US Pat. No. 9,257,234

MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor comprising:
a ceramic body having a plurality of dielectric layers stacked therein;
an active part including a plurality of first and second internal electrodes alternately exposed through end surfaces of the
ceramic body, respectively, with each of the dielectric layers interposed between the first and second internal electrodes;

upper and lower cover layers disposed on upper and lower portions of the active part, respectively; and
first and second external electrodes including head parts formed on the both end surfaces of the ceramic body and band parts
extended from the head parts to portions of a mounting surface of the ceramic body,

wherein when a thickness of the upper or lower cover layer is defined as C, a width of a margin portion of the ceramic body
in a width direction is defined as M, a cross-sectional area of the ceramic body in a width-thickness direction is defined
as Ac, a cross-sectional area of the active part in a width-thickness direction in a portion thereof in which the first and
second internal electrodes are overlapped with each other in a thickness direction is defined as Aa, and a width of the band
part of the first or second external electrode is defined as B,

1.826?C/M?4.686, 0.2142?Aa/Ac?0.4911, and 0.5050?C/B?0.9094 are satisfied.

US Pat. No. 9,305,705

MULTILAYER CERAMIC ELECTRONIC COMPONENT

Samsung Electro-Mechanics...

1. A multilayer ceramic electronic component, comprising:
a ceramic body having internal electrodes formed therein;
external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes; and
a buffer layer formed on surfaces of contact between the internal electrodes and the external electrodes among external surfaces
of the ceramic body, in an interior direction of the ceramic body,

wherein when a thickness of the external electrode is denoted by T, a thickness of the buffer layer is denoted by t, a thickness
of an active region is denoted by TA, and a thickness of the ceramic body is denoted by Tc, T?10 ?m, TA/TC>0.8, and t?5 ?m.

US Pat. No. 9,305,704

MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD THEREOF

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor, comprising:
a ceramic body having a plurality of dielectric layers stacked therein in a thickness direction and a groove portion recessed
in a lower surface thereof toward the thickness direction, wherein the groove portion extends in a width direction;

a plurality of first and second internal electrodes disposed in the thickness direction in the ceramic body to be alternately
exposed through both end surfaces of the ceramic body, having the dielectric layers therebetween; and

first and second external electrodes respectively formed on both end portions of the ceramic body and electrically connected
to the first and second internal electrodes, respectively.

US Pat. No. 9,291,797

LENS MODULE

SAMSUNG ELECTRO-MECHANICS...

1. A lens module comprising:
a first lens having positive refractive power of which an image-side surface is convex;
a second lens having negative refractive power of which an image-side surface is concave;
a third lens having negative refractive power;
a fourth lens having refractive power;
a fifth lens having negative refractive power and having a shape in which an image-side surface thereof is convex; and
a sixth lens having refractive power, having a shape in which an image-side surface thereof is concave, and having at least
one point of inflection formed on the image-side surface thereof,

wherein an optical system including the first to sixth lenses satisfies Conditional Equation 5:
|f5/f1|>9.0  [Conditional Equation 5]

where f5 indicates a focal length [mm] of the fifth lens and f1 indicates a focal length [mm] of the first lens.

US Pat. No. 9,287,045

DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR INCLUDING THE SAME

SAMSUNG ELECTRO-MECHANICS...

6. A multilayer ceramic capacitor, comprising:
a ceramic body in which dielectric layers and first and second internal electrodes are alternately stacked; and
first and second external electrodes formed on both end portions of the ceramic body and electrically connected to the first
and second internal electrodes,

wherein the dielectric layers include a dielectric ceramic composition including a base powder represented by xSrTiO3-(1?x)BiMO3 (M includes Mg and Ti) containing a first main component represented by SrTiO3 and a second main component represented by BiMO3, and x satisfies 0.5?x?0.9.

US Pat. No. 9,288,906

MOUNTING CIRCUIT BOARD OF MULTILAYER CERAMIC CAPACITOR

SAMSUNG ELECTRO-MECHANICS...

1. A mounting circuit board of a multilayer ceramic capacitor comprising:
a multilayer ceramic capacitor including a ceramic body in which a plurality of dielectric layers are stacked, an active layer
including a plurality of first and second internal electrodes alternately exposed to both side surfaces of the ceramic body,
having the dielectric layer interposed therebetween, and first and second external electrodes extended from both side surfaces
of the ceramic body to a portion of a lower surface thereof; and

a printed circuit board having first and second electrode pads so that the first and second external electrodes of the multilayer
ceramic capacitor are mounted thereon,

wherein the first and second electrode pads are disposed in positions diagonally opposed to each other, based on the ceramic
body of the multilayer ceramic capacitor,

wherein 0.58?W/S<1.00 in which W is a width of the ceramic body, and S is a distance between a front end of the first electrode
pad disposed on one side surface of the ceramic body and a front end of the second electrode pad disposed on the other side
surface.

US Pat. No. 9,240,274

COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A common mode filter, comprising:
an external magnetic layer;
an insulating layer formed on the external magnetic layer and having coil electrodes therein;
a protecting layer having an opening part, wherein the opening part is formed on the insulating layer;
an internal magnetic layer formed inside the opening part of the protecting layer such that the internal magnetic layer is
not exposed to an exterior; and

external electrode terminals connected with end portions of the coil electrodes, wherein the external electrode terminals
pass through the protecting layer along with side surfaces of the protecting layer so that side surfaces of the external electrode
terminals are exposed.

US Pat. No. 9,258,466

CAMERA MODULE

Samsung Electro-Mechanics...

1. A camera module comprising:
a lens barrel including at least one lens stacked and bonded therein and having a lower protrusion part for maintaining a
constant flatness formed on a bottom surface thereof; and

a housing having an internal space so as to receive the lens barrel therein and having a supporting surface supporting the
lens barrel,

wherein there is a plurality of protrusion parts provided on the bottom surface of the lens barrel, wherein each of the lower
protrusion parts is not an electrical connecting means, and wherein the plurality of lower protrusion parts is protruded at
a height of 0.001 mm to 1.0 mm, a width of 0.001 mm to 0.3 mm, and a length of 0.001 mm to 3.0 mm.

US Pat. No. 9,240,699

POWER SUPPLY APPARATUS AND POWER SUPPLY APPARATUS FOR ELECTRIC VEHICLE

SAMSUNG ELECTRO-MECHANICS...

1. A power supply apparatus comprising:
a charging unit charging a battery with charging power by converting input power into the charging power having a predetermined
level and after the charging is completed, supplying the charged power from the battery;

a main power supplying unit converting the input power into main power having a predetermined level to supply the main power
to a load during the charging of the battery by the charging unit, and after the charging of the battery by the charging unit
is completed, converting the charged power from the charging unit into the main power to supply the main power to the load;
and

an auxiliary power supplying unit not receiving a power supply during the charging of the battery by the charging unit, and
after the charging of the battery by the charging unit is completed, converting the charged power from the charging unit into
auxiliary power having a predetermined level to supply the auxiliary power to another load.

US Pat. No. 9,155,199

PASSIVE DEVICE EMBEDDED IN SUBSTRATE AND SUBSTRATE WITH PASSIVE DEVICE EMBEDDED THEREIN

Samsung Electro-Mechanics...

1. A substrate with a passive device embedded therein, comprising:
a core layer having a cavity;
a passive device comprising
a laminate formed by alternately laminating a plurality of internal electrodes and dielectric layers,
a first external electrode having a first upper cover region, which covers a part of an upper portion of the laminate, and
a first lower cover region, which covers a part of a lower portion of the laminate and has a smaller area than the first upper
cover region, and

a second external electrode having a second lower cover region, which covers a part of the lower portion of the laminate,
and a second upper cover region, which covers a part of the upper portion of the laminate and has a smaller area than the
second upper cover region, wherein the first upper cover region is larger than the second upper cover region, and the second
lower upper region has a larger area than the first lower cover region, and embedded in the cavity;

insulating layers laminated on and under the core layer;
circuit patterns formed on the insulating layers; and
vias respectively mounted on the first upper cover region and the second lower cover region of the passive device through
the insulating layers to electrically connect the first and second external electrodes to the circuit patterns, wherein only
one via is on the first upper cover region of the passive device and only one via is on the second lower cover region of the
passive device.

US Pat. No. 9,305,686

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic electronic component comprising:
a ceramic body;
internal electrodes multilayered within the ceramic body and including a first conductive oxide; and
external electrodes formed on outer surfaces of the ceramic body, connected to the internal electrodes, and including a second
conductive oxide,

wherein the first conductive oxide and the second conductive oxide are the same conductive oxide, and
wherein the first conductive oxide and the second conductive are an indium-tin oxide.

US Pat. No. 9,293,258

MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING INSULATING LAYERS FORMED ON LATERAL AND END SURFACES THEREOF

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic electronic component comprising:
a ceramic main body including a dielectric layer and having first and second main surfaces opposing one another, first and
second lateral surfaces opposing one another, and first and second end surfaces opposing one another;

a first internal electrode formed within the ceramic main body, including a capacitance formation part having an overlap region
to form capacitance and a first lead out portion extending from the capacitance formation part so as to be exposed to the
first lateral surface, and exposed to the first and second end surfaces;

a second internal electrode alternately laminated together with the first internal electrode with the dielectric layer interposed
therebetween, insulated from the first internal electrode, having a second lead out portion extending from the capacitance
formation part so as to be exposed to the first lateral surface, and formed to be spaced apart from the first and second end
surfaces by a predetermined interval;

first and second external electrodes formed to be connected to the first lead out portion and the second lead out portion,
respectively; and

insulating layers formed on the first lateral surface, the first end surface, and the second end surface of the ceramic main
body, respectively,

wherein the first external electrode is formed on a first outer area of the first lateral surface, and the second external
electrode is formed on a second outer area of the first lateral surface opposing the first external electrode, the first and
second outer areas being arranged on opposite sides of a center line dividing the first lateral surface, and

wherein the insulating layer which is formed on the first lateral surface is formed between the first and second external
electrodes so as to intersect the center line and covers at least one of the exposed areas of the first and second lead out
portions.

US Pat. No. 9,269,491

MULTILAYER CERAMIC CAPACITOR AND MOUNTING CIRCUIT BOARD THEREFOR

Samsung Electro-Mechanics...

1. A multilayer ceramic capacitor comprising:
a ceramic body formed by laminating a plurality of dielectric layers in a width direction;
a plurality of first and second internal electrodes disposed to face each other within the ceramic body, having each of the
dielectric layers interposed therebetween, and having respective lead portions exposed to an upper surface of the ceramic
body;

first and second external electrodes formed on the upper surface of the ceramic body and connected to the lead portions, respectively;
and

first and second terminal frames each including a vertical portion facing end surfaces of the ceramic body and upper and lower
horizontal portions facing upper and lower surfaces of the ceramic body, respectively,

wherein the upper horizontal portions of the first and second terminal frames are connected to the first and second external
electrodes, respectively, and

adhesive layers are provided only between the upper horizontal portions and the first and second external electrodes, respectively.

US Pat. No. 9,256,307

TOUCH PANEL

Samsung Electro-Mechanics...

1. A touch panel, comprising:
a transparent substrate;
an electrode array disposed on an active area of the transparent substrate; and
a wiring array;
wherein the electrode array has at least two electrodes including first and second electrodes disconnected to each other and
arranged in a first direction, and each of the first and second electrodes includes a plurality of column patterns continuously
arranged, each of the column patterns having parallelogram patterns continuing along the first direction, and

the wiring array has at least two wirings including first and second wirings arranged in parallel with each other along the
first direction and each other of the first and second wirings has a zigzag shape where a first peak and a second peak are
formed alternatively and continuously, and the first wiring has a first portion connected to one side of the first electrode
and second portion disconnected to the first portion and connected to one side of the second electrode, and the second wiring
is disconnected to the first portion of the first wiring and connected to one side of the second electrode via the second
portion of the first wiring.

US Pat. No. 9,257,230

MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor comprising:
a ceramic body including a plurality of dielectric layers and having first and second main surfaces opposing each other, first
and second side surfaces opposing each other, and first and second end surfaces opposing each other;

a capacitor part disposed in the ceramic body and including first and second internal electrodes, the first internal electrode
having a first lead exposed to the second main surface and the second internal electrode having a second lead exposed to the
first main surface;

resistor parts including first internal connection conductors exposed to the first and second main surfaces and the first
end surface and second internal connection conductors exposed to the first and second main surfaces and the second end surface,
the first and second internal connection conductors being disposed on the same dielectric layers among the plurality of dielectric
layers in the ceramic body; and

first to fourth external electrodes disposed on the first and second main surfaces of the ceramic body and electrically connected
to the first and second internal electrodes and the first and second internal connection conductors, first and third connection
terminals disposed on the first end surface of the ceramic body and connected to the first internal connection conductors,
and second and fourth connection terminals disposed on the second end surface of the ceramic body and connected to the second
internal connection conductors,

wherein the capacitor part and the resistor parts are connected in series to one another.

US Pat. No. 9,266,266

CASE OF ELECTRONIC DEVICE HAVING ANTENNA PATTERN FRAME EMBEDDED THEREIN, MOLD THEREFOR AND METHOD OF MANUFACTURING THEREOF

Samsung Electro-Mechanics...

1. A case of an electronic device having an antenna pattern embedded therein, the case comprising:
a radiator frame having a through hole, a radiator including an antenna pattern part disposed on a surface of the radiator
frame, the antenna pattern part being apart from the through hole with a predetermined distance; and

a case frame covering the radiator frame such that the case frame is secured to the radiator frame via the through hole.

US Pat. No. 9,281,257

SEMICONDUCTOR PACKAGE INCLUDING A CONNECTING MEMBER

SAMSUNG ELECTRO-MECHANICS...

1. A semiconductor package comprising:
at least one electronic device;
a lead frame including a plurality of leads electrically connected to the electronic device;
a lead connecting member coupled to at least one of the leads; and
a molded portion sealing the electronic device and the lead connecting member,
wherein the leads include at least one through hole to which the lead connecting member is coupled.

US Pat. No. 9,263,176

CONDUCTOR PATTERN AND ELECTRONIC COMPONENT HAVING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A conductor pattern of an electronic component formed in an oval coil shape on a magnetic substrate, the conductor pattern
comprising:
a straight part; and
a curved part connected to the straight part at both sides thereof,
wherein a line width of all the curved part is smaller than that of the straight part,
a space between the conductor pattern of the curved part is wider than a space between the conductor pattern of the straight
part, and

a sum of the line width of the curved part and the space between the conductor patterns of the curved part is equal to a sum
of the line width of the straight part and the space between the conductor patterns of the straight part.

US Pat. No. 9,231,547

FILTER FOR REMOVING NOISE AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A filter for removing noise, which comprises:
a lower magnetic body;
an insulating layer disposed on the lower magnetic body and including at least one conductor pattern;
input and output stud terminals electrically connected to the at least one conductor pattern for electrical input and output
of the at least one conductor pattern; and

an upper magnetic body consisting of an inner upper magnetic body and an outer upper magnetic body,
wherein the inner upper magnetic body includes a first ferrite powder having a particle size within a first interval between
the input and output stud terminals, and

wherein the outer upper magnetic body includes a second ferrite powder having a particle size within a second interval between
the input and output stud terminals and an outer surface of lower the magnetic body.

US Pat. No. 9,263,560

POWER SEMICONDUCTOR DEVICE HAVING REDUCED GATE-COLLECTOR CAPACITANCE

SAMSUNG ELECTRO-MECHANICS...

1. A power semiconductor device, comprising:
a first conductivity type first semiconductor region;
a second conductivity type second semiconductor region disposed on an upper portion of the first semiconductor region;
a first conductivity type third semiconductor region disposed in an upper inner side of the second semiconductor region;
a trench gate penetrating through a portion of the first semiconductor region from the third semiconductor region;
a first conductivity type fourth semiconductor region disposed below the second semiconductor region while being spaced apart
from the trench gate; and

a fifth semiconductor region formed in an upper portion of the second semiconductor region and formed to be in contact with
the fourth semiconductor region.

US Pat. No. 9,250,739

TOUCH SENSING DEVICE AND TOUCHSCREEN DEVICE

Samsung Electro-Mechanics...

18. A touch sensing device, comprising:
a driving circuit unit inputting a signal to a node capacitor that outputs a first voltage;
a first buffer unit including a first node of a first buffer capacitor charged and discharged by the first voltage output
by the node capacitor and a second voltage, the first voltage and the second voltage being respectively input to the first
buffer capacitor at a predetermined period;

a first integrating circuit unit integrating a charging voltage of a second node of the first buffer capacitor;
a second buffer unit including a first node of a second buffer capacitor charged and discharged by an output of the first
integrating circuit unit and the second voltage, the output of the first integrating circuit unit and the second voltage being
alternatively input to the second buffer capacitor;

a second integrating circuit unit integrating a charging voltage of a second node of the second buffer capacitor;
a signal conversion unit comparing a voltage output from the second integrating circuit unit, which is based on the integrated
charging voltage of the second node of the second buffer capacitor, with a predetermined reference voltage to generate the
second voltage; and

a touch determination unit counting the second voltage using a predetermined reference clock to determine a touch.

US Pat. No. 9,245,685

COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A common mode filter, comprising:
a body element including an insulating member enclosing coil electrode patterns and a magnetic member disposed on one surface
or both surfaces of the insulating member; and

an insulating layer disposed on at least one side surface of the body element,
wherein the at least one side surface extends in a thickness direction of the body element.

US Pat. No. 9,247,287

COMMUNAL TELEVISION RECEIVING SYSTEM AND METHOD THEREOF

SAMSUNG ELECTRO-MECHANICS...

1. A communal television receiving system, comprising: a common wireless distributing apparatus performing a scanning operation
for a wireless local area network (WLAN) communications module included in a WLAN communications network, determining transmission
power with the WLAN communications module transmitting an acknowledgement (ACK) signal for the scanning operation, converting
a received television signal into a WLAN signal having the determined transmission power, and transmitting the WLAN signal;
and first to Nth wireless residential apparatuses transmitting the ACK signal as a response to the scanning operation of the
common wireless distributing apparatus, receiving the WLAN signal from the common wireless distributing apparatus, and outputting
the television signal; wherein when the wireless residential apparatus which does not transmit the ACK signal is present in
the first to Nth wireless residential apparatuses, the common wireless distributing apparatus determines a most remote wireless
residential apparatus among the wireless residential apparatuses transmitting the ACK signal as a relay terminal candidate
and requests the corresponding wireless residential apparatus operate as the relay terminal.

