US Pat. No. 9,220,164

HIGH FREQUENCY MODULE

Murata Manufacturing Co.,...

1. A high frequency module comprising:
a multilayer substrate on which a component is mounted on an upper surface thereof;
a ground mounting electrode located on the upper surface of the multilayer substrate and connected to a ground terminal of
the component;

a flat plate-shaped first ground in-plane conductor located on or in the multilayer substrate on a portion under the component
and connected to the ground mounting electrode with a first ground interlayer connecting conductor;

a specific signal mounting electrode located on the upper surface of the multilayer substrate and connected to a specific
signal terminal which is any one of a plurality of signal terminals of the component; and

a specific signal in-plane line conductor located in the multilayer substrate on a portion under the first ground in-plane
conductor and connected to the specific signal mounting electrode with a specific signal interlayer connecting conductor;
wherein

the first ground in-plane conductor is located between the component and the specific signal in-plane conductor; and
the specific signal interlayer connecting conductor is located on an outer side portion of the first ground in-plane conductor
when seen from above.

US Pat. No. 9,374,901

MONOLITHIC CAPACITOR MOUNTING STRUCTURE AND MONOLITHIC CAPACITOR

Murata Manufacturing Co.,...

1. A monolithic capacitor mounting structure comprising:
a monolithic capacitor including an elementary body having a parallelepiped shape or a substantially parallelepiped shape
and defined by plural dielectric layers and plural inner electrodes, which are alternately stacked, only one first outer electrode
located on a first side surface, extending in a lengthwise direction, of the elementary body, and only one second outer electrode
located on a second side surface, extending in the lengthwise direction, of the elementary body;

a mounting substrate including an insulating substrate, a first land electrode disposed on a surface of the insulating substrate
and connected to the first outer electrode, and a second land electrode disposed on the surface of the insulating substrate
and connected to the second outer electrode;

a first bonding material arranged to bond the first outer electrode and the first land electrode; and
a second bonding material arranged to bond the second outer electrode and the second land electrode; wherein
a portion of the first outer electrode joined with the first bonding material is a first bonding portion and a portion of
the second outer electrode joined with the second bonding material is a second bonding portion;

a length of each of the first and second bonding portions in the lengthwise direction is about 0.2 times to about 0.5 times
a length of the elementary body in the lengthwise direction; and

a center of each of the first and second bonding portions in the lengthwise direction is located at a position different from
a center of the elementary body in the lengthwise direction.

US Pat. No. 9,408,310

SUBSTRATE WITH BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING THE SAME

Murata Manufacturing Co.,...

1. A substrate with a built-in component, comprising:
an insulating base made of a thermoplastic resin and including a pair of main surfaces;
an electronic component arranged inside of the insulating base;
a wiring conductor arranged inside the insulating base so as to extend in parallel or substantially parallel to directions
in which the main surfaces extend; and

a via conductor arranged inside the insulating base; wherein
the substrate with the built-in component includes:
one or more frame-shaped electrodes arranged inside the insulating base so as to encircle the electronic component when the
insulating base is viewed from a direction perpendicular or substantially perpendicular to directions in which the main surfaces
of the insulating base extend;

the one or more frame-shaped electrodes are not connected to the electronic component;
each of the one or more frame-shaped electrodes is a closed frame-shaped electrode this is continuously provided without any
gap included therein; and

the electronic component is completely encircled by at least one of the one or more frame-shaped electrodes.

US Pat. No. 9,230,743

GRAVURE PRINTING PLATE AND MANUFACTURING METHOD THEREOF, GRAVURE PRINTING MACHINE, AND MANUFACTURING METHOD FOR LAMINATED CERAMIC ELECTRONIC COMPONENT

Murata Manufacturing Co.,...

1. A gravure printing plate used for transferring a paste film onto a printing target material through gravure printing, the
plate comprising:
an image section to which a printing paste for forming the paste film is supplied,
wherein the image section is provided with banks and a plurality of substantially recess-shaped cells defined by the banks;
and

a plurality of the cells being provided with a projecting portion that projects from a part of a bottom surface of the cell,
each projecting portion being distant from the banks and being provided in such a location that a distance from the projecting
portion to an outer edge of the image section is shorter than a distance from the projecting portion to the nearest bank.

US Pat. No. 9,224,543

CERAMIC ELECTRONIC COMPONENT INCLUDING GLASS COATING LAYER

MURATA MANUFACTURING CO.,...

1. A ceramic electronic component comprising:
a ceramic body;
a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body;
at least one glass coating layer covering a portion of the surface of the ceramic body on which the plurality of internal
electrodes are exposed; and

at least one electrode terminal provided directly on the at least one glass coating layer and including a plating film; wherein
the at least one glass coating layer is made of a glass medium in which metal powder particles are dispersed;
the plurality of internal electrodes project from the surface of the ceramic body into the at least one glass coating layer
without passing through the at least one glass coating layer; the at least one glass coating layer is a composite film in
which the glass medium and the metal powder particles are integrally bonded;

the at least one glass coating layer has a thickness of about 1 to 10 ?m;
the metal powder particles define conduction paths electrically connecting the plurality of internal electrodes with the at
least one electrode terminal; and

all of the metal powder particles are not sintered together and the glass medium continuously exists to join the spaces between
the metal powder particles.

US Pat. No. 9,185,805

METHOD OF MANUFACTURING A CIRCUIT SUBSTRATE

Murata Manufacturing Co.,...

1. A method for manufacturing a circuit substrate on which a first electronic component having a bump is to be mounted, the
circuit substrate including a terminal to which the bump of the first electronic component is to be electrically connected,
the method comprising the steps of:
forming a mask layer on a portion of a main surface of a first sheet;
forming a through-hole in the mask layer;
filling the through-hole with a conductive material;
stacking a plurality of second sheets and the first sheet having the mask layer such that the mask layer defines an uppermost
layer, and compressing the stack to embed the mask layer in the first sheet; and

removing the mask layer from the stack of the first sheet and the second sheets.

US Pat. No. 9,159,492

LAMINATED CERAMIC CAPACITOR HAVING A COVERING LAYER

MURATA MANUFACTURING CO.,...

1. A laminated ceramic capacitor comprising:
a laminated body having dielectric layers stacked adjacent one another and internal electrodes arranged between the dielectric
layers;

external electrodes on surfaces of the laminated body and connected to the internal electrodes, the external electrodes including
a silver-containing, layer containing at least Ag as a main constituent thereof; and

a covering layer covering at least portions of sections of the laminated body between the laminated body and edges of the
external electrodes,

wherein the dielectric layers and the covering layer contain, as their main constituent, a perovskite compound represented
by a chemical formula ABO3, wherein A is at least one of Ba, Sr, and Ca, and B is at least one of Ti, Zr, and Hf,

among the dielectric layers and the covering layer, V is present only in the dielectric layers,
the internal electrodes are not present in the covering layer,
a thickness of the covering layer is 38 ?m or greater,
the laminated body has a cuboid shape,
the internal electrodes are exposed at a pair of mutually opposed end surfaces of the laminated body, and
the covering layer covers four surfaces of the laminated body other than the mutually opposed end surfaces.

US Pat. No. 9,130,539

ELASTIC WAVE DEVICE WITH STACKED PIEZOELECTRIC SUBSTRATES

Murata Manufacturing Co. ...

1. An elastic wave device comprising:
a first elastic wave element including a first piezoelectric substrate;
a second elastic wave element including a second piezoelectric substrate that is stacked on the first piezoelectric substrate
and has a greater coefficient of linear expansion than the first piezoelectric substrate; and

a first substrate that is bonded to the second piezoelectric substrate and has a lower coefficient of linear expansion than
the second piezoelectric substrate.

US Pat. No. 9,148,090

POWER SUPPLY DEVICE FOR HIGH FREQUENCY POWER AMPLIFICATION CIRCUIT AND HIGH FREQUENCY POWER AMPLIFICATION DEVICE

Murata Manufacturing Co.,...

1. A power supply device for a high frequency power amplification circuit, the power supply device being configured to vary
an output voltage supplied as a power supply voltage to the high frequency power amplification circuit that amplifies a high
frequency signal, in accordance with an amplitude change of the high frequency signal, the power supply device comprising:
at least one bidirectional converter provided between an input section for an input voltage and an output section for an output
voltage, the least one bidirectional converter being capable of supplying or regenerating an electric charge;

an amplitude change monitor circuit configured to detect the amplitude change of the high frequency signal and to control
the at least one bidirectional converter supplying or regenerating an electric charge so that the output voltage follows the
amplitude change of the high frequency signal;

an output side energy storage device provided at an output section of the at least one bidirectional converter; and
a regeneration energy storage device provided at an input section of the at least one bidirectional converter, the regeneration
energy storage device being configured to store regenerated energy from the output side energy storage device.

US Pat. No. 9,374,886

SIGNAL LINE PATH AND MANUFACTURING METHOD THEREFOR

MURATA MANUFACTURING CO.,...

1. A signal line comprising:
a laminated body including at least a first insulator layer, a second insulator layer, and a third insulator layer that each
include a flexible material and that are laminated in a lamination direction from an upper side of the laminated body to a
lower side of the laminated body in this order;

a first ground conductor fixed to a main surface on an upper side of the first insulator layer;
a wiring conductor fixed to a main surface on an upper side of the second insulator layer; and
a second ground conductor provided on a main surface of the third insulator layer; wherein
the first ground conductor, the wiring conductor, and the second ground conductor define a stripline structure;
the laminated body has a bent structure so that the third insulator layer is located on an inner periphery side of the laminated
body, as compared to a location of the first insulator layer; and

surface roughnesses of surfaces on upper sides of the first ground conductor and the wiring conductor in the lamination direction
are smaller than surface roughnesses of surfaces on lower sides of the first ground conductor and the wiring conductor in
the lamination direction.

US Pat. No. 9,426,897

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

Murata Manufacturing Co.,...

1. A method for manufacturing an electronic component, the method comprising the steps of:
preparing a plurality of electrical elements each including first and second principal surfaces that are opposed to each other
and side surfaces that extend between and connect the first and second principal surfaces;

preparing a base including a plurality of boards on which the plurality of electrical elements are to be mounted, respectively;
forming a resin layer on the base;
pressing the plurality of electrical elements against the resin layer to join portions of the side surfaces of the plurality
of electrical elements to the resin layer, such that the resin layer is in direct contact with the portions of the side surfaces
of the plurality of electrical elements, the resin layer is spaced away and separated from one of the first and second principal
surfaces of each of the plurality of electrical elements to be subjected to grinding, and the resin layer is spaced away from
a central portion of another one of the first and second principal surfaces of each of the plurality of electrical elements
opposite to the one of the first and second principal surfaces of each of the plurality of electrical elements to be subjected
to grinding;

grinding the one of the first and second principal surfaces of each of the plurality of electrical elements such that a thickness
of each of the plurality of electrical elements defined by a distance between the first and second principal surfaces is reduced;
and

dividing the base to form the plurality of boards into individual pieces after the step of grinding the one of the first and
second principal surfaces of each of the plurality of electrical elements; wherein

the step of forming the resin layer on the base is performed before the step of pressing the plurality of electrical elements
against the resin layer.

US Pat. No. 9,380,699

CERAMIC MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

MURATA MANUFACTURING CO.,...

1. A ceramic multilayer substrate comprising:
a plurality of stacked ceramic layers;
a plurality of internal conductors which are stacked on each other with a respective one of the ceramic layers between adjacent
pairs of the plurality of internal conductors, the plurality of internal conductors being arranged such that at least a portion
of the plurality of internal conductors overlap each other in a stacking direction; and

at least one constraining layer which is located on a layer different from layers on which the internal conductors are located;
wherein

the at least one constraining layer is arranged to overlap, in a stacking direction, an internal conductor-overlapping region
where at least two of the internal conductors overlapping each other in the stacking direction overlap each other;

the at least one constraining layer includes a planar area that is not more than twice a planar area of an internal conductor-overlapping
region;

the at least one constraining layer contains an inorganic material powder that is not sintered;
the at least one constraining layer has a planar area that is not more than one-half of a planar area of the ceramic layers;
the at least one constraining layer is made of a different material from a material from which the plurality of internal conductors
are made; and

the at least one constraining layer has a thickness less than a thickness of each of the plurality of internal conductors.

US Pat. No. 9,490,529

ANTENNA DEVICE AND MOBILE TERMINAL

Murata Manufacturing Co.,...

1. An antenna device comprising:
a coil conductor,
a flat conductor disposed near the coil conductor,
a magnetic sheet provided between the coil conductor and the flat conductor, and
a casing,
wherein the coil conductor is a spirally wound winding and has a conductor opening portion at a center of the winding,
the coil conductor bends toward the flat conductor, and
the coil conductor is provided on only one side of the magnetic sheet.

US Pat. No. 9,408,311

METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC COMPONENT MODULE

Murata Manufacturing Co.,...

1. A method of manufacturing an electronic component module, comprising:
a first step of sealing a surface of an aggregate substrate on which a plurality of electronic components are mounted with
a sealing resin;

a second step of cutting a boundary portion between electronic component modules from an outer surface of the sealing resin
to a position where the aggregate substrate is cut at least partially through and forming a first groove;

a third step of forming a shield layer by coating the outer surface of the sealing resin with a conductive resin and by filling
the first groove with the conductive resin;

a fourth step of forming a conductive resin projection at a position on the shield layer where the first groove is formed
and forming a recess at a position where the conductive resin projection is formed; and

a fifth step of cutting the boundary portion between the electronic component modules along the recess from an outer surface
side of the shield layer to the position where the aggregate substrate is cut at least partially through, forming a second
groove having a width smaller than the width of the recess, and singulating the aggregate substrate into the individual electronic
component modules,

wherein, in the second step, the boundary portion is cut between electronic component modules from an outer surface of the
sealing resin to a position where the aggregate substrate is completely cut through.

US Pat. No. 9,313,911

PACKAGE SUBSTRATE

MURATA MANUFACTURING CO.,...

1. A package substrate comprising:
a main package including:
a main package body including first and second principal surfaces that are opposed to each other;
a plurality of first bonding materials provided on the second principal surface of the main package body; and
an internal circuit provided within the main package body and electrically connected to at least one of the plurality of first
bonding materials; and

a sub-package located on the second principal surface of the main package, the sub-package including:
a sub-package body made of an insulating material and including first and second principal surfaces that are opposed to each
other; and

a plurality of independent ceramic electronic component chips embedded in the sub-package body; wherein
a thickness direction dimension that is a dimension from the second principal surface of the main package to a portion of
the sub-package that is most distant from the second principal surface of the main package, is substantially equal to or less
than a thickness direction dimension of the first bonding materials;

the first principal surface of the sub-package is arranged closer to the main package than the second principal surface of
the sub-package body;

the plurality of independent ceramic electronic component chips embedded in the sub-package body are arranged in a direction
parallel or substantially parallel to at least one of the first and second principal surfaces of the sub-package body;

the sub-package is surrounded by the plurality of first bonding materials;
the sub-package includes a pad conductor on the first principal surface of the sub-package; and
a dimension of the pad conductor is smaller than a dimension of each of the plurality of first bonding materials in a direction
parallel to the second principal surface of the main package.

US Pat. No. 9,146,254

DYNAMIC SENSOR

Murata Manufacturing Co.,...

1. A dynamic sensor comprising:
a plurality of supports;
a plurality of beams including a plurality of piezoresistive elements provided therein;
a weight that is oscillatably supported on the supports by the beams and is arranged to detect a stress occurring in the beams
due to oscillation of the weight to detect a physical characteristic based on an applied force; wherein

the weight includes a first weight portion and a second weight portion which are aligned along a first axis direction and
a bridge portion which is provided at an approximate center of the first weight portion and the second weight portion in a
second axis direction perpendicular to the first axis direction and which connects the first weight portion and the second
weight portion;

the supports extend along the second axis direction such that the bridge portion of the weight is located therebetween, and
so as to be spaced apart from the weight; and

the beams are provided on both sides of the bridge portion along the second axis direction and extend along the first axis
direction to directly connect the first weight portion to the support and the second weight portion to the support.

US Pat. No. 9,402,307

RIGID-FLEXIBLE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

Murata Manufacturing Co.,...

