US Pat. No. 9,480,407

DEVICE AND METHOD FOR REMOVAL OF AMBIENT NOISE SIGNAL FROM A PHOTOPLETHYSMOGRAPH

NITTO DENKO CORPORATION, ...

1. A method for removal of ambient noise signal from an optical measurement, the method comprising:
obtaining a first signal waveform based on detecting light based on a first light illumination;
obtaining a second signal waveform based on detecting light based on a second light illumination;
tuning the first light and second light illumination such that the maximum amplitudes of the first and second signal waveforms
are maximised and within a predetermined saturation range, such that ambient light interference for the first and second signal
waveforms is reduced;

obtaining a third signal waveform based on detecting ambient light;
obtaining respective maximum and minimum values of the first and the second signal waveforms, said obtaining respective maximum
and minimum values being performed at a plurality of identified sample points; and

deriving signal values of the first and second signal waveforms with the removal of ambient noise using the third signal waveform
and by using the maximum and minimum values of the first and the second signal waveforms.

US Pat. No. 9,288,903

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

NITTO DENKO CORPORATION, ...

1. A method of manufacturing a printed circuit board comprising the steps of:
preparing an insulating layer consisting essentially of a porous polytetrafluoroethylene having continuous pores, an average
pore size of the continuous pores of said polytetrafluoroethylene being not more than 0.1 ?m; and

forming a conductor pattern having a given pattern on said insulating layer using a processing solution such that the processing
solution is prevented from entering or remaining in the continuous pores of said insulating layer.

US Pat. No. 9,244,205

HARD-COATED ANTIGLARE FILM, POLARIZING PLATE AND IMAGE DISPLAY INCLUDING THE SAME, METHOD FOR PRODUCING THE SAME, AND METHOD FOR EVALUATING THE SAME

NITTO DENKO CORPORATION, ...

1. A hard-coated antiglare film, comprising:
a transparent plastic film substrate; and
a hard-coating antiglare layer containing fine particles, on at least one surface of the transparent plastic film substrate,
wherein

the amount of fine particles is in the range of 10 to 20 parts by weight, per 100 parts by weight of a material for forming
a hard-coating layer,

the hard-coated antiglare film has a total haze value Ht in a range of 10% to 35%,
the total haze value Ht and an internal haze value Hin satisfy an relationship expressed by the following formula (1),
a surface of the hard-coating antiglare layer has an uneven shape and the following arithmetic average surface roughness Ra
in a range of 0.1 to 0.3 ?m, and

the hard-coated antiglare film includes: convexities that exceed a roughness mean line of a surface roughness profile; no
convexities in which line segments of portions of the mean line that cross the convexities each have length of 80 ?m or longer;
convexities that exceed a standard line that is in parallel with the mean line and is located at a height of 0.1 ?m; and at
least 50 convexities in which line segments of portions of the standard line that cross the convexities each have a length
of 20 ?m or shorter in a 4-mm long portion at an arbitrary location of the surface of the hard-coating antiglare layer,

0.5?Hin/Ht?0.9  (1)

Total haze value Ht: a haze value (cloudiness) (%) of an entire hard-coated antiglare film, according to JIS K 7136 (2000
version),

Internal haze value Hin: a haze value (%) of the entire hard-coated antiglare film measured in the case where a surface of
the hard-coated antiglare film is smooth,

Ra: an arithmetic average surface roughness (?m) defined in JIS B 0601 (1994 version).

US Pat. No. 9,242,001

CATIONIC LIPIDS FOR THERAPEUTIC AGENT DELIVERY FORMULATIONS

NITTO DENKO CORPORATION, ...

1. A stellate-cell-specific drug carrier comprising a stellate cell specific amount of a retinoid molecule and a liposomal
composition wherein the liposomal composition comprises a cationic lipid of formula I
wherein R1 and R2 are independently selected from the group consisting of C10 to C18 alkyl, C12 to C18 alkenyl, and oleyl; wherein R3 and R4 are independently selected from the group consisting of C1 to C6 alkyl, and C2 to C6 alkanol; wherein X is selected from the group consisting of —CH2—, —S—, and —O—, or is absent; wherein Y is selected from —(CH2)n—, —S(CH2)n—, —O(CH2)n—, -thiophene-, —SO2(CH2)n, and ester, wherein n=1-4; wherein a=1-4; wherein b=1-4; wherein c=1-4; and wherein Z is a counterion.

US Pat. No. 9,251,950

MAGNETIC ELEMENT FOR WIRELESS POWER TRANSMISSION AND METHOD FOR MANUFACTURING SAME

NITTO DENKO CORPORATION, ...

1. A magnetic element for wireless power transmission, which generates an induced electromotive force, comprising:
a conductor portion through which an alternating current flows; and
a magnetic part arranged in parallel to the conductor portion,
wherein the magnetic part includes a resin in which magnetic particles are dispersed, and the conductor portion is at least
partially bonded and integrated with the magnetic part, while being electrically insulated therefrom, by the resin, and

wherein the magnetic particles are either spherical particles or flat particles,
when the magnetic particles are spherical particles, the spherical magnetic particles with a mean grain diameter of 1 ?m to
300 ?m are mixed into the resin for an amount of 50 Vol % to 90 Vol % with respect to the resin, and

when the magnetic particles are flat particles, the flat magnetic particles with a grain diameter of not more than 50 ?m and
with an aspect ratio of 10 or higher are mixed into the resin for an amount of 20 Vol % to 70 Vol % with respect to the resin.

US Pat. No. 9,241,410

WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF

NITTO DENKO CORPORATION, ...

1. A wired circuit board, comprising:
an insulating layer; and
a conductive layer including a wire covered with the insulating layer and a terminal, which is continued to the wire, for
being electrically connected to an electronic element,

wherein the insulating layer is formed with an insulating opening exposing the terminal, and the terminal is formed in a pattern
which is indented in a thickness direction so as to form a plurality of indented lower walls and at least one upper wall joined
to the lower walls by connecting walls, to thereby increase a contact area between the terminal and a connecting medium for
connecting the electronic element to the terminal,

wherein the connecting medium comprises a conductive adhesive,
wherein the terminal is used by electrically connecting to a terminal of the electronic element via the conductive adhesive,
and

wherein the terminal of the wired circuit board is completely physically separated from the terminal of the electronic element
by the conductive adhesive interposed therebetween.

US Pat. No. 9,272,460

METHOD OF PRODUCING POLARIZING FILM

NITTO DENKO CORPORATION, ...

1. A method of producing a polarizing film, comprising the steps of: at least dyeing and stretching a first polyvinyl alcohol
resin film of two or more band-like polyvinyl alcohol resin films in the course of a traveling path while traveling the first
polyvinyl alcohol resin film in a longitudinal direction, and bonding a tail end of the first polyvinyl alcohol resin film
to a leading end of a second polyvinyl alcohol resin film forming a joint portion, and at least dyeing and stretching the
first polyvinyl alcohol resin film, the second polyvinyl alcohol resin film and the joint portion continuously at a stretch
ratio of not less than 5.25 times,
wherein the first and second polyvinyl alcohol resin films are arranged with the tail end of the first polyvinyl alcohol resin
film and the leading end of the second polyvinyl alcohol resin film being layered, and an interface portion thereof is bonded
to form the joint portion wherein the bonding consists of laser welding and optionally a light absorbing agent.

US Pat. No. 9,183,879

SUSPENSION BOARD WITH CIRCUIT

NITTO DENKO CORPORATION, ...

1. A suspension board with circuit for mounting a slider unit including a slider and an electron device,
the electron device being mounted so as to form, when projected in the thickness direction with respect to the slider provided
with a magnetic head,

an overlapping portion that overlaps with the slider, and
a protruding portion that protrudes from the slider in a longitudinal direction of the suspension board with circuit, where
the longitudinal direction of the suspension board with circuit is defined as a front-rear direction along an elongated length
of the suspension board with circuit, with the slider unit being mounted to a mount region located at a front end portion
of the suspension board with circuit,

wherein the suspension board with circuit is formed with a first opening that penetrates in the thickness direction, which
is perpendicular to the longitudinal direction of the suspension board with circuit, and accommodates the overlapping portion,

a second opening that communicates with the first opening, wherein the second opening extends from the first opening in the
longitudinal direction of the suspension board with circuit, wherein the second opening is smaller in width than a width of
the first opening in a widthwise direction of the suspension board with circuit, where the widthwise direction is perpendicular
to both the longitudinal direction and the thickness direction, and wherein the second opening accommodates the protruding
portion of the electron device,

wherein the protruding portion has a width smaller than a width of the overlapping portion in the widthwise direction of the
suspension board with circuit,

wherein the suspension board with circuit further comprises a metal supporting board and an insulating base layer formed on
the metal supporting board,

wherein the first opening is defined by a region at a rear side in the front-rear direction of a support opening passing through
the metal supporting board in the thickness direction, the region being exposed from the insulating base layer, and

wherein the second opening is defined by a cutout extending from a front end face of the first opening in the front-rear direction
toward a front side in the front-rear direction in the insulating base layer, the cutout being at an inner side in the width
direction in a region at the front side in the front-rear direction of the support opening.

US Pat. No. 9,159,343

COPPER RESIDUAL STRESS RELAXATION REDUCTION MEANS FOR HARD DISK DRIVE SLIDER GIMBALS

NITTO DENKO CORPORATION, ...

1. A hard drive (HDD) gimbal trace circuit characterized in reduced magnitude of the residual stress or residual plastic strain,
the trace circuit comprising:
a stainless steel gimbal strut (SGST) configured to support a transducer and configured to nullify a natural pitch angle of
a flexure from mechanical-coarse adjustment of the SGST;

a plurality of traces forming a trace structure, and being plastically deformed at a high strain region from the mechanical-coarse
adjustment of the SGST;

a first stress suppressor comprising a first protrusion being at least partially disposed under the high strain region, and
a second stress suppressor comprising a second protrusion being at least partially disposed under the high strain region,
wherein the SGST has an edge disposed on the transducer side so as to be spaced apart with an air gap from the trace structure
in the high strain region, the edge extending so as to be substantially parallel to the plurality of traces in the high strain
region,

each of the first protrusion and the second protrusion extends from the edge in an orthogonal direction to an extending direction
of the trace structure in the high strain region so as to extend across the plurality of traces in the high strain region
without bending,

the first protrusion and the second protrusion are disposed side by side in the extending direction of the plurality of traces,
each of the first protrusion and the second protrusion comprises:
a proximate end which contacts the edge of the SGST on a first side of the plurality of traces;
a distal end which is distal to the edge, is located outside of a second side of the plurality of traces, and is parallel
to the proximate end;

two equally-sized parallel sides which extend from the distal end to the proximate end, and
only the first protrusion and the second protrusion are disposed under the plurality of traces in the high strain region.

US Pat. No. 9,260,639

POLYESTER ADHESIVE COMPOSITION

NITTO DENKO CORPORATION, ...

1. An adhesive composition containing substantially no organic solvent,
wherein the composition is a polyester-based adhesive composition comprising a polyester having a weight-average molecular
weight of from 1.0×103 to 20×103 as a main component thereof and a trifunctional or more polyepoxy compound as a crosslinking agent,

wherein, when the molar number, mcooH, of carboxyl group contained in a polycarboxylic acid component constituting the polyester is taken as 1, the molar number,
mOH, of hydroxyl group contained in a polyalcohol component constituting the polyester is from 0.5 to 0.98,

wherein the composition has a viscosity at 23° C. of at most 80 Pa·s, and
wherein at least one polycarboxylic acid of the polycarboxylic acid component constituting the polyester is an aliphatic dicarboxylic
acid having a dimerized structure of an unsaturated fatty acid.

US Pat. No. 9,164,210

OPTICAL LAMINATED BODY, OPTICAL LAMINATED BODY SET, AND LIQUID CRYSTAL PANEL USING OPTICAL LAMINATED BODY OR OPTICAL LAMINATED BODY SET

NITTO DENKO CORPORATION, ...

1. An optical laminate set, comprising:
a first optical laminate including a first polarizing film having a thickness of 10 ?m or less; and a reflective polarization
film; and

a second optical laminate including a second polarizing film having a thickness larger than the thickness of the first polarizing
film of the first optical laminate by 5 micrometer or more;

wherein the second optical laminate is placeable on a viewer side of a liquid crystal panel and the first optical laminate
is placeable on a side opposite to the viewer side.

US Pat. No. 9,253,297

SOUND-TRANSMITTING MEMBRANE FOR MICROPHONE, SOUND-TRANSMITTING MEMBRANE MEMBER FOR MICROPHONE PROVIDED WITH THE MEMBRANE, MICROPHONE, AND ELECTRONIC DEVICE PROVIDED WITH MICROPHONE

Nitto Denko Corporation, ...

1. A sound-transmitting membrane member for a microphone, comprising:
a sound-transmitting membrane to be disposed to a sound-collecting opening of the microphone and/or a sound-collecting opening
of a casing of an electronic device having the microphone so as to allow sound to transmit through the sound-transmitting
membrane while preventing a foreign matter from entering into a sound transducer of the microphone through the sound-collecting
opening, the sound-transmitting membrane having two main surfaces positioned opposite to each other; and

a double-sided adhesive sheet for bonding the sound-transmitting membrane to a member having the sound-collecting opening
so as to cover the sound-collecting opening,

wherein the double-sided adhesive sheet is placed on a peripheral portion of at least one main surface of the sound-transmitting
membrane,

wherein the sound-transmitting membrane is composed of a nonporous film or a multilayer membrane including a nonporous film,
has a surface density of 30 g/m2 or less, and

has a sound transmission loss of less than 3 dB in a frequency range of 300 to 4000 Hz, and
wherein both of the main surfaces of the sound-transmitting membrane are exposed to an outside of the sound-transmitting membrane
member except for the peripheral portion on which the double-sided adhesive sheet is placed.

US Pat. No. 9,156,780

SULFONIC ACID GROUP-CONTAINING DIAMINE COMPOUND AND METHOD FOR PRODUCING THE SAME

Nitto Denko Corporation, ...

1. A sulfonic acid group-containing diamine compound represented by formula (1) below:
where
a group represented by [—SO3M] is a sulfonic acid group, a salt of sulfonic acid group, or an ester of sulfonic acid group,

A in a partial structure represented by [—O-A-NH2] denotes:

a divalent aliphatic group R1 which may have a substituent and has a carbon number of 1 to 10;

a divalent aromatic group Ar1 which has 1 to 4 ring structures and may have a substituent;

a group represented by formula: [—Ar2—Z1—Ar3—] (where Ar2 and Ar3, which may be the same as or different from each other, each are a divalent aromatic group which has 1 to 4 ring structures
and may have a substituent, and Z1 is a direct bond (—), an ether group (—O—), a thioether group (—S—), or a sulfone group (—SO2—));

a group represented by formula: [—R2—Ar4—] (where R2 is a divalent aliphatic group which may have a substituent and has a carbon number of 1 to 10, and Ar4 is a divalent aromatic group which has 1 to 4 ring structures and may have a substituent); or

a group represented by formula: [—Ar5—R3—Ar6—] (where Ar5 and Ar6, which may be the same as or different from each other, each are a divalent aromatic group which has 1 to 4 ring structures
and may have a substituent, and R3 is a divalent aliphatic group which may have a substituent and has a carbon number of 1 to 10), and

the substituent which the aliphatic groups R1, R2, and R3, and the aromatic groups Ar1, Ar2, Ar3, Ar4, Ar5, and Ar6 may have is at least one selected from a methyl group, an ethyl group, a propyl group, a butyl group, a trifluoromethyl group,
a phenyl group, a phenoxy group, a phenylthio group, and a benzenesulfonyl group.

US Pat. No. 9,357,645

JOINING SHEET, ELECTRONIC COMPONENT, AND PRODUCING METHOD THEREOF

NITTO DENKO CORPORATION, ...

1. A joining sheet comprising:
a solder layer which contains solder particles, a thermoplastic resin, and an active agent capable of activating the solder
particles, but does not substantially contain a thermosetting resin; and

a thermosetting resin-containing layer which is laminated on at least one surface in a thickness direction of the solder layer
and contains a thermosetting resin.

US Pat. No. 9,147,861

SURFACE LIGHT-EMITTING OBJECT

NITTO DENKO CORPORATION, ...

1. A surface light emitter, comprising:
a base material;
a plurality of ribbon-shaped organic electroluminescent elements formed side by side and over the base material; and
a lenticular sheet formed over the ribbon-shaped organic electroluminescent elements through an adhesion layer, and having
a plurality of convex cylindrical lenses provided side by side,

wherein a direction in which the convex cylindrical lenses extend and a direction in which the ribbon-shaped organic electroluminescent
elements extend are substantially parallel to each other, and

wherein a width of each of the ribbon-shaped organic electroluminescent elements is 5 mm to 100 mm, and a ratio of a width
of each of the convex cylindrical lenses to the width of each of the ribbon-shaped organic electroluminescent elements is
1/10 to 1/10,000.

US Pat. No. 9,319,762

WATER-PROOF SOUND TRANSMITTING MEMBER

Nitto Denko Corporation, ...

1. A water-proof sound transmitting member having a multilayer structure, comprising:
a water-proof sound transmitting membrane to be attached to a housing having a hole that allows sound to pass therethrough;
a support layer to be attached to the housing together with the water-proof sound transmitting membrane, the support layer
allowing sound to pass therethrough;

a housing-side adhesive layer for bonding the water-proof sound transmitting membrane to the housing; and
a support layer-side adhesive layer, wherein
an entire peripheral portion of the support layer extends outwardly beyond the housing-side adhesive layer,
the support layer has a frame shape, a peripheral edge of which lies beyond a peripheral edge of the water-proof sound transmitting
membrane, and is bonded to a peripheral portion of the water-proof sound transmitting membrane by the support layer-side adhesive
layer, and

the entire peripheral portion of the support of the support layer also extends outwardly beyond the support layer-side adhesive
layer.

US Pat. No. 9,156,060

METHOD FOR PRODUCING WATERPROOF ORGANIC THIN FILM

NITTO DENKO CORPORATION, ...

1. A method for producing a waterproof organic thin film, comprising: a waterproofing step of preparing a long laminate having
an organic thin film, and bringing at least the organic thin film into contact with a waterproofing-treatment liquid;
a washing step of washing at least the organic thin film surface of the long laminate; and
a conveying step to be performed between the waterproofing step and the washing step, the conveying step being a step of conveying
the long laminate from the waterproofing step to the washing step;

wherein in the conveying step, the long laminate is conveyed while the waterproofing-treatment liquid remaining on the organic
thin film surface is caused to flow relatively to the organic thin film surface,

the long laminate is continuous in a conveying direction, and
the conveying step comprises conveying the long laminate in the state of inclining the organic thin film surface to a horizontal
plane while wind is blown onto the organic thin film surface,

wherein the inclination angle of the organic thin film surface to the horizontal plane is 1 to 45 degrees, and the speed of
the wind is 5 to 30 m/second.

US Pat. No. 9,260,777

TRANSPARENT CRYSTALLINE ELECTRICALLY-CONDUCTIVE THIN FILM, METHOD OF PRODUCTION THEREOF, TRANSPARENT ELECTRICALLY-CONDUCTIVE FILM, AND TOUCH PANEL

NITTO DENKO CORPORATION, ...

1. A method for producing a transparent crystalline electrically-conductive thin film comprising an indium tin oxide, said
method comprising:
forming a transparent electrically-conductive thin film of an indium tin oxide by a vapor method, and then
crystallizing the transparent electrically-conductive thin film by a heat treatment,
wherein the transparent electrically-conductive thin film of an indium tin oxide comprises indium tin oxide as the main component
and up to 9% by weight of tin oxide based on the total amount of indium oxide and tin oxide,

wherein the vapor method comprises a sintered mixture of indium oxide and tin oxide in an argon atmosphere containing argon
gas and nitrogen gas and the nitrogen gas is in an amount of 3000 ppm to 13000 ppm based on the total amount of the argon
gas and the nitrogen gas;

wherein the transparent crystalline electrically-conductive thin film contains up to 0.45 atomic % of nitrogen, and
wherein the transparent crystalline electrically-conductive thin film has a surface resistance of 200 ?/square or more.

US Pat. No. 9,332,662

VENTILATION MEMBER

Nitto Denko Corporation, ...

1. A ventilation member attachable to an opening of a housing, the ventilation member comprising:
a support having a through hole serving as a part of an air passage between an interior space and an exterior space of the
housing when the support is attached to the opening;

an air-permeable membrane disposed on the support so as to cover one end of the through hole that opens into the exterior
space; and

a cover member covering the support over the air-permeable membrane so as to form, between the cover member and the support,
a ventilation space serving as a part of the air passage,

wherein the support comprises:
a first oil-repellent portion formed around the air-permeable membrane, the first oil-repellent portion being formed by an
oil-repellent treatment of a part of a first surface of the support; and

a second oil-repellent portion formed around an end of the through hole that opens into the interior space, opposite to the
one end thereof opening to the exterior space, the second oil-repellent portion being formed by an oil-repellent treatment
of a part of a second surface of the support.

US Pat. No. 9,056,943

EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME

NITTO DENKO CORPORATION, ...

1. An epoxy resin composition for an optical semiconductor device, comprising the following ingredients (A) to (E):
(A) an epoxy resin;
(B) an acid anhydride curing agent;
(C) a curing accelerator;
(D) a silicone resin where a siloxane unit constituting the silicone resin is represented by the following general formula
(1), the silicone resin has at least one hydroxyl group or alkoxy group bonded to a silicon atom in one molecule thereof,
and, among monovalent hydrocarbon groups (R) bonded to silicon atoms, 10% by mol or more thereof are substituted or unsubstituted
aromatic hydrocarbon groups;

Rm(OR1)nSiO(4-m-n)/2  (1)
wherein R is a substituted or unsubstituted saturated monovalent hydrocarbon group having 1 to 18 carbon atoms or an aromatic
hydrocarbon group and may be the same or different from each other; R1 is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms and may be the same or different from each other; and m and
n are each an integer of 0 to 3; and
(E) an alcohol compound represented by the following general formula (2):
wherein X is a single bond or a divalent hydrocarbon group having 1 to 22 carbon atoms,
wherein a content of the alcohol compound as the ingredient (E) is 5 to 25% by mol based on the number of mol of the acid
anhydride curing agent as the ingredient (B).

US Pat. No. 9,239,416

SYSTEM AND METHOD FOR MANUFACTURING OPTICAL DISPLAY DEVICE, SET OF MATERIAL ROLLS AND METHOD FOR MANUFACTURE THEREOF

NITTO DENKO CORPORATION, ...

1. A material roll comprising an optical film to be bonded to a surface of a rectangular optical display unit, comprising:
a belt-shaped sheet material that comprises the optical film, a pressure-sensitive adhesive layer, and a release film laminated
in this order, wherein the optical film comprises a polarizing plate whose longitudinal direction is parallel to its absorption
axis,

the belt-shaped sheet material having score lines that are previously formed so that the optical film can be divided by the
score lines into pieces each having a length corresponding to a long or short side of the optical display unit,

the belt-shaped sheet material having undergone a slitting process in a direction parallel to the longitudinal direction of
the polarizing plate so that it has a width corresponding to the short or long side of the optical display unit, and having
been wound into the roll.

