US Pat. No. 9,587,318

METHOD FOR CONTINUOUSLY PRODUCING FLEXIBLE COPPER CLAD LAMINATES

RICHVIEW ELECTRONICS CO.,...

1. A process for a continuous production of flexible copper-clad laminate, comprising the sequent steps of:
conducting a continuous ion implantation to a surface of an organic macromolecular polymer film;
conducting a plasma deposition on the ion implanted surface of the organic macromolecular polymer film; and
continuously electrocoppering the plasma deposited surface of the organic macromolecular polymer film,
wherein the continuous ion implantation and the plasma deposition use an ion source, wherein the ion source is a magnetic
filter vacuum arc ion source, the ion source is configured to provide metal ions;

wherein during the ion implantation, the metal ions are injected inside the organic macromolecular polymer film to a depth
of 1.0-10 nm, a running speed of the organic macromolecular polymer film of 0.3-2 m/minute, a voltage of 1-10 KV is used for
accelerating the metal ions, and a dosage of the metal ions is 0.5×1013-1.0×1017 atom/cm2; and

wherein during the plasma deposition, a plasma deposition voltage of 100-500 V is applied between the ion source and the organic
macromolecular polymer film, and a flow rate of the metal ions is 20-80 milliampere.

US Pat. No. 10,321,581

SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACTURING METHODS THEREFOR

RICHVIEW ELECTRONICS CO.,...

1. A method for manufacturing single-layer circuit board, the method comprising:drilling a hole on a substrate, the hole comprises a blind hole and/or a through hole;
on a surface of said substrate, forming a photoresist layer having a circuit negative image;
forming a conductive seed layer on the surface of said substrate and a hole wall of said hole; and
removing said photoresist layer, to form a circuit pattern on the surface of said substrate,
wherein forming a conductive seed layer comprises, implanting a conductive material below the surface of said substrate and below the hole wall of said hole via ion implantation, to form an ion implantation layer as at least part of said conductive seed layer.

US Pat. No. 10,757,821

SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACTURING METHODS THEREFOR

RICHVIEW ELECTRONICS CO.,...

1. A Method for manufacturing multi-layer circuit board, comprising:implementing laying-up plate and lamination in the order of metal foil, middle sticking layer, single-layer circuit board, middle sticking layer, single-layer circuit board, middle sticking layer, metal foil;
drilling a hole on the multi-layer plate after lamination, the hole comprises through hole and/or blind hole;
forming a conductive seed layer on a hole wall of said hole; and
removing part of said metal foil, to form circuit pattern,
wherein forming a conductive seed layer comprises implanting a conductive material below the hole wall of said hole via ion implantation, to form ion implantation layer as at least part of said conductive seed layer.

US Pat. No. 10,757,820

SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACTURING METHODS THEREFOR

RICHVIEW ELECTRONICS CO.,...

1. A single-layer circuit board, comprising substrate and circuit pattern layer formed on partial surface of said substrate, said substrate is provided with a hole, the hole comprises blind hole and/or through hole, the hole wall of said hole is formed with conductive seed layer, said circuit pattern layer comprises conductive seed layer formed to partial surface of said substrate, wherein said conductive seed layer comprises ion implantation layer implanted below partial surface of said substrate and below the hole wall of said hole.

US Pat. No. 11,032,915

SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACTURING METHODS THEREFOR

RICHVIEW ELECTRONICS CO.,...

1. A method for manufacturing multi-layer circuit board, comprising:implementing a multi-layer laying-up plate and lamination in an order of surface sticking layer, single-layer circuit board, middle sticking layer, single-layer circuit board, middle sticking layer, single-layer circuit board, surface sticking layer;
drilling a hole on the multi-layer plate after lamination, the hole comprises through hole and/or blind hole;
forming a conductive seed layer to an outer surface of said surface sticking layer and a hole wall of said hole; and
forming circuit pattern on the outer surface of said surface sticking layer,
wherein forming a conductive seed layer comprises implanting a conductive material below the outer surface of said surface sticking layer below and hole wall of said hole via ion implantation, to form ion implantation layer as at least part of said conductive seed layer.