1. A rigid-flexible substrate, comprising:
a plurality of rigid portions; and
a flexible portion connecting the plurality of rigid portions; wherein
the flexible portion is composed only of a first portion of a first resin sheet, the first resin sheet being composed of at
least one layer of a thermoplastic resin sheet;

each of the rigid portions includes a second portion of the first resin sheet other than the first portion of the first resin
sheet defining the flexible portion, and a second resin sheet composed of a plurality of thermoplastic resin sheets laminated
on one surface or both surfaces of the second portion of the first resin sheet;

a tapered portion is provided at an end edge of the second resin sheet on a side close to the flexible portion;
a thickness of the tapered portion in a direction in which the second resin sheet is laminated decreases toward the flexible
portion and is substantially 0 at a position in contact with the flexible portion;

all of the at least one layer of the thermoplastic resin sheet constituting the first resin sheet is made of a material that
is identical to a material from which the plurality of thermoplastic resin sheets constituting the second resin sheet are
made;

a conductor wire is laminated on at least one surface of the plurality of thermoplastic resin sheets constituting the second
resin sheet; and

one of the plurality of thermoplastic resin sheets of the second resin sheet that is located farther from the first resin
sheet has a longer distance from a boundary surface between the flexible portion and one of the rigid portions.

US Pat. No. 9,402,314

SEMICONDUCTOR MODULE

MURATA MANUFACTURING CO.,...

1. A semiconductor module comprising:
a circuit substrate;
a first semiconductor device substrate that is mounted on the circuit substrate and that processes an input signal of a first
frequency band;

a second semiconductor device substrate that is mounted on the circuit substrate and that processes an input signal of a second
frequency band; and

a control device substrate that is arranged between the first and second semiconductor device substrates and that controls
the first and second semiconductor device substrates;

a first matching circuit that is mounted on the circuit substrate and that is provided between the first semiconductor substrate
and an outside of the semiconductor module; and

a second matching circuit that is mounted on the circuit substrate and that is provided between the second semiconductor substrate
and the outside of the semiconductor module; wherein

the first and second matching circuits are arranged on a same side on the circuit substrate; and
a common electrode that is connected between a terminal of a capacitor of the first matching circuit and a terminal of a capacitor
of the second matching circuit is connected to a ground potential.

US Pat. No. 9,224,563

ELECTRONIC PART AND ELECTRONIC CONTROL UNIT

DENSO CORPORATION, Kariy...

1. An electronic part mounted to a printed board comprising:
a main body of a pillared shape, the main body having at least one electronic element;
multiple electrodes respectively formed at outer surfaces of the main body, each of the electrodes being electrically connected
to the electronic element; and

at least one fuse terminal electrically connected to one of the electrodes,
wherein the electrodes are composed of a first electrode formed at a first axial end surface of the main body and a second
electrode formed at a second axial end surface of the main body, the first and second axial end surfaces are opposing to each
other in an axial direction of the main body,

wherein the main body is arranged on the printed board in such a way that the first axial end surface is opposed to a board
surface of the printed board,

wherein the first electrode is electrically connected to a first wiring pattern formed in the printed board,
wherein the second electrode is electrically connected to a second wiring portion via the fuse terminal,
wherein the fuse terminal is composed of;
an electrode-connected portion electrically and mechanically connected to the second electrode;
a wire-connected portion electrically and mechanically connected to the second wiring portion; and
a connecting portion extending from the electrode-connected portion in a direction away from the main body and further extending
in the axial direction of the main body in order to electrically connect the electrode-connected portion to the wire-connected
portion,

wherein the connecting portion has a cut-off portion, which has a cross sectional area smaller than that of other portions
of the fuse terminal and which is melted down by heat generated by excess current flowing through the cut-off portion.

US Pat. No. 9,113,556

FLEXIBLE BOARD AND ELECTRONIC DEVICE

Murata Manufacturing Co.,...

1. A flexible board comprising:
a flexible body including a first main surface and a second main surface; and
a linear conductor provided at the flexible body so as to be located closer to the first main surface than to the second main
surface; wherein

the flexible body is valley-folded along a line crossing the linear conductor such that the first main surface is located
inside of the fold, and is mountain-folded along a line crossing the linear conductor such that the first main surface comes
is located outside of the fold; and

an average radius of curvature in an area where the flexible body is mountain-folded is greater than an average radius of
curvature in an area where the flexible body is valley-folded.

US Pat. No. 9,485,850

CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

Murata Manufacturing Co.,...

1. A circuit device comprising:
a heat detection component including lead terminals and a heat detection element;
a heat-generating electronic component including lead terminals; and
a substrate including a wiring pattern, holes, and lands; wherein
the heat detection component and the heat-generating electronic component are electrically connected to the substrate through
the lead terminals thereof;

the lead terminals of the heat detection component are bent into a U-shaped or substantially U-shaped configuration such that
the lead terminals include bent U-shaped portions and are partly contacted with the heat-generating electronic component,
and such that the heat detection component detects a temperature of the heat-generating electronic component; and

the heat-generating electronic component is sandwiched between the bent U-shaped portions of the lead terminals of the heat
detection component and the heat detection element of the heat detection component.

US Pat. No. 9,398,673

ESD PROTECTION DEVICE AND METHOD FOR PRODUCING THE SAME

MURATA MANUFACTURING CO.,...

1. An ESD protection device comprising:
an insulating substrate having a cavity therein;
first and second discharge electrodes disposed in the cavity of the insulating substrate, ends of the first and second discharge
electrodes facing each other with a gap therebetween;

a first outer electrode on an outer surface of the insulating substrate, the first outer electrode being electrically connected
to the first discharge electrode; and

a second outer electrode on the outer surface of the insulating substrate, the second outer electrode being electrically connected
to the second discharge electrode, wherein

each of the ends of the first and second discharge electrodes is thicker than any other portions of each of the first and
second discharge electrodes.

US Pat. No. 9,329,125

PERFORATED-STRUCTURE BODY, MANUFACTURING METHOD THEREFOR, AND MEASUREMENT APPARATUS AND MEASUREMENT METHOD

MURATA MANUFACTURING CO.,...

1. A perforated-structure body comprising:
a plate having a first main surface and a second main surface that opposes the first main surface, and a plurality of apertures
that penetrate from the first main surface to the second main surface; and

a support substrate that is stacked on at least one of the first main surface and the second main surface of the perforated
plate, the support substrate defining a portion through which at least a first aperture of the plurality of apertures is exposed
and at least a second aperture of the plurality of apertures is closed.

US Pat. No. 9,124,243

SURFACE ACOUSTIC WAVE FILTER DEVICE

Murata Manufacturing Co.,...

1. A surface acoustic wave filter device comprising:
a ladder surface acoustic wave filter unit including:
a series arm;
a series arm resonator connected in the series arm;
a parallel arm arranged to connect the series arm and ground to each other; and
a parallel arm resonator provided in the parallel arm; wherein
the ladder surface acoustic wave filter unit uses a Rayleigh wave as a main mode;
each of the series arm resonator and the parallel arm resonator includes a surface acoustic wave resonator including a piezoelectric
substrate, an IDT electrode located on the piezoelectric substrate, and a dielectric layer arranged so as to cover the IDT
electrode;

a thickness of the dielectric layer in the surface acoustic wave resonator configuring the series arm resonator is different
from a thickness of the dielectric layer in the surface acoustic wave resonator configuring the parallel arm resonator, and
a propagation orientation of a surface acoustic wave in the surface acoustic wave resonator configuring the series arm resonator
is different from a propagation orientation of a surface acoustic wave in the surface acoustic wave resonator configuring
the parallel arm resonator;

the piezoelectric substrate is a LiNbO3 substrate including Euler angles (?, ?, ?), wherein ? is within a range of about 25 degrees to about 45 degrees and ? corresponds
to a propagation orientation of the surface acoustic wave in the surface acoustic wave resonator configuring the series arm
resonator and a propagation orientation of the surface acoustic wave in the surface acoustic wave resonator configuring the
parallel arm resonator;

an angle defined by the propagation orientation of the surface acoustic wave in the surface acoustic wave resonator configuring
the series arm resonator with the propagation orientation of the surface acoustic wave in the surface acoustic wave resonator
configuring the parallel arm resonator is larger than 0 degrees and less than or equal to about 8 degrees; and

the dielectric layer in the surface acoustic wave resonator configuring the series arm resonator is thicker than the dielectric
layer in the surface acoustic wave resonator configuring the parallel arm resonator, ? of the surface acoustic wave resonator
configuring the series arm resonator is within a range of 0 degrees±1 degrees, and ? of the surface acoustic wave resonator
configuring the parallel arm resonator is within a range of about 1 degrees to about 8 degrees.

US Pat. No. 9,369,090

HIGH-FREQUENCY AMPLIFIER CIRCUIT

MURATA MANUFACTURING CO.,...

1. A high-frequency amplifier circuit comprising:
a high-frequency amplifying element including an input end and an output end;
a bias circuit that is connected to the high-frequency amplifying element and that supplies a first bias voltage to an input
side of the high-frequency amplifying element; and

a bias adjusting circuit that is connected between the input end and the bias circuit and that adjusts the first bias voltage
based on a high-frequency signal inputted to the input end, the bias adjusting circuit including a lumped element and an active
element,

wherein the bias adjusting circuit includes a signal detecting circuit and a switching circuit;
the signal detecting circuit is connected to the input end and the switching circuit, detects the high-frequency signal, and
outputs a detected value to the switching circuit; and

the switching circuit is connected to the bias circuit and reduces the first bias voltage when the detected value is greater
than or equal to a threshold.

US Pat. No. 9,313,892

ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT PACKAGE

MURATA MANUFACTURING CO.,...

1. An electronic component, comprising:
a laminated capacitor including a plurality of dielectric layers and a plurality of internal electrodes defining a laminate,
and a first external electrode and a second external electrode electrically connected to the internal electrodes and located
on both end surfaces of the laminate in a longitudinal direction, respectively; and

a substrate-type terminal including an insulating substrate main body, a first component connection electrode located on a
first main surface of the substrate main body on which the laminated capacitor is arranged, and connected to the first external
electrode, a second component connection electrode located on the first main surface of the substrate main body and connected
to the second external electrode, a first external connection electrode located on a second main surface of the substrate
main body opposite to the first main surface, a second external connection electrode located on the second main surface of
the substrate main body, a first connection electrode connecting the first component connection electrode and the first external
connection electrode, and a second connection electrode connecting the second component connection electrode and the second
external connection electrode; wherein

the substrate main body includes an inorganic material;
the substrate main body has a thickness of more than or equal to about 0.05 mm and less than or equal to about 0.4 mm;
the substrate main body has a Young's modulus of more than or equal to about 100 GPa and less than or equal to about 400 GPa;
and

a dimension of the substrate main body in a shorter direction of the laminate perpendicular or substantially perpendicular
to the longitudinal direction is less than a dimension of the laminated capacitor in the shorter direction, and a dimension
of the substrate main body in the longitudinal direction of the laminate is greater than a dimension of the laminated capacitor
in the longitudinal direction, or

the dimension of the substrate main body in the longitudinal direction is less than the dimension of the laminated capacitor
in the longitudinal direction, and the dimension of the substrate main body in the shorter direction is greater than the dimension
of the laminated capacitor in the shorter direction.

US Pat. No. 9,236,187

MULTILAYER CERAMIC CAPACITOR

Murata Manufacturing Co.,...

1. A multilayer ceramic capacitor comprising:
a ceramic main body including:
a first outer layer portion including first ceramic layers;
a second outer layer portion including second ceramic layers;
an inner layer portion including third ceramic layers and inner electrodes arranged at a plurality of interfaces between at
least some of the third ceramic layers; and

outer electrodes arranged on surfaces of the ceramic main body and electrically connected to the inner electrodes; wherein
the first outer layer portion and the second outer layer portion are arranged vertically so as to sandwich the inner layer
portion therebetween;

the third ceramic layers contain a perovskite-type compound represented by ABO3, where A contains one or more of Ba, Sr, and Ca; B contains one or more of Ti, Zr, and Hf; and O represents oxygen, and a
rare-earth element;

an outermost layer portion of at least one of the first and the second outer layer portions including at least a portion of
a surface of the ceramic main body contains a perovskite-type compound represented by A?B?O3, where A? contains one or more of Ba, Sr, and Ca; B? contains one or more of Ti, Zr, and Hf; and O represents oxygen, and
optionally a rare-earth element that is the same or different as the rare-earth element of the third ceramic layers;

a mol concentration (CR) of the rare-earth element in the third ceramic layers is greater than a mol concentration (Cr) of the rare-earth element in the outermost layer portion, CR>Cr, inclusive of Cr=0; and

the inner electrodes include Ni or an alloy of Ni.

US Pat. No. 9,224,536

VARIABLE CAPACITANCE DEVICE

Murata Manufacturing Co.,...

1. A variable capacitance device comprising:
a fixed plate including a first driving electrode and a first variable capacitance electrode;
a movable plate including a second driving electrode facing the first driving electrode and a second variable capacitance
electrode facing the first variable capacitance electrode;

a driving voltage applying unit that applies a driving voltage between the first driving electrode and the second driving
electrode;

a reference capacitor having a predetermined capacitance;
a capacitance detection signal generation unit that applies a capacitance detection pulse signal to a driving capacitance
portion including the first driving electrode and the second driving electrode and to the reference capacitor; and

a voltage change comparator that compares a voltage change of the driving capacitance portion and a voltage change of the
reference capacitor caused by the capacitance detection pulse signal and outputs a comparison result; wherein

the driving voltage applying unit controls the driving voltage based on the comparison result.

US Pat. No. 9,161,160

WIRELESS COMMUNICATION SYSTEM

Murata Manufacturing Co.,...

1. A wireless communication system comprising:
a plurality of communication devices; and
a hand-held communication terminal that is a separate structure from the plurality of communication devices; wherein
each of the plurality of communication devices includes a coupling portion arranged to be electrically coupled with the hand-held
communication terminal, a power source, and a signal processing section arranged to process a signal received and a signal
to be sent;

the hand-held communication terminal includes a coupling portion arranged to be electrically coupled with the coupling portion
of each of the plurality of communication devices, an antenna arranged to send and receive radio waves, and a connector arranged
to connect the coupling portion and the antenna to each other, the hand-held communication terminal including neither a power
source nor a signal processing section; and

when the coupling portion of the hand-held communication terminal is coupled with the coupling portion of a specified one
of the plurality of communication devices, the hand-held communication terminal receives a signal only from the specified
one of the plurality of communication devices at the coupling portion thereof and sends the signal through the antenna, and/or
receives a signal at the antenna and sends the signal only to the specified one of the plurality of communication devices
through the coupling portion thereof.

US Pat. No. 9,413,293

CRYSTAL DEVICE

MURATA MANUFACTURING CO.,...

1. A crystal device comprising:
a first package member that has a principal surface and a frame-shaped adhesion area on the principal surface;
a frame-shaped glass layer provided on the principal surface of the first package member, the frame-shaped glass layer having
an adhesive spread preventing part that is provided in an area between at least a part of a peripheral edge of the frame-shaped
adhesion area and a peripheral edge of the principal surface of the first package member, and having an extended portion;

an electrode land provided on the extended portion of the frame-shaped glass layer;
a crystal oscillator mounted over the principal surface of the first package member, the crystal oscillator being bonded to
and held by the electrode land;

an adhesive layer in the frame-shaped adhesion area on the principal surface of the first package member; and
a second package member attached to the adhesive layer to define a hollow part together with the principal surface of the
first package member.

US Pat. No. 9,374,877

ESD PROTECTION DEVICE AND METHOD FOR PRODUCING THE SAME

MURATA MANUFACTURING CO.,...

1. An ESD protection device comprising:
a first discharge electrode and a second discharge electrode that are disposed so as to face each other;
a discharge auxiliary electrode formed so as to span between the first discharge electrode and the second discharge electrode;
and

an insulator base that holds the first discharge electrode, the second discharge electrode, and the discharge auxiliary electrode,
wherein the discharge auxiliary electrode includes an aggregate of a plurality of metal particles each having a core-shell
structure including a core portion that contains, as a main component, a first metal and a shell portion that contains, as
a main component, a metal oxide containing a second metal, and

a pore is present in at least part of the shell portion.

US Pat. No. 9,491,868

CONDUCTIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT USING SAME, BONDING METHOD, BONDING STRUCTURE, AND ELECTRONIC COMPONENT

MURATA MANUFACTURING CO.,...