US Pat. No. 9,158,156

LIQUID CRYSTAL DISPLAY, LAMINATED POLARIZING PLATE AND POLARIZED LIGHT SOURCE DEVICE

NITTO DENKO CORPORATION, ...

1. A transmissive liquid crystal display, comprising:
a light source (BL), a reflective linearly-polarizing layer (Pr1), a birefringent layer (A), a light source-side light-diffusing layer (D1), a light source-side absorptive linearly-polarizing layer (P1), a liquid crystal cell (LC), and a viewer-side linearly-polarizing layer (P2) which are arranged in this order and satisfy all the following conditions:

(a) transmission axes of the reflective linearly-polarizing layer (Pr1) and the light source-side absorptive linearly-polarizing layer (P1) are arranged substantially parallel to each other;

(b) said birefringent layer (A) has a thickness direction retardation Rth which satisfies the relation 250 nm?Rth?1000 nm
and said birefringent layer (A) has an in-plane retardation Re of 20 nm or less;

(c) of linearly polarized light emitted from the light source (BL) and transmitted through the reflective linearly-polarizing
layer (Pr1), the birefringent layer (A) makes substantially no change in the polarization state of linearly polarized light in the normal
direction while the birefringent layer (A) makes a change in the polarization state of linearly polarized light in an oblique
direction; and

wherein said reflective linearly-polarizing layer (Pr1), said birefringent layer (A), said light source-side light-diffusing layer (D1) and said light source-side absorptive linearly-polarizing layer (P1) are integrally bonded to one another with a pressure-sensitive adhesive.

US Pat. No. 9,279,828

SAMPLE FIXING MEMBER FOR ATOMIC FORCE MICROSCOPE

NITTO DENKO CORPORATION, ...

1. A sample fixing member for an atomic force microscope, comprising a base material and a fibrous columnar structure including
a plurality of fibrous columnar objects each having a length of 200 ?m or more,
wherein the fibrous columnar structure comprises a carbon nanotube aggregate including a plurality of carbon nanotubes,
wherein the carbon nanotubes each have a plurality of walls,
wherein each of the fibrous columnar objects is aligned in a horizontal direction with respect to each adjacent fibrous columnar
object, and

wherein the fibrous columnar objects are aligned in a direction substantially perpendicular to the base material.
US Pat. No. 9,168,472

AIR-PERMEABLE FILM IMPARTED WITH OIL REPELLENCY

Nitto Denko Corporation, ...

1. An air-permeable film imparted with oil repellency, comprising:
a porous body having a surface coated with an oil-repellent agent,
wherein the oil-repellent agent comprises a linear fluorine-containing hydrocarbon group represented by —R1C5F10CH2C4F9, where R1 is an alkylene group having 1 to 12 carbon atoms or a phenylene group,

the porous body is a porous formed body composed of ultra-high molecular weight polyethylene fine particles that are bound
together,

the air-permeable film has an air permeability of 15 seconds/100 ml or less in terms of Gurley number, and
a 5 mm-diameter droplet of an organic solvent that is n-decane or methanol does not penetrate the surface within 30 seconds
after the droplet is applied onto the surface.

US Pat. No. 9,242,198

VENTILATION MEMBER

Nitto Denko Corporation, ...

1. A ventilation member attachable to an opening of a housing, the ventilation member comprising:
a support having a through hole serving as an air passage between an interior space and an exterior space of the housing when
the support is attached to the opening;

a filter member disposed on the support to cover an aperture of the through hole that opens into the interior space; and
an air-permeable membrane disposed on the support to cover an aperture of the through hole that opens into the exterior space,
wherein
the through hole comprises:
a first air passage extending in a predetermined direction from one end of the first air passage to the other end of the first
air passage, the one end forming the aperture that opens into the interior space;

a second air passage having one end connected to a side of the first air passage and the other end forming the aperture that
opens into the exterior space; and

a dead end passage extending in the predetermined direction from the other end of the first air passage.

US Pat. No. 9,261,640

LIQUID CRYSTAL DISPLAY APPARATUS

KEIO UNIVERSITY, Tokyo (...

1. A liquid crystal display apparatus, comprising:
a liquid crystal display panel comprising a liquid crystal cell between a first polarizing plate provided on a viewer side
and a second polarizing plate provided on a back surface side; and

a surface light source device for illuminating the liquid crystal display panel from the back surface side,
wherein the surface light source device comprises:
a light source unit;
a light guide plate for causing light from the light source unit to enter from a light incident surface opposed to the light
source unit, and for outputting first directivity light from a light output surface opposed to the liquid crystal display
panel, the first directivity light being polarized light having directivity of maximum intensity in a first direction, which
forms a predetermined angle from a normal direction of the light output surface in a plane approximately parallel to a light
guiding direction of light, and having a high ratio of a polarized light component oscillating in the plane; and

a prism sheet arranged on a liquid crystal display panel side with respect to the light guide plate, the prism sheet comprising
a prism portion in which a plurality of columnar unit prisms protruding on a light guide plate side are arrayed, the prism
sheet being configured to convert the first directivity light into second directivity light directed in a second direction
within a predetermined angle from the normal direction of the light output surface of the light guide plate while substantially
maintaining a polarization state of the first directivity light,

wherein a ridge line direction of the columnar unit prisms is approximately parallel to the light incident surface of the
light guide plate,

wherein a transmission axis of the second polarizing plate is approximately parallel to a polarization direction of the second
directivity light and the light guiding direction of the light in the light guide plate, and

wherein the transmission axis of the second polarizing plate is approximately perpendicular to a transmission axis of the
first polarizing plate.

US Pat. No. 9,261,709

OPTICAL FILM ROLL SET, AND METHOD FOR PRODUCING OPTICAL FILM ROLL SET

NITTO DENKO CORPORATION, ...

1. A set of optical film rolls comprising:
a first optical film roll that is a roll of a first long multilayer optical film having a width corresponding to a length
of a pair of opposite sides of an optical cell and including a long polarizing film having an absorption axis in its longitudinal
direction; and

a second optical film roll that is a roll of a second long multilayer optical film having a width corresponding to a length
of another pair of opposite sides of the optical cell and including a long linearly polarized light separating film having
a reflection axis in its transverse direction;

wherein the set of optical film rolls are capable of being used in a process including supplying films and bonding the film,
in direction relatively perpendicular to one another, to the optical cell, wherein a direction in which each film is bonded
to the optical cell is equal to a direction in which each film is supplied, and the films are laminated to one side of the
optical cell.

US Pat. No. 9,271,070

WATERPROOF SOUND TRANSMITTING MEMBER

Nitto Denko Corporation, ...

1. An adhesive structure comprising a waterproof sound transmitting member and a housing,
the waterproof sound transmitting member comprising:
a waterproof sound transmitting membrane that allows sound to pass therethrough and prevents water from passing therethrough,
the waterproof sound transmitting membrane having a first surface and a second surface opposite to the first surface; and

a first adhesive sheet and a second adhesive sheet that are disposed on the first surface,
wherein when viewed in a direction perpendicular to the first surface, the first adhesive sheet has a closed frame shape,
and the second adhesive sheet is disposed within the frame formed by the first adhesive sheet and is spaced from the first
adhesive sheet,

the first adhesive sheet fixes the waterproof sound transmitting membrane and the housing together, and
the second adhesive sheet fixes the waterproof sound transmitting membrane and the housing together in a region surrounded
by the first adhesive sheet.

US Pat. No. 9,451,704

SUSPENSION BOARD ASSEMBLY SHEET WITH CIRCUITS AND METHOD FOR MANUFACTURING THE SAME

NITTO DENKO CORPORATION, ...

1. A suspension board assembly sheet with circuits comprising: a plurality of suspension boards with circuits; an inspection
substrate; and a support frame that integrally supports the plurality of suspension boards with circuits and the inspection
substrate, wherein each of the plurality of suspension boards with circuits includes a conductive first support substrate,
a first insulating layer formed on the first support substrate, a conductor line formed on the first insulating layer and
a first via that passes through the first insulating layer and electrically connects the first support substrate and the conductor
line, and the inspection substrate includes a conductive second support substrate, a second insulating layer formed on the
conductive second support substrate, a conductor layer formed on the second insulating layer, and a second via that passes
through the second insulating layer and electrically connects the conductive second support substrate and the conductor layer,
and the first via and the second via have the same configuration, wherein the second insulating layer has an opening that
is formed such that part of the conductive second support substrate is exposed.

US Pat. No. 9,265,141

OPTO-ELECTRIC HYBRID BOARD AND MANUFACTURING METHOD THEREFOR

NITTO DENKO CORPORATION, ...

1. An opto-electric hybrid board, comprising:
an optical waveguide unit; and
an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical
waveguide unit,

wherein the optical waveguide unit comprises:
an undercladding layer;
a core for an optical path, the core being formed on a surface of the undercladding layer;
an overcladding layer which covers the core; and
a fitting hole for locating the electric circuit unit, the fitting hole being formed in a surface of the overcladding layer;
wherein the electric circuit unit comprises:
an electric circuit board;
the optical element mounted at a predetermined portion on the electric circuit board; and
a protruding portion which fits into the fitting hole;
wherein the fitting hole of the optical waveguide unit is located and formed at a predetermined location with respect to an
end surface of the core;

wherein the protruding portion of the electric circuit unit is located and formed at a predetermined location with respect
to the optical element;

wherein the optical waveguide unit and the electric circuit unit are coupled to each other in a state in which the protruding
portion of the electric circuit unit fits into the fitting hole of the optical waveguide unit; and

wherein shapes of the fitting hole and the protruding portion are non-complementary.

US Pat. No. 9,261,731

LIQUID CRYSTAL DISPLAY APPARATUS

KEIO UNIVERSITY, Tokyo (...

1. A liquid crystal display apparatus, comprising:
a liquid crystal display panel comprising a liquid crystal cell between a first polarizing plate provided on a viewer side
and a second polarizing plate provided on a back surface side; and

a surface light source device for illuminating the liquid crystal display panel from the back surface side,
wherein the surface light source device comprises:
a light source unit; and
a light guide plate for causing light from the light source unit to enter from a light incident surface opposed to the light
source unit, and for outputting polarized light from a light output surface opposed to the liquid crystal display panel, the
polarized light having directivity of maximum intensity in a direction that forms a predetermined angle from a normal direction
of the light output surface in a plane approximately parallel to a light guiding direction of the light,

wherein the second polarizing plate comprises:
a polarizing portion comprising an absorptive polarizer; and
a prism portion arranged on a light guide plate side of the polarizing portion, the prism portion comprising a plurality of
columnar unit prisms arrayed so as to protrude on the light guide plate side, and

wherein, in the polarized light output from the light guide plate, when the normal direction of a light output surface is
defined to be at a polar angle of 0°, and the light guiding direction of the light guide plate is defined to be a direction
of an azimuth angle of 0°-180°, a ratio La/Lt of integrated intensity La of output light in ranges where the polar angle is
50° to 80° and the azimuth angle is 135° to 225°, 0° to 45°, and 315° to 360° to integrated intensity Lt of total output light
is 0.3 or more.

US Pat. No. 9,249,503

METHOD FOR DOUBLE-SIDE VACUUM FILM FORMATION AND LAMINATE OBTAINABLE BY THE METHOD

NITTO DENKO CORPORATION, ...

1. A method for continuously subjecting an elongated substrate to vacuum film formation, comprising the steps of:
a) unrolling and feeding an elongated substrate wound in a roll form from a first roll chamber in a first direction from the
first roll chamber toward a second roll chamber, using a first surface as a surface for film formation;

b) degassing the substrate fed in the first direction;
c) forming, in a second film formation chamber, a second material film on the first surface of the degassed substrate;
d) taking up, in the second roll chamber, the substrate in a roll form, the substrate having the second material film formed
thereon;

e) unrolling and feeding the substrate taken up in the second roll chamber from the second roll chamber in a second direction
from the second roll chamber toward the first roll chamber;

f) forming, in a first film formation chamber, a first material film on the second material film formed on the first surface
of the substrate fed in the second direction;

g) taking up, in the first roll chamber, the substrate in a roll form, the substrate having the first material film laminated
on the second material film on the first surface thereof, wherein a second surface of the substrate, opposite the first surface,
is free from material layers in the roll form;

h) unrolling and feeding the substrate taken up in the first roll chamber from the first roll chamber in the first direction,
using the second surface as a surface for film formation;

i) degassing the substrate fed in the first direction;
j) forming, in the second film formation chamber, the second material film on the second surface of the degassed substrate;
k) taking up, in the second roll chamber, the substrate in a roll form, the substrate having the second material film formed
thereon;

l) unrolling and feeding the substrate taken up in the second roll chamber from the second roll chamber in the second direction;
m) forming, in the first film formation chamber, the first material film on the second material film formed on the second
surface of the substrate fed in the second direction; and

n) taking up, in the first roll chamber, the substrate in a roll form, the substrate having the first material film laminated
on the second material film on each of the first and second surfaces thereof.

US Pat. No. 9,308,267

LIPIDS FOR THERAPEUTIC AGENT DELIVERY FORMULATIONS

Nitto Denko Corporation, ...

1. An ionizable lipid compound of formula I:

wherein
n and m are independently 1, 2, 3, or 4;
R1 and R2 are independently C10-18alkyl or C12-18alkenyl;

X is —CH2— or absent;

L is S—C1-4alkylene, —S(O)2—C1-4alkylene, or

or a pharmaceutically acceptable salt form thereof.

US Pat. No. 9,256,015

METHOD AND SYSTEM FOR MANUFACTURING OPTICAL DISPLAY PANEL

NITTO DENKO CORPORATION, ...

1. A method for manufacturing an optical display panel comprising an optical cell and a pressure-sensitive adhesive layer-carrying
optical film provided on the optical cell with the pressure-sensitive adhesive layer interposed therebetween, the method comprising:
an unwinding step comprising providing a roll of a multilayer optical film comprising the optical film and a long carrier
film placed on the optical film with the pressure-sensitive adhesive layer interposed therebetween and unwinding the multilayer
optical film from the roll;

a film feeding step comprising feeding the multilayer optical film being unwound from the roll in the unwinding step;
an optical cell feeding step comprising feeding the optical cell;
a peeling step comprising peeling off the optical film from the carrier film by inwardly folding back the carrier film fed
by the film feeding step; and

a bonding step comprising bonding the optical film, which is peeled off from the carrier film in the peeling step, to one
side of the optical cell with the pressure-sensitive adhesive interposed therebetween while feeding the optical cell, wherein

the longitudinal length (L) of the carrier film between an unwinding position at which the multilayer optical film begins
to be unwound in the film feeding step and a peeling position at which peeling is started in the peeling step is 15 times
or more the width (W) of the carrier film.

US Pat. No. 9,254,467

OIL REPELLENCY-IMPARTED AIR-PERMEABLE FILTER WITH ADHESIVE LAYER

Nitto Denko Corporation, ...

1. An air-permeable filter with an adhesive layer, the filter being imparted with oil repellency and comprising: a porous
membrane having a surface coated with an oil-repellent agent; and the adhesive layer disposed on the surface, wherein
the oil-repellent agent comprises a linear fluorine-containing hydrocarbon group represented by —R1C5F10CH2C4F9, where R1 is an alkylene group having 1 to 12 carbon atoms or a phenylene group.

US Pat. No. 9,253,879

WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF

NITTO DENKO CORPORATION, ...

1. A wired circuit board, comprising: a wire; and a-an electronic element-side terminal formed continuously to the wire and
configured to be electrically connected to an electronic element at one surface thereof in a thickness direction of the wired
circuit board, wherein the electronic element-side terminal includes a plate-shaped portion and, at the one surface of the
plate-shaped portion in the thickness direction, a plurality of projecting portions projecting away from the plate-shaped
portion in the thickness direction, and a plurality of covering layer-layers respectively covering one end portion of the
projecting portions in the thickness direction; wherein the wire and the electronic element-side terminal are provided integrally
in a conductive pattern, the wired circuit board further comprising: an insulating base layer formed on the one side of the
conductive pattern in the thickness direction, wherein the insulating base layer is formed with a base opening exposing the
one surface of the electronic element-side terminal in the thickness direction; wherein each of the covering layers includes
a first covering layer formed of the same material as that of the insulating base layer.

US Pat. No. 9,236,772

POWER SUPPLIER AND RECEIVER AND MOBILE DEVICE

NITTO DENKO CORPORATION, ...

1. A power-receiving/supplying device comprising:
a coil module configured to receive and supply power from and to another coil module by a resonance phenomenon; and
an electronic component provided in a magnetic field space which is formed by the resonance phenomenon to have a low magnetic
field strength,

the coil module including:
a resonance coil which is resonated with said another coil module; anda power-receiving/supplying coil which partly overlaps the resonance coil in a coil diameter direction and is configured to
receive and supply power from and to the resonance coil, the magnetic field space being formed at a predetermined position
between or around said another coil module and the coil module to have a lower magnetic field strength than a magnetic field
in parts around the predetermined position, by causing a magnetic field generated around the coil module and a magnetic field
generated around said another coil module to cancel each other out.

US Pat. No. 9,153,755

SILICONE RESIN SHEET, CURED SHEET, AND LIGHT EMITTING DIODE DEVICE AND PRODUCING METHOD THEREOF

NITTO DENKO CORPORATION, ...

1. A silicone resin sheet formed from:
a resin composition containing a thermosetting silicone resin and microparticles, wherein
the silicone resin sheet is in a semi-cured state and has a thickness of 300 to 3,000 ?m, and
the complex viscosity of the silicone resin sheet at a frequency of 10 Hz is 80 to 1000 Pa·s and the tan ? thereof at a frequency
of 10 Hz is 0.3 to 1.6 obtained by a dynamic viscoelastic measurement at a frequency of 0.1 to 50 Hz at 30° C. while increasing
the frequency by 10 Hz per minute; and a distortion of 1% in a shear mode.

US Pat. No. 9,171,535

WATERPROOF SOUND-TRANSMITTING MEMBRANE AND ELECTRICAL PRODUCT

Nitto Denko Corporation, ...

1. A waterproof sound-transmitting membrane comprising:
a solid resin film having a plurality of through holes that are straight holes having a constant cross-sectional shape, the
plurality of through holes extending through the solid resin film along a straight line in a thickness direction of the solid
resin film, a density of the through holes being in a range from 1×103 holes/mm2 to 1×107 holes/mm2; and

a treatment layer having water repellency, the treatment layer being formed on at least one of two surfaces of the resin film
that are opposite to each other in the thickness direction, the treatment layer having openings at positions corresponding
to the plurality of through holes, wherein

the waterproof sound-transmitting membrane has an air permeability of 100 seconds/100 mL or less in terms of Gurley number.

US Pat. No. 9,236,070

DUAL OPPOSING CANTILEVER PADS OF SUSPENSION FLEXURE

NITTO DENKO CORPORATION, ...

1. A suspension flexure comprising:
a steel layer;
a polyimide layer above the steel layer; and
a copper layer on the polyimide layer comprising a plurality of pairs of dual opposing cantilevered copper pads,
wherein each pair of the plurality of pairs comprises a first copper pad and a second copper pad each having a free end portion
and a fixed end portion,

the free end portions of the first copper pad and the second copper pad of each pair extend toward one another, and
the fixed end portions of the first copper pad and the second copper pad of each pair extend in directions opposing one another.
US Pat. No. 9,194,989

IODINE POLARIZING FILM, METHOD OF PRODUCING THE SAME, AND POLARIZING PLATE COMPRISING THE SAME

NITTO DENKO CORPORATION, ...

10. The method according to claim 9, further comprising a drying step of heating the polymer film under conditions of a drying temperature of 20° C. to 80° C.
and a drying time of 1 minute to 10 minutes after the washing step.

US Pat. No. 9,130,131

GARNET-BASED PHOSPHOR CERAMIC SHEETS FOR LIGHT EMITTING DEVICE

NITTO DENKO CORPORATION, ...

1. A lighting apparatus comprising:
a light source configured to emit radiation having a wavelength of peak emission between about 360 nm and about 500 nm; and
a composite configured to receive at least a portion of the radiation emitted by the light source, wherein the composite comprises
a first emissive layer and a second emissive layer that are sintered together;

wherein the first emissive layer comprises a first garnet phosphor and the second emissive layer comprises a second garnet
phosphor, and the first garnet phosphor and the second garnet phosphor are doped with a common dopant.

US Pat. No. 9,057,831

OPTICAL WAVEGUIDE WITH LIGHT-EMITTING ELEMENT AND OPTICAL TOUCH PANEL WITH THE SAME

NITTO DENKO CORPORATION, ...

1. An optical waveguide with a light-emitting element comprising:
a light-emitting element; and
an optical waveguide including a core for guiding light emitted from the light-emitting element to generate a plurality of
light beams,

wherein the light-emitting element is one of a light-emitting diode and a semiconductor laser,
an end of a main path-side on the core is optically coupled to the light-emitting element,
the optical waveguide comprises: an under-cladding layer; and an over-cladding layer, the core comprises: a main path; and
a plurality of branched paths branched at a plurality of branched points from the main path,

the main path has a maximum width of 500 ?m to 10,000 ?m and a height of 30 ?m to 100 ?m,
the main path has two sides faced to each other, in which one side has a plurality of branched points and the other side does
not have any branched points,

the plurality of branched points are provided on a straight line substantially parallel to a light guiding direction of the
main path,

the width of the main path becomes narrower as the main path moves away from the light-emitting element,
an angle ? formed by the other side without a branched point and the light guiding direction of the main path is 0.3 to 1.7°.

US Pat. No. 9,304,635

CONDUCTIVE FILM

NITTO DENKO CORPORATION, ...

1. A conductive film comprising:
an elongated film base, a first conductive layer, a second conductive layer and a third conductive layer in this order,
the elongated film base having a longitudinal direction and a width direction orthogonal to the longitudinal direction,
the width direction dimension of the elongated film base is greater than or equal to 1 m,
the first conductive layer being an indium-based oxide layer,
the second conductive layer being a metal layer,
the third conductive layer being an oxidized metal layer having a thickness of 1 nm to 15nm formed by sputter deposition,
wherein a surface resistance value is 0.1?/? to 0.6?/?, and
a standard deviation of a surface resistance value in the with direction is less than or equal to 0.01?/?.

US Pat. No. 9,351,399

LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE ASSEMBLY, AND ELECTRODE-BEARING SUBSTRATE IN WHICH A FRAGILE REGION IS FORMED IN A SUBSTRATE, AND LIGHT EMITTING DEVICE CUT FROM LIGHT-EMITTING DEVICE ASSEMBLY

NITTO DENKO CORPORATION, ...