US Pat. No. 9,117,992

APPARATUS FOR DRIVING PIEZO ACTUATOR AND METHOD OF DRIVING THE SAME

Samsung Electro-Mechanics...

1. An apparatus for driving a piezo actuator, comprising:
a control unit generating a digital control signal and converting the digital control signal into an analog control signal;
a driving unit amplifying and not inverting the analog control signal to generate a first driving signal and amplifying and
inverting the analog control signal to generate a second driving signal, with respect to a predetermined common voltage, and
applying the first and second driving signals to both terminals of a piezo actuator; and

an offset determining unit determining an offset in the first and second driving signals based on a voltage according to a
current flowing in the piezo actuator,

wherein the control unit generates the digital control signal to have an intermediate level in a predetermined offset detection
section.

US Pat. No. 9,384,893

MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor comprising:
a ceramic body including dielectric layers and having first and second main surfaces facing each other in a thickness direction,
first and second end surfaces facing each other in a length direction, and first and second side surfaces facing each other
in a width direction;

an active layer disposed in the ceramic body and including first internal electrodes each having a first lead part exposed
to at least one of the first and second side surfaces, and second internal electrodes opposed to the first internal electrodes,
with the dielectric layers interposed therebetween, and each having a second lead part exposed to the at least one of the
first and second side surfaces, thereby forming capacitance;

an upper cover layer formed on an upper portion of the active layer in the thickness direction;
a lower cover layer formed on a lower portion of the active layer in the thickness direction and having a thickness greater
than that of the upper cover layer;

a first external electrode connected to the first internal electrodes and extended from the side to which the first lead part
is exposed to at least one of the first and second main surfaces;

a second external electrode connected to the second internal electrodes and extended from the side to which the second lead
part is exposed to at least one of the first and second main surfaces; and

insulating layers covering the first and second external electrodes formed on the first and second side surfaces.

US Pat. No. 9,312,467

APPARATUS AND METHOD FOR GENERATING SINUSOIDAL WAVES, AND SYSTEM FOR DRIVING PIEZO ACTUATOR USING THE SAME

Samsung Electro-Mechanics...

1. An apparatus for generating sinusoidal waves, comprising:
a look-up table storage unit storing a look-up table including a plurality of sampling points determined based on a base frequency
and a sampling frequency;

a sinusoidal wave generating unit calculating an integer ratio of a target frequency to the base frequency and obtaining sampling
points from the look-up table by reflecting the integer ratio so as to generate a sinusoidal wave; and

a correction control unit calculating noise information in the generated sinusoidal wave, and controlling the sinusoidal wave
generating unit to correct the sampling frequency if the noise information fails to meet a predetermined requirement.

US Pat. No. 9,297,840

POWER DETECTION CIRCUIT

SAMSUNG ELECTRO-MECHANICS...

1. A power detection circuit comprising:
a first resistor having current applied thereto to adjust a detection voltage value of input power;
an element having an applied voltage changed according to the input power; and
a second resistor connected to the element and having current applied thereto when resistance of the element becomes relatively
low to adjust the detection voltage value of the input power,

wherein resistance of the element changes according to feedback of detection voltage value inputted to the element, thereby
changing in inverse proportion to the input power, and

wherein the element comprises a transistor having a gate coupled via an operational amplifier to an output of the power detection
circuit.

US Pat. No. 9,263,185

MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD FOR MOUNTING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor comprising:
a ceramic body in which a plurality of dielectric layers are laminated;
an active layer including a plurality of first and second internal electrodes formed to be alternately exposed to both end
surfaces of the ceramic body with the dielectric layer interposed therebetween, and forming capacitance;

an upper cover layer formed on an upper portion of the active layer;
a lower cover layer formed on a lower portion of the active layer and having a thickness greater than that of the upper cover
layer; and

first and second external electrodes covering both end surfaces of the ceramic body,
wherein when a width of an L-margin portion formed between an end portion of the internal electrode in a length direction
and one end surface of the ceramic body is LM, a width of a W-margin portion formed between a side of the internal electrode
in a width direction and one lateral surface of the ceramic body is WM, and a thickness of the lower cover layer is B, 0.3?LM/B?2.0
and 0.5?B/WM?5.0 are satisfied, and

when half of the overall thickness of the ceramic body is A, a thickness of the lower cover layer is B, half of the overall
thickness of the active layer is C, and a thickness of the upper cover layer is D,

a ratio (B+C)/A by which a central portion of the active layer deviates from a central portion of the ceramic body satisfies
1.063?(B+C)/A?1.745.

US Pat. No. 9,246,209

ANTENNA AND FRONT END MODULE

Samsung Electro-Mechanics...

1. An antenna, comprising:
a substrate having a preset mounting surface;
an antenna pattern part formed on the mounting surface of the substrate and transmitting and receiving a signal within a preset
frequency band; and

a solder ball group having a plurality of solder balls formed on the mounting surface of the substrate to fix the substrate
to an external circuit board and disposed at preset intervals around the antenna pattern part to form an air cavity,

wherein a distance between a center of one solder ball and a center of another solder ball adjacent thereto among the plurality
of solder balls is determined according to a wavelength of the signal and a preset permittivity.

US Pat. No. 9,159,494

MULTILAYER CERAMIC CONDENSER AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A method of manufacturing a multilayer ceramic condenser, the method comprising:
printing a plurality of stripe-type inner electrode patterns in parallel on a plurality of ceramic green sheets in a major-axis
direction of the stripe-type inner electrode patterns; and

printing line patterns between the plurality of stripe-type inner electrode patterns, respectively, in the major-axis direction
of the line patterns, wherein a width of the line pattern is 60 ?m or less when an interval between the plurality of stripe-type
inner electrode patterns is 140 ?m or less, where an interval between the plurality of stripe-type inner electrode patterns
is defined by a, and a width of the line pattern is defined by b, and the following Formula 1, with respect to a and b, is
satisfied, Formula 1: 1 ?m?a?2b?200 ?m, and

a ratio of spreading areas to printed areas of the plurality of stripe-type inner electrode patterns and the line patterns
is 12% or less.

US Pat. No. 9,245,858

SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED ANTENNA FOR WIRELESS APPLICATIONS

Samsung Electro-Mechanics...

1. A semiconductor package comprising:
a substrate including a semiconductor chip mounted thereon;
a protective layer covering the semiconductor chip;
a metal pattern mounted on the protective layer;
a first connective member connecting the semiconductor chip and the metal pattern, and
a conductive layer formed in a recess in the protective layer, wherein the conductive layer surrounds an end portion of the
first connective member, and surfaces of the protective layer, the first connective member, and the conductive layer adjacent
the metal pattern are substantially aligned such that the first connective member is stably connected to the metal pattern,
and the conductive layer and the first connective member are formed of different materials,

wherein the first connective member is a wire or a thin plate; and
the semiconductor chip includes a connection pad having a width greater than a width of the first connective member as viewed
in cross section, and the first connective member is connected to the connection pad.

US Pat. No. 9,386,701

ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD

Samsung Electro-Mechanics...

1. An electronic component embedded printed circuit board comprising:
a core having a cavity;
an electronic component inserted in the cavity; and
insulating layers laminated on top and bottom of the core and mixed with a coupling agent, which has functional groups respectively
coupled to an organic material and an inorganic material, to be bonded to an outer peripheral surface of the electronic component;
and circuit patterns provided on the insulating layers,

the coupling agent mixed in the insulating layer being organotitanates that consist of at least two functional groups and
are represented by

(XO)n—Ti—(OY)4-n
where X is an alkyl group, Y is an organo-functional group, and n is a natural number including 1, 2, 3.

US Pat. No. 9,087,644

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic electronic component comprising:
a ceramic main body;
a plurality of internal electrodes laminated within the ceramic main body; and
external electrodes formed of a conductive paste formed on outer surfaces of the ceramic main body and electrically connected
to the internal electrodes,

wherein an average thickness of the external electrodes is 10 ?m or less, and
when a thickness of the external electrodes in a central portion of the ceramic main body in a width direction is Tc and a
thickness of the external electrodes at a lateral edge of a printed surface region of the internal electrodes is T1, 0.5?|T1/Tc|?1.0 is satisfied.

US Pat. No. 9,312,068

COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A coil component comprising:
a magnetic substrate;
a coil layer disposed on the magnetic substrate and having conductor patterns installed therein; and
an electrostatic discharge (ESD) protecting layer disposed on the coil layer and discharging static electricity introduced
into the conductor patterns,

wherein the ESD protecting material is made of a low temperature curable resin in which electrically conductive metal powders
are dispersed.

US Pat. No. 9,287,047

MULTILAYER CERAMIC CAPACITOR AND BOARD WITH THE SAME MOUNTED THEREON

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor comprising:
a ceramic body including a plurality of dielectric layers, first and second main surfaces opposing each other, first and second
side surfaces opposing each other, and first and second end surfaces opposing each other;

a first capacitor part including a first internal electrode disposed in the ceramic body and exposed to the first side surface
and a second internal electrode disposed in the ceramic body and exposed to the second side surface;

second to fifth capacitor parts including a third internal electrode having first and second leads exposed to the first and
second end surfaces and a fourth internal electrode having third and fourth leads exposed to the first and second end surfaces,
the third and fourth internal electrodes being disposed on one dielectric layer in the ceramic body, and fifth and sixth internal
electrodes disposed on another dielectric layer in the ceramic body and spaced apart from each other; and

a first external electrode disposed on the first side surface of the ceramic body and extended to the first end surface and
the first and second main surfaces and a second external electrode disposed on the second side surface of the ceramic body
and extended to the second end surface and first and second main surfaces,

wherein the first capacitor part and the second to fifth capacitor parts are connected in parallel to each other.

US Pat. No. 9,312,749

DRIVER DEVICE FOR POWER FACTOR CORRECTION CIRCUIT

SAMSUNG ELECTRO-MECHANICS...

1. A driver device for a power factor correction circuit including first and second main switches that are switched on and
off with a phase difference there between, and first and second auxiliary switches that provide conduction paths of surplus
voltage in the first and second main switches before the first and second main switches are switched on, the driver device
comprising:
an input unit receiving a plurality of input signals wherein the input unit receives first and second input signals;
an output unit outputting a first control signal for the first main switch, a second control signal for the second main switch,
a third control signal for the first auxiliary switch, and a fourth control signal for the second auxiliary switch based on
a plurality of input signals

a PWM selecting unit selectively passing a PWM signal based on the first and second input signals, the PWM signal being a
first internal signal

a pulse generating unit outputting a second internal signal having a phase delayed with regard to a phase of the first internal
signal and a third internal signal having a delayed phase and a reduced pulse width with regard to the first internal signal
based on the first internal signals wherein the phase of the second internal signal is delayed with regard to that of the
third internal signal

a checking unit outputting a fourth internal signal including input signal information based on the first and second input
signals wherein the checking unit outputs a high signal in the case that the first input signal is a PWM signal, and outputs
a low signal in the case that the second input signal is a PWM signal

a main signal generating unit outputting first and second control signals based on the second and fourth internal signals
wherein the main signal generating unit, in the case that the fourth internal signal is a high signal, outputs the second
internal signal as the first control signal and the high signal as the second control signal.

US Pat. No. 9,312,787

INVERTER WITH SERIES CONNECTED GATE DRIVING CIRCUITS AND VOLTAGE DIVIDER

SAMSUNG ELECTRO-MECHANICS...

1. A gate driving circuit comprising:
a high voltage gate driving circuit unit including at least one high voltage gate driving unit having a plurality of high
voltage gate drivers connected to each other in series between an input terminal receiving an instruction signal serving as
a switching control for controlling an inverter unit and an output terminal outputting a control signal for controlling switching
of the inverter unit,

the inverter unit including at least one inverter arm having at least two switches and switching input power to output alternating
current (AC) power, and

the high voltage gate driving circuit unit controlling switching of a high side switch of the at least two switches, dividing
voltage generated at an output of the high side switch at the time of the switching of the high side switch, and applying
the divided voltage to the plurality of high voltage gate drivers.

US Pat. No. 9,237,556

METHOD OF OPERATING ACCESS POINT AND WIRELESS COMMUNICATION SYSTEM USING ACCESS POINT

Samsung Electro-Mechanics...

3. A method of operating an access point, used in a method of transmitting/receiving data between the access point including
a plurality of antennae and a plurality of terminals by applying order of priorities in a sequence of a real time communication
service, a voice call service, a moving picture service and a data service according to a quality of service (QoS) type, the
method comprising:
classifying the terminals according to the QoS type of a service required by each of the terminals;
applying a first weight value to the classified groups of terminals depending on the order of priority according to the QoS
type;

applying a second weight value according to the number of terminals belonged to each of the classified groups; and
applying the order of priority in a sequence from a highest value to a lowest value, in which the first weight value and the
second weight value are multiplied, to the classified groups to allocate the antenna to the terminal of the classified groups
according to the order of priority.

US Pat. No. 9,235,008

OPTICAL CONNECTOR AND OPTICAL MODULE HAVING THE SAME

Samsung Electro-Mechanics...

1. An optical connector comprising:
a first optical connector part including a reflecting member disposed at one side of a front end part and having a predetermined
inclined angle to change a path of an optical signal of an optical element and a first through-hole through which the optical
signal passes; and

a second connector part including an insertion part into which an other side of the first optical connector part is inserted
and a second through-hole provided with an optical fiber to which the optical signal passing through the first through-hole
is incident,

wherein, the second connector part further includes a plurality of support members supporting the optical fiber provided in
the second through-hole,

wherein the support members have a polygonal ring shape according to a cross section shape of the optical fiber and support
the optical fiber at a predetermined interval along the second through-hole.

US Pat. No. 9,236,180

INDUCTOR AND MANUFACTURING METHOD THEREOF

Samsung Electro-Mechanics...

1. An inductor comprising:
a PCB including an insertion part formed therein;
a coil assembly including a core and a coil wound around the core and positioned on the PCB so that a protrusion part formed
so as to protrude at a lower portion of the core is inserted and fixed into the insertion part, wherein a size of the protrusion
part is less than the core, and the protrusion part is formed so as to penetrate the PCB and a bottom of the protrusion part
is exposed to an outside of the PCB;

a lower PCB terminal disposed at a lower portion of the PCB and penetrating through the PCB to thereby be electrically connected
to the coil; and

a filler forming an appearance so that the core, the coil, and an upper exposed surface of the PCB are received therein.

US Pat. No. 9,087,639

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic electronic component, comprising:
a ceramic body; and
internal electrodes formed inside the ceramic body and having a plurality of non-electrode regions,
on a cross-section taken in length and thickness directions of the ceramic body, when a thickness of each of the internal
electrodes is denoted by Te, a continuity of each of the internal electrodes is denoted by C, an area of each of the internal
electrodes is denoted by Ae, an area of the plurality of non-electrode regions is denoted by Ao, and a maximum diameter of
the non-electrode region having the maximum diameter among the plurality of non-electrode regions is denoted by Pmax, 0.1
?m?Te?0.5 ?m, 1.1%?Ao/Ae?3.2%, Pmax?120 nm, and 95%?C?99.5% being satisfied.

US Pat. No. 9,287,031

MULTILAYER INDUCTOR AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer inductor comprising:
a body having a plurality of dielectric layers stacked therein;
a plurality of conductor patterns formed on the plurality of dielectric layers;
via electrodes formed in the dielectric layers and connecting the conductor patterns disposed adjacent to each other in a
vertical direction to form a coil; and

pad patterns formed between the conductor patterns and the dielectric layers at positions of the via electrodes,
wherein a width of at least one of the pad patterns is equal to or less than a width of at least one of the plurality of conductor
patterns.

US Pat. No. 9,251,925

CONDUCTIVE PASTE FOR EXTERNAL ELECTRODES AND MULTILAYER CERAMIC ELECTRONIC COMPONENT USING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A conductive paste for external electrodes, the conductive paste comprising:
a conductive metal powder including conductive metal particles; and
a conductive amorphous metal powder including amorphous metal particles having a(Si, B)-b(Li, K)-c(V, Mn) in which a+b+c=100
mol %, 20?a?60, 10?b?40, and 2?c?25 are satisfied.

US Pat. No. 9,305,712

TANTALUM CAPACITOR AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A tantalum capacitor, comprising:
a capacitor body including a tantalum powder and having a tantalum wire;
a molding part formed to expose an end portion of the tantalum wire and enclose the capacitor body;
an anode lead frame including an anode mounting part formed on a lower surface of the molding part and an anode terminal part
formed to be extended from the anode mounting part to one end surface of the molding part, the anode terminal part being connected
to the tantalum wire;

a thin plate electrode formed on a lower surface of the capacitor body and exposed through the other end surface of the molding
part; and

a cathode lead frame including a cathode mounting part formed on the lower surface of the molding part so as to be spaced
apart from the anode mounting part and a cathode terminal part formed to be extended from the cathode mounting part to the
other end surface of the molding part, the cathode terminal part being connected to the thin plate electrode.

US Pat. No. 9,236,172

CONDUCTOR PATTERN AND COIL PARTS HAVING THE SAME

Samsung Electro-Mechanics...

1. A conductor pattern of a common-mode filter comprising a magnetic substrate, a coil layer on the magnetic substrate, and
a top magnetic material formed an a top of the coil layer, wherein the common-mode filter is electrically isolated by being
covered with an insulating layer of the coil layer, the conductor pattern comprising:
a primary conductor pattern having both a first horizontal portion and a first vertical portion, which is vertically connected
to the first horizontal portion; and

a secondary conductor pattern having both a second horizontal portion and a second vertical portion, which is vertically connected
to the second horizontal portion,

wherein the primary conductor pattern and the secondary conductor pattern are arranged to face opposedly to one another,
wherein the secondary conductor pattern is formed on the primary conductor pattern to correspond to the primary conductor
pattern,

wherein a horizontal width of the first horizontal portion is 10 to 15 ?m, a vertical width of the first horizontal portion
is 3 to 5 ?m, a horizontal width of the first vertical portion is 3 to 5 ?m, and a vertical width of the first vertical portion
is 12 to 15 ?m, and

the second horizontal portion and the second vertical portion are formed with the same size as the first horizontal portion
and the first vertical portion.

