US Pat. No. 9,888,600

SUBSTRATE-FREE INTERCONNECTED ELECTRONIC MECHANICAL STRUCTURAL SYSTEMS

NUVOTRONICS, INC, Radfor...

9. A substrate-free, interconnected electronic mechanical structural system, comprising:
a first substrate-free, electronic subsystem including an electronic component therein, the subsystem having a slot extending
along a longitudinal axis of the subsystem; and

a second substrate-free, electronic subsystem including an electronic component therein, the second subsystem having a complementary
mating slot extending along a longitudinal axis of the second subsystem, wherein the complementary mating slot of the second
subsystem is disposed within the slot of the first subsystem to effect mechanical alignment and joining of the first and second
subsystems, comprising a generally planar base subsystem having electronic component therein, the base mechanically connected
to the first and second subsystems at respective ends thereof.

US Pat. No. 9,088,074

HOLLOW CORE COAXIAL CABLES AND METHODS OF MAKING THE SAME

NUVOTRONICS, LLC, Radfor...

1. A hollow core coaxial cable, comprising:
a. a glass capillary having an inside wall and an outside wall providing a hollow core extending along a central axis thereof;
b. an inner conductive layer disposed on the inside wall of the capillary; and
c. an outer conductive layer disposed on the outside wall of the capillary.

US Pat. No. 9,136,575

THREE-DIMENSIONAL MICROSTRUCTURES

NUVOTRONICS, LLC, Radfor...

1. An apparatus comprising:
a) a first power combiner/divider network configured to split a first electromagnetic signal into a plurality of split electromagnetic
signals, at least two of said split electromagnetic signals each connectable to at least one input of a plurality of signal
processors;

b) a second power combiner/divider network configured to combine at least two of a plurality of processed electromagnetic
signals into a second electromagnetic signal, at least two of said plurality of processed electromagnetic signals each connectable
to at least one output of said plurality of signal processors; and

c) wherein at least a portion of at least one of said first power combiner/divider network and said second power combiner/divider
network includes a three-dimensional coaxial microstructure,

wherein at least one of said first power combiner/divider network and said second power combiner/divider network includes
a Gysel combiner/divider.

US Pat. No. 10,076,042

DEVICES AND METHODS FOR SOLDER FLOW CONTROL IN THREE-DIMENSIONAL MICROSTRUCTURES

NUVOTRONICS, INC, Radfor...

1. An electronic microstructure, comprising:a plurality of layers of a metal and one or more layers of a material that is non-wetting to one or more of a metallic solder and a conductive epoxy;
a mounting surface disposed at and including a selected one of the plurality of layers of metal;
a wick stop structure formed of one or more of the plurality of layers of the non-wetting material, disposed away from the mounting surface and within the microstructure, the wick stop structure configured to deter a flow of one or more of the metallic solder and the conductive epoxy from the mounting surface to a location on the microstructure beyond the location of the wick stop structure.

US Pat. No. 9,306,255

MICROSTRUCTURE INCLUDING MICROSTRUCTURAL WAVEGUIDE ELEMENTS AND/OR IC CHIPS THAT ARE MECHANICALLY INTERCONNECTED TO EACH OTHER

NUVOTRONICS, INC., Radfo...

1. A three-dimensional microstructure, comprising:
a first microstructural coaxial waveguide element comprising one or more layers of material, the first microstructural waveguide
element comprising an outer conductor, a center conductor, and a plurality of non-conductive supports configured to support
the center conductor within the outer conductor and comprising a mating end at which the center conductor extends beyond the
length of the outer conductor, wherein one or more of the outer conductor, center conductor, and non-conductive supports comprises
a plurality of the layers of material; and

a second microstructural coaxial waveguide element comprising one or more layers of material, the second microstructural coaxial
waveguide element comprising an outer conductor, a center conductor and comprising a mating end complementary to the mating
end of the first microstructural coaxial waveguide element and configured to receive the mating end of the first microstructural
coaxial waveguide element and configured to electrically couple the respective center conductors of the first and second microstructural
coaxial waveguide elements and configured to electrically couple the respective outer conductors of the first and second microstructural
coaxial waveguide elements, wherein one or more of the outer conductor, center conductor, and non-conductive supports of the
second microstructural coaxial waveguide element comprises a plurality of the layers of material.