1. A light-emitting device assembly comprising:
light-emitting devices being provided continuously,
the light-emitting device each including a substrate, a light-emitting diode mounted on a surface of the substrate, an encapsulating
layer formed on the surface of the substrate to encapsulate the light-emitting diode, and an electrode formed on the surface
of the substrate so as to be electrically connected to the light-emitting diode,

wherein the substrate has a fragile region formed to partition off the light-emitting devices that are disposed next to each
other,

the fragile region having a weak mechanical strength compared to the substrate,
an encapsulating region that overlaps the light-emitting diode and the encapsulating layer as viewed from a thickness direction
of the substrate, and

an electrode region that overlaps the electrode exposed from the encapsulating layer as viewed from the thickness direction,
and

wherein the substrate is only divided into the fragile region, the encapsulating region, and the electrode region,
wherein the encapsulating layer includes a continuous region that allows for continuous encapsulation of the light-emitting
devices that are disposed next to each other, and

the fragile region is formed so as to partition off the light-emitting devices that are disposed next to each other in the
continuous region.

US Pat. No. 9,521,745

SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF

NITTO DENKO CORPORATION, ...

1. A suspension board with circuit comprising:
a metal supporting board having a support opening portion passing through in a thickness direction,
a base in layer disposed at one side in the thickness direction of the metal supporting board, and
a conductive layer disposed at one side in the thickness direction of the base insulating layer and including a plurality
of terminal portions, when projected in the thickness direction, overlapped with the support opening portion and disposed
at spaced intervals to each other, wherein

the base insulating layer includes
a plurality of base opening portions that pass through in the thickness direction and are when projected in the thickness
direction, disposed between the plurality of terminal portions in an arrangement direction of the plurality of terminal portions,

a plurality of thick portions that are, when projected in the thickness direction, overlapped with each of end portions of
the plurality of terminal portions in a direction orthogonal to both directions of the thickness direction and the arrangement
direction, and

a plurality of thin portions that are disposed along edge portions of the plurality of base opening portions between the plurality
of thick portions and are thinner than the plurality of thick portions.

US Pat. No. 9,295,160

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

NITTO DENKO CORPORATION, ...

1. A method of manufacturing a printed circuit board that includes an insulating layer and a conductor layer having a predetermined
pattern, the method comprising the steps of:
performing gradation exposure to irradiate said insulating layer with exposure light using a photomask having a partial light-transmitting
region that is configured to partially transmit the exposure light; and

performing development processing on said insulating layer such that a recess is formed in a portion of said insulating layer
that has been irradiated with the exposure light through said partial light-transmitting region,

wherein said partial light-transmitting region of said photomask includes:
a first region including a plurality of first light-transmitting portions that are transmittable of the exposure light, and
a second region that is provided to surround said first region, a plurality of second light-transmitting portions that are
transmittable of the exposure light being provided in the second region; and

wherein a relationship between a diameter of each of the plurality of first light-transmitting portions and a diameter of
each of the plurality of second light-transmitting portions and a relationship between pitches of the plurality of first light-transmitting
portions and pitches of the plurality of second light-transmitting portions are set such that an average transmission amount
of the exposure light per unit area of said second region is larger than an average transmission amount of the exposure light
per unit area of said first region.

US Pat. No. 9,167,693

METHOD OF PRODUCING A WIRED CIRCUIT BOARD

NITTO DENKO CORPORATION, ...

1. A method of producing a wired circuit board, comprising:
a first step of preparing a metal supporting layer;
a second step of forming, on one side of the metal supporting layer in a thickness direction thereof, an insulating layer
having a first opening, and a plurality of terminal formation portions placed in the first opening to be spaced apart from
each other;

a third step of forming, on one side of the insulating layer in the thickness direction, a conductive layer having a plurality
of terminal portions each corresponding to the plurality of terminal formation portions;

a fourth step of partially removing the metal supporting layer to form a second opening which includes the plurality of terminal
formation portions when projected in the thickness direction, and at least one reinforcing metal supporting portion placed
between the plurality of terminal formation portions in the second opening; and

a fifth step of removing the plurality of terminal formation portions exposed from the second opening to expose both side
surfaces of the plurality of terminal portions in the thickness direction.

US Pat. No. 9,121,626

VENTILATION MEMBER

Nitto Denko Corporation, ...

1. A ventilation member attachable to a housing having an interior space that requires ventilation and an opening for ventilation,
the ventilation member comprising:
a support having a vent hole serving as a part of an air passage between the interior space and an exterior space of the housing;
and

an air-permeable membrane disposed on the support to cover one end of the vent hole that opens into the exterior space,
wherein
the support comprises:
a base portion supporting the air-permeable membrane; and
a leg portion extending from the base portion toward the interior space and adapted to fix the ventilation member to the opening
of the housing, and

the leg portion comprises:
insertion portions separated from each other in a circumferential direction by slits formed between the insertion portions
in an insertion start side of the leg portion, the insertion portions being adapted to be elastically deformed radially inwardly
when the insertion portions are inserted into the opening and then to be fixed to the opening; and

receding portions each formed in a region between an edge of an inner circumferential surface of the insertion portion and
an edge of an outer circumferential surface of the insertion portion at a root of the insertion portion, the receding portion
receding from an imaginary circumferential end surface in a direction away from the slit and receding from an imaginary inner
circumferential surface toward the outer circumferential surface, the imaginary circumferential end surface being an imaginary
end surface including a central axis of the support and a first reference line parallel to the central axis and passing through
the edge of the outer circumferential surface, and the imaginary inner circumferential surface being an imaginary surface
extending in the circumferential direction from the edge of the inner circumferential surface toward the slit.

US Pat. No. 9,169,423

ADHESIVE OPTICAL FILM, MANUFACTURING METHOD FOR THE SAME AND IMAGE DISPLAY DEVICE USING THE SAME

NITTO DENKO CORPORATION, ...

1. A method for producing a pressure-sensitive adhesive optical film comprising an optical film and a pressure-sensitive adhesive
layer provided on the optical film, the method comprising the steps of:
(1A) applying a pressure-sensitive adhesive coating liquid with a viscosity Y (P) to the optical film to form a coating with
a thickness X (?m); and

(2A) drying the applied pressure-sensitive adhesive coating liquid to form a pressure-sensitive adhesive layer,
wherein the viscosity Y of the pressure-sensitive adhesive coating liquid and the thickness X of the coating satisfy the relation
0.8X?Y?68,

wherein the pressure-sensitive adhesive coating liquid has a thickness X (?m) of 20 to 250 ?m,
wherein the pressure-sensitive adhesive coating liquid has a viscosity Y (P) of 2 to 160 P,
wherein the pressure-sensitive adhesive layer has a thickness (?m) standard deviation of 0.12 ?m or less, and
wherein the pressure-sensitive adhesive coating liquid is a water-based or aqueous dispersion pressure-sensitive adhesive
containing a (meth)acryl-based polymer having a weight average molecular weight in the range of 1,400,000 to 3,000,000.

US Pat. No. 9,214,611

REFLECTING RESIN SHEET, LIGHT EMITTING DIODE DEVICE AND PRODUCING METHOD THEREOF

NITTO DENKO CORPORATION, ...

1. A reflecting resin sheet, for providing a reflecting resin layer at the side of a light emitting diode element, comprising:
a peelable substrate, and
the reflecting resin layer provided directly on a surface of the peelable substrate and extending from the surface of the
peelable substrate, wherein

the reflecting resin layer includes a plurality of through holes extending from the surface of the peelable substrate to an
outer surface of the reflecting layer and each through hole is spaced apart from an adjacent through hole in a pattern that
accepts a light emitting diode element from a predetermined arrangement of light emitting diode elements where side spaces
are formed separating the reflecting resin layer from the light emitting diode element, and

the reflecting resin layer is in a B-stage state.

US Pat. No. 9,153,556

ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SHEET, AND SEMICONDUCTOR DEVICE OBTAINED BY THE METHOD

NITTO DENKO CORPORATION, ...

1. A method of manufacturing a semiconductor device, comprising:
fixing a semiconductor element to an adherend using an adhesive sheet for manufacturing a semiconductor device used when a
semiconductor element is adhered to an adherend and the semiconductor element is wire-bonded, wherein a 180 degree peeling
adhesive strength against a silicon wafer is 5 (N/25 mm width) or less, wherein said adhesive sheet for manufacturing a semiconductor
element is removably attached to said semiconductor element such that removal of said adhesive sheet from said semiconductor
element does not damage said semiconductor element;

peeling the adhesive sheet from the semiconductor element without damaging the semiconductor element;
bonding wires to the semiconductor element after peeling the adhesive sheet from the semiconductor element; and
resin-sealing the semiconductor element with a sealing resin,
wherein the adherend is a substrate, lead frame, or semiconductor element.
US Pat. No. 9,156,959

POLYESTER ELASTOMER FOAM AND FOAM MATERIAL

NITTO DENKO CORPORATION, ...

1. A polyester elastomer foam comprising a polyester elastomer composition containing a polyester elastomer having a melting
point of 180 to 240° C. and an epoxy-modified polymer, wherein the content of the epoxy-modified polymer in the polyester
elastomer composition is 0.5 to 4.0 parts by weight relative to 100 parts by weight of the polyester elastomer,
wherein the epoxy-modified polymer is at least one polymer selected from an epoxy-modified acrylic polymer and an epoxy-modified
polyethylene, having a weight average molecular weight of 5,000 to 100,000 and an epoxy equivalent of 100 to 3000 g/eq,

wherein the polyester elastomer foam has a cell structure having an average cell diameter of 60 to 140 ?m.
US Pat. No. 9,263,681

ORGANIC LIGHT EMITTING HOST MATERIALS

Nitto Denko Corporation, ...

1. A compound represented by a formula:
HT-[Ph1]r-Py-Het-ET

wherein HT is optionally substituted diphenylamine or optionally substituted phenyl(naphthyl)amine,
each Ph1 is independently optionally substituted p-phenylene, wherein the p-phenylene directly bonded to HT may optionally form a bond
to a phenyl of HT to form a three ring system;

Py is optionally substituted pyrazin-2,5-ylene;
Het is optionally substituted p-phenylene or optionally substituted pyridin-2,5-ylene;
ET is optionally substituted benzimidazol-2-yl, optionally substituted benzoxazol-2-yl, or optionally substituted benzothiazol-2-yl;
and

r is 1, 2, 3.
US Pat. No. 9,255,209

AIR-PERMEABLE SHEET IMPARTED WITH OIL REPELLENCY

Nitto Denko Corporation, ...

1. An air-permeable sheet imparted with oil repellency, comprising a surface coated with an oil-repellent agent, wherein
the oil-repellent agent comprises a linear fluorine-containing hydrocarbon group represented by —R1C5F10CH2C4F9, where R1 is an alkylene group having 1 to 12 carbon atoms or a phenylene group,

the air-permeable sheet is a resin sheet having air permeability in a thickness direction of the resin sheet,
the resin sheet is a non-porous sheet having two or more through holes formed to extend in the thickness direction, and
the through holes are straight holes extending straight through the resin sheet.

US Pat. No. 9,243,129

PROCESS FOR PRODUCING RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR

NITTO DENKO CORPORATION, ...

1. A process for producing a resin composition for an optical semiconductor from a powdery material and a liquid material
using a kneader having a first supply port and a secondary supply port disposed at a downstream side of the first supply port,
the process comprising:
a step of supplying the powdery material into the kneader from the first supply port and delivering the powdery material to
a second supply port side by the kneader at a temperature at which the powdery material is not melted;

a step of melting the powdery material by heating and simultaneously supplying the liquid material from the second supply
port under a pressure higher than a pressure in the kneader to knead a melted product of the powdery material and the liquid
material; and

a step of further kneading a kneaded product thereof while cooling.

US Pat. No. 9,251,818

SUSPENSION BOARD WITH CIRCUITS FOR ACCURATE POSTURE ANGLE ADJUSTMENT, AND METHOD FOR MANUFACTURING THE SAME

NITTO DENKO CORPORATION, ...

1. A suspension board with circuits, comprising:
a support substrate formed of a conductive material;
an insulating layer that is formed on the support substrate, and includes a plurality of first portions, each having a first
thickness and at least one second portion, each having a second thickness smaller than the first thickness; and

a wiring trace formed to extend on the plurality of first portions and the at least one second portion of the insulating layer;
wherein

a boundary surface is formed between an upper surface of each of the plurality of first portions and an upper surface of each
of the at least one second portion, a boundary line between the upper surface of each of the plurality of first portions and
the boundary surface extends in a first direction, and a lateral side of the wiring trace extends in a second direction that
intersects with the first direction,

the wiring trace being formed on an upper surface of the insulating layer such that the second direction forms an angle of
not less than 60 degrees and not more than 90 degrees with the first direction,

the insulating layer alternately including the plurality of first portions and the at least second portion in the second direction,
and

wherein the plurality of first portions and the at least one second portion include a common, uniform, and flat lower surface.

US Pat. No. 9,301,386

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

NITTO DENKO CORPORATION, ...

1. A printed circuit board, comprising:
a first insulating layer;
a differential transmission path composed of first and second transmission lines; and
a ground conductor layer, wherein
said ground conductor layer, said first insulating layer and said differential transmission path are stacked such that said
ground conductor layer is opposite to said differential transmission path with said first insulating layer sandwiched therebetween,

a spacing between said first and second transmission lines at one part of said differential transmission path is smaller than
a spacing between said first and second transmission lines at another part of said differential transmission path,

said ground conductor layer including first and second conductor layers,
said first conductor layer being formed to overlap the one part and the other part of said differential transmission path,
said second conductor layer being formed to overlap the other part of said differential transmission path and not to overlap
the one part of said differential transmission path,

said second conductor layer being stacked on said first conductor layer so as to come into contact with said first conductor
layer, and

a thickness of a part of said ground conductor layer overlapping said one part of said differential transmission path is smaller
than a thickness of another part of said ground conductor layer overlapping the other part of said differential transmission
path.

US Pat. No. 9,274,273

OPTO-ELECTRIC HYBRID BOARD

NITTO DENKO CORPORATION, ...

1. An opto-electric hybrid board, comprising:
an electric circuit board including an insulative layer having front and back surfaces, electrical interconnect lines formed
on the front surface of the insulative layer, and an insulative interconnect line cover layer formed on the front surface
of the insulative layer and for covering and protecting the electrical interconnect lines; and

an optical waveguide including a cladding layer having a front surface, and cores formed in a pattern on the front surface
of the cladding layer,

wherein the electric circuit board and the optical waveguide are stacked together, with the cladding layer being in direct
contact with the back surface of the insulative layer,

wherein part of the opto-electric hybrid board is defined as a to-be-bent portion in which the interconnect line cover layer
and the optical waveguide are disposed in non-overlapping relation, and

wherein the interconnect line cover layer and the optical waveguide are disposed in overlapping relation in portions other
than the to-be-bent portion.

US Pat. No. 9,222,690

VENTILATION MEMBER

Nitto Denko Corporation, ...

1. A ventilation member attachable to a housing having an opening portion for ventilation, the ventilation member comprising:
a cylindrical support body having a through hole serving as an air passage between an interior space and an exterior space
of the housing;

an air-permeable membrane closing the through hole;
a cover body provided at a position facing the air-permeable membrane so as to protect the air-permeable membrane; and
a column portion provided between the cover body and the support body, the column portion being formed integrally with both
the cover body and the support body so as to fix the cover body to the support body,

wherein
the through hole includes (a) a first portion having a relatively large inner diameter and (b) a second portion having a relatively
small inner diameter,

an annular ridge portion is formed on an outer peripheral surface of the support body along a circumferential direction of
the support body,

the column portion is located on an annular open end face of the second portion of the through hole,
in a plane view of an opening of the second portion, the column portion has a bridge shape extending from a first position
on the open end face of the second portion to a second position on the open end face of the second portion so that the opening
of the second portion is divided into two or more sections by the column portion, and

(i) when the housing has, as the opening portion, a nozzle opening portion projecting from a surface of the housing, the ventilation
member can be attached to the housing by fitting the support body onto the nozzle opening portion so that an inner peripheral
surface of the support body in the first portion is in close contact with an outer peripheral surface of the nozzle opening
portion, and (ii) when the housing has, as the opening portion, a recess opening portion recessed from the surface of the
housing, the ventilation member can be attached to the housing by fitting the support body into the recess opening portion
so that the ridge portion is in close contact with an inner peripheral surface of the recess opening portion.

US Pat. No. 9,313,880

PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD ASSEMBLY SHEET AND METHOD OF MANUFACTURING THE SAME

NITTO DENKO CORPORATION, ...

1. A printed circuit board comprising:
a support substrate having a first opening;
a base insulating layer formed on said support substrate to cover said first opening, the base insulating layer having a recess
which overlaps the first opening, the recess having an open upper end and a closed bottom surface;

a conductor pattern formed on said base insulating layer;
a metal layer formed on said base insulating layer to surround the recess of said base insulating layer, a second opening
formed in the metal layer, the second opening overlapping the recess; and

ink applied to at least a portion of the closed bottom surface of the recess.

US Pat. No. 9,301,406

WIRED CIRCUIT BOARD

NITTO DENKO CORPORATION, ...

10. A wired circuit board, comprising:
a metal supporting layer;
a first insulating layer formed on the metal supporting layer;
a conductive layer formed on the first insulating layer;
a second insulating layer formed on the first insulating layer so as to cover the conductive layer; and
a ground layer formed on the second insulating layer,
wherein the first insulating layer is formed with a first opening extending therethrough in a thickness direction,
wherein the second insulating layer is formed with a second opening extending therethrough in the thickness direction to correspond
to the first opening,

wherein the first opening is surrounded by the second opening when projected in the thickness direction, and the ground layer
fills the first opening via the second opening so as to come in contact with an upper surface of the metal supporting layer,

wherein the first insulating layer comprises a first stepped portion which is a surrounding area of the first opening, the
second insulating layer comprises a second stepped portion which is a surrounding area of the second opening, and the first
stepped portion and the second stepped portion form a two-leveled stepped portion which stepwise descends inwardly, and

wherein the ground layer is formed so as to be inwardly recessed from the second stepped portion along a peripheral side surface
of the second opening in the second insulating layer, then, in the second opening, formed along a surface of the first stepped
portion, subsequently, formed so as to be recessed along a peripheral side surface of the first opening in the first insulating
layer, and thereafter, formed on the upper surface of the metal supporting layer exposed from the first opening.

US Pat. No. 9,281,107

RARE-EARTH PERMANENT MAGNET AND METHOD FOR MANUFACTURING RARE-EARTH PERMANENT MAGNET

NITTO DENKO CORPORATION, ...

1. A manufacturing method of a rare-earth permanent magnet comprising steps of:
milling magnet material into magnet powder:
preparing a mixture by mixing the magnet powder and any one of three kinds of binders
a binder made of a long-chain hydrocarbon
or
a binder made of a polymer or a copolymer consisting of one or more kinds of monomers selectable from possible monomers expressed
with a general formula (2)


(R1 and R2 represent a hydrogen atom, a lower alkyl group, a phenyl group or a vinyl group)

or
a binder obtained by mixing the long-chain hydrocarbon and either the polymer or the copolymer;
obtaining a green sheet by forming the mixture into a sheet-like shape, the mixture is formed by employing a hot melt coating
in which the mixture is heated to melt, and turns into a fluid state and then is spread;

removing the binder by holding the green sheet for a predetermined length of time at binder decomposition temperature in a
non-oxidizing atmosphere so that a residual carbon content contained in the permanent magnet after sintering is 1500 ppm or
less and a residual oxygen content contained in the permanent magnet after sintering is 2000 ppm or less; and

sintering the green sheet from which the binder has been removed by raising temperature up to sintering temperature.

US Pat. No. 9,275,778

PERMANENT MAGNET AND METHOD FOR MANUFACTURING THE SAME

NITTO DENKO CORPORATION, ...

1. A method for manufacturing a permanent magnet, said method comprising:
a step of wet-mixing a Dy compound precursor or a Tb compound precursor with a magnet raw material in the form of a powder
in a solvent;

a step of adding a resin binder to the magnet raw material coated with the Dy compound precursor or the Tb compound precursor;
a step of producing a slurry by kneading the magnet raw material and the resin binder;
a step of molding the slurry into a sheet form to prepare a green sheet; and
a step of sintering the green sheet,
wherein the permanent magnet is a Nd—Fe—B-based permanent magnet comprising 27 to 30 weight % of Nd, 60 to 70 wt % of Fe,
and 1 to 2 weight % of B, and the Dy compound or the Tb compound is formed at the grain boundaries,

wherein the Dy compound precursor or Tb compound precursor is soluble in the solvent, and
wherein the Dy compound precursor or Tb compound precursor is an organic acid salt, an organic complex, or an organic metal
compound.

US Pat. No. 9,206,505

VACUUM FILM FORMATION METHOD AND LAMINATE OBTAINED BY THE METHOD

NITTO DENKO CORPORATION, ...

1. A method for continuously subjecting an elongated substrate to vacuum film formation, comprising the steps of:
(a) feeding an elongated first substrate wound in a roll form, from a first roll chamber in a first direction from the first
roll chamber toward a second roll chamber;

(b) degassing the first substrate fed in the first direction;
(c) forming a film of a second material on the degassed first substrate, using a target supported by a second cathode electrode
of a second film formation chamber;

(d) rolling up, in the second roll chamber, the first substrate having the second material film formed thereon, thereby producing
the second material film-formed first substrate;

(a?) feeding an elongated second substrate wound in a roll form, from the second roll chamber in a second direction from the
second roll chamber toward the first roll chamber, wherein the second substrate is different from the first substrate;

(b?) degassing the second substrate fed in the second direction;
(c?) forming a film of a first material on the degassed second substrate, using a target supported by a first cathode electrode
of a first film formation chamber; and

(d) rolling up, in the first roll chamber, the second substrate having the first material film formed thereon, thereby producing
the first material film-formed second substrate,

wherein:
in the first direction, the first cathode electrode of the first film formation chamber is removed from the first film formation
chamber during operation of the second film formation chamber, and removing the first cathode electrode comprises removing
the first cathode electrode through a first opening and closing a temporary cover over the first opening following removal
of the first cathode electrode; and

in the second direction, the second cathode electrode of the second film formation chamber is removed from the second film
formation chamber during operation of the first film formation chamber.

US Pat. No. 9,254,627

MANUFACTURING METHOD FOR TRANSPARENT SUBSTRATE

NITTO DENKO CORPORATION, ...

1. A manufacturing method for a transparent substrate, comprising:
a step A of applying a thermoplastic resin (A) composition solution onto a support backing having solvent permeability to
form an applied layer; wherein the thermoplastic resin (A) composition solution comprises a solvent and a thermoplastic resin
(A); then

a step B of attaching at least one surface of an inorganic glass and the applied layer to each other via an adhesive composition
to form a laminate; then

a step C of subjecting the laminate to a first heat treatment to reduce an amount of the solvent to a predetermined amount;
and then

a step D of peeling the support backing from the laminate and then subjecting the resultant to a second heat treatment to
dry the applied layer, thereby forming a thermoplastic resin layer,

wherein the adhesive composition comprises a solvent, and the solvent in the adhesive composition exhibits the property of
dissolving thermoplastic resin (A) contained in the thermoplastic resin (A) composition solution.

US Pat. No. 9,246,063

PHOSPHOR ENCAPSULATING SHEET, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHOD THEREOF

NITTO DENKO CORPORATION, ...

