US Pat. No. 10,433,414

MANUFACTURING METHOD OF PRINTING CIRCUIT BOARD WITH MICRO-RADIATORS

Rayben Technologies (HK) ...

1. An object comprising a printed circuit board having a top surface and a bottom surface, the printed circuit board comprising:a radiator having an electrically insulated core and first electrically conductive layers formed on the top and bottom surfaces of the electrically insulated core;
a substrate having second electrically conductive layers formed on the top and bottom surfaces thereof, the second electrically conductive layer being separated from the first electrically conductive layer, wherein the first electrically conductive layer formed on the top surface of the electrically insulated core includes at least two portions separated from one another, and wherein the second electrically conductive layer formed on the top surface of the substrate includes at least two portions separated from one another;
a plurality of electrode bonding pads on the top surface of the printed circuit board; wherein the electrode bonding pads comprises:
one third electrically conductive layer directly contacting a surface of one portion of the second electrically conductive layer on the top surface of the substrate and extending from the contacted surface of the one portion of the second electrically conductive layer to a surface of one portion of the first electrically conductive layer on the top surface of the electrically insulated core; and
another separate third electrically conductive layer directly contacting a surface of another portion of the second electrically conductive layer on the top surface of the substrate and extending from the contacted surface of the other portion of the second electrically conductive layer to a surface of another portion of the first electrically conductive layer on the top surface of the electrically insulated core; and
a fourth electrically conductive layer on the bottom surface of the printed circuit board, wherein the fourth electrically conductive layer extends from a surface of the second electrically conductive layer on the bottom surface of the substrate to a surface of the first electrically conductive layer on the bottom surface of the electrically insulated core.