US Pat. No. 9,608,303

MULTI-LAYER DIGITAL ELLIPTIC FILTER AND METHOD

Nuvotronics, Inc., Radfo...

1. A digital elliptic filter, comprising:
a plurality of conductive walls defining an enclosure disposed therein;
a first conductive post disposed within the enclosure and having an end thereof electrically connected to a selected one of
the plurality conductive walls, the post having a longitudinally extending stub cavity disposed therein; and

a second conductive post disposed within the enclosure with an end thereof electrically connected to the selected conductive
wall, the second conductive post having a conductive stub extending along a longitudinal axis of the second conductive post
and disposed within the stub cavity,

wherein the first and second conductive posts, conductive stub, and the plurality of conductive walls each comprise a plurality
of layers of a conductive material, and are configured to have inductive and capacitive properties to provide a digital elliptic
filter.

US Pat. No. 9,337,152

FORMULATION FOR PACKAGING AN ELECTRONIC DEVICE AND ASSEMBLIES MADE THEREFROM

Nuvotronics, Inc, Radfor...

1. A microwave assembly comprising:
a. a microwave circuit comprising at least one microwave transmission line; and
b. a dielectric layer disposed over the microwave circuit, the dielectric layer comprising one or more cured matrix precursors
and hollow glass bubbles, the hollow glass bubbles present in an amount sufficient to form a matrix having a dielectric constant
less than about 2.0, and having a polydisperse population of glass microbubbles, wherein a first population has at least 10%
(vol/vol) of the hollow glass bubbles having an outer dimension less than or equal to about 15 micrometers and wherein a second
population of the hollow glass bubbles has an outer dimension that is equal to about 60 micrometers.

US Pat. No. 9,325,044

MULTI-LAYER DIGITAL ELLIPTIC FILTER AND METHOD

Nuvotronics, Inc., Radfo...

1. A multi-layer digital elliptic filter, comprising a conductive enclosure, the enclosure having conductive walls defining
a cavity therein, first and second conductive posts disposed within the cavity of the conductive enclosure, the conductive
posts each having a respective first end connected to a selected conductive wall of the conductive enclosure, the second conductive
post having a post cavity disposed therein, a conductive stub disposed within the post cavity and electrically connected to
the first conductive post, wherein the first and second conductive posts, the conductive stub, and the conductive enclosure
are configured to have inductive and capacitive properties to provide a digital elliptic filter.

US Pat. No. 9,312,589

COAXIAL WAVEGUIDE MICROSTRUCTURE HAVING CENTER AND OUTER CONDUCTORS CONFIGURED IN A RECTANGULAR CROSS-SECTION

NUVOTRONICS, INC., Radfo...

1. A coaxial waveguide microstructure, comprising:
at least one coaxial waveguide, comprising:
a center conductor;
an outer conductor comprising one or more walls, spaced apart from and disposed around the center conductor;
one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed
within the outer conductor; and

a core volume between the center conductor and the outer conductor,
wherein the core volume is under vacuum or in a gas state and wherein the center conductor and the outer conductor of the
at least one coaxial waveguide each having a generally rectangular cross-sectional structure.

US Pat. No. 9,505,613

DEVICES AND METHODS FOR SOLDER FLOW CONTROL IN THREE-DIMENSIONAL MICROSTRUCTURES

NUVOTRONICS, INC., Radfo...

1. A method of forming an electronic microstructure comprising:
depositing a plurality of layers over a substrate, wherein the layers comprise one or more of a metal material, a sacrificial
photoresist material, and a dielectric material, thereby forming an electronic microstructure above the substrate, the microstructure
comprising:

a mounting surface having at least a portion thereof configured to bond to one or more of a metallic solder and a conductive
epoxy; and

a wick stop structure disposed away from the mounting surface and formed within the microstructure proximate the mounting
surface, the wick stop structure configured to deter the flow of one or more of the metallic solder and the conductive epoxy
from the mounting surface to a location on the microstructure beyond the location of the wick stop structure.

