US Pat. No. 9,913,378

ELECTRONIC SUB-ASSEMBLY, A METHOD FOR MANUFACTURING THE SAME, AND A PRINTED CIRCUIT BOARD WITH ELECTRONIC SUB-ASSEMBLY

SCHWEIZER ELECTRONIC AG, ...

1. An electronic sub-assembly comprising:
a carrier layer of electrically conductive material, the carrier layer having at least one electronic component mounted on
at least one mounting area and at least one compensation layer being provided adjacent to the at least one mounting area on
the carrier layer, on which the at least one compensation layer an electrically insulating, thermally conductive layer and
at least one electrically conductive layer are provided;

the carrier layer has, at least in one section beneath the at least one mounting area, a coefficient of thermal expansion
adjusted to that of the at least one electronic component; and

the at least one electronic component is encapsulated.

US Pat. No. 9,456,500

CONDUCTOR STRUCTURE ELEMENT AND METHOD FOR PRODUCING A CONDUCTOR STRUCTURE ELEMENT

SCHWEIZER ELECTRONIC AG, ...

1. A method for producing a conductor structure element, comprising:
providing a rigid carrier;
electrodepositing a copper coating on the rigid carrier;
applying a conductive pattern structure on the copper coating;
populating the conductive pattern structure with components;
laminating the carrier with at least one electrically insulating layer;
removing the rigid carrier by dissolving or etching the rigid carrier; and
at least partially removing the copper coating to expose the conductive pattern structure.

US Pat. No. 9,232,647

PRINTED CIRCUIT BOARD WITH CAVITY

SCHWEIZER ELECTRONIC AG, ...

1. A printed circuit board multilayer construction, comprising:
a layer stack of several electrically insulating and/or conductive layers arranged one above the other; and
a cavity in an interior of the layer stack, wherein the cavity extends laterally only into a partial region of an areal extent
of the layer stack, and through an opening provided in the layer stack, is exposed to a pressure surrounding the printed circuit
board multilayer construction;

wherein the cavity is sealed relative to ingress of liquid with an aid of at least one liquid-impermeable membrane that is
laminated in between layers of the layer stack;

wherein the at least one liquid-impermeable membrane is inserted in the layer stack and extends only partially over the areal
extent of the insulating layers.

US Pat. No. 9,848,499

METHOD FOR PRODUCING A CIRCUIT BOARD AND CIRCUIT BOARD

SCHWEIZER ELECTRONIC AG, ...

1. A method of producing a printed circuit board with a plurality of inlays, having the following steps:
supplying a plurality of inlays, of which at least one inlay has at least one positioning element;
building up a layer sequence from a plurality of printed-circuit-board layers, with at least one recess for accommodating
inlays, wherein, prior to the step of the plurality of inlays being inserted, the recess is defined in an uppermost layer
by a frame made of non-conductive printed-circuit-board material;

inserting the plurality of inlays into the recess defined by the frame;
covering the inlays with a non-conductive printed-circuit-board material;
laminating the layer sequence; and
removing at least the positioning elements which establish a conductive contact between neighboring inlays.

US Pat. No. 10,121,737

PRINTED CIRCUIT BOARD ELEMENT AND METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD ELEMENT

SCHWEIZER ELECTRONIC AG, ...

1. A printed circuit board element comprising:a first semiconductor component which is arranged on an upper side of an electrically conductive intermediate plate such that a connector pad of the first semiconductor component has a whole-area electrical contact with the intermediate plate;
a second semiconductor component which is arranged on a lower side of the intermediate plate;
the second semiconductor component comprises a first connector pad and a second connector pad;
the first and second connector pads are aligned in a direction of the intermediate plate; and
the first connector pad is contacted with the intermediate plate, the second connector pad is not contacted with the intermediate plate, and the intermediate plate forms a phase tap of the printed circuit board element.

US Pat. No. 10,154,593

ELECTRONIC ASSEMBLY GROUP AND METHOD FOR PRODUCING THE SAME

SCHWEIZER ELECTRONIC AG, ...

