US Pat. No. 9,423,309

PRESSURE SENSOR, METHOD FOR MANUFACTURE THEREOF, AND PRESSURE DETECTION MODULE

Nippon Mektron, Ltd., Mi...

1. A method for manufacture of a pressure sensor, comprising:
forming a conductor pattern by means of a subtractive process in which a metal foil laminated through an adhesive agent on
a surface of a base film is subjected to etching processing to provide a pair of electrodes on said base film;

laminating a photosensitive cover on said base film, and removing at least a portion of said conductor pattern corresponding
to said pair of electrodes thereby to cause said portion to be exposed, while covering a remaining portion of said conductor
pattern with a remaining portion of said photosensitive cover;

applying metal plating treatment for prevention of oxidation to the exposed portion of said conductor pattern including said
pair of electrodes; and

forming, thereafter, a hollow portion opened to outside air in the removed portion of said photosensitive cover corresponding
to said pair of electrodes, by laminating a cover film with a pressure sensing part formed thereon in advance in which contact
resistance thereof changes according to a pressure of contact thereof with said electrodes, and by bonding said cover film
to the remaining portion of said photosensitive cover by means of an adhesive agent.

US Pat. No. 9,743,532

FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD OF FLEXIBLE PRINTED CIRCUIT BOARD

NIPPON MEKTRON, LTD., Mi...

1. A flexible printed circuit board having at least a set of strip line transmission path by being provided with a signal
line, insulating layers covering the signal line from both sides and each made of a thermoplastic resin as its material, and
a pair of ground layers facing the signal line with the respective insulating layers sandwiched therebetween, the flexible
printed circuit board comprising
a pleated part having curved portions molded at a plurality of positions thereof, the curved portions being curved so as to
be opened or closed,

in the ground layers, mesh ground layers in which conductive portions exist to surround openings so that the conductive portions
are provided in a mesh shape, and solid ground layers in which the conductive portions are provided in a planar state, are
provided,

the mesh ground layers are arranged on an outer peripheral side of the curved portions, and the solid ground layers are arranged
on an inner peripheral side of the curved portions.

US Pat. No. 9,089,050

FLEXIBLE CIRCUIT BOARD

Nippon Mektron, Ltd., Mi...

1. A flexible circuit board which at least has a wiring layer adapted to be electrically connected to a circuit element, an
insulating layer, and a heat dissipation layer, wherein
said wiring layer is formed of a copper foil which has a tensile strength of 250 MPa or less and a thickness of 50 ?m or less;
and

said heat dissipation layer is formed of a copper foil which has a tensile strength of 400 MPa or more and a thickness of
70 ?m or more, and is subjected to bending processing.

US Pat. No. 9,620,286

INSULATING MATERIAL, PASSIVE ELEMENT, CIRCUIT BOARD, AND METHOD OF MANUFACTURING AN INSULATING SHEET

NIPPON MEKTRON, LTD., To...

1. An insulating material comprising a fiber assembly mainly composed of a cellulose nanofiber, and an electroconductive metal
material supported by the fiber assembly, wherein the electroconductive metal material is fibrous, and the fibrous electroconductive
metal material, supported by 100 g of cellulose nanofiber, has a total length of 1×10?7 m or longer and 5×10?8 m or shorter.

US Pat. No. 9,576,731

INSULATING MATERIAL, PASSIVE ELEMENT, CIRCUIT BOARD, AND METHOD OF MANUFACTURING AN INSULATING SHEET

NIPPON MEKTRON, LTD., To...

1. An insulating material comprising a fiber assembly mainly composed of a cellulose nanofiber, and an electroconductive metal
material supported by the fiber assembly, wherein the electroconductive metal material is fibrous, and the fibrous electroconductive
metal material, supported by 100 g of cellulose nanofiber, has a total length of 1×10?7 m or longer and 5×10?8 m or shorter.

US Pat. No. 9,235,011

OPTICAL AND ELECTRICAL MIXED FLEXIBLE PRINTED WIRING BOARD AND METHOD OF MOUNTING LIGHT RECEIVING/EMITTING DEVICE THEREOF

Nippon Mektron, Ltd., Mi...

1. An optical and electrical mixed flexible printed wiring board, comprising:
a flexible printed wiring board body having at least one layer of a conductive layer and a flexible insulating layer and an
optical waveguide bonded to the flexible printed wiring board body via an adhesive,
wherein
the optical waveguide includes at least one flexible optical waveguide core having at least two optical input/output portions
and a flexible optical waveguide cladding at least in contact with the optical waveguide core,

a light emitting device and a light receiving device are mounted on the flexible printed wiring board body and light from
a light emitting portion of the light emitting device is transmitted to a light receiving portion through the optical waveguide,

the light emitting device and the light receiving device are in a bare chip form and are a light emitting device of surface
emitting type and a light receiving device of surface receiving type having an electrode on an opposite surface of the light
emitting portion and the light receiving portion respectively, and

the light emitting device, the light receiving device, and the optical waveguide are mounted on one surface of the flexible
printed wiring board body, the light emitting portion of the light emitting device, the optical waveguide core, and the light
receiving portion of the light receiving device are arranged substantially coaxially, and the light emitting device and the
light receiving device are mounted in such a way that a light emitting/receiving direction is substantially parallel to the
surface of the flexible printed wiring board body.

US Pat. No. 9,170,483

PHOTOMASK, PHOTOMASK SET, EXPOSURE APPARATUS AND EXPOSURE METHOD

NIPPON MEKTRON, LTD., (J...

1. A photomask for use with another photomask and a flexible printed substrate having a photosensitive resist layer being
provided on both front and rear faces of the flexible printed substrate, the photomask comprising:
a drawing pattern for exposure formed on one face opposing the flexible printed substrate;
a first alignment mark for alignment with a substrate side mark formed on the flexible printed substrate, the first alignment
mark being provided in a region of the one face, the region opposing the flexible printed substrate when the flexible printed
substrate is retained and the drawing pattern is not formed in the region; and

a second alignment mark for alignment with a third alignment mark provided on the another photomask opposing the other face
of the flexible printed substrate, the second alignment mark being provided in a region which does not oppose the flexible
printed substrate when the flexible printed substrate is retained.

US Pat. No. 9,155,193

FLEXIBLE CIRCUIT BOARD AND ITS METHOD FOR PRODUCTION

Nippon Mektron, Ltd., Mi...

