1. A Method for manufacturing multi-layer circuit board, comprising:implementing laying-up plate and lamination in the order of metal foil, middle sticking layer, single-layer circuit board, middle sticking layer, single-layer circuit board, middle sticking layer, metal foil;
drilling a hole on the multi-layer plate after lamination, the hole comprises through hole and/or blind hole;
forming a conductive seed layer on a hole wall of said hole; and
removing part of said metal foil, to form circuit pattern,
wherein forming a conductive seed layer comprises implanting a conductive material below the hole wall of said hole via ion implantation, to form ion implantation layer as at least part of said conductive seed layer.