1. A bonding structure bonding one conductor to the other conductor so as to be electrically connected, comprising a pair
of conductors with a cured conductive resin composition comprising (a) a cured resin and (b) hard spherical carbon having
an average particle diameter of 10 ?m or less, the hard spherical carbon itself having a compression strength of 200 MPa or
more, and the hard spherical carbon comprising solid spherical carbon particles whose surface is coated with fine carbon particles
or pitch-derived fine carbon pieces or both interposed between the conductors, wherein the hard spherical carbon in the conductive
resin composition is hard amorphous carbon and has a higher hardness than either member of the pair of conductors, and wherein
a part of the solid spherical carbon particles and the fine carbon on the surface of the solid spherical carbon particles
are incorporated into a surface of both conductors.

US Pat. No. 9,462,678

HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC DEVICE

Murata Manufacturing Co.,...

1. A high-frequency signal transmission line that is bent when used, the high-frequency signal transmission line comprising:
a body including dielectric layers stacked on top of one another;
a signal line provided in the body;
a first ground conductor located at one side in a stacking direction in relation to the signal line so as to face the signal
line across one or more of the dielectric layers;

a second ground conductor located at another side in the stacking direction in relation to the signal line so as to face the
signal line across one or more of the dielectric layers; and

a connection portion including a plurality of interlayer connection conductors, each of the interlayer connection conductors
pierced in one of the dielectric layers, and a plurality of connection conductors, each of the connection conductors provided
on one of the dielectric layers, the connection portion configured to connect the first ground conductor to the second ground
conductor; wherein

two of the interlayer connection conductors that constitute both ends in the stacking direction of the connection portion
are located farther away from a center of a bending section where the body is to be bent than the other interlayer connection
conductors of the connection portion; and

openings are located respectively in ones of the dielectric layers located at the one side and the another side in the stacking
direction in relation to the other interlayer connection conductors, at positions that overlap with the other interlayer connection
conductors.

US Pat. No. 9,236,357

MOUNTING SUBSTRATE AND LIGHT EMITTING DEVICE

Murata Manufacturing Co.,...

1. A mounting substrate comprising:
a base material shaped like a flat plate having a first surface and a second surface opposed to the first surface;
first and second component mounting conductors provided at a distance from each other on the first surface of the base material;
first and second external connection conductors provided at a distance from each other on the second surface of the base material;
a first wiring conductor disposed between the first surface of the base material and the first component mounting conductor,
and shaped such as to be in contact with the first component mounting conductor and such as to avoid contact with the second
component mounting conductor,

a second wiring conductor disposed between the first surface and the second component mounting conductor, and shaped such
as to be in contact with the second component mounting conductor and such as to avoid contact with the first component mounting
conductor;

an insulating layer disposed between the first and second wiring conductors and the first and second component mounting conductors
such that center areas of the first and second wiring conductors are exposed therefrom;

a first conductive hole open at one end between the first component mounting conductor and the second component mounting conductor
on the first surface of the base material and being in contact at the other end with the first external connection electrode;
and

a second conductive hole open at one end between the first component mounting conductor and the second component mounting
conductor on the first surface of the base material and being in contact at the other end with the second external connection
electrode,

wherein the first wiring conductor and the second wiring conductor partly project as projecting portions in a direction to
approach each other,

wherein the first conductive hole penetrates the projecting portion of the first wiring conductor, and
wherein the second conductive hole penetrates the projecting portion of the second wiring conductor.

US Pat. No. 9,136,056

ELECTRONIC COMPONENT

Murata Manufacturing Co.,...

1. A monolithic ceramic capacitor comprising:
an electronic component body including:
a base member including two opposed end surfaces; and
two outer electrodes respectively disposed at least on the two opposed end surfaces of the base member; and
two metal terminals including:
two connection portions respectively connected to the two outer electrodes of the electronic component body; and
two leg portions respectively extending from the two connection portions;wherein
each of the two leg portions includes:
a leg part extending downward from a lowermost point of connection between the respective connection portion and the respective
outer electrode along a straight line along which the respective connection portion extends; and

a bent part extending from an end of the leg part in a direction that is perpendicular or substantially perpendicular to the
straight line such that the bent part is arranged to be surface mounted on and parallel or substantially parallel to a substrate;

each of the two metal terminals includes a first free end and a second free end opposite to the first free end;
the first free end is disposed at an uppermost portion of the electronic component body and the second free end is disposed
below a lowermost portion of the electronic component body;

a relationship of about 6.4?h/t is satisfied where h is a length of each of the leg parts of the two leg portions of the two
metal terminals in a direction parallel or substantially parallel to the end surfaces of the base member of the electronic
component body and t is a thickness of each of the leg parts of the two leg portions of the two metal terminals in a direction
perpendicular or substantially perpendicular to the end surfaces of the base member of the electronic component body;

each of the connection portions of the two metal terminals is opposed to and extends along substantially all portions of a
respective one of the two outer electrodes that is disposed adjacent thereto in the direction parallel or substantially parallel
to the end surfaces of the base member of the electronic component body; and

the leg part extends from the lowermost point of the connection portion to the bent part, such that only open space is present
between the lowermost point of the connection portion and the bent part.

US Pat. No. 9,332,645

ELECTRONIC PART AND ELECTRONIC CONTROL UNIT

DENSO CORPORATION, Kariy...

1. An electronic part mounted to a printed board comprising:
a main body arranged at a position above and separated from a board surface of the printed board, the main body having at
least one electronic element and multiple electrodes for the electronic element; and

multiple terminals, each of which is connected at its one end to each of the electrodes and electrically and mechanically
connected at its other end to a land formed in the printed board, each of the terminals extending from the main body toward
the printed board so as to hold the main body at the position above and separated from the board surface in a condition that
each of the terminals is electrically and mechanically connected to the respective electrodes and the respective lands;

wherein each of the terminals has an electrode-connected portion electrically and mechanically connected to the corresponding
electrode, a land-connected portion electrically and mechanically connected to the corresponding land, and an intermediate
portion for connecting the electrode-connected portion and the land-connected portion with each other,

wherein the terminals include at least one fuse terminal,
wherein the fuse terminal has a first connecting portion at least as a part of the intermediate portion, the first connecting
portion extending in a direction parallel to the board surface or in a direction inclined with respect to the board surface
by an angle smaller than 90 degrees,

wherein the fuse terminal further has a cut-off portion formed in the first connecting portion,
wherein the cut-off portion, which has a width smaller than that of other portions of the fuse terminal, is melted down due
to heat generation by excess current, and

wherein the fuse terminal has tapered portions at both sides of the cut-off portion, so that the cut-off portion is respectively
connected to the electrode-connected portion and the land-connected portion via the respective tapered portions.

US Pat. No. 9,119,318

MULTILAYER SUBSTRATE MODULE

Murata Manufacturing Co.,...

1. A multilayer substrate module comprising:
a multilayer circuit substrate including a plurality of layers stacked on top of one another in a stacking direction and including
conductor patterns located on the layers;

a first external connection terminal located on one main surface of the multilayer circuit substrate; and
a second external connection terminal located on another main surface of the multilayer circuit substrate; wherein
a wiring line that connects the first external connection terminal and the second external connection terminal to each other,
an inductor that defines a portion of the wiring line, a first ground conductor that is positioned on the one main surface
side of the inductor, and a second ground conductor that is positioned on the other main surface side of the inductor are
defined by the conductor patterns inside the multilayer circuit substrate; and

an area where the inductor is located is not superposed with an area where one of the first ground conductor and the second
ground conductor that is closer to the layer including the inductor is located when the multilayer circuit substrate is viewed
in plan.

US Pat. No. 9,485,860

MULTILAYER BOARD

Murata Manufacturing Co.,...

1. A multilayer board comprising:
a first resin base material portion;
a second resin base material portion; and
a third resin base material portion; wherein
the first, second and third resin base material portions include a same thermoplastic resin as a principal material and are
laminated on each other; wherein

the first resin base material portion defines a first principal surface of the multilayer board;
the second resin base material portion defines a second principal surface of the multilayer board;
the third resin base material portion is provided between the first resin base material portion and the second resin base
material portion in a lamination direction of the multilayer board;

a step portion at which a thickness of the multilayer board changes is provided between a flexible portion which has flexibility
and in which the third resin base material portion is not disposed and a thick portion in which the third resin base material
portion is disposed so that the thick portion has a thickness larger than that of the flexible portion;

the first resin base material portion and the second resin base material portion extend in a region from the thick portion
beyond the step portion to the flexible portion;

the first resin base material portion and the second resin base material portion cover both ends of the third resin base material
portion in a first direction in which the first resin base material portion and the second resin base material portion extend
in a region from the thick portion beyond the step portion to the flexible portion; and

the first resin base material portion and the second resin base material portion are joined directly to one another at outermost
ends of the multilayer board in the first direction.

US Pat. No. 9,362,042

ELECTRONIC COMPONENT

Murata Manufacturing Co.,...

1. An electronic component comprising:
a laminate formed by laminating a plurality of insulator layers;
a coil including linear coil conductor layers laminated along with the insulator layers, the coil having a spiral form; and
via-hole conductors extending through the insulator layers and connecting the coil conductor layers, wherein,
in a cross section perpendicular to a direction in which the coil conductor layers extend, the coil conductor layers have
recesses provided in surfaces directed toward an inner circumference side of the coil, the recesses being set back toward
an outer circumference side of the coil,

the recesses are positioned in portions of the coil conductor layers a spaced distance from the via-hole conductors along
the direction in which the coil conductor layers extend, and

the recesses have a depth of greater than or equal to 6 ?m and less than 20 ?m.

US Pat. No. 9,345,127

MULTILAYER WIRING BOARD

Murata Manufacturing Co.,...

1. A multilayer wiring board comprising:
a multilayer body including a plurality of insulating layers stacked on each other, the multilayer wiring board including:
a ground electrode located at a center or approximate center of one principal surface of the multilayer body;
a plurality of individual electrodes located at an outer edge of the one principal surface of the multilayer body; and
a surface insulating film including an interelectrode insulating portion and a surface covering portion, the interelectrode
insulating portion covering an edge portion of the ground electrode to provide insulation between the ground electrode and
each of the plurality of individual electrodes, the surface covering portion being disposed on a surface of the ground electrode
to divide the ground electrode into a plurality of regions; wherein

at least a central portion of the ground electrode located at the center or the approximate center of the one principal surface
of the multilayer body is exposed to an outside of the multilayer body.

US Pat. No. 9,287,625

STACK-TYPE INDUCTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME, AND COMMUNICATION DEVICE

Murata Manufacturing Co.,...

1. A stack-type inductor element, comprising:
a stack including a magnetic element layer, a first main surface, and a second main surface;
a coil conductor pattern provided in the stack and including the magnetic element layer as a magnetic element core;
a plurality of first pad electrodes provided on the first main surface of the stack; and
a plurality of second pad electrodes provided on the second main surface of the stack to include a portion symmetric to the
plurality of first pad electrodes; wherein

a first end and a second end of the coil conductor pattern is electrically connected to two of the plurality of first pad
electrodes, respectively, and the plurality of second pad electrodes are all electrically open;

the first and second main surfaces of the stack oppose each other, and the opposing first and second main surfaces include
portions that are symmetric to each other; and

the stack is an integral fired ceramic laminate, and the first and second main surfaces of the stack respectively define uppermost
and lowermost surfaces of the ceramic laminate.

US Pat. No. 9,136,057

CERAMIC ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, AND COLLECTIVE COMPONENT

MURATA MANUFACTURING CO.,...

1. A collective component from which a plurality of ceramic electronic components may be obtained by dividing the collective
component along a predetermined break line, comprising:
mutually opposite first and second principal surfaces; and
an external conductor on the first principal surface, wherein
a plurality of break leading holes extend in a direction to connect the first and second principal surfaces,
each of the break leading holes has an open end located on the first principal surface,
the plurality of break leading holes are distributed along a break line,
the collective component, when viewed from a side of the first principal surface, has a first region that intersects the external
conductor in the break line and a second region that does not intersect the external conductor in the break line,

the plurality of break leading holes include an extending break leading hole disposed so as to extend over the first region
and the second region, and

a pitch of adjacent break leading holes of the plurality of break leading holes is greater than a pitch of adjacent break
leading holes of the extending break leading hole.

US Pat. No. 9,331,639

POWER AMPLIFICATION CIRCUIT AND POWER AMPLIFICATION MODULE

MURATA MANUFACTURING CO.,...

1. A power amplification circuit comprising:
a first amplification element which amplifies and outputs an input signal with a gain according to a level of the input signal
and a level of a bias voltage;

a second amplification element which has the same gain characteristic as the first amplification element and amplifies and
outputs the input signal; and

a variable bias voltage generation circuit which generates the bias voltage, such that the bias voltage decreases with an
increase in level of an output signal of the second amplification element,

wherein the variable bias voltage generation circuit includes a filter circuit which attenuates an AC component of an output
signal of the second amplification element, and generates the bias voltage based on an output signal of the filter circuit.

US Pat. No. 9,532,495

METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC COMPONENT MODULE

Murata Manufacturing Co.,...

1. A method of manufacturing an electronic component module, the method being used to join a plurality of outer terminals
of a bare IC respectively to a plurality of bumps provided on one surface of a substrate, the method comprising the steps
of:
forming, on flat surface electrodes on the one surface of the substrate, the plural bumps in a stepped shape such that each
bump includes a thicker portion having a relatively large thickness and a thinner portion having a relatively small thickness,
and that, when looking at the bare IC in a mounted state in a plan view, the thicker portion is positioned on side closer
to a center of the bare IC relative to corresponding one of the outer terminals, and the thinner portion is positioned on
opposite side away from the center of the bare IC relative to the corresponding outer terminal; and

forming a plurality of joining portions, which join the plural outer terminals, through deformation of the bumps, such that
a height of each joining portion on the opposite side away from the center of the bare IC when looking at the mounted bare
IC in a plan view is lower than a height of the joining portion on the side closer to the center of the bare IC,

wherein
the plurality of the outer terminals which are bumps are respectively formed immediately under the bare IC,
the joining portions are respectively located immediately under the plurality of the outer terminals which are the bumps,
the plurality of the outer terminals which are bumps are respectively joined with the joining portions formed on the flat
surface electrodes, and

the plurality of joining portions are respectively formed in contact with a top surface of the flat surface electrode and
a bottom surface of the bare IC.

US Pat. No. 9,479,135

METHOD FOR MANUFACTURING PIEZOELECTRIC VIBRATION DEVICE

MURATA MANUFACTURING CO.,...

1. A method for manufacturing a piezoelectric vibration device, the method comprising:
mounting a piezoelectric vibration element on a substrate;
exposing the piezoelectric vibration element to a temperature higher than an ambient temperature and to a humidity higher
than an ambient humidity; and

detecting a variation of an electrical property caused by dust or contaminating foreign matter that is attached to the piezoelectric
vibration element and that absorbs moisture while the piezoelectric vibration element is kept at the temperature higher than
the ambient temperature and at the humidity higher than the ambient humidity.

US Pat. No. 9,473,030

SWITCHING POWER SUPPLY APPARATUS INCLUDING CONTROLLER THAT SWITCHES A SWITCHING UNIT BASED ON THE AMOUNT OF CHARGE IN A CHARGE UNIT

Murata Manufacturing Co.,...

1. A switching power supply apparatus comprising:
a converter circuit configured to have efficiency characteristics in which power conversion efficiency at a rated load is
higher than power conversion efficiency at a light load and that converts power-supply voltage into direct-current voltage
to output the direct-current voltage;

a switching unit configured to switch supply and shutoff of the power-supply voltage to the converter circuit, such that when
the switching unit is switched to shut off the power-supply voltage to the converter circuit, the power-supply voltage is
prevented from being input to the converter circuit;

a charge unit configured to store the direct-current voltage output from the converter circuit;
a detecting unit configured to detect an amount of charge in the charge unit; and
a controller configured and programmed to switch the switching unit based on the amount of charge detected by the detecting
unit; wherein

the controller is configured and programmed to set the switching unit to the shutoff state if the amount of charge in the
charge unit is higher than a first threshold value and set the switching unit to the supply state if the amount of charge
in the charge unit is lower than a second threshold value;

the controller is configured and programmed to output the direct-current voltage subjected to the conversion in the converter
circuit and store the direct-current voltage subjected to the conversion in the converter circuit in the charge unit when
the switching unit is in the supply state and output the direct-current voltage stored in the charge unit when the switching
unit is in the shutoff state; and

a frozen period in which the switching unit is in the shutoff state is controlled depending on an increase and a decrease
of output power and the frozen period is lengthened with the decreasing output power.