1. A phosphor encapsulating sheet, for encapsulating a light emitting diode element, comprising, in order:
a first substrate, an encapsulating layer, a phosphor layer, and an adhesive layer,
wherein the adhesive layer is a layer for being adhered to a cover layer,
the encapsulating layer is in a B-stage and configured to be in direct contact with the light emitting diode element, and
the first substrate is peelable from the encapsulating layer.

US Pat. No. 9,223,165

DISPLAY PANEL DEVICE WITH TOUCH INPUT FUNCTION, OPTICAL UNIT FOR SAID DISPLAY PANEL DEVICE, AND PRODUCTION METHOD FOR SAME

NITTO DENKO CORPORATION, ...

1. A roll of an optical unit for producing a display panel device having a capacitive touch input function, said optical unit
comprising a combination of a touch panel laminate and a polarization functional laminate, said optical unit being formed
in an elongated shape and wound into a roll form;
wherein:
the touch panel laminate comprises
an optically transparent first substrate layer laminated to one surface of an optically transparent adhesive layer,
a first transparent electrically conductive layer laminated, through a first undercoat layer, to a surface of the first substrate
layer on a side opposite to the adhesive layer,

an optically transparent second substrate layer laminated to the other surface of the adhesive layer, and
a second transparent electrically conductive layer laminated, through a second undercoat layer, to a surface of the second
substrate layer on a side opposite side to the adhesive layer,

wherein each of the first and second transparent electrically conductive layers is patterned in a predetermined pattern; and
the polarization functional laminate comprises a layer comprised of at least a circular polarization element, the polarization
functional laminate being laminated, through an optically transparent adhesive layer, to one surface of the touch panel laminate
on a side having one of the first and second transparent electrically conductive layers,

wherein the optical unit further comprises a release liner peelably bonded, through an optically transparent adhesive layer,
to the other surface of the touch panel laminate on a side having a remaining one of the first and second transparent electrically
conductive layers, the adhesive layer bonding the release liner to the touch panel laminate therethrough being adhered to
the release liner with a weak peel force enough to be at least partly left on the side of the touch panel laminate in the
form of a layer when the release liner is peeled; and

wherein said touch panel laminate and said polarization functional laminate are bonded together to form an optical unit of
an elongated continuous form which is wound into a roll.

US Pat. No. 9,283,740

METHOD AND APPARATUS FOR SEQUENTIALLY LAMINATING OPTICAL FILM INCLUDING POLARIZING FILM, TO RECTANGULAR-SHAPED PANEL

NITTO DENKO CORPORATION, ...

1. A method of sequentially laminating a carrier film-attached optical film laminate to a rectangular-shaped panel having
a long side and a short side, using the optical film laminate which comprises an optical film including at least a polarizing
film having a thickness of 10 ?m or less,
and a carrier film attached to the optical film through an adhesive layer under a condition that an adhesion force of the
carrier film with respect to the adhesive layer is weaker than an adhesion force of the optical film with respect to the adhesive
layer, wherein the polarizing film has optical characteristics satisfying the following conditions:

P>?(100.929T?42.4?1)×100 (where T<42.3); and

P?99.9 (where T?42.3)

wherein T is a single layer transmittance, and P is a polarization rate, the method comprising the steps of:
sequentially forming a plurality of slits in the optical film laminate in a width direction thereof at lengthwise intervals
corresponding to one of the long and short sides of the panel, to extend from a surface of the optical film on a side opposite
to the carrier film to a depth reaching a surface of the carrier film adjacent to the optical film to thereby form an optical
film sheet supported by the carrier film, between lengthwisely adjacent two of the slits;

sequentially feeding a plurality of the panels to a lamination position;
feeding the optical film laminate having the slits formed therein, toward the lamination position, in such a manner that each
of the optical film sheets is fed in synchronization with a respective one of the panels being sequentially fed to the lamination
position; and

laminating each of the optical film sheets to a respective one of the panels through the adhesive layer, with peeling the
optical film sheet from the carrier film at a location sufficiently close to the lamination position that a leading end of
the optical film sheet is on the panel fed to the lamination position while a rear end of the optical film sheet is in contact
with the carrier film, while allowing the adhesive layer to be left on the side of the optical film sheet, while holding at
least the leading end of the optical film sheet in a moving direction thereof.

US Pat. No. 9,279,064

MANUFACTURING SEMICONDUCTOR DEVICE WITH FILM FOR FORMING PROTECTIVE LAYER

NITTO DENKO CORPORATION, ...

1. A method of manufacturing a semiconductor device, using a film for forming a protective layer on a bumped wafer in which
a low dielectric material layer is formed, the film for forming the protective layer comprising a support base, an adhesive
layer, and a thermosetting resin layer, laminated in this order, wherein
a melt viscosity of the thermosetting resin layer is 1×102 Pa·S or more and 2×104 Pa·S or less, and a shear modulus of the adhesive layer is 1×103 Pa or more and 2×106 Pa or less when a temperature of the thermosetting resin layer is in a range of 50 to 120° C., comprising the steps of:

pasting the film for forming the protective layer onto the bumped wafer in which the low dielectric material layer is formed
with the thermosetting resin layer serving as a pasting surface;

peeling the support base and the adhesive layer from the thermosetting resin layer;
forming the protective layer by thermally curing the thermosetting resin layer;
dicing the bumped water and the protective layer together;
picking up a semiconductor chip individualized by dicing;
and
adhering and fixing the semiconductor chip to an adherend; wherein
a thickness of the thermosetting resin layer before being cured to form the protective layer is 0.05 times or more and 0.9
times or less a bump height of the bumped wafer, wherein the bump height is a distance from a first end of a bump of a plurality
of bumps in the low dielectric material layer to a second end opposite the first end, and the bumps protrude from opposing
ends of the thermosetting resin layer.

US Pat. No. 9,255,719

VENTILATION MEMBER

Nitto Denko Corporation, ...

1. A ventilation member attachable to a housing having an opening portion for ventilation, the ventilation member comprising:
a cylindrical support body having a through hole serving as an air passage between an interior space and an exterior space
of the housing;

an air-permeable membrane closing the through hole;
a cover body provided at a position facing the air-permeable membrane so as to protect the air-permeable membrane; and
a column portion provided between the cover body and the support body, the column portion being formed integrally with both
the cover body and the support body so as to fix the cover body to the support body,

wherein
the through hole includes (a) a first portion having a relatively large inner diameter and (b) a second portion having a relatively
small inner diameter,

an annular ridge portion is formed on an outer peripheral surface of the support body along a circumferential direction of
the support body,

the column portion is located on an annular open end face of the second portion of the through hole,
in a plane view of an opening of the second portion, the column portion has a bridge shape extending from a first position
on the open end face of the second portion to a second position on the open end face of the second portion so that the opening
of the second portion is divided into two or more sections by the column portion, and

(i) when the housing has, as the opening portion, a nozzle opening portion projecting from a surface of the housing, the ventilation
member can be attached to the housing by fitting the support body onto the nozzle opening portion so that an inner peripheral
surface of the support body in the first portion is in close contact with an outer peripheral surface of the nozzle opening
portion, and (ii) when the housing has, as the opening portion, a recess opening portion recessed from the surface of the
housing, the ventilation member can be attached to the housing by fitting the support body into the recess opening portion
so that the ridge portion is in close contact with an inner peripheral surface of the recess opening portion.

US Pat. No. 9,227,812

ADHESIVE SHEET JOINING METHOD AND ADHESIVE SHEET JOINING APPARATUS

NITTO DENKO CORPORATION, ...

1. An adhesive sheet joining method of joining an adhesive sheet to a workpiece, the method comprising:
transporting the adhesive sheet while holding the adhesive sheet with a transporting mechanism, the adhesive sheet having
a separator attached thereto that is larger than the adhesive sheet;

separating the separator from the adhesive sheet by holding a portion of the separator protruding from a front end of the
adhesive sheet with a holder on a tip of an arm of a separating mechanism in front of the adhesive sheet in a standby state,
and by moving the holder in a direction crossing with respect to a surface of the adhesive sheet moving horizontally in a
transportation direction and moving the transporting mechanism in synchronization with movement of the holder in the transportation
direction while folding back the separator at an end of a supporting member contacting the separator as a starting point;
and

joining the adhesive sheet by transporting the adhesive sheet with the separator separated therefrom to the workpiece with
the adhesive sheet being held with the transporting mechanism.

US Pat. No. 9,224,953

METHOD AND APPARATUS FOR MANUFACTURING ORGANIC EL DEVICE

NITTO DENKO CORPORATION, ...

1. A method for manufacturing an organic EL device, in which constituent layers of an organic EL element are formed by deposition
over a substrate in the form of a strip, while the substrate is being moved in a longitudinal direction, the method comprising:
a constituent layer-forming step of performing deposition over one surface of the substrate, while the substrate is being
moved in the longitudinal direction, sequentially in at least first and second deposition units arranged along the moving
direction of the substrate by discharging a vaporized material from an evaporation source, wherein

the constituent layer-forming step comprises:
an upward deposition step of performing deposition over a deposition surface of the substrate, while the substrate is being
moved with its deposition surface facing downward, in the first and second deposition units by discharging the vaporized material
from the evaporation source arranged below the substrate toward the deposition surface; and

a direction changing step of turning the substrate conveyed from the first deposition unit, by means of a guide mechanism
provided between the first deposition unit and the second deposition unit, so that the deposition surface faces upward and
thereafter downward, while supporting the substrate from the non-deposition surface side so that the non-deposition surface
of the substrate faces the inside of the turn, so as to guide the substrate to the second deposition unit,

wherein the moving direction of the substrate viewed from above the first deposition unit within the first deposition unit
is a first direction and the moving direction of the substrate viewed from above the second deposition unit within the second
deposition unit is a second direction and the first direction and the second direction are different from each other.

US Pat. No. 9,250,724

INFORMATION MANAGEMENT SYSTEM

NITTO DENKO CORPORATION, ...

1. An information management system, comprising:
a personal computer having a display; and
an electronic underlay which capable of being laid under a sheet to perform writing with a writing tool,
wherein the electronic underlay specifies a movement locus of a tip of the writing tool on a surface of the sheet, outputs
the movement locus to the personal computer, and displays the movement locus on the display,

wherein the electronic underlay comprises:
a sheet-like optical waveguide in which a plurality of linear cores are arranged and formed in a lattice shape on the surface
of a sheet-like under cladding layer, an over cladding layer is formed in a sheet shape covering plurality of linear the cores,
and the surface of the over cladding layer is a contact surface with the sheet;

a light emitting element connected to a first end surface of the plurality of linear cores;
a light receiving element connected to a second end surface of the plurality of linear cores; and
movement locus specifying means for specifying a movement locus of a tip of a writing tool on a surface of the optical waveguide
based on a light propagation amount of the plurality of linear cores, the light propagation amount being changed due to the
movement,

wherein an elasticity modulus of the plurality of linear cores is larger than an elasticity modulus of the under cladding
layer and an elasticity modulus of the over cladding layer, and

wherein, in a state where the surface of the sheet-like optical waveguide is pressed by the tip of the writing tool, in a
direction of the pressing, a deformation ratio of the plurality of linear cores in a cross section is smaller than deformation
ratios of the over cladding layer and the under cladding layer in cross sections.

US Pat. No. 9,913,373

SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF

NITTO DENKO CORPORATION, ...

1. A suspension board with circuit capable of being mounted with a piezoelectric element, comprising:
a metal supporting board,
a conductor layer having a terminal capable of being electrically connected to the piezoelectric element and disposed above
the metal supporting board at spaced intervals thereto,

a first insulating layer disposed between the metal supporting board and the conductor layer so as to support the conductor
layer, and

a second insulating layer disposed on the first insulating layer and the conductor layer so as to expose the terminal, wherein
the first insulating layer includes
a first portion including the terminal viewed from a thickness direction of the metal supporting board, and
a second portion disposed in a position different from that of the first portion viewed from the thickness direction,
the second insulating layer includes
a third portion disposed on the first portion, and
a fourth portion disposed on the second portion,
the first portion is a recessed portion dented from an upper surface of the first insulating layer toward the metal supporting
board,

a thickness of the recessed portion is thinner than that of the second portion, and
the third portion is dented from an upper surface of the second insulating layer toward the metal supporting board so as to
fit the recessed portion.

US Pat. No. 9,453,951

RETARDATION FILM WEB, CIRCULARLY POLARIZING PLATE AND ORGANIC EL PANEL

NITTO DENKO CORPORATION, ...

1. A retardation film web, comprising:
a polycarbonate resin or a polyester carbonate resin,
wherein an orientation angle ? which is an angle between a slow axis and a width direction satisfies formula (1):
38°???52°  (I)
and
a ratio of an in-plane retardation R450 measured at a wavelength of 450 nm to an in-plane retardation R550 measured at a wavelength
of 550 nm satisfies formula (II):

R450/R550<1  (II),
wherein the polycarbonate resin or the polyester carbonate resin comprises a structural unit derived from a dihydroxy compound
having a cyclic ether structure.

US Pat. No. 9,293,387

FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE, DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND FLIP CHIP TYPE SEMICONDUCTOR DEVICE

NITTO DENKO CORPORATION, ...

1. A sheet for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected
onto an adherend,
wherein the sheet for flip chip type semiconductor back surface is a sheet before thermal curing and has, at the thermal curing
thereof, a volume contraction ratio within a range of 23° C. to 165° C. of 100 ppm/° C. to 400 ppm/° C.,

wherein a tensile storage elastic modulus of the sheet in an uncured state at 23° C. is 1 GPa or more, and
wherein the sheet after the thermal curing has a tensile storage elastic modulus at 23° C. within a range of 1 GPa to 5 GPa.
US Pat. No. 9,112,159

BIPOLAR HOSTS FOR LIGHT EMITTING DEVICES

Nitto Denko Corporation, ...

1. A host compound for use in emissive elements of organic light emitting devices, the compound being represented by a formula:
HT-Ph1-Ph2-ET

wherein Ph1 and Ph2 are independently optionally substituted o-phenylene; and

HT is optionally substituted 4-(phenylcarbazolyl)phenyl; and
ET is optionally substituted benzimidazol-2-yl, optionally substituted benzimidazol-2-ylphenyl, optionally substituted di(benzimidazol-2-yl)phenyl,
optionally substituted benzothiazol-2-ylphenyl, optionally substituted benzoxazol-2-ylphenyl, optionally substituted di(benzoxazol-2-yl)phenyl,
optionally substituted 3,3?-bipyridin-5-yl, optionally substituted quinolin-8-yl, optionally substituted quinolin-5-yl, or
optionally substituted quinoxalin-5-yl.

US Pat. No. 9,059,369

METHOD FOR MANUFACTURING TRANSPARENT CONDUCTIVE FILM

NITTO DENKO CORPORATION, ...

1. A method for manufacturing a transparent conductive film comprising:
a first step of laminating an amorphous layer formed of an indium-based complex oxide on a first side of a film base material
having a thickness of 10 to 50 ?m;

a second step of forming a transparent conductive layer by heating the film base material on which the amorphous layer is
laminated to 160° C. or above to crystallize the amorphous layer during a process of conveying the film base material from
a feed roller and taking up the film base material on a take-up roller; and

a third step of forming an adhesive layer on a second side of the film base material after the second step.

US Pat. No. 9,243,320

METHOD FOR DOUBLE-SIDE VACUUM FILM FORMATION AND LAMINATE OBTAINABLE BY THE METHOD

NITTO DENKO CORPORATION, ...

1. A method for continuously subjecting an elongated substrate to vacuum film formation, comprising the steps of:
a) unrolling and feeding an elongated substrate wound in a roll form from a first roll chamber in a first direction from the
first roll chamber toward a second roll chamber;

b) degassing the substrate fed in the first direction;
c) forming, in a first film formation chamber, a first material film on the first surface of the degassed substrate, wherein
a second surface of the substrate, opposite the first surface, is free of material layers in the second roll chamber;

d) guiding the substrate having the first material film formed thereon to a second film formation chamber in a second direction
from the second roll chamber toward the first roll chamber, and forming, in the second film formation chamber, a second material
film on the second surface when the substrate is being guided in the second direction;

e) taking up, in a third roll chamber provided between the first roll chamber and the second roll chamber, the substrate in
a roll form, the substrate having the first material film formed on the first surface and the second material film formed
on the second surface;

f) unrolling and feeding the substrate taken up in the third roll chamber from the first roll chamber in the first direction;
g) guiding the fed substrate to the first film formation chamber in the first direction, and forming, in the first film formation
chamber, a third material film on the first or the second surface of the substrate when it is being guided in the first direction;

h) guiding the substrate having the third material film formed thereon to the second film formation chamber in the second
direction, and forming, in the second film formation chamber, a fourth material film on the second or the first surface of
the substrate when it is being guided in the second direction; and

i) taking up, in the third roll chamber, the substrate in a roll form, the substrate having the third or fourth material film
laminated on the first material film on the first surface and the fourth or third material film laminated on the second material
film on the second surface.

US Pat. No. 9,351,934

CROSSLINKED GELATIN SUPPORT AND SUPPORT FOR CONTROLLED RELEASE OF PHYSIOLOGICALLY ACTIVE SUBSTANCE USING THE SAME

NITTO DENKO CORPORATION, ...

1. A crosslinked gelatin support, wherein a surface of a crosslinked gelatin is negatively charged and has a zeta potential
in ethanol of from ?3 to ?50 mV;
wherein the crosslinked gelatin has been further subjected to a decomposition treatment; and
wherein a content of water-soluble matter in the crosslinked gelatin before the decomposition treatment is from 15 to 50%
by weight and is increased to 25 to 75% by weight after the decomposition treatment.

US Pat. No. 9,299,945

TOP-EMITTING WHITE ORGANIC LIGHT-EMITTING DIODES HAVING IMPROVED EFFICIENCY AND STABILITY

NITTO DENKO CORPORATION, ...

1. A top-emission white organic light-emitting diode (OLED) comprising an emissive construct, wherein the emissive construct
comprises:
a fluorescent emissive layer comprising a first host material that emits blue light, wherein the fluorescent emissive layer
is undoped;

a phosphorescent emissive layer comprising a second host material;
a partial hole-blocking layer having a first thickness disposed between the fluorescent emissive layer and phosphorescent
emissive layer;

wherein the fluorescent emissive layer and the phosphorescent emissive layer define a recombination zone having a second thickness;
and

wherein the first thickness is less than about one-third of the second thickness.
US Pat. No. 9,096,782

POLYESTERS, POLYESTER COMPOSITIONS, PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS, PRESSURE-SENSITIVE ADHESIVE LAYERS AND PRESSURE-SENSITIVE ADHESIVE SHEETS

NITTO DENKO CORPORATION, ...

1. A polyester composition comprising:
50 to 99 parts by wight of a first polyester, and 1 to 50 by weight of a second polyester;
wherein the second polyester is a branched polyester oligomer having a hydroxyl value of 100 to 1,000 mgKOH/g, and
wherein the first polyester comprises at least a lactic acid unit, a dibasic acid unit and a glycol unit,
the dibasic acid unit contains dimer acid,
the first polyester contains 20-40 mol % of lactic acid unit, 30-40 mol % of the dibasic acid unit and 30-40 mol % of the
glycol unit; and

the first polyester has a glass transition temperature as measured at a temperature rising rate of 20° C./minute using a differential
scanning calorimeter, of ?50 to ?54° C., a weight average molecular weight of 9.2×104 to 28.5×104, a hydroxyl value of 2 to 9 mgKOH/g, an acid value of 0.6 mgKOH/g or less, and a dispersion degree (Mw/Mn) of 2.5 to 10.0.

US Pat. No. 9,351,942

PATCH AND PATCH PREPARATION

Nitto Denko Corporation, ...

1. A patch comprising a support and an adhesive layer on at least one surface of the support, wherein the adhesive layer comprises
poly(2-methylpropene) having a viscosity average molecular weight of 4,000,000-6,500,000, an organic fluid component having
high polarity, a tackifier, and magnesium aluminometasilicate,
wherein
the magnesium aluminometasilicate comprises an amorphous composite oxide of the formula:
Al2O3/aMgO/bSiO2·nH2O,

wherein a is 0.3-3 and b is 0.3-5,
the total content of magnesium aluminometasilicate in the adhesive layer is less than 25 wt % relative to the total weight
of the adhesive layer, and

the organic fluid component having high polarity has an angle within the range of 20°-80° as calculated by the following formula
using an inorganic value and an organic value in an organic conceptual diagram:

Angle[°]=arc tan(organic value/inorganic value)?1×(180/?).

US Pat. No. 9,287,473

EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME

NITTO DENKO CORPORATION, ...

4. The optical semiconductor device according to claim 3, wherein a region including the optical semiconductor element surrounded by the reflector is encapsulated with a silicone
resin.

US Pat. No. 9,219,015

PHOSPHOR LAYER-COVERED OPTICAL SEMICONDUCTOR ELEMENT, PRODUCING METHOD THEREOF, OPTICAL SEMICONDUCTOR DEVICE, AND PRODUCING METHOD THEREOF

NITTO DENKO CORPORATION, ...

1. A method for producing a phosphor layer-covered optical semiconductor element comprising:
a step of opposing a phosphor layer containing a phosphor to an optical semiconductor element;
an adjusting step of adjusting a color tone of light emitted from the optical semiconductor element and exited via the phosphor
layer by adjusting the thickness of the phosphor layer;

a calibration curve preparation step including:
a first measurement step of measuring a thickness of a first reference phosphor layer at the time of opposing the first reference
phosphor layer that is the same as the phosphor layer to the optical semiconductor element and a color tone of light emitted
from the optical semiconductor element and exited via the first reference phosphor layer; and

a second measurement step of measuring a thickness of a second reference phosphor layer at the time of opposing the second
reference phosphor layer that is the same as the phosphor layer to the optical semiconductor element so that the thickness
thereof is different from that of the first reference phosphor layer and a color tone of light emitted from the optical semiconductor
element and exited via the second reference phosphor layer; and

a calibration curve production step of producing a calibration curve based on the thickness and the color tone of the light
obtained from the calibration curve preparation step,

wherein, in the adjusting step, the thickness of the phosphor layer that corresponds to the color tone to be aimed at is obtained
based on the calibration curve and subsequently, the thickness of the phosphor layer is adjusted so as to have the thickness.

US Pat. No. 9,081,146

POLARIZING MEMBRANE AND POLARIZING FILM

NITTO DENKO CORPORATION, ...

1. A polarizing membrane, comprising a polyvinyl alcohol-based resin membrane containing a dichromatic substance, wherein
the polyvinyl alcohol-based resin membrane has an Nz coefficient of 1.10 or more and 1.50 or less.

US Pat. No. 9,053,846

PERMANENT MAGNET AND MANUFACTURING METHOD THEREOF

NITTO DENKO CORPORATION, ...