1. A flexible circuit board comprising:
an insulating film made of a thermoplastic resin;
a wiring layer formed on said insulating film; and
an insulating layer made of a thermoplastic resin and formed on said wiring layer;
wherein a spiral part shaped into a spiral shape is formed in at least a part of said flexible circuit board;
said spiral part is shaped in such a manner that a part of a circumferential surface and another adjacent part of the circumferential
surface mutually overlap with each other;

said spiral part is shaped in an arc shaped portion which is formed in said flexible circuit board in a state where said spiral
part has not been shaped; and

said flexible circuit board is constructed to be expandable and contractable, and/or torsionally deformable in said spiral
part.

US Pat. No. 9,076,997

FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME, AND FUEL CELL USING THE FLEXIBLE CIRCUIT BOARD

NIPPON MEKTRON, LTD, Tok...

1. A flexible circuit board having a current collector of a fuel cell provided thereon, comprising:
an insulating flexible base material;
a plurality of openings that supply fuel or air, the openings being provided in a specified region so as to penetrate through
the flexible base material in a thickness direction;

a conductor layer that constitutes the current collector, the conductor layer being formed on a front surface and a back surface
of the flexible base material in the specified region and on inner walls of the plurality of openings;

a conductive surface treatment film formed on top of the conductor layer, the conductive surface treatment film having corrosion
resistance higher than that of the conductor layer; and

an insulating layer that covers the surface treatment film in a peripheral edge portion of the current collector across a
boundary of the current collector.

US Pat. No. 9,483,923

ELECTRIC TACTILE SENSE PRESENTATION DEVICE

Nippon Mektron, Ltd., Mi...

1. An electric tactile sense presentation device comprising:
an electrode substrate with a contact surface adapted to be worn so as to be in contact with a skin; and
a multitude of electrodes formed on the contact surface of said electrode substrate for contact with the skin to present a
tactile sense by means of electrical stimulation;

wherein said electrode substrate is composed of a flexible circuit body which is flexible to enable a portion thereof in contact
with a real object to flexibly deform so as to conform to deformation of the skin, whereby it is configured such that the
electrical stimulation by said electrodes is superimposed on the tactile sense of a human being, while maintaining the human
tactile sense,

wherein said electrode substrate is flexible and has a slit formed therein to promote deformation thereof, and
wherein said electrodes are disposed on the contact surface of said electrode substrate such that in a plan view, four electrodes
are located at four vertexes of a rhombus shape formed by two pair of equilateral triangles respectively disposed in reverse
relation to each other so as to form a unit pattern of said electrodes, and said slit is formed in said electrode substrate
along an axis direction between electrodes at opposed vertexes of one of the two pair of equilateral triangles in the rhombus
shape of the unit pattern of said electrodes.

US Pat. No. 9,274,415

PHOTOMASK, PHOTOMASK SET, EXPOSURE APPARATUS AND EXPOSURE METHOD

NIPPON MEKTRON, LTD., (J...

1. An exposure apparatus for exposing both faces of a substrate wherein both the faces have a photosensitive material formed
thereon, the exposure apparatus comprising:
a first moving mechanism comprising a first drive source and moving by driving the first drive source a first photomask disposed
to oppose one face of the substrate at a position where exposure is performed;

a second moving mechanism comprising a second drive source and moving by driving the second drive source a second photomask
disposed to oppose other face of the substrate at a position where exposure is performed;

an imaging means for imaging a first alignment mark formed on the first photomask and a substrate side mark formed on the
substrate and imaging a second alignment mark formed on the first photomask and a third alignment mark formed on the second
photomask;

a first pressure generating means for retaining the substrate by the first photomask by utilizing negative pressure or releasing
retention of the substrate by the first photomask by utilizing positive pressure;

a second pressure generating means for retaining the substrate by the second photomask by utilizing negative pressure or releasing
retention of the substrate by the second photomask by utilizing positive pressure; and

a control unit for controlling driving of the first drive source, the second drive source, the imaging means, the first pressure
generating means and the second pressure generating means, wherein

the control unit controls the first drive source so that alignment between the first alignment mark and the substrate side
mark is performed based on results of imaging these marks in the imaging means,

the control unit controls driving of the first pressure generating means so as to retain the substrate by the first photomask
by utilizing negative pressure after alignment between the substrate and the first photomask is performed by controlling the
first drive source,

the control unit controls the second drive source so that alignment between the second alignment mark and the third alignment
mark is performed based on results of imaging these marks in the imaging means, and

the control unit controls driving of the second pressure generating means so as to retain the substrate by the second photomask
by utilizing negative pressure after alignment between the substrate and the second photomask is performed by controlling
the second drive source.

US Pat. No. 9,176,271

LIGHT GUIDE PLATE AND METHOD FOR MANUFACTURING LIGHT GUIDE PLATE

NIPPON MEKTRON, LTD., To...

1. A light guide plate for guiding a light which has entered into the light guide plate to propagate therein and exit from
a predetermined emission surface thereof, the light guide plate comprising:
a flat base material; and
a dot pattern of white ink including an acrylic acid ester directly disposed on and soaked into a surface of the flat base
material, the surface being opposite to the emission surface;

wherein the base material is made of a thermosetting polyurethane as an elastomer of predetermined high flexibility and exhibits
a shore-A hardness of 60 to 98, inclusive, and

for the white ink, a swellability of a predetermined value or more allows the base material to increase in weight by 10% or
more as a result of being soaked in the white ink for one hour.

US Pat. No. 9,655,239

FLEXIBLE PRINTED CIRCUIT BOARD WITH COMPONENT MOUNTING SECTION FOR MOUNTING ELECTRONIC COMPONENT AND FLEXIBLE CABLE SECTIONS EXTENDING IN DIFFERENT DIRECTIONS FROM THE COMPONENT MOUNTING SECTION

NIPPON MEKTRON, LTD., To...

1. A flexible printed circuit board, comprising: a support plate; two first partial flexible printed circuit boards, each
of which includes a first partial component mounting section having a first land formed on a surface thereof and a first interlayer
conduction path electrically connected with the first land, and a flexible cable section extending from the first partial
component mounting section; two second partial flexible printed circuit boards, each of which includes a second partial component
mounting section having a second land formed on a surface thereof and a second interlayer conduction path electrically connected
with the second land, and a flexible cable section extending from the second partial component mounting section; wherein a
lower component mounting section, which is configured such that the two of the first partial component mounting sections are
arranged on a first plane, being fixed onto the support plate; an upper component mounting section, which is configured such
that the two of the second partial component mounting sections are arranged on a second plane, being stacked on the lower
component mounting section through an anisotropic conductive layer having a conductive particle; and the first land being
electrically connected with the second land positioned directly thereon through the conductive particle and the second interlayer
conduction path.
US Pat. No. 9,133,300

RESIN COMPOSITION FOR ADHESIVE, ADHESIVE CONTAINING RESIN COMPOSITION FOR ADHESIVE, ADHESIVE SHEET CONTAINING RESIN COMPOSITION FOR ADHESIVE, AND PRINTED WIRING BOARD INCLUDING ADHESIVE OR ADHESIVE SHEET AS ADHESIVE LAYER

TOYO BOSEKI KABUSHIKI KAI...