US Pat. No. 9,184,782

HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE

Murata Manufacturing Co.,...

1. A high-frequency module comprising:
first and second demultiplexers each of which includes a common terminal, a transmission filter, and a reception filter, the
transmission filter and the reception filter of the first and second demultiplexers are connected to the common terminal;
and

a band elimination filter that includes an antenna-side terminal and a demultiplexer-side terminal, the demultiplexer-side
terminal is connected to the common terminal of the first demultiplexer; wherein

the band elimination filter includes a first pass band, and a second pass band and a stop band that are located adjacent to
each other within the first pass band; and

the band elimination filter is configured so that the second pass band includes a pass band of each of the transmission filter
and the reception filter in the first demultiplexer and the stop band includes a pass band of the transmission filter in the
second demultiplexer.

US Pat. No. 9,089,054

CHIP-COMPONENT STRUCTURE

Murata Manufacturing Co.,...

1. A chip-component structure, comprising:
a multilayer capacitor including a laminated body including a plurality of dielectric layers and a plurality of internal electrodes
stacked on each other, and outer electrodes provided on opposite longitudinal component end surfaces of the laminated body
and electrically connected to respective ones of the plurality of internal electrodes; and

an interposer including a substrate including a through-hole opened between both principal surfaces thereof, a component connecting
electrode provided on a component mount surface defining one of the principal surfaces of the substrate and joined to the
outer electrodes, an external connection electrode provided on a substrate mount surface defining the other principal surface
of the substrate opposite to the component mount surface, and in-hole electrodes provided in the through-hole to connect the
component connecting electrode and the external connection electrode; wherein

the in-hole electrodes connected to the different outer electrodes of the multilayer capacitor are provided in the same through-hole.

US Pat. No. 9,472,839

HIGH-FREQUENCY TRANSMISSION LINE AND ELECTRONIC DEVICE

Murata Manufacturing Co.,...

1. A high-frequency transmission line comprising:
a laminate including a plurality of dielectric layers;
a first signal line provided on one of the dielectric layers;
a second signal line crossing the first signal line when viewed in a plan view in a direction of lamination, the second signal
line being positioned on the same dielectric layer as the first signal line except for a crossing portion that crosses with
the first signal line; and

an intermediate ground conductor provided between the first and second signal lines in the direction of lamination, so as
to overlap with crossing portions of the first and second signal lines when viewed in a plan view in the direction of lamination;
wherein

the crossing portion of the first signal line that crosses the second signal line is positioned on a second side in the direction
of lamination relative to a portion of the first signal line not crossing the second signal line; and

the crossing portion of the second signal line that crosses the first signal line is positioned on a first side in the direction
of lamination relative to a portion of the second signal line not crossing the first signal line.

US Pat. No. 9,468,100

MULTILAYER WIRING SUBSTRATE

MURATA MANUFACTURING CO.,...

1. A multilayer wiring substrate including a substrate body having first and second principal surfaces, and a plurality of
wirings disposed inside the substrate body and extending from the first principal surface toward the second principal surface,
wherein the first principal surface comprises a first exterior surface of the multilayer wiring substrate and the second principal
surface comprises a second exterior surface of the multilayer wiring substrate that is opposite the first exterior surface
of the multilayer wiring substrate,

the substrate body includes a plurality of stacked insulator layers,
the wirings include a plurality of via conductors penetrating through at least one of the insulator layers, and wiring conductors
disposed between the insulator layers and connecting the via conductors to each other, and the wiring conductors included
in at least one of the wirings have a nonlinear shape,

a plurality of outer-peripheral via conductors in one of the insulator layers that is closer to the first principal surface
than to the second principal surface, and a plurality of inner-peripheral via conductors in one of the insulator layers that
is closer to the first principal surface than to the second principal surface, the inner-peripheral via conductors being disposed
in a region surrounded by an outer periphery defined by the outer-peripheral via conductors in one of the insulator layers
that is closer to the first principal surface than to the second principal surface, the one of the insulator layers having
the first exterior surface,

when seeing through the substrate body from a direction perpendicular to the second exterior surface, a region surrounded
by the plurality of outer-peripheral via conductors in one of the insulator layers that is closer to the second exterior surface,
which are positioned at second exterior surface-side end portions of the plurality of wirings including the plurality of outer-peripheral
via conductors in one of the insulator layers that is closer to the first exterior surface than to the second principal surface,
has a larger area than a region surrounded by the outer-peripheral via conductors in one of the insulator layers that is closer
to the first exterior surface than to the second principal surface, and

a plurality of inner-peripheral via conductors in one of the insulator layers that is closer to the second exterior surface
than to the first principal surface, which are positioned at the second exterior surface-side end portions of the wirings
including the inner-peripheral via conductors in one of the insulator layers that is closer to the first exterior surface
than to the second principal surface, are positioned inside the region surrounded by the outer-peripheral via conductors in
one of the insulator layers that is closer to the second exterior surface than to the first principal surface.

US Pat. No. 9,445,493

SIGNAL LINE AND MANUFACTURING METHOD THEREFOR

Murata Manufacturing Co.,...

1. A signal line comprising:
a laminated body including a plurality of insulator layers that include flexible material and are laminated on one another;
and

a first ground conductor;
a signal conductor; and
a second ground conductor; wherein
each of the first ground conductor, the signal conductor, and the second ground conductor is provided in a different layer
of the laminated body from one another;

the first ground conductor, the signal conductor, and the second ground conductor define a stripline structure in which the
signal conductor is located between the first ground conductor and the second ground conductor;

the second ground conductor overlaps with the signal conductor in a planar view in a lamination direction of the laminated
body;

the first ground conductor includes a first ground conductor portion and a second ground conductor portion and a slit is disposed
between the first ground conductor portion and the second ground conductor portion of the first ground conductor, and at least
a portion of the slit overlaps with the signal conductor in the planar view in the lamination direction of the laminated body;

the first ground conductor includes a first surface and a second surface opposing the first surface, the first surface being
closer to the signal conductor than the second surface, and the first surface has a surface roughness larger than the second
surface; and

the laminated body is bent so that the second ground conductor is located on an inner periphery side as compared to a location
of the first ground conductor.

US Pat. No. 9,413,413

HIGH-FREQUENCY MODULE

MURATA MANUFACTURING CO.,...

1. A high-frequency module comprising:
a plurality of switch elements each including an antenna connection terminal and a plurality of switching connection terminals;
and

a multilayer body on which the plurality of switch elements are mounted; wherein
a filter component mounted on the multilayer body or a filter circuit defined by an inner layer electrode of the multilayer
body is connected to any of the switching connection terminals; and

a switching connection terminal of each of the plurality of switch elements that is not connected to the filter component
or the filter circuit is directly connected to an inner layer ground electrode provided in the multilayer body; wherein

the plurality of switch elements are mounted on a front surface of the multilayer body;
the switching connection terminals that are not connected to the filter component or the filter circuit are connected to the
inner layer ground electrode by conductive via holes; and

the inner layer ground electrode, which is directly connected with the conductive via holes to the switching connection terminals
of the plurality of switch elements that are not connected to the filter component or the filter circuit, includes portions
that are electrically isolated from each other and to each of which one of the plurality of switch elements is connected.

US Pat. No. 9,167,685

CIRCUIT BOARD

Murata Manufacturing Co.,...

1. A circuit board comprising:
a plate-shaped dielectric body including a first main surface and a second main surface, the plate-shaped dielectric body
including a first area that is not bent when the circuit board is used and a second area that is bent such that the first
main surface and the second main surface become an outer side and an inner side, respectively, when the circuit board is used;

a first reinforcing member located in the first area of the dielectric body, nearer the first main surface in relation to
a center of the second area of the dielectric body in a thickness direction; and

a second reinforcing member located in the first area of the dielectric body, nearer the second main surface in relation to
the center of the second area of the dielectric body in the thickness direction, and contacting with a border between the
first area and the second area; wherein

the first reinforcing member is located farther away from the second area than the second reinforcing member;
when the circuit board is used, the first main surface of the dielectric body curves from a portion overlapping a first edge
of the first reinforcing member closest to the second area when viewed from a direction normal to the first main surface;

when the circuit board is used, the second main surface of the dielectric body curves from a portion overlapping a second
edge of the second reinforcing member on the border between the first area and the second area when viewed from a direction
normal to the second main surface; and

the first reinforcing member and the second reinforcing member are metal plates.

US Pat. No. 9,148,123

LADDER FILTER DEVICE AND ELASTIC WAVE RESONATOR

Murata Manufacturing Co.,...

1. A ladder filter device comprising:
a first signal terminal and a second signal terminal;
a series arm that connects the first signal terminal and the second signal terminal;
a plurality of series arm resonators connected in series in the series arm;
a parallel arm that connects the series arm and a ground potential; and
at least one parallel arm resonator arranged in the parallel arm; wherein
at least one of the series arm resonators includes an elastic wave resonator including a piezoelectric substrate and an IDT
electrode arranged on the piezoelectric substrate;

the IDT electrode includes a first comb-shaped electrode and a second comb-shaped electrode, each of which includes a busbar
and a plurality of electrode fingers connected to the busbar, the first comb-shaped electrode and the second comb-shaped electrode
being inserted into each other in a staggered arrangement;

in each of the first comb-shaped electrode and the second comb-shaped electrode, an apodization angle falls in a range from
about 2° to about 14°, the apodization angle being an angle between an elastic wave propagation direction and an envelope
line that connects tips of the plurality of electrode fingers;

the at least one parallel arm resonator is defined by an elastic wave resonator including a piezoelectric substrate and an
IDT electrode arranged on the piezoelectric substrate;

the IDT electrode of the at least one parallel arm resonator includes a third comb-shaped electrode and a fourth comb-shaped
electrode, each of which includes a busbar and a plurality of electrode fingers connected to the busbar, the third comb-shaped
electrode and the fourth comb-shaped electrode being inserted into each other in a staggered arrangement;

the apodization angle in the at least one of the series arm resonators is less than the apodization angle in the at least
one parallel arm resonator; and

the apodization angle in the at least one parallel arm resonator is about 28° or less and is greater than the apodization
angle in the at least one of the series arm resonators.

US Pat. No. 9,129,733

LAMINATED INDUCTOR ELEMENT AND MANUFACTURING METHOD THEREOF

Murata Manufacturing Co.,...

1. A laminated inductor element comprising:
a plurality of magnetic layers each defined by a lamination of a plurality of magnetic sheets;
a plurality of non-magnetic layers each defined by a lamination of a plurality of non-magnetic sheets; and
an inductor including coils provided between the sheets and connected in a lamination direction; wherein
the non-magnetic layers define outermost layers and an intermediate layer of the laminated inductor element;
the non-magnetic layer on the outermost layer on a first surface side is thinner than the non-magnetic layer on the outermost
layer on a second surface side; and

a distance between an uppermost surface of the inductor and a surface of the laminated inductor element on the first surface
side is greater than a distance between a lowermost surface of the inductor and a surface of the laminated inductor element
on the second surface side.

US Pat. No. 9,538,695

CARRIER TAPE, PACKAGE TAPE AND SERIES OF ELECTRONIC COMPONENTS

Murata Manufacturing Co.,...

1. A carrier tape comprising
a layer of cardboard, and
a plurality of housing holes for housing electronic components with a planar dimension of 0.6 mm×0.3 mm or less inside thereof
such that the housing holes are arranged in a longitudinal direction and penetrate the layer of cardboard in a thickness direction,

a top tape attached to an upper surface of the layer of cardboard and a bottom tape attached to a lower surface of the layer
of cardboard,

interval portions between the housing holes adjacent to each other are provided, in the lower surface, with a concave slot
connecting the housing holes adjacent to each other,

wherein the concave slot has a bottom surface having a cross-sectional shape entirely recessed from opposite ends of the housing
holes as starting points, when viewed in a direction of arrangement of the housing holes.

US Pat. No. 9,338,889

METHOD OF MANUFACTURING MOUNTING SUBSTRATE ON WHICH MONOLITHIC CERAMIC CAPACITORS ARE MOUNTED AND MOUNTING STRUCTURE

Murata Manufacturing Co.,...

1. A method of manufacturing a mounting substrate in which a pair of monolithic ceramic capacitors each of which includes
a multilayer body in which a plurality of dielectric ceramic sheets and a plurality of planar or substantially planar inner
electrodes are stacked on top of one another and at least a pair of outer electrodes that are electrically connected to the
inner electrodes and that are provided on a surface of the multilayer body are mounted on a circuit board, the method of manufacturing
a mounting substrate comprising:
a step of joining the outer electrodes to lands that are formed on a front surface and a rear surface of the circuit board
such that surface directions of planes of the inner electrodes match each other, the lands formed on the front surface being
formed at positions that are plane-symmetrical to positions of the corresponding lands formed on the rear surface while being
electrically connected to the corresponding lands formed on the rear surface; wherein

the pair of monolithic ceramic capacitors are mounted such that the planes of the inner electrodes are oriented in a perpendicular
or substantially perpendicular direction with respect to the front surface and the rear surface of the circuit board.

US Pat. No. 9,277,647

CAPACITOR ELEMENT MOUNTING STRUCTURE AND CAPACITOR ELEMENT MOUNTING METHOD

MURATA MANUFACTURING CO.,...

1. A capacitor element mounting structure comprising
a plurality of capacitor elements mounted on a wiring board, each of the plurality of capacitor elements including a multilayer
body including dielectric material layers and internal electrode layers layered in an alternating manner along a predetermined
direction; wherein

the plurality of capacitor elements include a first capacitor element and a second capacitor element, disposed near or adjacent
to each other and arranged along a direction parallel or substantially parallel to a main surface of the wiring board, and
electrically connected in series or in parallel via a conductive pattern provided on the wiring board;

a main surface of the first capacitor element and a main surface of the second capacitor element that oppose the wiring board
both have a rectangular or substantially rectangular shape including a pair of short sides and a pair of long sides;

the first capacitor element and the second capacitor element each include a pair of end surfaces located opposite to each
other on both ends in a direction in which the pair of long sides extend, a pair of side surfaces located opposite to each
other on both ends in a direction in which the pair of short sides extend, and a pair of outer electrodes provided distanced
from each other on an outer surface of the multilayer body; and

the first capacitor element and the second capacitor element are mounted on the wiring board so that a direction in which
the pair of long sides of the main surface on the first capacitor element extend is perpendicular or substantially perpendicular
to a direction in which the pair of long sides of the main surface on the second capacitor element extend and one of the pair
of side surfaces on the first capacitor element opposes one of the pair of end surfaces on the second capacitor element.

US Pat. No. 9,386,696

MULTILAYER CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREFOR

Murata Manufacturing Co.,...

1. A multilayer ceramic substrate comprising: a ceramic element body including a plurality of stacked ceramic layers;
a resistor including a resistance film disposed between at least two of the ceramic layers; and
a lead via conductor penetrating the ceramic layers in a thickness direction and connected at a first end portion to the resistance
film; wherein

the resistance film and the lead via conductor both contain at least a first metallic component and a second metallic component
that constitute an alloy resistive material; and

a concentration of the second metallic component in the lead via conductor has a gradient structure that is comparatively
high in the first end portion connected to the resistance film and gradually decreases from the first end portion toward a
second end portion opposite therefrom; wherein the first metallic component is Cu and the second metallic component is Ni.

US Pat. No. 9,190,212

METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT

Murata Manufacturing Co.,...