US Pat. No. 9,410,799

DEVICE PACKAGE AND METHODS FOR THE FABRICATION AND TESTING THEREOF

Nuvotronics, Inc., Radfo...

1. A wafer or grid level optoelectronic device package, comprising:
a base wafer or base grid comprising a plastic or slip-cast ceramic, the base wafer or base grid having a plurality of base
die each comprising an optoelectronic device mounting region and a lid mounting region;

an optoelectronic device mounted on each of the optoelectronic device mounting regions; and
a lid wafer or lid grid attached to the base wafer or base grid, the lid wafer or lid grid comprising a plurality of lid die,
each lid die being mounted on a respective said lid mounting region to form an enclosed volume between the base die and lid
die, wherein a respective optoelectronic device is in the enclosed volume, and wherein each lid die has an optically transmissive
region suitable for transmitting light of a given wavelength along an optical axis to or from the optoelectronic device.

US Pat. No. 9,413,052

THREE-DIMENSIONAL MICROSTRUCTURES

Nuvotronics, Inc., Radfo...

1. An apparatus comprising:
a) a first power combiner/divider network having an input and a plurality of output legs electrically connected thereto and
configured to split a first electromagnetic signal at the input into a plurality of split electromagnetic signals in the plurality
of legs, at least two of the legs connectable to a respective input of a signal processor;

b) a second power combiner/divider network having an output and a plurality of input legs electrically connected thereto and
configured to combine at least two of a plurality of processed electromagnetic signals present at the input legs into a second
electromagnetic signal at the output, at least two of the input legs connectable to a respective output of the signal processor;

c) wherein at least a portion of at least one of the first power combiner/divider network and the second power combiner/divider
network includes a three-dimensional coaxial microstructure, and wherein at least one of the first power combiner/divider
network and the second power combiner/divider network includes a Wilkinson combiner/divider; and

d) at least one variable phase adjuster having a phase that can be adjusted, the variable phase adjuster electrically connected
between the first power combiner/divider network and the second power combiner/divider network.

US Pat. No. 9,065,163

HIGH FREQUENCY POWER COMBINER/DIVIDER

NUVOTRONICS, LLC, Radfor...

1. A waveguide power combiner/divider for operation at a selected wavelength, comprising:
a plurality of hollow waveguides having a hollow core configured to support at least one radiation mode therein, the waveguides
having first and second ends with the second ends in communication with one another to permit communication of radiation modes
therebetween;

a plurality of transmission line waveguides having a center conductor transmission line disposed therein, each of the transmission
line waveguides having an electromagnetic end launcher operably connected to respective first ends of the hollow waveguides,
each electromagnetic end launcher having an elongated center conductor end portion that extends into the hollow core of the
hollow waveguide; and

a plurality of ground posts each disposed at a respective end launcher in electrical communication with the center conductor
and a wall of the hollow waveguide, respectively, to ground the end launcher to the hollow waveguide wall.

US Pat. No. 9,647,420

PACKAGE AND METHODS FOR THE FABRICATION AND TESTING THEREOF

Nuvotronics, Inc., Radfo...

1. A sealed via structure, comprising:
a semiconductor substrate having a first surface and a second surface opposite the first surface;
a etch stop layer on the first surface of the substrate;
a via hole through the substrate from the second surface to the etch stop layer, the via hole having a first perimeter in
the first surface;

an aperture in the etch stop layer, wherein the aperture has a second perimeter within the first perimeter; and
a metallization structure sealing the via structure.

US Pat. No. 9,666,947

DIELECTRIC-FREE METAL-ONLY DIPOLE-COUPLED BROADBAND RADIATING ARRAY APERTURE WITH WIDE FIELD OF VIEW

NUVOTRONICS, INC, Radfor...

1. A dipole-coupled broadband radiator structure, comprising:
a ground surface having first and second openings disposed therethrough; and
adjacent first and second dipole antennas each comprising two loops with each loop disposed in a respective plane perpendicular
to the ground plane, a selected one of the loops of each of the antennas having a first end shorted to the ground surface
and a second end disposed in a respective one of the first and second openings, with the respective planes of a selected loop
of each of the first and second antennas disposed perpendicular to one another.