1. Electronic assembly, comprising:a printed circuit board structure, which comprises a multilayer structure that has an electrically conductive carrier layer with a semiconductor component and a further electrically conductive layer connected to the semiconductor component;
a passive component, which is connected to the electrically conductive carrier layer and the further electrically conductive layer;
the electrically conductive carrier layer and the further electrically conductive layer respectively having one portion that extends beyond a core region of the multilayer structure with connection regions formed on it;
layer portions that protrude beyond the core region and are not required as connection regions are at least partially removed and prepreg layer portions that protrude beyond the core region are at least partially removed; and
the passive component making contact directly at the connection regions.

US Pat. No. 10,212,802

ELECTRONIC DEVICE AND METHOD FOR PRODUCING AN ELECTRONIC DEVICE

Schweizer Electronic AG, ...

1. An electronic device comprising:a multilayer printed circuit board;
an electronic component arranged on a first surface of the multilayer printed circuit board;
the multilayer printed circuit board has a cutout extending from a second surface of the multilayer printed circuit board in a direction toward the electronic component on the first surface to provide a reduced thickness of the multilayer printed circuit below the electronic component, the second surface being situated opposite the first surface; and
a coolant container including an opening closed by the second surface of the multilayer printed circuit board.

US Pat. No. 10,229,895

ELECTRONIC SUB-ASSEMBLY AND METHOD FOR THE PRODUCTION OF AN ELECTRONIC SUB-ASSEMBLY

SCHWEIZER ELECTRONIC AG, ...

1. A method for producing an electronic sub-assembly with the following steps:providing an electrically conductive starting substrate;
placing at least one first layer made of electrically insulating material;
mounting of at least one component on the at least one first layer of electrically insulating material;
laying on the at least one first layer of electrically insulating material a first electrically conductive layer having at least one recess, the at least one recess being designed in its arrangement and dimensions to match the at least one component so that the at least one component is disposed in the at least one recess;
applying at least a second layer made of electrically insulating material, and at least a second electrically conductive layer;
pressing together the electrically conductive starting substrate, the at least one first layer made of electrically insulating material, the first electrically conductive layer, the at least a second layer made of electrically insulating material and the at least a second electrically conductive layer; and
wherein the step of mounting of the at least one component is followed by the step of laying the first electrically conductive layer, wherein the at least one component has an elevated temperature at the moment of mounting to liquefy the at least one first layer of electrically insulating material below the at least one component.

US Pat. No. 10,462,905

PRINTED CIRCUIT BOARD ELEMENT WITH INTEGRATED ELECTRONIC SWITCHING ELEMENT, POWER CONVERTER AND METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD ELEMENT

SCHWEIZER ELECTRONIC AG, ...

1. A printed circuit board element comprising:at least one electronic switching element integrated in the printed circuit board element;
the at least one electronic switching element comprises two semiconductor switches formed in a layer sequence of the printed circuit board element;
at least two busbars formed to contact the semiconductor switches, the busbars are arranged substantially one above the other in a layer sequence of the printed circuit board element; and
at least one intermediate circuit capacitor arranged between the at least two busbars is formed in the layer sequence of the printed circuit board element.

US Pat. No. 10,424,536

ELECTRONIC COMPONENT HAVING A LEAD FRAME CONSISTING OF AN ELECTRICALLY CONDUCTIVE MATERIAL

SCHWEIZER ELECTRONIC AG, ...

1. An electronic component, comprising:a first lead frame consisting of an electrically conductive material;
the first lead frame carries a first semiconductor component, and with a shunt element arranged in a plane of the first lead frame;
the shunt element comprises a resistor body arranged between a first terminal contact and a second terminal contact;
an electrically conducting connection extends from a terminal of the first semiconductor component through the first lead frame to the first terminal contact of the shunt element; and
the first terminal contact, the second terminal contact and the resistor body of the shunt element are arranged next to each other with respect to the plane of the first lead frame.