US Pat. No. 9,242,017

SYSTEM AND METHOD TO ELECTRONICALLY DETERMINE ADEQUATE GAMMA RADIATION STERILIZATION TIME

Maxim Integrated Products...

1. An integrated circuit comprising:
a sensing module that senses radiation incident on the integrated circuit, wherein the sensing module includes a MOSFET having
threshold voltage that shifts due to the radiation;

a measuring module that communicates with the sensing module and that measures an amount of the radiation incident on the
integrated circuit based on an amount of shift in the threshold voltage of the MOSFET due to the radiation; and

a comparing module that communicates with the measuring module and that compares the amount of the radiation to a predetermined
threshold and that generates an indication that the amount of the radiation is less than the predetermined threshold or that
the amount of the radiation is greater than or equal to the predetermined threshold.

US Pat. No. 9,152,161

MAINTAIN POWER SIGNATURE (MPS) POWERED DEVICE (PD)

Maxim Integrated Products...

1. A current sense based Maintain Power Signature (MPS) Powered Device (PD) comprising:
a current sensor configured to sense current flowing from Power Sourcing Equipment (PSE) to the PD; and
a current generator configured to sink electrical current for preventing the PSE from removing power to the PD, the electrical
current comprising a current amplitude characteristic selected based upon MPS requirements of the PSE, wherein the current
generator is configured to sink pulses of electrical current comprising timing characteristics selected based upon MPS requirements
of the PSE.

US Pat. No. 9,305,506

VCOM AMPLIFIER WITH TRANSIENT ASSIST CIRCUIT

Maxim Integrated Products...

1. A method of providing an output voltage to a load, the method comprising:
using an application circuit to output an output voltage, wherein the application circuit comprises a linear amplifier coupled
to a power supply;

receiving a feedback voltage from the load and inputting the feedback voltage to the linear amplifier, the linear amplifier
being configured to compare the feedback voltage to a reference voltage input to the linear amplifier to determine a voltage
difference;

driving the output voltage using the power supply during a first portion of a timing period; and
driving the output voltage using the linear amplifier during a second portion of the timing period.

US Pat. No. 9,224,884

LIGHT SENSOR HAVING TRANSPARENT SUBSTRATE AND DIFFUSER FORMED THEREIN

Maxim Integrated Products...

1. A light sensor comprising:
a substrate having a surface;
a photodetector formed in the substrate proximate to the surface, the photodetector configured to detect light and to provide
a signal in response thereto;

a first color filter disposed over the photodetector and configured to filter light in a first limited spectrum of wavelengths
to the photodetector;

a second color filter disposed over the photodetector and configured to filter light in a second limited spectrum of wavelengths
to the photodetector;

a third color filter disposed over the photodetector and configured to filter light in a third limited spectrum of wavelengths
to the photodetector; and

a transparent substrate disposed over the substrate, the transparent substrate including a diffuser configured to diffuse
light incident on the diffuser and to pass the diffused light to at least one of the first color filter, the second color
filter, or the third color filter.

US Pat. No. 9,230,903

MULTI-DIE, HIGH CURRENT WAFER LEVEL PACKAGE

Maxim Integrated Products...

1. A process comprising:
forming a pillar upon a semiconductor wafer, the pillar extending from the semiconductor wafer to a first height above the
semiconductor wafer;

connecting an integrated circuit chip device to the semiconductor wafer, the integrated circuit chip device extending from
the semiconductor wafer to a second height above the semiconductor wafer;

forming an encapsulation structure over the semiconductor wafer, the encapsulation structure at least substantially encapsulating
the pillar; and

applying at least one solder contact to the pillar, the at least one solder contact being located at a third height above
the semiconductor wafer,

wherein the second height is less than at least one of: the first height and the third height;
wherein the step of forming the pillar upon the semiconductor wafer comprises:
depositing a blanket seed layer on the semiconductor wafer;
applying a first photoresist layer over the semiconductor wafer;
patterning and etching the first photoresist layer to form an etched area;
depositing a conductive material in the etched area to form a first layer of the pillar;
at least substantially removing the first photoresist layer;
applying a second photoresist layer over the semiconductor wafer;
patterning and etching the second photoresist layer to form an etched area of the second photoresist layer;
depositing conductive material in the etched area of the second photoresist layer to form a second layer of the pillar;
at least substantially removing the second photoresist layer; and
etching the blanket seed layer.

US Pat. No. 9,261,541

SAMPLING DEVICE AND CIRCUIT HAVING A SINGLE VOLTAGE SUPPLY

Maxim Integrated Products...

1. A sampling system that samples over positive and negative voltage ranges using a single voltage source, the system comprising:
an input on which an analog signal is received;
a sampling switch, coupled to the input, the sampling switch defining an active state and inactive state for the sampling
circuit;

at least one bootstrap capacitor, coupled to the sampling switch and the single voltage source, the at least one bootstrap
capacitor is charged to a first voltage level of the first voltage source to allow sampling within the negative range and
the positive voltage range;

a self-switching bootstrap mechanism, coupled to the at least one bootstrap capacitor and sampling switch, the self-switching
bootstrap mechanism having a positive feedback mechanism that allows sampling within the negative voltage range and the positive
voltage range; and

a sampling circuit, coupled to the sampling switch, the sampling circuit sampling the analog signal during the active state.

US Pat. No. 9,148,147

PROGRAMMABLE MIXED-SIGNAL INPUT/OUTPUT (IO)

Maxim Integrated Products...

1. An integrated circuit device comprising:
a plurality of ports, respective ones of the ports being configurable to function as an input or output to communicate at
least one of a digital or analog signal based on an on-chip register setting;

a single analog-to-digital converter that is time-multiplexed to the plurality of ports; and
a single digital-to-analog converter that is time-multiplexed to the plurality of ports.

US Pat. No. 9,502,356

DEVICE AND METHOD WITH PHYSICAL UNCLONABLE FUNCTION

Maxim Integrated Products...

1. A physical unclonable function device, comprising:
an integrated circuit device including an active layer, the active layer including an electrode array with multiple electrodes;
a physical unclonable function coating disposed on the active layer, wherein the physical unclonable function coating comprises
a dielectric material, and wherein the physical unclonable function coating includes a physical unclonable material arranged
in a random configuration;

wherein the physical unclonable function coating includes a glass material and the physical unclonable material includes glass
beads; and

a distinct capacitance between at least two electrodes of the electrode array is used as a unique identifier in the physical
unclonable function device depending on a density of the physical unclonable function material and a distance between the
at least two electrodes of the electrode array.

US Pat. No. 9,219,043

WAFER-LEVEL PACKAGE DEVICE HAVING HIGH-STANDOFF PERIPHERAL SOLDER BUMPS

Maxim Integrated Products...

1. A wafer-level package device comprising:
a base integrated circuit chip including an integrated circuit;
at least one pillar formed on a first side of the base integrated circuit chip device, where the at least one pillar has a
high standoff peripheral arrangement and includes at least one solder bump formed on the pillar; and

a second integrated circuit chip device electrically coupled to the first side of the base integrated circuit chip device,
the second integrated circuit chip device disposed in a center of the at least one pillar with the high standoff peripheral
arrangement, where the second integrated circuit chip device includes at least one solder bump formed on a side distal from
the first side of the base integrated circuit chip.

US Pat. No. 9,136,258

STACKED LED FOR OPTICAL SENSOR DEVICES

Maxim Integrated Products...

1. A wafer level optical device, comprising:
a substrate;
a sensor disposed on the substrate;
a molding layer disposed over the sensor;
a lens formed on the molding layer; and
a light-emitting diode package disposed on the substrate, where the light-emitting diode package at least partially covers
the sensor and the molding layer, the light-emitting diode package including

at least one 3D substrate,
a light-emitting diode substrate,
a light-emitting diode disposed on the light-emitting diode substrate, and
a light-emitting diode lens disposed on the light-emitting diode.

US Pat. No. 9,306,662

OPTICAL ISOLATOR LIFE EXPANDER

Maxim Integrated Products...

1. A system comprising: a light emitting diode on a first side of electrically isolated circuitry for transmitting an optical
signal to a second side of the electrically isolated circuitry; a driver for driving the light emitting diode with an “ON”
time; an optical receiver on the second side of the electrically isolated circuitry for receiving the optical signal from
the light emitting diode; a sensor coupled with the optical receiver for sampling the intensity of the optical signal received
by the optical receiver, wherein the sensor is communicatively coupled with the driver and configured to transmit the sampled
intensity of the optical signal received from the light emitting diode to the driver, and the driver is configured to adjust
the “ON” time based upon the sampled intensity of the optical signal; and a sigma-delta modulator and an oscillator disposed
on the first side of the electrically isolated circuitry and configured to provide a clock signal to the light emitting diode.

US Pat. No. 9,472,696

LIGHT SENSOR HAVING A CONTIGUOUS IR SUPPRESSION FILTER AND TRANSPARENT SUBSTRATE

Maxim Integrated Products...

1. A light sensor comprising:
a substrate having a surface;
one or more photodetectors formed in the substrate, the one or more photodetectors configured to detect light and provide
a signal in response thereto;

one or more color pass filters positioned over the surface and configured to filter visible light to pass light in a limited
spectrum of wavelengths to the one or more photodetectors;

an IR suppression filter positioned over the surface and configured to filter infrared light to at least substantially block
infrared light from reaching the one or more photodetectors; and

a transparent substrate positioned over the IR suppression filter,
wherein the IR suppression filter comprises a contiguous IR suppression filter disposed continuously over the one or more
color pass filters and the one or more photodetectors.

US Pat. No. 9,239,254

AMBIENT TEMPERATURE MEASUREMENT

Maxim Integrated Products...

1. An electronics device having a device housing and one or more heat generating device electronics positioned within the
device housing, the electronics device comprising:
a. a heat plate exposed to the ambient;
b. the device electronics comprise a power transmitter configured to transmit an electromagnetic signal;
c. a first sensor chip comprising a first temperature sensor thermally coupled to the heat plate and configured to measure
first temperature data, a first energy harvesting circuit configured to harvest energy from the transmitted electromagnetic
signal, and a first wireless communication transmitting block configured to transmit the first temperature data;

d. a second sensor chip comprising a second temperature sensor configured to measure second temperature data, a second energy
harvesting circuit configured to harvest energy from the transmitted electromagnetic signal, and a second wireless communication
block configured to transmit the second temperature data;

e. the device electronics comprise a wireless communication receiving block configured to receive the transmitted first temperature
data and the transmitted second temperature data; and

f. the device electronics comprise a processor coupled to the wireless communication receiving block and configured to calculate
an ambient temperature according to the first temperature data and the second temperature data.

US Pat. No. 9,231,607

INTERCONNECT STRUCTURES FOR MINIMIZING CLOCK AND OUTPUT TIMING SKEWS IN A HIGH SPEED CURRENT STEERING DAC

Maxim Integrated Products...

1. A digital-to-analog converter (DAC) system comprising:
a DAC including a plurality of segments and a plurality of drivers, wherein each of the plurality of segments receives driver
signals from a respective one of the plurality of drivers and generates a positive output and a negative output based on the
driver signals, and wherein each of the plurality of drivers receives a respective one of a plurality of clock signals and
outputs the driver signals based on the respective one of the plurality of clock signals; and

a clock interconnect module including an interconnect loop, wherein a clock input is connected to a first portion of the interconnect
loop, and wherein the plurality of clock signals are output from a second portion of the interconnect loop connected to the
plurality of drivers.

US Pat. No. 9,196,680

METAL OXIDE SEMICONDUCTOR FIELD EFFECT TRANSISTOR WITH REDUCED SURFACE FIELD FOLDING

MAXIM INTEGRATED PRODUCTS...

1. A laterally diffused metal oxide semiconductor field effect transistor (LDMOSFET) comprising:
a first source contact region, a first gate contact region, and a drain contact region;
an n-type buried layer;
a first p-type body region formed in an n-type epitaxial layer, the first p-type body region directly contacting the first
source contact region and extending past a first end of the first source contact region toward the drain contact region;

a first p-type reduced surface field (PRSF) region formed in the n-type epitaxial layer, the PRSF region disposed between
the first p-type body region and the n-type buried layer;

an n-type drift region formed in the n-type epitaxial layer, the n-type drift region directly contacting the drain contact
region,

wherein the first PRSF region extends into an area between the n-type drift region and the n-type buried layer;
a second source contact region and a second gate contact region;
a second p-type body region formed in the n-type epitaxial layer, the second p-type body region directly contacting the second
source contact region and extending past a second end of the second source contact region toward the drain contact region;

a second PRSF region formed in the n-type epitaxial layer, the second PRSF region disposed between the second p-type body
region and the n-type buried layer and extending into the area between the n-type drift region and the n-type buried layer;
and

an n-type diffusion region in the n-type epitaxial layer disposed in the area between the n-type buried layer and the n-type
drift region and between the first and second PRSF regions, the n-type diffusion region electrically connecting the n-type
buried layer with the n-type drift region between the first and second PRSF regions.

US Pat. No. 9,130,514

VCOM SWITCHING AMPLIFIER

Maxim Integrated Products...

1. An electronic device for driving a display that uses a common voltage, the electronic device comprising:
a common voltage application circuit coupled to the display to supply the display with the common voltage, wherein the common
voltage application circuit comprises a switching amplifier configured to output a switching waveform used to form the common
voltage; and

a filter coupled between the switching amplifier and the display, the filter is formed by an inductor and a fixed capacitance
inherent to the display, wherein the inductor is designed to cause the filter to improve a transient response of the common
voltage application circuit.

US Pat. No. 9,312,877

SYSTEMS AND METHODS FOR CAPACITIVE DIGITAL TO ANALOG CONVERTERS

Maxim Integrated Products...

1. A capacitive digital to analog converter (DAC), comprising:
a first switching device that receives first, second, third, and fourth reference potentials at respective inputs and that
selectively connects one of the first, second, third, and fourth reference potentials to a first output of the first switching
device,

wherein the first and second reference potentials are approximately equal, and
wherein the third and fourth reference potentials are approximately equal;
a first capacitor that is connected between the first output of the first switching device and a common node;
a second switching device that receives the first, second, third, and fourth reference potentials at respective inputs and
that selectively connects one of the first, second, third, and fourth reference potentials to a second output of the second
switching device; and

a second capacitor that is connected between the second output of the second switching device and the common node.

US Pat. No. 9,196,672

SEMICONDUCTOR DEVICE HAVING CAPACITOR INTEGRATED THEREIN

Maxim Integrated Products...

13. A semiconductor device comprising:
a substrate having dopant material of a first conductivity type;
a plurality of trenches disposed within the substrate;
a diffusion region disposed proximate to the plurality of trenches, the diffusion region having dopant material of a second
conductivity type;

an isolation region disposed adjacent to the diffusion region; and
a dual metal-insulator-metal (MIM) capacitor formed within each trench of the plurality of trenches, the dual metal-insulator
metal capacitor including a plurality of dielectric layers, the plurality of dielectric layers comprising alternating layers
of Hafnium(IV) oxide and aluminum oxide, wherein a ratio of Hafnium(IV) oxide to aluminum Oxide ranges from one and a half
(1.5) to two and a half (2.5).

US Pat. No. 9,479,042

SHUT-OFF CIRCUITRY HAVING TEMPERATURE STABLE THRESHOLD CURRENT SENSING

Maxim Integrated Products...

1. A circuit comprising:
a current sensing element configured to generate a voltage drop based upon a current generated by a drive current source through
a load electrically connected to the current sensing element;

an asymmetric differential circuit configured to generate a differential output based upon the voltage drop;
an amplifier electrically coupled to the asymmetric differential circuit, the amplifier configured to generate a single-ended
output based upon the differential output; and

a flip-flop module electrically connected to the amplifier, the flip-flop module configured to transition between a first
state and a second state based upon the single-ended output,

wherein the flip-flop module is configured to control operation of a switch, the switch configured to control current flow
to the load, wherein the asymmetric differential circuit comprises a first transistor and a plurality of second transistors,
the first transistor connected to a first node comprising an electrical interconnection between a first port of the current
sensing element and the drive current source, the plurality of second transistors connected to a second node comprising an
electrical interconnection between a second port of the current sensing element and the plurality of second transistors.

US Pat. No. 9,444,434

SYSTEMS, METHODS AND APPARATUS FOR VOLTAGE CLAMPING

Maxim Integrated Products...

1. A voltage clamping apparatus comprising:
a predriver having a signal input node, a output high node and a output low node;
a first current source coupled between a first voltage source node and the output high node;
a second current source coupled between a second voltage source node and the output low node;
a first bipolar transistor having a control node coupled to the output high node and a first active node coupled to a signal
output node;

a second bipolar transistor having a control node coupled to the output low node and a first active node coupled to the signal
output node;

a first level shifter coupling a first node of a first low voltage-drop diode to the output high node, whereby a second node
of the first low voltage-drop diode comprises a voltage clamp high node; and

a second level shifter coupling a first node of a second low voltage-drop diode to the output low node, whereby a second node
of the second low voltage-drop diode comprises a voltage clamp low node;

wherein the first transistor is an NPN transistor and the second transistor is a PNP transistor, wherein bases of the first
transistor and the second transistor are the control nodes, emitters of the first transistor and the second transistor are
the first active nodes, and collectors of the first transistor and the second transistor are second active nodes coupled to
the first voltage source node and the second voltage source node, respectively.

US Pat. No. 9,383,186

METHOD AND DEVICE FOR CONTACTLESS SENSING ROTATION AND ANGULAR POSITION USING ORIENTATION TRACKING

Maxim Integrated Products...

1. A method for sensing rotation and angular position using a plurality of magnetic field sensing elements on a single integrated
circuit comprising iteratively tracking of the orientation of a rotating movable magnetic target the method comprising:
i. separating a 360° sensor carrying area into two halves, calculating a summation signal of the magnetic sensing elements
in the first half and subtracting the summation signal of the magnetic sensing elements in the second half of the area;

ii. turning a separation axis by 360°/(2*n) clockwise or counter clockwise depending on the result of i., wherein n represents
the number of the iterative steps performed for a target resolution, starting with n=2, and adding and subtracting the signal
values of the new half-areas accordingly in response to a virtual turning;

iii. repeating step ii. with increasing n until an amplitude of a remaining misalignment falls below a threshold value that
is a function of the number of used magnetic sensing elements, the remaining misalignment being associated with a corresponding
difference of the summation signals of the two half-areas, each iterative step reduces the angular distance of tracking; and

iv. performing an A/D conversion on the remaining misalignment.

US Pat. No. 9,226,071

DIRECT MEASUREMENT OF AN INPUT SIGNAL TO A LOUDSPEAKER TO DETERMINE AND LIMIT A TEMPERATURE OF A VOICE COIL OF THE LOUDSPEAKER

Maxim Integrated Products...

