US Pat. No. 9,894,791

IMPLEMENTATION METHOD FOR STACKED CONNECTION BETWEEN ISOLATED CIRCUIT COMPONENTS AND THE CIRCUIT THEREOF

SHENZHEN XILONG TOY COMPA...

1. An implementation method for stacked connection between a plurality of isolated circuit components, each of the plurality
of isolated circuit components including at least an insulating surface and a pin, comprising:
directly connecting a first pin of a first isolated circuit component with a first pin of a second isolated circuit component;
directly connecting a second pin of the first isolated circuit component with a first pin of a third isolated circuit component;
directly connecting an insulating surface of the second isolated circuit component with an insulating surface of the third
isolated circuit component; and

making the plurality of isolated circuit components form an integrated module in accordance with a desired connection configuration
of a circuit, and saving circuit boards and wires.

US Pat. No. 10,455,717

IMPLEMENTATION METHOD FOR STACKED CONNECTION BETWEEN ISOLATED CIRCUIT COMPONENTS AND THE CIRCUIT THEREOF

SHENZHEN XILONG TOY COMPA...

1. An implementation module for stacked connection between isolated circuit components, whose setting is according to circuit components connecting in parallel/ series in a circuit, wherein, in accordance with a connection configuration of the circuit, a plurality of corresponding pins of the circuit components are welded directly, making the circuit components form an integrated module in accordance with a desired connection method of the circuit, and saving a plurality of circuit boards and connection wires; the circuit component is designed in a parallelepiped, and a plurality of bonding pads are arranged on part of an area on a surface of the parallelepiped;wherein the parallelepiped has a ratio in length, width and height of 3:2:1 or 3:1:1.

US Pat. No. 11,116,100

IMPLEMENTATION MODULE FOR STACKED CONNECTION BETWEEN ISOLATED CIRCUIT COMPONENTS AND THE CIRCUIT THEREOF

SHENZHEN XILONG TOY COMPA...


1. A modularized circuit for isolated circuit, whereinthe isolated circuit includes at least two circuit components connecting in parallel and/or series;
the circuit components, in accordance with a connection configuration of a circuit, weld a plurality of corresponding pins of the circuit components directly, making the circuit components form an integrated module in accordance with a connection method of the circuit, and saving circuit boards and wires;
the circuit components are designed in a parallelepiped, and a plurality of bonding pads are arranged on part of an area on a surface of the parallelepiped; and
the circuit components further comprise a triode, and three different bonding pad areas including a base electrode area, a collector area and an emitter area are designed on the triode.