US Pat. No. 9,570,787

HOLLOW CORE COAXIAL CABLES AND METHODS OF MAKING THE SAME

Nuvotronics, Inc., Radfo...

1. A hollow core coaxial cable, comprising:
a. a dielectric capillary having an inside wall and an outside wall providing a hollow core extending along a central axis
thereof, the capillary having an inner dimension of 700 ?m or less and an outer dimension of 850 ?m or less;

b. an inner conductive layer disposed on the inside wall of the capillary; and
c. an outer conductive layer disposed on the outside wall of the capillary, the dielectric capillary, inner conductive layer,
and outer conductive layer disposed coaxial to one another;

whereby the materials and dimensions of the dielectric capillary, inner conductive layer, and outer conductive layer cooperate
to provide a flexible, hollow core, coaxial cable.

US Pat. No. 10,002,818

INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF

Nuvotronics, Inc., Radfo...

1. A microstructure for integration with an electronic component to provide thermal dissipation, the microstructure comprising:a substrate;
a waveguide section having an outer conductor and a center conductor disposed within the outer conductor, the waveguide section having a core volume disposed between the center conductor and outer conductor;
a transition structure thermally connected between the substrate and the center conductor to dissipate heat therefrom, the transition structure comprising a thermally conductive material and an electrically isolative material; and
an electronic device coupled to the transition structure.

US Pat. No. 9,306,254

SUBSTRATE-FREE MECHANICAL INTERCONNECTION OF ELECTRONIC SUB-SYSTEMS USING A SPRING CONFIGURATION

NUVOTRONICS, INC., Radfo...

1. A substrate-free, interconnected electronic mechanical structural system, comprising first and second substrate-free, electronic
subsystems each including electronic components therein, each subsystem having respective mechanical connection features,
the connection features structured to cooperate with one another to mechanically interconnect the first and second substrate-free,
electronic subsystems, wherein the connection features of the first substrate-free, electronic subsystem comprise a spring
configured to orient and retain the second-substrate-free, electronic subsystem in position relative to the first substrate-free,
electronic subsystem.

US Pat. No. 9,660,614

STACKED, SWITCHED FILTER BANKS

NUVOTRONICS, INC., Radfo...

1. A stacked, switched filter bank, comprising:
a first filter board having opposing upper and lower surfaces and having a filter disposed therein, the filter having an input
coaxial transmission line and an output coaxial transmission line, the input and output transmission lines each having a respective
portion perpendicular to, and terminating at, the lower surface; and

a second filter board having top surface disposed proximate the lower surface of the first filter board, the second filter
board having a filter disposed therein and additionally having two pass-through coaxial transmission lines each of which is
disposed in electrical communication with a respective one of the input and output coaxial transmission lines of the first
filter board.

US Pat. No. 9,490,517

HIGH FREQUENCY POWER COMBINER/DIVIDER

Nuvotronics, Inc., Radfo...

1. A waveguide power combiner/divider for operation at a selected wavelength, comprising:
a plurality of hollow waveguides each having a hollow core surrounded by a waveguide wall configured to support at least one
radiation mode therein;

an output port in communication the plurality of hollow waveguides to permit communication of radiation modes between the
port and the hollow waveguides; and

a plurality of transmission line waveguides having a center conductor transmission line disposed therein, each of the transmission
line waveguides having an electromagnetic end launcher operably extending into respective first ends of the plurality of hollow
waveguides, each launcher having a terminus suspended within the hollow core out of contact with the waveguide wall.

US Pat. No. 9,843,084

THREE-DIMENSIONAL MICROSTRUCTURES

NUVOTRONICS, INC, Radfor...