1. A method for manufacturing a multilayer ceramic electronic component comprising steps of:
(a) preparing a first ceramic green sheet on which at least one of a first internal electrode pattern and a second internal
electrode pattern are printed, a second ceramic green sheet on which at least one of a first dummy conductor pattern and a
second dummy conductor pattern are printed, and a third ceramic green sheet on which at least one of a third internal electrode
pattern and a fourth internal electrode pattern are printed;

(b) obtaining a non-baked ceramic multilayer body by laminating a predetermined number of the third ceramic green sheets,
a predetermined number of the first ceramic green sheets, and a predetermined number of the second ceramic green sheets sequentially
from the bottom while applying pressure on a sheet-by-sheet basis;

(c) baking the non-baked ceramic multilayer body; and
(d) forming a first external terminal electrode and a second external terminal electrode by performing direct plating on the
baked ceramic multiplayer body; wherein

in the step (a), a width of the third dummy conductor pattern is made less than a width of the first dummy conductor pattern,
and a width of the fourth dummy conductor pattern is made less than a width of the second dummy conductor pattern.

US Pat. No. 9,172,276

POWER TRANSMISSION DEVICE AND POWER TRANSFER SYSTEM

MURATA MANUFACTURING CO.,...

1. A power transmission device comprising:
a power transmission device side active electrode;
a power transmission device side passive electrode;
a high-frequency high-voltage generating circuit configured to apply a high voltage of high frequency between the power transmission
device side active electrode and the power transmission device side passive electrode; and

a potential control section configured to control a potential of the power transmission device side passive electrode, wherein
the power transmission device side passive electrode surrounds the power transmission device side active electrode and the
high-frequency high-voltage generating circuit.

US Pat. No. 9,596,764

ELECTRONIC COMPONENT-EMBEDDED MODULE AND COMMUNICATION TERMINAL DEVICE

MURATA MANUFACTURING CO.,...

1. An electronic component-embedded module comprising:
an electronic component having a plurality of pads on its surface; and
a multilayer substrate which is a multilayer body formed by stacking up a plurality of resin layers and in which a cavity
is formed for containing the electronic component,

wherein the plurality of resin layers of the multilayer substrate at least includes
a first resin layer at which a plurality of first pattern conductors and a space, which forms the cavity, are formed, and
a second resin layer having at least one second pattern conductor and a plurality of third pattern conductors, the plurality
of third pattern conductors being capable of having electrical conduction with either of the plurality of first pattern conductors
or the plurality of pads, the second resin layer being placed over the first resin layer,

the second pattern conductor is arranged around one or more first pads with a gap provided between the second pattern conductor
and the one or more first pads when viewed in plan in a layer stacking direction of the first resin layer and the second resin
layer, the one or more first pads being one or more of the plurality of pads,

when viewed in plan in the layer stacking direction, a portion of the second resin layer is present between the second pattern
conductor and the one or more first pads,

when viewed in plan in the layer stacking direction, the second pattern conductor is arranged to surround the one or more
first pads in a continuous way or in an interrupted way, and

in the multilayer substrate, at least a portion of the second resin layer enters into a recess surrounded by the second pattern
conductor arranged to surround the one or more first pads in a continuous way or in an interrupted way.

US Pat. No. 9,461,611

LOW PASS FILTER HAVING ATTENUATION POLE AND WAVE SPLITTER

MURATA MANUFACTURING CO.,...

1. A low pass filter having an attenuation pole, comprising:
a multilayer body including a first surface and a second surface;
an input terminal, an output terminal, and a ground terminal provided on the second surface of the multilayer body;
a plurality of parallel resonance circuits disposed on a series arm configured to connect the input terminal and the output
terminal, each of the plurality of parallel resonance circuits including a capacitor and an inductor; and

a capacitor disposed on a parallel arm configured to connect the series arm and the ground terminal; wherein
at least two of the inductors disposed on the series arm are wound inductors mounted on the first surface of the multilayer
body, and a winding axis of one of the at least two wound inductors is perpendicular or substantially perpendicular to a winding
axis of another one of the at least two wound inductors;

the multiplayer body is made of a low temperature co-fired ceramic; and
at least one of the capacitors included in the plurality of parallel resonance circuits or the capacitor disposed on the parallel
arm is provided within the multilayer body.

US Pat. No. 9,222,988

MAGNETIC SENSOR, MAGNETIC SENSOR DRIVING METHOD, AND COMPUTER-READABLE RECORDING MEDIUM

MURATA MANUFACTURING CO.,...

1. A magnetic sensor comprising:
a pulse generator that receives an intermittent power supply signal from an external intermittent power supply and generates
a pulse based on a rising edge of a power supply pulse for an ON state of the intermittent power supply signal, the pulse
having a pulse width shorter than a power-on time of the intermittent power supply signal;

a magneto-electric conversion element;
a switch that controls, based on the pulse, a signal application time of the intermittent power supply signal to the magneto-electric
conversion element within the power-on time; and

an output waveform recovery circuit that changes the waveform of an output from the magneto-electric conversion element so
that the pulse width of the output becomes equal to the power-on time of the external intermittent power supply, the output
having a pulse width shorter than the power-on time of the intermittent power supply signal.

US Pat. No. 9,166,285

HIGH-FREQUENCY MODULE

Murata Manufacturing Co.,...

1. A high-frequency module comprising:
an antenna connection terminal which is connected to an antenna;
a plurality of input/output terminals to which communication signals are input or from which communication signals are output,
respectively;

a switch IC that includes a plurality of switch terminals which are individually connected to the plurality of input/output
terminals, and a common terminal which is connected to the antenna connection terminal, and that connects the common terminal
to each of the plurality of switch terminals in a switching manner;

a matching circuit which is connected between the common terminal of the switch IC and the antenna connection terminal; and
a multilayer body including a plurality of electrically insulating layers which are stacked on top of one another; wherein
the switch IC is mounted on one principal surface of the multilayer body;
the matching circuit includes a first inductor which is connected in series between the common terminal of the switch IC and
the antenna connection terminal; and

a first wiring line, which connects one end of the first inductor and the common terminal, is shorter than a second wiring
line, which connects the other end of the first inductor and the antenna connection terminal.

US Pat. No. 9,112,256

NON-RECIPROCAL CIRCUIT ELEMENT

Murata Manufacturing Co.,...

1. A non-reciprocal circuit element comprising:
a first center conductor;
a second center conductor;
a third center conductor;
a microwave magnetic body; and
a permanent magnet; wherein
the first, second and third center conductors are disposed, in an insulated state and intersecting with one another, around
the microwave magnetic body to which a direct current magnetic field is applied by the permanent magnet;

one end of the first center conductor defines a first port, one end of the second center conductor defines a second port,
and one end of the third center conductor defines a third port;

the first port is connected to a first terminal, the second port is connected to a second terminal, and the third port is
connected to a third terminal;

a first capacitance element is connected to the first center conductor in parallel, and a second capacitance element is connected
to the second center conductor in parallel;

other ends of the first center conductor, the second center conductor, and the third center conductor are connected to one
another, and are grounded via a first inductance element and a third capacitance element that are connected in series;

a second inductance element is connected to one end of the third center conductor in parallel, and another end of the second
inductance element is grounded; and

a fourth capacitance element is connected to a connection point between the one end of the third center electrode and the
second inductance element, and another end of the fourth capacitance element is connected to the third terminal.

US Pat. No. 9,554,461

FLEXIBLE BOARD AND ELECTRONIC DEVICE

Murata Manufacturing Co.,...

1. A flexible board comprising: a first sheet section including a first principal surface; a second sheet section including
a second principal surface and provided in a different position from the first principal surface in a normal direction to
the first principal surface; at least one first bent sheet section configured to connect ends of the first and second sheet
sections, the first bent sheet section including a third principal surface not parallel to the first and second principal
surfaces; and at least two second bent sheet sections each including a fourth principal surface and provided in different
positions from the third principal surface in a normal direction to the third principal surface; wherein the second bent sheet
sections are positioned so as to sandwich the first bent sheet section therebetween when viewed in a plan view in the normal
direction to the third principal surface; and wherein the second bent sheet sections each include a first end in physical
contact with the first sheet section and a second end in physical contact with the second sheet section.

US Pat. No. 9,603,228

DISCHARGE LAMP LIGHTING APPARATUS

MURATA MANUFACTURING CO.,...

1. A discharge lamp lighting apparatus comprising:
an inverter circuit that includes a high-side switching device and a low-side switching device and that generates an AC voltage
supplied to a discharge lamp;

an inverter control circuit that performs driving control of the inverter circuit; and
a resonant circuit that includes a resonant inductor and a resonant capacitor, that is provided in a stage subsequent to the
inverter circuit, and that increases, at a start-up time of the discharge lamp, a supply voltage supplied to the discharge
lamp through a voltage step-up action accompanying a resonance phenomenon; wherein

the inverter control circuit includes:
a driving frequency control circuit that drives the inverter circuit by using a first frequency including a resonant frequency
of the resonant circuit during a first period which is a period in which breakdown and a glow discharge subsequent to initiation
of a start-up process of the discharge lamp are generated, that drives the inverter circuit by using a second frequency including
a resonant frequency of the resonant circuit, the second frequency being lower than the first frequency, during a second period
which is a period in which an arc discharge of the discharge lamp is generated, and that drives the inverter circuit by using
a third frequency lower than the second frequency, during a third period subsequent to the second period; and

a dead time control circuit that sets a dead time in which both of the high-side switching device and the low-side switching
device of the inverter circuit are turned off so that the dead time is longer in the second period than in the first period
and the third period.

US Pat. No. 9,526,176

COMPONENT-EMBEDDED RESIN SUBSTRATE

MURATA MANUFACTURING CO.,...

1. A component-embedded resin substrate, comprising:
a resin structure including a plurality of laminated resin layers and having an end surface surrounding an outer periphery
of said resin layers; and

a plurality of embedded components arranged as embedded in said resin structure,
said plurality of embedded components including a first embedded component and a second embedded component,
said first embedded component having a first outer side extending along a first portion of said end surface closest to said
first embedded component when viewed in a planar view,

said second embedded component having a second outer side extending along a second portion of said end surface closest to
said second embedded component when viewed in a planar view,

said first outer side being oblique to said second outer side when viewed in a planar view,
said resin structure having an irregular shape when viewed in a planar view, and
said first portion of said end surface being oblique to said second portion of said end surface,
wherein each of said plurality of embedded components is arranged in parallel to said end surface closest to said embedded
component, and

wherein said end surface closest to said first embedded component has a straight portion not shorter than said first outer
side, and said end surface closest to said second embedded component has a straight portion not shorter than said second outer
side.

US Pat. No. 9,750,168

CONVEYANCE APPARATUS FOR ELECTRONIC COMPONENTS AND APPARATUS FOR INDUSTRIAL USE EQUIPPED WITH THE CONVEYANCE APPARATUS

Murata Manufacturing Co.,...

1. A conveyance apparatus for electronic components comprising:
a storing member having a plurality of cavities in which an electronic component is stored respectively,
an electronic component supply mechanism configured to supply a plurality of electronic components to be stored in the cavities
to the storing member; and

a moving unit configured to move the storing member in a predetermined direction in a relative relationship with the electronic
component supply mechanism,

the electronic components being sequentially stored in the plurality of cavities by moving the storing member and the electronic
component supply mechanism relative to each other such that the plurality of respective cavities opposedly face the electronic
components sequentially supplied from the electronic component supply mechanism,

a depth of the cavity being set to a depth which allows a portion of the electronic component to project from the cavity in
a state where the electronic component is stored in the cavity in a predetermined posture,

the storing member including guide portions each of which is a space communicating with the cavity and configured to guide
the electronic component into the cavity,

the guide portion being formed such that a guide opening portion which is an opening portion of the guide portion is larger
than an opening portion of the cavity and the opening portion of the cavity falls within a region of the guide opening portion
as viewed in a depth direction of the cavity, and

a storing space formed of the cavity and the guide portion being configured to store an entire electronic component in the
inside thereof.

US Pat. No. 9,287,918

HIGH-FREQUENCY FRONT-END CIRCUIT

Murata Manufacturing Co.,...

1. A high-frequency front-end circuit, comprising:
first and second variable filters each including an adjustable transmission characteristic and an adjustable impedance characteristic;
a common terminal to which the first variable filter and the second variable filter are connected;
a first individual terminal that is connected to a side of the first variable filter opposite to a side to which the common
terminal is connected; and

a second individual terminal that is connected to a side of the second variable filter opposite to the side to which the common
terminal is connected; wherein

at a time when frequency division duplex communication signals are to be transmitted and received, a band characteristic of
the first variable filter is set such that a transmission frequency band falls within a pass band of the first variable filter
and a reception frequency band falls within an attenuated band of the first variable filter, and a band characteristic of
the second variable filter is set such that the reception frequency band falls within a pass band of the second variable filter
and the transmission frequency band falls within an attenuated band of the second variable filter;

at a time when time division duplex communication signals are to be transmitted, the pass band of the first variable filter
is adjusted to match a transmission frequency band and an impedance of the second variable filter is adjusted such that the
impedance of the second variable filter in the transmission frequency band seen from the common terminal side is open; and

at a time when the time division duplex communication signals are to be received, the pass band of the second variable filter
is adjusted to match a reception frequency band and an impedance of the first variable filter is adjusted such that the impedance
of the first variable filter in the second frequency band seen from the common terminal side is open.

US Pat. No. 9,046,093

FLUID CONTROL DEVICE

Murata Manufacturing Co.,...

1. A fluid control device comprising:
a vibrating plate including a first main surface and a second main surface;
a driver that is provided on the first main surface of the vibrating plate and vibrates the vibrating plate; and
a plate that faces the second main surface of the vibrating plate and includes a hole; wherein
the plate includes a movable portion arranged to bend and vibrate; and
at least one of either the vibrating plate or the plate includes a projection projecting in a direction between the movable
portion and a region of the vibrating plate facing the movable portion.

US Pat. No. 9,252,489

CIRCUIT BOARD AND CIRCUIT MODULE

Murata Manufacturing Co. ...

1. A circuit board, comprising:
a first board portion and a second board portion each including an insulating layer made of a flexible material;
an antenna coil including a coil conductor provided with the insulating layer in the first board portion;
a wiring conductor provided with the insulating layer in the second board portion and electrically connected to the antenna
coil; and

a magnetic substance layer; wherein
the first board portion and the second board portion are arranged so as to include regions that face each other; and
the magnetic substance layer is provided with the first board portion and is located between the coil conductor of the first
board portion and the wiring conductor of the second board portion.

US Pat. No. 9,178,281

DIELECTRIC ANTENNA AND MATERIAL FOR THE SAME

MURATA MANUFACTURING CO.,...

1. A material for a dielectric antenna, the material comprising:
an organic polymer material, the organic polymer material containing a liquid crystal polymer and polytetrafluoroethylene,
wherein an amount of the polytetrafluoroethylene is 2 to 15% by volume based on a volume of the organic polymer material.

US Pat. No. 9,136,212

CIRCUIT BOARD

Murata Manufacturing Co.,...

1. A circuit board comprising:
a flexible laminated body including a laminate of a plurality of insulating-material layers made of a flexible material, a
first external electrode provided on a top surface of the flexible laminated body and on which an electronic component is
to be mounted; and

a plurality of film-shaped conductors each of which, when viewed in plan in a lamination direction of the flexible laminated
body, is provided on a respective insulating-material layer of the plurality of insulating-material layers; wherein

an area of each of the plurality of film-shaped conductors is larger than an area of the first external electrode, and the
entire first external electrode, when viewed in plan in the lamination direction of the flexible laminated body, is overlapped
with the plurality of film-shaped conductors;

the plurality of film-shaped conductors, when viewed in plan in a lamination direction of the laminated body, are not connected
to one another through via hole conductors in regions in which the plurality of film-shaped conductors are overlapped with
the first external electrode; and

when the flexible laminated body is bent, the film-shaped conductor is displaced by a greater amount than an amount by which
the first external electrode is displaced; and

each of the plurality of film-shaped conductors is provided in an area of the respective insulating-material layer under the
first external electrode and is spaced away from all edges of the respective insulating-material layer.

US Pat. No. 9,591,762

MULTILAYER CERAMIC CAPACITOR, MOUNTING STRUCTURE OF MULTILAYER CERAMIC CAPACITOR, AND TAPED ELECTRONIC COMPONENT ARRAY

Murata Manufacturing Co.,...