1. A manufacturing method of a permanent magnet comprising steps of
wet-milling magnet material in an organic solvent to obtain magnet powder;
adding, to the organic solvent during the wet-milling, an organometallic compound expressed with a structural formula of
M?(OR)x,

M including at least one of neodymium, praseodymium, dysprosium and terbium, each being a rare earth element, R representing
a substituent group consisting of a straight-chain or branched-chain hydrocarbon, and x representing an arbitrary integer,

to make the organometallic compound adhered to particle surfaces of the magnet powder in the organic solvent to obtain a slurry-state
magnet powder;

injecting the slurry-state magnet powder containing the organic solvent used in the wet-milling into a cavity without drying
the slurry-state magnet powder, while applying an initial magnetic field to the cavity, and further applying a magnetic field
stronger than the initial magnetic field to the cavity during or after the injection so as to perform wet molding and obtain
a compact body in which the organometallic compound is adhered to the particle surfaces of the magnet powder;

calcining the compact body in hydrogen atmosphere so as to obtain a calcined body of which carbon residue is reduced in comparison
with before calcining the compact body, wherein the step of calcining causes thermal decomposition of the organometallic compound
and removes R so as to reduce carbon residue; and

sintering the calcined body.

US Pat. No. 9,538,639

WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF

NITTO DENKO CORPORATION, ...

1. A wired circuit board, comprising:
a first insulating layer;
a first conductive layer including a first wire directly disposed on an upper surface of the first insulating layer;
a second insulating layer directly disposed on the upper surface of the first insulating layer so as to cover the first wire;
and

a second conductive layer including a second wire directly disposed on an upper surface of the second insulating layer, wherein
the second conductive layer includes:

a first terminal portion for electrically connecting the first wire to an outside; a second terminal portion for electrically
connecting the second wire to an outside; and a connection portion electrically connecting the first terminal portion and
the first wire, wherein the first terminal portion and the second terminal portion are disposed side by side on the upper
surface of the first insulating layer,

wherein the second conductive layer further includes a positioning mark for positioning a component to be mounted relative
to the wired circuit board,

and wherein the positioning mark has a generally annular shape in a plan view.

US Pat. No. 9,227,222

THIN POLARIZING FILM, OPTICAL LAMINATE WITH THIN POLARIZING FILM, AND PRODUCTION METHOD FOR THIN POLARIZING FILM

NITTO DENKO CORPORATION, ...

1. A thin polarizing film, which is produced by forming a polyvinyl alcohol-based resin layer on a thermoplastic resin substrate,
wherein the thin polarizing film has a thickness of 10 ?m or less, a single axis transmittance of 42.0% or more, a polarization
degree of 99.95% or more, and an iodine content of 17.6 grams per 400×700 square millimeters or less, which is measured by
an ion chromatography method.

US Pat. No. 9,150,716

RESIN FOAM AND FOAM SEALING MATERIAL

NITTO DENKO CORPORATION, ...

1. A resin foam having a thickness recovery ratio of 65% or more, wherein the thickness recovery ratio is defined as a ratio
of a thickness 1 second after releasing a compressed state to an initial thickness, when the resin foam is compressed for
1 minute in the thickness direction so as to give a thickness equal to 20% of the initial thickness in a 23° C. atmosphere;
and then the compressed state is released in a 23° C. atmosphere,
wherein the resin foam has an average cell diameter of 10 to 180 ?m, a repulsive stress at 50% compression of 0.1 to 3.0 N/cm2, and an apparent density of 0.01 to 0.10 g/cm3, wherein the repulsive stress at 50% compression is defined as a repulsive load when the resin foam is compressed in the
thickness direction so as to give a thickness equal to 50% of the initial thickness in a 23° C. atmosphere,

wherein a resin constituting the resin foam includes a thermoplastic resin, and
wherein the resin foam has a dynamic dustproofness expressed by less than 100 mm2 and less than 1500 Pixel×Pixel of the total particle area of both the particles adhering to the black acrylic sheet on the
side of the aluminum sheet and the particles adhering to the black acrylic sheet on the side of the cover plate.

US Pat. No. 9,116,380

DISPLAY PANEL DEVICE HAVING TOUCH INPUT FUNCTION

NITTO DENKO CORPORATION, ...

1. A display panel device having a capacitive touch input function, comprising a window, a capacitive touch panel laminate
and a display panel, the display panel device being characterized in that the touch panel laminate comprises: an optically
transparent first substrate layer; a pattern-shaped first transparent electrically conductive layer laminated to one surface
of the first substrate layer; and a pattern-shaped second transparent electrically conductive layer disposed to face the first
transparent electrically conductive layer across at least the first substrate layer, the first transparent electrically conductive
layer being disposed on a side closer to the window with respect to the first substrate layer, wherein:
at least two undercoat layers are disposed between the first transparent electrically conductive layer and the first substrate,
and including a near-side undercoat layer located at a side closer to the first transparent electrically conductive layer
which has a refractive index less than that of a far-side undercoat layer located at a side farther from the first transparent
electrically conductive layer, the near-side undercoat layer having a thickness less than that of the far-side undercoat layer;
and

a space between the window and one of the layers closest to the window is filled with an optically transparent adhesive.

US Pat. No. 9,095,064

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

NITTO DENKO CORPORATION, ...

1. A method of manufacturing a printed circuit board comprising the steps of:
laminating a base insulating layer on a metal support substrate such that a body region of said base insulating layer is positioned
on said metal support substrate and an auxiliary region of said base insulating layer projects toward the outside of said
metal support substrate;

forming a first wiring trace that is arranged to continuously extend on said body region and said auxiliary region of said
base insulating layer and forming a second wiring trace that is arranged to extend on said body region of said base insulating
layer;

forming a first cover insulating layer on said body region of said base insulating layer to cover a portion of said first
wiring trace and said second wiring trace on said body region of said base insulating layer, and forming a second cover insulating
layer on said auxiliary region of said base insulating layer to cover a portion of said first wiring trace on said auxiliary
region of said base insulating layer; and

bending said base insulating layer such that said body region and said auxiliary region overlap each other to cause the portion
of said first wiring trace on said auxiliary region to be opposite to a portion of said second wiring trace with said first
and second cover insulating layers sandwiched therebetween.

US Pat. No. 9,387,507

METHOD FOR MANUFACTURING WATER RESISTANT OPTICALLY ANISOTROPIC FILM, AND WATER RESISTANT OPTICALLY ANISOTROPIC FILM

NITTO DENKO CORPORATION, ...

1. A method for manufacturing a water resistant optically anisotropic film, comprising:
a water resistant treatment step of bringing an optically anisotropic film containing an organic dye having an anionic group
into contact with a water resistant treatment liquid containing a multivalent cationic compound and a monovalent cationic
compound;

wherein the mass ratio of the multivalent cationic compound and the monovalent cationic compound contained in the water resistant
treatment liquid, monovalent cationic compound/multivalent cationic compound, is 0.01 to 2.

US Pat. No. 9,340,681

RESIN FILM AND METHOD OF PRODUCING RESIN FILM

NITTO DENKO CORPORATION, ...

1. A resin film, comprising:
a substrate film; and
an antistatic layer formed on one side of the substrate film and comprising a binder resin, a cross-linking agent in an amount
of 1 part by weight to 30 parts by weight with respect to 100 parts by weight of the binder resin and a conductive material,

wherein:
the binder resin comprises a polyurethane-based resin;
the antistatic layer has an arithmetic average surface roughness Ra of 10 nm or more and 100 nm or less; and
the conductive material comprises a conductive polymer
wherein the antistatic layer is formed by applying a resin composition containing the binder resin and the cross-linking agent,
and drying the resin composition.

US Pat. No. 9,312,456

ENCAPSULATING SHEET AND OPTICAL SEMICONDUCTOR ELEMENT DEVICE

NITTO DENKO CORPORATION, ...

1. An encapsulating sheet comprising:
a release sheet formed from a resin film, and
an encapsulating resin layer formed on the release sheet and formed from an encapsulating resin composition, wherein the encapsulating
resin composition contains an encapsulating resin including an encapsulating silicone resin composition, and silicone microparticles,

the mixing ratio of the silicone microparticles with respect to the encapsulating resin composition is 20 to 50 mass %,
the silicone microparticles are microparticles of polysiloxanes having a cross-linked structure, and
the encapsulating resin is a transparent resin and is used to encapsulate an optical semiconductor element.

US Pat. No. 9,411,081

METHOD OF MANUFACTURING POLARIZING PLATE

NITTO DENKO CORPORATION, ...

1. A method of manufacturing a polarizing plate that comprises a polyester resin base and a polarizing film comprising a polyvinyl
alcohol resin laminated on the polyester resin base, the method comprising the steps of:
stretching a laminate that comprises a polyvinyl alcohol resin layer laminated on the polyester resin base;
dyeing the polyvinyl alcohol resin layer; and
crystallizing the polyester resin base, wherein crystallization is performed at a temperature higher than the glass transition
temperature of the polyester resin base,

wherein the crystallization step is performed after the dyeing step, and
wherein, in the crystallization step, the crystallization is performed so that the degree of crystallinity of the polyester
resin base, represented as the heat of fusion determined by differential scanning calorimetry, is in the range from 25 to
45 mJ/mg.

US Pat. No. 9,377,570

POLARIZING FILM WITH ADHESIVE LAYER AND IMAGE DISPLAY APPARATUS

NITTO DENKO CORPORATION, ...

1. A pressure-sensitive adhesive layer-attached polarizing film, comprising a polarizing film and a pressure-sensitive adhesive
layer provided on the polarizing film,
wherein the polarizing film comprises a polarizer with a thickness of 10 ?m or less and a transparent protective film or films
provided on one or both sides of the polarizer, and

the pressure-sensitive adhesive layer is formed from a pressure-sensitive adhesive composition containing a (meth)acryl-based
polymer (A) and an ionic compound (B).

US Pat. No. 9,373,797

COMPOUNDS FOR USE IN LIGHT-EMITTING DEVICES

NITTO DENKO CORPORATION, ...

1. A compound represented by a formula:

US Pat. No. 9,304,339

METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY PANELS

NITTO DENKO CORPORATION, ...

1. A method for continuously manufacturing an inspected liquid crystal display panel, comprising:
a continuous transport line for sequentially transporting a liquid crystal cell, the continuous transport line including a
first laminating station provided in the continuous transport line for applying a first polarizing plate unrolled from a first
roll of the first polarizing plate to a first side of the liquid crystal cell transported to the first laminating station,
a second laminating station provided in the continuous transport line downstream of the first laminating station for applying
a second polarizing plate unrolled from a second roll of the second polarizing plate to a second side of the liquid crystal
cell transported to the second laminating station to form a liquid crystal display panel, and an inspecting station provided
in the continuous transport line downstream of the second laminating station for optically inspecting the liquid crystal display
panel transported from the second laminating station along the continuous transport line to the inspecting station;

the method comprising:
transporting the liquid crystal cell sequentially along continuous transport line, wherein each liquid crystal cell has a
first substrate and a second substrate, respectively, which are opposite to one another, and the first substrate has a relatively
slower decay of electrostatic charge than the second substrate;

applying at the first laminating station the first polarizing plate unrolled from a first polarizing plate roll to the first
substrate of the liquid crystal cell transported to the first laminating station; then

applying at the second laminating station the second polarizing plate unrolled from a second polarizing plate roll to the
second substrate of the liquid crystal cell transported from the first laminating station along the continuous transport line
to the second laminating station, to thereby form the liquid crystal display panel; and then

optically inspecting at the inspecting station the liquid crystal display panel transported from the second laminating station
along the continuous transport line to the inspecting station;

wherein in the optically inspecting station, the liquid crystal display panel is irradiated with a transmitted light on one
side of the liquid crystal panel and then imaging the irradiated liquid crystal display panel without applying electric voltage
to the liquid crystal display panel.

US Pat. No. 9,202,795

LAMINATED FILM AND USE THEREOF

NITTO DENKO CORPORATION, ...

1. A laminated film for filling a space between semiconductor elements that are electrically connected through a member for
connection, the film comprising a dicing sheet in which a pressure-sensitive adhesive layer is laminated on a base material,
and a curable film that is laminated on the pressure-sensitive adhesive layer, wherein:
the curable film is configured to be peeled from the pressure-sensitive adhesive layer of dicing sheet;
the curable film has a lowest melt viscosity at 50 to 200° C. of 1×102 Pa·s to 1×104 Pa·s; and

a height X (?m) of the member for connection and a thickness Y (?m) of the curable film satisfy the following relationship:
1.0?Y/X?1.7.

US Pat. No. 9,159,598

SEMICONDUCTOR WAFER MOUNTING METHOD AND SEMICONDUCTOR WAFER MOUNTING APPARATUS

NITTO DENKO CORPORATION, ...

1. A semiconductor wafer mounting method for mounting a semiconductor wafer on a ring frame via a supporting adhesive tape,
comprising:
prior to generating a mount frame having the ring frame integrate with the semiconductor via the adhesive tape,
(A) discriminating a carrying-out object between the semiconductor wafer and a spacer;
(B) discriminating a protective tape from the semiconductor wafer; and
(C) discriminating a circuit surface of the semiconductor wafer;
wherein (B) is performed in accordance with the result of (A), (C) is performed in accordance with the result of (B), and
(A) to (C) are performed as follows:

(a) during transportation of the carrying-out object as the semiconductor wafer and the carrying-out object as the spacer
that are alternately stacked in a receiving container by a transport mechanism, detecting a front surface of the carrying-out
object by a first discrimination sensor and discriminating the carrying-out object between the semiconductor wafer and the
spacer in accordance with a detection result, thereby performing (A);

(b-1) determining whether or not a protective tape is on the front surface of the semiconductor wafer by detecting the front
surface of the semiconductor wafer with a first discrimination sensor, and

(b-2) when it is determined that the protective tape is not on the front surface of the semiconductor wafer, detecting a back
surface of the semiconductor wafer with a second discrimination sensor to determine whether or not the protective tape is
on the back surface of the semiconductor wafer, thereby performing (B), and

(c) when it is determined from the detection performed in (B) by the second discrimination sensor that the protective tape
is not on the back surface of the semiconductor wafer,

comparing the detection results of the front and back surfaces of the semiconductor wafer and determining a circuit surface
thereof, thereby performing (C);

(D) after performing (A) to (C), placing the semiconductor wafer having the surface with the protective tape or the circuit
surface directed downward by the transport mechanism onto an alignment stage and aligning the semiconductor wafer with the
alignment stage,

(E) joining the supporting adhesive tape over both the surface of the semiconductor wafer that is directed upward and the
ring frame with a tape joining mechanism,

(F) reversing the semiconductor wafer with the protective tape, placing the semiconductor wafer on a holding table by the
transport mechanism, and separating the protective tape from the semiconductor wafer with a separating mechanism;

(G) collecting only the mount frame from which the protective tape is separated; and
(H) transporting the spacer discriminated in (A) into a spacer-collecting section by the transport mechanism.

US Pat. No. 9,089,930

SURFACE PROTECTION SHEET FOR LASER MATERIAL PROCESSING

NITTO DENKO CORPORATION, ...

1. A method for preventing development of a dross on a surface opposite to a laser beam irradiation face of a stainless steel
plate during a laser cutting process, comprising: providing a stainless steel plate having a surface protection sheet adhered
to a surface of the stainless steel plate on an opposite side of a face of the stainless steel plate to be subjected to a
laser beam irradiation, which sheet comprises a substrate layer and an adhesive layer formed on one surface of the substrate
layer, wherein the substrate layer is made of at least one resin material selected from the group consisting of poly(ethylene
terephthalate) and low density polyethylene, wherein the resin material has a melt viscosity measurement based on JIS K7199
(1999) at 290° C. of 20-100 Pa·s, wherein the substrate layer has a thickness of 0.02-0.05 mm, and cutting by irradiation
process of a laser beam from a carbon dioxide gas laser on the stainless steel plate while blowing 0.5-1.5 MPa assist gas,
wherein the surface protection layer sheet together with the stainless steel plate are cut during the cutting process, and
wherein a height of the dross is suppressed to 0.5 mm or less.

US Pat. No. 9,190,584

OPTICAL-SEMICONDUCTOR DEVICE

NITTO DENKO CORPORATION, ...

1. An optical-semiconductor device comprising
a substrate,
an optical-semiconductor element on the substrate,
a compression molded body comprising a two-step cured encapsulating resin layer comprising a condensation-addition curing
type silicone resin in an amount of 50% or more of components constituting the encapsulating layer, and a wavelength conversion
layer containing light wavelength-converting particles,

wherein the wave conversion layer is laminated directly or indirectly on said encapsulating resin layer,
the encapsulating resin layer embeds the optical-semiconductor element,
the wavelength conversion layer is not present in a side surface of said molded body, and
the optical-semiconductor device satisfies the following formulae (I) and (II) when a thickness of the encapsulating resin
layer is regarded as (X) (mm), an area of the sheet for optical-semiconductor element encapsulation necessary for encapsulating
one optical-semiconductor element is regarded as (Y) (mm2) and an area of an upper part of the optical-semiconductor element is regarded as (A) (mm2):

0.5?X?2.0  (I)

{X×tan(75°)}2×?+A?Y?{X×tan(80°)}2×?+A  (II).

US Pat. No. 9,182,522

HARD COAT FILM, POLARIZING PLATE, IMAGE DISPLAY DEVICE, AND METHOD FOR PRODUCING HARD COAT FILM

NITTO DENKO CORPORATION, ...

1. A hard coat film, comprising:
a transparent film; and
a hard coat layer provided on the transparent film;
wherein an interface that can be detected by a reflection spectrum analysis exists between the transparent film and the hard
coat layer, and a refractive index continuously varies in the thickness direction in a region from the interface to a thickness-wise
middle part of the hard coat layer without forming an interface that can be detected by the reflection spectrum analysis.

US Pat. No. 9,147,625

THERMOSETTING RESIN SHEET FOR SEALING ELECTRONIC COMPONENT, RESIN-SEALED TYPE SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING RESIN-SEALED TYPE SEMICONDUCTOR DEVICE

NITTO DENKO CORPORATION, ...

1. A thermosetting resin sheet for sealing an electronic component, comprising one or more resin components and an inorganic
filler, wherein one of the resin components is a thermoplastic resin, and the thermosetting resin sheet has a content by percentage
of the thermoplastic resin of a nonzero percentage which is not more than 30% by weight of all of the resin components,
wherein a content by percentage of the inorganic filler is from 70% to 95% by weight of the thermosetting sheet,
wherein after the thermosetting resin sheet is bonded onto a silicon nitride film formed on a silicon wafer and then set,
the thermosetting resin sheet has a shear adhesive strength of 15 MPa or more at 25° C., and 2 MPa or more at 260° C.,

wherein after the thermosetting resin sheet is bonded onto a copper plate and then set, the thermosetting resin sheet has
a shear adhesive strength of 10 MPa or more at 25° C., and 0.5 MPa or more at 260° C.,

wherein after the thermosetting resin sheet is bonded onto a glass fabric based epoxy resin substrate and then set, the thermosetting
resin sheet has a shear adhesive strength of 10 MPa or more at 25° C., and 1 MPa or more at 260° C., and

wherein the thermosetting resin sheet further comprises a curing promoter.
US Pat. No. 9,142,818

BATTERY SEPARATOR AND BATTERY USING THE SAME

NITTO DENKO CORPORATION, ...

1. A battery separator comprising:
a porous substrate; and
a layer of a crosslinked polymer supported on at least one surface of the porous substrate, wherein the crosslinked polymer
is obtained by reacting

(a) a reactive polymer having a reactive group containing a hydroxy group with
(b) a polycarbonate urethane prepolymer in which two ends thereof are terminated by an isocyanate group,
the polycarbonate urethane prepolymer is obtained by reacting an aliphatic polycarbonate diol having hydroxy groups with a
polyfunctional isocyanate having isocyanate groups, wherein a molar ratio of the isocyanate groups possessed by the polyfunctional
isocyanate to the hydroxy groups possessed by the polycarbonate diol is in a range of 1.2 to 3.3.

US Pat. No. 9,142,332

TRANSPARENT CONDUCTIVE FILM

NITTO DENKO CORPORATION, ...

1. A transparent conductive film comprising:
a film substrate having two main surfaces; and
a transparent conductor layer formed on one main surface of the film substrate,
wherein the transparent conductor layer is composed of three layers in which a first indium tin oxide layer, a second indium
tin oxide layer, and a third indium tin oxide layer are laminated in this order from the film substrate side,

the first indium tin oxide layer has a smaller tin oxide content than the second indium tin oxide layer, and the third indium
tin oxide layer has a smaller tin oxide content than the second indium tin oxide layer, and

wherein the first indium tin oxide layer has a thickness smaller than the second indium tin oxide layer and the third indium
tin oxide layer has a thickness smaller than the second indium tin oxide layer wherein the first indium tin oxide layer has
a tin oxide content of 1% by weight to 5% by weight, the second indium tin oxide layer has a tin oxide content of 6% by weight
to 15% by weight, and the third indium tin oxide layer has a tin oxide content of 1% by weight to 5% by weight.

US Pat. No. 9,056,941

PHOTOCURABLE RESIN COMPOSITION AND OPTICAL COMPONENT USING THE SAME

NITTO DENKO CORPORATION, ...

1. A photocurable resin composition comprising the following ingredients (A), (B), (C) and (D):
(A) a linear chain epoxy resin represented by the following general formula (1):
wherein m indicates an integer of from 2 to 10, and R1 and R2 each represent a hydrogen atom or a fluorine atom;
(B) an alicyclic epoxy resin having at least two epoxy groups in one molecule thereof;
(C) a phosphorus fluoride-based photopolymerization initiator; and
(D) an oxetane compound having at least one oxetanyl group in one molecule thereof, wherein
a content of ingredient (A) is within a range of from 10 to 75% by weight of all the resin ingredients in the composition,
a content of ingredient (B) is within a range of from 25 to 75% by weight of all the resin ingredients in the composition,
a content of ingredient (C) is within a range of from 0.01 to 7 parts by weight of all the resin ingredients in the composition,
and

a content of ingredient (D) is within a range of from 3 to 30% of all the resin ingredients.
US Pat. No. 9,508,971

GAS-PERMEABLE FILTER PROVIDED WITH OIL REPELLENCY

NITTO DENKO CORPORATION, ...

1. A gas-permeable filter provided with oil repellency, the gas-permeable filter comprising a porous membrane having a surface
coated with an oil-repellent agent, wherein
the porous membrane is a stretched polytetrafluoroethylene porous membrane, and
the oil-repellent agent comprises a linear fluorine-containing hydrocarbon group represented by —R1C5F10CH2C4F9, where R1 is an alkylene group having from 1 to 12 carbon atoms or a phenylene group.

US Pat. No. 9,417,369

RETARDATION FILM WEB, CIRCULARLY POLARIZING PLATE AND ORGANIC EL PANEL

NITTO DENKO CORPORATION, ...

1. A retardation film web, comprising:
a polycarbonate resin or a polyester carbonate resin,
wherein an orientation angle ? which is an angle between a slow axis and a width direction satisfies formula (1):
38°???52°  (I)
and
a ratio of an in-plane retardation R450 measured at a wavelength of 450 nm to an in-plane retardation R550 measured at a wavelength
of 550 nm satisfies formula (II):

R450/R550<1  (II),
wherein the polycarbonate resin or the polyester carbonate resin comprises a structural unit derived from a dihydroxy compound
having a cyclic ether structure.