1. An n-way signal processor, comprising:
at least one three-dimensional coaxial microstructure divider having an input and a plurality of output legs operably connected
thereto, the divider configured to split an electromagnetic signal received at the input into the output legs, the output
legs each having a center conductor disposed within and surrounded by an outer conductor;

a plurality of signal processors each having an input for receiving an electromagnetic signal and an output for supplying
an modified form of the electromagnetic signal, each input of a respective one of the signal processors operably connected
to a respective output leg of the three-dimensional coaxial microstructure divider;

at least one three-dimensional coaxial microstructure combiner having a plurality of input legs each operably connected to
an output of a respective one of the plurality of signal processors, the combiner configured to combine the electromagnetic
signals received at the input legs at an output of the combiner, the input legs each having a center conductor disposed within
and surrounded by an outer conductor; and

a common waveguide and wherein the at least one three-dimensional coaxial microstructure combiner comprises a plurality of
three-dimensional coaxial microstructure combiners, each combiner having an antenna disposed at the output thereof, the antennas
disposed within the common waveguide.

US Pat. No. 9,817,199

DEVICE PACKAGE AND METHODS FOR THE FABRICATION AND TESTING THEREOF

NUVOTRONICS, INC, Radfor...

1. A method of hermetically sealing a micro-optical device package to permit leak detection, comprising:
providing a substrate having hermetically sealed conductive vias disposed therethrough;
attaching an active optical element to the substrate with the optical element disposed in electrical communication with the
hermetically sealed conductive vias;

placing a lid over the active optical element and the substrate;
sealing the lid to the substrate to provide the sealed micro-optical device package, the sealed micro-optical device package
including a sealed volume between the substrate and the lid having a pressure above atmospheric pressure such that a wall
of the lid has a measurable outward deflection; and

measuring the deflection of the wall after sealing the micro-optical device package.

US Pat. No. 9,515,364

THREE-DIMENSIONAL MICROSTRUCTURE HAVING A FIRST DIELECTRIC ELEMENT AND A SECOND MULTI-LAYER METAL ELEMENT CONFIGURED TO DEFINE A NON-SOLID VOLUME

Nuvotronics, Inc., Radfo...

1. A three-dimensional microstructure, comprising:
a first microstructural element comprising a dielectric material and having an aperture extending at least partially therethrough;
a second microstructural element comprising a plurality of layers of a metal material,
each metal layer disposed on top of and in contact with one another;
a metal material in the aperture affixing the first microstructural element to the second microstructural element; and
a non-solid volume to which the first microstructural element and/or the second microstructural element are exposed.

US Pat. No. 9,570,789

TRANSITION STRUCTURE BETWEEN A RECTANGULAR COAXIAL MICROSTRUCTURE AND A CYLINDRICAL COAXIAL CABLE USING STEP CHANGES IN CENTER CONDUCTORS THEREOF

NUVOTRONICS, INC, Radfor...

1. A transmission line microstructure for connection to a cylindrical coaxial cable, comprising:
a rectangular coaxial microstructure having a center conductor surrounded by an outer conductor extending along a longitudinal
axis, the outer conductor including a plurality of layers of a conductive material, the center conductor having an end with
a step change in thickness perpendicular to the longitudinal axis; and

a transition structure electrically connected to the outer conductor of the rectangular coaxial microstructure proximate the
center conductor end said transition structure having a step change in height, and extending outwardly therefrom along the
longitudinal axis, the transition structure having an upper surface shaped to support a cylindrical coaxial cable at an orientation
in which a center conductor of the cylindrical coaxial cable is disposed along the longitudinal axis in electrical communication
with the center conductor of the rectangular coaxial microstructure.

US Pat. No. 10,074,885

COAXIAL WAVEGUIDE MICROSTRUCTURES HAVING CONDUCTORS FORMED BY PLURAL CONDUCTIVE LAYERS

NUVOTRONICS, INC, Radfor...

1. A multi-layer, waveguide microstructure for operation at a selected wavelength, comprising:a center conductor comprising a plurality of layers of a conductive material;
an outer conductor comprising one or more walls, spaced apart from and disposed around the center conductor, the one or more walls having a plurality of layers of a conductive material and at least one wall of the one or more walls having one or more of interconnected spirals and springs,
wherein the one or more interconnected spirals and springs are arranged relative to one wall another to provide the at least one of the one or more walls.

US Pat. No. 9,583,856

BATCH FABRICATED MICROCONNECTORS

Nuvotronics, Inc., Radfo...

