF switch, the switch controller including a controllable electrical source
having at least two sub-circuits configured to receive at least two control signals, each sub-circuit configured to receive
a respective control signal of the at least two control signals and to draw from a supply in response to an edge of the respective
control signal, the switch controller further including a control signal generator configured to provide the at least two
control signals to the controllable electrical source such that the at least two control signals are separated by at least
one non-zero phase difference.

US Pat. No. 9,143,125

RADIO-FREQUENCY SWITCHES HAVING EXTENDED TERMINATION BANDWIDTH AND RELATED CIRCUITS, MODULES, METHODS, AND SYSTEMS

Skyworks Solutions, Inc.,...

1. A switching circuit, comprising:
an input port configured to receive a radio-frequency (RF) signal;
an output port configured to output the RF signal;
a switch configured to be capable of being in first and second states, the first state corresponding to the input and output
ports being electrically connected so as to allow passage of the RF signal therebetween, the second state corresponding to
the input and output ports being electrically isolated; and

at least one termination circuit configured so as to provide termination for at least one of the input and output ports, the
termination circuit including an assembly of two or more electrically parallel branches, each branch having a resistor and
a capacitor connected in series so as to yield a desired impedance for the termination circuit when encountered by an RF signal
arriving at the respective port when the switch is in the second state, the RF signal having a frequency within a selected
frequency range, values of the capacitors of the two or more electrically parallel branches being selected such that the effective
capacitance of the termination circuit resonates with an inductance associated with the termination circuit within at least
a portion of the selected frequency range.

US Pat. No. 9,117,156

RFID DEVICE HAVING LOW-LOSS BARIUM-BASED CERAMIC OXIDE

Skyworks Solutions, Inc.,...

1. A method comprising:
providing a precursor mixture including a barium-based substance;
heating the precursor mixture to form a low-dielectric loss barium-based ceramic oxide;
providing a body material including the low-dielectric loss barium-based ceramic oxide; and
embedding a radio frequency identification (RFID) device in the body material.

US Pat. No. 9,071,325

SAW-LESS, LNA-LESS LOW NOISE RECEIVER

Skyworks Solutions, Inc.,...

1. A low noise receiver, comprising:
a passive low pass filter configured to filter a radio frequency (RF) signal directly from a switch module and to provide
a voltage gain to the RF signal, the passive low pass filter including an impedance matching circuit and further configured
to reduce a level of an interfering signal occurring at a frequency that is a seventh harmonic of the frequency of the RF
signal;

a downconverter coupled to the passive low pass filter and configured to receive the filtered RF signal, the downconverter
including a switching architecture configured to generate a plurality of output phases based on a respective plurality of
local oscillator (LO) signals, each of the plurality of output phases corresponding to a different phase within an LO period,
the plurality of output phases being organized into at least K groups, K being an integer greater than one, each nth group
of the K groups including an nth output phase of the plurality of output phases and an (n+K)th output phase of the plurality
of output phases;

a differencing stage configured to combine the plurality of output phases such that the nth output phase of each respective
group of the K groups is differenced with the (n+K)th output phase of the respective group, resulting in gain-added output
phases; and

a summation filter configured to receive the gain-added output phases and configured to combine the gain-added output phases
such that a response of the receiver effectively reduces odd harmonics of the RF signal including the third and fifth harmonics
of the RF signal.

US Pat. No. 10,074,716

SAUCER-SHAPED ISOLATION STRUCTURES FOR SEMICONDUCTOR DEVICES

SKYWORKS SOLUTIONS (HONG ...

1. An isolation structure formed in a semiconductor substrate of a first conductivity type, the substrate having a top surface and not including an epitaxial layer, the structure comprising:a region of a second conductivity type opposite to the first conductivity type, the region of the second conductivity type being saucer-shaped and having a floor portion substantially parallel to the top surface of the substrate and a sloped sidewall portion, the sloped sidewall portion extending downward from the top surface of the substrate at an oblique angle and merging with the floor portion, the floor portion and the sloped sidewall portion together forming an isolated pocket of the substrate of the first conductivity type;
a dielectric-filled trench located in the isolated pocket and extending downward from the top surface of the substrate, an entirety of the dielectric-filled trench being completely separated from the region of the second conductivity type by portions of the isolated pocket, an upper portion of the dielectric-filled trench terminating at the top surface of the substrate with no dielectric material extending from the dielectric-filled trench above the top surface of the substrate;
a second region of the second conductivity type outside the isolated pocket, the second region of the second conductivity type including a second floor portion substantially parallel to the top surface of the substrate and a second sloped sidewall portion, the second sloped sidewall portion extending downward from the top surface of the substrate at an oblique angle and merging with the second floor portion, the second floor portion and the second sloped sidewall portion together forming a second isolated pocket of the substrate of the first conductivity type; and
a second dielectric-filled trench extending downward from the top surface of the substrate, the second dielectric-filled trench being located between the region of the second conductivity type and the second region of the second conductivity type, the second dielectric-filled trench being completely separated from the region of the second conductivity type by portions of the substrate of the first conductivity type and completely separated from the second region of the second conductivity type by portions of the substrate of the first conductivity type.

US Pat. No. 9,787,897

SYSTEMS AND METHODS FOR EXTENDING OPERATION OF RADIO-FREQUENCY POWER AMPLIFIERS

Skyworks Solutions, Inc.,...