US Pat. No. 9,545,005

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic electronic component comprising:
a multilayer ceramic capacitor including
a ceramic body in which a plurality of dielectric layers are stacked,
a pair of first external electrodes disposed on first and second side surfaces of the ceramic body, respectively,
a pair of second external electrodes disposed on the first and second side surfaces of the ceramic body, respectively, wherein
one of the first external electrodes and one of the second external electrodes disposed on the first side surface are spaced
apart from each other in a length direction of the ceramic body and extended to portions of a mounting surface of the ceramic
body, and

first and second internal electrodes alternately stacked in the ceramic body, exposed through at least one of the first and
second side surfaces of the ceramic body, and connected to one of the first and second external electrodes, one of the plurality
of dielectric layers being disposed between the first and second internal electrodes; and

an interposer substrate including
an insulation substrate connected to the mounting surface of the multilayer ceramic capacitor, and
first and second connection terminals disposed on the insulation substrate and connected to the first and second external
electrodes, respectively,

wherein the first and second connection terminals of the interposer substrate comprise:
first and second connection portions disposed on an upper surface of the insulation substrate so as to be connected to the
first and second external electrodes, respectively; and

first and second terminal portions extended from a center of the first and second connection portions to a part of a lower
surface of the insulation substrate through surfaces of the insulation substrate opposing each other in a length direction
of the insulation substrate, respectively, and

wherein each of the first and second connection portions extends to both opposing edges of the insulation substrate in a width
direction of the insulation substrate orthogonal to the length direction of the insulation substrate, and corner parts of
the insulation substrate between the first and second connection portions and the first and second terminal portions are provided
with margins.

US Pat. No. 9,287,043

MULTILAYER CERAMIC ELECTRONIC COMPONENT HAVING CONTROLLED DIFFERENCE IN CONTINUITY BETWEEN INTERNAL ELECTRODES AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic electronic component, comprising:
a ceramic body including dielectric layers;
first and second internal electrodes disposed to face each other within the ceramic body with the dielectric layer interposed
therebetween; and

first and second external electrodes electrically connected to the first and second internal electrodes,
wherein the ceramic body includes a capacitance forming part contributing to capacitance formation and a non-capacitance forming
part provided on at least one of upper and lower surfaces of the capacitance forming part,

when the capacitance forming part is divided into three areas in a thickness direction of the ceramic body, a difference in
continuity between internal electrodes in a middle area of the three areas and internal electrodes in upper and lower areas
thereof is greater than 1% and less than 5%, and

the continuity of the internal electrodes in the upper and lower areas is 95% or higher.

US Pat. No. 9,281,389

SEMICONDUCTOR DEVICE

Samsung Electro-Mechanics...

10. A semiconductor device comprising:
an undoped GaN layer;
a layer of first conductive AlGaN layer formed on the undoped GaN layer;
a source electrode formed directly on one side of the layer of first conductive AlGaN;
a layer of first and second conductive AlGaN formed on another side of the layer of first conductive AlGaN and formed in a
direction perpendicular to the source electrode;

a gate electrode formed directly on one side of the layer of first and second conductive AlGaN; and
a drain electrode formed directly on another side of the layer of first and second conductive AlGaN,
wherein the layer of first and second conductive AlGaN includes alternating bands of first conductive AlGaN and second conductive
AlGaN.

US Pat. No. 9,112,424

POWER SUPPLY DEVICE HAVING IMPROVED POWER CONVERSION EFFICIENCY IN LIGHT LOAD CONDITIONS

SAMSUNG ELECTRO-MECHANICS...

1. A power supply device, comprising:
a power supply unit supplying preset DC power by switching input power using a full bridge by a phase shift method; and
a control unit controlling a switching time of a switch of the full bridge according to a load state in which the DC power
is received from the power supply unit;

wherein the switch of the full bridge of the power supply unit includes:
first and second leading leg switches; and
first and second lagging leg switches;
wherein the control unit maintains a switching on time of at least one of the first and second lagging leg switches as before,
in the case that the load current is above a predetermined load current; and

wherein the control unit delays a switching on time of at least one of the first and second lagging leg switches, in the case
that the load current is below the predetermined load current;

wherein the switching on time is a point in time of switching on the first or second lagging leg.

US Pat. No. 9,075,088

POWER QUALITY MONITORING APPARATUS AND METHOD THEREOF

SAMSUNG ELECTRO-MECHANICS...

1. A power quality monitoring apparatus, comprising:
a calculating unit for calculating an absolute value of an applied commercial voltage;
an accumulating unit for accumulating the absolute value of the applied commercial voltage per a constant period to output;
an extracting unit for sampling an absolute value accumulative maximum value of the commercial voltage for each period; and
a determining unit for determining a quality of the commercial voltage by using the absolute value accumulative maximum value
of the sampled commercial voltage.

US Pat. No. 9,510,455

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF

Samsung Electro-Mechanics...

1. An electronic component embedded substrate comprising:
a core board having a cavity formed therein;
an electronic component, having a body and an electrical terminal, embedded in the cavity; and
a circuit pattern formed on one surface of the core board and configured for fixing the electronic component in the cavity
by pressing the body of the electronic component,

wherein the cavity has lateral surfaces and formed through the core board, and
wherein the circuit pattern is not in contact with the lateral surfaces of the cavity.

US Pat. No. 9,281,120

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic electronic component comprising:
a ceramic body including dielectric layers; and
a plurality of internal electrodes disposed in the ceramic body, having at least one of the dielectric layers interposed therebetween,
wherein when a distance between a widthwise end of an internal electrode disposed at a central portion of the ceramic body
in a thickness direction thereof and an adjacent side surface of the ceramic body is defined as D1 and a distance between
a widthwise end of an internal electrode disposed at an upper or lower portion of the ceramic body in the thickness direction
thereof and the adjacent side surface of the ceramic body is defined as D2, D1/D2 is in a range of 0.5 to 0.95 (0.5?D1/D2?0.95).

US Pat. No. 9,261,364

DRIVING CIRCUIT, SYSTEM, AND DRIVING METHOD FOR GYRO SENSOR

Samsung Electro-Mechanics...

1. A gyro sensor driving circuit comprising:
a charge/voltage conversion unit configured to receive a charge output from a vibration-type gyro sensor and to convert the
charge output into a voltage signal;

a phase converting unit configured to receive a signal from the charge/voltage converting unit and to convert a phase of the
received signal;

a pulse generating unit configured to receive an output signal of the phase converting unit and to output the output signal
as a pulse wave;

a pulse converting unit configured to convert the pulse wave output from the pulse generating unit into a pulse signal using
a certain voltage level as reference so as to apply the pulse signal as a driving signal of the vibration-type gyro sensor;
and

a control unit configured to control the pulse converting unit to generate the pulse signal using the certain voltage level
as reference,

wherein the pulse converting unit comprises:
a voltage distributor configured to distribute a certain voltage to voltage levels; and
a certain potential pulse generating circuit configured to be switched by a pulse wave output from the pulse generating unit
and to generate the pulse signal using the certain voltage level obtained from the voltage levels distributed by the voltage
distributor as reference according to control of the control unit.

US Pat. No. 9,241,196

FRONT MODULE HAVING TRIPLEXER FOR MULTIMEDIA OVER COAX ALLIANCE

Samsung Electro-Mechanics...

1. A front module, comprising:
a triplexer receiving and distributing a Multimedia over Coax Alliance (MoCA) receiving signal and a cable broadcasting signal
from a coaxial cable and receiving a MoCA transmitting signal and outputting the received MoCA transmitting signal to the
coaxial cable;

a transceiver for MoCA removing and outputting noise from the MoCA receiving signal input through the triplexer and amplifying
the MoCA transmitting signal input from an outside and providing the amplified MoCA transmitting signal to the triplexer;
and

a receiver for cable removing and outputting noise from the cable broadcasting signal input through the triplexer,
wherein the transceiver for MoCA includes:
a low-noise amplifier for MoCA which removes noise from the MoCA receiving signal input from the triplexer and then outputs
the MoCA receiving signal to the outside;

a power amplifier which power-amplifies the MoCA transmitting signal input from the outside and outputs the MoCA transmitting
signal to the triplexer;

a balun for MoCA which distributes a MoCA signal input from the triplexer depending on a predetermined ratio and outputs the
distributed MoCA signal to the low-noise amplifier for MoCA and outputs the signal input from the power amplifier to the triplexer;
and

a circulator which transmits a signal input through the balun for MoCA to the low-noise amplifier for MoCA and transmits the
signal provided from the power amplifier to the balun.

US Pat. No. 9,237,616

SWITCHING MODE POWER SUPPLY APPARATUS

Samsung Electro-Mechanics...

1. A switching mode power supply apparatus, comprising:
a main transformer converting DC voltage of a predetermined amplitude supplied from a voltage source into DC voltage of a
different amplitude;

an auxiliary transformer operated by receiving current flowing in a primary winding of the main transformer;
a first semiconductor switching element turning on/off an LED array that is driven by receiving voltage from a secondary winding
of the auxiliary transformer; and

an auxiliary circuit disposed in an LED control circuit unit including the LED array and the first semiconductor switching
element,

wherein the auxiliary circuit distributes current flowing in the first semiconductor switching element so as to reduce heat
generated in the first semiconductor switching element.

US Pat. No. 9,047,910

SPINDLE MOTOR AND HARD DISK DRIVE INCLUDING THE SAME

Samsung Electro-Mechanics...

1. A spindle motor comprising:
a lower thrust member fixed to a base member;
a shaft fixed to the lower thrust member;
a sleeve disposed above the lower thrust member and installed so as to be rotatable with respect to the shaft; and
a rotor hub coupled to the sleeve to be rotated together therewith,
wherein the lower thrust member includes a fitting protrusion protruding upwardly in the axial direction and fitted into a
fixing groove formed in a lower end of the shaft so as to be depressed upwardly in the axial direction, a thrust bearing surface
forming a thrust bearing between the thrust bearing surface and a lower surface of the sleeve, and an extension part protruding
from an outer edge of the lower thrust member in a radial direction upwardly in the axial direction to form a liquid-vapor
interface between the extension part and an outer surface of the sleeve while enclosing the sleeve, and

the thrust bearing surface has inner and outer concave parts depressed in one of inner and outer diameter directions thereof,
respectively.

US Pat. No. 9,370,102

EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT

SAMSUNG ELECTRO-MECHANICS...

1. An embedded multilayer ceramic electronic component comprising:
a ceramic body including dielectric layers, having first and second main surfaces opposing one another, first and second lateral
surfaces opposing one another, and first and second end surfaces opposing one another, and having a thickness equal to or
less than 250 ?m;

a first internal electrode and a second internal electrode disposed to face one another with the dielectric layer interposed
therebetween and alternately exposed to the first lateral surface and the second lateral surface, respectively;

a first external electrode formed on the first lateral surface of the ceramic body and electrically connected to the first
internal electrode and a second external electrode formed on the second lateral surface and electrically connected to the
second internal electrode; and

metal layers being copper plating layers, and disposed on the first external electrode and the second external electrode,
respectively,

wherein the ceramic body includes an active layer including the first internal electrodes and the second internal electrodes
and a cover layer formed on an upper or lower surface of the active layer, and when a thickness of the metal layers is tp,
tp?5 ?m is satisfied, and

wherein when surface roughness of the metal layers is Ra2 and the thickness of the metal layers is tp, 200 nm?Ra2?tp is satisfied.

US Pat. No. 9,256,328

TOUCH INPUT SENSING DEVICE AND TOUCH INPUT SENSING METHOD

Samsung Electro-Mechanics...

1. A touch input sensing device comprising:
a plurality of sensing electrodes; and
a controller configured to obtain sensing signals generated from the plurality of sensing electrodes through a plurality of
sensing channels electrically connected to the plurality of sensing electrodes,

the controller configured to calculate a plurality of difference values between the sensing signals obtained from the plurality
of sensing channels connected to mutually adjacent sensing electrodes among the plurality of sensing electrodes to thus determine
a touch input,

the controller including a driving circuit unit configured to apply a driving signal to at least some of the plurality of
sensing electrodes,

the driving circuit unit configured to apply the driving signal to a plurality of first electrodes which apply the driving
signal to the at least some of the plurality of sensing electrodes, and

each one of the plurality of first electrodes crossing each one of a plurality of second electrodes of the plurality of sensing
electrodes,

the controller configured to determine weighting values, index the plurality of difference values, and apply the weighting
values to difference values of sensing signals of mutually adjacent sensing electrodes

wherein the weighting values corresponding to the plurality of difference values increases with a distance from the index
corresponding to a sign change of a difference value.

US Pat. No. 9,455,207

ALL-IN-ONE POWER SEMICONDUCTOR MODULE

Samsung Electro-Mechanics...

1. An all-in-one power semiconductor module, comprising:
a plurality of first semiconductor devices formed on a substrate;
a housing molded and formed to include bridges formed across upper portions of the plurality of first semiconductor devices;
and

a plurality of lead members having a portion embedded in the bridges, directly bonded with the plurality of first semiconductor
devices, and electrically connecting the plurality of first semiconductor devices and the substrate,

wherein at least one of the plurality of lead members is directly connected to at least one of the plurality of first semiconductor
devices.

US Pat. No. 9,338,899

METHOD OF MANUFACTURING A RIGID-FLEXIBLE PRINTED CIRCUIT BOARD

Samsung Electro-Mechanics...

1. A method of manufacturing a rigid-flexible printed circuit board, comprising:
providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both
sides of which inner circuit patterns and a first window are respectively formed;

layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the base substrate;
forming a via hole in the rigid region, and, simultaneously, forming a via hole to correspond to the first window in a flexible
region;

forming outer circuit patterns including areas adjacent to the first window; and
applying solder resists in the rigid region to expose portions of the outer circuit patterns,
wherein the region adjacent to the via hole in the flexible region includes additional plating portions for covering the coverlays.

US Pat. No. 9,288,902

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A printed circuit board comprising:
a light-blocking glass substrate;
a negative photosensitive insulating layer formed on the glass substrate; and
a circuit pattern formed on the glass substrate and embedded in the negative photosensitive insulating layer,
wherein the negative photosensitive insulating layer is formed on either side of the glass substrate.

US Pat. No. 9,275,785

MULTILAYERED POWER INDUCTOR AND METHOD FOR PREPARING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayered power inductor, comprising:
a magnetic layer included in at least a part of a power inductor chip body;
an inner electrode coil pattern formed in the magnetic layer; and
an outer electrode layer,
wherein the magnetic layer comprises a metal powder insulated along a grain interface of the metal powder, and an SiO2-based ceramic material insulates the grain interface of the metal powder and the surface of the inner electrode coil pattern.

US Pat. No. 9,420,709

CORELESS BOARD FOR SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME

Samsung Electro-Mechanics...

1. A coreless board for a semiconductor package, the coreless board comprising:
a build-up layer comprising circuit layers and insulating layers disposed between the circuit layers;
a plurality of external connection terminals formed on the build-up layer;
a solder resist layer formed on the build-up layer so as to expose the plurality of external connection terminals, the solder
resist layer having an opening formed thereon in such a way that the opening exposes the plurality of external connection
terminals;

a first via hole disposed in a first insulating layer; and
a second via hole disposed in a second insulating layer, the second insulating layer disposed closer to the external connection
terminals than the first insulating layer,

wherein a width and a height of the second via hole are smaller than those of the first via hole.

US Pat. No. 9,370,743

CARBON DIOXIDE ADSORBENT INCLUDING BARIUM TITANATE, CARBON DIOXIDE CAPTURE MODULE INCLUDING THE SAME, AND METHODS FOR SEPARATING CARBON DIOXIDE USING THE SAME

Samsung Electronics Co., ...

1. A carbon dioxide adsorbent comprising:
a complex oxide including barium and titanium, the complex oxide having a perovskite crystalline structure and represented
by BaxTiyOz, an atomic ratio of Ba/Ti ranging from about 0.95 to about 1.70, the complex oxide having a specific surface area of greater
than or equal to about 20 m2/g and an average particle size of less than or equal to about 70 nm as measured by Barrett-Joyner-Halenda (BJH) method.

US Pat. No. 9,313,893

SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN AND METHOD OF MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A substrate having an electronic component embedded therein, comprising:
the electronic component including an external electrode;
a first insulating layer including a cavity into which at least a portion of the electronic component is inserted and having
a first circuit pattern provided on one surface thereof and a second circuit pattern provided on the other surface thereof;

a second insulating layer covering the first circuit pattern and one surface of the first insulating layer;
a third insulating layer covering the second circuit pattern and the other surface of the first insulating layer;
a third circuit pattern provided on a surface of the second insulating layer;
a fourth circuit pattern provided on a surface of the third insulating layer;
a first via directly connecting the external electrode and the third circuit pattern to each other while penetrating through
the second insulating layer;

a second via directly connecting the first circuit pattern and the third circuit pattern to each other while penetrating through
the second insulating layer;

a third via directly connecting the first circuit pattern and the second circuit pattern to each other while penetrating through
the first insulating layer;

a fourth via directly connecting the second circuit pattern and the fourth circuit pattern to each other while penetrating
through the third insulating layer; and

a fifth via directly connecting the external electrode and the forth circuit pattern to each other while penetrating through
the third insulating layer,

wherein an electrical loop is formed by connections from the external electrode to the third circuit pattern through the first
via, from the third circuit pattern to the first circuit pattern through the second via, from the first circuit pattern to
the second circuit pattern through the third via, from the second circuit pattern to the fourth circuit pattern though the
fourth via, and from the fourth circuit pattern to the external electrode through the fifth via.

US Pat. No. 9,312,778

POWER SUPPLY DEVICE

SAMSUNG ELECTRO-MECHANICS...