1. A system for providing temperature limiting for a voice coil of a speaker, comprising:
an amplifier connected to the speaker, the amplifier configured for receiving an amplifier input signal, generating an amplifier
output signal based upon the amplifier input signal and transmitting the amplifier output signal to the speaker;

a sensing circuit connected to the amplifier, the sensing circuit configured for measuring a voltage and a current of the
amplifier output signal and providing an output signal including the measured voltage and measured current;

a filter block connected to the sensing circuit, the filter block configured for receiving the sensing circuit output signal,
and based upon the sensing circuit output signal, providing an output signal including the measured voltage and measured current;
and

a resistance estimator module including a processor, the resistance estimator module being connected to the filter block,
the resistance estimator module configured for receiving the measured current and measured voltage from the filter block,
calculating an estimated resistance of the voice coil based upon the measured voltage and the measured current by dividing
a root mean square value of the measured voltage and the measured current, and providing an output including the estimated
resistance; and

a temperature estimator module connected to the resistance estimator module, the temperature estimator module being configured
for receiving the resistance estimator module output and calculating a temperature of the voice coil based upon the estimated
resistance,

wherein the amplifier input signal is attenuated based upon a comparison of the calculated temperature of the voice coil against
a pre-determined threshold temperature of the voice coil.

US Pat. No. 9,202,162

EMBEDDED RADIO FREQUENCY IDENTIFICATION (RFID) PACKAGE

Maxim Integrated Products...

1. A radio frequency identification (RFID) device comprising:
an integrated circuit (IC) die electrically connected to a radio frequency (RF) antenna winding for transmitting electronically
stored information via the RF antenna winding;

a first core comprising a first layer of the RF antenna winding, the first core defining a cavity for retaining the IC die;
and

a second core comprising a second layer of the RF antenna winding, the second core directly laminated to the first core so
that the RF antenna winding is routed through the first core and the second core, wherein the cavity is disposed within the
RF antenna winding in the first core, the first core and the second core comprising a substrate.

US Pat. No. 9,461,601

MULTICHANNEL DIGITAL AUDIO INTERFACE

Maxim Integrated Products...

1. A multichannel input device comprising:
an automatic number-of-channels and bit depth detector having a bit clock (BCLK) input, a left/right clock (LRCLK) input,
a number of channels NCHAN output and a bit depth B output, wherein the automatic number-of-channels and bit depth detector
includes a plurality of counters and a logic device;

a digital audio interface (DAI) having a data DIN input, the BCLK input, the LRCLK input, an NCHAN input and a B input, the
DAI having an output including data associated with an assigned channel; and

a digital to analog converter (DAC) having a digital input coupled to the output of the DAI and an analog output;
wherein the automatic number-of-channels and bit depth detector includes:
a) a first counter and a first latch register for counting one of
i) a number N1 of BCLK cycles for one LRCLK cycle,
ii) a number N2 of BCLK cycles when LRCLK is HI,
iii) a number N3 of BCLK cycles when LRCLK is LO; and
b) a second counter and a second latch register for counting one of N1, N2 and N3 that was not counted by the first counter;
whereby the logic device determines a number of channels NCHAN and a bit depth B using at least two of N1, N2 and N3.

US Pat. No. 9,337,860

PRECISION SUB-RADIX2 DAC WITH ANALOG WEIGHT BASED CALIBRATION

Maxim Integrated Products...

1. A system comprising:
a sub-binary radix digital-to-analog converter (DAC) that converts a digital input signal to an analog output signal based
on a sub-radix DAC code; and

a radix conversion module that performs radix conversion on the digital input signal,
wherein, to perform the radix conversion, the radix conversion module (i) associates bit positions corresponding to the digital
input signal with respective analog weights and (ii) converts the digital input signal to the sub-radix DAC code based on
the respective analog weights.

US Pat. No. 9,318,462

SIDE WETTABLE PLATING FOR SEMICONDUCTOR CHIP PACKAGE

Maxim Integrated Products...

1. A system, comprising:
a metalized backing;
an adhesive disposed on the metalized backing;
a plurality of conductive particles embedded in the adhesive, the plurality of conductive particles electrically connected
to the metalized backing; and

a semiconductor chip package in contact with the plurality of conductive particles embedded in the adhesive and electrically
connected to the metalized backing, wherein the metalized backing and the semiconductor chip package are electrically connected
to a ground.

US Pat. No. 9,348,462

GESTURE DETECTION AND RECOGNITION BASED UPON MEASUREMENT AND TRACKING OF LIGHT INTENSITY RATIOS WITHIN AN ARRAY OF PHOTODETECTORS

Maxim Integrated Products...

1. An electronic device comprising:
a sensor configured to detect a gesture and provide a signal in response thereto, the sensor comprising an array of photodetectors;
a lens disposed over the sensor to collimate light incident on the lens and to pass the collimated light to the sensor;
a memory operable to store one or more modules; and
a processor operable to execute the one or more modules to:
generate a plurality of light intensity ratios, respective light intensity ratios of the plurality of light intensity ratios
comprising a ratio value of light intensity incident upon at least one corresponding photodetector within the array of photodetectors
as compared to the light intensity incident upon the other photodetectors within the array of photodetectors,

associate the respective light intensity ratios with discrete coordinates corresponding to a unit circle, and
track the discrete coordinates to determine a type of gesture.

US Pat. No. 9,087,732

WAFER-LEVEL PACKAGE DEVICE HAVING SOLDER BUMP ASSEMBLIES THAT INCLUDE AN INNER PILLAR STRUCTURE

Maxim Integrated Products...

1. A process comprising:
applying a bump interface to a contact pad of the semiconductor wafer, the semiconductor wafer processed to form one or more
integrated circuits therein;

forming a first pillar structure portion over the bump interface and forming a second pillar structure portion over the first
pillar structure portion, the first pillar structure portion and the second pillar structure portion comprising a pillar structure;

placing a solder ball onto the pillar structure; and
reflowing the solder ball over the pillar structure and the bump interface to form a solder bump, the pillar structure extending
at least partially into the solder bump.

US Pat. No. 9,356,003

HIGHLY INTEGRATED FLEX SENSOR PACKAGE

Maxim Integrated Products...

1. A flex sensor package, comprising:
a flex printed circuit including at least one flex window formed therein, where the flex printed circuit comprises a zero
initiation force edge connector;

an adhesive layer disposed on a portion of a first side of the flex printed circuit;
at least one stiffener assembly disposed on the adhesive layer, where the at least one stiffener assembly includes a stiffener
window including an optically-transparent material formed therein;

at least one semiconductor die disposed on a second side of the flex printed circuit, where an active portion of at least
one semiconductor die is aligned with at least one flex window and at least one stiffener window.

US Pat. No. 9,319,058

INTERLEAVING ERROR CORRECTION AND ADAPTIVE SAMPLE FREQUENCY HOPPING FOR TIME-INTERLEAVED ANALOG-TO-DIGITAL CONVERTERS

Maxim Integrated Products...

1. A multiple-input multiple-output (MIMO) filter comprising:
a delay line including D delay cells that receives an input signal including M outputs of M sub-analog-to-digital converters
(sub-ADCs) of an interleaved ADC, where D and M are integers greater than 1;

a first selector that selects n of M outputs of a last one of the D delay cells;
a second selector that selects n of M inputs of a first one of the D delay cells;
a first multiplexer that multiplexes outputs of the first and second selectors and (D?1) of the D delay cells and that generates
N outputs, where N=(D?1)M+2n, and 1?n?M;

a third selector that has M output ports each selecting L of the N outputs, where L=N+1?M;
M product generators each generating a product of an output of one of the M output ports and a corresponding coefficient;
a second multiplexer that multiplexes M products of the M product generators and that generates a correction signal to correct
errors in the input signal; and

an adder that adds the correction signal to an output of one of the D delay cells to generate a corrected signal.

US Pat. No. 9,294,063

DIGITAL INPUT CIRCUIT AND METHOD FOR HIGH VOLTAGE SENSORS

Maxim Integrated Products...

1. A digital input circuit comprising:
a series connection of a current limiter and a switch having a switch control input coupled between a signal input and ground;
a logic level shifter including a voltage comparator and a digital low pass filter, the logic level shifter being coupled
to the signal input and having a switch control output coupled to the switch control input and a signal output, where a maximum
amplitude at the signal input is greater than a maximum amplitude at the signal output; and

a clock coupled to the low pass filter and to the switch control input.

US Pat. No. 9,276,680

ADAPTIVE SAMPLING QUALIFICATION FOR EXTINCTION RATIO CONTROL

Maxim Integrated Products...

1. A laser driver assembly comprising:
a laser driver; and
a sampling loop configured to facilitate sampling of photodiode current produced by a monitor photodiode (MPD) of an optical
transmitter assembly, the sampling loop comprising:

a low pass filter configured to receive transmit (Tx) data provided to the laser driver and to generate an attenuated output
waveform corresponding to an input waveform defined by a number of consecutive bits of a first type received in the transmit
(Tx) data, the low pass filter configured to reset the output waveform when a bit of a second type is received;

a digital-to-analog converter (DAC) configured to output a threshold signal; and
a comparator configured to compare the output waveform from the low pass filter and the threshold signal, and to output a
signal indicating when the photodiode current is to be sampled.

US Pat. No. 9,207,254

ACCELEROMETER WITH LOW SENSITIVITY TO THERMO-MECHANICAL STRESS

Maxim Integrated Products...

1. A micro-machined inertial sensor, comprising:
a proof mass that is suspended above a substrate and attached with a moveable electrode;
a plurality of stationary electrodes, electrically coupled to the moveable electrode, the plurality of stationary electrodes
forming a sensing capacitor with the moveable electrode such that movement of the proof mass leads to a capacitive variation
of the sensing capacitor that is further converted to a sensing output; and

wherein the plurality of stationary electrodes is coupled to at least one anchor on the substrate via a coupling structure
that incorporates at least one elastic element, at least one elastic element being incorporated to couple two stationary electrodes
of the plurality of stationary electrodes.

US Pat. No. 9,172,305

DC-TO-DC CONVERTER WITH ADAPTIVE DEAD-TIME CONTROL

MAXIM INTEGRATED PRODUCTS...

11. A DC-to-DC converter comprising:
first and second switches that are connected to each other at a node, that are connected in series across a supply voltage
and a reference potential, and that are biased by pulse-width modulated (PWM) pulses;

an inductance connected between the node and a load;
a timing module that determines a first time difference between a first edge of a first signal at the node and a first edge
of a second signal at a control terminal of the first switch, a second time difference between a second edge of the first
signal at the node and a second edge of the second signal at the control terminal of the first switch, a third time difference
between the second edge of the first signal at the node and a first edge of a third signal at the control terminal of the
second switch, and a fourth time difference between the first edge of the first signal at the node and a second edge of the
third signal at the control terminal of the second switch, wherein the first and second edges of the second signal and the
second and first edges of the third signal respectively correspond to first and second edges of one of the PWM pulses;

a plurality of charge pumps that output respective voltages based on the first, second, third, and fourth time differences;
and

a delay module that delays the first and second edges of the second signal at the control terminal of the first switch based
on the first and second time differences, respectively, that delays the first and second edges of the third signal at the
control terminal of the second switch based on the third and fourth time differences, respectively.

US Pat. No. 9,342,159

METHOD AND APPARATUS FOR ACTIVATING ELECTRONIC DEVICES WITH GESTURES

Maxim Integrated Products...

1. An electronic device with gesture activation comprising:
a body including at least one infrared (IR) transmissive window;
an IR gesture detection sensor located within the body and aligned with the transmissive window;
a processor located within the body and coupled to the gesture detection sensor; and
digital memory disposed within the body and coupled to the processor where the memory includes codes segments executable on
the processor for:

(a) starting a timer if a first gesture of an activation gesture sequence including an ordered plurality of gestures is detected
by said IR gesture detection sensor while at least one process of the electronic device is in an inactive mode; and

(b) activating the at least one process of the electronic device if the remainder of ordered plurality of gestures is received
before the timer has elapsed;

wherein the electronic device is a portable digital device provided with a display screen and a wireless connection to at
least one of a cellular telephone network and the Internet.

US Pat. No. 9,338,003

SECURE MODULES USING UNIQUE IDENTIFICATION ELEMENTS

Maxim Integrated Products...

1. A secure system comprising:
a microcontroller comprising:
a processing unit;
a first unique identification element having a first unique identification value obtained by measuring at least one gradient
of a first physical characteristic of the microcontroller;

a first secret generator adapted to receive the first unique identification value and to generate a first secret from the
first unique identification value;

a module adapted to communicate with the microcontroller, the module comprising:
a second unique identification element having a second unique identification value obtained by measuring at least one gradient
of a second physical characteristic of the module;

a second secret generator adapted to receive the second unique identification value and to generate a second secret from the
second unique identification value; and

wherein a first encryption key associated with the first secret is stored within the module and a second encryption key associated
with the second secret is stored within the microcontroller, the first and second encryption keys support secure communication
between the microcontroller and the module and

wherein the first and second encryption keys are generated during initialization of the secure system.

US Pat. No. 9,322,901

MULTICHIP WAFER LEVEL PACKAGE (WLP) OPTICAL DEVICE

Maxim Integrated Products...

1. An optical device comprising:
a carrier substrate having a surface, the surface including at least a first cavity and a second cavity formed therein;
a light source disposed in the first cavity, the light source configured to emit light in a predetermined spectrum of wavelengths;
an optical sensor disposed in the second cavity, the optical sensor configured to detect light in the predetermined spectrum
of wavelengths and to provide a signal in response thereto, the optical sensor including a wafer level package device die
having a glass substrate formed thereon; and

a cover disposed on the surface of the carrier substrate so that the cover at least substantially encloses the light source
within the first cavity and the optical sensor within the second cavity, the cover configured to transmit light within the
predetermined spectrum of wavelengths.

US Pat. No. 9,231,538

ENERGY EFFICIENT, LOW DISTORTION AMPLIFICATION APPARATUS

Maxim Integrated Products...

1. An energy efficient, low distortion amplification apparatus comprising:
a differential amplifier having a pair of differential inputs, a pair of outputs, and a bias current control input;
a digital delay having an n-bit word input and an m-bit word output;
a digital-to-analog converter (DAC) having an input coupled to the output of the digital delay and a pair of differential
outputs coupled to the pair of differential inputs of the differential amplifier; and

a bias current controller having an input coupled to the digital delay and having an output coupled to the bias current control
input of the differential amplifier;

wherein the digital delay includes a First-In-First-Out (FIFO) buffer;
wherein the input of the bias current controller is coupled to the n-bit word input of the digital delay; and
wherein the output of the bias current controller is a digital signal having a width w of at least one bit.

US Pat. No. 9,083,578

NUMERICALLY CONTROLLED OSCILLATOR WITH FRACTIONAL FREQUENCY CONTROL WORD INPUTS

MAXIM INTEGRATED PRODUCTS...

1. A numerically controlled oscillator module comprising:
a first accumulator circuit configured to receive a clock signal and at least first portions of each of a plurality of frequency
control words and accumulate the first portions to generate a phase value, wherein each of the plurality of frequency control
words identifies a fractional value and includes a respective one of the first portions and a respective second portion;

a second accumulator circuit configured to accumulate the second portions and generate a trigger signal based on a result
of the accumulated second portions, wherein the second portions are numerators of the fractional values of the plurality of
frequency control words, and

wherein the first accumulator circuit is configured to adjust the phase value based on the trigger signal;
a phase-to-amplitude converter module configured to generate a digital signal based on the clock signal and the phase value;
and

an output configured to transmit an output signal from the numerically controlled oscillator module based on the digital signal.

US Pat. No. 9,190,391

THREE-DIMENSIONAL CHIP-TO-WAFER INTEGRATION

Maxim Integrated Products...

1. A semiconductor device comprising:
a semiconductor substrate comprising a first die, the semiconductor substrate comprising electrical circuitry;
a second die attached to the semiconductor substrate, the second die attached to the semiconductor substrate in a face-down
orientation, the second die comprising a die attach pad;

a third die attached to the second die in a face-up orientation, the third die attached to the die attach pad of the second
die, the second die and the third die stacked in direct contact;

an overmold molded onto the semiconductor substrate over the second die and the third die;
a conductive pillar connected directly to at least one of the electrical circuitry of the semiconductor substrate, or the
second die, or the third die, the conductive pillar extending through the overmold, wherein the footprint of the semiconductor
device is the same as the footprint of the first die;

a redistribution layer formed on the overmold; and
a plurality of solder bumps formed on the redistribution layer, at least one of the plurality of solder bumps connected to
the conductive pillar via the redistribution layer.

US Pat. No. 9,224,714

SEMICONDUCTOR DEVICE HAVING A THROUGH-SUBSTRATE VIA

Maxim Integrated Products...

1. A semiconductor device comprising:
a substrate having a first surface and a second surface, the substrate including a dielectric layer, an alignment mark for
alignment of a carrier wafer with the substrate, an etch stop disposed within the substrate, and one or more integrated circuit
devices formed therein;

a first array of solder bumps disposed over the first surface;
a second array of solder bumps disposed over the second surface; and
a via extending from about the second surface through the dielectric layer to the etch stop,
wherein at least one of the integrated circuit devices is electrically connected to at least one solder bump of the second
array of solder bumps through the via.

US Pat. No. 9,166,442

ADAPTIVE INPUT CURRENT LIMITING FOR SWITCH-MODE CHARGERS

MAXIM INTEGRATED PRODUCTS...

1. A system comprising:
a voltage regulator module that regulates an input voltage supplied by a power supply and that supplies an output current
to a load;

a voltage comparator module that compares the input voltage to a first threshold; and
a current limiting module that decreases the output current when the input voltage decreases to less than or equal to the
first threshold, that decreases the output current until the input voltage increases to greater than the first threshold,
and that decreases the output current further by an additional predetermined amount after the input voltage increases to greater
than the first threshold.

US Pat. No. 9,077,348

FRACTIONAL CLOCK GENERATOR

Maxim Integrated Products...

1. A fractional clock generator comprising:
a phase splitter that generates phase signals from an input clock signal having a first frequency;
a phase generator coupled to receive the phase signals and output a plurality of clock signals of the first frequency, each
of the plurality of clock signals comprises has a different phase angle;

a phase multiplexer coupled to the phase generator, the phase multiplexer selects a predetermined sequence of the plurality
of clock signals in response to receiving a feedback signal, the phase multiplexer configured to generate an output clock
signal of a second frequency that can be selected lower and higher than the first frequency; and

a selection circuit coupled to the phase multiplexer, the selection circuit comprises a state machine circuit that receives
the output clock signal at its input, generates a one-hot signal, and generates the feedback signal that controls the phase
multiplexer, the state machine circuit comprising a plurality of flip-flops coupled to each other in a loop configuration
such that a data output of each flip-flop is coupled to a data input of a preceding flip-flop.

US Pat. No. 9,312,688

POWER SUPPLY PROTECTION SYSTEM

Maxim Integrated Products...

1. A power supply protection system comprising:
a first metal oxide field effect transistor (MOSFET) having a first source, a first drain coupled to an input node, and a
first gate;

a second MOSFET having a second source coupled to the first source, a second drain coupled to an output node and a second
gate coupled to the first gate, whereby the first MOSFET and the second MOSFET are coupled back-to-back;

a zener diode coupled between the first and second sources and the first and second gates;
charge pump circuitry coupled across the zener diode, whereby a voltage on the first and second gates is boosted with respect
to the voltage on the first and second sources; and

a first protection circuit coupled between the charge pump circuitry and the first and second gates and a second protection
circuit coupled between the charge pump circuitry and the first and second sources.

US Pat. No. 9,178,420

INDUCTIVE BYPASS, STORAGE AND RELEASE IMPROVES BUCK RESPONSE

Maxim Integrated Products...