1. A dilation amplifier system, comprising:
a dilation including a first array of a first pitch disposed at a first surface thereof and a second array of a second pitch,
different from the first pitch, disposed at a second surface opposing the first surface, and 3D-RF routing disposed within
the dilation, the routing extending from a selected element of the first array to a selected element of the second array;
and

a plurality of amplifiers, each amplifier electrically connected to a respective element of the first array.

US Pat. No. 9,993,982

METHODS OF FABRICATING ELECTRONIC AND MECHANICAL STRUCTURES

NUVOTRONICS, INC., Radfo...

1. A method for fabricating a three dimensional device, comprising:depositing a first polymer material using three dimensional printing; and
depositing a second polymer material using three dimensional printing, wherein:
the second polymer material is capable of being selectively metallized with respect to the first polymer material; and the steps of depositing the first and second polymer materials create a coaxial structure having a metallizable center conductor core comprising the second polymer material and a metallizable outer conductor core comprising the second polymer material, with the first polymer material disposed between the center conductor core and outer conductor core to support the center conductor core in the outer conductor core.

US Pat. No. 10,027,030

DIELECTRIC-FREE METAL-ONLY DIPOLE-COUPLED BROADBAND RADIATING ARRAY APERTURE WITH WIDE FIELD OF VIEW

NUVOTRONICS, INC, Radfor...

1. A two-dimensional array of dipole-coupled broadband radiator structures, each structure comprising:a ground surface having first and second openings disposed therethrough; and
adjacent first and second dipole antennas each comprising two loops with each loop disposed in a respective plane perpendicular to the ground surface, a selected one of the loops of each of the antennas having a first end shorted to the ground surface and a second end disposed in a respective one of the first and second openings, with the respective planes of a selected loop of each of the first and second antennas disposed perpendicular to one another, wherein the loops comprise self-supporting metal-only structures such that the loops are not embedded in dielectric materials,
wherein the length of a unit cell of the two-dimensional array taken along the ground surface is approximately half of a wavelength at the upper end of the frequency range over which the array operates.

US Pat. No. 10,008,779

DIELECTRIC-FREE METAL-ONLY DIPOLE-COUPLED RADIATING ARRAY APERTURE WITH WIDE FIELD OF VIEW

Nuvotronics, INC, Radfor...

1. A two-dimensional array of dipole-coupled radiator structures, each radiator structure comprising:a ground surface having first and second openings disposed therethrough; and
a pair of antenna loops with each loop disposed in a respective plane perpendicular to the ground surface, a selected one of the loops having a first end shorted to the ground surface and a second end disposed in a respective one of the first and second openings, with the respective planes of the antenna loops oriented perpendicular to one another, wherein the loops comprise self-supporting metal-only structures such that the loops are not embedded in dielectric materials,
wherein the array comprises dual-polarized differentially-fed shorted dipoles.

US Pat. No. 10,050,325

COAXIAL WAVEGUIDE MICROSTRUCTURES HAVING CONDUCTORS FORMED BY PLURAL CONDUCTIVE LAYERS

NUVOTRONICS, INC, Radfor...

1. A multi-layer, waveguide microstructure for operation at a selected wavelength, comprising:a center conductor comprising a plurality of layers of a conductive material;
an outer conductor comprising one or more walls, spaced apart from and disposed around the center conductor, the one or more walls having a plurality of layers of a conductive material and at least one wall of the one or more walls having one or more of interconnected spirals and springs,
wherein the one or more interconnected spirals and springs are arranged relative to one wall another to provide the at least one of the one or more walls.

US Pat. No. 10,135,109

METHOD OF FORMING A COAXIAL LINE MICROSTRUCTURE HAVING AN ENLARGED REGION ON A SUBSTRATE AND REMOVING THE COAXIAL LINE MICROSTRUCTURE FROM THE SUBSTRATE FOR MOUNTING ON A MOUNTING SUBSTRATE

NUVOTRONICS, INC, Radfor...