US Pat. No. 9,331,307

METHOD FOR MANUFACTURING ORGANIC EL DEVICE AND ORGANIC EL DEVICE

NITTO DENKO CORPORATION, ...

1. A method for manufacturing an organic EL device, comprising:
sequentially forming an insulating layer, a first electrode layer, an organic layer having at least a light emitting layer
as an organic constituent layer, a second electrode layer, and a sealing layer, on one surface of a strip-shaped metal substrate;
and thereby

manufacturing the organic EL device having a portion in which the first electrode layer, the organic layer, and the second
electrode layer overlap and which serves as a light emitting part, wherein

while the first electrode layer and the second electrode layer are prevented from being in contact with each other,
the first electrode layer, the organic layer, and the second electrode layer are formed so that both end edges of the organic
layer in a longitudinal direction of the substrate are covered by both end sides of the second electrode layer in the longitudinal
direction, on at least both outer sides of the light emitting part in the longitudinal direction of the substrate, by allowing
the organic layer to protrude from the first electrode layer toward at least both outer sides of the substrate in the longitudinal
direction and further allowing the second electrode layer to protrude from the organic layer toward at least both outer sides
of the substrate in the longitudinal direction.

US Pat. No. 9,297,931

POLARIZING FILM, IMAGE DISPLAY DEVICE, AND METHOD FOR PRODUCING POLARIZING FILM

NITTO DENKO CORPORATION, ...

1. A polarizing film comprising a disazo compound represented by the following general formula (1):

wherein Q2 represents a naphthylene group having at least one —SO3M group; X represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, a thioalkyl group
having 1 to 4 carbon atoms, a halogeno group, or a polar group; subscript k denotes the number of substitutions of X and represents
an integer of 0 to 5; M represents a counter ion, where when k is an integer of 2 or more, Xs are the same or different; and
Q1 represents a phenyl group represented by the following general formula (Q1-1):


wherein Y represents a substituent consisting of an acyclic structure other than the —SO3M group; subscript m denotes the number of substitutions of Y and represents an integer of 0 to 4; and subscript l denotes
the number of substitutions of the —SO3M group and represents an integer of 1 to 5, where 1?l+m?5, and when m is 2 or more, Ys are the same or different, and

wherein the disazo compound is a component of the polarizing film.

US Pat. No. 9,287,738

POWER SUPPLIER AND RECEIVER AND MOBILE DEVICE

NITTO DENKO CORPORATION, ...

1. A power-receiving/supplying device comprising:
a coil module configured to receive and supply power from and to another coil module by a resonance phenomenon; and
an electronic component provided in a magnetic field space which is formed by the resonance phenomenon to have a low magnetic
field strength,

the coil module including:
a resonance coil which is resonated with said another coil module; anda power-receiving/supplying coil which partly overlaps the resonance coil in a coil diameter direction and is configured to
receive and supply power from and to the resonance coil, the magnetic field space being formed at a predetermined position
between or around said another coil module and the coil module to have a lower magnetic field strength than a magnetic field
in parts around the predetermined position, by causing a magnetic field generated around the coil module and a magnetic field
generated around said another coil module to cancel each other out.

US Pat. No. 9,385,284

PHOSPHOR REFLECTING SHEET, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHOD THEREOF

NITTO DENKO CORPORATION, ...

1. A phosphor reflecting sheet, for providing a phosphor layer on one side in a thickness direction of a light emitting diode
element and providing a reflecting resin layer at the side of the light emitting diode element, comprising:
the phosphor layer is continuous without a space in a direction perpendicular to the thickness direction,
the reflecting resin layer is provided on an upper surface of the phosphor layer and is provided with a plurality of through
holes,

side surfaces of the reflecting resin layer around each through hole of the plurality of through holes are exposed,
the upper surface of the phosphor layer is exposed from each through hole of the plurality of through holes, and
a release substrate is provided on a lower surface of the phosphor layer,
wherein the reflecting resin layer is in a semi-solid state, and
the release substrate is made of a resin material, has a thickness of 10 to 1000 ?m, is flexible, and is configured to curvilinearly
peel off from the phosphor layer.

US Pat. No. 9,346,652

FILM WINDING CORE, AND WOUND FILM BODY USING SAME

Nitto Denko Corporation, ...

1. A film winding core on which a long film is to be wound, comprising:
a tubular bearing portion into which a shaft used to rotate the film winding core is to be inserted;
a plurality of blade portions provided respectively at a plurality of positions in a rotational direction of the bearing portion,
the plurality of blade portions respectively extending outwardly from the bearing portion so as to partition a space around
the bearing portion in the rotational direction;

a plurality of film supporting portions respectively provided at positions outward from leading edges of the blade portions,
the plurality of film supporting portions having an outwardly protruding shape so that the film is supported away from the
film winding core between the film supporting portions that are adjacent to each other in the rotational direction, and

a rim portion located on the leading edges of the blade portions, the rim portion having a tubular shape that surrounds the
bearing portion in the rotational direction, wherein

the film supporting portions are fixed to the rim portion,
the rim portion is fixed to the bearing portion by the blade portions,
each of the blade portions has a rectangular plate shape, the rim portion is located on one side of the blade portions, and
the bearing portion is located on another side of the blade portions,

both the film supporting portions and the blade portions extend from one side of the bearing portion to another side of the
bearing portion in a direction parallel to a rotational axis of the film winding core, and

the bearing portion, the blade portions, the rim portion, and the film supporting portions have a same length in the direction
parallel to the rotational axis.

US Pat. No. 9,328,086

SUBSTITUTED BIPYRIDINES FOR USE IN ORGANIC LIGHT-EMITTING DEVICES

NITTO DENKO CORPORATION, ...

1. A compound represented by Formula 2:

wherein each Ph is independently optionally substituted phenyl;
n and m are independently 0, 1, or 2;
Hcy1 is optionally substituted carbazolyl, optionally substituted diphenylamine, optionally substituted benzimidazolyl, optionally
substituted benzothiazolyl, or optionally substituted benzoxazolyl;

Hcy2 is optionally substituted benzimidazolyl, optionally substituted benzothiazolyl, or optionally substituted benzoxazolyl; and

R1, R2, R3, R4, R5, and R6 are independently selected from the group consisting of H, optionally substituted C1-12 alkyl, and optionally substituted phenyl.

US Pat. No. 9,295,728

CO-POLYMER CONJUGATES

NITTO DENKO CORPORATION, ...

13. A polymer conjugate comprising a recurring unit of Formula (I), a recurring unit of Formula (II), and a recurring unit
of Formula (III):

wherein:
each A1 and each A2 are independently oxygen or NR5, wherein R5 is hydrogen or C1-4 alkyl;

each R1 and each R2 are independently selected from the group consisting of hydrogen, a C1-10 alkyl group, a C6-20 aryl group, ammonium, an alkali metal, and a compound that comprises an anti-cancer drug, provided that at least one of R1 and R2 is a compound that comprises an anti-cancer drug;

each R3 and each R4 are independently selected from the group consisting of hydrogen, a C1-10 alkyl group, a C6-20 aryl group, ammonium, and an alkali metal; and

each R6 is independently selected from the group consisting of:

with the proviso that at least one R6 is
and at least one other
R6 is selected from the group consisting of:


US Pat. No. 9,226,395

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

NITTO DENKO CORPORATION, ...

1. A printed circuit board comprising:
a first insulating layer that has first and second surfaces and includes a first portion and a second portion having a smaller
thickness than a thickness of said first portion;

a conductor layer that is formed on said first surface of said first insulating layer and has a predetermined pattern; and
a reinforcing layer that is formed in a partial region on said first surface of said first insulating layer so as to overlap
with a first boundary portion of a boundary between said first portion and said second portion, wherein said reinforcing layer
is an insulating layer being in contact with said first surface of said first insulating layer, and

at least part of said conductor layer is formed in another region excluding said partial region on one surface of said first
insulating layer so as to overlap with a second boundary portion, which is different from the first boundary portion, of the
boundary between said first portion and said second portion; a support substrate that is provided on said second surface of
said first insulating layer to support said first insulating layer, wherein

said conductor layer is configured to be electrically connectable to a magnetic head.

US Pat. No. 9,196,533

FILM FOR BACK SURFACE OF FLIP-CHIP SEMICONDUCTOR, DICING-TAPE-INTEGRATED FILM FOR BACK SURFACE OF SEMICONDUCTOR, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND FLIP-CHIP SEMICONDUCTOR DEVICE

NITTO DENKO CORPORATION, ...

1. A method for manufacturing a semiconductor device comprising:
a step of sticking a semiconductor wafer onto a film for back surface of flip-chip semiconductor in a dicing tape-integrated
film for back surface of semiconductor;

wherein the dicing tape-integrated film for back surface of semiconductor comprises a dicing tape including a base material
and a pressure-sensitive adhesive layer laminated on the base material, and the film for back surface of flip-chip semiconductor
laminated on the pressure-sensitive adhesive layer, and

wherein an amount of shrinkage of the film for back surface of flip-chip semiconductor due to thermal curing is 2% by volume
or more and not more than 30% by volume relative to a total volume of the film for back surface of flip-chip semiconductor
before the thermal curing;

a step of dicing the semiconductor wafer to form a semiconductor element;
a step of peeling off the semiconductor element together with the film for back surface of flip-chip semiconductor from the
pressure-sensitive adhesive layer of the dicing tape; and

a step of flip-chip connecting the semiconductor element onto an adherend,
wherein the step of flip-chip connection includes a step of encapsulating an encapsulating resin in a gap between the semiconductor
element flip-chip bonded onto the adherend and the adherend, followed by thermally curing the encapsulating resin and the
film for flip chip type semiconductor back surface simultaneously.

US Pat. No. 9,133,048

SEAWATER DESALINATION METHOD

Nitto Denko Corporation, ...

1. A seawater desalination method for obtaining freshwater from seawater by a reverse osmosis membrane treatment, the method
comprising the steps of:
obtaining ultrafiltration membrane-treated water by subjecting seawater to an ultrafiltration membrane treatment;
obtaining membrane bioreactor-treated water by subjecting organic wastewater to a membrane bioreactor treatment;
obtaining mixed water by mixing the ultrafiltration membrane-treated water and the membrane bioreactor-treated water;
obtaining ultraviolet irradiation-treated water by subjecting the mixed water to an ultraviolet irradiation treatment; and
subjecting the ultraviolet irradiation-treated water to a reverse osmosis membrane treatment.

US Pat. No. 9,102,875

EMISSIVE CERAMIC MATERIALS HAVING A DOPANT CONCENTRATION GRADIENT AND METHODS OF MAKING AND USING THE SAME

NITTO DENKO CORPORATION, ...

1. An emissive ceramic comprising a yttrium aluminum garnet (YAG) region and a dopant having a concentration gradient along
a thickness of the YAG region between a first surface and a second surface, wherein said concentration gradient comprises
a maximum dopant concentration, a first half-maximum dopant concentration, and a first slope at or near the first half-maximum
dopant concentration, wherein an absolute value of the first slope is in the range of about 0.001 and about 0.006 (at %/?m).

US Pat. No. 10,111,339

METHOD FOR PRODUCING WIRED CIRCUIT BOARD

NITTO DENKO CORPORATION, ...

1. A method for producing a wired circuit board including an insulating layer and a conductive pattern provided on one side face in a thickness direction of the insulating layer, the method including the steps of:a step (1), in which the insulating layer is provided, the insulating layer having the one side face including a flat face and an inclined face, the inclined face being inclined from the flat face toward the one side in the thickness direction,
a step (2), in which a metal thin film is provided on the flat face and the inclined face of the insulating layer,
a step (3), in which a photoresist is provided on the metal thin film,
a step (4), in which a photomask is disposed so that in the photoresist, a to-be-portion where the conductive pattern is to be provided and which is provided on the flat face is shielded from light and a portion other than the to-be-portion in the photoresist is not shielded, wherein the portion other than the to-be-portion in the photoresist includes, when projected in the thickness direction, the inclined face, and the photoresist is exposed to light through the photomask,
a step (5), in which the to-be-portion of the photoresist shielded from light by the photomask is removed to expose the metal thin film corresponding to the to-be-portion, and
a step (6), in which the conductive pattern is provided on the metal thin film exposed from the photoresist,
wherein when exposing the photoresist in the step (4), reflection is caused by the metal thin film positioned above the inclined face to reduce light toward the to-be-portion on the flat face.

US Pat. No. 9,642,262

METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD ASSEMBLY SHEET

NITTO DENKO CORPORATION, ...

1. A method of manufacturing a printed circuit board assembly sheet comprising a plurality of printed circuit boards, a support
frame configured to integrally support the plurality of printed circuit boards such that the plurality of printed circuit
boards are arranged at spacings, and a dummy trace portion provided in a region between at least one printed circuit board
on one end side and the support frame, the method comprising the steps of:
forming first insulating layers, which correspond to the plurality of printed circuit boards and the dummy trace portion,
on a support substrate;

forming a plurality of conductor traces on each of the first insulating layers corresponding to the plurality of printed circuit
boards and the first insulating layer corresponding to the dummy trace portion; and

forming second insulating layers on the first insulating layers to cover the plurality of conductor traces corresponding to
the plurality of printed circuit boards and the conductor trace corresponding to the dummy trace portion, respectively,

wherein each of the plurality of printed circuit boards is configured to be separated from the support frame, and the dummy
trace portion is configured not to be separated from the support frame,

wherein a groove is not formed in the first insulating layer in a region between adjacent conductor traces in the dummy trace
portion, and

wherein the step of forming the second insulating layers includes forming a groove in the second insulating layer in the region
between the adjacent conductor traces in the dummy trace portion.

US Pat. No. 9,392,685

TRANSPARENT CONDUCTIVE FILM AND TOUCH PANEL

NITTO DENKO CORPORATION, ...

1. A transparent conductive film comprising a transparent film base; at least one dielectric layer formed on a first main
surface of the transparent film base; and a transparent conductive layer formed on the dielectric layer, wherein
the transparent conductive layer is patterned;
a first main surface of the transparent conductive film has an arithmetical mean roughness Ra of 22 nm or more, and exposed
surface of the dielectric layer at a pattern-opening part has 140/mm2 to 550/mm2 of protrusions having heights of 250 nm or higher; and

a thickness of the dielectric layer is 50 nm or less.
US Pat. No. 9,366,900

ADHESIVE FOR POLARIZING PLATE, POLARIZING PLATE, METHOD FOR PRODUCING SAME, OPTICAL FILM, AND IMAGE DISPLAY DEVICE

NITTO DENKO CORPORATION, ...

1. A polarizing plate, comprising:
a polarizer;
an adhesive layer; and
a transparent protective film provided on at least one side of the polarizer with the adhesive layer interposed therebetween,
wherein

the adhesive layer has a refractive index of 1.47 to 1.54, and is made from an adhesive comprising a resin solution containing
a polyvinyl alcohol-based resin and at least one water-soluble silicate selected from the group consisting of water-soluble
lithium silicate, water-soluble sodium silicate, and water-soluble potassium silicate,

wherein the water-soluble lithium silicate has a molar SiO2/Li2O ratio of 2 to 8,

wherein the water-soluble sodium silicate has a molar SiO2/Na2O ratio of 4 to 5,

and wherein the water-soluble potassium silicate has a molar SiO2/K2O ratio of 2 to 5.

US Pat. No. 9,325,207

POWER SUPPLIER AND RECEIVER AND MOBILE DEVICE

NITTO DENKO CORPORATION, ...

1. A power-receiving/supplying device comprising:
a coil module configured to receive and supply power from and to another coil module by a resonance phenomenon; and
an electronic component provided in a magnetic field space which is formed by the resonance phenomenon to have a low magnetic
field strength,

the coil module including:
a resonance coil which is resonated with said another coil module; anda power-receiving/supplying coil which partly overlaps the resonance coil in a coil diameter direction and is configured to
receive and supply power from and to the resonance coil, the magnetic field space being formed at a predetermined position
between or around said another coil module and the coil module to have a lower magnetic field strength than a magnetic field
in parts around the predetermined position, by causing a magnetic field generated around the coil module and a magnetic field
generated around said another coil module to cancel each other out.

US Pat. No. 9,305,680

TRANSPARENT CONDUCTIVE FILM AND MANUFACTURING METHOD THEREFOR

NITTO DENKO CORPORATION, ...

1. A transparent conductive film, comprising
a flexible transparent base; and
a transparent conductive layer formed on the flexible transparent base and including a crystalline indium/tin composite oxide,
wherein a compressive residual stress of the transparent conductive layer is 0.7 to 2 GPa,
wherein the transparent conductive layer is formed by a sputtering method,
wherein the transparent conductive layer is crystallized by heating, and a dimensional change in at least one direction in
a plane of the layer with respect to a dimension before crystallization is ?0.3% to ?1.5%,

the flexible transparent base comprises a transparent substrate film and an undercoat layer, and
the undercoat layer comprises an organic substance or a mixture of an inorganic substance and an organic substance.

US Pat. No. 9,295,156

WIRED CIRCUIT BOARD

NITTO DENKO CORPORATION, ...

1. A wired circuit board, comprising:
a metal supporting layer;
a first insulating layer formed on a surface on one side of the metal supporting layer in a thickness direction thereof;
a conductive pattern formed on a surface on one side of the first insulating layer in the thickness direction; and
a second insulating layer formed on a surface on one side of the conductive pattern in the thickness direction, wherein
the first insulating layer includes a first opening which exposes a surface on the other side of the conductive pattern in
the thickness direction from the first insulating layer,

the second insulating layer includes a second opening which exposes the surface on one side of the conductive pattern in the
thickness direction from the second insulating layer and is located such that at least one part thereof overlaps the first
opening when projected in the thickness direction,

the conductive pattern has the surface on the other side thereof in the thickness direction which is exposed through the first
opening and configured as a first terminal portion, and the surface on one side thereof in the thickness direction which is
exposed through the second opening and configured as a second terminal portion, and

the metal supporting layer includes a third opening which exposes the first terminal portion and a covering portion of the
first insulating layer which covers the conductive pattern continued to the first terminal portion, and a reinforcing portion
located on a surface on the other side of the covering portion in the thickness direction and provided continuously from the
metal supporting layer,

wherein the reinforcing portion is a protruding portion which protrudes from an end edge of the third opening toward an interior
of the third opening.

US Pat. No. 9,244,307

MANUFACTURING METHOD FOR LIQUID CRYSTAL DISPLAY

NITTO DENKO CORPORATION, ...

1. A manufacturing method for a liquid crystal display panel including a liquid crystal cell and optical films arranged on
both sides of the liquid crystal cell,
the manufacturing method comprising the steps of:
cutting, while feeding a first optical film from an optical film roll, the optical film roll being obtained by slitting the
first optical film having an elongate shape, which includes a polarizing film having an absorption axis in its width direction,
the polarizing film including a polyvinyl alcohol-based resin film that contains a dichromatic substance and has an Nz coefficient
of 1.10 or more, so as to have a width corresponding to a pair of opposing sides of the liquid crystal cell, and by rolling
the slit first optical film, the first optical film in its width direction so as to have a length corresponding to another
pair of opposing sides of the liquid crystal cell;

cutting, while feeding a second optical film from an optical film roll, the optical film roll being obtained by slitting the
second optical film having an elongate shape, which includes a polarizing film having an absorption axis in its longitudinal
direction, so as to have a width corresponding to a pair of opposing sides of the liquid crystal cell, and by rolling the
slit second optical film, the second optical film in its width direction so as to have a length corresponding to another pair
of opposing sides of the liquid crystal cell;

bonding the cut first optical film onto one surface of the liquid crystal cell; and
bonding the cut second optical film onto another surface of the liquid crystal cell.

US Pat. No. 9,206,086

METHOD AND APPARATUS FOR SINTERING FLAT CERAMICS

NITTO DENKO CORPORATION, ...

1. A method of sintering a ceramic to produce a sintered ceramic plate, comprising:
heating a ceramic precursor material between a first mesh and a second mesh;
wherein at least a first portion of the ceramic precursor material contacts the first mesh and at least a second portion of
the ceramic precursor material contacts the second mesh during heating,

thereby producing a sintered ceramic plate;
wherein either or both of the first mesh and the second mesh comprise a heat conductive material;
wherein the ceramic is a translucent phosphor;
wherein the number of contact points between the first mesh and the ceramic precursor is greater than about 500 per square
inch; and

wherein the number of contact points between the second mesh and the ceramic precurser is greater than about 500 per square
inch.

US Pat. No. 9,206,424

MODULATION OF HSP47 EXPRESSION

NITTO DENKO CORPORATION, ...

1. A double stranded nucleic acid molecule having a structure (A2) set forth below:
(A2) 5? N1-(N)x-Z 3? (antisense strand)

3? Z?-N2-(N?)y-z? 5? (sense strand)

wherein each of N2, N and N? is independently an unmodified or modified ribonucleotide, or an unconventional moiety;

wherein each of (N)x and (N?)y is an oligonucleotide in which each consecutive N or N? is joined to the adjacent N or N? by
a covalent bond;

wherein each of x and y is independently an integer between 17 and 39;
wherein the sequence of (N?)y has complementarity to the sequence of (N)x and the sequence of (N)x has complementarity to
a consecutive sequence in a mRNA encoding hsp47;

wherein N1 is covalently bound to (N)x and is mismatched to the mRNA encoding hsp47; or is a complementary DNA moiety to the mRNA encoding
hsp47;

wherein N1 is a moiety selected from natural or modified uridine, deoxyribouridine, ribothymidine, deoxyribothymidine, adenosine or deoxyadenosine;

wherein z? may be present or absent, but if present is a capping moiety covalently attached at the 5? terminus of N2—(N?)y;

wherein each of Z and Z? is independently present or absent, but if present is independently 1-5 consecutive nucleotides,
consecutive non-nucleotide moieties or a combination thereof covalently attached at the 3? terminus of the strand in which
it is present; and

wherein the sense strand and the antisense strand comprise the oligonucleotides described as SERPINH1—45a (SEQ ID NOs: 98 and 165) or SERPINH1—51 (SEQ ID NOs: 101 and 168).

US Pat. No. 9,142,817

BATTERY SEPARATOR AND BATTERY USING THE SAME

NITTO DENKO CORPORATION, ...

1. A battery separator comprising:
a porous substrate; and
a layer of a crosslinked polymer supported on at least one surface of the porous substrate,
wherein the crosslinked polymer is obtained by reacting
(a) a reactive polymer having a first reactive group containing a hydroxy group and a second reactive group having cationic
polymerizability with

(b) a polycarbonate urethane prepolymer in which two ends thereof are terminated by an isocyanate group,
the polycarbonate urethane prepolymer is obtained by reacting an aliphatic polycarbonate diol having hydroxy groups with a
polyfunctional isocyanate having isocyanate groups, wherein a molar ratio of the isocyanate groups possessed by the polyfunctional
isocyanate to the hydroxy groups possessed by the polycarbonate diol is in a range of 1.2 to 3.3.