1. A DC-DC converter circuit to generate an output voltage for a system load, the DC-DC converter circuit comprising:
an inductive element coupled between an input and an output of the DC-DC converter circuit;
first and second switches coupled to the inductive element, the switches selectively turn ON and OFF in a predetermined sequence;
a third switch coupled in parallel to the inductive element; and
a controller coupled to the first, the second, and the third switches, the controller comprises circuitry to generate control
signals that selectively activate the third switch in response to the controller detecting a polarity of a load transient
event to maintain a circulating current between the third switch and the inductive element until operating the third switch
in a linear voltage regulation mode to adjust a current supplied through the third switch.

US Pat. No. 9,152,576

MODE-BASED SECURE MICROCONTROLLER

Maxim Integrated Products...

1. A machine-implemented method of storing data in a memory interfacing with a secure microcontroller, the method comprising:
generating a logic address, input data and a write/read control in the microcontroller, the write/read control identifying
a memory read or write operation;

translating the logic address to at least one physical address in the memory that is partitioned into a plurality of regions;
generating a mode control signal based on the logic address and the write/read control, the mode control signal identifying
a data processing mode from a plurality of data processing modes;

associating the data processing mode with at least one data processing method selected from a plurality of data processing
methods, each data processing method being associated with at least one region of the memory;

storing data within the at least one region of the memory according to the selected at least one data processing method; and
wherein one of the plurality of data processing modes involves two data processing methods, such that two processed data are
generated, and a first logic address is translated into a first physical address and a second logic address is translated
into a second physical address, the first and second physical addresses are located within different regions in the memory.

US Pat. No. 9,054,549

CIRCUIT TOPOLOGY FOR REGULATING POWER FROM LOW CAPACITY BATTERY CELLS

Maxim Integrated Products...

1. A power circuit comprising:
an interface to receive a battery voltage;
a storage capacitor;
an active control loop coupled between the interface and the storage capacitor, the active control loop configured to enable
charging of the storage capacitor by a battery at an adjustable current charge rate based at least partially on an electrical
characteristic of the battery,

wherein the active control loop comprises a transistor coupled between the battery and the storage capacitor and prevents
the battery voltage from dropping below a threshold voltage when the storage capacitor is below the threshold voltage; and

an operational amplifier coupled to the transistor and the battery, the operational amplifier comprises a first input coupled
to the battery to receive the battery voltage, and a second input to receive the threshold voltage,

wherein an impedance of the transistor is variably controlled by a control signal output from the operational amplifier.

US Pat. No. 10,257,959

METHOD AND APPARATUS FOR MONITORING ELECTROMECHANICAL DEVICE PERFORMANCE AND RELIABILITY

Maxim Integrated Products...

1. A method for monitoring air cooling fans to diagnose fan operation and predict a potential impending failure condition comprising:determining a fan rotation rate transfer function as a function of a control signal;
determining a first upper boundary limit, a second upper boundary limit, a first lower boundary limit and a second lower boundary limit;
sending a fan speed control signal to a fan to control its rotational speed;
measuring a fan rotation rate subsequent to sending the fan speed control signal;
comparing the measured fan rotation rate to the first upper boundary limit with respect to the fan rotation rate transfer function and the first lower boundary limit with respect to the fan rotation rate transfer function;
issuing a first alarm if the measured fan rotation rate is at least one of above the first upper boundary limit and below the first lower boundary limit to indicate a potential impending failure condition;
issuing the first alarm if the measured fan rotation rate is between the first upper boundary limit and the second upper boundary limit with respect to the fan rotation rate transfer function that is greater than the first upper boundary limit;
issuing the first alarm if the measured fan rotation rate is between the first lower boundary limit and the second lower boundary limit with respect to the fan rotation rate transfer function that is less than the first lower boundary limit; and
issuing a second alarm if the measured fan rotation rate is at least one of above the second upper boundary limit and below the second lower boundary limit;
wherein the second alarm indicates the measured fan rotation rate has extended beyond the second upper or second lower boundary limit;
wherein the first upper boundary limit, the first lower boundary limit and the rotation rate transfer function precede sending the control signal to the fan; and
wherein the potential impending failure condition is predicted as opposed to detecting the fan has already failed or reached a condition where it is no longer suitable for operation.

US Pat. No. 9,132,705

METHOD FOR THE MEASUREMENT AND ANALYSIS OF TYRE AIR PRESSURE WITH ALLOCATION OF WHEEL POSITIONS AND SYSTEM FOR TYRE AIR PRESSURE MEASUREMENT

Maxim Integrated Products...

1. A method of measuring and analyzing tire air pressure according to a wheel position of a vehicle, comprising the steps
of:
coupling each of a plurality of wheels of the vehicle to an air pressure checking device, an LF receiver, an analysis unit,
and an RF-transmission device;

allocating an individual wheel code to each of the plurality of wheels;
providing an LF signal to the LF receiver by an LF transmission device of a central unit;
analyzing the amplitude of the LF signal to determine a wheel rotation rate for each of the plurality of wheels;
sending an RF signal to the central unit, the RF signal being coupled with information about the wheel rotation rate and the
individual wheel code;

determining the wheel position for each of the plurality of wheels using a measurement device according to the wheel rotation
rate; and

enabling the air pressure checking device according to the individual wheel code to sense the tire air pressure associated
with the wheel position.

US Pat. No. 9,371,982

GLASS BASED MULTICHIP PACKAGE

Maxim Integrated Products...

1. A glass-based multichip package, comprising:
a photodefinable glass-based substrate, where a portion of the photodefinable glass-based substrate includes a light isolation
component that is converted to ceramic;

at least one electronic component directly disposed on the photodefinable glass-based substrate;
at least one interconnect including a solder ball directly coupled to the photodefinable glass-based substrate and a printed
circuit board, and wherein the electronic component comprises a sensor, the sensor including a light sensor coupled to the
photodefinable glass-based substrate and coupled proximate to a lens formed in the photodefinable glass-based substrate, and
where light passes through the lens to the light sensor.

US Pat. No. 9,357,302

SYSTEM AND METHOD FOR EXTRACTING PARAMETERS OF A SPEAKER WITHOUT USING STIMULUS

Maxim Integrated Products...

1. A system comprising:
a plurality of channels, wherein each channel receives a plurality of input signals that represent an input to a speaker,
and wherein each channel generates real and imaginary components of a transfer function of the speaker based on the plurality
of input signals;

a parameter calculator that calculates a plurality of parameters of the speaker based on the real and imaginary components
of the transfer function received from each channel; and

an equalizer that adjusts the input to the speaker based on the parameters.

US Pat. No. 9,324,687

WAFER-LEVEL PASSIVE DEVICE INTEGRATION

Maxim Integrated Products...

1. A wafer-level package device comprising: a segmented semiconductor wafer section configured to function as a base layer;
an integrated circuit chip device coupled to the segmented semiconductor wafer section;
a passive device disposed proximate to the integrated circuit chip device and coupled to the segmented semiconductor wafer
section;

at least one pillar electrically coupled to the integrated circuit chip device and at least one pillar electrically coupled
to the passive device;

an encapsulation layer covering at least a portion of the segmented semiconductor wafer section, the integrated circuit chip
device, and the passive device;

a redistribution layer structure coupled to the at least one pillar; and
at least one solder bump coupled to the redistribution layer structure and disposed on a surface of the encapsulation layer
distal from the segmented semiconductor wafer section.

US Pat. No. 9,860,946

CIRCUIT TOPOLOGY FOR DRIVING HIGH-VOLTAGE LED SERIES CONNECTED STRINGS

Maxim Integrated Products...

1. A backlighting system comprising:
one or more LED strings;
a high-voltage source;
one or more low-voltage regulators coupled in a feedback loop, the one or more low-voltage regulators have a polarity opposite
that of the high-voltage source, the high-voltage source and the one or more low-voltage regulators provide voltage differences
across the one or more LED strings to illuminate the one or more LED strings without a current source, the one or more low-voltage
regulators are programmed to periodically couple outputs of the one or more LED strings to a controlled and variable low voltage.

US Pat. No. 9,472,586

LIGHT SENSOR HAVING TRANSPARENT SUBSTRATE AND THROUGH-SUBSTRATE VIAS AND A CONTIGUOUS IR SUPPRESSION FILTER

Maxim Integrated Products...

1. A light sensor comprising:
a substrate having a surface;
one or more photodetectors formed in the substrate, the one or more photodetectors configured to detect light and provide
a signal in response thereto;

one or more color pass filters formed proximate to an IR suppression filter and configured to filter visible light to pass
light in a limited spectrum of wavelengths to the one or more photodetectors;

the IR suppression filter positioned over the surface and configured to filter infrared light to at least substantially block
infrared light from reaching the one or more photodetectors;

a transparent substrate positioned over the IR suppression filter; and
a through-substrate via formed in the substrate and configured to provide an electrical interconnect with the one or more
photodetectors,

wherein the IR suppression filter comprises a contiguous IR suppression filter disposed continuously over the plurality of
color pass filters and the plurality of photodetectors.

US Pat. No. 9,054,488

SPECKLE REDUCTION FOR LASER PROJECTION DISPLAYS

Maxim Integrated Products...

1. A laser driver that drives a laser diode with a pulsed modulation current, comprising:
a controller that is coupled to receive and process video data;
a pulse-off control module, coupled to the controller, the pulse-off control module controls at least a first analog switch
and a second analog switch;

a first current source, coupled in series with the first analog switch that is regularly switched off within one integration
period of human eyes, the first current source generating a modulation current that is greater than a laser threshold current,
such that the modulation current causes the laser diode to emit light; and

a second current source coupled in series with the second analog switch, the second current source receives light-off pulses
from the pulse-off control module that are shorter than one integration period of human eyes to generate a pulsed biasing
current that causes the laser diode to emit no light during the light-off pulses when the second analog switch is closed thereby
generating a plurality of laser waves that are incoherent to each other.

US Pat. No. 9,229,581

METHOD FOR DETECTING GESTURES USING A MULTI-SEGMENT PHOTODIODE AND ONE OR FEWER ILLUMINATION SOURCES

Maxim Integrated Products...

1. A method of detecting a gesture, the method comprising:
selectively blocking a portion of light reflected from an object from impinging on a light sensor assembly depending upon
a position of the object relative to the light sensor assembly using a light modifying wall structure disposed adjacent to
the light sensor assembly, the light modifying wall structure comprising a plurality of layers and a plurality of vias, respective
ones of the plurality of layers and the plurality of vias offset in a stair-step fashion with respect to a center axis defined
perpendicular to a surface of the light sensor assembly;

calculating one or more differential signals according to time dependent signals output from the light sensor assembly, the
light sensor assembly comprising a plurality of light sensors configured to detect light reflected from the object and to
output the time dependent signals in response thereto; and

determining an object motion direction of the object passing over the light sensor assembly by applying vector analysis to
the one or more differential signals.

US Pat. No. 9,106,138

ACTIVE PARASITE POWER CIRCUIT

Maxim Integrated Products...

1. An electronic circuit comprising:
a parasitic power circuit, the parasitic power circuit comprising:
a first PMOS transistor having a first drain, a first gate and a first source; the first drain being adapted to be electrically
connected to receive an input signal, the first source being electrically connected to a VDD supply node, the VDD supply node
being adapted to be connected to a capacitor and to a parasitic circuit;

a comparison circuit adapted be electrically connected to receive the input signal, the comparison circuit comprising a comparison
output that is electrically connected to the first gate, where the comparison circuit is further adapted to receive an invoke
signal, the comparison output switches the PMOS transistor OFF when the invoke signal indicates that the first PMOS transistor
should not pass the input signal to the VDD supply node.

US Pat. No. 9,086,710

ZERO-POLE COMPENSATOR CIRCUITS WITH IMPEDANCE REDUCTION MULTIPLIERS

MAXIM INTEGRATED PRODUCTS...

1. A compensator circuit comprising:
a first transconductance amplifier to convert an input voltage to a first output current;
a second transconductance amplifier to convert the input voltage to a second output current;
a buffer comprising a non-inverting input and an output, wherein the non-inverting input of the buffer receives the second
output current;

a resistance connected between an output of the first transconductance amplifier and the output of the buffer; and
a capacitance connected (i) between an output of the second transconductance amplifier and a terminal at a reference potential,
and (ii) between the non-inverting input of the buffer and the terminal,

wherein an output voltage of the compensator circuit is based on the first output current and is a voltage across the resistance,
the buffer and the capacitance.

US Pat. No. 9,052,846

CHARGE PUMP WITH A WIDE INPUT SUPPLY RANGE

Maxim Integrated Products...

1. A method of regulating an input supply voltage to a charge pump output voltage, comprising the steps of:
receiving the input supply voltage;
determining whether to use an auxiliary charge pump to start up and drive a primary charge pump according to a level of the
input supply voltage, wherein the primary charge pump generates the charge pump output voltage;

enabling the auxiliary charge pump to provide an intermediate voltage when the input supply voltage is lower than a reference
voltage, the intermediate voltage having a higher level than that of the input supply voltage; and

coupling the intermediate voltage to boost up the primary charge pump that drives a load, wherein the auxiliary charge pump
comprises a voltage-dependent oscillator that is driven by the intermediate voltage and provides a voltage-dependent clock,
the voltage-dependent clock having a frequency increasing with the magnitude of the intermediate voltage when the intermediate
voltage is lower than a threshold voltage and saturating when the intermediate voltage reaches the threshold voltage.

US Pat. No. 9,436,940

EMBEDDED SECURE ELEMENT FOR AUTHENTICATION, STORAGE AND TRANSACTION WITHIN A MOBILE TERMINAL

Maxim Integrated Products...

1. A secure element, comprising:
a secure memory that stores a sensitive data;
a secure processor that receives a request for a trusted transaction and processes the request, the trusted transaction being
associated with an operation selected from writing the sensitive data into the secure memory and reading the sensitive data
from the secure memory, the secure memory being coupled to and accessed by the secure processor only;

a verification/authentication (V/A) unit, coupled to the secure processor, the V/A unit verifying and authenticating the trusted
transaction and a user that makes the request as the secure processor receives the request for the trusted transaction; and

wherein the secure element is embedded in a mobile device and authorized to process the trusted transaction, and an initial
credential, provided by an entity that is different from a manufacturer of the mobile device and provides a user specific
credential encrypted with the initial credential to authenticate the trusted transaction, is programmed into the secure element
before the secure element is assembled into the mobile device and wherein the secure memory is a component separate from a
memory that is coupled to and accessed by only a central processing unit of the mobile device.

US Pat. No. 9,257,908

SYSTEMS AND METHODS TO AUTO-ADJUST ZERO CROSS CIRCUITS FOR SWITCHING REGULATORS

Maxim Integrated Products...

12. A method to adjust a zero cross condition, the method comprising:
detecting, in a first cycle, a variation in a node voltage in response to a switching event;
based on the variation, determining a time delay between the switching event and a second event; and
based on the time delay, reducing, in a second cycle, the time delay by adjusting a switching time of the switching event,
wherein adjusting comprises:

counting to a maximum delay time during a continuous conduction mode; and, in response to exceeding the maximum delay time,
adjusting a turn-off time of a synchronous rectifier in subsequent cycles.

US Pat. No. 9,482,534

GYROSCOPE SHOCK AND DISTURBANCE DETECTION CIRCUIT

Maxim Integrated Products...

1. A gyroscope sensing circuit comprising:
a first demodulation unit coupled to receive a first signal from a gyroscope, the first demodulation unit demodulates the
first signal to a first demodulated signal using a first reference signal;

a second demodulation unit coupled to receive the first signal from the gyroscope, the second demodulation unit demodulates
the first signal to a second demodulated signal output using a second reference signal;

a subtractor coupled to the first and second demodulation units, the subtractor isolates a shock signal that is asymmetric
with respect to a characteristic frequency of the gyroscope; and

a detector coupled to the subtractor, the detector determines whether the shock signal exceeds a threshold level.

US Pat. No. 9,372,264

PROXIMITY SENSOR DEVICE

Maxim Integrated Products...

1. A proximity sensor device comprising:
a substrate having a surface;
a light sensor assembly mounted to the substrate proximate to the surface, the light sensor assembly configured to detect
electromagnetic radiation in the limited spectrum of wavelengths; and

an encapsulation layer formed on the surface over the light sensor assembly, the encapsulation layer including a trench formed
therein to receive electromagnetic radiation blocking material, the electromagnetic radiation blocking material configured
to block electromagnetic radiation in a limited spectrum of wavelengths emitted from a light emitting source to at least partially
mitigate crosstalk between the light emitting source and the light sensor assembly.

US Pat. No. 9,129,874

LIGHT SENSOR HAVING IR CUT INTERFERENCE FILTER WITH COLOR FILTER INTEGRATED ON-CHIP

Maxim Integrated Products...

1. A light sensor comprising:
a substrate having a surface;
one or more photodetectors disposed proximate to the substrate and configured to detect light and to provide a signal in response
thereto;

one or more color pass filters disposed proximate to the surface, the one or more color pass filters configured to filter
visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors;

an IR cut interference filter disposed over the one or more photodetectors, the IR cut interference filter configured to filter
infrared light to at least substantially block infrared light from reaching the one or more photodetectors;

an adhesion layer disposed between the surface and the one or more color pass filters; and
an insulation layer disposed over the surface such that the insulation layer substantially encloses the one or more color
pass filters and the IR cut interference filter.

US Pat. No. 9,438,110

SYSTEMS AND METHODS FOR FEED-FORWARD CONTROL OF LOAD CURRENT IN DC TO DC BUCK CONVERTERS

Maxim Integrated Products...

1. A system for controlling load current in a voltage converter, the system comprising:
a current normalization module that receives a first measurement corresponding to the load current, receives a second measurement
corresponding to an inductor current, and matches a first gain of the first measurement corresponding to the load current
to a second gain of the second measurement corresponding to the inductor current to generate a normalized load current;

a feed-forward generation module that receives the normalized load current from the current normalization module and generates
a load current feed-forward (LCFF) signal based on the normalized load current; and

a duty cycle generation module that generates a duty cycle used to control the voltage converter based on a commanded output
voltage of the voltage converter and the LCFF signal.

US Pat. No. 9,276,470

MULTIPHASE SWITCHING CONVERTERS OPERATING OVER WIDE LOAD RANGES

Maxim Integrated Products...

1. A system comprising:
a multi-phase switching converter that receives an input voltage and that supplies an output voltage to a load via a plurality
of phases, wherein each phase comprises:

a plurality of switches;
an on-time generator module that determines an on-time of the switches;
a switch control module that controls a switching frequency of the switches based on the on-time and a clock signal; and
an inductance that connects the switches to the load;
a converter control module that varies the switching frequency without varying the on-time or varies the on-time without varying
the switching frequency when current through the load varies,

an error amplifier that generates an error voltage based on a reference voltage and the output voltage; and
a voltage controlled oscillator that generates the clock signal having a frequency based on the error voltage;
wherein the switching frequency is based on the frequency of the clock signal; and
wherein the converter control module comprises an on-time control module that generates a feed-forward control for the on-time
based on the error voltage and a clamping voltage, wherein the clamping voltage is equal to the error voltage at critical
conduction.

US Pat. No. 9,131,565

LED LIGHTING SYSTEM AND METHOD

Maxim Integrated Products...