1. A power supply device, comprising:
a full-bridge circuit including first to fourth switches switching power input from a power input unit, the first and second
switches being connected to both terminals of the power input unit in parallel and the third and fourth switches being connected
to the terminals of the power input unit in parallel;

a resonance unit connected between a first connection node between the first switch and the second switch and a second connection
node between the third switch and the fourth switch;

a transformer including a primary winding and a secondary winding connected to the resonance unit in series;
a rectifying circuit rectifying and outputting a voltage transferred from the secondary winding;
a sensing unit obtaining at least one of an output current and an output voltage output from the rectifying circuit; and
a controlling unit controlling the first to third switches provided in the full-bridge circuit or controlling the second to
fourth switches provided in the full-bridge circuit when the at least one of the output current and the output voltage obtained
by the sensing unit has a predetermined value or less,

wherein the controlling unit turns the first switch and the third switch on and turns the second switch off at a first interval,
and turns the first switch and the third switch off and turns the second switch on at a second interval, and turns the fourth
switch off at the first interval and the second interval, or

wherein the controlling unit turns the second switch and the fourth switch on and turns the third switch off at the first
interval, and turns the second switch and the fourth switch off and turns the third switch on at the second interval, and
turns the first switch off at the first interval and the second interval.

US Pat. No. 9,312,587

COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A common mode filter, comprising:
a magnetic substrate;
a receiving groove formed on the magnetic substrate;
a dielectric layer formed in the receiving groove and having a coil pattern included therein; and
a magnetic layer formed on upper surfaces of the dielectric layer and the magnetic substrate,
wherein a thickness of the dielectric layer is smaller than a depth of the receiving groove, and
wherein the magnetic layer covers an inside wall of the receiving groove.

US Pat. No. 9,526,169

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A printed circuit board (PCB), comprising:
a base substrate comprising a metal pattern for a circuit; and
a surface roughness provided on the metal pattern,
wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a
black oxide layer in a granular structure formed on the first surface roughness,

wherein the anchor structure has a neck portion and a head portion having a larger surface area than the neck portion, and
wherein a bismaleimide-triazine resin layer is formed on the black oxide layer in a granular structure that is formed on the
anchor structure, and

wherein an interlayer adhesion between the metal pattern and the bismaleimide-triazine resin layer is more than 0.4 kgf/cm.

US Pat. No. 9,312,909

RF SWITCH

Samsung Electro-Mechanics...

1. A RF(Radio Frequency) switch comprising:
a common port transmitting and receiving high frequency signals;
a first switching unit including a plurality of first switching devices connected to each other in series and conducting or
blocking a signal transfer path between a first port to and from which the high frequency signal is input and output and the
common port;

a second switching unit including a plurality of second switching devices connected to each other in series and conducting
or blocking a signal transfer path between a second port to and from which the high frequency signal is input and output and
the common port;

a negative voltage generating unit sensing the high frequency signal from the common port and rectifying the sensed high frequency
signal to generate a negative voltage; and

a logic circuit unit controlling switching operations of the first and second switching units using the negative voltage provided
from the negative voltage generating unit and a positive voltage provided from outside of the RF switch.

US Pat. No. 9,300,285

GATE DRIVER CIRCUIT

SAMSUNG ELECTRO-MECHANICS...

1. A gate driver circuit, comprising:
a driving signal generating unit configured to generate first and second control signals based on a data signal and a fault
state signal and control gate detection;

a driving inverter configured to operate in response to the first and second control signals to generate a gate signal and
provide the gate signal to a power switch element; and

a soft turn-off/gate detecting unit configured to operate in response to the second control signal, perform a soft turn-off
in the case of a fault, and detect the gate signal to provide a detected signal;

wherein the first control signal has a level into which the data signal is inverted when the fault state signal is at the
low level and has a level into which the fault state signal is inverted regardless of a level of the data signal when the
fault state signal is at the high level,

wherein the second control signal has a same level as the first control signal when the fault state signal is at the low level
and has a level of the fault state signal regardless of the level of the first control signal when the fault state signal
is at the high level.

US Pat. No. 9,386,706

LINE WIDTH PROTECTOR PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A printed circuit board, comprising:
an insulating layer; and
a circuit pattern formed on the insulating layer,
wherein the circuit pattern includes a seed layer and a metal layer formed on the seed layer, and
both sides of the seed layer are formed with an etched groove.

US Pat. No. 9,279,861

APPARATUS FOR TESTING SWITCHING OF POWER SEMICONDUCTOR MODULE

Samsung Electro-Mechanics...

1. An apparatus for testing switching of a power semiconductor module, comprising:
a power semiconductor module including a plurality of power semiconductor devices corresponding to a plurality of phases to
test a switching operation of a corresponding power semiconductor device;

a power supply unit supplying power to the power semiconductor module;
a relay switching unit including a plurality of relay switch devices that connects or disconnects between the power semiconductor
module and the power supply unit according to a relay control signal; and

a control unit controlling the relay switching unit to test on/off characteristics of the plurality of power semiconductor
devices simultaneously,

wherein the control unit controls the on/off of the relay switching unit connecting between the power semiconductor module
and the power supply unit through various paths to supply power to the corresponding power semiconductor devices so as to
test the on/off operation of the corresponding power semiconductor device.

US Pat. No. 9,251,959

MULTILAYER CERAMIC CONDENSER AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic condenser, comprising:
a multilayer main body formed by stacking a plurality of dielectric layers including ceramic grains formed from sintering
a first ceramic dielectric powder and sequentially surrounded by a first side, a second side, a third side, and a fourth side;

a first inner electrode pattern and a second inner electrode pattern formed on the plurality of dielectric layers and formed
to be exposed to the first side and the third side of the multilayer main body, respectively,

and further the first inner electrode pattern being exposed to both the second side and the fourth side of the multilayer
main body and the second inner electrode pattern being exposed to both the second side and the fourth side of the multilayer
main body;

a first external electrode formed on the first side of the multilayer main body and a second external electrode formed on
the third side of the multilayer main body; and

a first side part and a second side part each formed on the second side and the fourth side of the multilayer main body, and
including ceramic grains formed from sintering a second ceramic dielectric powder having a smaller particle diameter than
the first ceramic dielectric powder,

wherein a mean grain size of the ceramic grains formed from sintering a first ceramic dielectric powder and a mean grain size
of the ceramic grains formed from sintering a second ceramic dielectric powder are similar, and

wherein the ceramic grains formed from sintering the second ceramic powder exist more in the first and the second side part
than in the multilayer main body.

US Pat. No. 9,526,177

PRINTED CIRCUIT BOARD INCLUDING ELECTRONIC COMPONENT EMBEDDED THEREIN AND METHOD FOR MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A printed circuit board including an electronic component embedded therein, comprising:
a core formed with a cavity which is constituted with a through hole and is formed with an inclined surface such that a central
portion of a sidewall is protruded;

an electronic component embedded in the cavity;
insulating layers stacked on upper and lower portions of the core including the electronic component; and
external circuit layers formed on the insulating layers.

US Pat. No. 9,462,644

POWER SUPPLY DEVICE

SAMSUNG ELECTRO-MECHANICS...

1. A power supply device comprising:
an insulating DC/DC converter unit including a primary winding and a secondary winding magnetically coupled to the primary
winding, and inducing a voltage in the secondary winding in a first direction or a second direction: and

a boosting unit including a first booster boosting the voltage induced in the secondary winding to supply power to a first
light emitting diode module, in a first mode in which the voltage is induced in the secondary winding in the first direction,
and a second booster boosting the voltage induced in the secondary winding to supply the power to a second light emitting
diode module, in a second mode in which the voltage is induced in the secondary winding in the second direction,

wherein the boosting unit further includes a common inductor having one end connected to one end of the secondary winding
in series,

wherein the boosting unit further includes a first switching element and a first diode connected to another end of the secondary
winding, and

wherein the first switching element performs a zero voltage switching in response to freewheeling performed by a current flowing
in a parasitic inductor of the secondary winding.

US Pat. No. 9,310,585

LENS MODULE

Samsung Electro-Mechanics...

1. A lens module comprising:
a first lens having positive refractive power;
a second lens having refractive power, an image-side surface thereof being concave;
a third lens having positive refractive power of which an object-side surface is convex;
a fourth lens having negative refractive power, an object-side surface thereof being convex; and
a fifth lens having negative refractive power and having one or more inflection point formed on at least one of an object-side
surface and an image-side surface thereof

wherein the first, second, third, fourth and fifth lenses are disposed in a sequential order from the first lens to the fifth
lens.

US Pat. No. 9,312,756

CHARGE PUMP SYSTEM AND CHARGE PUMP PROTECTION CIRCUIT

Samsung Electro-Mechanics...

1. A charge pump system comprising:
a charge pump including a plurality of boosting units boosting an input voltage input to an input terminal multiple times
depending on clock signals and outputting the boosted voltage to an output terminal; and

a charge pump protection circuit including a series resistor unit disposed between the output terminal and a ground and including
a plurality of resistors connected to each other in series,

wherein a portion of the plurality of resistors are connected to a portion of the plurality of boosting units, in parallel.

US Pat. No. 9,304,642

TOUCH SENSOR COMPRISING MESH PATTERN WITH IRREGULAR SHAPE

Samsung Electro-Mechanics...

1. A touch sensor, comprising:
a transparent substrate; and
an electrode pattern formed on the transparent substrate, wherein
the electrode pattern is formed in a mesh pattern and the mesh pattern includes an irregular unit pattern comprising polygons
satisfying the following relationship:


wherein r is a radius of the irregular unit pattern, ? is a standard deviation and set to a value of between 0 and 1, and
f(r) is a frequency of the irregular unit pattern.

US Pat. No. 9,287,794

RESONANCE-TYPE POWER SUPPLY APPARATUS

Samsung Electro-Mechanics...

1. A resonance-type power supply apparatus, comprising:
a switching unit switching input power;
a transformer including a primary winding receiving the power switched by the switching unit and a secondary winding magnetically
coupled to the primary winding and having a preset turns ratio, and transforming the received switched power according to
the turns ratio;

a resonance unit electrically connected between the switching unit and the transformer and providing a resonance tank resonating
with inductance from the transformer; and

a controlling unit controlling the switching of the switching unit based on timing that resonance power information input
to the primary winding of the transformer by the resonance unit meets a reference value.

US Pat. No. 9,516,740

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT EMBEDDED SUBSTRATE

Samsung Electro-Mechanics...

1. An electronic component embedded substrate comprising:
an electronic component comprising a first surface having first external terminals thereon and a second surface opposite the
first surface and made of an insulating material;

a first wiring layer provided on the first surface and comprising a first wiring portion electrically connected to the first
external terminal and a first insulating portion; and

a second wiring layer provided on the second surface and comprising a second wiring portion and a second insulating portion,
wherein at least one of the number of layers and wiring density of the first wiring layer is greater than at least one of
the number of layers and wiring density of the second wiring layer, respectively, and the first insulating portion is made
of a material having a lower coefficient of thermal expansion than the second insulating portion.

US Pat. No. 9,417,644

APPARATUS FOR AND METHOD OF CONTROLLING POWER SUPPLY SYSTEM

SAMSUNG ELECTRO-MECHANICS...

1. An apparatus for controlling a power supply system, comprising:
an offset correction circuit equally dividing an input voltage into n (n is a natural number larger than 2) and outputting
n divided voltages; and

a control unit using an analog-to-digital converter (ADC) to detect the n divided voltages output from the offset correction
circuit, and determining a difference in levels between a value of the detected n divided voltages and a value calculated
by dividing the input voltage by n, as an offset correction value.

US Pat. No. 9,245,690

MULTILAYER CERAMIC CAPACITOR, BOARD HAVING THE SAME MOUNTED THEREON, AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor comprising:
a ceramic body including a plurality of dielectric layers and having first and second main surfaces facing each other in a
thickness direction, third and fourth end surfaces facing each other in a length direction, and fifth and sixth side surfaces
facing each other in a width direction;

a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed to the third and
fourth end surfaces, having the dielectric layers interposed therebetween; and

first and second external electrodes electrically connected to the first and second internal electrodes,
wherein in a cross-section of the ceramic body in a thickness-length direction, the first and second external electrodes include:
first and second conductive glass layers formed to be extended from the third and fourth end surfaces to portions of the first
and second main surfaces;

first and second conductive resin layers containing copper and an epoxy, formed on the first and second conductive glass layers
to be extended from the third and fourth end surfaces to portions of the first and second main surfaces, and having a width
greater than that of the first and second conductive glass layers formed on the first and second main surfaces; and

first and second insulating layers formed to be extended from the third and fourth end surfaces to portions of the first and
second main surfaces so as to cover the first and second conductive glass layers and the first and second conductive resin
layers formed on the third and fourth end surfaces, while having a width smaller than that of the first and second conductive
resin layers formed on the first and second main surfaces.

US Pat. No. 9,299,497

MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor comprising:
a ceramic body in which a plurality of dielectric layers are laminated;
an active layer including a plurality of first and second internal electrodes formed to be alternately exposed to both end
surfaces of the ceramic body with the dielectric layer interposed therebetween, disposed vertically on upper and lower surfaces
of the ceramic body and forming capacitance;

an upper cover layer formed upwardly of the active layer, disposed vertically on the first and second internal electrodes;
a lower cover layer formed downwardly of the active layer, disposed vertically below the first and second internal electrodes
and having a thickness greater than that of the upper cover layer; and

first and second external electrodes covering both end surfaces of the ceramic body,
wherein the active layer includes a first block in which a first region I formed to one side based on a central portion R
of the ceramic body in the length direction in the length-width (L-W) cross-section of the ceramic body and including internal
electrodes having different polarities facing one another in a lamination direction to form capacitance and a second region
II including internal electrodes having the same polarity disposed in the lamination direction so as to not form capacitance,
and a second block in which a third region III formed on the other side based on the central portion R of the ceramic body
in the length direction, facing the first region I in the length direction of the ceramic body, and including internal electrodes
having the same polarity facing one another in the lamination direction so as to not form capacitance, and a fourth region
IV facing the second region II in the length direction of the ceramic body and including internal electrodes having different
polarities facing one another in the lamination direction to form capacitance, and

wherein the central portion R of the ceramic body in the length direction contains some of the plurality of first and second
internal electrodes forming capacitance, and the lengths of the first and second internal electrodes in the central portion
R are identical to each other.

US Pat. No. 9,293,259

MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING ELECTRODE LEAD OUT PORTIONS HAVING DIFFERENT LENGTHS

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic electronic component, comprising:
a ceramic body including dielectric layers, and having first and second main surfaces opposing each other, first and second
side surfaces opposing each other, and first and second end surfaces opposing each other;

first and second internal electrodes having overlap regions forming a capacitance part for forming capacitance inside the
ceramic body, the first internal electrodes respectively having a first lead out portion extended from the capacitance part
so as to be exposed to the first side surface, the second internal electrodes being alternately laminated with the first internal
electrodes with the dielectric layers interposed therebetween while being insulated from the first internal electrodes, and
the second internal electrodes respectively having a second lead out portion extended from the capacitance part so as to be
exposed to the first side surface;

first and second external electrodes connected with the first and second lead out portions, respectively; and
an insulating layer formed on the first side surface of the ceramic body and between the first and second external electrodes,
and covering an exposed portion of the first lead out portion,

wherein a length of the first lead out portion in a length direction of the ceramic body is longer than a length of the second
lead out portion in the length direction of the ceramic body, and the first lead out portion and the second lead out portion
do not overlap each other,

wherein the length of the first lead out portion is less than a length of the capacitance part of the first internal electrode
in the length direction and the length of the second lead out portion is less than a length of the capacitance part of the
second internal electrode in the length direction, and

wherein the capacitance part includes at least two regions having different distances from the first side surface.

US Pat. No. 9,101,064

THIN FILM ELECTRODE CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A thin film electrode ceramic substrate, comprising:
a ceramic substrate;
a plurality of anti-etching metal layers formed in a surface of the ceramic substrate;
a thin film electrode pattern formed on the anti-etching metal layers; and
a plating layer formed on the thin film electrode pattern,
wherein the anti-etching metal layers are extant under respective edge portions of the thin film electrode pattern and extends,
in the ceramic substrate, a distance away from the thin film electrode pattern,

the edge portions of the thin film electrode pattern are contacted with the respective anti-etching metal layers,
the anti-etching metal layers are spaced apart from each other by a predetermined distance, except in a region where the anti-etching
metal layers are contacted with the respective edge portions of the thin film electrode pattern, and

the ceramic substrate underlays entire bottom surfaces of the anti-etching metal layers.

US Pat. No. 9,304,233

LENS MODULE

Samsung Electro-Mechanics...

1. A lens module, comprising:
a first lens including a first conical surface based on an optical axis and a first flat surface extending in a vertical direction
with respect to the optical axis; and

a second lens including a second conical surface based on an optical axis and a second flat surface extending in a vertical
direction with respect to the optical axis,

wherein the first conical surface and the first flat surface are connected by a first curved surface having a first radius,
and

the second conical surface and the second flat surface are connected by a second curved surface having a second radius,
wherein the first radius and the second radius have the same length.

US Pat. No. 9,386,702

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED SUBSTRATE

Samsung Electro-Mechanics...

1. An electronic component embedded substrate comprising:
an insulating layer having a cavity;
an electronic component having an external electrode, the electronic component provided in the cavity;
a conductor pattern provided on a surface of the insulating layer;
a build-up insulating layer provided on the insulating layer and covering the conductor pattern and the electronic component;
a first via passing through the build-up insulating layer and having a first contact portion in contact with the external
electrode; and

a second via passing through the build-up insulating layer and having a second contact portion in contact with the conductor
pattern, wherein the second contact portion has a smaller cross-sectional area than that of the first contact portion,

wherein a lateral surface of the external electrode is in contact with the build-up insulating layer.

US Pat. No. 9,120,668

MICROPHONE PACKAGE AND MOUNTING STRUCTURE THEREOF

Samsung Electro-Mechanics...