1. A resin composition for an adhesive, comprising:
a polyurethane resin (a-1) containing a carboxyl group, having an acid value of not less than 100 equivalent/106 g and not more than 1000 equivalent/106 g, having a number average molecular weight of not less than 5.0×103 and not more than 1.0×105, and having a glass transition temperature of 30° C. or more and 80° C. or less;

a polyester resin (a-2) having a number average molecular weight of not less than 5.0×103 and not more than 1.0×105 and having a glass transition temperature of ?5° C. or less;

an epoxy resin (b) containing a nitrogen atom; and
an epoxy resin (c) having a dicyclopentadiene skeleton, wherein
a content rate of said polyurethane resin (a-1) to a sum of said polyurethane resin (a-1) and said polyester resin (a-2) is
not less than 70 percent by mass and not more than 95 percent by mass,

a content rate of the total epoxy resin contained in the resin composition to the sum of said polyurethane resin (a-1) and
said polyester resin (a-2) is not less than 5 percent by mass and not more than 30 percent by mass, and

a blending ratio of said epoxy resin (b) is not less than 0.1 percent by mass and not more than 20 percent by mass of the
total epoxy resin contained in the resin composition.

US Pat. No. 9,334,962

GASKET FOR SMALL SIZE ELECTRONIC APPLIANCE

Nippon Mektron, Ltd., (J...

1. A waterproof gasket assembly having a retention groove provided in one of first and second case members and a water proof
gasket to be retained in said retention groove, said waterproof gasket comprising:
straight portions and corner portions provided alternately in a peripheral direction corresponding to outer peripheral shapes
of said first and second case members;

a main seal portion formed to be brought into close contact with another of said first and second case members; and
a seat seal portion formed to be brought into close contact with a bottom surface of said gasket retention groove;
wherein said straight portion has a shoulder portion protruding out in a width direction between said main seal portion and
the seat seal portion to be brought into close contact with an inner side surface of a groove shoulder of said gasket retention
groove,

wherein said corner portion has a recession portion retracting in a width direction relatively from said shoulder portion
between said main seal portion and the seat seal portion, and

wherein, a first gap distance between said shoulder portion and said inner side surface of said groove shoulder is smaller
than a second gap distance between said recession portion and said inner side surface of said groove shoulder.

US Pat. No. 9,084,352

LID MEMBER WITH WATERPROOFING FUNCTION

Nippon Mektron, Ltd., (J...

1. A lid member with a waterproofing function for opening and closing an opening portion formed in a housing, the lid member
comprising:
a resin main body accommodated in said opening portion;
a projection portion which is integrally formed in one surface of said resin main body, said projection portion having a distal
end surface and an outer peripheral surface; and

an elastic seal portion which is integrally formed in said outer peripheral surface of said projection portion, said seal
portion including an annular projection configured to abut an inner peripheral surface of said opening portion,

wherein said annular projection is formed as a shape which is expanded toward an inner portion side of said housing in said
opening portion, has a tapered outer peripheral surface which converges toward said inner portion side, and is provided with
a seal surface having a circular arc shaped cross section extending from said tapered outer peripheral surface toward said
resin main body, and

wherein a maximum diameter of said seal surface is positioned closer to said inner portion side of said housing than said
distal end surface.

US Pat. No. 9,198,298

METHOD FOR MANUFACTURING TRANSPARENT PRINTED CIRCUIT AND METHOD FOR MANUFACTURING TRANSPARENT TOUCH PANEL

NIPPON MEKTRON, LTD., To...

1. A manufacturing method for a transparent printed circuit, comprising:
providing a transparent conductive sheet having a transparent base material and a transparent conductive layer formed on the
transparent base material;

forming, by screen printing, an etching resist having a specified pattern on the transparent conductive layer;
etching the transparent conductive layer with the etching resist as a mask;
forming, by screen printing, a peeling film on the etching resist and on the transparent base material exposed by the etching
of the transparent conductive layer so as to cover an area where the etching resist is formed, the peeling film consisting
of a material identical to the material of the etching resist; and

peeling the peeling film together with the etching resist.

US Pat. No. 9,185,802

FLEXIBLE PRINTED CIRCUIT BOARD WITH COMPONENT MOUNTING SECTION FOR MOUNTING ELECTRONIC COMPONENT AND FLEXIBLE CABLES EXTENDING IN DIFFERENT DIRECTIONS FROM THE COMPONENT MOUNTING SECTION, AND METHOD OF MANUFACTURING THE SAME

NIPPON MEKTRON, LTD., To...

1. A method of manufacturing a flexible printed circuit board that includes a component mounting section for mounting an electronic
component and a plurality of flexible cables extending in different directions from the component mounting section and extending
in different directions from one another, comprising:
manufacturing a plurality of partial flexible printed circuit boards in a predetermined sheet, each of the partial flexible
printed circuit board including a partial component mounting section formed by dividing the component mounting section into
a predetermined number of parts and a flexible cable extending from the partial component mounting section, the flexible cable
being one of the plurality of flexible cables;

cutting an area including the partial flexible printed circuit board from the sheet;
after cutting the area from the sheet, performing an alignment of the predetermined number of partial flexible printed circuit
boards such that the predetermined number of partial component mounting sections are combined to configure the component mounting
section for mounting an electronic component; and

after the alignment, fixing the predetermined number of aligned partial flexible printed circuit boards to a flexible support
plate such that the predetermined number of aligned partial flexible printed circuit boards are arranged adjacent to each
other.

US Pat. No. 9,635,751

FLEXIBLE CIRCUIT BODY AND METHOD FOR PRODUCTION THEREOF

Nippon Mektron, Ltd., Mi...