US Pat. No. 9,120,060

VENTILATION UNIT

Nitto Denko Corporation, ...

1. A ventilation structure comprising a ventilation unit and a housing,
the ventilation unit including:
a ventilation member that is attached to an opening of the housing, the ventilation member having a water-proof gas-permeable
membrane that covers the opening;

a sealing member that is pressed against the housing by the ventilation member and seals a gap between the housing and the
ventilation member; and

a washer that is pressed against the housing by the ventilation member, the washer being provided around the sealing member.

US Pat. No. 9,045,670

PRESSURE-SENSITIVE ADHESIVE SHEET

NITTO DENKO CORPORATION, ...

1. A pressure-sensitive adhesive sheet, having:
a total light transmittance of 85% or more;
a light transmittance at a wavelength of 380 nm of 5% or less; and
a haze of 3% or less,
wherein the pressure-sensitive adhesive sheet comprises a pressure-sensitive adhesive layer comprising a triazine-based ultraviolet
absorber and an acrylic polymer containing, as monomer units, at least one of an alkyl (meth)acrylate having a linear or branched
alkyl group and an alkoxyalkyl (meth)acrylate, a monomer containing a hydroxyl group in a molecule thereof, and a monomer
containing a nitrogen atom in a molecule thereof,

wherein a proportion of the monomer containing a nitrogen atom in a molecule thereof is 1 to 30 wt % based on total monomer
components (100 wt %) forming the acrylic polymer, and

wherein a content of the triazine-based ultraviolet absorber is 1 to 10 parts by weight relative to 100 parts by weight of
the acrylic polymer.

US Pat. No. 9,390,849

MAGNETIC ELEMENT FOR WIRELESS POWER TRANSMISSION AND POWER SUPPLY DEVICE

NITTO DENKO CORPORATION, ...

1. A magnetic element for wireless power transmission, which generates an induced electromotive force by magnetic coupling,
wherein:
in a cross section in a direction of the magnetic coupling, alternating conductor sections adapted to conduct an alternating
current and magnetic material sections are arranged in parallel in a direction perpendicular to the direction of the magnetic
coupling, wherein the conductor sections and the magnetic material sections are spiraled from an inner circumference side
to an outer circumference side; and

each of the conductor sections has at least one region protruding from the magnetic material section in the direction of the
magnetic coupling, or each of the magnetic material sections has at least one region protruding from the conductor section
in the direction of the magnetic coupling.

US Pat. No. 9,354,373

POLARIZING PLATE AND METHOD OF PRODUCING POLARIZING PLATE

NITTO DENKO CORPORATION, ...

1. A method of producing a polarizing plate, comprising:
stretching and dyeing a laminate including a resin substrate and a polyvinyl alcohol-based resin layer formed on one side
of the resin substrate to produce a polarizing film on the resin substrate;

laminating a first protective film on the polarizing film on an opposite side to the resin substrate; and
peeling the resin substrate, followed by laminating a second protective film on the polarizing film on a side from which the
resin substrate has been peeled,

the laminating of at least one of the first protective film and the second protective film being performed through an adhesive
having a moisture content of 10% or less.

US Pat. No. 9,295,949

VENTILATION MEMBER

Nitto Denko Corporation, ...

1. A ventilation structure comprising:
a housing having an opening for ventilation; and
a ventilation member attached to the opening, the ventilation member comprising:
a support comprising: a base portion adapted to form an air passage between an interior space and an exterior space of the
housing; and a leg portion extending from the base portion and adapted to be fitted into the opening;

an air-permeable membrane disposed on the support to cover the air passage; and
a sealing member made of a resin and placed at a root of the leg portion, the sealing member having a compression set of 10%
or less when measured under conditions of a test temperature of 100° C. and a test time of 100 hours in accordance with JIS
K 6262;

wherein the opening has a tapered portion, a diameter of the opening increasing from the interior space toward the exterior
space at the tapered portion; and

the sealing member is in contact with the housing only at the tapered portion and in contact with the base portion and the
leg portion of the support.

US Pat. No. 9,188,722

ANTISTATIC ADHESIVE OPTICAL FILM AND IMAGE DISPLAY

Nitto Denko Corporation, ...

1. An antistatic pressure-sensitive adhesive optical film, the optical film having an antistatic layer laminated on at least
one side of the optical film, and a pressure-sensitive adhesive layer further laminated on the antistatic layer,
wherein the antistatic layer comprises a water soluble or water dispersible polythiophene conductive polymer and a sulfonic
acid compound as raw material components, and the pressure-sensitive adhesive layer is formed of an acryl-based pressure-sensitive
adhesive containing nitrogen,

wherein the optical film is selected from the group consisting of a polarizing plate, a retardation plate, an optical compensation
film, a brightness enhancement film, and a laminate thereof,

wherein a base polymer of the acryl-based pressure-sensitive adhesive containing nitrogen is a copolymer of a monomer containing
nitrogen and an acryl-based monomer, or a mixture of a polymer containing nitrogen and an acryl-based polymer,

wherein the polymer containing nitrogen comprises the monomer containing nitrogen,
wherein the monomer containing nitrogen is N-acryloylmorpholine,
wherein the antistatic layer is on and in direct contact with the optical film, and
wherein the pressure-sensitive adhesive layer is on and in direct contact with the antistatic layer.

US Pat. No. 9,110,237

METHOD OF MANUFACTURING OPTICAL WAVEGUIDE

NITTO DENKO CORPORATION, ...

1. A method of manufacturing an optical waveguide, comprising:
forming protruding cores and a protruding alignment mark on an upper surface of an under cladding layer from a photosensitive
resin layer by a photolithographic method using a single photomask; and

after removing the photomask, positioning a mold for over cladding layer formation by using the alignment mark as a guide
to form an over cladding layer,

wherein the photolithographic method employs a photomask having opening patterns for core formation and alignment mark formation,
wherein the opening pattern for alignment mark formation includes a central first opening and a light transmission amount
reduction region provided around the first opening and having an aperture ratio within a range greater than 10% and less than
80%,

wherein the light transmission amount reduction region includes a plurality of polygonal or circular second openings which
are smaller than the first opening in size and are spaced at predetermined intervals so that the second openings are discrete
openings,

wherein the protruding alignment mark is formed from a portion of the photosensitive resin layer corresponding to the opening
pattern for alignment mark formation including the first opening and the light transmission amount reduction region,

wherein the alignment mark has a top surface formed into a horizontal surface by using an irradiation light transmitted through
the first opening,

wherein the alignment mark has a peripheral side surface in the form of an inclined surface having a height becoming gradually
lower toward the outside of the alignment mark resulting from the decrease in the amount of irradiation light transmitted
through the light transmission amount reduction region, thereby enhancing the recognizability of the alignment mark with a
recognition device,

wherein the mold for over cladding layer formation includes a cavity having a mold surface complementary in shape to a surface
of the over cladding layer, and

wherein, after enhancing the recognizability of the alignment mark, the mold is positioned while the alignment mark and the
cores are covered by the cavity of the mold.

US Pat. No. 9,349,927

ENCAPSULATING SHEET AND OPTICAL SEMICONDUCTOR ELEMENT DEVICE

NITTO DENKO CORPORATION, ...

3. An optical semiconductor element device comprising:
an optical semiconductor element and
an encapsulating layer which is formed from an encapsulating sheet and encapsulates the optical semiconductor element, and
the encapsulating sheet comprising:
an encapsulating resin composition which contains an encapsulating resin including an encapsulating silicone resin composition,
and silicone microparticles, wherein

the mixing ratio of the silicone microparticles with respect to the encapsulating resin composition is 20 to 50 mass %, and
the silicone microparticles are microparticles of polysiloxanes having a cross-linked structure,
the encapsulating resin is a transparent resin,
the refractive index of the silicone microparticles is 1.39 to 1.43, and
a difference between the refractive index of the silicone microparticles and the refractive index of the encapsulating resin
is within 0.03 in absolute value.

US Pat. No. 9,287,419

WAVELENGTH CONVERSION PERYLENE DIESTER CHROMOPHORES AND LUMINESCENT FILMS

Nitto Denko Corporation, ...

1. A perylene diester derivative represented by the following general formula (I) or general formula (II):

wherein R1 and R1' in formula (I) are each independently selected from the group consisting of hydrogen, C1-C10 alkyl, C3-C10 cycloalkyl, C2-C10 alkoxyalkyl, C6-C18 aryl, and C6-C20 aralkyl; m and n in formula (I) are each independently in the range of from 1 to 5; and R2 and R2' in formula (II) are each independently selected from the group consisting of a C6-C18 aryl and C6-C20 aralkyl.

US Pat. No. 9,232,915

METHOD AND APPARATUS FOR DERIVING A HEALTH INDEX FOR DETERMINING CARDIOVASCULAR HEALTH

NITTO DENKO CORPORATION, ...

1. A computer implemented method of deriving a health index for determining cardiovascular health of a subject; the method
performed by a computing device and comprising
(i) obtaining values of at least two parameters from one or more PPG signals of the subject, the at least two parameters including
Sp02 and at least one other parameter related to Sp02;

(ii) assigning, using the computing device, a score using the values of the at least two related parameters from a reference
scoring system, wherein the reference scoring system is derived, using the computing device, by

listing all possible permutations of the at least two parameters in a list, each permutation corresponding to a preliminary
band classification and a preliminary score;

checking the list against a list of impossible combinations and atypical combinations;
identifying, using the computing device, which of the possible permutations in the list falls within the list of impossible
combinations and atypical combinations and marking the identified possible permutations;

manipulating, using the computing device, the preliminary band classification of the possible permutations identified as atypical
combinations;

manipulating, using the computing device, the preliminary scores corresponding to the manipulated preliminary band classifications
based on predefined scores and band classification relationships;

deriving, using the computing device, a plurality of groupings for each parameter from the list of possible permutations and
the manipulated scores and band classifications; each grouping including a range of readings for the respective parameter
and is associated with a corresponding score for assigning to, and dependence on, the obtained values; and

(iii) deriving, using the computing device, the health index based on the assigned score; wherein the health index is derived
by deriving a preliminary health index from the groupings for each parameter based on the obtained values and verifying if
a combination of the groupings is medically possible, and further verifying if the preliminary health index requires corrective
adjustment based on the combination of the groupings.

US Pat. No. 9,186,633

METHOD FOR PRODUCING POROUS THERMOSETTING RESIN SHEET, POROUS THERMOSETTING RESIN SHEET AND COMPOSITE SEMIPERMEABLE MEMBRANE USING SAME

NITTO DENKO CORPORATION, ...

1. A method for producing a porous thermosetting resin sheet, comprising:
forming a cylindrical or columnar resin block that is composed of a cured product of a thermosetting resin composition containing
a thermosetting resin, a curing agent and a porogen;

forming a long thermosetting resin sheet by cutting the surface of said resin block at a certain thickness; and
then removing the porogen from the thermosetting resin sheet so as to form pores.

US Pat. No. 9,131,829

LABEL SHEET FOR CLEANING AND CONVEYING MEMBER HAVING CLEANING FUNCTION

NITTO DENKO CORPORATION, ...

1. A method of manufacturing a label sheet having a cleaning function, wherein the label sheet comprises a plurality of labels
for cleaning, and,
wherein the method comprises polymerizing and curing a curing type adhesive of a cleaning layer of each of the plurality of
labels by irradiating the label sheet with active energy, and carrying out a sheet punching process for forming label shape
after the polymerization and curing reaction of the adhesive of the cleaning layer,

wherein the plurality of labels are continuously and removably provided on an elongated separator at intervals through an
ordinary adhesive layer, and

wherein each of said plurality of labels comprise a base material, the cleaning layer provided on one surface of the base
material in a condition where the surface of the cleaning layer is protected by a removing film, and the ordinary adhesive
layer is provided on another surface of the base material.

US Pat. No. 9,109,142

PHOTOCURABLE ADHESIVE COMPOSITION, PHOTOCURABLE ADHESIVE LAYER, AND PHOTOCURABLE ADHESIVE SHEET

NITTO DENKO CORPORATION, ...

1. A photocurable pressure-sensitive adhesive composition, comprising:
a graft polymer comprising a (meth)acryl-based polymer and a chain that contains a cyclic ether group-containing monomer component
and is graft-polymerized onto the (meth)acryl-based polymer together with at least one other monomer capable of undergoing
co-grafting such that the weight ratio of the cyclic ether group-containing monomer to the at least one other monomer is from
80/20 to 20/80; and

a cationic photopolymerization initiator.

US Pat. No. 9,093,090

SUSPENSION BOARD WITH CIRCUIT

NITTO DENKO CORPORATION, ...

1. A suspension board with circuit comprising:
a conductive pattern on a top surface thereof, wherein
a folded-back portion that is capable of being folded back toward a back surface side is provided in the suspension board
with circuit, and

at the circumference edge of the folded-back portion,
a part of the circumference edge is continuous to the suspension board with circuit around the folded-back portion via a bent
portion and

the remaining portion of the circumference edge is disposed apart from the suspension board with circuit around the folded-back
portion by a penetrating space that penetrates the suspension board with circuit in a thickness direction,

wherein the conductive pattern at least includes a top-surface-side terminal that is disposed on the top surface of the suspension
board with circuit and a back-surface-side terminal that is disposed in the folded-back portion, and wherein

a slider mounted with a magnetic head is capable of being mounted on the top surface side thereof and an electronic device
is capable of being mounted on the back surface side thereof;

the conductive pattern includes
a first conductive pattern including a first terminal that is to be electrically connected to an external circuit and a second
terminal that is to be electrically connected to the magnetic head, and

a second conductive pattern including a third terminal that is to be electrically connected to the external circuit and a
fourth terminal that is to be electrically connected to the electronic device; and

the top-surface-side terminal serves as the second terminal and
the back-surface-side terminal serves as the fourth terminal.

US Pat. No. 9,088,030

POLYIMIDE, POLYIMIDE-BASED POLYMER ELECTROLYTE MEMBRANE, MEMBRANE-ELECTRODE ASSEMBLY, AND POLYMER ELECTROLYTE FUEL CELL

Nitto Denko Corporation, ...

1. A polyimide comprising a structural unit (P) represented by the following formula (1):
where
a group represented by [—SO3M] is a sulfonic acid group, a salt of a sulfonic acid group, or an ester of a sulfonic acid group,

A1 in a partial structure represented by [—O-A1-] is:

a divalent aliphatic group R1 which has a carbon number of 1 to 10 and may have a substituent;

a divalent aromatic group Ar1 which contains 1 to 4 rings and may have a substituent;

a group represented by formula [—Ar2—Z1—Ar3—] (where Ar2 and Ar3, which may be the same as or different from each other, are each a divalent aromatic group which contains 1 to 4 rings and
may have a substituent, and Z1 is a direct bond (—), an ether group (—O—), a thioether group (—S—), or a sulfone group (—SO2—));

a group represented by formula [—R2—Ar4—] (where R2 is a divalent aliphatic group which has a carbon number of 1 to 10 and may have a substituent, and Ar4 is a divalent aromatic group which contains 1 to 4 rings and may have a substituent); or

a group represented by formula [—Ar5—R3—Ar6—] (where Ar5 and Ar6, which may be the same as or different from each other, are each a divalent aromatic group which contains 1 to 4 rings and
may have a substituent, and R3 is a divalent aliphatic group which has a carbon number of 1 to 10 and may have a substituent),

the substituent which the aliphatic groups R1, R2 and R3, and the aromatic groups Ar1, Ar2, Ar3, Ar4, Ar5 and Ar6 may have is at least one selected from a methyl group, an ethyl group, a propyl group, a butyl group, a trifluoromethyl group,
a phenyl group, a phenoxy group, a phenylthio group, and a benzenesulfonyl group, and

C1 is a tetravalent group.

US Pat. No. 9,086,534

OPTICAL WAVEGUIDE FORMING RESIN COMPOSITION, OPTICAL WAVEGUIDE AND LIGHT TRANSMISSION FLEXIBLE PRINTED BOARD PRODUCED BY USING THE RESIN COMPOSITION, AND PRODUCTION METHOD FOR THE OPTICAL WAVEGUIDE

NITTO DENKO CORPORATION, ...

1. An optical waveguide forming resin composition, comprising:
(A) a liquid oxetane compound;
(B) a liquid epoxy compound;
(C) an alkylene glycol; and
(D) a photoacid generator,
wherein the optical waveguide forming resin composition is free from a solid resin component and the viscosity thereof under
a 25° C. environment is within the range of 10 to 20 mPa·s, and

wherein the proportion of the liquid oxetane compound (A) is 70 wt % or more, the proportion of the liquid epoxy compound
(B) is 20 wt % or less, the proportion of the alkylene glycol (C) is 20 wt % or less, and the proportion of (B)+(C) is 30
wt % or less based on an overall amount of resin components of the optical waveguide forming resin composition.

US Pat. No. 9,078,926

POLYMER CONJUGATES WITH A LINKER

Nitto Denko Corporation, ...

1. A polymer conjugate comprising a recurring unit of the Formula (I) and a recurring unit of the Formula (II):

wherein:
each A1 and each A2 are independently oxygen or NR5, wherein R5 is hydrogen or C1-4 alkyl;

each R1 and each R2 are independently selected from the group consisting of hydrogen, a C1-10 alkyl group, a C6-20 aryl group, ammonium, an alkali metal, and a compound that comprises a linker and an anticancer drug, provided that at least
one of R1 and R2 is a compound that comprises a linker and an anticancer drug;

wherein the linker has the structure:

wherein A3 is N or CH; X1 is 1, 2, 3, 4, 5 or 6; X2 is 0 or 1; and X3 is 1, 2 or 3; and

each R3 and each R4 are independently selected from the group consisting of hydrogen, a C1-10 alkyl group, a C6-20 aryl group, ammonium, and an alkali metal.

US Pat. No. 9,709,084

CLIP AND ELASTIC BODY ATTACHMENT COMPONENT

NITTO DENKO CORPORATION, ...

1. A clip comprising:
a pair of holding members arranged oppositely to each other to be capable of holding an elastic body therebetween;
a base member, to which end portions of one side of the pair of holding members are coupled, being set on an object to be
fixed;

at least one of the holding members being pivotably coupled to the base member,
pressing members provided on the holding members for retaining the elastic body between the pair of holding members,
wherein the pressing members are provided as a pair on each of the holding members, a pressing member being disposed on one
side of each holding member and the other pressing member being disposed on the other side of each holding member,

wherein the respective pressing members provided on the one side of the holding members are angled toward the other side of
the holding members,

wherein the respective pressing members provided on the other side of the holding members are angled toward the one side of
the holding members, whereby:

the pair of pressing members on the one side of the holding members and the pair of pressing members on the other side of
the holding members retain the elastic body pressed between the pair of holding members,

the pair of holding members are spaced apart in an opposed direction; and
the pair of pressing members are spaced apart a predetermined distance in a direction orthogonal to the opposed direction
of the pair of holding members,

wherein the holding members include pedestal portions and pressure contact portions,
wherein the pedestal portions are thick plates relative to the pressing members and coupled to the base member,
wherein the pressure contact portions are thick plates relative to the pressing members and extend in a direction opposite
to the base member with respect to the pedestal portions, and

wherein the pressing members are thin plates relative to the pedestal portions and the pressure contact portions and provided
on the pressure contact portions.

US Pat. No. 9,453,953

THIN POLARIZING FILM, OPTICAL LAMINATE WITH THIN POLARIZING FILM, AND PRODUCTION METHOD FOR THIN POLARIZING FILM

NITTO DENKO CORPORATION, ...

1. A thin polarizing film, comprising a polyvinyl alcohol-based resin film that adsorbs and orients an iodine,
wherein a polyvinyl alcohol-based resin that forms the polyvinyl alcohol-based resin film has a saponification degree of 99.0
mol % or more, and

the thin polarizing film has a thickness of 10 ?m or less, a single axis transmittance of 42.0% or more, a polarization degree
of 99.95% or more, and the iodine content of 17.6 grams per 400×700 square millimeters or less, which is measured by an ion
chromatography method.

US Pat. No. 9,332,633

TRANSPARENT CONDUCTIVE FILM

NITTO DENKO CORPORATION, ...

1. A transparent conductive film, comprising:
a film substrate;
a plurality of transparent conductor patterns formed on the film substrate; and
a pressure-sensitive adhesive layer formed on the film substrate wherein the plurality of transparent conductor patterns are
embedded,

the transparent conductor patterns respectively have a two-layer structure wherein a crystalline layer of first indium tin
oxide and a crystalline layer of second indium tin oxide are laminated on the film substrate in this order, the crystalline
layer of first indium tin oxide has a greater tin oxide content than the crystalline layer of second indium tin oxide does,

the crystalline layer of first indium tin oxide has a thickness smaller than that of the crystalline layer of second indium
tin oxide, and

the difference between the thickness of the crystalline layer of second indium tin oxide and the thickness of the crystalline
layer of first indium tin oxide is 2 nm to 10 nm.

US Pat. No. 9,326,952

ADHESIVE SKIN PATCH

NITTO DENKO CORPORATION, ...

1. An adhesive patch comprising a support, an adhesive layer containing a drug and arranged on at least one side of the support,
and a release liner arranged on a side of the adhesive layer opposite to the side thereof on which the support is arranged,
wherein the adhesive patch does not include bisoprolol,
wherein the support, the release liner and the adhesive layer each have a rectangular planar shape and the adhesive patch
as a whole has a rectangular planar shape,

wherein, at one or more corners of the adhesive patch, the adhesive patch comprises a protrudent part on a support-side surface
thereof,

wherein each protrudent part is positioned at one of the corners of the adhesive patch,
wherein the adhesive patch as a whole comprises a peripheral part and a middle part having a rectangular planar shape,
wherein a thickness of the adhesive patch in the peripheral part is smaller than a thickness of the adhesive patch in the
middle part, and the protrudent part is positioned at a corner of the middle part, and

wherein each protrudent part is formed by thickening one or both of the support and the adhesive layer.

US Pat. No. 9,324,616

METHOD OF MANUFACTURING FLIP-CHIP TYPE SEMICONDUCTOR DEVICE

NITTO DENKO CORPORATION, ...

1. A method of manufacturing a flip-chip type semiconductor device comprising:
a step A of laminating on a semiconductor wafer a film for the backside of a flip-chip type semiconductor, in which the film
is to be formed on the backside of a semiconductor element that is flip-chip connected onto an adherend;

a step B of dicing the semiconductor wafer; and
a step C of laser marking the film for the backside of a flip-chip type semiconductor, wherein
the film for the backside of a flip-chip type semiconductor in the step C is uncured, and formed from a resin composition
containing an epoxy resin and a phenol resin, and the total amount of the epoxy resin and the phenol resin is 10 to 25 parts
by weight to 100 parts by weight of the resin composition.

US Pat. No. 9,289,177

SENSING DEVICE, A METHOD OF PREPARING A SENSING DEVICE AND A PERSONAL MOBILE SENSING SYSTEM

NITTO DENKO CORPORATION, ...

