1. A circuit board structure, comprising:a core substrate;
an insulation layer disposed on the core substrate;
a patterned metal layer disposed on the insulation layer, wherein the patterned metal layer comprises a wiring layer and a pad;
a first metal pillar disposed on the pad, and the first metal pillar has a top surface;
a second metal pillar disposed on the wiring layer; and
a first solder-resist layer disposed on the patterned metal layer and the first metal pillar, and the first solder-resist layer has a first opening exposing the first metal pillar and the second metal pillar, and the first opening has a bottom surface, wherein the top surface of the first metal pillar is higher than or equal to the bottom surface of the first opening, and the first metal pillar has an upper portion higher than the bottom surface of the first opening and the upper portion of the first metal pillar is not in direct contact with a sidewall of the first opening.