1. A flexible circuit body comprising a flexible wiring board having an insulating film, a wiring layer formed on the insulating
film, and an insulating layer having an adhesive layer formed on the wiring layer,
the flexible circuit body being configured to have a wear-resistant thermoplastic elastomer coated on at least part of a surface
of the flexible wiring board, and to have an expansion-contraction portion bent to have at least one predetermined curved
portion shape that is formed and retained even after expansion and contraction deformation in the flexible wiring board, with
the thermoplastic elastomer being provided on at least a portion of the at least one predetermined curved portion shape of
the expansion-contraction portion that is subjected to rubbing, wherein

the flexible wiring board is provided with a mounted component, and the thermoplastic elastomer is coated on a thermoplastic
resin in which the mounted component is embedded,

the thermoplastic resin in which the mounted component is embedded is a low-hardness thermoplastic resin with a hardness lower
than that of the thermoplastic elastomer,

the thermoplastic elastomer is a high-hardness thermoplastic polyurethane elastomer and the low-hardness thermoplastic resin
is a low-hardness thermoplastic polyurethane resin, and

a hardness of the high-hardness thermoplastic polyurethane elastomer is equal to or higher than JIS A80 and equal to or less
than JIS A95, and a hardness of the low-hardness thermoplastic polyurethane resin is equal to or less than JIS A70.

US Pat. No. 9,788,439

MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD

NIPPON MEKTRON, LTD., To...

1. A manufacturing method of a multilayer printed wiring board comprising:
attaching an adhesive protective film having a weak adhesive layer formed on one side thereof to a single-sided metal-foiled
laminate sheet having a first insulating resin film and a first metal foil on a front face of the first insulating resin film
in such a way that the weak adhesive layer contacts with a rear face of the first insulating resin film;

forming a bottomed via hole that has a bottom face with the first metal foil exposed therefrom by partially removing the adhesive
protective film and the first insulating resin film;

first printing of filling a conductive paste into the bottomed via hole by a printing method;
peeling off the adhesive protective film from the first insulating resin film and causing a part of the conductive paste filled
in the bottomed via hole to protrude from the first insulating resin film to obtain a first wiring substrate;

forming, on a double-sided metal-foiled laminate sheet having a second insulating resin film and second and third metal foils
respectively provided on a front face and a rear face of the second insulating resin film, a piercing mask by patterning the
second metal foil;

forming an adhesive protective layer including an adhesive-agent layer that covers the front face of the second insulating
resin film and buries the patterned second metal foil and a protective film that is laminated on the adhesive-agent layer;

forming a bottomed step via hole that has a middle part with the piercing mask exposed therefrom and a bottom face with the
third metal foil exposed therefrom by partially removing the adhesive protective layer and the second insulating resin film;

second printing of filling a conductive paste into the bottomed step via hole by a printing method;
peeling off the protective film from the adhesive-agent layer and causing a part of the conductive paste filled in the bottomed
step via hole to protrude from the adhesive-agent layer to obtain a second wiring substrate; and

laminating in which the first wiring substrate and the second wiring substrate are laminated in such a way that a protruding
part of the conductive paste filled in the bottomed via hole of the first wiring substrate comes into contact with a protruding
part of the conductive paste filled in the bottomed step via hole of the second wiring substrate, and the laminated first
and second wiring substrates are heated to be integrated with each other.

US Pat. No. 9,574,955

PRESSURE SENSING ELEMENT HAVING AN INSULATING LAYER WITH AN INCREASED HEIGHT FROM THE SUBSTRATE TOWARDS THE OPENING

NIPPON MEKTRON, LTD., To...

1. A pressure sensing element comprising:
a support substrate;
a sensor electrode supported by the support substrate;
a pressure sensing film functionalized to be electro-conductive, at least in a portion thereof faced to the sensor electrode;
and

an insulating layer which keeps the sensor electrode and the pressure sensing film apart from each other by a predetermined
distance, and has formed therein an opening in which the sensor electrode is exposed to the pressure sensing film,

the insulating layer having an aperture wall which partitions the opening, and an aperture end faced to the pressure sensing
film, and

the insulating layer being increased in height, measured from the support substrate, continuously towards the opening.

US Pat. No. 9,310,575

MANUFACTURING METHOD OF OPTO-ELECTRIC HYBRID FLEXIBLE PRINTED CIRCUIT BOARD AND OPTO-ELECTRIC HYBRID FLEXIBLE PRINTED CIRCUIT BOARD

NIPPON MEKTRON, LTD., To...

1. A manufacturing method of an opto-electric hybrid flexible printed circuit board, the opto-electric hybrid flexible printed
circuit board including a flexible printed circuit board having a first principal surface and a second principal surface on
an opposite side to the first principal surface; a flexible optical waveguide provided along the first principal surface of
the flexible printed circuit board and made of organic polymer; and a surface light-emitting element and a surface light-receiving
element both of which are implemented on the second principal surface of the flexible printed circuit board, the method comprising:
a step of pasting a first flexible cladding layer with a flexible core layer;
a step of forming a core, by patterning the flexible core layer, such that a width of one end of the core is larger than that
of a light-emitting part of the surface light-emitting element and that a width of other end of the core is smaller than that
of a light-receiving part of the surface light-receiving element;

a step of producing the flexible optical waveguide by pasting a second flexible cladding layer on the first cladding layer
so as to cover the core;

a step of pasting the flexible optical waveguide at a predetermined position on the first principal surface of the flexible
printed circuit board via an adhesive sheet;

a mirror forming step of respectively forming, at the one end and the other end of the core, a first optical path converting
mirror and a second optical path converting mirror each of which converts an optical path of signal light due to light reflection
on an end face by processing the flexible optical waveguide pasted with the flexible printed circuit board;

a first ultrasonic bonding step, performed after the mirror forming step, of implementing the surface light-emitting element
on the flexible printed circuit board such that the signal light emitted from the light-emitting part of the surface light-emitting
element is reflected by the first optical path converting mirror and propagates in the core; and

a second ultrasonic bonding step, performed after the mirror forming step, of implementing the surface light-receiving element
on the flexible printed circuit board such that the signal light reflected by the second optical path converting mirror is
incident on the light-receiving part of the surface light-receiving element, wherein

in the first ultrasonic bonding step, an ultrasonic wave traveling along a width direction of the core is applied to the surface
light-emitting element while pressure in a thickness direction is exerted on the surface light-emitting element placed at
a predetermined position on the flexible printed circuit board, thereby electrically connecting a first electrode of the surface
light-emitting element, which is provided on the same face as that of the light-emitting part, to a first pad provided on
the second principal surface of the flexible printed circuit board,

in the second ultrasonic bonding step, the ultrasonic wave traveling along the width direction of the core is applied to the
surface light-receiving element while the pressure in the thickness direction is exerted on the surface light-receiving element
placed at a predetermined position on the flexible printed circuit board, thereby electrically connecting a second electrode
of the surface light-receiving element, which is provided on the same face as that of the light-receiving part, to a second
pad provided on the second principal surface of the flexible printed circuit board.