1. A multilayer ceramic capacitor comprising:
a stacked body including a stack of a plurality of dielectric layers and a plurality of internal electrodes, and including
a first main surface and a second main surface that are opposed to each other in a stacking direction, a first side surface
and a second side surface that are opposed to each other in a width direction perpendicular or substantially perpendicular
to the stacking direction, and a first end surface and a second end surface that are opposed to each other in a length direction
perpendicular or substantially perpendicular to each of the stacking direction and the width direction; and

a pair of external electrodes provided on the first end surface and the second end surface, respectively, of the stacked body;
wherein

each of the internal electrodes is connected at one of the first end surface and the second end surface to a corresponding
one of the external electrodes;

in the stacked body, assuming that a dimension between the first end surface and the second end surface is defined as a length
dimension, a dimension between the first side surface and the second side surface is defined as a width dimension, and a dimension
between the first main surface and the second main surface is defined as a thickness dimension, the width dimension is greater
than the thickness dimension, the length dimension is about 0.4 mm or less, the width dimension is about 0.15 mm or more and
about 0.35 mm or less, the thickness dimension is about 0.2 mm or less, the internal electrode is made of Cu or Ag as a main
component, and a width dimension of the internal electrode is about 60% or more of the width dimension of the stacked body;

an auxiliary electrode is provided inside the stacked body; and
the auxiliary electrode and one of the plurality of internal electrodes are provided on a common dielectric layer of the plurality
of dielectric layers.

US Pat. No. 9,258,019

COMMUNICATION DEVICE

MURATA MANUFACTURING CO.,...

1. A communication device comprising:
a first communication system configured to communicate using a first communication signal with a first frequency band as a
carrier frequency, and including a first radio communication integrated circuit configured to process the first communication
signal; and

a second communication system configured to communicate using a second communication signal with a second frequency band as
a carrier frequency, and including a second radio communication integrated circuit configured to process the second communication
signal; wherein

the first communication system further includes a filter circuit with the first frequency band and at least a portion of the
second frequency band as a pass band, and configured to attenuate a harmonic wave component of the second communication signal.

US Pat. No. 9,099,246

MULTILAYER CERAMIC CAPACITOR

Murata Manufacturing Co. ...

1. A multilayer ceramic capacitor comprising:
a body including conductive layers and ceramic dielectric layers alternately stacked on each other in a thickness direction;
and

a plurality of outer electrodes disposed on portions of the body; wherein
the body includes first and second principal surfaces opposing each other in the thickness direction, first and second end
surfaces opposing each other in a length direction, and first and second side surfaces opposing each other in a width direction;

the plurality of outer electrodes includes a first outer electrode covering at least the first end surface and a second outer
electrode covering at least the second end surface;

some of the conductive layers include a first effective portion and a first extension portion extending from the first effective
portion toward the first end surface and connecting to the first outer electrode, and others of the conductive layers include
a second effective portion and a second extension portion extending from the second effective portion toward the second end
surface and connecting to the second outer electrode;

the body includes a multilayer unit including an effective portion defined by the first and second effective portions and
portions of the ceramic dielectric layers stacked therebetween;

the body includes a thickness-direction first outer layer section that includes one of the ceramic dielectric layers and that
defines the first principal surface, a thickness-direction second outer layer section that includes another of the ceramic
dielectric layers and that defines the second principal surface, and a thickness-direction inner layer section that includes
the multilayer unit and that is disposed between the thickness-direction first and second outer layer sections;

a dimension of the thickness-direction second outer layer section in the thickness direction is greater than a dimension of
the thickness-direction first outer layer section in the thickness direction;

one of the first and second extension portions of a first outermost conductive layer of the conductive layers that is closest
to the first principal surface is inclined toward the second principal surface;

one of the first and second extension portions of a second outermost conductive layer of the conductive layers that is closest
to the second principal surface is inclined toward the first principal surface; and

an amount of inclination of the second outermost conductive layer is greater than an amount of inclination of the first outermost
conductive layer.

US Pat. No. 9,165,239

ELECTROMAGNETIC-COUPLING-MODULE-ATTACHED ARTICLE

Murata Manufacturing Co.,...

1. An article comprising:
a metal housing portion including at least one main surface; and
a power supply circuit including a resonant circuit that includes a coil-shaped electrode connected to a radio IC chip, the
resonant circuit having a resonant frequency; wherein

the coil-shaped electrode of the power supply circuit is disposed adjacent to the at least one main surface of the metal housing
portion such that a portion of the coil-shaped electrode overlaps the at least one main surface of the metal housing portion
and another portion of the coil-shaped electrode does not overlap the at least one main surface of the metal housing portion
when viewed in a direction perpendicular to the at least one main surface of the metal housing portion;

the coil-shaped electrode of the power supply circuit is magnetically coupled to the at least one main surface of the metal
housing portion, and the metal housing portion is utilized as a radiation element;

the metal housing portion is configured to perform at least one of radiating a transmission signal supplied from the power
supply circuit, and receiving a reception signal and supplying the reception signal to the power supply circuit;

the transmission signal and/or the reception signal has a frequency substantially corresponding to the resonant frequency
of the resonant circuit; and

the frequency of the transmission signal and/or the reception signal is not substantially dependent upon an electrical length
of the radiation element.

US Pat. No. 9,240,273

ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME

Murata Manufacturing Co.,...

1. An electronic component comprising:
a laminate formed by laminating a plurality of insulator layers; and
a helical coil provided in the laminate and formed by a plurality of coil conductors provided on the insulator layers, the
helical coil including first and second coil conductors, and via-hole conductors provided so as to pierce through the insulator
layers,

the first and second coil conductors being opposed to each other in a direction of lamination,
the first coil conductor having a first side existing toward the direction of the lamination and a third side existing toward
a direction opposite thereto and the first side and the third side having, in a cross section normal to a direction in which
the first coil conductor extends, a first convex portion and a second convex portion, respectively, and

the second coil conductor having a second side existing toward the direction opposite thereto and a fourth side existing toward
the direction of the lamination and the second side and the fourth side having, in a cross section normal to a direction in
which the second coil conductor extends, a first concave portion and a second concave portion, respectively, the first concave
portion overlapping the first convex portion in the direction of lamination.

US Pat. No. 9,064,636

MULTILAYER CERAMIC CAPACITOR INCLUDING FIRST AND SECOND OUTER LAYER PORTIONS AND AN INNER LAYER PORTION DISPOSED THEREBETWEEN

Murata Manufacturing Co.,...

1. A multilayer ceramic capacitor comprising:
a multilayer body including a plurality of dielectric layers and a plurality of conductive layers, which are stacked therein
in a stacking direction, and including a first principle surface and a second principle surface that are arranged so as to
be opposite to each other in the stacking direction; and

a pair of outer electrodes provided on portions of a surface of the multilayer body and electrically connected to at least
one of the plurality of conductive layers; wherein

the multilayer body includes a first end surface and a second end surface that are arranged at opposite sides of the multilayer
body and connect the first principle surface and the second principle surface, and a first side surface and a second side
surface that are arranged at opposite sides of the multilayer body and connect the first principle surface and the second
principle surface as well as the first end surface and the second end surface;

the multilayer body further includes a first outer layer portion which is a dielectric layer arranged closest to the first
principle surface, a second outer layer portion which is a dielectric layer arranged closest to the second principle surface,
and an inner layer portion adjacent to both of the first outer layer portion and the second outer layer portion, the inner
layer portion including a conductive layer arranged closest to the first principle surface and a conductive layer arranged
closest to the second principle surface;

the second outer layer portion includes an outer portion and an inner portion, the outer portion being thicker than the first
outer layer portion and including the second principle surface, the inner portion being arranged between the outer portion
and the inner layer portion;

the dielectric layers include barium titanate as a primary component and Si as an accessory component;
the outer portion has a higher Si composition ratio relative to Ti, compared to the dielectric layers included in the inner
layer portion and the inner portion; and

a boundary portion between the outer portion and the inner portion has a larger Si content compared to the outer portion;
the dielectric layers included in the inner layer portion have a higher rare earth element composition ratio relative to Ti,
compared to the outer portion; and

the dielectric layers included in the inner layer portion, the first outer layer portion, and the inner portion has a higher
Mn composition ratio relative to Ti, compared to the outer portion.

US Pat. No. 9,750,132

CIRCUIT BOARD AND ELECTRONIC DEVICE

MURATA MANUFACTURING CO.,...

1. A circuit board comprising:
a flexible board having a principal surface; and
a ground conductor provided in the flexible board, wherein,
the flexible board includes at least one elongated cut portion extending from an edge of the flexible board,
the flexible board is bent using the at least one elongated cut portion, so that the flexible board has a first portion and
a second portion at a different height from the first portion, and the ground conductor has a gap formed by the at least one
elongated cut portion, and

at least one ground terminal is provided on the ground conductor at a location adjacent an edge defining an open end of the
gap and positioned between the open end of the gap and a closed end of the gap, to electrically connect the circuit board
to a ground provided in an external circuit,

wherein the ground conductor and the at least one ground terminal are electrically connected to each other.

US Pat. No. 9,635,791

CARRIER TAPE, CARRIER TAPE MANUFACTURING APPARATUS, AND METHOD OF MANUFACTURING CARRIER TAPE

Murata Manufacturing Co.,...

1. A carrier tape constituted by a strip-shaped base material, the tape comprising:
a plurality of recesses provided in a first surface of the base material and for respectively containing electronic components;
a covering unit configured to seal openings of the recesses; and
a projection provided on a second surface of the base material along a longitudinal direction of the base material, a length
of the projection being such that the projection extends over at least two of the recesses, the projection being provided
at a position immediately under the recesses, wherein

the first surface, the second surface and the projection are one piece and being the same material and the plurality of recesses
and the projection are formed by a punch.

US Pat. No. 9,591,747

MODULE BOARD

MURATA MANUFACTURING CO.,...

1. A module board comprising a substrate, a plurality of electronic components mounted on one face of the substrate, and an
insulating resin sealing the plurality of electronic components,
wherein a plurality of columnar connection terminals are arranged on a peripheral area of the substrate and in one or more
predetermined areas on the substrate, and

wherein the one or more predetermined areas are areas of the substrate other than the peripheral area of the substrate where
none of the plurality of electronic components are mounted.

US Pat. No. 9,591,769

MODULE AND METHOD FOR MANUFACTURING THE SAME

MURATA MANUFACTURING CO.,...

1. A module comprising:
a wiring board;
a mounting electrode for component mounting, the mounting electrode being disposed on one principal surface of the wiring
board;

a component mounted on the one principal surface of the wiring board and solder-connected to the mounting electrode;
a photosensitive resin covering the one principal surface of the wiring board with at least a connection surface of the mounting
electrode exposed, the connection surface being connected to the component; and

a sealing resin layer disposed on the one principal surface of the wiring board, the sealing resin layer covering the photosensitive
resin and the component connected to the mounting electrode,

wherein an edge of the photosensitive resin contacts a side of the mounting electrode and a portion of the photosensitive
resin above the edge slopes away from the side of the mounting electrode to form a substantially V-shaped recess at a boundary
between the mounting electrode and the photosensitive resin; and

the recess is filled with resin of the sealing resin layer.

US Pat. No. 9,362,053

MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

Murata Manufacturing Co. ...

1. A multilayer ceramic capacitor comprising:
a multilayer body including a plurality of stacked dielectric layers including a dielectric ceramic that includes a plurality
of crystal grains and a plurality of internal electrodes disposed at a plurality of interfaces between the dielectric layers;
and

an external electrode provided on an outer surface of the multilayer body and electrically connected to some of the plurality
of inner electrodes; wherein

the multilayer body includes a Ba and Ti containing perovskite compound, and La, Mg and Mn;
in a case in which a content of Ti is set to 100 molar parts, a fraction of each content of La, Mg and Mn relative to the
content of Ti is such that La is about 1.2 to about 6.0 molar parts, Mg is about 2.4 to about 5.0 molar parts and Mn is about
1.0 to about 3.0 molar parts; and

an average number of crystal grains included in each of the dielectric layers in the stacking direction is one or more to
three or less.

US Pat. No. 9,324,497

DIELECTRIC THIN FILM, DIELECTRIC THIN FILM ELEMENT AND THIN FILM CAPACITOR

MURATA MANUFACTURING CO.,...

1. A thin film capacitor comprising:
a substrate;
a dielectric thin film element disposed on the substrate, the dielectric thin film element comprising:
a dielectric nanosheet thin film have a void portion filled with a p-type conductive organic polymer; and
a pair of electrodes configured to sandwich said dielectric nanosheet thin film,
wherein the dielectric nanosheet thin film comprises Ti0.87O2 or Ca2Nb3O10, and

wherein the substrate comprises an Si plate, an SiO2 film on the Si plate, and a Ti film on the SiO2 film.

US Pat. No. 9,655,249

SUBSTRATE WITH BUILT-IN CAPACITOR AND METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN CAPACITOR

IBIDEN CO., LTD., Ogaki-...

1. A substrate with a built-in capacitor, comprising:
an insulating base material layer;
a build-up layer formed on the insulating base material layer and comprising a conductor layer and an insulating layer; and
a multilayer ceramic capacitor positioned in an opening portion of the insulating base material layer and comprising a plurality
of internal electrodes, a plurality of ceramic dielectric layers and a pair of external electrodes,

wherein the multilayer ceramic capacitor has a cuboid shape having long sides and short sides, the pair of external electrodes
is formed on opposing long-side sides such that the external electrodes are separated by a distance in a range of 30 ?m to
200 ?m and that each of the external electrodes comprises a conductive paste layer connected to a respective group of the
internal electrodes and a copper plated layer covering the conductive paste layer, the conductive paste layer comprises one
of a Ni paste and a Cu paste including a glass component in a range of 5% to 40%, and the build-up layer has a plurality of
first via conductors and a plurality of second via conductors such that the first via conductors are connected to one of the
external electrodes of the multilayer ceramic capacitor and the second via conductors are connected to the other one of the
external electrodes of the multilayer ceramic capacitor.

US Pat. No. 9,516,728

ESD PROTECTION DEVICE

MURATA MANUFACTURING CO.,...

1. An ESD protection device comprising:
an insulating member;
first and second discharge electrodes provided in the insulating member;
a first outer electrode provided on an outer surface of the insulating member and electrically connected to the first discharge
electrode;

a second outer electrode provided on an outer surface of the insulating member and electrically connected to the second discharge
electrode; and

one or more inner conductors provided in the insulating member and connected to the first or second outer electrode.

US Pat. No. 9,245,680

COMMON MODE CHOKE COIL AND METHOD FOR MANUFACTURING THE SAME

Murata Manufacturing Co.,...

1. A common mode choke coil comprising
a non-magnetic layer and a second magnetic layer stacked on a first magnetic layer, and two conductive coils facing one another
included in the non-magnetic layer,

wherein the non-magnetic layer is formed of sintered glass ceramics, the conductive coil is formed of a conductor containing
copper, at least one of the first magnetic layer and the second magnetic layer is formed of a sintered ferrite material containing
Fe2O3, Mn2O3, NiO,

ZnO and CuO, and the sintered ferrite material has an Fe2O3-reduced content of not less than 25 mol % but not more than 47 mol % and a Mn2O3-reduced content of 1 mol % or more and less than 7.5 mol %, or Fe2O3-reduced content of not less than 35 mol % but not more than 45 mol % and a Mn2O3-reduced content of not less than 7.5 mol % but not more than 10 mol %, and a CuO reduced content of less than 5 mol %,

the conductive coil and at least one of the first magnetic layers and the second magnetic layer are co-sintered.

US Pat. No. 9,241,408

ELECTRONIC COMPONENT

Murata Manufacturing Co.,...

1. An electronic component comprising:
a base plate including a flat-plate-shaped insulating substrate, a first upper surface electrode and a second upper surface
electrode located on one main surface of the insulating substrate, and a first lower surface electrode and a second lower
surface electrode located on the other main surface of the insulating substrate; and

a chip component including a first outer electrode and a second outer electrode located on both ends in a length direction
of a main body, the first outer electrode opposing the second outer electrode, the first outer electrode being mounted on
the first upper surface electrode, the second outer electrode being mounted on the second upper surface electrode; wherein

the base plate includes a plurality of connection electrodes that are located on end surfaces perpendicular or substantially
perpendicular to the one main surface and the other main surface, that connects the first upper surface electrode to the first
lower surface electrode, and that connects the second upper surface electrode to the second lower surface electrode;

the first upper surface electrode is separated from the first lower surface electrode and the second upper surface electrode
is separated from the second lower surface electrode at substantially a center in a width direction perpendicular or substantially
perpendicular to the length direction of the main body of the chip component;

the main body includes a top surface and a bottom surface, first and second ends in the length direction and first and second
ends in the width direction;

the first outer electrode is located on the bottom surface, one of the first and second ends in the length direction and both
of the first and second ends in the width directions; and

the second outer electrode is located on the bottom surface, the other one of the first and second ends in the length direction
and both of the first and second ends in the width direction.