1. A switching circuit to automatically identify a transformer, the circuit comprising:
a first comparator comprising a first input voltage and a second input voltage;
a second comparator coupled to the first comparator; and
a switching network coupled between the second comparator and an EMI filter, the switching network comprises at least one
switch and engages the EMI filter in response to the at least one switch being activated by the second comparator, wherein
the at least one switch is activated in response to a first input voltage of the first comparator exceeding a predetermined
threshold of a second input voltage of the first comparator.

US Pat. No. 9,092,041

CURRENT MIRROR CIRCUIT CONFIGURED TO ADJUST A BODY TO SOURCE VOLTAGE OF AN INPUT DEVICE

Maxim Integrated Products...

1. A current mirror circuit comprising:
a current mirror comprising an input device and an output device coupled together; and
a feedback circuit component coupled between the output of the current mirror and the input device, the feedback circuit component
for adjusting a body to source voltage of the input device in response to a drain to source voltage of the output device.

US Pat. No. 9,409,765

METHOD AND APPARATUS FOR AN ISOLATING STRUCTURE

Maxim Integrated Products...

1. An apparatus for mechanical isolation in semiconductor packaging, comprising:
a circuit board and an etched copper frame wherein the etching forms a first portion of the copper frame and a second portion
of the copper frame, the etched copper frame coupled to the printed circuit board;

a cavity between the printed circuit board and the etched copper frame permitting the first portion of the copper frame to
move relative to the second portion of the copper frame; and

a wire bond, both ends of the wire bond coupled to the first portion of the etched copper frame.

US Pat. No. 9,344,050

DYNAMIC SPEAKER MANAGEMENT WITH ECHO CANCELLATION

Maxim Integrated Products...

1. A system for echo cancellation comprising:
a dynamic speaker management (DSM) module receptive to a far-end signal and operative to develop a modified far-end signal
and a plurality of parameter outputs;

a current/voltage sensing amplifier coupled to the modified far-end signal and having an amplifier output, a voltage (V) parameter
output, and a current (I) parameter output;

a sound pressure level (SPL) model module coupled to the plurality of parameter outputs of the of the DSM module and operative
to develop a predicted SPL; and

an echo canceller module responsive to the predicted SPL and to a near-end signal and operative to develop an echo-canceled
output signal.

US Pat. No. 9,196,587

SEMICONDUCTOR DEVICE HAVING A DIE AND THROUGH SUBSTRATE-VIA

Maxim Integrated Products...

1. A semiconductor device comprising:
a processed semiconductor wafer having a first surface and a second surface, where the processed semiconductor wafer includes
integrated circuits formed proximate to the first surface of the processed semiconductor wafer and includes a first conductive
layer disposed over the first surface of the processed semiconductor wafer;

an integrated circuit die coupled to the second surface of the processed semiconductor wafer with an adhesive material, where
the integrated circuit die includes a conductive pad disposed proximate to the second surface of the processed semiconductor
wafer; and

a via formed from the first conductive layer to the conductive pad and through the first surface of the processed semiconductor
wafer to the second surface of the processed semiconductor wafer, where the via includes a conductive material configured
to electrically couple the conductive pad of the integrated circuit die to the first conductive layer and the first side of
the processed semiconductor wafer.

US Pat. No. 9,189,002

SINGLE-INDUCTOR POWER CONVERTER WITH BUCK-BOOST CAPABILITY

MAXIM INTEGRATED PRODUCTS...

1. A power converter comprising:
an inductor;
a first switch including a control terminal, a first terminal connected to a reference potential and a second terminal connected
to one terminal of the inductor;

a second switch including a control terminal, a first terminal connected to another terminal of the inductor and a second
terminal connected to a reference potential;

a summing module generating a voltage sum based on a ramp voltage and a first voltage based on a sensed inductor current;
a plurality of error amplifier modules generating error voltages;
a comparing and control signal generating module to generate first and second switching signals and skip signals based on
the error voltages and the voltage sum; and

a state machine module connected to the control terminals of the first switch and the second switch to switch the first switch
and the second switch based on the first switching signal, the second switching signal and the skip signals,

wherein the state machine module, during a single clock period, operates in one of a two phase mode with a TON phase during which the inductor is charged and one TOFF phase during which one of a first load and a second load is fed and a three phase mode with the TON phase and two TOFF phases during which both the first load and the second load are sequentially fed.

US Pat. No. 9,052,368

NEGATIVE PEAK VOLTAGE DETECTION FOR ENHANCED FUELGAUGE EMPTY VOLTAGE PREDICTION

Maxim Integrated Products...

1. A method of estimating the end of life of a battery in a battery powered device comprising:
estimating an average battery voltage during a discharge cycle of the battery;
determining the negative peaks in the battery voltage relative to the estimated average battery voltage during operation of
the battery powered device and storing a largest negative peak in the battery voltage relative to the estimated average battery
voltage;

modifying the estimated average battery voltage based on the largest negative peak in the battery voltage relative to the
estimated average battery voltage; and

estimating the battery end of life based on the modified estimated average battery voltage.

US Pat. No. 9,335,744

TRANSPONDER

Maxim Integrated Products...

1. A transponder, comprising:
a first coil coupled to receive a wireless electromagnetic query signal, the first coil generates a first wired electrical
incoming signal from the query signal;

at least one additional coil coupled to receive the wireless electromagnetic query signal, the at least one additional coil
generates a second wired electrical incoming signal from the query signal, wherein a first axis of the first coil and a second
axis of the at least one additional coil having different spatial alignments,

at least one full-wave rectifier, coupled to the first coil and the at least one further coil, the at least one full-wave
rectifier generating a first rectified incoming signal and a second rectified incoming signal from the first and second wired
electrical incoming signal;

a comparator that compares a first peak associated with the first rectified incoming signal and a second peak associated with
the second rectified incoming signal, the comparator identifies a larger peak between the first and second peaks.

US Pat. No. 9,279,681

MICROMECHANICAL CORIOLIS RATE OF ROTATION SENSOR

Maxim Integrated Products...

1. A micromechanical Coriolis rate of rotation sensor for detecting a rate of rotation, comprising:
a substrate;
a measurement axis (X-axis), a detection axis (Y-axis), and a drive axis (Z-axis), each being disposed orthogonally to each
other;

a first and a second driving mass disposed in an X-Y plane parallel to the substrate, each driving mass being rotatably coupled
to the substrate by means of a central suspension that is disposed along the Y-axis;

drive means for generating rotational oscillation of the driving masses about the drive axis (Z) at each central suspension;
and

wherein at least one elastic connecting element is disposed on each of the driving masses on both sides of the Y-axis, and
spaced apart for coupling and oscillating the first and second driving mass in a mutually tuned manner.

US Pat. No. 9,369,447

SYSTEM AND METHOD TO SECURELY TRANSFER DATA

Maxim Integrated Products...

1. A state-machine based secure data-converting apparatus comprising:
a signal converter coupled to receive a first signal from a physical data interface, the signal converter converts the first
signal into a second signal;

a logic circuit coupled to the signal converter and the data securing device, the logic circuit configured to receive a third
signal from a host via a bidirectional communication channel and determine validity of the third signal that comprises at
least one of a digital command, identifier information, and a shared secret;

a data securing device coupled to the signal converter, the data securing device comprises a secret and applies a security
protocol to the second signal without executing microcode.

US Pat. No. 9,329,042

INNOVATIVE ANGULAR SENSOR READ-OUT MULTI-AXES DIGITAL FRONT-END CHAIN

Maxim Integrated Products...

1. A signal processor for processing sensor signals from a plurality sensors of a gyroscope, comprising:
a multiplexer coupled to the plurality of sensors, responsive to a plurality of readout signals from the plurality of sensors,
and operative to generate a multiplexed signal;

a front end amplifier for converting the multiplexed signal into a voltage variation signal;
a demultiplexer coupled to the front end amplifier and operative to demultiplex the voltage variation signal into a plurality
of signals;

at least one analog-to-digital converter coupled to the demultiplexer and operative to convert the plurality of signals into
a plurality of digital signals; and

at least one demodulator coupled to the at least one analog-to-digital converter and operative to demodulate the plurality
of digital signals to thereby extract envelope signal therefrom.

US Pat. No. 9,159,684

WAFER-LEVEL PACKAGED DEVICE HAVING SELF-ASSEMBLED RESILIENT LEADS

Maxim Integrated Products...

1. A process comprising:
forming resilient leads on a wafer configured to be segmented into integrated circuit chips;
applying a guard to the wafer, the guard configured to protect the resilient leads; and
segmenting the wafer to separate an integrated circuit chip from the wafer, the integrated circuit chip including at least
one resilient lead, wherein the at least one resilient lead is configured to move from a first position to a second position
during an assembly reflow process, the resilient lead being held adjacent to the integrated circuit chip in the first position
and extending away from the integrated circuit chip in the second position to provide electrical interconnection of the integrated
circuit chip to a printed circuit board.

US Pat. No. 9,294,120

DIGITAL TECHNIQUE FOR EXCESS LOOP DELAY COMPENSATION IN A CONTINUOUS-TIME DELTA SIGMA MODULATOR

Maxim Integrated Products...

8. A continuous time delta sigma modulator, comprising:
a quantizer that includes N comparators that generate N digital outputs based on comparisons of (i) an input generated based
on a sample of an analog signal with (ii) N reference potentials, respectively;

a switching module that includes a plurality of switching devices and a plurality of resistors and that, based on states of
the switching devices, outputs the N reference potentials; and

a switch control module that controls the states of the switching devices based on the N digital outputs.

US Pat. No. 9,134,337

MICROELECTROMECHANICAL Z-AXIS OUT-OF-PLANE STOPPER

Maxim Integrated Products...

1. A microelectromechanical structure comprising:
a sensor substrate;
a proof mass suspended above the sensor substrate via at least one elastic element, the proof mass displacing and titling
in response to acceleration of the structure;

a cap substrate coupled to the sensor substrate, the cap substrate being bonded to the sensor substrate to form a cavity that
encloses the proof mass, the cap substrate further comprising a plurality of shock stoppers that are arranged above the proof
mass to push back the proof mass at specific locations upon a shock load; and

a plurality of balance stoppers coupled underneath the proof mass, each of the plurality of balance stoppers being arranged
according to a position of one of the plurality of shock stoppers and electrically driven by a balance voltage, each of the
plurality of balance stoppers generating first electrostatic force and torque on the proof mass to balance second force and
torque generated by a corresponding shock stopper.

US Pat. No. 9,525,420

PROGRAMMABLE MIXED-SIGNAL INPUT/OUTPUT (IO)

Maxim Integrated Products...

1. An integrated circuit device comprising:
a memory for storing a configuration register for furnishing an on-chip register setting;
a plurality of ports, respective ones of the ports being timed-multiplexing configurable to function as an input or output
to communicate at least one of a digital or analog signal based on the on-chip register setting; and

at least one of an analog-to-digital converter or a digital-to-analog converter that is time-multiplexed to the plurality
of ports.

US Pat. No. 9,349,035

MULTI-FACTOR AUTHENTICATION SENSOR FOR PROVIDING IMPROVED IDENTIFICATION

Maxim Integrated Products...

1. A mobile device configured to authenticate a user, comprising:
an authentication sensing device, including
a biometric sensor configured to receive biometric information from the user; and
a fingerprint sensor configured to receive fingerprint information from the user, where the biometric sensor and the fingerprint
sensor are disposed in a backside chip-on-glass configuration in an area of the authentication sensing device where optical
and electrostatic sensing areas overlap; and

a controller configured to authenticate the user, where the authentication sensing device, including
the biometric sensor and the fingerprint sensor, is coupled to the controller.

US Pat. No. 9,197,399

DIGITAL SIGNAL SAMPLING METHOD

Maxim Integrated Products...

1. A method of processing a digital signal comprising:
receiving a digital signal having a bit period;
deriving a first clock signal from the digital signal for sampling the digital signal at a sampling time during each bit period;
performing a sweep of all phase values of the digital signal;
determining from the sweep of all phase values of the digital signal which phase corresponds to a maximum vertical eye opening;
adjusting the phase of the first clock signal to the phase that corresponds to maximum vertical eye opening; and
adjusting the phase of the first clock signal to improve a vertical eye opening of the digital signal at the sampling time
by

(a) measuring the vertical eye opening of the signal at a first phase of the first clock signal;
(b) making an adjustment to the phase of the first clock signal in a direction;
(c) determining whether the vertical eye opening has increased or decreased by
(i) determining a first signal value that a first predetermined proportion of samples are below;
(ii) determining a second signal value that a second predetermined proportion of signal values are below; and
(iii) determining the difference between the first signal value and second signal value;
(d) if the vertical eye opening has increased, repeating (a) to (c) with an adjustment to the phase of the first clock signal
in the same direction; and

(e) if the vertical eye opening has not increased, repeating (a) to (c) with an adjustment to the phase of the first clock
signal in an opposite direction.

US Pat. No. 9,064,388

IMPULSE NOISE DETECTION AND CANCELLATION IN POWER LINE COMMUNICATION DEVICE

MAXIM INTEGRATED PRODUCTS...

1. A receiver for a power line communication (PLC) device, comprising:
an analog front end configured to receive an input signal from a power line, wherein the input signal includes symbols and
wherein each of the symbols includes samples; and

a demodulator module configured to demodulate the input signal received from the analog front end to generate a demodulated
signal, wherein the demodulator module includes an impulse noise module configured to detect and remove an impulse noise in
the symbols of the input signal, and wherein the impulse noise module comprises:

a magnitude measurement module configured to determine an average magnitude of the samples in the symbols of a portion of
a preamble of the input signal and to set a magnitude threshold based on the average magnitude;

a coarse detection module configured to use a sliding window and the magnitude threshold to determine one or more positions
of the impulse noise in T adjacent symbols, wherein T is an integer greater than zero; and

a fine detection module configured to locate rising and falling edges of the impulse noise based on one or more of the positions
and to determine one or more erase positions based on the rising and falling edges.

US Pat. No. 9,343,430

STACKED WAFER-LEVEL PACKAGE DEVICE

Maxim Integrated Products...

1. A wafer-level package device comprising:
a semiconductor device having at least one electrical interconnection and at least one integrated circuit formed therein,
the semiconductor device including a first surface and a second surface, where the at least one electrical interconnection
includes at least one micro-through-silicon-via, where the at least one micro-through-silicon via has a size from ten (10)
micrometers to fifty (50) micrometers and a depth from fifty (50) micrometers to one hundred and fifty (150) micrometers;

a semiconductor package device positioned over the first surface of the semiconductor device;
at least one micro-solder bump coupled to the semiconductor package device and coupled to the micro-through-silicon via; and
a single encapsulation structure supported by the semiconductor device that encapsulates all sides of the semiconductor package
device including a side of the semiconductor package device that is distal from the semiconductor device, where the encapsulation
structure includes a polymer, and where the encapsulation structure abuts the semiconductor device including at least one
integrated circuit,

wherein the at least one micro-solder bump is in contact with the at least one electrical interconnection when the semiconductor
package device is positioned over the first surface of the semiconductor device and the at least one electrical interconnection
is configured to provide electrical connectivity to the semiconductor package device.

US Pat. No. 9,245,702

KEYPAD HAVING TAMPER-RESISTANT KEYS

Maxim Integrated Products...

1. A keypad comprising:
a resilient key member having a contact configured to close a key press detection circuit to register a key press, where the
resilient key member is configured to engage with an inner portion of a key; and

a tamper detection switch assembly integrated with the resilient key member, the tamper detection switch assembly at least
partially surrounding the contact, the tamper detection switch assembly configured to detect an attempt to access the keypad,
wherein the tamper detection switch assembly includes an actuator at least partially surrounding the resilient key member,
the actuator configured to at least partially flex from a compressed shape to a released shape in response to the attempt
to access the keypad.

US Pat. No. 9,223,332

STABILIZING REFERENCE VOLTAGE OF SWITCHED CAPACITOR CIRCUITS

Maxim Integrated Products...

1. A system comprising:
a switched capacitor circuit that has a first state, wherein the first state is a function of an input of the switched capacitor
circuit; that receives a reference voltage from a reference node; that transitions from the first state to a second state
in response to a change in the input of the switched capacitor circuit, wherein the second state is a function of the first
state or the input of the switched capacitor circuit; and that draws or supplies a switched capacitor charge from or to the
reference node in response to transitioning from the first state to the second state;

a stabilizing circuit that stabilizes the reference voltage by supplying or drawing a stabilizing charge to or from the reference
node based on the first and second states of the switched capacitor circuit;

a feedback circuit that is connected to the reference node and that generates a feedback of the reference voltage; and
a buffer that receives the feedback and a first voltage and that supplies a buffer charge to the reference node,
wherein the buffer charge compensates for a positive or negative error in estimation of the stabilizing charge.

US Pat. No. 9,081,403

OPTIMAL COMPENSATING RAMP GENERATOR FOR FIXED FREQUENCY CURRENT MODE DC-DC CONVERTERS

MAXIM INTEGRATED PRODUCTS...

1. A system for generating a compensating ramp for a DC-DC converter having fixed frequency current mode control architecture,
the system being adaptive to an input voltage of the converter and an output voltage of the converter, and being programmable
based on an inductor of the converter, the system comprising:
a reference slope generator module that receives the input voltage and the output voltage of the converter and that outputs,
based on the input voltage and the output voltage, a voltage reference;

a voltage ramp generator module that receives the voltage reference and that generates a voltage ramp based on the voltage
reference; and

a ramp converter module that i) receives the voltage ramp and a user input, wherein the ramp converter module includes a comparator
having a first input that receives the voltage ramp and a second input connected to a programmable resistor, wherein the programmable
resistor receives the user input, wherein the user input includes a digital input corresponding to an inductance value of
the inductor, and wherein a conversion gain associated with at least one of the voltage ramp generator module and the ramp
converter module is set based on the user input, and ii) converts the voltage ramp to a compensating ramp current.

US Pat. No. 9,052,335

METHOD AND SYSTEM FOR QUADRATURE ERROR COMPENSATION

Maxim Integrated Products...

1. A method for compensation of a quadrature error on an MEMS sensor, the method comprising:
reading out a drive movement using detection electrodes;
detecting a movement of at least one mass arranged on a substrate and mounted to move relative to drive electrodes, the movement
deviating from a prescribed movement due to a quadrature error;

identifying a capacitance change as a function of drive movement of the at least one mass using a plurality of compensation
electrodes;

generating a compensation charge on the compensation electrodes, the compensation charge being dependent on the quadrature
error; and

wherein the quadrature error in the detection electrodes is compensated using the compensation charge without changing a deviating
movement of the mass caused by the quadrature error.

US Pat. No. 9,176,157

MICRO-ELECTROMECHANICAL STRUCTURE WITH LOW SENSITIVITY TO THERMO-MECHANICAL STRESS

Maxim Integrated Products...

1. A microelectromechanical structure, comprising:
a substrate;
a proof mass, suspended above the substrate, the proof mass responding to acceleration by displacing and tilting with respect
to a moveable mass rotational axis that is located in the plane of the proof mass;

at least one anchor, fixed on the substrate, the at least one anchor being coupled to support the proof mass; and
a plurality of elastic elements, connected to the at least one anchor and the proof mass, geometry and configuration of the
plurality of elastic elements being adjusted to reduce a displacement of the proof mass caused by thermo-mechanical stress
with respect to the moveable mass rotational axis, wherein a first subset and a second subset of the plurality of elastic
elements are arranged to support the proof mass from two opposite sides, and the first and second subsets of elastic elements
mirror each other in their geometry and configuration with respect to a central line that is perpendicular to the moveable
mass rotational axis and passes a center of the proof mass.

