1. A method for producing a printed circuit board, comprising the steps of:
forming a slot in a substrate having at least three layers with the slot extending through at least two of the layers, the
slot having a length and a width with the length being greater than the width, the slot having a first end and a second end,
the first end and the second end having a semi-circular shape, the slot being formed by laterally translating a router bit;
coating a sidewall of the substrate surrounding the slot with a conductive layer; and
separating the conductive layer into at least two segments that are electrically isolated along the side wall of the substrate.