US Pat. No. 9,154,113

LADDER ACOUSTIC WAVE FILTER DEVICE AND BRANCHING FILTER

Murata Manufacturing Co.,...

1. A ladder acoustic wave filter device comprising:
an input end;
an output end;
a series arm that electrically connects the input end and the output end;
a series arm resonator provided to the series arm and including a series-arm-side IDT electrode;
a parallel arm electrically connected between the series arm and a ground potential; and
a parallel arm resonator provided to the parallel arm and including a parallel-arm-side IDT electrode; wherein
each of the series-arm-side IDT electrode and the parallel-arm-side IDT electrode includes a pair of comb-shaped electrodes
that are interposed between each other, the pair of comb-shaped electrodes each including a busbar and a plurality of electrode
fingers extending from the busbar;

the series-arm-side IDT electrode is apodization weighted, and the busbars of the series-arm-side IDT electrode are configured
so that in an acoustic wave propagation direction, a distance between the busbars in an overlap width direction perpendicular
to the acoustic wave propagation direction becomes shorter as an overlap width of the electrode fingers becomes smaller;

each of the pair of comb-shaped electrodes of the parallel-arm-side IDT electrode further includes a plurality of dummy electrodes
that extends from the busbar and are opposed to the electrode fingers of the other comb-shaped electrode in the overlap width
direction, and the parallel-arm-side IDT electrode is an IDT electrode in which the overlap width is constant; and

a region bounded by a first envelope and a second envelope has a hexagonal shape, the first envelope being an imaginary line
formed by connecting tips of the electrode fingers of one of the pair of comb-shaped electrodes of the series-arm-side IDT
electrode, the second envelope being an imaginary line formed by connecting tips of the electrode fingers of the other one
of the pair of comb-shaped electrodes of the series-arm-side IDT electrode.

US Pat. No. 9,148,109

MONOLITHIC CERAMIC ELECTRONIC COMPONENT

Murata Manufacturing Co. ...

1. A monolithic ceramic electronic component comprising:
at least two types of stacked ceramic layers having different dielectric constants; and
internal electrodes at least partially disposed between the at least two types of ceramic layers having different dielectric
constants; wherein

the internal electrodes include an additive component common to a component of a material included in two ceramic layers of
the at least two types of stacked ceramic layers that are adjacent to each other with the internal electrodes disposed therebetween.

US Pat. No. 9,117,049

CAPACITOR ARRANGEMENT ASSISTING METHOD AND CAPACITOR ARRANGEMENT ASSISTING DEVICE

MURATA MANUFACTURING CO.,...

1. A capacitor arrangement assisting method comprising:
receiving an input of a width of a power supply wiring that connects a power supply terminal of an IC with a capacitor, a
thickness of a dielectric provided between the power supply wiring and a ground plane, an impedance of the capacitor, and
a target impedance of the IC at a target frequency;

calculating, by using a computer, a maximum allowable wiring length of the power supply wiring on the basis of the width of
the power supply wiring, the thickness of the dielectric, the impedance of the capacitor, and the target impedance of the
IC at the target frequency; and

displaying the maximum allowable wiring length on a display unit,
wherein the maximum allowable wiring length lmax is calculated as follows:


where ?0 represents the permeability of a vacuum, w represents the width of the power supply wiring, h represents the thickness of
the dielectric, ZC represent the impedance of the capacitor, and ZT represents the target impedance of the IC at the target frequency fT .

US Pat. No. 9,491,849

ELECTRONIC COMPONENT

Murata Manufacturing Co.,...

1. A mounting structure including an electronic component mounted on a board, wherein the electronic component comprises:
a laminate including a plurality of laminated dielectric layers, a mounting surface that faces the board and that is positioned
on one side of the laminate in a lamination direction, and a first end surface and a second end surface that are opposed to
each other;

a plurality of capacitor conductors laminated together with the dielectric layers to define a capacitor, and led out to the
first end surface or the second end surface;

a first outer electrode disposed to extend over the first end surface and partly over the mounting surface, and connected
to the capacitor conductors;

a second outer electrode disposed to extend over the second end surface and partly over the mounting surface, and connected
to the capacitor conductors; wherein

the board includes:
a board body; and
a first land electrode and a second land electrode disposed on the board body, the first land electrode and the second land
electrode being connected respectively to the first outer electrode and the second outer electrode through conductive materials;
wherein

a distance between the mounting surface and the capacitor conductor closest to the mounting surface is longer than a distance
between a surface of the laminate opposed to the mounting surface and the capacitor conductor closest to the opposed surface;
and

H1/H2 is not greater than about 1.27, where H1 is a height from each of surfaces of the first and second land electrodes to a top of the respective conductive material
connecting the first and second land electrodes to the respective first and second outer electrodes, and H2 is a height from each of the surfaces of the first and second land electrodes to the capacitor conductor closest to the mounting
surface.

US Pat. No. 9,237,854

VALVE, FLUID CONTROL DEVICE

Murata Manufacturing Co.,...

1. A valve comprising:
a valve housing; and
a diaphragm that divides an inside of the valve housing and defines a first region and a second region in the valve housing;
wherein

the valve housing includes:
a first ventilation hole to communicate with the first region;
a second ventilation hole to communicate with the second region; and
a third ventilation hole to communicate with a region outside of the valve housing;
the diaphragm includes:
a fourth ventilation hole to communicate with both the second ventilation hole and the second region;
a first face that communicates with the first region; and
a second face that communicates with the third ventilation hole; and
the diaphragm is fixed to the valve housing so that, in a case in which a pressure of the first region is higher than a pressure
of the second region, the diaphragm makes the first ventilation hole and the second ventilation hole communicate with each
other and blocks communication between the third ventilation hole and the fourth ventilation hole; and, in a case in which
the pressure of the first region is lower than the pressure of the second region, the diaphragm makes the third ventilation
hole and the fourth ventilation hole communicate with each other and blocks the communication between the first ventilation
hole and the second ventilation hole.

US Pat. No. 9,071,227

HIGH-FREQUENCY MODULE

Murata Manufacturing Co. ...

1. A high-frequency module comprising:
a high-frequency device including balanced terminals; and
a layered body having the high-frequency device mounted thereon and including balanced-output external connection ports to
be connected to the balanced terminals; wherein

the layered body includes a first routing pattern and a second routing pattern that connect the balanced terminals and the
balanced-output external connection ports to each other;

the first routing pattern and the second routing pattern have shapes such that characteristic impedances thereof are the same;
the layered body includes a plurality of layers, each of the plurality of layers includes an upper principal surface and a
lower principal surface, and the upper principal surface of an uppermost one of the plurality of layers defines a mounting
surface on which the high-frequency device is mounted;

electrode patterns defining circuit elements and wiring patterns, which constitute the high-frequency module, are located
on the upper principal surface of at least one of the plurality of layers;

the first routing pattern and the second routing pattern are located between the mounting surface and a first inner layer
ground electrode located in the layered body;

a position at which the first routing pattern and the second routing pattern are located overlaps a position at which the
electrode patterns defining the circuit elements and the wiring patterns are located when the high-frequency device is viewed
in a plan view; and

the first inner layer ground electrode located in the layered body is located between the electrode patterns defining the
circuit elements and the wiring patterns, and the first routing pattern and the second routing pattern in a thickness direction
of the high frequency device.

US Pat. No. 9,538,638

HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC DEVICE

Murata Manufacturing Co.,...

1. A high-frequency signal transmission line, comprising:
a dielectric element assembly including a plurality of dielectric layers laminated on each other in a lamination direction,
the plurality of dielectric layers having substantially the same dielectric constant;

a linear signal line provided at the dielectric element assembly; and
a first ground conductor provided on a first side in the lamination direction relative to the signal line and including a
plurality of openings arranged along the signal line; wherein

one of the plurality of dielectric layers that is positioned at an end of the first side in the lamination direction includes
an undulating portion provided on a first surface located on the first side in the lamination direction, such that the undulating
portion overlaps with the openings when viewed in a plan view in the lamination direction;

the undulating portion is defined by grooves provided in the dielectric layer at the end of the first side in the lamination
direction, the grooves extending along the signal line in the first surface;

the first ground conductor has a ladder-shaped configuration with bridge portions provided between the openings being adjacent
to one another; and

the grooves overlap with the bridge portions when viewed in a plan view in the lamination direction.

US Pat. No. 9,355,210

METHOD FOR DERIVING EQUIVALENT CIRCUIT MODEL OF CAPACITOR

Murata Manufacturing Co.,...

1. A method for deriving an equivalent circuit model of a capacitor that is formed by a resistive element, a capacitive element,
and an inductive element, the method comprising:
expressing, by a computer, a rate of change in a characteristic value of a voltage-dependent element being one of the resistive
element, the capacitive element, and the inductive element, the voltage-dependent element having a value that changes as a
direct current voltage is applied to the capacitor, the value being a dimensionless coefficient on the basis of a rate of
change in the characteristics of the capacitor attributable to a material of the capacitor;

multiplying, by the computer, the characteristic value of the element, of which the characteristic value changes in response
to the direct current voltage being applied to the capacitor, held while the direct current voltage is not applied by the
dimensionless coefficient; and

correcting, by the computer, the characteristic value of the element to a value in accordance with the direct current voltage
applied to the capacitor,

wherein the equivalent circuit model is formed by one of a main resonant circuit, a secondary resonant circuit, a capacitive
circuit, and an inductive circuit, the main resonant circuit being formed by connecting a resistive element, a capacitive
element, and an inductive element in series, the secondary resonant circuit being formed by connecting a resistive element,
a capacitive element, and an inductive element in parallel, the capacitive circuit being formed by connecting a resistive
element and a capacitive element in parallel, the inductive circuit being formed by connecting a resistive element and an
inductive element in parallel; or the equivalent circuit model is formed by connecting some of the main resonant circuit,
the secondary resonant circuit, the capacitive circuit, and the inductive circuit in series.

US Pat. No. 9,355,762

CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT

Murata Manufacturing Co.,...

1. A ceramic electronic component comprising:
a ceramic body including first and second principal surfaces that extend in a length direction and a width direction, first
and second side surfaces that extend in the length direction and a thickness direction, and first and second end surfaces
that extend in the width direction and the thickness direction; and

an outer electrode arranged so as to extend from the first end surface of the ceramic body to the second principal surface
of the ceramic body; wherein

the outer electrode includes:
a resin-containing electrode layer provided on the ceramic body and containing a conductive material and a resin; and
a plating layer provided on the resin-containing electrode layer, the plating layer including a Ni plating layer; wherein
when a thickness of the Ni plating layer is t1 and a distance by which a portion of the Ni plating layer that is in contact
with the second principal surface extends in the length direction is t2, t2/t1 is less than about 1.

US Pat. No. 9,319,026

HIGH-FREQUENCY MODULE

Murata Manufacturing Co.,...

1. A high-frequency module comprising
a multilayer body including dielectric layers stacked on top of one another and first and second ground conductors that are
separated from each other;

a common terminal that is provided in the multilayer body and to and from which communication signals are input and output;
and

a plurality of splitters that are mounted on a surface of the multilayer body and that separate the input and output communication
signals via the common terminal; wherein

each of the plurality of splitters includes a respective transmission filter that is mounted on the surface of the multilayer
body and that is grounded by the first ground conductor and each of the plurality of splitters includes a reception filter
that is mounted on the surface of the multilayer body and that is grounded by the second ground conductor.

US Pat. No. 9,137,904

MODULE AND METHOD OF MANUFACTURING THE SAME

MURATA MANUFACTURING CO.,...

1. A module comprising:
a circuit board;
a resin layer disposed on a first principal surface of the circuit board; and
an external connection conductor arranged in the resin layer, having a first end connected to the circuit board and a second
end protruding through a surface of the resin layer, and including a projection extending along the surface of the resin layer
in a portion protruding through the surface of the resin layer,

wherein the external connection conductor includes a supporting section and a covering section,
wherein the supporting section is disposed in the resin layer so as to be recessed from the surface of the resin layer and
has a first end connected to the circuit board, and

the covering section protrudes through the surface of the resin layer, is disposed on the supporting section, and includes
the projection extending along the surface of the resin layer in the portion protruding through the surface of the resin layer,
and

wherein the module further comprises a solder bump provided on the second end of the external connection conductor.

US Pat. No. 9,111,682

MULTILAYER CERAMIC ELECTRONIC COMPONENT

Murata Manufacturing Co.,...

1. A multilayer ceramic electronic component comprising:
a ceramic body including a pair of opposing principal surfaces, a pair of opposing side surfaces, a pair of first and second
opposing end surfaces, and a plurality of ceramic layers that extend in a direction in which the principal surfaces extend
and are stacked in a direction of a line that connects the pair of principal surfaces, a dimension of the end surfaces in
a direction of a line that connects the pair of side surfaces is smaller than a dimension of the side surfaces in a direction
of a line that connects the pair of end surfaces;

a first internal electrode that is arranged inside the ceramic body and that includes a first led out portion that provides
an exposed end that is exposed at the first end surface, and a first opposing portion;

a second internal electrode that is arranged inside the ceramic body and that includes a second led out portion that provides
an exposed end that is exposed at the second end surface opposed to the first end surface, and a second opposing portion opposed
to the first opposing portion;

an external electrode that is arranged on one of the first and second end surfaces so as to be electrically connected to one
of the first and second internal electrodes; wherein

the external electrode includes a first conductive portion that is arranged on the one of the first and second end surfaces
so as to cover the exposed end of one of the first and second led out portions and so as not to wrap around onto the side
surfaces, and includes a second conductive portion that is arranged on the one of the first and second end surfaces so as
to cover the first conductive portion and so as to wrap around onto the principal surfaces and the side surfaces;

the external electrode does not include any insulating layers, nor are any insulating layers arranged between the first and
second internal electrodes and the external electrode;

a width of the first led out portion is less than a width of the first opposing portion and a width of the second led out
portion is less than a width of the second opposing portion;

the external electrode further includes a third conductive portion that wraps around and encapsulates all exposed portions
of the second conductive layer;

the external electrode includes a protruding portion that is arranged on the one of the first and second end surfaces so as
to be adjacent to the first conductive portion with a predetermined distance therebetween;

the protruding portion is electrically connected to the one of the first and second internal electrodes only through the first,
second, and third conductive portions; and

the protruding portion is spaced away from the first led out portion or the second led out portion exposed at the one of the
first and second end surfaces.

US Pat. No. 9,451,700

METHOD FOR PRODUCING MULTI-LAYER SUBSTRATE AND MULTI-LAYER SUBSTRATE

MURATA MANUFACTURING CO.,...

1. A method for producing a multi-layer substrate including sealing resin layers disposed on both of principal surfaces of
a core individual substrate, the method comprising:
(a) a step of mounting first surface mount devices on a first principal surface of a core parent substrate, wherein the core
parent substrate includes a plurality of the core individual substrates and has through holes formed in each of the core individual
substrates so as to extend therethrough;

(b) a first resin layer forming step of forming a first partially cured resin layer on the first principal surface and filling
the through holes with the first resin layer so that the first surface mount devices are sealed with the first resin layer;

(c) a step of mounting second surface mount devices on a second principal surface of the core parent substrate, wherein the
second principal surface is opposed to the first principal surface;

(d) a second resin layer forming step of forming a second partially cured resin layer on the second principal surface so that
the second surface mount devices are sealed with the second resin layer and the first partially cured resin layer and the
second partially cured resin layer are joined and integrated to each other at a predetermined region of the through holes;

(e) a main curing step of completely curing the first partially cured resin layer and the second partially cured resin layer
formed on the core parent substrate; and

(f) a dividing step of dividing at a predetermined position the core parent substrate provided with the first and second resin
layers completely cured in the main curing step to separate the core parent substrate into each core individual substrate.

US Pat. No. 9,419,320

NONRECIPROCAL CIRCUIT ELEMENT AND TRANSCEIVER DEVICE

Murata Manufacturing Co.,...