1. A microphone package comprising:
a package substrate;
an acoustic element mounted on the package substrate and having a space formed in a lower portion thereof; and
at least one electronic component mounted on the package substrate and having a space formed in a lower portion thereof, the
space extending inwardly of the electronic component, wherein the package substrate includes an acoustic volume connecting
the space of the acoustic element and the space of the electronic component.

US Pat. No. 9,521,760

RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A rigid flexible printed circuit board having a rigid region and a flexible region, comprising:
a base substrate including a portion in the rigid region and a portion in the flexible region, and including an internal insulating
layer and an inner layer circuit layer formed on the internal insulating layer;

a coverlay formed on the base substrate;
a first insulating layer formed on the coverlay and formed in the rigid region;
a second insulating layer formed on the first insulating layer;
an outer layer circuit layer formed on the second insulating layer; and
a via electrically connecting the inner layer circuit layer to the outer layer circuit layer by penetrating through the first
insulating layer, the second insulating layer, and the coverlay,

wherein a glass transition temperature of the second insulating layer is 180° C. or more.

US Pat. No. 9,281,121

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Samsung Electro-Mechanics...

1. A multilayer ceramic electronic component comprising:
a ceramic body including a dielectric layer;
first and second internal electrodes disposed in the ceramic body to face each other, having the dielectric layer interposed
therebetween; and

first and second external electrodes formed on external surfaces of the ceramic body and electrically connected to the first
and second internal electrodes,

wherein the first and second internal electrodes are exposed to both end surfaces of the ceramic body, the first internal
electrode includes a first oxide layer formed inwardly from one end surface of the ceramic body in a length direction and
a first interlayer formed adjacently to the first oxide layer, and the second internal electrode includes a second oxide layer
formed inwardly from the other end surface of the ceramic body in the length direction and a second interlayer formed adjacently
to the second oxide layer, and

the first interlayer contains a metal having an ionization tendency higher than that of a metal contained in a remaining region
of the first internal electrode, or contains a metal more easily oxidized than the metal contained in the remaining region
of the first internal electrode, in a solid solution form, as well as the metal contained in the remaining region of the first
internal electrode, and the second interlayer contains a metal having an ionization tendency higher than that of a metal contained
in a remaining region of the second internal electrode or contains a metal more easily oxidized than the metal contained in
the remaining region of the second internal electrode, in a solid solution form, as well as the metal contained in the remaining
region of the second internal electrode.

US Pat. No. 9,192,050

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

Samsung Electro-Mechanics...

1. A method of manufacturing a printed circuit board, comprising:
forming an electronic component including an electrode that is formed on at least one side of a body;
forming terminals on an upper portion of the electrode and an upper portion of the body;
providing a substrate in which a cavity is formed;
mounting the electronic component formed with the terminals in the cavity of the substrate; and
forming a buildup layer on an upper portion of the substrate and an upper portion of the electronic component,
wherein the forming of the terminals includes:
preparing a plurality of terminals; and
bonding the terminals to the upper portion of the electrode of the electronic component and the upper portion of the body
of the electronic component.

US Pat. No. 9,526,164

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Samsung Electro-Mechanics...

1. A printed circuit board comprising:
a wiring structure disposed on at least one of a surface and an interior of a base; and
stitching vias configured to reduce electromagnetic interference, the stitching vias disposed on a periphery of the base and
having exposed side surfaces,

wherein a center of each of the stitching vias are offset each from the other in a zig-zag manner along one edge of the base.

US Pat. No. 9,526,174

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic electronic component comprising:
a multilayer ceramic capacitor including:
a ceramic body in which a plurality of dielectric layers are stacked,
a plurality of first and second internal electrodes alternately exposed to first and second side surfaces of the ceramic body,
having the dielectric layers interposed therebetween, and

first and second external electrodes extended from the first and second side surfaces of the ceramic body to portions of a
mounting surface of the ceramic body and connected to the first and second internal electrodes, respectively; and

an interposer board including:
an insulation board coupled to the mounting surface of the multilayer ceramic capacitor, and
first and second connection terminals disposed on the insulation board and connected to the first and second external electrodes,
respectively,

wherein the interposer board is formed to have an area smaller than that of the mounting surface of the multilayer ceramic
capacitor,

wherein the first and second connection terminals of the interposer board include:
first and second terminal parts formed to cover both end portions of the insulation board in a length direction;
first and second interconnection parts extended inwardly from the first and second terminal parts along an upper surface of
the insulation board; and

first and second connection parts formed at a position corresponding to the first and second external electrodes in the center
of the insulation board in the length direction and connected to end portions of the first and second interconnection parts
and connected to the first and second external electrodes, respectively,

wherein the first and second external electrodes are formed on central portions of both side surfaces of the ceramic body.

US Pat. No. 9,147,513

SERIES INDUCTOR ARRAY IMPLEMENTED AS A SINGLE WINDING AND FILTER INCLUDING THE SAME

Samsung Electro-Mechanics...

1. A series inductor array implemented as a single winding, the series inductor array comprising:
a winding structure having both ends; and
one or more terminal parts electrically connected to a region between the both ends of the winding structure to form an external
electrical connection,

wherein the winding structure has a structure in which a plurality of inductors having inductance formed in regions of the
winding structure disposed between the both ends thereof and the terminal parts or between the terminal parts are connected
in series, and

wherein the series inductor array is implemented as a multilayer circuit, and the winding structure is formed as a conductive
pattern on a single layer of the multilayer circuit.

US Pat. No. 9,431,899

POWER SUPPLY DEVICE FOR SUPPLYING STANDBY VOLTAGE BY USING MAIN VOLTAGE

SAMSUNG ELECTRO-MECHANICS...

1. A power supply device, comprising:
a standby power unit converting a DC voltage to an operating voltage and a first standby voltage and providing the first standby
voltage to a standby output terminal;

a DC/DC converting unit receiving the operating voltage from the standby power unit, converting the DC voltage to a main voltage,
and providing the main voltage to a main output terminal;

a main/standby power unit converting the main voltage from the DC/DC converting unit to a second standby voltage and providing
the second standby voltage to the standby output terminal; and

a sensing unit sensing whether or not the second standby voltage is supplied to the standby output terminal,
wherein the sensing unit outputs a switching signal varying a magnitude of the first standby voltage to the standby power
unit when the second standby voltage is supplied to the standby output terminal.

US Pat. No. 9,305,829

SEMICONDUCTOR PACKAGE WITH AN INDENTED PORTION AND MANUFACTURING METHOD THEREOF

SAMSUNG ELECTRO-MECHANICS...

1. A semiconductor package comprising:
a substrate having at least one indented portion formed as a groove therein;
at least one electronic device mounted on one surface of the substrate;
a lead frame bonded to the substrate and electrically connected to the electronic device; and
a molded portion sealing the lead frame and the electronic device and including at least one through hole extending the indented
portion,

wherein an interior of the indented portion is partially exposed to air through the through hole.

US Pat. No. 9,294,007

GATE DRIVING CIRCUIT AND INVERTER HAVING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A gate driving circuit, comprising:
at least one gate driving unit including at least one high voltage gate driving unit having a plurality of high voltage gate
drivers connected to one another in series between an input terminal of an instruction signal instructing a switching control
of an inverter unit including at least one inverter arm having a plurality of switches and switching input power according
to a control to output alternating current (AC) power and an output terminal of a control signal controlling switching of
the inverter unit to thereby control gate driving of a high side switch of the plurality of switches, and including at least
one low voltage gate driver to control the gate driving of a low side switch of the plurality of switches; and

at least one bootstrap unit dividing a voltage generated at the time of switching the plurality of switches to apply the divided
voltage to respective switches according to switching control of the gate driving unit,

wherein the inverter arm includes the high side switch, first and second middle side switches, and the low side switch sequentially
connected in series between the input power terminal and a ground,

wherein the gate driving unit includes:
a first high voltage gate driving unit having the plurality of high voltage gate drivers connected to one another in series
between the input terminal of the instruction signal and the output terminal of the control signal, and controlling switching
of the high side switch;

a second high voltage gate driving unit having the plurality of high voltage gate drivers connected to one another in series
between the input terminal of the instruction signal and the output terminal of the control signal, and controlling switching
of the first middle side switch;

a high voltage gate driver controlling switching of the second middle side switch; and
a low voltage gate driver controlling switching of the low side switch,
wherein the bootstrap unit includes:
a capacitor group including a first capacitor connected between a driving power terminal of a high voltage gate driver of
the last stage of the first high voltage gate driving unit and the ground, a second capacitor connected between a driving
power terminal of the high voltage gate driver of the last stage of the second high voltage gate driving unit and the ground,
and a third capacitor connected between a driving power terminal of a high voltage gate driver controlling switching of the
second middle side switch and the ground and connected to a driving power input terminal inputting the driving power to the
high voltage gate driver of the last stage of the first high voltage gate driving unit and a driving power input terminal
inputting the driving power to the high voltage gate driver of the last stage of the second high voltage gate driving unit;
and

a diode group including a first diode connected between the driving power terminal of the high voltage gate driver of the
last stage of the first high voltage gate driving unit and the driving power terminal of the high voltage driver of the last
stage of the second high voltage gate driving unit, a second diode connected between the driving power terminal of the high
voltage gate driver of the last stage of the second high voltage gate driving unit and the driving power terminal of the high
voltage gate driver controlling the switching of the second middle side switch, and a third diode connected between the driving
power terminal of the high voltage gate driver controlling the switching of the second middle side switch and a driving power
terminal of the low voltage gate driver.

US Pat. No. 9,214,856

POWER FACTOR CORRECTION DEVICE

SAMSUNG ELECTRO-MECHANICS...

1. A power factor correction device comprising:
a main switching unit including a first main switch and a second main switch performing a switching operation with predetermined
phase differences;

an auxiliary switching unit including a first auxiliary switch and a second auxiliary switch forming a transmission path for
surplus power existing before the first main switch and the second main switch are turned on, respectively;

an inductor unit positioned between a power input unit to which AC power is applied and the main switching unit and accumulating
or discharging energy according to a switching operation of the main switching unit; and

an auxiliary inductor unit regulating an amount of current flowing in the auxiliary switching unit in the event of a switching
operation of the auxiliary switching unit,

wherein the first auxiliary switch performs a first switching operation of being turned on before the first main switch is
turned on, and turned off before the first main switch is turned off, within a single switching period of the first main switch,
and

wherein the second auxiliary switch performs a first switching operation of being turned on before the second main switch
is turned on, and turned off before the second main switch is turned off, within a single switching period of the second main
switch.

US Pat. No. 9,408,285

ELECTROSTATIC DISCHARGE PROTECTION DEVICE AND CHIP COMPONENT WITH THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. An electrostatic discharge protective device, comprising:
a lower cover;
electrodes disposed on the lower cover, being spaced apart from each other;
a conductor; and
a semiconducting material layer covering the lower cover and the electrodes and formed of a semiconducting material,
wherein the semiconducting material includes at least any one of polyacetylene, poly (p-phenylene) (PPP), polypyrrole (PYR),
and polyazine (PAZ), and

the conductor is distributed within the semiconducting material layer and separated from a boundary surface between the lower
cover and the semiconducting material layer.

US Pat. No. 9,357,646

PACKAGE SUBSTRATE

SAMSUNG ELECTRO-MECHANICS...

1. A package substrate comprising:
an insulating layer;
circuit patterns formed on the insulating layer and divided into pad areas and pattern areas that have different heights;
and

a non-conductive paste (NCP) interposed between the circuit patterns and pads of a die connected to the circuit patterns to
fix the die onto the insulating layer,

wherein the circuit patterns are configured in a peripheral type, and the pad areas and the pattern areas form a step therebetween,
such that the pad areas have a height higher than that of the pattern areas, and

wherein the circuit pattern includes a plurality of circuits each including a respective pad area and a respective pattern
area and arranged in a row, the respective circuits alternately having different lengths and being arranged substantially
in parallel with each other.

US Pat. No. 9,554,466

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Samsung Electro-Mechanics...

9. A printed circuit board comprising:
a core insulating layer having a through hole;
a photosensitive resin layer disposed on an upper surface and a lower surface of the core insulating layer and inside the
through hole;

circuit layers on an upper surface and a lower surface of the photosensitive resin layer; and
a via configured to interconnect the circuit layer on the upper surface to the circuit layer on the lower surface of the photosensitive
resin layer,

wherein the via comprises a through via disposed on the photosensitive resin layer inside the through hole.

US Pat. No. 9,124,224

POWER GENERATING CIRCUIT AND SWITCHING CIRCUIT

SAMSUNG ELECTRO-MECHANICS...

1. A power generating circuit comprising:
a first transistor in which a second control signal is applied to a control terminal and a first control signal is applied
to one end, and which has the other end connected to an output terminal;

a second transistor in which the first control signal is applied to a control terminal and the second control signal is applied
to one end, and which has the other end connected to the output terminal;

a third transistor in which one of the first and the second control signals is applied to a control terminal and which has
one end grounded; and

a fourth transistor in which the other one of the first and the second control signals is applied to a control terminal and
which has one end connected to the other end of the third transistor and the other end connected to the output terminal.

US Pat. No. 9,307,632

MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Samsung Electro-Mechanics...

15. A method of manufacturing a multilayered substrate, comprising:
mounting an electronic component on a first reinforcing layer having a third circuit pattern layer formed on one surface thereof,
the electronic component having an external electrode;

forming a second insulating layer on the first reinforcing layer, the second insulating layer covering the third circuit pattern
layer and the first reinforcing layer and contacting a side of the electronic component;

stacking a first insulating layer on the second insulating layer, the first insulating layer having a cavity into which at
least a portion of the electronic component is inserted;

forming a third upper insulating layer on the first insulating layer, the third upper insulating layer covering the electronic
component and the first insulating layer and being filled between the cavity and the electronic component;

forming a fifth circuit pattern layer on the third upper insulating layer, the fifth circuit pattern layer having at least
one circuit pattern directly connected to the external electrode by a third via;

forming a third lower insulating layer on the third upper insulating layer, the third lower insulating layer covering the
fifth circuit pattern layer and the third upper insulating layer;

forming a fourth circuit pattern layer on the third lower insulating layer, the fourth circuit pattern layer having at least
one circuit pattern directly connected to at least one circuit pattern of the fifth circuit pattern layer by a fourth via;
and

forming a second reinforcing layer on the third lower insulating layer, the second reinforcing layer covering the fourth circuit
pattern layer and the third lower insulating layer, wherein the first and second reinforcing layers are substantially devoid
of fiber and decrease warpage of the multilayered substrate.

US Pat. No. 9,281,124

MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor comprising:
a ceramic body having a plurality of dielectric layers stacked therein;
an active part including a plurality of first and second internal electrodes alternately exposed through end surfaces of the
ceramic body, respectively, each of the dielectric layers being interposed between the plurality of first and second electrodes;

upper and lower cover layers disposed on upper and lower surfaces of the active part, respectively; and
first and second external electrodes covering side surfaces of the ceramic body, respectively,
wherein when a thickness of the upper or lower cover layer is defined as C, a margin between the active part and a side surface
of the ceramic body in a width direction is defined as M, a cross-sectional area of the ceramic body in a width-thickness
direction is defined as Ac, and a cross-sectional area of the active part in the width-thickness direction, in which the first
and second internal electrodes are overlapped with each other in a thickness direction, is defined as Aa, 1.826?C/M?4.686,
and 0.2142?Aa/Ac?0.4911.

US Pat. No. 9,279,959

OPTICAL SYSTEM

Samsung Electro-Mechanics...

1. An optical system comprising:
in order from an object side,
a first lens having positive refractive power and an object-side surface convex in the object side direction;
a second lens having negative refractive power;
a third lens having negative refractive power;
a fourth lens having positive refractive power and an image-side surface convex in an image side direction;
a fifth lens having negative refractive power and an image-side surface convex in the image side direction;
a sixth lens having negative refractive power and an image-side surface concave in the image side direction: and
an aperture stop disposed between the first and second lenses.

US Pat. No. 9,515,563

POWER MODULE AND DISTRIBUTED POWER SUPPLY APPARATUS HAVING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A power module, comprising:
a power factor correction stage configured to switch an input power to correct a power factor thereof;
a DC/DC conversion stage configured to convert a power output of the power factor correction stage into a DC power;
a control unit configured to control the power factor correction stage and the DC/DC conversion stage to perform a power conversion
operation in a preset powered mode and to stop the power conversion operation of the DC/DC conversion stage in a preset idle
mode; and

a reference voltage supply unit configured to supply a reference voltage to the DC/DC conversion stage in the preset idle
mode, wherein the control unit is further configured to receive a current feedback associated with a current level of the
DC power and to control an operation of the reference voltage supply unit, and

wherein the DC/DC conversion stage is further configured to track the reference voltage supplied in the preset idle mode,
at the time of switching from the preset idle mode to the preset powered mode, to perform a power switching operation; and

wherein the DC/DC conversion stage includes:
a DC/DC conversion unit configured to switch the power output of the power factor correction stage and to convert the switched
power into the DC power; and

a DC conversion controller configured to control the switching of the DC/DC conversion unit based on a control exerted by
the control unit; and wherein the DC conversion controller includes:

a comparator configured to compare the reference voltage with a first voltage set by a voltage level of the DC power; and
a first switch configured to cut an output of the comparator according to the controlling of the control unit in the idle
mode.

US Pat. No. 9,583,267

MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor, comprising:
a ceramic body;
internal electrodes having opposing polarities, alternately disposed within the ceramic body of the ceramic body, and including
lead portions which are exposed to a mounting surface of the ceramic body and are spaced apart from each other in a lengthwise
direction of the ceramic body; and

external electrodes connected to the lead portions having opposing polarities, respectively,
wherein an interval between adjacent lead portions having opposing polarities, determined in the lengthwise direction, is
in a range of 167.3 ?m to 500.7 ?m,

wherein widths of one-side margin portions of the external electrodes in the length direction of the ceramic body that are
not in contact with the corresponding lead portions are in a range of 20.2 ?m to 186.9 ?m,

wherein an interval between adjacent external electrodes is in a range of 195.6 ?m to 460.3 ?m,
wherein the external electrodes include first bands extending to portions of opposite side surfaces of the ceramic body in
the width direction thereof, and

wherein heights of the first bands of the external electrodes are equal to or more than 73.4 ?m, respectively and are equal
to or less than an overall height of the capacitor.