US Pat. No. 9,143,092

FULLY CAPACITIVE COUPLED INPUT CHOPPERS

Maxim Integrated Products...

1. A method of differential signal transfer from a differential input Vinp and Vinn when a common mode input voltage is higher
than the power supply voltage, comprising:
providing an input chopper having first through fourth chopper transistors, each having a source, a drain and a gate, the
input chopper having Vinp and Vinn as a differential input, the first through fourth transistors being MOS transistors, and
wherein the sources of the first and third transistors are coupled to the Vinp input, the sources of the second and fourth
transistors are coupled to the Vinn input, the drains of the first and fourth transistors are coupled to input chopper output
Voutp and the drains of the second and third transistors being coupled to the input chopper output Voutn;

providing an output chopper;
capacitively coupling a differential output Voutp and Voutn of the input chopper to a differential input of the output chopper;
wherein providing protection of the gates of the first through fourth transistors from excessive voltages comprises, when
a negative common mode voltage surge occurs on the inputs Vinp and Vinn, coupling the gates of the first through fourth transistors
to the input Vinp or the input Vinn, which ever is a lower voltage.

US Pat. No. 9,070,714

STRAPPED DUAL-GATE VDMOS DEVICE

Maxim Integrated Products...

1. A process comprising:
forming a dual-gate over a semiconductor wafer, the semiconductor wafer having a first surface and a second surface, the semiconductor
wafer including a drain region of a first conductivity type proximal to the second surface and an epitaxial region formed
proximal to the first surface and extending from the first surface to the drain region, the dual-gate including a first gate
region and a second gate region, the first gate region and the second gate region forming a gap there between;

implanting a first body region of a second conductivity type through the first gate region and a second body region of the
second conductivity type through the second gate region;

implanting a first source region of the first conductivity type in the first body region and a second source region of the
first conductivity type in the second body region; and

forming a conductive layer over the dual-gate to connect the first gate region and the second gate region together and for
reducing an effective resistance of the dual-gate.

US Pat. No. 9,459,298

METHOD AND APPARATUS FOR SENSING CAPACITANCE VALUE AND CONVERTING IT INTO DIGITAL FORMAT

Maxim Integrated Products...

1. A capacitance sensing device comprising:
a signal generator that generates both a digital local oscillator (LO) signal and an excitation signal;
a capacitance-to-amplitude converter (C2A) coupled to the signal generator, the C2A converts a measured capacitance to an
AC signal having an amplitude proportional to the measured capacitance;

a demodulator coupled to receive the AC signal from the C2A and the digital LO signal from the signal generator, the demodulator
multiplies the AC signal with the digital LO signal to generate a DC signal proportional to the amplitude; and

an analog-to-digital converter (ADC) coupled to the output of the demodulator, the ADC outputs a digital conversion value
proportional to both the DC component and the measured capacitance.

US Pat. No. 9,352,955

MEMS PRESSURE SENSOR WITH IMPROVED INSENSITIVITY TO THERMO-MECHANICAL STRESS

Maxim Integrated Products...

1. A system for providing thermo-mechanical insensitivity, comprising:
a sealed cavity;
an array of membranes acting as pressure sensors within the sealed cavity;
a plurality of sensing electrodes, wherein the sensing electrodes are suspended within the sealed cavity; and
dielectric anchors coupled to the sensing electrodes and the sensing membranes.

US Pat. No. 9,171,916

LDMOS WITH THICK INTERLAYER-DIELECTRIC LAYER

Maxim Integrated Products...

1. A semiconductor device comprising:
a substrate having a source region of a first conductivity type and a drain region of the first conductivity type formed proximate
to a surface of the substrate;

an extended drain region of the first conductivity type disposed in the substrate, the extended drain region having the drain
region formed therein;

a gate positioned over the surface and between the source region and the drain region, the gate configured to receive a voltage;
an interlayer-dielectric region positioned over at least one of the surface or the gate, the interlayer-dielectric region
having a thickness ranging between 2.5 microns and 4.0 microns for supporting breakdown voltages ranging between 800 volts
and 900 volts while maintaining a relatively constant on-state resistance per unit area;

a first field plate at least partially positioned over the gate and configured to shape an electrical field generated at least
partially between the source region and the drain region when the voltage is applied to the gate, the first field plate electrically
connected to the gate;

a second field plate at least partially positioned over the drain region, the second field plate electrically connected to
the drain region;

a LOCOS region disposed between the source region and the drain region, wherein the extended drain region at least partially
extends below the LOCOS region; and

a reduced surface field (RESURF) region disposed in the extended drain region,
wherein the first field plate and the second field plate are disposed directly over the interlayer-dielectric region, wherein
the first field plate is disposed over the reduced surface field (RESURF) region.

US Pat. No. 9,109,893

MICRO-GYROSCOPE AND METHOD FOR OPERATING A MICRO-GYROSCOPE

Maxim Integrated Products...

1. A micro-gyroscope for determining a rate of rotation about a Z-axis, comprising:
a substrate, and
a first and a second sensor device, wherein each sensor device further comprises:
at least one drive mass disposed parallel to the substrate,
at least one anchor by means of which the at least one drive mass is attached to the substrate,
at least one anchor spring disposed between the at least one anchor and the at least one drive mass, by means of which the
at least one drive mass is mounted linearly displaceably in the direction of an X-axis and rigidly in the directions of a
Y-axis and a Z-axis,

drive elements by means of which the at least one drive mass can be driven in an oscillatory manner in the direction of the
X-axis,

at least one sensor mass coupled to the at least one drive mass by means of springs, such that said at least one sensor mass
is coupled displaceably in the Y-direction and rigidly in the X-direction and Z-direction to the at least one drive mass,

sensor elements for detecting a deflection of the at least one sensor mass in the direction of the Y-axis,
wherein the first and second sensor devices are disposed parallel to each other and one above the other in the direction of
the Z-axis, and wherein the at least one drive mass in the first and second sensor device are coupled to each other by means
of a coupling spring.

US Pat. No. 9,106,255

DIGITAL TECHNIQUE FOR EXCESS LOOP DELAY COMPENSATION IN A CONTINUOUS-TIME DELTA SIGMA MODULATOR

MAXIM INTEGRATED PRODUCTS...

1. A continuous time delta sigma modulator, comprising:
a quantizer that includes:
a first comparator that generates a first digital output based on a comparison of a first reference potential with an input
generated based on a sample of an analog signal; and

a second comparator that generates a second digital output based on a comparison of a second reference potential with the
input generated based on the sample of the analog signal; and

a reference module that varies the first and second reference potentials based on the first and second digital outputs.

US Pat. No. 9,054,786

SYSTEM AND METHOD FOR APPLYING MULTI-TONE OFDM BASED COMMUNICATIONS WITHIN A PRESCRIBED FREQUENCY RANGE

MAXIM INTEGRATED PRODUCTS...

1. A first network device connected by a power line to a distribution transformer, the first network device comprising:
a transceiver to communicate with a second network device via the power line through the distribution transformer in a frequency
band from 1 kHz to 600 kHz;

a tone mapping module to select orthogonal tones in the frequency band for modulation based on a mapping table; and
a pre-emphasis module to pre-emphasize at least one of the selected orthogonal tones to compensate for attenuation of a signal
transmitted through the power line,

wherein the transceiver receives a channel estimate generated by the second network device based on the signal to adjust the
mapping table and pre-emphasis.

US Pat. No. 9,582,283

TRANSFER TRIGGERED MICROCONTROLLER WITH ORTHOGONAL INSTRUCTION SET

Maxim Integrated Products...

1. A microprocessor core comprising:
a plurality of registers in which commands are received and processed, the plurality of registers being scalable and configurable
by a user;

a point-to-point transport network coupled to the plurality of registers, the point-to-point transport network interfacing
directly with each register within the plurality of registers and providing point-to-point communication between a routine
source register and a routine destination register;

a decoder, coupled to the point-to-point transport network and program memory, the decoder configured to decode data fetched
from the program memory and transmit this decoded data to at least one register within the plurality of registers; and

a memory management unit, coupled to the program memory, data memory and at least one register within the plurality of registers,
the memory management unit creating a virtual memory map by combining at least a portion of the program memory and at least
a portion of the data memory.

US Pat. No. 9,472,451

TECHNIQUE FOR WAFER-LEVEL PROCESSING OF QFN PACKAGES

Maxim Integrated Products...

1. A wafer-level package device comprising:
an integrated circuit chip having a surface;
a plurality of pillars extending from the surface, the plurality of pillars having an end distal from the surface, the plurality
of pillars configured to provide an electrical interconnection to the integrated circuit chip;

a first photoresist layer disposed over the surface; and
a second photoresist layer disposed over the first photoresist layer,
wherein a first pillar of the plurality of pillars extends through the first photoresist layer and the second photoresist
layer and a second pillar of the plurality of pillars extends only through the first photoresist layer.

US Pat. No. 9,367,502

COMMUNICATION METHODS AND APPARATUS AND POWER SUPPLY CONTROLLERS USING THE SAME

Maxim Integrated Products...

1. A method of simultaneous bidirectional communication over a first line between first and second locations comprising:
transferring information over the first line from the first location to the second location as an analog voltage signal;
while simultaneously transferring information over the same first line from the second location to the first location as an
analog current signal;

wherein the method is practiced in a power supply controller having a master controller at the first location and a plurality
of slave controllers at the second and at least one other location, each having at least one line between the respective slave
controller and the master controller; and

wherein the master controller includes first and second multiplexers, whereby unique voltage signals may be sent by the master
controller through the first multiplexer to the slave controllers in succession while receiving current signals from the respective
slave controllers through the second multiplexer at the same time.

US Pat. No. 9,157,797

AVALANCHE PHOTO DIODE DETECTOR CONTROL SYSTEMS AND METHOD

Maxim Integrated Products...

1. A method for controlling an avalanche photo diode detector comprising:
providing an avalanche photo diode optically coupled to a light source, whereby the light source provides an input optical
power level to the avalanche photo diode;

measuring a signal current flowing through the avalanche photo diode in response to the input optical power level;
computing an estimate of the input optical power level from the signal current measurement; and
adjusting a voltage bias applied to the avalanche photo diode based on the estimate of the input optical power levels
wherein the voltage bias is adjusted to a high voltage level VH for input optical power levels equal to or below a first input optical power level; and

wherein the signal current passing through the avalanche photo diode is held constant for input optical power levels above
the first input optical power level.

US Pat. No. 9,159,586

METHOD OF FORMING SOLDERABLE SIDE-SURFACE TERMINALS OF QUAD NO-LEAD FRAME (QFN) INTEGRATED CIRCUIT PACKAGES

Maxim Integrated Products...

1. A method of processing a plurality of integrated circuit (IC) packages, comprising:
forming a plurality of individual IC packages from an array of attached IC packages;
removing oxides from side surfaces of terminals of the individual IC packages before vertically stacking the individual IC
packages having the terminals;

wherein vertically stacking the individual IC packages having the terminals comprises:
placing a first side of a first individual IC package onto a first side of a cover, where the first side of the first individual
IC package includes terminals, placing a first side of a second individual IC package onto a second side of the cover opposite
to the first side of the cover to form a first stack of individual IC packages, and placing the stack of individual IC packages
on a second stack of individual IC packages;

maintaining the first stack of individual IC packages and second stack of individual IC packages using a securing device;
pre-heating the first stack and the second stack to a temperature less than a temperature of a solder bath;
forming a solder coating on the side surfaces of terminals of the individual IC packages of the first stack and the second
stack; and

dismantling the first stack and the second stack and cleaning the plurality of individual IC packages.

US Pat. No. 9,093,333

INTEGRATED CIRCUIT DEVICE HAVING EXTENDED UNDER BALL METALLIZATION

Maxim Integrated Products...

1. An electronic device comprising:
a printed circuit board; and
a semiconductor device, the semiconductor device including
an integrated circuit chip,
a solder ball configured to couple the integrated circuit chip to the printed circuit board, and
an under ball metallization formed on the integrated circuit chip, where the solder ball is disposed on the under ball metallization
so that the solder ball and the under ball metallization have a contact area there between, the under ball metallization having
an area that is greater than the contact area, where the under ball metallization includes a first conductive layer and a
second conductive layer, the second conductive layer extending beyond the contact area, where the second conductive layer
is formed at least partially over a dielectric layer, where a polymer layer is at least partially formed over the second conductive
layer, and where the second conductive layer extends past each edge of the solder ball.

US Pat. No. 9,443,815

EMBEDDED DIE REDISTRIBUTION LAYERS FOR ACTIVE DEVICE

Maxim Integrated Products...

1. An embedded integrated circuit package comprising:
a substrate assembly;
an integrated circuit die embedded within the substrate assembly;
a laminate material in contact with the integrated circuit die;
a passivation layer having at least a portion in direct contact with a surface of the embedded integrated circuit die;
at least one substrate redistribution layer having at least a portion in direct contact with the surface of the embedded integrated
circuit die and at least another portion in direct contact with the passivation layer, the at least one substrate redistribution
layer further including at least a portion positioned between the laminate material and the passivation layer where at least
a portion of the passivation layer is positioned between the surface of the embedded integrated circuit die and the at least
another portion of the at least one substrate redistribution layer, the surface of the embedded integrated circuit die in
direct contact with each of the laminate material, the passivation layer, and the at least one substrate redistribution layer;
and

a via in contact with the substrate redistribution layer.

US Pat. No. 9,075,457

SYSTEM AND METHOD FOR INTERFACING APPLICATIONS PROCESSOR TO TOUCHSCREEN DISPLAY FOR REDUCED DATA TRANSFER

Maxim Integrated Products...

1. A method of interfacing a touchscreen with an applications processor, comprising:
generating a first signal representing a user touching the touchscreen;
generating a second signal representing the user releasing the touchscreen;
generating a third signal representing the user dragging a touch across the touchscreen, the step of generating a third signal
including:

defining an aperture window having a boundary around the touch on the touchscreen;
monitoring a movement of the touch on the touchscreen; and
when the user drags the touch to a point on the boundary, recording the user dragging event in a memory and defining a new
aperture window around the point on the boundary;

transmitting the first, second, and third signals to a controller;
analyzing whether each of the first, second, and third signals satisfies at least one predetermined criterion;
based on the analysis, storing in the memory data related to the at least one of the first, second, and third signals;
responsive to storage of the data in the memory, transitioning an interrupt signal to a first logic level to indicate that
the data in the memory is available for access by an applications processor; and

responsive to reading all of the data in the memory by the applications processor, transitioning the interrupt signal to a
second logic level to indicate that there is no data in the memory available for access by the applications processor.

US Pat. No. 9,059,734

SYSTEMS AND METHODS FOR CAPACITIVE DIGITAL TO ANALOG CONVERTERS

MAXIM INTEGRATED PRODUCTS...

1. A successive-approximation-register (SAR) analog to digital converter (ADC) comprising:
a capacitive digital to analog converter (DAC) comprising:
a first capacitor that includes a first terminal and a second terminal, the second terminal connected to a common node;
a first switching device that:
includes a third terminal connected to the first terminal of the first capacitor;
includes fourth, fifth, sixth, and seventh terminals that are connected to first, second, third, and fourth reference potentials,
respectively; and

selectively connects the third terminal to one of the fourth, fifth, sixth, and seventh terminals;
a second capacitor that includes an eighth terminal and a ninth terminal, the ninth terminal connected to the common node;
a second switching device that:
includes a tenth terminal connected to the eighth terminal of the second capacitor;
includes eleventh, twelfth, thirteenth, and fourteenth terminals that are connected to the first, second, third, and fourth
reference potentials, respectively; and

selectively connects the tenth terminal to one of the eleventh, twelfth, thirteenth, and fourteenth terminals;
a comparator module that compares a first voltage of a sample of an analog signal with a second voltage at the common node;
and

a SAR module that controls the first and second switching devices based on the comparison, wherein the SAR module:
controls the first switching device to connect the third terminal to the fourth terminal at a first time; and,
when the second voltage is less than the first voltage at a second time that is after the first time, selectively controls
the first switching device to connect the third terminal to the fifth terminal.

US Pat. No. 9,294,049

FAST-SETTLING CAPACITIVE-COUPLED AMPLIFIERS

Maxim Integrated Products...

1. A differential amplifier system comprising:
a chopper free signal path having a first differential amplifier with a first differential amplifier output coupled to a differential
amplifier system output, the first differential amplifier having a first differential amplifier input capacitively coupled
to a differential amplifier system input, the chopper free signal path not having any choppers therein; and

a chopper signal path coupled between the differential amplifier system input and the differential amplifier system output,
the chopper signal path having a first chopper having an input coupled to the differential amplifier system input and an output
capacitively coupled to an input of a second chopper, the output of the second chopper being coupled through an integrator
to the differential amplifier system output.

US Pat. No. 9,191,104

DIRECT REFERENCE SUBTRACTION SYSTEM FOR CONTROL OF OPTICAL TRANSMITTERS

Maxim Integrated Products...

17. An optical measurement system comprising:
a laser diode configured to emit electromagnetic radiation;
a photodetector configured to detect the electromagnetic radiation in the limited spectrum of wavelengths and to generate
a photodetector signal in response thereto, the photodetector signal representing the electromagnetic radiation;

a plurality of reference current sources, each reference current source of the plurality of reference current sources configured
to generate a respective reference current;

a switch configured to electrically connect the photodetector to at least one reference current source of the plurality of
reference current sources at a time, the at least one reference current source selected according to the transmission signal
such that the reference current generated by the at least one reference current source is subtracted from the photodetector
signal such that a difference signal remains, the difference signal representing a temperature characteristic associated with
the laser diode; and

a comparison device directly coupled to the photodetector, the comparison device configured to compare the difference signal
to a reference signal, the comparison device configured to output a comparison output signal indicative of an adjustment for
a laser diode drive signal that drives the laser diode based upon the transmission signal.

US Pat. No. 9,086,439

CIRCUITS, DEVICES AND METHODS HAVING PIPELINED CAPACITANCE SENSING

Maxim Integrated Products...

1. A capacitance sensing circuit, comprising:
a plurality of sample and hold (S/H) circuits, each configured to sample and store an analog value corresponding to a capacitance
sensed by a corresponding sense channel, each S/H circuit comprising a sample amplifier having a first terminal and a sample
capacitor having a first terminal and a second terminal, the first terminal of the sample amplifier coupled to the first terminal
of the sample capacitor, each S/H circuit further including switch elements, the switch elements configured to couple the
first and second terminals of the sample capacitor to a reference voltage in an idle mode, to couple the first terminal to
the corresponding sense channel and the second terminal to the reference voltage in a sample mode, to isolate the first terminal
and couple the second terminal to the reference voltage in a wait mode, and to couple the first terminal to an amplifier feedback
loop and the second terminal to an amplifier input in a hold mode; and

a multiplexer (MUX) circuit having a different input coupled to each S/H circuit and an output coupled to an analog-to-digital
converter (ADC), wherein the sample amplifier of each S/H circuit is configured to operate in a low power state when an analog
voltage from the corresponding sense channel is stored by the corresponding sample capacitor, and configured to operate in
a second power state that is higher than the low power state when the S/H circuit is coupled to the ADC.