1. A system for operating a battery-powered wireless device, the system comprising:
a boost converter capable of generating a boosted-voltage output;
a controller coupled to the boost converter and configured to generate a control signal for the boost converter to generate
the boosted-voltage output under a selected condition; and

a switching circuit configured to route the boosted-voltage output of the boost converter to a radio-frequency (RF) block
under the selected condition.

US Pat. No. 9,628,134

SYSTEMS, DEVICES AND METHODS RELATED TO STACKED BAND SELECTION SWITCH DEVICES

Skyworks Solutions, Inc.,...

1. A radio-frequency (RF) module comprising:
a packaging substrate configured to receive a plurality of components;
a power amplifier (PA) assembly implemented on a PA die mounted on the packaging substrate;
an output matching network (OMN) device mounted on the packaging substrate and configured to provide output matching functionality
for at least a portion of the PA assembly; and

a band selection switch device mounted on the OMN device.

US Pat. No. 9,602,056

AMPLIFIER WITH BASE CURRENT REUSE

SKYWORKS SOLUTIONS, INC.,...

1. A power amplifier module for an radio frequency communications circuit, the module comprising:
a driver stage amplifier having an input that receives an radio frequency signal, the driver stage amplifier powered by a
supply voltage which is applied across first and second nodes of the driver stage amplifier to amplify the radio frequency
signal;

a final stage amplifier that receives an amplified radio frequency signal from an output of the driver stage amplifier on
the first node, that is powered by a supply voltage applied across the final stage amplifier, and that provides an amplified
output signal, a bias current applied to the input of the final stage amplifier and applied to the second node to power the
driver stage amplifier to reduce the current that flows through the driver stage amplifier; and

an envelope tracking module that provides power to at least one of the driver stage amplifier and final stage amplifier.

US Pat. No. 9,478,428

APPARATUS AND METHODS FOR SHIELDING A PLASMA ETCHER ELECTRODE

SKYWORKS SOLUTIONS, INC.,...

26. An apparatus for etching a plurality of features on a wafer, the apparatus comprising:
a chamber;
a feature plate disposed in the chamber for holding the wafer;
an anode and a cathode within the chamber;
a radio frequency power source configured to provide a radio frequency voltage between the anode and the cathode;
a clamp for holding the wafer against the feature plate, the clamp including one or more electrical measurement holes configured
to pass a portion of the plasma ions through the clamp to impact the feature plate;

a plurality of rods configured to secure the clamp against the feature plate, the plurality of rods including a first rod;
a spring clamp assembly having a first end connected to the clamp and a second end connected to a first end of the first rod,
the spring clamp assembly including a spring configured to provide tolerance to variation in thickness between wafers processed
in the chamber; and

an electrode shield surrounding at least a portion of the cathode, the electrode shield including a first region having a
first thickness and a second region having a second thickness less than the first thickness, the electrode shield further
including a plurality of rod holes through the first region, the plurality of rods configured to pass through the plurality
of rod holes.

US Pat. No. 9,450,629

SYSTEMS AND METHODS FOR CONTROLLING LOCAL OSCILLATOR FEED-THROUGH

Skyworks Solutions, Inc.,...

1. A method comprising:
convolving signal components of a radio frequency (RF) signal generated by a transmitter to generate a detector signal, the
detector signal having at least a side band tone and a local oscillator (LO) feed-through tone, the LO feed-through tone of
the detector signal corresponding to a cross-product of a LO feed-through tone of the RF signal generated by the transmitter
and a side band tone of the RF signal generated by the transmitter, the LO feed-through tone of the detector signal having
a greater magnitude than a corresponding LO feed-through tone in the RF signal generated by the transmitter;

digitizing a processed version of the detector signal to generate a digitized signal using an analog-to-digital converter,
the analog-to-digital converter having a sampling rate that is greater than two times a noise bandwidth of a filter in a signal
path associated with the detector signal;

filtering the digitized signal to attenuate the side band tone and provide a filtered signal in which the LO feed-through
tone has a greater magnitude than any other tone of the filtered signal;

detecting a signal level corresponding to LO feed-through in the RF signal of the transmitter based at least in part on said
filtering; and

responsive to detecting the signal level, modifying at least one of a direct current (DC) offset level for an in-phase (I)
signal in the transmitter and a DC offset level for a quadrature-phase (Q) signal in the transmitter.

US Pat. No. 9,078,215

PROGRAMMABLE TRANSMIT CONTINUOUS-TIME FILTER

Skyworks Solutions, Inc.,...

1. A radio frequency (RF) transmitter comprising:
a programmable-current transmit continuous-time filter (TX-CTF) including a programmable-current first CTF stage having an
input configured to receive a baseband transmission signal, first CTF stage amplifier circuitry, and programmable first CTF
stage current circuitry configured to provide a first stage bias current generated in response to first digital programming
data to the first CTF stage amplifier circuitry, the programmable-current TX-CTF further including a programmable-current
second CTF stage having an input configured to receive an output of the programmable-current first CTF stage, second CTF stage
amplifier circuitry, and programmable second CTF stage current circuitry configured to provide a second stage bias current
generated in response to second digital programming data to the second CTF stage amplifier circuitry; and

control logic configured, in response to the one or more transmitter control signals, to produce the first and second digital
programming data.