US Pat. No. 9,148,963

LASER PROCESSING METHOD AND PRODUCTION METHOD OF MULTILAYER FLEXIBLE PRINTED WIRING BOARD USING LASER PROCESSING METHOD

NIPPON MEKTRON, LTD., To...

1. A laser processing method of forming a via hole in a structure that includes a first insulating layer, a second insulating
layer, and a conductive film, wherein
the conductive film defines a bottom of the via hole,
the first insulating layer is provided with a first conformal mask on a top surface thereof and is characterized by a first
absorbance at an operational wavelength of a pulsed laser and by a first decomposition temperature, wherein the value of the
operational wavelength is one selected from one or more wavelength values that allow for functional operation of the pulsed
laser, and

the second insulating layer is provided below the first insulating layer and is characterized by a second absorbance that
is higher than the first absorbance at the operational wavelength and by a second decomposition temperature that is lower
than the first decomposition temperature,
the method comprising:
a first irradiation step of radiating one shot of a first light from the pulsed laser onto the structure to completely remove
a portion of the first insulating layer that is exposed by a mask hole of the first conformal mask, a first energy density
of the first light being selected so that the conductive film is not deformed or penetrated by the one shot of the first light;
and

a second irradiating step of radiating a predetermined number of shots of a second light from the pulsed laser onto the structure
to remove a portion of the second insulating layer that is below the completely removed portion of the first insulating layer
so as to form the via hole, the second light having a second energy density that is lower than the first energy density and
the second energy density being selected so that the conductive film is not deformed or penetrated by the predetermined number
of shots of the second light.

US Pat. No. 9,883,584

METHOD OF MANUFACTURING A MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD

NIPPON MEKTRON, LTD., To...

1. A method of manufacturing a multilayer flexible printed circuit board having a strip line foldable at a folding part, the
method comprising:
a process of preparing a laminate body having a flexible insulative substrate, an inner layer circuit pattern provided inside
the flexible insulative substrate and including a signal line extending in a predetermined direction, and metal foils covering
both sides of the flexible insulative substrate;

an opening part forming process of removing the metal foils at least in the folding part out of a ground layer formation scheduled
region to form an opening part from a bottom face of which the flexible insulative substrate is exposed;

a nonelectrolytic plating process of forming a nonelectrolytic plating coat on the flexible insulative substrate that is exposed
from the bottom face of the opening part by a nonelectrolytic plating method;

an etching mask forming process of forming an etching mask covering the nonelectrolytic plating coat;
an exposed part forming process of removing the nonelectrolytic plating coat that is not covered by the etching mask to form
a ground thin film constituted of the nonelectrolytic plating coat and an exposed part from which the flexible insulative
substrate is exposed; and

a protective layer forming process of forming a protective layer that covers the ground thin film and is in close contact
with the exposed part.

US Pat. No. 9,763,323

STRETCHABLE CIRCUIT BOARD

NIPPON MEKTRON, LTD., To...

1. A stretchable circuit board comprising a sheet-like stretchable base capable of stretching and contracting, a stretchable
interconnect part formed on or above at least one major surface of the stretchable base, and an external terminal connected
to the interconnect part,
the stretchable circuit board having a reinforcing area having in-plane rigidity higher than that of the stretchable base,
and a stretchable area which remains after excluding the reinforcing area,

the interconnect part being formed across a boundary part between the reinforcing area and the stretchable area, and
a sheet-like stretchable auxiliary member, capable of stretching and contracting, being provided to the boundary part having
the interconnect part formed therein.

US Pat. No. 10,076,025

STRETCHABLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

NIPPON MEKTRON, LTD., To...

1. A stretchable circuit board, comprising:a plurality of stretchable bases comprising:
a first stretchable base having a first main surface and a second main surface opposite to the first main surface, the first stretchable base having a first through opening, and
a second stretchable base having a third main surface and a fourth main surface opposite to the third main surface, the second stretchable base having a second through opening, the first stretchable base being joined with the second stretchable base such that the second main surface is opposed to the third main surface; and
a plurality of stretchable wiring portions comprising:
a first stretchable wiring portion, and
a second stretchable wiring portion,
wherein an entire of the first stretchable wiring portion and an entire of the second stretchable wiring portion are extended between the second main surface and the third main surface,
wherein the first stretchable wiring portion and the second stretchable wiring portion are integrally fused to each other and electrically connected therebetween,
wherein the first stretchable wiring portion is formed on the second main surface of the first stretchable base,
wherein the second stretchable wiring portion is formed on the third main surface of the second stretchable base,
wherein the first stretchable wiring portion and the second main surface overlap with the second through opening such that the first stretchable wiring portion is exposed through the second through opening in a direction toward the fourth main surface,
wherein the second stretchable wiring portion and the third main surface overlap with the first through opening such that the second stretchable wiring portion is exposed through the first through opening in a direction toward the first main surface.

US Pat. No. 9,961,766

STRETCHABLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING STRETCHABLE CIRCUIT BOARD

NIPPON MEKTRON, LTD., To...

1. A stretchable circuit board, comprising:a stretchable base;
a stretchable wiring portion formed on a main surface located on at least one side of the stretchable base, and having stretchability;
a reinforcement base having in-plane rigidity higher than that of the stretchable base; and
a draw-out wiring portion formed on a main surface located on at least one side of the reinforcement base, wherein
the main surface of the reinforcement base is overlaid with a part of an area of the main surface of the stretchable base, where the stretchable wiring portion is formed, in a manner such that the main surface of the reinforcement base faces the main surface of the stretchable base, and
a part of the stretchable wiring portion and a part of the draw-out wiring portion are joined together, and are electrically continuous with each other.

US Pat. No. 10,084,211

FLEXIBLE PRINTED CIRCUIT WITH BUS BARS, MANUFACTURING METHOD THEREOF, AND BATTERY SYSTEM

NIPPON MEKTRON, LTD., To...