US Pat. No. 9,077,331

HARMONIC DISTORTION REDUCTION IN CONTINUOUS TIME FILTERS

MAXIM INTEGRATED PRODUCTS...

1. An integrated circuit (IC) comprising:
a first circuit that is manufactured using a process, that has an input and an output, and that has a first nonlinearity;
and

a second circuit that is manufactured using the process, that has a first terminal connected to the output of the first circuit
and a second terminal connected to the input of the first circuit, and that has a second nonlinearity,

wherein the second nonlinearity (i) is equal and opposite to the first nonlinearity and (ii) cancels the first nonlinearity,
and

wherein a resistance of the second circuit is a function of an operating parameter of the IC, the IC further comprising:
a sensing circuit that senses the operating parameter of the IC; and
a control module that is coupled to the sensing circuit and the second circuit and that selects a value of the resistance
of the second circuit based on the operating parameter of the IC,

wherein the value of the resistance is selected to cancel a predetermined harmonic from the output of the first circuit.

US Pat. No. 9,537,656

SYSTEMS AND METHODS FOR MANAGING CRYPTOGRAPHIC KEYS IN A SECURE MICROCONTROLLER

Maxim Integrated Products...

1. A method of pairing cryptographic keys with memory regions in a secure microcontroller:
receiving a data and a logic address;
translating the logic address to at least one physical address;
comparing an address with a plurality of area configuration sets, the address being selected from the physical address and
the logic address, each area configuration set being associated with a memory region storing data processed based on a particular
key;

identifying an area configuration set based on the address selected from the physical address and the logic address;
receiving a plurality of keys via a dedicated link, the dedicated link being implemented as a serial data interface;
selecting a target key from the plurality of keys according to the area configuration set; and
processing the data based on the target key, wherein an address range of the memory region is defined by a plurality of area
configurations included in the area configuration set.

US Pat. No. 9,461,625

SWITCHED-CAPACITOR NETWORK WITH INPUT-OUTPUT COMMON MODE DECOUPLING

Maxim Integrated Products...

1. A switched-capacitor network to cancel unwanted signals, the switched-capacitor network comprising:
first and second reset switches coupled to a respective input common mode voltage and an output common mode voltage;
an operational amplifier having an input terminal and an output terminal that in a reset phase are selectively connected to
receive the input common mode voltage and the output common mode voltage, respectively;

a CDS capacitor coupled between first and second reset switches to decouple the input common mode voltage from the output
common mode voltage in a CDS phase;

a sensing capacitor coupled in series with a sensing switch across the operational amplifier in a feedback loop, the sensing
capacitor configured to store in a sensing phase a charge associated with an unwanted signal;

a first CDS switch coupled to the sensing capacitor; and
a second CDS switch coupled between the output common mode voltage and the output terminal.

US Pat. No. 9,431,440

OPTICAL SENSOR

Maxim Integrated Products...

1. An integrated circuit device forming a pinhole camera, the integrated circuit device comprising:
an array of photodiodes on an active semiconductor substrate;
a dielectric layer disposed adjacent to the active semiconductor substrate proximate to the array of photodiodes, the dielectric
layer having a first side immediately adjacent to the active semiconductor substrate and a second side opposite from the active
semiconductor substrate, the dielectric layer configured to transmit electromagnetic radiation therethrough;

a front-end epoxy layer disposed on the second side of the dielectric layer, the front-end epoxy layer and the dielectric
layer having at least approximately the same index of refraction; and

a layer of substantially opaque material disposed between the dielectric layer and the front-end epoxy layer, the layer of
substantially opaque material defining an aperture that permits electromagnetic radiation incident upon a surface of the front-end
epoxy layer to reach the array of photodiodes to form a plurality of image spots on the array of photodiodes, the plurality
of image spots having a one-to-one correspondence with a plurality of object spots on an object located within a field of
view of the pinhole camera.

US Pat. No. 9,369,141

INTERCONNECT STRUCTURES FOR MINIMIZING CLOCK AND OUTPUT TIMING SKEWS IN A HIGH SPEED CURRENT STEERING DAC

Maxim Integrated Products...

1. A system comprising:
a clock interconnect network including an input node and a plurality of output nodes, wherein the clock interconnect network
receives a clock input at the input node and distributes, based on the clock input, a plurality of clock signals via respective
ones of the plurality of output nodes, and wherein a propagation delay of each of the plurality of clock signals distributed
by the clock interconnect network is approximately equal to respective propagation delays of others of the plurality of clock
signals distributed by the clock interconnect network; and

a digital-to-analog converter (DAC) that includes (i) a plurality of segments, wherein each of the plurality of segments outputs
a respective output and (ii) a plurality of drivers, wherein each of the plurality of drivers receives a respective one of
the plurality of clock signals and provides a driver signal to a respective one of the plurality of segments based on the
respective one of the plurality of clock signals.

US Pat. No. 9,362,942

SYSTEM CHARACTERISTIC IDENTIFICATION SYSTEMS AND METHODS

Maxim Integrated Products...

1. A characteristic identification system, comprising:
a digital to analog converter (DAC) that samples a first digital signal at a first predetermined rate to produce first digital
values and that outputs a first analog signal corresponding to the first digital values to a system of one or more components
that is to be characterized;

a mixer that receives a second analog signal output by the system in response to the first analog signal and that mixes the
second analog signal with a periodic signal to produce a mixed signal;

an integrator that integrates the mixed signal during successive predetermined periods and that generates an integrator signal
based on the integration;

an analog to digital converter (ADC) that samples the integrator signal at a second predetermined rate corresponding to the
predetermined periods and that converts the samples into second digital values, wherein the second predetermined rate is less
than the first predetermined rate;

a correction module that determines corrections for the integrator and the DAC and that generates third digital values based
on the first digital values and the corrections, respectively;

a correction determination module that pairs ones of the third digital values with ones of the second digital values, respectively,
and that determines coefficients for the system based on the pairs; and

a pre-distortion module that pre-distorts a second digital signal based on the coefficients for the system to produce the
first digital signal.

US Pat. No. 9,184,113

METHODS OF FORMING COAXIAL FEEDTHROUGHS FOR 3D INTEGRATED CIRCUITS

Maxim Integrated Products...

1. A coaxial feedthrough in a wafer or wafer size substrate comprising:
a wafer or wafer size substrate having at least one through hole therein extending from a first surface to a second surface
of the wafer or wafer size substrate;

a layer of a first insulative material lining the at least one through hole, the layer of first insulative material also extending
over at least a part of the first surface;

a first metal conductor layer in the at least one through hole on an inner surface of the first insulative layer, the first
metal conductor layer also extending over at least a part to the first insulative material extending over at least a part
of the first surface;

a layer of a second insulative material in the at least one through hole on an inner surface of the first metal conductor
layer;

a second metal conductor layer in the at least one through hole on an inner surface of the second insulative layer;
the second metal conductor layer at least partially filling an opening in the layer of second insulative material.

US Pat. No. 9,177,161

SYSTEMS AND METHODS FOR SECURE ACCESS MODULES

Maxim Integrated Products...

1. A secure transaction system comprising:
a secure element;
a first memory coupled to the secure element, the first memory is configured to hold a first secret information;
a terminal configured to couple to the secure element, the terminal comprises a second memory that is configured to hold a
second secret information, wherein the secure element and the terminal communicate over a first cryptographic protocol at
a start-up condition and a second cryptographic protocol at regular operation; and

a battery coupled to the terminal, the battery is configured to provide energy to the second memory.

US Pat. No. 9,151,611

MICRO RATE OF ROTATION SENSOR AND METHOD FOR OPERATING A MICRO RATE OF ROTATION SENSOR

Maxim Integrated Products...

1. A rotation sensor for detecting a plurality of rates of rotation about orthogonal axes (x,y,z), comprising:
a substrate;
a plurality of masses that are displaceable relative to the substrate and disposed in an X-Y plane parallel to the substrate;
a plurality of anchors for coupling the plurality of masses to the substrate;
springs to couple at least some of the plurality of masses to at least one adjacent mass or to at least one anchor;
drive elements for oscillating more than one of the plurality of masses in an X-direction, in order to generate Coriolis forces
when the substrate is deflected;

sensor elements in order to detect deflections of the more than one of the plurality of masses due to the Coriolis forces
generated; and

wherein the plurality of masses include driving masses, X-Y sensor masses. and Z sensor masses, the X-Y sensor masses being
coupled to the driving masses and the Z sensor masses by means of springs, the X-Y sensor masses and the driving masses being
coupled in such a manner that when the driving masses are driven to oscillate in the X-direction, the X-Y sensor masses are
driven to oscillate in an X-Y direction by means of the driving masses.

US Pat. No. 9,413,228

2-PHASE THRESHOLD DETECTOR BASED CIRCUITS

Maxim Integrated Products...

1. A switched-capacitor circuit, comprising:
a threshold detector comprising a first input and a second input, the threshold detector generates a threshold detection signal
when a difference between first and second input signals crosses a predetermined level;

a plurality of capacitors;
a variable current source coupled to the first and second inputs, the variable current source is enabled during a coarse phase
producing a varying amount of current in response to the difference between the first and the second input signals; and

a current source enabled during a fine phase.

US Pat. No. 9,372,351

CIRCUITS FOR ACTIVE EYEWEAR

Maxim Integrated Products...

1. A circuit for 3D active eyewear comprising:
a front-end circuit having a front-end signal input and a front-end signal output, the front end circuit including a common
base input device having an emitter signal input, a base coupled to a first reference voltage, and a collector signal output
and a current mirror having a current mirror input coupled to said collector signal output and having a current mirror output
which is a multiple of said current mirror input;

a receiver stage having a receiver signal input coupled to said front-end signal output and having a receiver signal output;
and

a controller having a controller input coupled to said receiver signal output and having a left lens control signal output
and a right lens control signal output.

US Pat. No. 9,367,119

SYSTEM AND METHOD TO REDUCE POWER CONSUMPTION IN A MULTI-SENSOR ENVIRONMENT

Maxim Integrated Products...

1. A method to reduce sensor power consumption, the method comprising:
receiving sensor data from one or more sensors, the sensor data attributable to a rotational movement;
applying a rules-based criterion to the sensor data to determine whether the sensor data satisfies one or more conditions;
in response to the determination, modulating power consumed by at least one of the sensors by switching between a first mode
of operation and a second mode of operation; and

using a subset of the sensor data to emulate virtual sensor data.

US Pat. No. 9,356,693

OPTICAL ISOLATOR PREVENTIVE MEASURE INDICATOR

Maxim Integrated Products...

1. A system comprising:
a light emitting diode on a first side of electrically isolated circuitry for transmitting a digital optical signal to a second
side of the electrically isolated circuitry;

an optical receiver on the second side of the electrically isolated circuitry for receiving the digital optical signal from
the light emitting diode; and

a sensor coupled with the optical receiver for periodically sampling the intensity of the digital optical signal received
by the optical receiver to determine a health of the link between the light emitting diode and the optical receiver; and a
sigma-delta modulator and an oscillator disposed on the first side of the electrically isolated circuitry and configured to
provide a clock signal to the light emitting diode.

US Pat. No. 9,048,890

TRANSMITTER CIRCUIT WITH INTEGRATED POWER CONTROL

Maxim Integrated Products...

1. A method for controlling a power output of an RF transmitter comprising:
developing a signal source;
applying the signal source to a buffer amplifier to provide an amplified signal;
applying the amplified signal to a gate of a MOSFET having a source coupled to ground and a drain providing a power output
signal; and

controlling a gain of the MOSFET with an analog signal in response to a digital command including a plurality of bits, wherein
the analog signal is a function PAVDD=keqn of the digital command where PAVDD is a D.C. voltage on the drain of the MOSFET, k and q are constants and n is a number of significant bits of the digital command.

US Pat. No. 9,157,740

MICRO-GYROSCOPE FOR DETECTING MOTIONS

Maxim Integrated Products...

1. A micro-gyroscope for detecting motions relative to a Z axis and at least one of an X and Y axis as a multi-dimensional
sensor, comprising:
a substrate;
a plurality of anchors including a central anchor, the plurality of anchors being fixed on the substrate;
a plurality of oscillating sample masses, the plurality of sample masses being disposed uniformly around the central anchor
and driven radially relative to the central anchor;

anchor springs disposed between the anchors and the plurality of oscillating sample masses, the anchor spring attaching the
plurality of oscillating sample masses to the substrate and allowing the plurality of oscillating sample masses to be deflected
both radially in a X-Y plane and out of the X-Y plane;

drive elements, the drive elements oscillating the plurality of oscillating sample masses in the X-Y plane to generate Coriolis
forces when the substrate is rotated;

sensor elements disposed below the plurality of oscillating sample masses, the sensor elements detecting deflections of the
plurality of oscillating sample masses due to the Coriolis forces;

sensor mass disposed on one of the plurality of oscillating sample masses by means of sensor springs, the sensor springs allowing
deflection of the sensor mass within the plane of the plurality of oscillating sample masses and orthogonal to the radial
drive direction of these sample masses; and

an elastic gimbal mount disposed between the central anchor and the anchor springs.

US Pat. No. 9,124,980

SYSTEM AND METHOD FOR OPTIMIZED PLAYBACK OF AUDIO SIGNALS THROUGH HEADPHONES

Maxim Integrated Products...

1. A method for playback of audio signals in a headphone device comprising:
detecting a connection between a headphone device and an electronic playback device;
sending an audio test signal to said headphone device, said audio test signal comprising a plurality of signals having energy
at frequencies between 20 Hz and 20 KHz;

measuring an electrical current and voltage delivered to said headphone device during playback of said audio test signal;
computing an impedance of said headphone device from said measured voltage and said measured electrical current;
comparing said impedance of said headphone device with impedance data from a plurality of previously measured headphone devices;
and

setting gain and equalization settings of said electronic playback device based on the comparison of said impedance of said
headphone device with the impedance data of said plurality of said previously measured headphone devices.

US Pat. No. 9,099,345

ENHANCED WLP FOR SUPERIOR TEMP CYCLING, DROP TEST AND HIGH CURRENT APPLICATIONS

Maxim Integrated Products...

1. A wafer level package (WLP) bump structure comprising:
a copper pillar extending perpendicularly a first distance from a fabricated WLP silicon surface, the copper pillar comprising
pillar sides and a distal portion that is distal from the fabricated WLP silicon surface, the distal portion comprising a
copper surface;

an encapsulant about the pillar sides and substantially covering the fabricated WLP silicon surface, the copper surface being
recessed a first recess distance below an encapsulant outer surface;

a layer of nickel metallurgically bonded to the copper surface, the layer of nickel having a nickel surface that is recessed
a second recess distance below the encapsulant outer surface, the second recess distance less than the first recess distance,
wherein a volume is defined between the nickel surface and the encapsulant outer surface; and

an under ball metallic (UBM) metallurgically bonded to the nickel surface, the UBM comprising a first portion that occupies
the volume between the nickel surface and the encapsulant outer surface and a second portion that extends beyond the encapsulant
outer surface, covers the first portion of the UBM, and overlaps a portion of the encapsulant outer surface; and

a solder ball attached to the second portion of the UBM, the solder ball overlapping an edge of the second portion of the
UBM and contacting the encapsulant outer surface.

US Pat. No. 9,087,779

MULTI-DIE, HIGH CURRENT WAFER LEVEL PACKAGE

Maxim Integrated Products...

5. A wafer-level package device comprising:
an integrated circuit chip having a surface;
a pillar extending from the surface of the integrated circuit chip, the pillar having an end distal from the surface, the
pillar configured to provide an electrical interconnection to the integrated circuit chip;

a first solder contact and a second solder contact disposed upon the distal end of the pillar in a first solder area and a
second solder area, respectively;

an integrated circuit chip device, the integrated circuit chip device being configured upon the surface of the integrated
circuit chip, the integrated circuit chip device having a surface distal from the surface of the integrated circuit chip;
and

an encapsulation structure disposed over the surface of the integrated circuit chip, the encapsulation structure at least
partially enclosing the pillar, the encapsulation structure defining the first solder area and the second solder area, the
first solder area being separated from the second solder area by the encapsulation structure.

US Pat. No. 9,054,584

LOAD DETECTION FOR A LOW POWER MODE IN AN AC-DC ADAPTER

Maxim Integrated Products...

1. An AC-DC adapter comprising: a switch-mode power supply coupled to receive an input AC voltage, the switch-mode power supply
converting the input AC voltage to a DC output voltage that drives a load; a power control loop coupled to the switch-mode
power supply, the power control loop receiving the DC output voltage and providing a power control signal to configure the
switch mode power supply according to a decay rate of the DC output voltage, wherein the power control loop further comprises:
a power mode control circuit that is coupled to the load detector and generates the power control signal, and a load detector
that is coupled to the power mode control and counts a number of clock cycles in a time interval during which the DC output
voltage decays from a high threshold voltage to an intermediate threshold voltage and compare the number of clock cycles with
a predetermined threshold number of clock cycles to determine presence and absence of the load.

US Pat. No. 9,164,560

DAISY CHAIN CONFIGURATION FOR POWER CONVERTERS

MAXIM INTEGRATED PRODUCTS...

1. A system comprising:
a plurality of power supplies that supply power to respective loads;
a serial bus that connects the plurality of power supplies in a daisy chain; and
a controller that is connected to first and last ones of the power supplies by the serial bus, that is connected to a management
bus via a management bus interface, that monitors the plurality of power supplies via the serial bus, and that transmits status
information of the plurality of power supplies to the management bus via the management bus interface of the controller, wherein
the serial bus is different than the management bus, wherein the controller comprises a fault detection module that transmits
a ping signal to the first one of the plurality of power supplies via the serial bus and that determines that one of the plurality
of power supplies is faulty if a response to the ping signal is not received from the last one of the plurality of power supplies
via the serial bus within a time-out period after transmitting the ping signal.

US Pat. No. 9,160,354

MULTI-LO BAND SWITCHED-CORE FREQUENCY MIXER

Maxim Integrated Products...

1. A frequency mixer comprising:
a single field-effect transistor (FET) ring comprising a first mixer core and a second mixer core, the first mixer core and
the second mixer core configured to connect to a radio frequency (RF) port and an intermediate frequency (IF) port;

a first local oscillator (LO) transformer connected to the single FET ring, the first LO transformer configured to furnish
a first LO signal occurring in a first limited range of frequencies to the first mixer core;

a second LO transformer connected to the single FET ring, the second LO transformer configured to furnish a second LO signal
occurring in a second limited range of frequencies to the second mixer core, the first limited range of frequencies different
than the second limited range of frequencies, the single FET ring including a plurality of segments, each one of the plurality
of segments including at least a first transistor and a second transistor, the first transistor defining the first mixer core
and the second transistor defining the second mixer core;

a first LO path for transmitting the first LO signal during a first time interval;
a second LO path for transmitting the second LO signal during a second time interval, wherein the first transistor is connected
to a first LO path and the second transistor is connected to a second LO path; and

LO select circuitry for selectively activating the first LO path during the first time interval and selectively activating
the second LO path during the second time interval,

wherein the first LO signal is configured to cause the first mixer core to commutate a frequency mixer signal during the first
time interval and the second LO signal is configured to cause the second mixer core to commutate the frequency mixer signal
during the second time interval, the second time interval different than the first time interval.