US Pat. No. 9,060,458

METHOD FOR MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD

SAMSUNG ELECTRO-MECHANICS...

1. A method for manufacturing a multi-layer printed circuit board, comprising:
forming first bumps on one surface of a first copper layer at a predetermined interval;
providing, on the first copper layer, an insulating layer through which the first bumps are penetrating;
stacking a second copper layer on a top of the insulating layer;
forming circuits by patterning the first copper layer and the second copper layer;
laminating insulating films on top and bottom surfaces of the insulating layer on which the circuits have been formed;
forming second bumps on one surface of a third copper layer and of a fourth copper layer at a predetermined interval; and
stacking the third copper layer and fourth copper layer, provided with the second bumps, on the top and bottom surfaces of
the insulating films.

US Pat. No. 9,583,266

DIELECTRIC CERAMIC COMPOSITION, DIELECTRIC MATERIAL AND MULTILAYER CERAMIC CAPACITOR INCLUDING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A dielectric ceramic composition comprising:
a major component (a barium titanate-based base material); and
a minor component,
wherein the dielectric ceramic composition is sintered to form a sintered body having a fine structure,
the fine structure includes first crystal grains in which a Ca content is lower than 2.5 mol % and second crystal grains in
which a Ca content is between 2.5 mol % to 13.5 mol %,

the minor component including at least one selected from the group consisting of oxides and carbonates of at least one of
Ba and Ca, and

the at least one of Ba and Ca included in the fourth minor component has a total content of 0.72 to 7.68 parts by mol on the
basis of 100 parts by mol of the major component.

US Pat. No. 9,455,079

MULTILAYERED POWER INDUCTOR AND METHOD FOR PREPARING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayered power inductor, comprising:
a magnetic layer, an inner electrode layer including a metal powder and a sintering inhibitor, and an outer electrode layer,
wherein the sintering inhibitor is one or more selected from the group consisting of ZrO2, MnO2, and TiO2,

wherein the inner electrode layer includes a number of pores, and
wherein a pore ratio at a section of the inner electrode layer is 7% or less.

US Pat. No. 9,491,847

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic electronic component comprising:
a board including first and second contact terminals which are disposed on one surface thereof to be spaced apart from each
other in a length direction, and first and second external terminals which are disposed on the other surface thereof to be
spaced apart from each other in the length direction;

a multilayer ceramic capacitor including first and second external electrodes including first and second connection portions
which are disposed on opposite end surfaces of a ceramic body and first and second band portions which extend from the first
and second connection portions to portions of one surface of the ceramic body in a thickness direction thereof, respectively,
the first and second band portions being connected to the first and second contact terminals of the board, respectively;

a sealing part enclosing the multilayer ceramic capacitor on the board while exposing one ends of the first and second contact
terminals; and

first and second connection terminals connecting the exposed ends of the first and second contact terminals and the first
and second external terminals to each other, respectively.

US Pat. No. 9,485,878

SUBSTRATE STRUCTURE HAVING ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING SUBSTRATE STRUCTURE HAVING ELECTRONIC COMPONENTS

Samsung Electro-Mechanics...

1. A substrate structure having electronic components, comprising:
a substrate having one surface, the other surface opposite to the one surface, and a cavity formed by penetrating between
the one surface and the other surface;

a first circuit pattern and a second circuit pattern provided on the one surface of the substrate;
a first electronic component of which a portion is inserted in the cavity and the remaining portion protrudes outside the
cavity and having a first terminal formed on a surface;

a filler for filling a space between the cavity and the first electronic component;
a first surface treatment layer provided on an upper surface of the first terminal of the first electronic component;
a second electronic component mounted on the one surface of the substrate and having a second terminal electrically connected
to the first surface treatment layer;

a second surface treatment layer provided on the upper surface of the second circuit pattern; and
a third surface treatment layer provided on a lower surface of the second terminal,
wherein an upper surface of the first electronic component is positioned higher than an upper surface of the substrate,
wherein the first terminal is formed on the upper surface of the first electronic component;
wherein the second terminal is provided in plurality, and some of the plurality of second terminals are coupled to the first
terminal and a rest of the plurality of second terminals are coupled to the second circuit pattern;

wherein the first surface treatment layer and the third surface treatment layer are in direct contact with each other by way
of solder, and

wherein the second surface treatment layer and the third surface treatment layer are in direct contact with each other by
way of solder.

US Pat. No. 9,480,158

INTERPOSER, ELECTRONIC COMPONENT INCLUDING THE SAME, AND BOARD HAVING ELECTRONIC COMPONENT INCLUDING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. An interposer comprising: an insulating board having first and second main surfaces opposing each other in a thickness
direction, first and second side surfaces opposing each other in a width direction, and third and fourth end surfaces opposing
each other in a length direction; connective electrodes disposed on the first and second main surfaces of the insulating board;
and a concave part disposed so that at least one of the first and second side surfaces and the third and fourth end surfaces
are indented, wherein when a length of a region including the insulating board and the connective electrodes is defined as
L, and a width thereof is defined as W, the concave part is disposed so that an area of the region including the insulating
board and the connective electrodes on the first main surface is smaller than L×W, wherein when an area of a region indented
by the concave part is defined as A, A/(L×W) satisfies 0.023?A/(L×W)?0.321.

US Pat. No. 9,287,317

IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A method of manufacturing an image sensor module for a subminiature camera, the method comprising:
dispensing an adhesive having a third coefficient of thermal expansion of 130 ppm/° C. or more at a glass transition temperature
Tg or more of the adhesive to a substrate having a second coefficient of thermal expansion and a thickness of 175 ?m or less,
the adhesive having a thickness less than that of the image sensor;

temporarily curing and attaching an image sensor having a first coefficient of thermal expansion to the substrate to which
the adhesive has been dispensed; and

curing the adhesive at the glass transition temperature Tg or more of the adhesive, the glass transition temperature of the
adhesive being lower than a curing temperature of the adhesive,

wherein pressure is applied for 1 to 2 seconds at a temperature range of 120° C. to 160° C. in the attaching of the image
sensor to the substrate, and

the curing of the adhesive is performed for about 120 seconds at about 120° C.

US Pat. No. 9,208,949

MULTILAYER CERAMIC CAPACITOR

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor comprising:
a ceramic body including a plurality of dielectric layers and having first and second surfaces opposing each other in a thickness
direction, first and second end surfaces opposing each other in a length direction, and first and second side surfaces opposing
each other in a width direction;

first and second internal electrodes disposed in the ceramic body to be alternately exposed to the first and second end surfaces
of the ceramic body, having the dielectric layers interposed therebetween; and

first and second external electrodes electrically connected to the first and second internal electrodes, respectively,
wherein the first and second external electrodes includes:
first and second internal conductive layers extended from the first and second end surfaces of the ceramic body to portions
of the first surface, respectively;

first and second insulating layers extended from the first and second internal conductive layers on the first and second end
surfaces to portions of the first and second internal conductive layers on the first surface, respectively, and having a length
shorter than that of the first and second internal conductive layers in such a manner that portions of the first and second
internal conductive layers are exposed to the first surface; and

first and second external conductive layers formed on the first and second internal conductive layers on the first surface,
respectively.

US Pat. No. 9,189,105

TOUCH SENSOR

Samsung Electro-Mechanics...

1. A touch sensor, comprising:
a window;
a transparent member:
a transparent substrate having a first electrode part formed on one surface thereof; and
a first adhesive layer allowing the window and one surface of the transparent substrate to adhere to each other,
wherein a first protrusion part is protruded from an edge of one surface of the transparent substrate toward a direction facing
the window;

a second adhesive layer allowing one surface of the transparent member and the other surface of the transparent substrate
to each other, a second electrode part being formed on the other surface of the transparent substrate,

wherein a third protrusion part is formed along an edge of the other surface of the transparent substrate.

US Pat. No. 9,344,000

POWER MODULE VARYING BIAS POWER AND DISTRIBUTED POWER SUPPLY APPARATUS

SAMSUNG ELECTRO-MECHANICS...

1. A power module comprising:
a power factor correction stage switching input power to correct a power factor thereof;
a DC/DC conversion stage switching power having a corrected power factor from the power factor correction stage to convert
the power into pre-set DC power in a powering mode in which normal power is output;

a standby stage converting the power having a corrected power factor from the power factor correction stage into pre-set standby
power in a cold standby mode in which the DC/DC conversion stage outputs power having a level lower than that of normal power;
and

a variable bias supply unit, provided with the converted pre-set standby power in a cold standby mode, varying a voltage level
of bias power for controlling DC/DC power conversion and supplying the same to the DC/DC conversion stage in the cold standby
mode and the powering mode,

wherein the DC/DC conversion stage comprises:
a DC/DC conversion unit switching power having a corrected power factor to convert it into DC power; and
a DC conversion controller controlling a switching operation of the DC/DC conversion unit upon receiving bias power having
a varied voltage level from the variable bias supply unit.

US Pat. No. 9,280,230

APPARATUS AND METHOD FOR SENSING CAPACITANCE, AND TOUCH SCREEN APPARATUS

Samsung Electro-Mechanics...

1. An apparatus for sensing capacitance, the apparatus comprising:
a first integration circuit unit, including a first capacitor configured to be charged by a change in capacitance occurring
in a sensing electrode;

a comparison circuit unit, configured to compare a level of an output signal of the first integration circuit unit with a
predetermined reference level; and

a noise removal unit, including a plurality of switches configured to operate according to an output of the comparison circuit
unit,

wherein the comparison circuit unit is configured to control an operation of each of the plurality of switches to discharge
charges charged in the first capacitor, when the level of the output signal of the first integration circuit unit is higher
than the reference level.

US Pat. No. 9,258,879

HEAT RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A heat radiating substrate comprising:
a heat radiating plate having a step in one side formed so that one side and the other side thereof have thicknesses different
from each other;

a conductor pattern layer formed on an opposite surface of a surface with the step in the heat radiating plate and including
a first mounting pad on which a control device is mounted, a second mounting pad on which a power device is mounted, and a
circuit pattern; and

an insulating layer formed between the opposite surface of the surface with the step in the heat radiating plate and the conductor
pattern layer,

wherein the opposite surface of the surface with the step in the heat radiating plate is substantially flat,
wherein the heat radiating plate includes:
a first heat radiating part having the first mounting pad on which the control device is mounted; and
a second heat radiating part formed integrally with the first heat radiating part at a side of the first heat radiating part,
having a thickness thicker than that of the first heat radiating part, and having the second mounting pad on which the power
device is mounted,

wherein the first heat radiating part or the second heat radiating part has a step, and
wherein the bottom of the heat radiating plate having a thin thickness at a region at which the step is formed is filled with
a heterogeneous material having thermal conductivity lower than that of the heat radiating plate.

US Pat. No. 9,153,381

CHIP DEVICE AND METHOD FOR MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A chip device comprising:
a multilayer body having a hexahedral shape;
an external electrode covering both distal ends of the multilayer body; and
a shape maintaining material contained in the external electrode to maintain a shape of the external electrode at the time
of forming the external electrode.

US Pat. No. 9,603,236

HEAT DISSIPATING SUBSTRATE

Samsung Electro-Mechanics...

1. A heat dissipating substrate comprising:
a base substrate;
a first plated layer penetrating the base substrate in a thickness direction of the base substrate and having a first through
hole formed therein in a thickness direction of the base substrate;

a first substrate disposed on an upper end portion of the base substrate;
a second plated layer penetrating the first substrate in a thickness direction of the first substrate and having a second
through hole formed therein in a thickness direction of the first substrate;

a heat dissipating pad disposed on an upper end portion of the first substrate to cover an upper end of the second plated
layer; and

a thermal conduction member comprising lead (Pb) and inserted into the first through hole and the second through hole to discharge
heat to an outside,

wherein the second through hole is connected to the first through hole and has a diameter smaller than that of the first through
hole.

US Pat. No. 9,474,167

MULTILAYERED SUBSTRATE

Samsung Electro-Mechanics...

1. A multilayered substrate, comprising:
a second insulating layer having a fine pattern layer formed on an upper surface thereof; and
a third insulating layer
having a circuit pattern layer formed on an upper surface thereof and formed of a material different from the second insulating
layer, the circuit pattern layer having a pattern pitch larger than that of the fine pattern layer,

disposed closer to an outer surface of the multilayered substrate as compared to the second insulating layer, and
having a thermal expansion rate smaller than that of the second insulating layer or a rigidity larger than that of the second
insulating layer,

wherein the second insulating layer has surface roughness smaller than that of the third insulating layer.

US Pat. No. 9,424,991

DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR COMPRISING THE SAME

Samsung Electro-Mechanics...

1. A dielectric ceramic composition comprising: a base powder; and an accessory ingredient, wherein the base powder includes
dielectric grains having a core-shell structure, and when a diameter of a core is defined as D1 and a diameter of the dielectric grain is defined as D2, 40 nm?D1?150 nm and 150 nm?D2?550 nm are satisfied.

US Pat. No. 9,240,280

MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor, comprising:
a ceramic body including a plurality of dielectric layers;
first and second internal electrodes facing each other while having at least one dielectric layer disposed therebetween, and
alternately exposed to end surfaces of the ceramic body; and

first and second external electrodes electrically connected to the first and second internal electrodes, respectively,
wherein each of the first and second external electrodes includes:
a first external electrode layer formed of a material containing copper and glass and extending from an end surface of the
ceramic body to portions of main and side surfaces of the ceramic body;

a second external electrode layer formed of a material containing glass, disposed on the first external electrode layer, and
being shorter than the first external electrode layer to expose a portion of the first external electrode layer; and

a third external electrode layer formed of a material containing copper and glass and covering the first and second external
electrode layers.

US Pat. No. 9,196,506

METHOD FOR MANUFACTURING INTERPOSER

Samsung Electro-Mechanics...

1. A method for manufacturing an interposer, the method comprising:
forming a via hole in an insulation plate comprising a resin or a ceramic;
simultaneously forming resists for formation of a first upper redistribution layer on the top surface of the insulation plate,
and a lower redistribution layer on the bottom surface of the insulation plate;

plating copper to fill the via hole and simultaneously forming the first upper redistribution layer and the lower redistribution
layer along a designed circuit pattern; and

forming a first upper protection layer and a lower protection layer to expose a portion of the first upper redistribution
layer and a portion of the lower redistribution layer.

US Pat. No. 9,095,065

METHOD OF REPAIRING PROBE BOARD AND PROBE BOARD USING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A probe board comprising:
a board body formed as a ceramic sintered body;
a plurality of first via electrodes formed in the board body, the first via electrodes being filled with a first filling material;
and

a second via electrode filled with a second filling material having a lower sintering temperature than that of the first filling
material.

US Pat. No. 9,609,753

MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING OF THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor comprising:
a ceramic body including a plurality of dielectric layers stacked in a width direction;
a plurality of first and second internal electrodes alternately disposed to have a respective dielectric layer interposed
between the first and second internal electrodes;

first and second lead-out portions each having one or more space portions and extended from the first internal electrode to
be exposed through a mounting surface of the ceramic body and spaced apart from each other in the length direction of the
ceramic body;

a third lead-out portion extended from the second internal electrode to be exposed through the mounting surface of the ceramic
body and disposed between the first and second lead-out portions;

first and second external electrodes disposed on the mounting surface of the ceramic body to be spaced apart from each other
in the length direction of the ceramic body and connected to the first and second lead-out portions, respectively; and

a third external electrode disposed between the first and second external electrodes and connected to the third lead-out portion,
wherein a total area of the space portions included in the first lead-out portion is S2 and an area corresponding to the sum
of an area of the first lead-out portion and S2 is S1, and S2/S1 ranges from 10.0% to 90.1%, and

a total area of the space portions included in the second lead-out portion is S2? and an area corresponding to the sum of
an area of the second lead-out portion and S2? is S1?, and S2?/S1? ranges from 10.0% to 90.1%.

US Pat. No. 9,270,255

HIGH VOLTAGE DRIVER USING LOW VOLTAGE TRANSISTOR

Samsung Electro-Mechanics...

1. A high voltage driver comprising:
a low side switching unit including first and second to n-th N-channel metal oxide semiconductor (NMOS) transistors connected
to each other in series between an output terminal and a ground and operated in a turned-on or turned-off state depending
on a first control signal;

a high side switching unit including first and second to n-th P-channel MOS (PMOS) transistors connected to each other in
series between a power supply voltage terminal and the output terminal and operated complementarily to the low side switching
unit depending on a second control signal;

a voltage dividing unit dividing a voltage between the output terminal and the ground and providing the divided voltages to
connection nodes between the first and second to n-th PMOS transistors and connection nodes between the first and second to
n-th NMOS transistors, respectively;

a first constant voltage unit providing a constant voltage and a unidirectional signal path between a source and a gate of
each of the second to n-th NMOS transistors;

a second constant voltage unit providing a constant voltage and a unidirectional signal path between a source and a gate of
each of the second to n-th PMOS transistors;

a first charging unit charged with a voltage through the signal path of the first constant voltage unit and providing the
charged voltage to each of the gates of the second to n-th NMOS transistors; and

a second charging unit charged with a voltage through the signal path of the second constant voltage unit and providing the
charged voltage to each of the gates of the second to n-th PMOS transistors.

US Pat. No. 9,105,844

PIEZOELECTRIC DEVICE WITH PIEZOELECTRIC POLYMER MATERIAL

SAMSUNG ELECTRO-MECHANICS...

1. A piezoelectric device with a multi-layered structure, comprising:
a piezoelectric polymer; and
a plurality of first electrodes and a plurality of second electrodes stacked sequentially on a single surface or both surfaces
of the piezoelectric polymer,

wherein the first electrodes are graphene having a hexagonal sheet structure or a graphene composite including the same.

US Pat. No. 9,099,329

IN NANOWIRE, DEVICE USING THE SAME AND METHOD OF MANUFACTURING IN NANOWIRE

SAMSUNG ELECTRO-MECHANICS...