1. A method of forming a coaxial transmission line microstructure, comprising:disposing a plurality of layers over a substrate, wherein the plurality of layers comprise one or more of dielectric and a conductive material;
forming the coaxial transmission line microstructure from the plurality of layers to include a center conductor, an outer conductor disposed around the center conductor, a non-solid volume between the center conductor and the outer conductor, and a transition structure for transitioning between the coaxial transmission line and an electrical connector, the transition structure having an end portion of the center conductor which has an increased dimension along an axis thereof to provide an enlarged region of the center conductor adapted to attach to an electrical connector, with the end portion of the center conductor disposed in an enlarged region of the outer conductor;
removing the coaxial transmission line microstructure from the substrate;
providing a mounting substrate having a support pedestal disposed thereon; and,
mounting the coaxial transmission line microstructure on the mounting substrate with the end portion of the center conductor disposed on, and supported by, the support pedestal.

US Pat. No. 10,193,203

STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT AND ASSEMBLY MECHANISMS FOR AND BETWEEN CHIPS, COMPONENTS, AND 3D SYSTEMS

NUVOTRONICS, INC, Radfor...

13. A microstructure, comprising:a first microstructural element having a plurality of fused layers of a material, each layer parallel to an upper surface of the first microstructural element, the first microstructural element having a first mating edge;
a second microstructural element having a plurality of fused layers of a material, each layer parallel to an upper surface of the second microstructural element, the second microstructural element having a second mating edge, the second mating edge disposed adjacent the first mating edge; and
a jumper having a plurality of fused layers of a material, the jumper disposed at the upper surfaces of the first and second microstructural elements at a location spanning the first and second mating edges and attached to each of the first and second microstructural elements to join the first and second microstructural elements to one another, wherein the first microstructural element includes an opening disposed therein in registration with a corresponding feature of the jumper.

US Pat. No. 10,257,951

SUBSTRATE-FREE INTERCONNECTED ELECTRONIC MECHANICAL STRUCTURAL SYSTEMS

NUVOTRONICS, INC, Radfor...

1. A substrate-free, interconnected electronic mechanical structural system, comprising:a first substrate-free, electronic subsystem comprising a plurality of sequential planar layers of a material disposed parallel to a first plane, the layers including an electronic component and a first mechanical alignment feature; and
a second substrate-free, electronic subsystem comprising a plurality of sequential planar layers of a material disposed parallel to a second plane, the layers including an electronic component and a second mechanical alignment feature, wherein the first and second mechanical alignment features are configured to cooperate to join the first and second subsystems such that the first and second planes of the respective subsystems are orthogonal to one another.

US Pat. No. 10,256,545

DIELECTRIC-FREE METAL-ONLY DIPOLE-COUPLED RADIATING ARRAY APERTURE WITH WIDE FIELD OF VIEW

NUVOTRONICS, INC, Radfor...

1. A radiator structure, comprising:a ground surface having a plurality of openings disposed therethrough;
first and second antenna loops with each loop disposed in a respective plane perpendicular to the ground surface, each loop having a first end shorted to the ground surface and each loop having a second end disposed in a respective one of the plurality of openings, wherein the antenna loops comprise self-supporting metal-only structures such that the antenna loops are not embedded in dielectric materials;
a third antenna loop disposed in the same plane as the first antenna loop, the third loop having a first end shorted to the ground surface and a second end disposed in a respective one of the plurality of openings; and
a fourth antenna loop disposed in the same plane as the second antenna loop, the fourth loop having a first end shorted to the ground surface and a second end disposed in a respective one of the plurality of openings,
wherein the first, second, third, and fourth antenna loops are arranged in a plus-shaped pattern and the grounded ends of the first, second, third, and fourth antenna loops are disposed proximate the center of the plus-shape.

US Pat. No. 10,310,009

WAFER SCALE TEST INTERFACE UNIT AND CONTACTORS

NUVOTRONICS, INC, Radfor...

1. A wafer level test interface device, comprising a device interface layer having a plurality of coaxial transmission lines extending therethrough from a first surface of the layer to an opposing second surface of the layer, the transmission lines having respective ends spaced relative to one another at the first surface separated by a first distance and having respective ends spaced relative to one another at the second surface separated by a second distance which is larger than the first distance, wherein the coaxial transmission lines comprise a center conductor suspended in air and surrounded by conductive shielding.