US Pat. No. 9,151,640

METHOD AND APPARATUS FOR SENSING CAPACITANCE VALUE AND CONVERTING IT INTO DIGITAL FORMAT

Maxim Integrated Products...

1. A capacitance sensing device coupled to operate a keyless entry system comprising:
a sensed capacitor;
a signal generator configured to generate a digital local oscillator signal and an excitation signal;
a capacitance-to-amplitude converter coupled to the sensed capacitor and to the signal generator, wherein the capacitance-to-amplitude
converter is configured to convert a measured capacitance received from the sensed capacitor to an AC signal according to
the excitation signal, the AC signal having an amplitude proportional to the measured capacitance;

a demodulator coupled to the capacitance-to-amplitude converter to receive the AC signal and to the signal generator to receive
the digital local oscillator signal, wherein the demodulator is configured to output a DC component proportional to the AC
signal and to output an AC component; and

an analog-to-digital converter coupled to the output of the demodulator, wherein the analog-to-digital converter is configured
to output a digital conversion value proportional to the DC component, which is proportional to the measured capacitance,
wherein the keyless entry system is coupled to receive the digital conversion value.

US Pat. No. 9,136,756

SYSTEM AND METHODS FOR TWO-STAGE BUCK BOOST CONVERTERS WITH FAST TRANSIENT RESPONSE

Maxim Integrated Products...

1. A switching regulator to convert an input voltage into an output voltage, the switching regulator comprising:
a first switching stage coupled to a first output voltage node, the first switching stage receives a first input voltage to
convert it into a first output voltage that is relatively lower than the first input voltage;

a second switching stage coupled to the first output voltage node, the second switching stage receives the first output voltage
and converts the first output voltage to a second output voltage at a second output voltage node, the second output voltage
is relatively higher than the first output voltage;

first and second charge storage devices coupled to the first output voltage node;
and
a first flying capacitor that is coupled in parallel with the first charge storage device during a charging phase and in parallel
with the second charge storage device during a charge transfer phase.

US Pat. No. 9,136,864

METHOD FOR TRIMMING SEGMENT CURRENTS IN CURRENT STEERING DAC BASED ON MOST BACK GATE VOLTAGE MODULATION

MAXIM INTEGRATED PRODUCTS...

1. A digital-to-analog converter (DAC) system comprising:
a DAC including a plurality of segments and a plurality of drivers, wherein each of the plurality of segments
receives driver signals from a respective one of the plurality of drivers,
receives a segment current generated by a respective one of a plurality of segment current sources, and
generates an output current based on the driver signals and the segment currents; and
a current trimming module that stores a plurality of trim coefficients and adjusts respective threshold voltages associated
with the plurality of segment current sources based on the plurality of trim coefficients.

US Pat. No. 9,513,644

ENERGY EFFICIENT SYSTEMS HAVING LINEAR REGULATORS AND METHODS OF OPERATING THE SAME

Maxim Integrated Products...

1. A system having an enhanced power consumption mechanism, comprising:
a regulator responsive to an input voltage and operative to output a regulated voltage;
a first circuit coupled to the regulator and configured to operate at a first voltage difference between the regulated voltage
and a ground level;

a second circuit; and
a monitor that compares the input voltage to a reference voltage, causes the regulator to apply the first voltage difference
across the first circuit and the second circuit if the input voltage is lower than the reference voltage and causes the regulator
to apply the first voltage difference across the first circuit and applies a second voltage difference across the second circuit
to operate the second circuit at the second voltage difference across the second circuit if the input voltage is higher than
or equal to the reference voltage, the second voltage difference being a difference between the input voltage and the regulated
voltage.

US Pat. No. 9,374,000

CONTROLLING DC-TO-DC CONVERTER DUTY CYCLE BY SHIFTING PWM RAMP

Maxim Integrated Products...

1. A system comprising:
a pulse width modulator that receives a saw-tooth signal and that generates pulse width modulated pulses based on the saw-tooth
signal to regulate an output voltage of a DC-to-DC converter; and

a shift generator that generates a DC voltage that is different than the saw-tooth signal based on the saw-tooth signal and
a change in an input voltage of the DC-to-DC converter and that shifts a DC level of the saw-tooth signal by the DC voltage
to regulate the output voltage of the DC-to-DC converter.

US Pat. No. 9,369,127

METHOD AND APPARATUS FOR GENERATING PIEZOELECTRIC TRANSDUCER EXCITATION WAVEFORMS USING A BOOST CONVERTER

Maxim Integrated Products...

1. A method of deforming a material comprising:
dynamically adjusting a peak charging current to adjust an energy transfer rate of a DC-to-DC step up converter;
applying according to a predetermined pattern a controlled charge to the deformable material; and
providing an increasing energy transfer rate to reduce a voltage step size so as to adjust a waveform according to the predetermined
pattern.

US Pat. No. 9,354,111

WAFER LEVEL LENS IN PACKAGE

Maxim Integrated Products...

1. A wafer level optical device, comprising:
a substrate;
an electronic device disposed on the substrate, the electronic device comprising an integrated circuit chip;
an illumination source disposed on the electronic device;
an enclosure disposed on the substrate, the enclosure including at least one optical surface, where the enclosure covers the
electronic device and the illumination source; and

at least one solder ball disposed on a side of the substrate distal from the electronic device.

US Pat. No. 9,348,382

METHOD AND APPARATUS FOR PROVIDING POWER TO AN ELECTRONIC DEVICE

Maxim Integrated Products...

10. An apparatus for providing power to an electronic device comprising:
a bus having a power line, a ground line and at least one data communication line;
a variable voltage converter having a power input and a direct current (DC) output selectively coupled to the power line of
the bus by a switch, the variable voltage converter having a voltage control signal input, whereby the variable voltage converter
can provide a plurality of voltage levels at the DC output;

logic coupled to the switch and to the at least one data communication line and having a voltage control signal output developed
in response to data communication with an electronic device by:

(a) emulating a personal computer (PC) host system;
(b) retrieving at least one descriptor from the electronic device;
(c) identifying a maximum voltage level to be provided to the electronic device from the at least one descriptor; and
(d) developing the voltage control signal to set the DC output to the maximum voltage level; and
a galvanic isolator coupling the voltage control signal output of the logic to the voltage control signal input of the variable
voltage converter.

US Pat. No. 9,135,551

INDUCTIVE ANTENNA COUPLING

Maxim Integrated Products...

1. A method for radio frequency communication between two substrates comprising:
arranging a first substrate supporting a radio frequency circuit, that is one of a plurality of radio frequency circuits,
and a first substrate inductor, that is one of a plurality of first substrate inductors, in proximity with a second substrate
supporting an antenna and a second substrate inductor such that there is a transformer magnetic coupling between the first
substrate inductor and the second substrate inductor;

exchanging signals between the radio frequency circuit and the antenna by magnetic transformer coupling between the first
substrate inductor and the second substrate inductor; and

coupling any of the plurality of first substrate inductors to any of the plurality of radio frequency circuits.

US Pat. No. 9,103,850

MICROMECHANICAL SENSOR WITH MULTIPLE SPRING BARS

Maxim Integrated Products...

1. A micromechanical sensor, comprising:
a substrate;
an anchor coupled to the substrate;
a bending spring device responsive to a rotational movement about the anchor, the bending spring device comprising spring
bars that extend substantially parallel from the anchor to one or more masses, wherein each spring bar comprises:

a first end being coupled to the anchor; and
a second end being coupled to the one or more masses; and
a meander located between the first and the second end, wherein a total length of at least one spring bar is greater than
a length of bars of the meander so as to improve a linear spring characteristic of the bending spring device.

US Pat. No. 9,330,624

VCOM AMPLIFIER WITH FAST-SWITCHING GAIN

Maxim Integrated Products...

1. A method of driving a display that uses a common voltage, the method comprising:
alternately adjusting a common voltage amplifier output between a first gain during a first portion of a first half period,
thereby driving the common voltage amplifier output to or near the value of a first power supply rail voltage and a second
gain during a second portion of the first half period,

wherein the common voltage amplifier output settles to a predetermined common voltage at an end of the first half period,
driving the common voltage amplifier output during a first portion of a second half period to or near the value of a second
power supply rail voltage according to the first gain so as to reduce a voltage drop from the respective power supply rail
to the output voltage across an output stage of the common voltage amplifier, and driving the common voltage amplifier according
the second gain during a second portion of the second half period, wherein the common voltage amplifier output settles to
a predetermined common voltage at an end of the second half period, wherein the second gain is less than the first gain.

US Pat. No. 9,055,633

LOAD COMPENSATION FOR AN ELECTRONIC TRANSFORMER IN A LED ILLUMINATION SYSTEM

Maxim Integrated Products...

1. A light emitting diode (LED) illumination system that provides a LED current to drive a LED, comprising:
(1) an electronic transformer converting a first AC supply to a second AC supply that is contained within a signal envelope,
wherein the frequency of the signal envelope is substantially equal to that of the first AC supply; and

(2) a LED driver and current regulator, coupled between the electronic transformer and the LED, the LED driver and current
regulator generating a LED current contained in a square-shape LED current envelope from the second AC supply and further
comprising:

(a) a bridge rectifier, coupled to the electronic transformer, the bridge rectifier providing full-wave rectification to the
second AC supply; and

(b) a load compensation circuitry, coupled to the bridge rectifier, the load compensation circuitry sensing the rectified
second AC supply and compensating the load of the electronic transformer by adjusting a slew rate of at least one of leading
and trailing edges of the square-shape LED current envelope.

US Pat. No. 9,397,027

SACRIFICIAL PAD ON SEMICONDUCTOR PACKAGE DEVICE AND METHOD

Maxim Integrated Products...

1. A semiconductor package device, comprising:
a lead frame substrate including at least one lead frame contact pad and at least one sacrificial contact pad that is electrically
nonconductive;

an integrated circuit device electrically coupled to the lead frame substrate; and
an encapsulation layer that encapsulates the lead frame substrate and the integrated circuit device.

US Pat. No. 9,134,128

METHOD FOR DETECTING ACCELERATIONS AND ROTATION RATES, AND MEMS SENSOR

Maxim Integrated Products...

1. A micro-electro-mechanical-system (MEMS) sensor for detecting accelerations along and rotational movements about at least
one of three mutually perpendicular spatial axes, x, y, and z, comprising:
a substrate arranged in an x-y plane;
at least one driving mass adapted to oscillate in a plane parallel to the substrate and driven in a linear motion along the
x-axis;

at least one sensing mass connected to the least one driving mass via connecting springs, wherein the connecting springs bend
to move the at least one sensing mass in a linear motion relative to the at least one driving mass during operation;

at least one anchor secured to the substrate and at least one anchor spring connected to the at least one driving mass or
the at least one sensing mass;

sensing elements for sensing acceleration, rotation, or both of the MEMS sensor; and
drive elements for driving the at least one driving mass relative to the at least one sensing mass at a driving frequency,
wherein the at least one driving mass is adapted to generate an imbalance of the at least one driving mass and the at least
one sensing mass with respect to the at least one anchor during operation.

US Pat. No. 9,077,527

FULL-DUPLEX DIFFERENTIAL SERIAL LINK INTERFACE FOR DATA TRANSFERRING

Maxim Integrated Products...

1. An apparatus for transferring data using a communication link, comprising:
a first link interface adapted to generate a forward channel differential signal including high speed serial data for transmission
via the communications link; and

a second link interface adapted to differentially modulate the forward channel differential signal by relatively low speed
serial data for transmission in a reverse channel via the communications link, voltage levels of the forward channel differential
signal being modulated according to voltage levels of the relatively low speed serial data.

US Pat. No. 9,459,833

SYSTEM AND METHOD WITH SPECIFIC ORDERED EXECUTION OVER PHYSICAL ELEMENTS

Maxim Integrated Products...

1. A number generator, comprising:
a plurality of physical elements in which every two physical elements are associated with an inherent difference due to non-uniformity
and imprecision of a manufacturing process;

an integrator, coupled to the plurality of physical elements, the integrator uses a selection circuit to select two sets of
physical elements from the plurality of physical elements, amplifying over time a difference between the two selected sets
of physical elements and generating a first integrated difference signal; and

a comparison-decision logic, coupled to the integrator, the comparison-decision logic determining whether the difference between
the two selected sets of physical elements is associated with a first bit of “1” or “0”.

US Pat. No. 9,449,264

EMBEDDED RADIO FREQUENCY IDENTIFICATION (RFID) PACKAGE

Maxim Integrated Products...

1. A radio frequency identification (RFID) device comprising:
an integrated circuit (IC) die electrically connected to a radio frequency (RF) antenna winding for transmitting electronically
stored information via the RF antenna winding;

a first core comprising a first layer of the RF antenna winding, the first core defining a cavity for retaining the IC die;
and

a second core comprising a second layer of the RF antenna winding, the second core directly laminated to the first core so
that the RF antenna winding is routed through the first core and the second core.

US Pat. No. 9,129,710

DYNAMIC TRIM METHOD FOR NON VOLATILE MEMORY PRODUCTS

Maxim Integrated Products...

1. A memory device comprising:
a. a plurality of memory cells,
b. a set of dynamically determined margin levels, wherein the memory device is configured to communicate at least a portion
of the set of margin levels to a controller.

US Pat. No. 9,531,535

SECURE MEMORIES USING UNIQUE IDENTIFICATION ELEMENTS

Maxim Integrated Products...

1. A memory device of a computing system comprising:
a plurality of memory cells;
a unique identification element having a unique and repeatable identification value associated with a physical characteristic
derived physical differences originating from semiconductor processing of the memory device itself;

an address decoder coupled to the plurality of memory cells, the address decoder having a plurality of word lines mapped to
the plurality of memory cells according to a memory map derived at least partially from the unique identification value, wherein
a specific address mapping of the memory device is determined based upon the unique identification value associated with the
unique physical characteristic of the memory device located within the computing system; and

read/write circuitry coupled to the plurality of memory cells, the read/write circuitry having a plurality of bit lines mapped
to the plurality of memory cells.

US Pat. No. 9,470,726

TEMPERATURE COMPENSATED REAL-TIME CLOCK

Maxim Integrated Products...

1. A method of real-time clock compensation comprising:
measuring a temperature with a temperature sensor;
detecting a temperature dependent frequency from an oscillator;
inputting the temperature and determining a temperature estimate for the oscillator with an infinite impulse response filter,
and determining the temperature estimate includes performing a transfer function with the infinite impulse response filter
for the temperature estimate as a function of the temperature and treating the oscillator as a first thermal mass on a first
thermal gradient and treating the temperature sensor as a second thermal mass on a second thermal gradient; and

determining a compensation factor, for the oscillator.

US Pat. No. 9,435,910

LIGHT SENSING DEVICE FOR DETECTING GESTURES HAVING A CASING WITH A LENS RECEIVING APERTURE DISPOSED IMMEDIATELY ADJACENT TO A DISPLAY SCREEN

Maxim Integrated Products...

1. A light sensing device comprising:
a substrate having a surface;
a photodetector disposed over the surface of the substrate, the photodetector configured to detect light and to provide a
signal in response thereto;

an optical baffle extending from the surface to a display screen, the optical baffle configured to at least substantially
prevent transmission of optical crosstalk to the photodetector;

a casing having an exterior surface and an interior surface, the casing at least partially disposed over the substrate and
the photodetector, the casing defining a lens receiving aperture, the lens receiving aperture positioned over the photodetector;
and

a lens having an exterior surface co-planar with the exterior surface of the casing and an interior surface extending beyond
a plane defined by the interior surface of the casing, the lens disposed within the lens receiving aperture, the lens configured
to focus light incident upon the lens and to pass the focused light to the photodetector.

US Pat. No. 9,412,927

FORMATION OF A THERMOPILE SENSOR UTILIZING CMOS FABRICATION TECHNIQUES

Maxim Integrated Products...

1. A process comprising:
forming a thermopile sensor proximate to a semiconductor wafer, the thermopile sensor comprising at least a first thermocouple
material and a second thermocouple material; and

forming an absorption stack proximate to the semiconductor wafer, the absorption stack comprising a first planar layer having
at least one of an absorption characteristic or a reflective characteristic, a second planar layer having a wave phase shift
characteristic, the second planar layer different from the first planar layer, and a third planar layer having a reflective
characteristic, the third planar layer different from the first planar layer and the second planar layer, the first planar
layer, the second planar layer, and the third planar layer arranged in a stacked configuration, wherein the absorption stack
is horizontally offset with respect to the thermopile sensor.

US Pat. No. 9,342,054

APPARATUS AND METHOD OF KEEPING TIME OF DAY OVER AN INDUSTRIAL TEMPERATURE RANGE

Maxim Integrated Products...

1. A method of generating accurate time of day in a low power SLEEP mode, comprising the steps of:
generating a first clock and a second clock, both the frequency and the accuracy of the first clock being higher than that
of the second clock, while the first clock is associated with larger power consumption than the second clock;

setting an initial value for an accumulating number that is used to track the cycles of the first clock;
during a plurality of consecutive second clock cycles, adding a cycle number to the accumulating number in each of the plurality
of consecutive second clock cycles and enabling the first clock to compensate the accumulating number at an update frequency,
the cycle number being associated with the number of cycles of the first clock within a cycle of the second clock; and

increasing the time of day by an interval of time when the accumulating number reaches a predetermined target number representative
of a number of cycles.

US Pat. No. 9,154,036

SYSTEMS AND METHODS TO CONTROL DC/DC MULTIPHASE SWITCHING REGULATORS

Maxim Integrated Products...

1. A multiphase switching regulator comprising:
a phase multiplexer coupled to receive both an error signal and a phase selector signal, the phase multiplexer is configured
to output a multiplexed error signal;

a set of on time timers to generate a plurality of pulse signals in response to receiving the multiplexed error signal, each
pulse signal comprising an on time;

a pulse generator coupled to receive the plurality of pulse signals, the pulse generator generates a first sequence of pulse
signals;

a pulse stretcher to generate a second sequence of pulse signals from the first sequence of pulse signals; and
a phase selector coupled to receive the second sequence of pulse signals to generate the phase selector signal.

US Pat. No. 9,625,514

ELECTRICAL TRANSFORMER OPEN AND SHORT DETECTOR

Maxim Integrated Products...

15. A circuit comprising:
a transformer configured to provide an input signal, the input signal comprising an input signal amplitude characteristic
and an input signal frequency characteristic;

a pulse generator electrically configured to generate a pulse signal, the pulse signal comprising a pulse signal amplitude
characteristic and a pulse signal frequency characteristic;

a clamp device electrically connected to the transformer and the pulse generator, the clamp device configured to modify the
input signal amplitude characteristic of the input signal and a pulse signal amplitude characteristic of the pulse signal
to generate a clamp signal;

an amplifier electrically connected to the clamp device, the amplifier configure to amplify the clamp signal to generate an
amplified clamp signal;

a filter electrically connected to the amplifier, the filter configured to filter the amplified clamp signal to generate a
filtered amplified clamp signal;

an analog-to-digital converter electrically connected to the filter, the analog-to-digital converter configured to receive
the filtered amplified clamp signal, the filtered amplified clamp signal comprising the input signal and the pulse signal,
the analog-to-digital converter configured to convert the combined signal to a digital representation of the filtered amplified
clamp signal;

a first digital filter electrically connected to the analog-to-digital converter, the first digital filter configured to reconstruct
the amplitude characteristic of input signal based upon the digital representation of the filtered amplified clamp signal;

a second digital filter electrically connected to the analog-to-digital converter, the second digital filter configured to
reconstruct the pulse signal based upon the digital representation of the filtered amplified clamp signal; and

a controller electrically connected to the first digital filter and the second digital filter, the controller configured to
indicate at least one of a short or an open associated with the transformer based upon a value of the reconstructed pulse
signal.