1. An Indium (In) nanowire, comprising:
a substrate;
an indium thin film formed on the substrate;
an insulating film formed on the indium thin film and having at least one through hole through formation of a pattern; and
an In nanowire vertically protruded from the indium thin film through the at least one through hole,
wherein the insulating film is formed of diamond-like carbon.

US Pat. No. 9,270,165

PHASE SHIFT CIRCUIT AND POWER FACTOR CORRECTION CIRCUIT INCLUDING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A phase shift circuit comprising:
a switching circuit unit charging power in or discharging power from a capacitor through a plurality of switching devices
and comparing a voltage of the capacitor with a predetermined reference voltage; and

a clock generating unit generating a reference clock signal based on an output of the switching circuit unit,
wherein the switching circuit unit turns the plurality of switching devices on or off, based on currents from inductors respectively
included in a main circuit and a sub-circuit of a power factor correction circuit to determine a polarity of the voltage of
the capacitor,

wherein the plurality of switching devices includes first and second switch groups having different operational timings, and
a polarity of the voltage of the capacitor when the first switch group is turned on is different from a polarity of the voltage
of the capacitor when the second switch group is turned on, and

wherein the capacitor is charged both when the first switch group is on and when the second switch group is on.

US Pat. No. 9,263,187

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A multilayer ceramic capacitor comprising:
a ceramic main body including a dielectric layer; and
first and second internal electrodes provided on upper and lower surfaces of the dielectric layer and formed of a thin film
including graphene,

wherein the thin film including graphene has structure in which ten or less graphene thin films are laminated.

US Pat. No. 9,510,461

ELECTRIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. An electronic component module, comprising:
a first substrate having mounted electrodes formed on both surfaces thereof;
a plurality of electronic components mounted on both surfaces of the first substrate;
at least one second substrate bonded to a lower surface of the first substrate by soldered joints; and
an insulating part formed in at least one position in a gap between the first substrate and the second substrate and bonding
the first substrate to the second substrate,

wherein the insulating part is disposed to be spaced apart from the soldered joints so as not to contact the soldered joints,
and

the insulating part is a melted and cured insulating member, being one of hot-melt tape, thermal bonding tape or thermosetting
bonding tape.

US Pat. No. 9,287,044

ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF

SAMSUNG ELECTRO-MECHANICS...

1. An electronic component comprising:
a ceramic main body including two end surfaces in a length direction, two side surfaces in a width direction and top and bottom
surfaces in a thickness direction;

first and second external electrodes disposed on the two end surfaces in the length direction, respectively;
third and fourth external electrodes disposed on the two side surfaces in the width direction, respectively;
first internal electrodes disposed within the ceramic main body and connected to first and second external electrodes; and
second internal electrodes alternately arranged with the first internal electrodes, while having a ceramic layer interposed
therebetween, and connected to the third and fourth external electrodes,

wherein a roughness R1 of the first internal electrode is lower than a roughness R2 of the second internal electrode, and

wherein 0.13?(R2/t2)?0.5 is satisfied, and t2 is the thickness of the second internal electrode.

US Pat. No. 9,236,173

COIL PARTS AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A coil part comprising:
a lower magnetic body;
primary and secondary lower patterns formed on the lower magnetic body in a spiral shape in parallel to each other;
a lower insulating layer covering the primary and secondary lower patterns;
primary and secondary upper patterns electrically connected to the primary and secondary lower patterns, respectively, and
formed on the lower insulating layer in a spiral shape in parallel to each other to correspond to the primary and secondary
lower patterns; and

an upper magnetic body formed on the primary and secondary upper patterns, wherein the primary and secondary upper patterns
have portions which cross the primary and secondary lower patterns on the plane,

wherein the primary and secondary upper patterns are arranged to cross arrangement of the primary and secondary lower patterns,
and

wherein the primary upper pattern is arranged to be positioned in a space between the primary lower pattern and the secondary
lower pattern, and the secondary upper pattern is arranged to be positioned in a space between the primary lower pattern and
the secondary lower pattern in the crossing portions.

US Pat. No. 9,209,854

RADIO FREQUENCY SWITCHING CIRCUIT WITH ADVANCED ISOLATION CHARACTERISTICS

Samsung Electro-Mechanics...

5. A radio frequency switching circuit comprising:
a reception switching circuit unit including first to nth (n is a natural number greater than at least 2) transistors connected in series between a first signal port for transmission
and reception of signals and a common connection node connected to an antenna port and operated according to a first gate
signal;

a transmission switching circuit unit including first to mth (m is a natural number greater than at least 2) transistors connected in series between a second signal port for transmission
and reception of signals and the common connection node and operated according to a second gate signal;

a first impedance adjuster forming an alternating current (AC) ground path between a ground and a gate of the first transistor
of the reception switching circuit unit when the reception switching circuit unit is in an off-state; and

a second impedance adjuster forming an AC ground path between a ground and a gate of the first transistor of the transmission
switching circuit unit when the transmission switching circuit unit is in an off-state.

US Pat. No. 9,159,504

APPARATUS FOR STORING ELECTRIC ENERGY AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. An apparatus for storing an electric energy, the apparatus comprising:
an electrode stack in which a cathode and an anode in which a cathode lead and an anode lead are respectively formed are alternately
stacked; and

collector plates disposed at both sides of the electrode stack, connected to the cathode lead and the anode lead, and provided
with external terminals and one or more electrolyte flow holes,

wherein the cathode lead is formed along the entire length of one side of the cathode and the anode lead is formed along the
entire length of one side of the anode.

US Pat. No. 9,148,955

MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING MULTI-LAYERED CERAMIC CAPACITOR THEREON

SAMSUNG ELECTRO-MECHANICS...

1. A mounting structure of a circuit board having a multi-layered ceramic capacitor thereon, in which a dielectric layer on
which inner electrodes are stacked in a first direction and external electrode terminals connecting the inner electrodes in
parallel are disposed on both ends thereof, wherein
the inner electrodes of the multi-layered ceramic capacitor and the circuit board are arranged to extend along a second direction
substantially perpendicular to the first direction, the external electrode terminals are connected with lands on the circuit
board by a conductive material,

a ratio of a bonding area ASOLDER of the conductive material to the area AMLCC of the external electrode terminals AMLCC is more than 0.72 and less than 1.2, thereby reducing vibration noise,

and the conductive material extends outwardly in length and width directions from a contact face between the external electrodes
and the land,

wherein the area AMLCC of the external electrode terminals defines length and width of the external electrode terminal disposed on both ends of the
multi-layered ceramic capacitor as LMLCC and WMLCC, respectively, defining the area calculated by a product of the length and the width, and

the bonding area ASOLDER of the conductive material defines length and width of the conductive material bonded to the external electrode terminal of
the multi-layered capacitor as LSOLDER and WSOLDER, respectively, defining the area calculated by a product of the length and the width.

US Pat. No. 9,136,059

MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor comprising:
a ceramic body including a plurality of dielectric layers and having first and second main surfaces facing each other, first
and second side surfaces facing each other, and first and second end surfaces facing each other;

a capacitor part formed in the ceramic body and including a first internal electrode having a lead exposed to the first side
surface and a second internal electrode exposed to the second end surface;

first to third internal connecting conductors formed in the ceramic body and having at least one polarity; and
first to fourth external electrodes formed outwardly of the ceramic body and electrically connected to the first and second
internal electrodes and the first to third internal connecting conductors,

wherein the first and second internal connecting conductors and the third internal connecting conductor are connected in parallel,
and

the first to third internal connecting conductors and the capacitor part are connected in series.

US Pat. No. 9,123,460

FERRITE COMPOSITION FOR HIGH FREQUENCY BEAD AND CHIP BEAD COMPRISING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A ferrite composition for a high frequency bead, comprising:
M-type hexagonal ferrite represented by BaFe8CuTiVZnO19.

US Pat. No. 9,110,156

APPARATUS AND SYSTEM FOR MEASURING VELOCITY OF ULTRASOUND SIGNAL

SAMSUNG ELECTRO-MECHANICS...

1. An apparatus for measuring velocity of an ultrasound signal, comprising:
a transmitting module transmitting ultrasound signals to targets;
a receiving module receiving the ultrasound signals reflected from the targets;
an image generating module using the received ultrasound signals to generate a plurality of ultrasonic images having different
sound velocities; and

a sound velocity determining module using the plurality of generated ultrasonic images to determine optimal sound velocity
for scanning the targets,

wherein the sound velocity determining module comprises:
a noise removing unit removing speckle noises from the plurality of generated ultrasonic images,
an image segmenting unit segmenting the plurality of ultrasonic images from which noise is removed into each of the plurality
of blocks,

a block selector selecting a predetermined number of blocks from the plurality of segmented blocks, and
a sound velocity determining unit comparing the blocks of the plurality of ultrasonic images selected in the block selector
to determine the optimal sound velocity for scanning the targets,

wherein the sound velocity determining unit detects the edge regions of blocks selected for each ultrasonic image, sums the
luminance of the detected edge regions, and compares the luminance of the edge regions summed for each ultrasonic image to
determine the sound velocity of the ultrasonic images having the smallest luminance in the summed edge regions as the optimal
sound velocity for scanning the targets.

US Pat. No. 9,655,247

COIL COMPONENT AND BOARD HAVING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A coil component comprising:
a main substrate;
a first coil pattern disposed on a first surface of the main substrate;
a first insulating layer disposed on one surface of the first coil pattern;
a third coil pattern disposed on one surface of the first insulating layer and electrically connected to the first coil pattern;
a second coil pattern disposed on a second surface of the main substrate opposing the first surface;
a second insulating layer disposed on one surface of the second coil pattern;
a fourth coil pattern disposed on one surface of the second insulating layer and electrically connected to the second coil
pattern; and

a magnetic body in which the first to fourth coil patterns are embedded.

US Pat. No. 9,504,169

PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A printed circuit board having an embedded electronic device, comprising:
a core substrate having circuit layers formed on both a top surface and a bottom surface thereof;
a taper-shaped cavity formed on the core substrate; and
an electronic device embedded in the cavity,
wherein a width of the cavity is formed to gradually decrease in a direction toward the bottom surface of the core substrate
from the top surface of the core substrate, and a width of the cavity of a lower surface at the bottom surface of the core
substrate is formed to be smaller than that of a lower portion of the electronic device, and

wherein an edge of the lower portion of the electronic device is in contact with a tapered surface of the cavity.

US Pat. No. 9,390,856

DIELECTRIC COMPOSITION, MULTILAYER CERAMIC CAPACITOR USING THE SAME, AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC CAPACITOR

SAMSUNG ELECTRO-MECHANICS...

1. A dielectric composition comprising a base main component including Ba and Ti and an accessory component, wherein a ratio
of domain width/grain size of the dielectric composition is in the range of more than 0 and equal or less than 0.2, and wherein
the accessory component comprises:
a first accessory component including one or more variable-valence acceptor elements selected from the group consisting of
Mn, V, Cr, Fe, Ni, Co, Cu, and Zn, oxides thereof, and carbonates thereof;

one or more second accessory components selected from the group consisting of fixed-valence acceptor elements of Mg and Al,
oxides thereof, and carbonates thereof;

a third accessory component including one or more rare-earth elements selected from the group consisting of Y, Dy, Ho, Er,
Gd, Ce, Nd, and Sm, oxides thereof, and carbonates thereof;

a fourth accessory component including a Ba element, oxides thereof, and carbonates thereof;
a fifth component including Ca and Zr elements, oxides thereof, and carbonates thereof; and
a sixth accessory component including Si and Al elements, oxides thereof, carbonates thereof, and glass including a Si element.

US Pat. No. 9,384,899

TANTALUM CAPACITOR AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A tantalum capacitor comprising:
a negative electrode lead frame;
a capacitor body mounted on an upper surface of the negative electrode lead frame and containing a tantalum powder and having
a tantalum wire protruding to one end surface of the capacitor body;

a positive electrode lead frame including a positive electrode terminal part, a vertical support part vertically extended
from one leading edge of the positive electrode terminal part, and a positive electrode connection part extended from the
vertical support part toward the positive electrode terminal part and connected to the tantalum wire; and

a molding part formed to allow a lower surface of the positive electrode terminal part of the positive electrode lead frame
and a lower surface of the negative electrode lead frame to be exposed to an outside of the molding part, while enclosing
the capacitor body.

US Pat. No. 9,355,766

COIL FOR CORDLESS CHARGING AND CORDLESS CHARGING APPARATUS USING THE SAME

Samsung Electro-Mechanics...

1. A coil for cordless charging, the coil comprising:
first and second coil substrates having a coil pattern; and
a connection substrate having one end interposed between the first and second coil substrates and electrically connected to
the coil pattern and the other end electrically connected to the outside,

wherein each of the first coil substrate and the second coil substrate is printed on a printed circuit board having rigidity,
and the connection substrate is a thin film circuit board having flexibility.

US Pat. No. 9,160,297

COMMON MODE FILTER

SAMSUNG ELECTRO-MECHANICS...

1. A common mode filter comprising:
first and second coil electrode patterns formed at an upper layer and alternately disposed; and
first and second coil electrode patterns formed at a lower layer and alternately disposed,
wherein the outermost pattern of the upper layer and the outermost pattern of the lower layer are coil electrode patterns
having the same order, and the coil electrode patterns disposed at the upper layer and the lower layer and having the same
order are overlapped with each other in the vertical direction, but have the centers misaligned with each other.

US Pat. No. 9,153,678

POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A power semiconductor device, comprising:
a contact formed in an active region;
a first conductive body layer and a second conductive emitter layer formed below the contact;
a trench gate extendedly formed from the active region into a first termination region and formed alternately with the contact;
a first conductive well formed between the contact of the active region and the trench gate;
a first conductive well extending portion formed in the first termination region and a part of a second termination region;
a first conductive field limiting ring formed in the second termination region and contacting the first conductive well extending
portion; and

a high-concentration second conductive buried hole accumulation part formed below the first conductive well and the first
conductive well extending portion,

the high-concentration second buried hole accumulation part being formed to cover at least a portion of a side surface of
the trench gate.

US Pat. No. 9,152,162

CONSTANT VOLTAGE GENERATING CIRCUIT AND CONSTANT VOLTAGE GENERATING METHOD FOR GENERATING A CONSTANT VOLTAGE WITH RESPECT TO A VARIABLE POWER SUPPLY VOLTAGE WITHOUT USING A REGULATOR

Samsung Electro-Mechanics...

1. A constant voltage generating circuit, comprising:
a voltage distribution unit performing voltage drop on a variable input power in accordance with a preset ratio;
a reference voltage and register bit generation unit outputting a band gap reference voltage and a register bit in accordance
with an output of a controller of a comparison control unit;

the comparison control unit comparing an output of the voltage distribution unit and the band gap reference voltage output
from the reference voltage and register bit generation unit, and controlling the reference voltage and register bit generation
unit or a constant voltage generation unit in accordance with the compared result; and

the constant voltage generation unit receiving the variable input power by an operation of a switch corresponding to the register
bit to thereby output a constant voltage, in accordance with the output of the controller of the comparison control unit.

US Pat. No. 9,134,587

OPTICAL IMAGE STABLILIZER DETECTING X DIRECTION DISPLACEMENT AND Y DIRECTION DISPLACEMENT OF LENS GROUP

Samsung Electro-Mechanics...

1. An optical image stabilizer comprising:
a drive unit including a magnet and a coil, the magnet being disposed in a direction perpendicularly intersecting with a Z
direction of a lens group which is an optical axis direction of a camera module; and

a Hall sensor disposed to be opposed to the magnet in a direction facing the magnet,
wherein the Hall sensor detects change in magnetic force when the magnet moves in a direction intersecting with the Hall sensor,
the Hall sensor detects change in magnetic force when the magnet moves in a direction changing mutual interval between the
magnet and the Hall sensor, thus the Hall sensor can detect X direction displacement and Y direction displacement of the lens
group.

US Pat. No. 9,115,991

APPARATUS AND METHOD FOR DETECTING GYRO SENSOR SIGNAL

Samsung Electro-Mechanics...

1. An apparatus for detecting a gyro sensor signal, the apparatus comprising:
a preamplifier unit outputting sensing voltage and inverse phase sensing voltage that are in proportion to a charge amount
of a gyro sensor;

a sample and hold unit holding the sensing voltage and the inverse phase sensing voltage of the preamplifier unit for a predetermined
period at a predetermined point in time;

an averaging unit synthesizing the sensing voltage and the inverse phase sensing voltage held in the sample and hold unit
to remove offset;

a current passing unit providing a current path of output voltage of the averaging unit;
a comparing unit comparing a signal output from the averaging unit and reference voltage with each other to output a comparison
signal; and

a pulse counter unit counting the number of counting pulses up to before a state transistor of the comparison signal output
from the comparing unit is generated to generate and output a count signal.

US Pat. No. 9,093,224

ELECTRODE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME, AND ENERGY STORAGE DEVICE INCLUDING THE ELECTRODE STRUCTURE

SAMSUNG ELECTRO-MECHANICS...

1. An electrode structure, comprising:
a current collector; and
an active material layer formed on the current collector,
wherein the active material layer includes an active material having a carbon material and metal particles locally formed
on the carbon material such that a surface of the active material is partially exposed.

US Pat. No. 9,502,177

MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON

Samsung Electro-Mechanics...

1. A multilayer ceramic capacitor, comprising:
a ceramic body containing a dielectric within which is located a first plurality of internal electrodes and a second plurality
of internal electrodes, the first and second plurality of electrodes interleaved with facing each other so as to form a capacitance;

a first external electrode disposed on the one side surface of the ceramic body and electrically connected to the first plurality
of internal electrodes, and a second external electrode disposed on a second side surface of the ceramic body and electrically
connected to the second plurality of internal electrodes,

wherein 0.2?L1/L?0.96,

where L is a length in a length direction of the ceramic body, and L1 is a length of the first and second external electrodes in the length direction of the ceramic body, and

an overlapped area of the first and second internal electrodes is substantially equal to (L2×W)?(2×S2),

where L2 is a length of the first and second internal electrodes, W is a width of the ceramic body and S2 is an area of a margin part of the ceramic body in a width direction of the ceramic body corresponding to a region between
one end of each of the first and second internal electrodes and the other end thereof in the length direction.