1. A flexible printed circuit with bus bars comprising:a flexible printed wiring board having a flexible insulating base material, and a plurality of wiring patterns provided on one main surface of the flexible insulating base material and provided with land parts for bus bar connection at one end; and
a plurality of bus bars fixed to the respectively corresponding land parts for the bus bar connection with an adhesive, wherein
the bus bar is electrically connected to the land part for the bus bar connection by a first plating layer formed on the bus bars and the land parts for the bus bar connection,
and wherein the bus bar is electrically connected to the land part for the bus bar connection by plating through-holes formed a second plating layer which is formed on an inner wall of a through-hole for electrical conduction provided in the flexible insulating base material and a third plating layer which formed on the bus bar exposed in the through-hole for electrical conduction and connected to the second plating layer, no screw being passed through the through-hole for electrical conduction.

US Pat. No. 10,004,148

MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD

NIPPON MEKTRON, LTD., To...

1. A manufacturing method of a multilayer printed wiring board comprising:forming, in a first single-sided metal-foiled laminate sheet having a first insulating resin film and a first metal foil on a front face of the first insulating resin film, a first adhesive protective layer having a first adhesive-agent layer that covers a rear face of the first insulating resin film and a first protective film that is laminated on the adhesive-agent layer;
forming a first bottomed via hole having a bottom face with the first metal foil exposed therefrom by partially removing the first adhesive protective film and the first insulating resin film;
first printing of filling a conductive paste into the first bottomed via hole by a printing method;
peeling off the first protective film from the first adhesive-agent layer and causing a part of the conductive paste filled in the first bottomed via hole to protrude from the first adhesive-agent layer to obtain a first wiring substrate;
forming, in a double-sided metal-foiled laminate sheet having a second insulating resin film and second and third metal foils respectively provided on a front face and a rear face of the second insulating resin film; a first piercing mask and a first reception land by patterning the second metal foil and forming a second piercing mask and a second reception land by patterning the third metal foil;
attaching a first adhesive protective film having a weak adhesive layer formed on one side thereof to the double-sided metal-foiled laminate sheet in such a way that the weak adhesive layer contacts with the front face of the second insulating resin film and buries the patterned second metal foil;
attaching a second adhesive protective film having a weak adhesive layer formed on one side thereof to the double-sided metal-foiled laminate sheet in such a way that the weak adhesive layer contacts with the rear face of the second insulating resin film and buries the patterned third metal foil;
forming a first bottomed step via hole having a middle part with the first piercing mask exposed therefrom and a bottom face with the second reception land exposed therefrom by partially removing the first adhesive protective layer and the second insulating resin film;
forming a second bottomed step via hole having a middle part with the second piercing mask exposed therefrom and a bottom face with the first reception land exposed therefrom by partially removing the second adhesive protective layer and the second insulating resin film;
second printing of filling a conductive paste into the first bottomed step via hole by a printing method;
third printing of filling a conductive paste into the second bottomed step via hole by a printing method;
peeling off the first adhesive protective film from the second insulating resin film and causing a part of the conductive paste filled in the first bottomed step via hole to protrude from the first piercing mask, and peeling off the second adhesive protective film from the second insulating resin film and causing a part of the conductive paste filled in the second bottomed step via hole to protrude from the second piercing mask to obtain a second wiring substrate;
forming, in a second single-sided metal-foiled laminate sheet having a third insulating resin film and a fourth metal foil on a rear face of the third insulating resin film, a second adhesive protective layer having a second adhesive-agent layer that covers a front face of the third insulating resin film and a second protective film that is laminated on the second adhesive-agent layer;
forming a second bottomed via hole having a bottom face with the fourth metal foil exposed therefrom by partially removing the second adhesive protective layer and the third insulating resin film;
fourth printing of filling a conductive paste into the second bottomed via hole by a printing method;
peeling off the second protective film from the second adhesive-agent layer and causing a part of the conductive paste filled in the second bottomed via hole to protrude from the second adhesive-agent layer to obtain a third wiring substrate; and
laminating in which the first to third wiring substrates are laminated in such a way that a protruding part of the conductive paste filled in the first bottomed via hole of the first wiring substrate comes into contact with a protruding part of the conductive paste filled in the first bottomed step via hole of the second wiring substrate and a protruding part of the conductive paste filled in the second bottomed via hole of the third wiring substrate comes into contact with the second reception land of the second wiring substrate, and the laminated first to third wiring substrates are heated to be integrated with one another.

US Pat. No. 10,136,514

EXTENSIBLE FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING EXTENSIBLE FLEXIBLE PRINTED CIRCUIT BOARD

NIPPON MEKTRON, LTD., To...

1. An extensible flexible printed circuit board having extensibility, comprising:a plurality of flexible printed circuit boards, the plurality of flexible printed circuit boards being arranged at least a surface of each of the plurality of flexible circuit boards face a surface of another of the plurality of flexible printed circuit boards; and
a covering member whose material is a flexibly deformable elastomer, and which covers the plurality of flexible printed circuit boards;
wherein at least one of the plurality of flexible printed circuit boards comprises a component mounting part structured so as to receive electronic components mounted thereon;
wherein each of the plurality of flexible printed circuit boards comprises an extensible conductive part, the extensible conductive part comprising:
an extensible pattern part comprising a plurality of joint parts each intersecting a center line when an extension/contraction direction is set to the center line, and a plurality of curved parts each continuing from an end part of the joint part, and proceeding from the joint part to return to the center line side, and exhibiting extensibility by the curved parts bending to open or close; and
a portion other than the extensible pattern part;
wherein an insulating layer is provided between adjacent flexible printed circuit boards of the plurality of flexible circuit boards, the insulating layer comprising an adhesive layer at a region corresponding to the component mounting part, and the insulating layer does not include an adhesive layer at a portion corresponding to the extensible conductive part;
wherein the covering member penetrates through the plurality of flexible printed circuit boards at the portion other than the extensible pattern part.

US Pat. No. 10,104,774

FLEXIBLE PRINTED WIRING BOARD

NIPPON MEKTRON, LTD., To...

1. A flexible printed wiring board used in a state, in which one and another ends in a longitudinal direction are fixed respectively to one and another members that move in relation to each other, in a state of being bent to be curved in the longitudinal direction,the flexible printed wiring board comprising:
a plurality of wiring board units in which a plurality of wires are formed on a flexible insulating substrate and which are molded in a state of being curved in a lateral direction, wherein
adjacent wiring board units are partially connected at side edges thereof in the lateral direction.

US Pat. No. 10,034,370

STRETCHABLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING STRETCHABLE CIRCUIT BOARD

NIPPON MEKTRON, LTD., To...