1. A sensing device comprising:
an electromagnetic wave emitter for emitting electromagnetic waves to a surface;
an electromagnetic wave detector for detecting the emitted electromagnetic waves that are reflected from the surface;
a force transmitting member configured to transmit a force applied thereto for detection,
wherein the force transmitting member is positioned relative to the electromagnetic wave emitter and electromagnetic wave
detector to substantially prevent waves emitted by the electromagnetic wave emitter from travelling directly to the electromagnetic
wave detector;

a force detector coupled to the force transmitting member for detecting the force transmitted by the force transmitting member;
and

a feedback unit coupled to the force detector, the feedback unit being configured to correlate the quality of the detected
electromagnetic wave with the amount of force applied to the force transmitting member and provide feedback related to the
correlation by:

computing an area under waveforms of detected signals corresponding to a variety of applied pressure amounts, and
determining an optimum pressure to correspond a largest computed area, from the variety of applied pressure amount.

US Pat. No. 9,283,739

METHOD AND SYSTEM FOR CONTINUOUSLY MANUFACTURING OPTICAL DISPLAY PANEL

NITTO DENKO CORPORATION, ...

1. A method for continuously manufacturing an optical display panel, comprising:
a carrier film feeding step comprising feeding a carrier film by means of a carrier film feeding unit, wherein sheet pieces
of polarizing film are formed on the carrier film with a pressure-sensitive adhesive interposed therebetween;

a peeling step comprising peeling off by means of a peeling unit a sheet piece of the polarizing film together with the pressure-sensitive
adhesive from the carrier film by inwardly folding back the carrier film at a front end, wherein the carrier film is fed by
the carrier film feeding step;

a take-up step comprising taking up by means of a take-up unit the carrier film from which the sheet piece is peeled off by
the peeling step;

a bonding step comprising bonding the sheet piece by means of a bonding unit to an optical cell with the pressure-sensitive
adhesive interposed therebetween while feeding the optical cell so that an optical display panel is formed, wherein the sheet
piece is peeled off from the carrier film by the peeling step; and

a velocity control step comprising: setting a bonding velocity and a carrier film feed velocity in such a manner that during
an entire period from the start of the bonding of the sheet piece to the end of the bonding in the bonding step, the bonding
velocity in the bonding step is higher than the carrier film feed velocity at which the carrier film being peeled off in the
peeling step is fed by the carrier film feeding unit and in such a manner that slack formed in the sheet piece is eliminated
between the bonding position and a front end of the peeling unit; and performing control in such a manner that during a period
from the start of the bonding to the end of the bonding, the distance (L) between the bonding position and the front end of
the peeling unit is longer than the distance (Ls) between the front end of the peeling unit and a bent part at which the carrier
film is folded back, while the bonding velocity in the bonding step is higher than a velocity at which the carrier film is
fed by the carrier film feeding unit,

wherein the carrier film feeding unit has an upstream-side film supply unit for feeding the carrier film placed upstream of
the peeling unit with respect to the feeding or has a downstream-side film supply unit for feeding the carrier film placed
downstream of the peeling unit with respect to the feeding, and

in the velocity control step, the upstream-side film supply unit or the downstream-side film supply unit is driven and controlled
to feed the carrier film.

US Pat. No. 9,279,069

DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET AND METHOD FOR PRODUCING THE SAME

NITTO DENKO CORPORATION, ...

1. A double-sided PSA sheet produced by a method comprising
(a) preparing an aqueous dispersion-type PSA composition;
(b) preparing a non-woven fabric substrate that is 15 ?m to 70 ?m in thickness and 0.3 to 0.6 g/cm3 in bulk density, wherein 8 layers of the non-woven fabric substrate have an air resistance of 0.7 sec to 2 sec (Gurley); and

(c) forming a PSA layer by applying the PSA composition to at least one of the two sides of the non-woven fabric substrate
and allowing the applied composition to dry.

US Pat. No. 9,955,579

PRINTED CIRCUIT BOARD HAVING REDUCED LOSS OF ELECTRIC SIGNAL AND METHOD OF MANUFACTURING THE SAME

NITTO DENKO CORPORATION, ...

1. A printed circuit board comprising:a first insulating layer;
a wiring trace formed on the first insulating layer;
a metal thin film formed on the wiring trace;
a second insulating layer formed on the first insulating layer to cover the metal thin film; and
a connection terminal electrically connected to the wiring trace, and formed on the first insulating layer to be exposed from the second insulating layer,
wherein the metal thin film has a thickness larger than 0 nm and not more than 150 nm,
wherein the connection terminal includes a first conductor layer and a second conductor layer formed on the first conductor layer, the first conductor layer being integrally connected to the wiring trace,
wherein the first conductor layer has a thickness smaller than a thickness of the wiring trace,
wherein the second conductor layer has a thickness larger than the thickness of the metal thin film, and
wherein the metal thin film and the first conductor layer are different layers.

US Pat. No. 9,512,337

PAINT FILM-PROTECTING SHEET AND METHOD OF MANUFACTURE

NITTO DENKO CORPORATION, ...

1. A paint film-protecting sheet in roll form comprising a pressure-sensitive adhesive sheet wound in a lengthwise direction
with the adhesive sheet comprising a substrate in continuous sheet form and a pressure-sensitive adhesive layer disposed on
the substrate, wherein
the substrate is an extruded sheet is a multilayer substrate consisting of two, three, or four layers and each layer of the
substrate contains a polyethylene and a polypropylene resin in a different blend ratio compared to the other layer of the
multilayer substrate,

a surface of the layer directly on a pressure-sensitive adhesive layer side thereof is composed of a material containing at
least 20% by mass of an ethylene component,

the pressure-sensitive adhesive layer is formed of a non-crosslinking polyisobutylene-based pressure-sensitive adhesive, and
the paint film-protecting sheet, after being unwound from the roll, has a percent shrinkage, in the lengthwise direction,
of 1.2% or less than 1.2% when heated at 80° C. for 1 hour.

US Pat. No. 9,500,887

METHOD AND APPARATUS FOR THE CONTINUOUS MANUFACTURE OF LIQUID CRYSTAL DISPLAY DEVICES

NITTO DENKO CORPORATION, ...

1. A method for continuously manufacturing liquid crystal display devices, which is adapted to use a strip-shaped film laminate
comprising a polarizing film having an adhesive layer formed thereon and being of a width corresponding to one of long and
short sides of a rectangular panel, and a carrier film peelably laminated to the adhesive layer, a plurality of transversely
extending, longitudinally spaced cut lines being formed in the polarizing film and the adhesive layer, a plurality of polarizing
film sheets being defined each between longitudinally adjacent two of the cut lines, each of the polarizing film sheets being
classified, based on a defect detected by a preliminary inspection, into either a defect-free normal sheet having a length
corresponding to the other of the long and short sides of the rectangular panel, or a defect-containing defective sheet; the
method comprising the steps of:
feeding the plurality of polarizing film sheets carried by the carrier film, with respect to a plurality of rectangular panels
being sequentially conveyed, sequentially toward a lamination position for lamination to each of the sequentially conveyed
rectangular panels;

using a controller provided for determining whether the polarizing film sheet is a normal sheet or a defective sheet and;
when one of the polarizing film sheets is determined as the normal sheet by the controller, positioning a sheet peeling device
at a forward, operative position wherein the sheet peeling device acts on the strip-shaped film laminate which is being fed
along a first sheet feeding path, to have the normal sheet peeled from the carrier film, and fed to the lamination position
so as to laminate the normal sheet to one of the rectangular panels fed to the lamination position in synchronization with
the feeding of the normal sheet; and

when one of the polarizing film sheets is determined as the defective sheet by the controller, operating a sheet path changing
device into an operative position so as to move said sheet peeling device backward apart from the strip-shaped film laminate
to thereby direct the strip-shaped film laminate along a second sheet feeding path which bypasses the lamination position,
to have the defective sheet fed with the carrier film toward a carrier film take-up position, so that the polarizing film
is taken up together with the carrier film, by a predetermined length corresponding to the length of the defective sheet in
the feeding direction, wherein operating the sheet path changing device comprises moving each of a plurality of rollers from
a first position to a second position.

US Pat. No. 9,433,533

PATCH PACKAGE STRUCTURE

NITTO DENKO CORPORATION, ...

1. A patch package structure, which comprises:
a package comprising a first sheet material which is planar and a second sheet material which has been molded, said first
and second sheet materials being sealed together in peripheral parts thereof; and

a patch disposed in the package,
wherein the patch comprises a backing, a pressure-sensitive adhesive layer laminated on at least one side of the backing,
and a release liner which protects a pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer,

wherein the second sheet material has been molded so as to have a protrudent part in at least a substantially central area
thereof, said protrudent part having a planar outer shape larger than a planar outer shape of the release liner and having
at least one recessed part,

wherein d is equal to T, in which d is the minimum gap distance between the inner surface of the first sheet material and
the inner surface of the second sheet material at the recessed part and T is a thickness of the patch, so as to reduce vertical
movement of the patch inside the package,

wherein, at the boundary between the sealed part where the first and second sheet materials are sealed together and an unsealed
part, the outer surface of the second sheet material rises at an obtuse angle,

wherein a maximum gap distance D between a package inner surface of the protrudent part of the second sheet material and the
package inner surface of the first sheet material is larger than d and is smaller than 2.3×d, and

wherein the obtuse angle is in the range of 95 to 175 degrees.

US Pat. No. 9,428,625

TRANSPARENT CONDUCTIVE FILM, METHOD FOR PRODUCTION THEREOF AND TOUCH PANEL THEREWITH

NITTO DENKO CORPORATION, ...

1. A transparent conductive film, comprising:
a transparent film substrate;
a transparent conductor layer that is provided on one side of the transparent film substrate and has a thickness d of 15 nm
to 35 nm and an average surface roughness Ra of 0.37 nm to 1 nm;

at least a single layer of an undercoat layer interposed between the transparent film substrate and the transparent conductor
layer;

wherein the transparent conductor layer has a maximum surface roughness Ry of 7.5 nm to 15 nm,
wherein in the transparent conductor layer, the ratio (Ry/d) of the maximum surface roughness Ry to the thickness d is from
0.34 to 1; and

wherein in the transparent conductor layer, the ratio (Ra/d) of the average surface roughness Ra to the thickness d is from
0.017 to 0.045.

US Pat. No. 9,399,730

WAVELENGTH CONVERSION MATERIAL AS ENCAPSULATE FOR SOLAR MODULE SYSTEMS TO ENHANCE SOLAR HARVESTING EFFICIENCY

Nitto Denko Corporation, ...

1. An encapsulation structure for a solar energy conversion device comprising:
a luminescent wavelength conversion material comprising at least one chromophore and an optically transparent polymer matrix;
wherein the at least one chromophore is represented by formula (I-a)

i is an integer in the range of 0 to 100;
A0 and Ai are each independently selected from the group consisting of optionally substituted alkyl, optionally substituted alkenyl,
optionally substituted heteroalkyl, optionally substituted heteroaryl, optionally substituted amino, optionally substituted
amido, optionally substituted cyclic amido, optionally substituted cyclic imido, optionally substituted alkoxy, optionally
substituted carboxy, and optionally substituted carbonyl;

D1 and D2 are each independently selected from the group consisting of hydrogen, optionally substituted alkoxy, optionally substituted
aryloxy, optionally substituted acyloxy, optionally substituted alkyl, optionally substituted aryl, optionally substituted
heteroaryl, optionally substituted amino, amido, cyclic amido, and cyclic imido, provided that D1 and D2 are not both hydrogen;

Li is independently selected from the group consisting of optionally substituted alkylene, optionally substituted alkenylene,
optionally substituted alkynylene, optionally substituted arylene, and optionally substituted heteroarylene; and

wherein the luminescent wavelength conversion material is configured to encapsulate the solar energy conversion device and
inhibit penetration of moisture and oxygen into the solar energy conversion device.

US Pat. No. 9,174,368

RETARDATION FILM, METHOD OF PRODUCING THE SAME AND IMAGE DISPLAY DEVICE

NITTO DENKO CORPORATION, ...

1. A retardation film comprising:
only one type of a resin component,
wherein the only one type of resin component is either an epoxy resin cured product or an epoxy (meth)acrylate resin cured
product,

wherein an in-plane birefringence index of the retardation film at a wavelength of 590 nm is 0.001 or more and a birefringence
index in a thickness direction thereof at a wavelength of 590 nm is 0.001 or more,

the retardation film is a stretched film, and
an index ellipsoid of the retardation film satisfies one of the relationships of nx>ny>nz, nx>nz>ny, or nx>ny=nz, wherein
nx represents refractive index in the direction in which in-plane refractive index of the retardation film is maximum (X axial
direction), ny represents refractive index in the direction orthogonal to the X axial direction in the same plane (Y axial
direction), and nz represents refractive index in the direction orthogonal to the X axial direction and Y axial direction
(thickness direction), and

the in-plane birefringence index is determined from the expression: ?nxy [590]=nx?ny, and the birefringence index in the thickness direction is determined from the expression: ?nxz [590]=nx?nz.

US Pat. No. 9,175,194

ACRYLIC PRESSURE-SENSITIVE ADHESIVE TAPE

NITTO DENKO CORPORATION, ...

1. An acrylic pressure-sensitive adhesive tape comprising an acrylic pressure-sensitive adhesive layer, wherein
a 180° peel adhesive force of the acrylic pressure-sensitive adhesive tape to a glass plate is 10 N/20 mm or more,
a 180° peel adhesive force of the acrylic pressure-sensitive adhesive tape to an acrylic plate is 10 N/20 mm or more,
the acrylic pressure-sensitive adhesive layer contains an acrylic polymer (A) and an acrylic polymer (B) having a weight average
molecular weight of from 1,000 to 30,000,

the acrylic polymer (B) comprises, as a monomer component, a (meth)acrylic acid ester having a tri- or multi-cyclic aliphatic
hydrocarbon in a molecule thereof,

the acrylic pressure-sensitive adhesive layer has a gel fraction of 65% or more, and
the acrylic pressure-sensitive adhesive layer has a 300% tensile residual stress of from 7 to 16 N/cm2.

US Pat. No. 9,162,632

PATTERNED PRESSURE-SENSITIVE ADHESIVE BODY AND PRODUCING METHOD THEREOF

NITTO DENKO CORPORATION, ...

1. A method for producing a patterned pressure-sensitive adhesive body comprising:
a pattern forming step of cutting a pressure-sensitive adhesive layer in a pressure-sensitive adhesive film including a first
release film and the pressure-sensitive adhesive layer laminated on one surface of the first release film so as to form a
first slit in a pattern shape and

an outer frame forming step of cutting the first release film and the pressure-sensitive adhesive layer so as to form a second
slit in an outer frame shape surrounding the pattern shape,

wherein the second slit has a plurality of discontinuous portions in a cutting direction; and
wherein the outer frame shape of the second slit is composed of an intermittent line formed by the discontinuous portions
and surrounding the pattern shape.

US Pat. No. 9,138,947

METHOD FOR PRODUCING POLARIZER, POLARIZER, POLARIZING PLATE, OPTICAL FILM, AND IMAGE DISPLAY DEVICE

NITTO DENKO CORPORATION, ...

1. A method for producing a polarizer, comprising:
subjecting a polyvinyl alcohol film to at least a dyeing process, a crosslinking process and a stretching process,
then subjecting the polyvinyl alcohol film, in which all of the processes have been performed, having a water content of 25
to 55% by weight to a drying process, wherein

the dyeing process is performed by allowing iodine to adsorb to and align in the polyvinyl alcohol film,
in the drying process, the water content of the polyvinyl alcohol film is reduced by at least 15% by weight, so that the polyvinyl
alcohol film has a water content of 5 to 35% by weight, and

the drying process comprises bringing the polyvinyl alcohol film into contact with a heating roller and blowing hot air, thereby
performing a quick drying stage in which the water content of the polyvinyl alcohol film is reduced by at least 10% by weight
in a time period of ½ to 1/30 of the total drying time of the drying process.

US Pat. No. 9,051,284

COMPOUNDS FOR POROUS FILMS IN LIGHT-EMITTING DEVICES

NITTO DENKO CORPORATION, ...

1. A compound represented by a Formula 2:

wherein Z is N;
R2, R3, and R4 are independently H, C1-6 alkyl, or —O—C1-6 alkyl;

Rg3, and Rg2 are independently optionally substituted pyridinyl or phenyl; and

Rg5 and Rg4 are independently benzimidazol-2-yl, benzooxazol-2-yl, or benzothiazol-2-yl.

US Pat. No. 9,046,646

OPTO-ELECTRIC HYBRID BOARD AND METHOD OF MANUFACTURING SAME

NITTO DENKO CORPORATION, ...

1. An opto-electric hybrid board, comprising:
an electric circuit board including an insulative layer having front and back surfaces, and electrical interconnect lines
formed on the front surface of the insulative layer;

an optical waveguide including a cladding layer and cores, the optical waveguide being formed on the back surface of the insulative
layer of the electric circuit board; and

a metal layer formed between the cladding layer of the optical waveguide and the back surface of the insulative layer of the
electric circuit board,

wherein part of the opto-electric hybrid board is formed as a to-be-bent portion,
wherein the metal layer is partially removed in a position corresponding to the to-be-bent portion, and
wherein the cladding layer of the optical waveguide fills a site where the metal layer is removed.

US Pat. No. 10,021,780

WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF

NITTO DENKO CORPORATION, ...

1. A wired circuit board comprising: an insulating layer and a conductive layer disposed at one-side surface in a thickness direction of the insulating layer, wherein the insulating layer continuously has a first insulating portion, a second insulating portion having a thickness smaller than that of the first insulating portion, and a third insulating portion disposed between the first insulating portion and the second insulating portion and having a thickness that tapers gradually and becomes smaller from the first insulating portion toward the second insulating portion; the conductive layer continuously has a first conductive portion disposed at one-side surface in the thickness direction of the first insulating portion and a second conductive portion disposed at one-side surface in the thickness direction of the second insulating portion and having a thickness smaller than that of the first conductive portion; and the first conductive portion is further disposed at one-side surfaces in the thickness direction of the second insulating portion and the third insulating portion or the second conductive portion is further disposed at one-side surfaces In the thickness direction of the first insulating portion and the third insulating portion.

US Pat. No. 9,648,726

SUSPENSION BOARD ASSEMBLY SHEET WITH CIRCUITS AND MANUFACTURING METHOD OF THE SAME

NITTO DENKO CORPORATION, ...

1. A suspension board assembly sheet with circuits comprising: a plurality of suspension boards with circuits; a support frame
that integrally supports the plurality of suspension boards with circuits; and a plurality of inspection substrates provided
to correspond to the plurality of suspension boards with circuits, wherein each of the plurality of suspension boards with
circuits includes a conductive first support substrate, a first insulating layer formed on the first support substrate, a
conductor line formed on the first insulating layer, and a first via that passes through the first insulating layer and electrically
connects the first support substrate and the conductor line, each of the plurality of inspection substrates includes a conductive
second support substrate, a second insulating layer formed on the second support substrate, a conductor layer formed on the
second insulating layer and a second via that passes through the second insulating layer and electrically connects the second
support substrate and the conductor layer, and the first via and the second via have the same configuration, wherein the plurality
of suspension boards with circuits further include a third insulating layer formed on the first insulating layer such that
at least part of the conductor line and the first via are covered, and the inspection substrate further includes a fourth
insulating layer formed on the second insulating layer such that the second via is covered and at least part of the conductor
layer is exposed.

US Pat. No. 9,484,240

FILM ADHESIVE, DICING TAPE WITH FILM ADHESIVE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

NITTO DENKO CORPORATION, ...

1. A film adhesive comprising a thermoplastic resin and electrically conductive particles, the film adhesive having an adhesion
strength measured at 25° C. after the film adhesive is pasted to a mirror silicon wafer at 40° C. of 0.5 N/10mm or more,
wherein the electrically conductive particles have a specific gravity of greater than or equal to 0.7 and less than or equal
to 22,

wherein the film adhesive has a storage modulus measured at 25° C. before curing of 5 MPa or more,
wherein the film adhesive further comprises a curable resin, the curable resin comprising a curable resin that is solid at
25° C. and a curable resin that is liquid at 25° C., and

wherein a ratio of a weight of the curable resin that is solid at 25° C. to a weight of the curable resin that is liquid at
25° C. is 49/51 to 10/90.

US Pat. No. 9,478,454

DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE

NITTO DENKO CORPORATION, ...

1. A dicing tape-integrated film for semiconductor back surface, comprising a film for flip chip type semiconductor back surface
for protecting a back surface of a semiconductor element flip chip-connected onto an adherend, and a dicing tape,
the dicing tape comprising a base material and a pressure-sensitive adhesive layer provided on the base material,
the film for flip chip type semiconductor back surface being formed on the pressure-sensitive adhesive layer,
wherein the pressure-sensitive adhesive layer is a radiation-curable pressure-sensitive adhesive layer whose pressure-sensitive
adhesive force toward the film for flip chip type semiconductor back surface is to be decreased by irradiation with a radiation
ray,

wherein the radiation-curable pressure-sensitive adhesive is an internal-type UV curable pressure-sensitive adhesive in which
a polymer having a radically reactive carbon-carbon double bond in an acrylic polymer side chain or main chain is used as
the base polymer, or an addition-type radiation-curable pressure-sensitive adhesive in which a UV curable monomer component
or oligomer component is blended into an acrylic pressure-sensitive adhesive,

wherein the film for flip chip type semiconductor back surface contains a coloring agent,
wherein the dicing tape-integrated film for semiconductor back surface satisfies a relation: r1 where r1 is a diameter of a semiconductor wafer; r2 is a diameter of a part in the pressure-sensitive adhesive layer, which
corresponds to the film for flip chip type semiconductor back surface or a semiconductor wafer-attaching part in the film
for flip chip type semiconductor back surface, and r3 is a diameter of the film for flip chip type semiconductor back surface
or the semiconductor wafer-attaching part in the film for flip chip type semiconductor back surface, and

the part in the pressure-sensitive adhesive layer is to be cured.

US Pat. No. 9,461,506

WIRELESS POWER-SUPPLY SYSTEM

NITTO DENKO CORPORATION, ...

1. A wireless power-supply system comprising:
a power transmission device including a power supply unit configured to supply power, and a power-supplying resonator configured
to transmit the power supplied from the power supply unit in the form of electromagnetic energy; and

a movable power-receiving device including a power-receiving resonator and a power-receiving unit, the power receiving resonator
having a same resonance frequency as that of the power-supplying resonator and being configured to receive the electromagnetic
energy transmitted from the power-supplying resonator in the form of power, the power-receiving unit being configured to operate
when the power received by the power-receiving resonator is predetermined effective power or more, wherein:

an area of a predetermined distance from the power transmission device is set as a power supply range, the predetermined distance
being defined so as to correspond to a positional relation between the power-supplying resonator and the power-receiving resonator
in which power transmitted in the form of electromagnetic energy by having the power-supplying resonator and the power-receiving
resonator resonate with each other yields the predetermined effective power or more; and the power-receiving unit is configured
to operate only when the power-receiving device is within the power supply range.