US Pat. No. 9,507,433

SYSTEM AND METHOD FOR DISCERNING COMPLEX GESTURES USING AN ARRAY OF OPTICAL SENSORS

Maxim Integrated Products...

1. A method for gesture determination via an electronic system, the method comprising:
detecting a plurality of sub-gestures via a plurality of sensors of the electronic system;
when a first sub-gesture included in the plurality of sub-gestures is detected, commencing a data frame for the system, the
data frame having a pre-determined, finite duration;

generating a plurality of signals via the plurality of sensors, the plurality of signals being based on the plurality of sub-gestures;
transmitting the plurality of signals via the plurality of sensors to a processor of the system;
processing the plurality of signals via the processor to obtain sub-gesture data associated with the plurality of sub-gestures;
and

analyzing the sub-gesture data associated with the plurality of sub-gestures via the processor to determine if the plurality
of sub-gestures collectively constitute a gesture,

wherein analyzing the sub-gesture data is performed after the data frame expires by analyzing the sub-gesture data corresponding
to: the first sub-gesture and to sub-gestures detected during the data frame.

US Pat. No. 9,444,338

SYSTEMS AND METHODS TO CALIBRATE SWITCHING REGULATORS

Maxim Integrated Products...

1. A switching regulator comprising:
a pulse generator to generate a first ramp voltage that ramps to a first predetermined voltage within a ramp time in a calibration
phase; and

a slope compensation circuit coupled to the pulse generator, the slope compensation circuit calibrates a slope of a second
ramp voltage to reach within the ramp time a peak voltage that is maintained during regular operation, the ramp time being
equal to the switching period of the switching regulator.

US Pat. No. 9,385,679

STAGGERED Y TOPOLOGY FOR MULTIBAND LIMITER

Maxim Integrated Products...

1. A multiband limiter with Staggered-Y topology comprising:
a band splitter having a signal input and a plurality of bands, wherein the plurality of bands is n?2;
a first band limiter having an input coupled to a first band of the band splitter;
a first summer having a first input coupled to an output of the first band limiter and a second input coupled to a second
band of the band splitter, wherein the second input of the first summer is coupled to the second band of the band splitter
by a second band limiter and wherein the number of summers is n?1;

a first summer limiter having an input coupled to an output of the first summer;
a second summer having a first input coupled to an output of the first summer limiter and a second input coupled to a third
band of the band splitter by a third band limiter; and

a second summer limiter having an input coupled to an output of the second summer.

US Pat. No. 9,209,091

INTEGRATED MONOLITHIC GALVANIC ISOLATOR

Maxim Integrated Products...

1. A semiconductor device comprising:
a first electrical circuit formed on a semiconductor on insulator wafer, the semiconductor on insulator wafer having a layer
of semiconducting material formed over a buried layer of insulating material formed over a supporting layer of material;

a second electrical circuit formed on the semiconductor on insulator wafer; and
a wide deep trench more than two micrometers (2 ?m) wide formed in the semiconductor on insulator wafer to galvanically isolate
the first electrical circuit from the second electrical circuit, where the first electrical circuit and the second electrical
circuit are coupled together for exchanging energy between the galvanically isolated electrical circuits,

wherein the supporting layer of material comprises a handle wafer substrate, and the semiconductor on insulator wafer is formed
with a cavity of insulating material within the handle wafer substrate below at least one of the first electrical circuit
or the second electrical circuit for further isolating the first electrical circuit from the second electrical circuit.

US Pat. No. 9,343,426

USE OF DEVICE ASSEMBLY FOR A GENERALIZATION OF THREE-DIMENSIONAL METAL INTERCONNECT TECHNOLOGIES

Maxim Integrated Products...

1. A method of assembly comprising:
assembling a plurality of singulated first die onto a carrier substrate;
fabricating a plurality of second die on a first side of a second substrate;
assembling a plurality of singulated third die onto a second side of the second substrate;
stacking the second substrate and the carrier substrate such that the plurality of second die are facing the plurality of
first die, wherein the first side of the second substrate and a first side of the carrier substrate face each other such that
active circuitry of the plurality of first die faces active circuitry of the plurality of second die;

bonding the plurality of first die directly to the plurality of second die such that at least one second die is operatively
bonded to a respective first die to furnish an electrical interconnect between the at least one second die and the respective
first die and third die;

forming vias through the second substrate to establish electrical interconnects between the first, second, and third die such
that the at least one second die and the respective first die are both electrically connected to a respective third die, wherein
at least one of the vias is formed through the at least one second die;

removing the carrier substrate, thereby leaving the plurality of first die exposed; and;
after removing the carrier substrate, adding a cap structure over the plurality of first die and coupling the cap structure
to the second substrate such that a surface opposite an active circuit portion of each of the plurality of first die is facing
the cap structure, wherein the cap structure includes a plurality of cavities, each cavity aligned with a corresponding one
first die and having a shape and a size that matches the corresponding one first die.

US Pat. No. 9,322,756

NONDISPERSIVE INFRARED MICRO-OPTICS SENSOR FOR BLOOD ALCOHOL CONCENTRATION MEASUREMENTS

Maxim Integrated Products...

1. A mobile micro-optics sensor package for blood alcohol concentration measurements, comprising:
a package substrate having an output region, an input region, and a baffle positioned between the output region and the input
region;

a light source coupled to the package substrate and configured to generate light having a plurality of wavelengths, at least
one of the plurality of wavelengths corresponding to a peak spectral absorption of ethanol and water, and at least one of
the plurality of wavelengths corresponding to a peak spectral absorption of water, the light source configured to direct the
light from the light source through the output region;

a photodetector coupled to the package substrate and configured to receive at least a portion of the light having the plurality
of wavelengths through the input region and to generate one or more alternating current signal outputs in response thereto;
and

control circuitry coupled to the light source and the photodetector, the control circuitry configured to detect and calibrate
the one or more alternating current signal outputs from the photodetector to determine a blood alcohol concentration based
on spectral data associated with the wavelengths corresponding to a peak spectral absorption of ethanol and water and with
the wavelengths corresponding to a peak spectral absorption of water and based on a detected change in reflectance range of
the one or more alternating current signal outputs between a first reflectance range at a first time period and a second reflectance
range at a second time period.

US Pat. No. 9,153,666

LDMOS WITH CORRUGATED DRIFT REGION

Maxim Integrated Products...

1. A process comprising:
forming an extended drain region of a first conductivity type in a substrate;
forming a plurality of trench regions in the extended drain region;
forming a RESURF region in the extended drain region;
forming a gate over a surface of the substrate; and
forming a source region of the first conductivity type and a drain region of the first conductivity type in the substrate
so that the gate is position between the source region and the drain region, the drain region formed in the extended drain
region,

wherein the plurality of trench regions disposed between the drain region and the source region, wherein the RESURF region
disposed under the plurality of trench regions with respect to the surface of the substrate.

US Pat. No. 9,196,681

METAL OXIDE SEMICONDUCTOR FIELD EFFECT TRANSISTOR WITH REDUCED SURFACE FIELD FOLDING

MAXIM INTEGRATED PRODUCTS...

1. A laterally diffused metal oxide semiconductor field effect transistor (LDMOSFET) comprising:
a first source contact region, a first gate contact region, and a drain contact region;
an n-type buried layer;
a first p-type body region formed in an n-type epitaxial layer, the first p-type body region directly contacting the first
source contact region and extending past a first end of the first source contact region toward the drain contact region;

a first p-type reduced surface field (PRSF) region formed in the n-type epitaxial layer, the first PRSF region disposed between
the first p-type body region and the n-type buried layer;

an n-type drain drift region formed in the n-type epitaxial layer, the n-type drain drift region directly contacting the drain
contact region;

a first n-type drift region formed in the n-type epitaxial layer, the first n-type drift region directly contacting a first
portion of the n-type drain drift region,

wherein the first PRSF region is further disposed between the first n-type drift region and the n-type buried layer;
a second source contact region and a second gate contact region;
a second p-type body region formed in the n-type epitaxial layer, the second p-type body region directly contacting the second
source contact region and extending past a second end of the second source contact region toward the drain contact region;

a second PRSF region formed in the n-type epitaxial layer, the second PRSF region disposed between the second p-type body
region and the n-type buried layer;

a second n-type drift region formed in the n-type epitaxial layer, the second s-type drift region directly contacting a second
portion of the n-type drain drift region,

wherein the second PRSF region is further disposed between the second n-type drift region and the n-type buried layer; and
an n-type diffusion region in the n-type epitaxial layer, the n-type diffusion region electrically connecting the n-type buried
layer with the first n-type drift region, the second n-type drift region, and the n-type drain drift region between the first
and second PRSF regions.

US Pat. No. 9,195,252

METHOD AND APPARATUS FOR CURRENT SENSING AND MEASUREMENT

Maxim Integrated Products...

1. A current sensing and measurement apparatus comprising:
a first current mirror having an input terminal, a high current output terminal, and a mirrored current output terminal;
a second current mirror having an input terminal, a high current output terminal, and a mirrored current output terminal,
wherein the mirrored current output terminal of the first current mirror is connected to the input terminal of the second
current mirror;

a first voltage control system, the first voltage control system operative to hold the high current output terminal of the
first current mirror at a first bias voltage;

a second voltage control system, the second voltage control system operative to hold the high current output terminal of the
second current mirror at a second bias voltage, the first bias voltage being greater than the second bias voltage;

a third voltage control system, the third voltage control system operative to hold a voltage potential of the high current
output terminal of the first current mirror approximately equal to a voltage potential of the mirror current output terminal
of the first current mirror; and

a fourth voltage control system, the fourth voltage control operative to hold a voltage potential of the high current output
terminal of the second current mirror approximately equal to a voltage potential of the mirror current output terminal of
the second current mirror.

US Pat. No. 9,560,705

MAGNETIC AMPLIFIER ASSISTED LED CONSTANT CURRENT SINK OVERHEAD VOLTAGE REGULATION

Maxim Integrated Products...

1. A power circuit comprising:
a power conversion module including a transformer, a primary winding of the transformer coupled to a power source;
a magnetic amplifier coupled to a secondary winding of the transformer, wherein the magnetic amplifier comprises a saturable
magnetic core and two or more windings around at least a portion of the core;

a light emitting diode string coupled to an output of the magnetic amplifier by a rectifier circuit, wherein the light emitting
diode string includes a plurality of light emitting diodes coupled in series;

a reset current source coupled to the output of the magnetic amplifier;
a current sink coupled to an output of the light emitting diode string; and
a control circuit coupled to the reset current source, the light emitting diode string, and to the current sink;
wherein the magnetic amplifier comprises a first winding configured to transmit power to the light emitting diode string and
a second winding configured to receive a reset current from the reset current source.

US Pat. No. 9,485,094

SYSTEMS AND METHODS FOR STABLE PHYSICALLY UNCLONABLE FUNCTIONS

Maxim Integrated Products...

1. An apparatus to generate stable PUF key bits, the apparatus comprising:
a sensing element configured to detect mismatches in physical characteristics between PUF elements and output signals associated
with the mismatches;

a data converter coupled to the sense element, the data converter converts the output signals into mismatch data having a
first distribution;

a selection circuit coupled to receive the mismatch data from the data converter, the selection circuit generates a second
distribution comprising paired data in a manner such that the difference within a pair is equal to or exceeds a predetermined
value; and

a sequence generator that generates a bit sequence associated with the paired data.

US Pat. No. 9,424,218

SAS EXPANDER WITH NON-BLOCKING VIRTUAL PHY ARCHITECTURE

Maxim Integrated Products...

1. A SAS expander comprising:
a switch core operative to detect whether a new connection request is in conflict with an existing connection request and
for determining if there is a free destination phy not operationally used for an origination of a connection request;

a plurality of SAS expander phys coupled to the switch core;
a Serial Management Protocol (SMP) originator coupled to the switch core, the SMP originator being configured to only originate
connection requests;

an SMP receptor coupled to the switch core, the SMP receptor being configured to only receive connection request; and
a microcontroller coupled to non-transient digital storage media storing code segments including
(a) code segments determining if there is a free SMP receptor; and
(b) code segments which disable BACKOFF REVERSE PATH for the free SMP receptor if the connection request came from a virtual
phy.

US Pat. No. 9,250,262

METHOD AND APPARATUS FOR AN INTEGRATED ISOLATION MECHANICAL FILTER WITH SUBSTRATE BASED PACKAGE

Maxim Integrated Products...

9. An apparatus for mechanical isolation comprising:
a microelectromechanical systems device;
a wafer attached to the microelectromechanical systems device, a portion of the wafer being removed to form a trench that
surrounds the microelectromechanical systems device and acts as a mechanical filer that isolates mechanical stress;

a lead frame attached to the wafer and having a cavity formed at least partially beneath the wafer, the trench and cavity
forming an integral empty space; and

a cap wafer disposed over the microelectromechanical systems device.

US Pat. No. 9,521,405

RECEIVER AUTOMATIC GAIN CONTROL (AGC) AND SLICER

Maxim Integrated Products...

1. A system comprising:
an Automatic Gain Control (AGC) module configured to automatically adjust the gain of a receiver, the receiver configured
to receive a signal from a transmitter, the signal comprising a plurality of commands having a characteristic command length
and a characteristic command interval, the command length having a substantially shorter duration than the command interval;
and

a command processor communicatively coupled with the AGC module, the command processor configured to receive and interpret
the plurality of commands to determine ends of the plurality of commands, the command processor configured to provide a notification
to the AGC module associated with the ends of the plurality of commands, the AGC module configured to adjust the gain of the
receiver when the notification is received from the command processor.

US Pat. No. 9,510,101

DIRECT MEASUREMENT OF AN INPUT SIGNAL TO A LOUDSPEAKER TO DETERMINE AND LIMIT A TEMPERATURE OF A VOICE COIL OF THE LOUDSPEAKER

Maxim Integrated Products...

1. A system for providing temperature limiting for a voice coil of a speaker, comprising:
an amplifier connected to the speaker, the amplifier configured for receiving an amplifier input signal, generating an amplifier
output signal based upon the amplifier input signal and transmitting the amplifier output signal to the speaker;

a sensing circuit connected to the amplifier, the sensing circuit configured for measuring a voltage and a current of the
amplifier output signal and providing an output signal including a measured voltage and a measured current;

a resistance estimator module including a processor, the resistance estimator module connected to the sensing circuit, the
resistance estimator module configured for receiving the measured current and the measured voltage, calculating an estimated
resistance of the voice coil based upon the measured voltage and the measured current by dividing a root mean square value
of the measured voltage and the measured current, and providing an output including the estimated resistance; and

a temperature estimator module connected to the resistance estimator module, the temperature estimator module being configured
for receiving the resistance estimator module output and calculating a temperature of the voice coil based upon the estimated
resistance,

wherein the amplifier input signal is attenuated based upon a comparison of the calculated temperature of the voice coil against
a pre-determined threshold temperature of the voice coil.

US Pat. No. 9,450,074

LDMOS WITH FIELD PLATE CONNECTED TO GATE

Maxim Integrated Products...

1. A semiconductor device comprising:
a substrate comprising a bulk substrate of a second conductivity type and having a source region of a first conductivity type
and a drain region of the first conductivity type formed proximate to a surface of the substrate,

a gate, having a gate length ranging from 5 micrometers to 20 micrometers, positioned over the surface of the substrate and
between the source region and the drain region;

an epitaxial region of the first conductivity type having a doping profile ranging from 3e14/cm3 to 3e18/cm3;

a well region of the second conductivity type disposed within the epitaxial region,
wherein the source region is disposed within the well region;
a local oxidation of silicon (LOCOS) region formed between the source region and the drain region;
an extended drain region of the first conductivity type having the drain region formed therein, the extended drain region
at least partially extending below the LOCOS region and has a doping profile ranging from 1e15/cm3 to 8e18/cm3;

a field plate, having a field plate length in a range from 5 micrometers to 50 micrometers, at least partially positioned
over and connected to the gate, wherein the gate and the field plate at least partially extend over the LOCOS region and the
field plate is configured to shape the electrical field occurring under the LOCOS region and between the source region and
the drain region,

a plurality of source contacts electrically connected to the source region and comprising, in a plan view, a first row of
source contacts positioned along and near one side of the gate and a second row of source contacts positioned along and near
another side of the gate,

a plurality of drain contacts electrically connected to the drain region, the plurality of drain contacts comprising, in a
plan view, a first row of drain contacts and a second row of drain contacts, each drain contact of the first row of drain
contacts having a corresponding drain contact of the second row of drain contacts immediately adjacent thereto;

a plurality of gate contacts electrically connected to the gate and comprising, in a plan view, one row of gate contacts disposed
near one side of the gate and another row of gate contacts disposed near another side of the gate, wherein

the rows of the plurality of source contacts, the rows of the plurality of drain contacts, and the rows of the plurality of
gate contacts are arranged parallel to each other in a plan view.

US Pat. No. 9,112,798

POWER LINE COMMUNICATION DEVICE WITH CHANNEL LOAD MEASUREMENT AND IMPROVED CHANNEL ACCESS

MAXIM INTEGRATED PRODUCTS...

1. A power line communication (PLC) device, comprising:
a physical layer module including a transceiver configured to transmit and receive data over a power line;
a medium access control (MAC) module configured to send data to and process data from the physical layer module,
wherein the MAC module includes a channel access module configured to:
initiate a channel access attempt;
successively increase a random backoff period for a subsequent channel access attempt based on a random backoff function in
response to a determination by the physical layer module that a PLC channel is busy during a preceding one of the channel
access attempts; and

selectively reset a variable in the random backoff function based on an output of a modulo function of a number of backoff
attempts and a predetermined number.

US Pat. No. 9,077,356

MDAC WITH DIFFERENTIAL CURRENT CANCELLATION

Maxim Integrated Products...

1. An MDAC to generate a residue signal, the MDAC comprising:
a first voltage node and a second voltage node;
a residue amplifier that induces a node current flowing into at least one of the first voltage node and second voltage node;
and

at least one compensating current source coupled to at least one of the first voltage node and second voltage node to provide
a compensating current that at least partially cancels the node current.

US Pat. No. 9,368,466

BUMP I/O CONTACT FOR SEMICONDUCTOR DEVICE

Maxim Integrated Products...

1. A bump contact comprising:
an electrically conductive pillar constructed on a conductor that is located on a substrate, the conductive pillar having
first and second ends, the first end of the pillar being in direct contact with a contact pad of a semiconductor device, the
pillar projecting outwardly from the substrate;

a solder crown having first and second extreme ends, the solder crown being positioned in axial alignment with the pillar
with the first end of the solder crown facing the second end of the pillar, the solder crown being reflowable at a predetermined
temperature into effecting electrical contact and mechanical attachment by the second end thereof with the conductor on the
substrate; and

a diffusion barrier electrically and mechanically joining the first end of the solder crown to the second end of the pillar,
the diffusion barrier resisting electro-migration into the first end of the solder crown by a selected chemical constituent
of the pillar.