1. A stretchable circuit board, comprising:a stretchable portion that includes a stretchable base having stretchability and a stretchable wiring formed on a first main surface of the stretchable base and having stretchability; and
a non-stretchable portion that includes a base substrate having stretchability lower than that of the stretchable base and a draw-out wiring formed on a first main surface of the base substrate, wherein
the first main surface of the stretchable base and the first main surface of the base substrate are joined with each other,
the stretchable wiring and the draw-out wiring are electrically connected with each other, and
the first main surface of the base substrate is a rough surface having a projection and a depression.

US Pat. No. 10,048,141

PRESSURE SENSING ELEMENT AND PRESSURE SENSOR

NIPPON MEKTRON, LTD., To...

1. A pressure sensing element comprising:an electro-conductive pressure sensing film comprising a resin and carbon particles, the resin comprising polyimide or polyamide-imide as a main ingredient;
a sensor electrode provided at a position faced to the pressure sensing film; and
an insulating layer which creates a predetermined distance between the pressure sensing film and the sensor electrode so as to keep them apart from each other,
wherein a surface of the pressure sensing film, faced to the sensor electrode, has a surface roughness Rz of 0.10 ?m or larger and 0.50 ?m or smaller.

US Pat. No. 10,194,527

METHOD FOR MANUFACTURING STRETCHABLE CIRCUIT BOARD AND STRETCHABLE CIRCUIT BOARD

NIPPON MEKTRON, LTD., To...

1. A stretchable circuit board comprising:a first sheet member including a first main surface having a terminal portion formed thereon;
a second sheet member having a main surface and stretchability higher than that of the first sheet member, and joined to the first sheet member;
the main surface of the second sheet member opposed to the main surface of the first sheet member includes a stretchable wiring portion which is a printed pattern including a resin binder and a conductive material, wherein the stretchable wiring portion directly contacts the terminal portion between the first sheet member and the second sheet member, and
wherein the stretchable wiring portion is a series of layers from the terminal portion to an area on the second sheet member that does not overlap with the first sheet member, and the stretchable wiring portion has a constant width when viewed from above.

US Pat. No. 10,162,137

APPARATUS AND METHOD FOR MOUNTING PHOTOELECTRIC ELEMENT

NIPPON MEKTRON, LTD., To...

8. A mounting apparatus for mounting an optical element on a wiring board provided with an optical waveguide having a reflecting mirror part on one side, said optical element being mounted on the other side of the wiring board, comprising:a mounting table configured to support said wiring board on a surface of a holding area including an optically-transmitting area, to face the one side of said wiring board;
a mounting nozzle configured to hold said optical element and mount said optical element on said wiring board;
a light source that is located opposite said wiring board with respect to the mounting table, and configured to emit light for illuminating said reflecting mirror part of said wiring board supported by the holding area, through said optically-transmitting area;
an image pickup apparatus configured to drive with the mounting nozzle integrally, and image said reflecting mirror part which is illuminated by the light through the optically-transmitting area; and
a controller configured to obtain a geometrical center of the image of said reflecting mirror part or a point of maximum intensity of the light, calculated by using the image of said reflecting mirror part, so as to control the mounting nozzle to mount said optical element onto a mount position on the wiring board, the mount position being determined based on the geometrical center or the point of maximum intensity.

US Pat. No. 10,398,024

STRETCHABLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING STRETCHABLE CIRCUIT BOARD

NIPPON MEKTRON, LTD., To...

1. A stretchable circuit board, comprising:a stretchable base;
a stretchable wiring portion formed on at least one of a first main surface and a second main surface of the stretchable base;
a reinforcement base having in-plane rigidity higher than that of the stretchable base;
a conductor portion formed on at least one of a first main surface and a second main surface of the reinforcement base, and electrically continuous with the stretchable wiring portion; and
an elastomer layer formed on at least one of the first main surface and the second main surface of the reinforcement base, wherein
the reinforcement base overlaps with a partial area of the stretchable base,
an other area of the stretchable base is exposed from the reinforcement base,
the stretchable wiring portion extends on the other area and over the partial area,
the elastomer layer and the stretchable base are layered and joined with each other,
the elastomer layer lies between the conductor portion and the reinforcement base,
the conductor portion is in contact with one surface of the elastomer layer,
the elastomer layer has an electrically insulating property, and
the elastomer layer entirely covers the first main surface of the reinforcement base.

US Pat. No. 10,383,224

METHOD OF MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD WITH COMPONENT MOUNTING SECTION FOR MOUNTING ELECTRONIC COMPONENT AND FLEXIBLE CABLE SECTIONS EXTENDING IN DIFFERENT DIRECTIONS FROM THE COMPONENT MOUNTING SECTION

NIPPON MEKTRON, LTD., To...

1. A method of manufacturing a flexible printed circuit board, comprising:manufacturing a plurality of first partial flexible printed circuit boards each of which includes a first partial component mounting section having a first land formed on a surface thereof and a flexible cable section extending from the first partial component mounting section;
manufacturing a plurality of second partial flexible printed circuit boards each of which includes a second partial component mounting section having a second land formed on a surface thereof and an interlayer conduction path electrically connected with the second land and a flexible cable section extending from the second partial component mounting section;
forming a lower flexible printed circuit board by performing an alignment so that the first partial component mounting sections of the two first partial flexible printed circuit boards are arranged on the same plane and configure a lower component mounting section and then fixing the two first partial flexible printed circuit boards onto a support plate;
forming an upper flexible printed circuit board by performing an alignment so that the second partial component mounting sections of the two second partial flexible printed circuit boards are arranged on the same plane and configure an upper component mounting section and then fixing the two second partial flexible printed circuit boards onto an anisotropic conductive film containing a conductive particle therein; and
forming a component mounting section in which the upper component mounting section is stacked on the lower component mounting section and the first land is electrically connected with the second land positioned directly thereon through the conductive particle and the interlayer conduction path, by placing the upper flexible printed circuit board on the lower flexible printed circuit board and performing heating pressurizing.

US Pat. No. 10,321,578

FILLING METHOD OF CONDUCTIVE PASTE AND MANUFACTURING METHOD OF MULTI-LAYER PRINTED CIRCUIT BOARD

NIPPON MEKTRON, LTD., To...