US Pat. No. 9,258,893

MULTILAYER CERAMIC ELECTRONIC PART AND BOARD HAVING THE SAME MOUNTED THEREON

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic electronic part comprising:
a ceramic body including dielectric layers;
an active layer including a plurality of first and second internal electrodes formed to be alternately exposed to both end
surfaces of the ceramic body, having the dielectric layer therebetween, to thereby form capacitance;

upper and lower cover layers formed on upper and lower portions of the active layer; and
first and second external electrodes formed on both end portions of the ceramic body,
wherein in a cross section of the ceramic body in a length-thickness direction, the first external electrode includes a first
base electrode, a first conductive layer formed on the first base electrode at a corner portion of the ceramic body, and a
first terminal electrode formed on the first base electrode and the first conductive layer, and the second external electrode
includes a second base electrode, a second conductive layer formed on the second base electrode at a corner portion of the
ceramic body, and a second terminal electrode formed on the second base electrode and the second conductive layer, the first
and second conductive layers being positioned outside the active layer in a thickness direction of the ceramic body.

US Pat. No. 9,178,483

MULTILAYER CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

SAMSUNG ELECTRO-MECHANICS...

6. A board having a multilayer chip electronic component, comprising:
a printed circuit board having first to third electrode pads disposed thereon; and
the multilayer chip electronic component mounted on the printed circuit board,
wherein the multilayer chip electronic component includes: a ceramic body including a plurality of dielectric layers and having
first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second
end surfaces opposing each other, an inductor part disposed within the ceramic body and including first and second internal
electrodes, the first internal electrode being exposed to the first side surface and the first end surface, and the second
internal electrode being exposed to the first side surface and the second end surface, a capacitor part disposed within the
ceramic body and including third to fifth internal electrodes, the third internal electrode being exposed to the first and
second side surfaces, the fourth internal electrode being exposed to the first end surface, and the fifth internal electrode
being exposed to the second end surface, and first and second external electrodes respectively disposed on the first and second
end surfaces of the ceramic body and electrically connected to the first and second internal electrodes and the fourth and
fifth internal electrodes, a third external electrode extended from the second main surface of the ceramic body to the first
and second side surfaces and connected to the third internal electrode, and a fourth external electrode extended from the
first main surface of the ceramic body to the first and second side surfaces and connected to the first and second internal
electrodes, the capacitor part being composed of first and second capacitor parts and the inductor part and the capacitor
part being connected to each other.

US Pat. No. 9,135,947

SPINDLE MOTOR HAVING SEALING CAP WITH CURVED PART AND HARD DISK DRIVE INCLUDING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A spindle motor comprising:
a shaft fixedly installed on a base member and including an upper thrust member provided in an upper portion thereof and protruded
in an outer diameter direction;

a sleeve rotatably supported by the shaft by fluid dynamic pressure;
a hub extended from the sleeve in an outer diameter direction; and
a sealing cap mounted on the hub and extended to an upper portion of the upper thrust member in an axial direction so as to
cover a space formed between the upper thrust member and the hub in the axial direction,

wherein the upper thrust member and the sleeve or the hub include a liquid-vapor interface formed therebetween,
wherein a gap between facing surfaces of the sealing cap and the upper thrust member in the axial direction is narrow enough
to form a labyrinth seal,

wherein the sealing cap includes a curved part curved so that a gap between the sealing cap and the upper thrust member at
a portion of the sealing cap facing the upper thrust member in the axial direction alternates in size in a radial direction,
and

wherein the sealing cap includes an upwardly protruding part protruded in an upward axial direction on an outer side of an
inner edge thereof in the radial direction and a first downward protrusion part protruded in a downward axial direction on
an outer side of the upwardly protruding part in the radial direction.

US Pat. No. 9,104,280

TOUCH PANEL

Samsung Electro-Mechanics...

1. A touch panel comprising:
a transparent substrate; and
a plurality of electrode patterns that are formed on the transparent substrate so as to be formed in a mesh shape, and are
orthogonal to each other in an intersecting point,

wherein the electrode pattern is formed of a combination of at least one unit pattern having a bent straight-line shape, and
wherein the unit pattern is formed in an irregular shape where bent portions are formed.

US Pat. No. 9,510,443

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic electronic component comprising:
a ceramic body including dielectric layers; and
first and second internal electrodes having at least one of the dielectric layers interposed therebetween,
wherein each of the first internal electrodes includes a first electrode plate and a first lead connected to the first electrode
plate, the first lead being exposed to a first surface of the ceramic body and having a bent shape,

each of the second internal electrodes includes a second electrode plate and a second lead connected to the second electrode
plate, the second lead being exposed to a second surface of the ceramic body and having a bent shape,

a portion of the first lead overlaps the second electrode plate, and
a portion of the second lead overlaps the first electrode plate.

US Pat. No. 9,443,818

POWER SEMICONDUCTOR MODULE

Samsung Electro-Mechanics...

1. A power semiconductor module, comprising:
a printed circuit board (PCB);
a first heat spreader and a second heat spreader mounted on the PCB and having surfaces arranged with terminal slots;
power devices mounted on the first heat spreader and connected to one another in parallel and electrically connected to the
second heat spreader;

a first terminal provided with protrusions to be inserted into each of the terminal slots of the first heat spreader and provided
with a connection terminal for connecting to an external terminal; and

a second terminal provided with protrusions to be inserted into each of the terminal slots of the second heat spreader and
provided with a connection terminal for connecting to an external terminal,

wherein the first terminal and the second terminal are electrically connected to the first heat spreader and the second heat
spreader by the protrusions.

US Pat. No. 9,252,212

POWER SEMICONDUCTOR DEVICE

SAMSUNG ELECTRO-MECHANICS...

1. A power semiconductor device, comprising:
an active region in which a current flows through a channel formed when the device being turned on;
a termination region disposed around the active region and extending along a first direction away from the active region;
a first semiconductor region of a first conductive type disposed in the termination region and extending along the first direction;
and

a second semiconductor region of a second conductive type formed on the termination region and extending along the first direction,
the first semiconductor region and the second semiconductor region being disposed alternately along a second direction crossing
the first direction, wherein:

a product of an impurity concentration of the first semiconductor region and a width of the first semiconductor region is
equal to a product of an impurity concentration of the second semiconductor region and a width of the second semiconductor
region, and

an impurity concentration of the first semiconductor region and an impurity concentration of the second semiconductor region
gradually become lower as the first semiconductor region and the second semiconductor region become farther from the active
region.

US Pat. No. 9,236,847

COMMON MODE FILTER

SAMSUNG ELECTRO-MECHANICS...

1. A common mode filter comprising:
a magnetic substrate;
a dielectric layer laminated on the magnetic substrate;
an external electrode formed on the dielectric layer in such a way that one surface thereof is exposed to an outside;
conductive patterns formed in a single-layer structure, wherein each of the conductive patterns has one end thereof connected
with the external electrode, is protruded from one surface of the dielectric layer in such a way that the conductive patterns
are located on a same plane as the external electrode, and comprises a plurality of straight-line parts and a plurality of
connection parts formed in curved lines and connecting the plurality of straight-line parts with each other;

a magnetic layer, comprising magnetic powder and resin material and formed on the one surface of the dielectric layer and
the conductive patterns so as to fill a separate space between the straight-line parts that are adjacent to each other and
a separate space between the connection parts that are adjacent to each other; and

an insulator film interposed between the conductive patterns and the magnetic layer so as to insulate the conductive patterns
from the magnetic layer.

US Pat. No. 9,225,235

POWER FACTOR CORRECTION CIRCUIT

SAMSUNG ELECTRO-MECHANICS...

1. A power factor correction circuit comprising:
a power conversion circuit unit controlling an inductor current according to a switching signal applied to a main switch to
convert an external input voltage into an output voltage having a predetermined range;

an imbalance detection circuit outputting an imbalance state signal when the external input voltage is in an unbalanced state
by using the inductor current,

wherein when a level of the inductor current is equal to or lower than a pre-set level and an ON time of the switching signal
is equal to or longer than a pre-set duration, the imbalance detection circuit unit determines that the external input voltage
is in the unbalanced state; and

a soft start circuit unit performing soft starting by adjusting the switching signal when the imbalance state signal is output
by the imbalance detection circuit unit.

US Pat. No. 9,171,780

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Samsung Electro-Mechanics...

1. A method for manufacturing a semiconductor package, comprising:
preparing a rectangular frame of a material of a molding having a plurality of quadrangular holes;
attaching a plurality of semiconductor chips and the frame on one surface of a tape;
forming a molding part on the tape to cover the semiconductor chip and the frame;
peeling the tape;
forming a resin layer at a portion at which the tape is peeled;
forming a wiring on the resin layer to be connected to the semiconductor chip; and
singulating the semiconductor package as individual semiconductor packages by a sawing process.

US Pat. No. 9,159,125

HISTOGRAM STRETCHING APPARATUS AND METHOD

Samsung Electro-Mechanics...

1. A non-statutory computer-readable medium comprising executable instructions which cause a histogram stretching apparatus
to perform following functions of:
receiving an input image to calculate a minimum image level and a maximum image level;
generating a histogram of frequencies of image levels in a first section ranging from the minimum image level to a first image
level and a second section ranging from a second image level to the maximum image level;

comparing the frequencies of the image levels in the first section and the second section with a reference frequency to set
an extension level; and

correcting the image levels of the input image according to the extension level,
wherein a reference image level is added to the minimum image level to calculate the first image level and subtracted from
the maximum image level to calculate the second image level,

wherein each of the first section and the second section is only a portion of a total section which ranges from the minimum
image level to the maximum image level.

US Pat. No. 9,137,886

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Samsung Electro-Mechanics...

1. A printed circuit board comprising:
a solder pad having a first surface on which a solder ball is mounted;
an insulator formed on surfaces of the solder pad except the first surface and having a lower surface disposed on a same plane
as the first surface of the solder pad; and

a protrusion formed under the insulator to support the solder ball when mounting the solder ball.

US Pat. No. 9,123,472

HIGH CAPACITY MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor, comprising:
a multilayer body having a first side and a second side opposite to each other and having a third side and a fourth side connecting
the first side to the second side;

a plurality of inner electrodes formed in the multilayer body and having distal edges exposed to the first side or the second
side;

first and second side members formed on the first and second sides of the multilayer body to cover the exposed distal edges
of the inner electrodes, a maximum thickness of the first and second side members being more than 10 ?m and 30 ?m or less,
an angle (?) between a virtual line connecting the distal edges of the plurality of inner electrodes and the first side member
or the second side member being less than 90° (?/2); and

outer electrodes formed on the third side and the fourth side to be electrically connected to the inner electrodes.

US Pat. No. 9,103,682

APPARATUS FOR APPLYING MULTI-AXIAL INERTIAL FORCE

Samsung Electro-Mechanics...

1. An apparatus for applying multi-axial inertial force to an inertial sensor, the apparatus comprising:
a lower support plate connected to a driving unit to transfer rotation or vertical vibration;
a first support member fixed to stand up from the lower support plate;
a second support member positioned to be orthogonal to the first support member in a stand-up direction thereof and rotatably
coupled to the first support member; and

a third support member stacked on the second support member and coupled to the second support member so as to be rotatable
based on a rotational axis corresponding to a stacked direction,

wherein the third support member includes a device under test (DUT) seating part formed in the stacked direction, and the
inertial sensor is seated on the device under test (DUT) seating part.

US Pat. No. 9,472,608

CHIP INDUCTOR

SAMSUNG ELECTRO-MECHANICS...

1. A chip inductor, comprising:
a substrate on which a through-hole is formed;
a conductive coil that is formed on an upper surface of the substrate and laminated in a plurality of layers;
an upper resin composite magnetic layer that is filled to surround the conductive coil so that a core is formed in a center
portion of the Upper resin composite magnetic layer formed on the upper side of the substrate;

a lower resin composite magnetic layer that is formed on a bottom portion of the substrate; and
an external electrode that is formed on both sides of the upper and lower resin composite magnetic layers,
wherein an insulating layer is formed surrounding an outer peripheral surface of the conductive coil, and
wherein the conductive coil is extended in two symmetrical directions of both sides of quadrants of the substrate to thereby
be electrically connected with the external electrode.

US Pat. No. 9,462,697

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF

Samsung Electro-Mechanics...

1. An electronic component embedded substrate comprising:
a first insulating layer having a cavity;
an electronic component inserted in the cavity and having at least one external electrode;
a first metal pattern formed on one surface of the first insulating layer configured to mount the electronic component thereon
and comprising at least one guide hole exposing a portion of the external electrode;

a second insulating layer formed on the one surface of the first insulating layer covering the first metal pattern;
a first circuit pattern formed on one surface of the second insulating layer; and
a first via passing through the guide hole of the first metal pattern and electrically connecting the external electrode exposed
through the guide hole and the first circuit pattern,

wherein an opening of the guide hole is smaller than an opening of the cavity, and
wherein the opening of the guide hole is smaller than the external electrode.

US Pat. No. 9,390,862

COMPOSITE ELECTRONIC COMPONENT AND BOARD WITH THE SAME MOUNTED THEREON

SAMSUNG ELECTRO-MECHANICS...

1. A composite electronic component comprising:
a composite body having a capacitor and an inductor coupled to each other therein, the capacitor including a ceramic body
in which a plurality of dielectric layers and first and second internal electrodes facing each other with the dielectric layers
interposed therebetween are stacked, and the inductor including a magnetic body including a coil part;

an input terminal disposed on a first end surface of the composite body and connected to the coil part of the inductor;
output terminals including a first output terminal disposed on a second end surface of the composite body and connected to
the coil part of the inductor and a second output terminal disposed on a lower surface of the capacitor of the composite body
and connected to a lead portion of the first internal electrode of the capacitor; and

a ground terminal disposed on the lower surface of the capacitor of the composite body and connected to a lead portion of
the second internal electrode of the capacitor,

wherein the capacitor is coupled to a side surface of the inductor, and the first and second internal electrodes are disposed
to be perpendicular with respect to a mounting surface of the composite body.

US Pat. No. 9,263,180

COIL COMPONENT AND BOARD HAVING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A coil component comprising:
a magnetic body; and
first and eighth external electrodes disposed on one surface of the magnetic body, second and third external electrodes and
sixth and seventh external electrodes that are disposed on two surfaces adjacent to the one surface of the magnetic body,
respectively, and fourth and fifth external electrodes disposed on the other surface opposing the one surface of the magnetic
body,

wherein the magnetic body includes upper and lower substrates and first to fourth coil parts disposed between the upper and
lower substrates and enclosed by an insulation film, the first to fourth coil parts having coupled coils wound in parallel
on the same plane, respectively, so that magnetic fluxes in the coupled coils are formed in directions opposite to each other,
the coupled coils being composed of first to eighth coils, and the first to eighth coils being connected to the first to eighth
external electrodes, respectively.

US Pat. No. 9,264,061

APPARATUS AND METHOD FOR GENERATING SINUSOIDAL WAVES, AND SYSTEM FOR DRIVING PIEZOELECTRIC ACTUATOR USING THE SAME

Samsung Electro-Mechanics...

14. A method for generating sinusoidal waves,
comprising:
receiving a target frequency;
loading at least some of a plurality of sampling points included in a look-up table by using an integer ratio calculated based
on the target frequency and a predetermined base frequency;

correcting a digital value of at least one sampling point among the loaded sampling points with a digital value of a sampling
point having a maximum value among the plurality of sampling points included in the look-up table; and

generating sinusoidal waves according to the changed sampling points.

US Pat. No. 9,165,715

MULTILAYER CERAMIC CAPACITOR WITH ELECTRODES HAVING LEAD-OUT PARTS AND METHOD OF MANUFACTURING THE SAME

SAMSUNG ELECTRO-MECHANICS...

1. A multilayer ceramic capacitor comprising:
a ceramic body in which a plurality of dielectric layers are stacked;
a plurality of first and second internal electrodes alternately formed on the plurality of dielectric layers and including
first and second lead-out parts having an overlap area exposed to one surface of the ceramic body, respectively;

first and second external electrodes formed on one surface of the ceramic body and electrically connected to the first and
second lead-out parts, respectively; and

a first insulating layer formed on one surface of the ceramic body to cover exposed portions of the first and second lead-out
parts,

wherein the first and second lead-out parts are formed to have concave-convex portions only alternating with each other in
the overlap area,

a length of a main part of the first internal electrodes is greater than a sum of a length of the concave-convex portion of
the first lead-out part and a length of the rest of the first lead-out part not formed to have a concave-convex portion, and

a length of a main part of the second internal electrodes is greater than a sum of a width of the concave-convex portion of
the second lead-out part and a length of the rest of the second lead-out part not formed to have a concave-convex portion.

US Pat. No. 9,093,888

LINEAR VIBRATOR

SAMSUNG ELECTRO-MECHANICS...

1. A linear vibrator comprising:
a fixing unit having a magnet in an inner space, the magnet generating magnetic force;
a vibration unit including a coil disposed to face the magnet and generating electromagnetic force by interaction with the
magnet, and a holder on a lower surface of a mass body in an axial direction;

a damper having a ring shape and having an inner circumference which is greater than an outer circumference of the magnet;
an elastic member coupled with the holder and the fixing unit and providing elastic force to the vibration unit; and
an upper surface of the elastic member in the axial direction is coupled with a lower surface of the holder in the axial direction
by welding.

US Pat. No. 9,230,955

INTEGRATED CIRCUIT AND WIRELESS COMMUNICATION APPARATUS

Samsung Electro-Mechanics...

1. An integrated circuit, comprising:
b sub-circuits (b is an integer equal to or greater than 1) that are connected in series between a first terminal and a second
terminal and have capacitance 2b-1 times larger than predetermined unit capacitance,

wherein the b-th sub-circuit includes 2b-1 configurations, which are connected in parallel, each including at least two capacitors connected in series and at least two
stacked switch elements,

at least the two stacked switch elements are operated to all switched for each sub-circuit, and
at least one switch element of at least the two stacked switch elements is provided between at least the two capacitors.