US Pat. No. 10,893,616

MULTILAYER PRINTED WIRING BOARD PRODUCTION METHOD, ADHESIVE LAYER-EQUIPPED METAL FOIL, METAL-CLAD LAMINATE, AND MULTILAYER PRINTED WIRING BOARD

Showa Denko Materials Co....

1. A method of producing a multi-layered printed wiring board, comprising the following steps 1 to 3:Step 1: a step of laminating a multilayer structure comprising, in order, a support, a metal foil and an organic adhesive layer, on a substrate with an inner layer circuit via an organic insulating resin layer, with the organic insulating resin layer being provided between the organic adhesive layer and the substrate with an inner layer circuit, the inner layer circuit having a thickness of 10 to 30 ?m, the metal foil having a thickness of 3 ?m or less and 1/10 to ? relative to the thickness of the inner layer circuit, and the organic adhesive layer having a thickness of 1 to 10 ?m, and then releasing the support to form a laminated sheet (a) having the metal foil as an outer layer metal foil layer;
Step 2: a step of irradiating the laminated sheet (a) with a laser to bore the outer layer metal foil layer, the organic adhesive layer, and the organic insulating resin layer to form a bored laminated sheet (b) having a blind via hole; and
Step 3: a step of forming an outer layer circuit connected with the inner layer circuit through the following steps 3-1 to 3-4;
Step 3-1: a step of removing the outer layer metal foil layer of the bored laminated sheet (b) formed in the step 2 by etching and then forming an outer layer copper layer having a thickness of 0.1 to 2 ?m on the bored laminated sheet (b);
Step 3-2: a step of forming a resist pattern by a resist applied on the outer layer copper layer;
Step 3-3: a step of forming a circuit layer on the surface of the outer layer copper layer on which the resist pattern is not formed, by electrolytic copper plating; and
Step 3-4: a step of removing the resist pattern and then removing the exposed outer layer copper layer by etching, thereby forming an outer layer circuit connected with the inner layer circuit.

US Pat. No. 10,892,482

NEGATIVE ELECTRODE MATERIAL FOR LITHIUM ION SECONDARY BATTERY, NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERY, AND LITHIUM ION SECONDARY BATTERY

Showa Denko Materials Co....

1. A lithium ion secondary battery, comprising:a positive electrode;
a negative electrode for a lithium ion secondary battery comprising a current collector, and a negative electrode material layer provided on the current collector, the negative electrode material layer comprising a negative electrode material (SiOx-C) comprising:
a silicon oxide represented by a formula SiOx (x is 0<+?2) having silicon crystallite present and having a diffraction peak attributable to Si (111) in an X-ray diffraction spectrum,
wherein a size of silicon crystallite calculated from the diffraction peak is from 2.0 nm to 8.0 nm,
wherein the silicon oxide further comprises carbon on a part of a surface thereof or the entire surface thereof,
wherein the carbon has an R value in a Raman spectrum of from 0.5 to 1.5, and
wherein a content ratio of the carbon is 0.5% by mass or more and less than 5.0% by mass; and
an electrolyte,
wherein the negative electrode material layer further comprises a carbonaceous negative electrode material (C), and a ratio of the negative electrode material (SiOx-C) to the carbonaceous negative electrode material (C) is from 1:99 to 10:90 in terms of mass.

US Pat. No. 10,875,008

SEPARATION MATERIAL

SHOWA DENKO MATERIALS CO....

1. A separation material comprising:porous polymer particles that comprise a styrene-based monomer as a monomer unit; and a coating layer that comprises a crosslinked modified agarose modified with a hydrophobic group and covers at least a portion of the surface of the porous polymer particles,
wherein the separation material has a 5% compressive deformation modulus of 100 to 1,000 MPa, and has a mode diameter in the pore size distribution of 0.1 to 0.5 ?m, and
the separation material comprises 160 to 410 mg of the coating layer per 1 g of the porous polymer particles.

US Pat. No. 10,880,997

STRETCHABLE MEMBER WITH METAL FOIL

SHOWA DENKO MATERIALS CO....

1. A stretchable member with a metal foil, comprising:a stretchable resin base material; and
a conductive metal foil provided on the stretchable resin base material,
wherein a surface of the metal foil on the stretchable resin base material side is a roughened surface having surface roughness Ra of 0.1 ?m to 3 ?m, and
a recovery rate after the stretchable resin base material is subjected to tensile deformation up to strain of 20% is greater than or equal to 80%.
US Pat. No. 10,876,000

THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATED BOARD, PRINTED WIRING BOARD, AND HIGH SPEED COMMUNICATION-COMPATIBLE MODULE

Showa Denko Materials Co....

1. A thermosetting resin composition comprising:(A) an addition reaction product of a maleimide compound having at least two N-substituted maleimide groups in one molecule (a1) and an amine compound having at least two primary amino groups in one molecule (a2), wherein the component (a2) contains a modified siloxane having an amino group at the end thereof,
(B) a thermoplastic elastomer, and
(C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a carboxylic acid anhydride.

US Pat. No. 10,865,332

EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE

Showa Denko Materials Co....

1. An epoxy resin composition, consisting of:an epoxy resin component (A) consisting of:
(1) a first compound represented by the following Formula (I), or
(2) an epoxy resin component consisting of:
at least 80% by mass, based on a total amount of the epoxy resin, of the first compound represented by the following Formula (I);
and a second epoxy compound having at least two epoxy groups per molecule, the second epoxy compound including a cresol novolac epoxy resin as the epoxy resin component (A);
(B) a phenol resin including a compound represented by the following Formula (II);
(C) a dihydroxynaphthalene compound including a compound represented by the following Formula (III); and
optionally, one or more of an antioxidant, a curing accelerator, an inorganic filler, a coupling agent, an ion exchanger, a mold releasing agent, a stress relaxing agent, a flame retardant, and a colorant;

wherein, in the Formula (I), R represents a hydrogen atom, and n represents an integer from 0 to 10;

wherein, in the Formula (II), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms, and each R1 may be the same as or different from another R1, and n represents an integer from 0 to 10;

wherein, in the Formula (III), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms;
wherein a content of a total amount of the compound represented by the Formula (III) with respect to a total amount of the compound represented by the Formula (II) and the compound represented by the Formula (III) is from 10% by mass to 55% by mass; and
wherein the epoxy resin composition is solid at 25° C.
US Pat. No. 10,868,252

ORGANIC ELECTRONICS MATERIAL AND USE THEREOF

Showa Denko Materials Co....

1. An organic electronic material comprising a charge transport polymer having a polymerizable functional group at least at a terminal portion of the charge transport polymer and for which, in a molecular weight distribution chart measured by GPC, an area ratio accounted for by components having a molecular weight of less than 20,000 is not more than 40%, and an area ratio accounted for by components having a molecular weight of 500 or less is not more than 1%.