1. A filling method of conductive paste, comprising:a process of preparing a metal foil clad laminated sheet having an insulative base material having a first principal surface and a second principal surface opposite to the first principal surface and a metal foil provided on the second principal surface of the insulative base material;
a process of providing a protective film on the first principal surface of the metal foil clad laminated sheet;
a boring process of partially removing the protective film and the insulative base material, and thereby, forming a bottomed via hole having the metal foil exposed on its bottom face;
a groove forming process of removing the protective film from a surface to a midway thereof to form a conductive paste flowing groove having the bottomed via hole exposed on its bottom face;
a housing member preparing process of preparing a housing member in which a conductive paste injecting channel and a vacuum evacuating channel are provided and has an opening face on which one end of each of the conductive paste injecting channel and the vacuum evacuating channel opens;
a housing member disposing process of disposing the housing member on the protective film such that the opening face opposes the protective film, and thereby, causing the conductive paste injecting channel and the vacuum evacuating channel to communicate with a conductive paste flowing space defined by the bottomed via hole, the conductive paste flowing groove and the opening face of the housing member;
a process of depressurizing the conductive paste flowing space via the vacuum evacuating channel;
a filling process of injecting conductive paste into the conductive paste flowing space via the conductive paste injecting channel, and thereby, filling an inside of the bottomed via hole with the conductive paste; and
a process of peeling off the protective film with the conductive paste flowing groove on its surface to remain the conductive paste in the bottomed via hole and to cause part of the conductive paste with which the bottomed via hole is filled to protrude, wherein
in the boring process, a plurality of the bottomed via holes are formed, and
in the groove forming process, the conductive paste flowing groove is formed so as to join the plurality of bottomed via holes.

US Pat. No. 10,232,464

ULTRASONIC BONDING JIG, ULTRASONIC BONDING METHOD, AND BONDING STRUCTURE

NIPPON MEKTRON, LTD., To...

1. An ultrasonic bonding jig comprising:a planar surface;
a plurality of protrusions formed on the planar surface; and
recessed portions, each of which are recessed in the planar surface, and each recessed portion is recessed to a side opposite to a projection direction of the protrusions along which each of the plurality of protrusions has been projected, the recessed portions being arranged on at least two sides of each of the plurality of protrusions in a direction orthogonal to the projection direction.

US Pat. No. 10,288,574

WETTING SENSOR AND WETTING SENSING SYSTEM

NIPPON MEKTRON, LTD., To...

1. A wetting sensor comprising:a stretchable circuit board having stretchability;
a first stretchable wiring line as a wiring line formed on a surface of the stretchable circuit board and having stretchability in accordance with the stretchability of the stretchable circuit board;
a second stretchable wiring line as a wiring line formed on the surface and having stretchability in accordance with the stretchability of the stretchable circuit board;
a first electrode connected to the first stretchable wiring line;
a second electrode connected to the second stretchable wiring line;
a water absorbing member configured to cover at least a part of each of the first electrode and the second electrode; and
a measurer configured to measure an electric characteristic between the first electrode and the second electrode which are contacting the water absorbing member,
wherein the first electrode includes multiple first electrode elements and the second electrode includes multiple second electrode elements.

US Pat. No. 10,379,064

SUBSTRATE INSPECTION DEVICE AND SUBSTRATE MANUFACTURING METHOD

NIPPON MEKTRON, LTD., To...

1. A substrate inspection device for inspecting a flexible printed board comprising a base member made of polyimide material and a transparent adhesive material applied thereto to determine whether the transparent adhesive material is properly applied, the substrate inspection device comprising:a substrate reading device that irradiates the flexible printed board with visible light to acquire image data of the flexible printed board;
an adhesive material position determination unit that determines a position of adhesive material CAD data corresponding to the transparent adhesive material, with respect to blue color image data among the image data corresponding to blue light that is readily absorbed by the polyimide;
an edge enhancing unit that performs processing, on image data including at least the blue color image data, to enhance an edge of the transparent adhesive material; and
a straight line determination unit that determines whether, based on edge enhanced data in which the edge of the transparent adhesive material has been enhanced by the edge enhancing unit, the edge of the transparent adhesive material is present in the edge enhanced data.

US Pat. No. 10,485,093

FLEXIBLE PRINTED BOARD AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED BOARD

NIPPON MEKTRON, LTD., To...

1. A flexible printed board on which a power consuming load is mounted, comprising:a front surface heat dissipation layer made of a copper foil and having a circuit portion on which the load is mounted;
a thermally conductive resin layer having the front surface heat dissipation layer laminated to a front surface side thereof and having a thermal conductivity of 0.49 W/mK or more, the front surface heat dissipation layer being arranged between the power consuming load and the thermally conductive resin layer with respect to a thickness direction, the front surface heat dissipation layer being directly contact with a front surface side of the thermally conductive resin layer; and
a rear surface heat dissipation layer made of a copper foil, laminated to and in direct contact with a rear surface side of the thermally conductive resin layer, and having a thickness of 100 to 400% with respect to the front surface heat dissipation layer.

US Pat. No. 10,391,584

ULTRASONIC BONDING JIG, ULTRASONIC BONDING METHOD, AND BONDING STRUCTURE

NIPPON MEKTRON, LTD., To...

1. An ultrasonic bonding jig comprising:a plurality of protrusions; and
a planar portion arranged among the plurality of protrusions at base ends of the plurality of protrusions, wherein
the planar portion has a flat surface that covers a continuous area between the base ends of the protrusions,
the plurality of protrusions have side surfaces that are tapered, at least one of the side surfaces being aligned in a direction orthogonal to a direction in which another of the side surfaces is aligned,
an inclination of a tangent of the side surface directly adjacent to a distal end of each of the plurality of protrusions, with respect to the planar portion, is larger than an inclination of a tangent of the side surface directly adjacent to the base end of each of the plurality of protrusions, with respect to the planar portion, the inclination varying in uncurved stages between the distal end and the planar portion of each of the plurality of protrusions, and
the side surfaces directly adjacent to the distal end of each of the plurality of protrusions are aligned perpendicular with respect to the planar portion.

US Pat. No. 10,410,106

ATTACHMENT TAG AND TAG SYSTEM

NIPPON MEKTRON, LTD., To...

1. An attachment tag comprising:a stretchable circuit board having stretchability;
a stretchable wiring line provided on a first main surface of the stretchable circuit board and having stretchability, the stretchable wiring line containing a resin binder;
an identification signal generator connected to the stretchable wiring line and configured to generate an identification signal containing identification information;
a transmitter configured to transmit the identification signal generated by the identification signal generator;
an adhesive layer provided on a second main surface, different from the first main surface, of the stretchable circuit board and exhibiting adhesiveness, and:
on a side of the attachment tag opposite to the adhesive layer, a printing target layer to which ink is applied and which exhibits lower visible light permeability than that of the stretchable circuit board.