1. A nonreciprocal circuit element comprising:
a ferrite; and
a first center electrode and a second center electrode arranged on the ferrite so as to cross each other and be insulated
from each other, and to which a direct current magnetic field generated by the permanent magnet is applied; wherein

one end portion of the first center electrode is connected to one of a plurality of balanced input/output ports and a first
unbalanced input/output port and another end portion of the first center electrode is connected to ground;

one end portion of the second center electrode is connected to another port of the plurality of balanced input/output ports
and a second unbalanced input/output port and another end portion of the second center electrode is connected to the ground;

the one end portion of the first center electrode is connected to the ground via a first capacitor element; and
the one end portion of the second center electrode is connected to the ground via a second capacitor element.

US Pat. No. 9,368,293

SEPARATOR FOR POWER STORAGE DEVICE AND POWER STORAGE DEVICE

MURATA MANUFACTURING CO.,...

1. A separator for a power storage device, comprising a composite material which comprises inorganic microparticles and an
organic binder, wherein
(a) the composite material has a pigment volume concentration (PVC) which is determined by the following formula of 55% or
more,

PVC=(Volume of Inorganic Microparticles)÷(Volume of Inorganic Microparticles+Volume of Organic Binder)×100  (1)in which the Volume of Inorganic Microparticles is the weight of the inorganic microparticles divided by the density of the
inorganic microparticles, and the Volume of Organic Binder is the weight of the organic binder divided by the density of the
organic binder; and
(b) the inorganic microparticles have an average particle size in a range of 0.2 to 3.0 ?m, and a general particle shape index
in a range of 0.51 to 0.84, wherein the general particle shape index is the product of the degree of circularity for the inorganic
microparticles of the formula (2), and the degree of smoothness for the inorganic microparticles of formula (3),

Degree of Circularity=Equivalent Circle Diameter÷Equivalent Ellipse Major Axis  (2)
Degree of Smoothness=Equivalent Ellipse Outer Perimeter÷Outer Perimeter  (3).

US Pat. No. 9,355,781

LAMINATED CERAMIC CAPACITOR

MURATA MANUFACTURING CO.,...

1. A laminated ceramic capacitor comprising a laminate having a plurality of stacked ceramic layers and a plurality of internal
electrodes disposed at interfaces between ceramic layers; and a plurality of external electrodes disposed on an outer surface
of the laminate and electrically connected to internal electrodes,
wherein the ceramic layers interposed between adjacent internal electrodes have ceramic grains in contact with both of the
adjacent internal electrodes,

the internal electrodes are 0.42 ?m or greater and 0.60 ?m or less in thickness,
the ceramic layers are 0.5 ?m or greater and 0.8 ?m or less in thickness,
of 100 lines drawn perpendicular to the internal electrodes at an interval of the average grain size of the ceramic grains
in a cross section of the ceramic layer, the percentage of the number of lines on which ceramic grains are present in contact
with both of the adjacent internal electrodes is 5 to 20%, and

the ceramic layers contain, as their main constituent, a perovskite-type compound containing Ba and Ti, in which some of Ba
is optionally substituted with at least one of Ca and Sr, and some of Ti is optionally substituted with Zr.

US Pat. No. 9,287,629

IMPEDANCE CONVERSION DEVICE, ANTENNA DEVICE AND COMMUNICATION TERMINAL DEVICE

MURATA MANUFACTURING CO.,...

1. An impedance conversion device arranged to be inserted between an antenna element and a feeder circuit, the impedance conversion
device comprising:
a first circuit including a first inductance element connected to the feeder circuit; and
a second circuit including a second inductance element connected to the antenna element and coupled with the first inductance
element; wherein

the second circuit includes a capacitor connected to the second inductance element;
the capacitor is connected in parallel with the second inductance element; and
a first end of the first circuit is connected to the feeder circuit, a second end of the first circuit is connected to the
antenna element, a first end of the second circuit is connected to the antenna element and a second end of the second circuit
is connected to ground.

US Pat. No. 9,269,038

ANTENNA DEVICE, CARD-TYPE COMMUNICATION DEVICE, AND COMMUNICATION TERMINAL APPARATUS

MURATA MANUFACTURING CO.,...

1. An antenna device comprising:
a wireless communication tag including an antenna resonance circuit connected to an RFID IC chip and having a fixed resonant
frequency, the antenna resonance circuit including a first coil defining a radiation element capable of sending and receiving
a high-frequency signal with a reader/writer; and

a variable-frequency resonance element, which is an additional device to the wireless communication tag, including a variable-frequency
resonance circuit including a second coil being coupled with the first coil via an electromagnetic field and also including
a control circuit configured to sweep a resonant frequency of the variable-frequency resonance circuit within a predetermined
frequency band so as to sweep a resonant frequency of the antenna resonance circuit.

US Pat. No. 9,230,723

LAMINATED COMMON MODE CHOKE COIL AND HIGH FREQUENCY COMPONENT

MURATA MANUFACTURING CO.,...

1. A laminated common mode choke coil comprising:
a laminated element body including:
a plurality of base material layers laminated each other,
a primary coil; and
a secondary coil, the primary coil and the secondary coil being coupled to each other,
wherein the primary coil comprises a first coil element and a second coil element which are connected in series and the secondary
coil comprises a third coil element and a fourth coil element which are connected in series,

the first coil element and the fourth coil element are wound around a first winding axis, and the second coil element and
the third coil element are wound around a second winding axis which is different from the first winding axis,

the first coil element and the third coil element are disposed adjacently in a layer direction of the base material layer,
and the second coil element and the fourth coil element are disposed adjacently in the layer direction of the base material
layer, and

the first coil element and the second coil element are connected and the third coil element and the fourth coil element are
connected such that a magnetic field in the same direction is generated in the first coil element, the second coil element,
the third coil element and the fourth coil element when common mode current flows.

US Pat. No. 9,699,895

FLEXIBLE BOARD AND ELECTRONIC DEVICE

MURATA MANUFACTURING CO.,...

1. A flexible board comprising:
a first sheet section including a first principal surface;
a second sheet section including a second principal surface and provided in a different position from the first principal
surface in a normal direction to the first principal surface;

a first bent sheet section configured to connect ends of the first and second sheet sections, the first bent sheet section
including a third principal surface not parallel to the first and second principal surfaces;

a second bent sheet section including a fourth principal surface and provided in a different position from the third principal
surface in a normal direction to the third principal surface;

a signal line provided in or on the first sheet section, the second sheet section, and one of the first bent sheet section
and the second bent sheet section; and

a ground conductor provided in or on the first sheet section, the second sheet section, and the one of the first bent sheet
section and the second bent sheet section, so as to be parallel or substantially parallel to the signal line; wherein

the ground conductor is disposed so as not to be positioned at a connection between the first sheet section and the first
bent sheet section and a connection between the second sheet section and the first bent sheet section or so as not to be positioned
at a connection between the first sheet section and the second sheet bent section and a connection between the second sheet
section and the second bent sheet section.

US Pat. No. 9,385,586

SNUBBER CIRCUIT

MURATA MANUFACTURING CO.,...

1. A snubber circuit that suppresses a surge voltage generated in a rectifier circuit in a switching power supply device including
a transformer which includes a primary winding and a secondary winding connected to the rectifier circuit, a first switching
element which intermittently applies a DC power supply voltage to the primary winding, and a smoothing circuit which includes
a first coil connected to a stage subsequent to the rectifier circuit, the snubber circuit comprising:
a second switching element and a first capacitor which are connected in series between output nodes of the rectifier circuit;
and

a second coil which is electromagnetically coupled to the first coil such that a vibration voltage is generated between terminals
of the second coil when the surge voltage is generated in the rectifier circuit;

a differentiating circuit which differentiates a voltage between the terminals of the second coil; and
a voltage generation circuit which generates a control voltage obtained by smoothing an output voltage of the differentiating
circuit and applies the control voltage to a control terminal of the second switching element to cause the second switching
element to conduct; wherein

the voltage generation circuit includes a rectifying element which rectifies an output current from the second coil in a direction
of the control terminal of the second switching element.

US Pat. No. 9,373,431

NTC THERMISTOR ELEMENT AND METHOD AND METHOD FOR PRODUCING THE SAME

MURATA MANUFACTURING CO.,...

1. A NTC thermistor element comprising:
a substrate composed of a ceramic material containing Mn, Ni, Fe and Ti; and
a pair of external electrodes on the substrate, wherein
when a molar amount of Mn is a [mol %] and a molar amount of Ni is b [mol %], a and b satisfy a+b=100, 44.90?a?65.27 and 34.73?b?55.10,
and

when a molar amount of Fe is c [mol %] and a molar amount of Ti is d [mol %], c and d satisfy 24.22?c?39.57 and 5.04?d?10.18
based on a+b=100.

US Pat. No. 9,366,620

SPECIMEN MEASURING METHOD

MURATA MANUFACTURING CO.,...

1. A measuring method for measuring characteristics of a specimen comprising:
providing an aperture array structure having a specimen held thereto and having first and second principal surfaces, apertures,
and a liquid directly or indirectly on at least a part of the first principal surface in a state open to an atmosphere under
air pressure, wherein the apertures of the aperture array structure have a size which does not allow the liquid to leak from
the first principal surface to the second principal surface, wherein the specimen is held on the aperture array structure,
and wherein characteristics of the specimen change a place where the liquid is present on the aperture array structure,

applying an electromagnetic wave to the aperture array structure from the second principal surface, the second principal surface
being positioned on the opposite side to the first principal surface to which the liquid is attached, and

detecting frequency characteristics of the electromagnetic wave reflected by the aperture array.

US Pat. No. 9,355,775

CERAMIC ELECTRONIC COMPONENT

Murata Manufacturing Co.,...

1. A ceramic electronic component, comprising:
an electronic component body including a ceramic element assembly that includes two opposite main surfaces, two opposite end
surfaces, and two opposite side surfaces, and outer electrodes, each being configured to cover each of the end surfaces and
a portion of the side surfaces of the ceramic element assembly; and

metal terminals, each being connected to each of the outer electrodes at positions on both of the side surfaces of the ceramic
element assembly; wherein

each of the metal terminals includes:
a terminal body;
a plated film that is located on a surface of the terminal body;
terminal bonding portions that are connected to the outer electrode at positions on the side surfaces of the ceramic element
assembly;

a mounting portion which is connected to an electrode of a mounting substrate on which the ceramic electronic component is
mounted, and which faces a lower surface of the ceramic element assembly; and

extension portions, each being provided between each of the terminal bonding portions and the mounting portion to provide
a gap between a surface of the ceramic element assembly which faces the mounting substrate and the mounting portion;

the surface of the terminal body is exposed at a peripheral surface of the mounting portion;
each of the metal terminals has a U-shaped or substantially U-shaped cross-section;
the terminal bonding portions contact only the side surfaces of the ceramic element assembly; and
the terminal bonding portions do not contact the end surfaces or the main surfaces of the ceramic element assembly.

US Pat. No. 9,328,014

CERAMIC ELECTRONIC COMPONENT AND GLASS PASTE

Murata Manufacturing Co.,...

1. A ceramic electronic component comprising:
a ceramic body including a surface at which an end portion of an inner electrode is exposed;
a glass coating layer that covers a portion of the ceramic body at which the inner electrode is exposed; and
a terminal electrode disposed directly above the glass coating layer and including a plating film; wherein
the glass coating layer includes a glass medium and metal powder particles that are dispersed in the glass medium and define
conductive paths which electrically connect the inner electrode and the terminal electrode;

the metal powder particles include first metal powder particles, which are flat or substantially flat powder particles, and
second metal powder particles, which are spherical or substantially spherical powder particles; and

the conductive paths include a plurality of relatively narrow portions and a plurality of relatively thick portions.

US Pat. No. 9,324,491

INDUCTOR DEVICE AND ELECTRONIC APPARATUS

Murata Manufacturing Co.,...

1. An inductor device comprising:
a layer-laminated member including base-material layers laminated; and
a coil located in the layer-laminated member with a winding axis coincident with a direction of layer lamination; wherein
the layer-laminated member includes a smaller-thickness portion positioned near one end portion thereof in the direction of
layer lamination, and a greater-thickness portion with a greater number of base-material layers laminated therein than that
in the smaller-thickness portion;

the coil is located in the greater-thickness portion;
the coil is connected, at one end positioned near one end portion of the layer-laminated member, to a first terminal portion
in the smaller-thickness portion;

the coil is connected, at the other end positioned near the other end portion of the layer-laminated member, to a second terminal
portion in a base-material layer located near the other end portion of the layer-laminated member; and

the first terminal portion and the second terminal portion are located at respective different positions in the direction
of layer lamination.

US Pat. No. 9,318,684

SEMICONDUCTOR CERAMIC AND SEMICONDUCTOR CERAMIC ELEMENT

MURATA MANUFACTURING CO.,...

1. A semiconductor ceramic comprising a perovskite or pyrochlore oxide containing Dy or Er, nickel, and titanium, wherein
a part of said nickel is present as metal nickel, the semiconductor ceramic is a ferromagnetic substance, and the semiconductor
ceramic element has resistance change characteristics relative to temperature that are larger in a temperature range of about
0° C. to +80° C. than at temperatures immediately on either side of said temperature range.

US Pat. No. 9,246,462

METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE

Murata Manufacturing Co.,...

1. A method for manufacturing a piezoelectric device including a piezoelectric thin film and a support that supports the piezoelectric
thin film, the method comprising the steps of:
implanting an ionized element into a piezoelectric substrate such that a concentration peak of the ionized element implanted
into the piezoelectric substrate is formed in the piezoelectric substrate;

forming a stress layer on the piezoelectric substrate such that the stress layer causes a surface on an ion-implanted side
of the piezoelectric substrate to contract;

forming the support; and
heating the piezoelectric substrate to isolate the piezoelectric thin film from the piezoelectric substrate at the concentration
peak of the ionized element implanted into the piezoelectric substrate as an isolation plane.

US Pat. No. 9,236,845

CERAMIC MULTILAYER COMPONENT

MURATA MANUFACTURING CO.,...

1. A ceramic multilayer component, comprising:
a ceramic multilayer body including a plurality of ceramic layers stacked on top of one another;
an internal electrode located inside the ceramic multilayer body;
a terminal electrode located on a mounting surface of the ceramic multilayer body; and
a via hole conductor arranged inside the ceramic multilayer body so as to connect the internal electrode and the terminal
electrode to each other; wherein a surface of the ceramic multilayer body includes a first edge and an opposite second edge;

an insulating portion is arranged to extend as a single body across the surface of the ceramic multilayer body from the first
edge to the opposite second edge and across a surface of the terminal electrode;

the insulating portion covers at least a portion of the via hole conductor and covers a portion of the terminal electrode
when viewed from a side of the mounting surface;

the insulating portion has a surface area less than a surface area of each of the plurality of ceramic layers; and
the insulating portion is arranged to cover only a portion of an uppermost ceramic layer of the plurality of ceramic layers
while not covering another portion of the uppermost ceramic layer when viewed from the side of the mounting surface.

US Pat. No. 9,231,557

DUPLEXER

MURATA MANUFACTURING CO.,...

1. A duplexer comprising:
a transmitting filter including serial resonators and parallel resonators connected in a ladder configuration; and
a receiving filter; wherein
a resonator of the serial resonators and the parallel resonators in the transmitting filter that is arranged closest to a
common terminal of the transmitting filter and the receiving filter includes a surface acoustic wave resonator;

at least one resonator excluding the resonator that is arranged closest to the common terminal is defined by a film bulk acoustic
wave resonator;

the film bulk acoustic wave resonator defining at least one of the serial resonators and the parallel resonators in the transmitting
filter comprises:

a substrate; and
a vibrator having a piezoelectric thin film arranged between a pair of electrodes on one of the main surfaces of the substrate,
and being acoustically isolated from the substrate; and

any two adjacent sides of the vibrator including the pair of electrodes with the piezoelectric thin film sandwiched therebetween
are connected to each other in a smoothly curved corner when viewed in the direction of thickness of the vibrator.

US Pat. No. 9,190,914

SWITCHING POWER SUPPLY APPARATUS

Murata Manufacturing Co.,...

1. A switching power supply apparatus comprising:
a transformer including an input unit, a main output unit, and a sub-output unit;
a switch circuit that switches between application of and stopping application of a voltage to the input unit;
a main rectifying and smoothing circuit that rectifies and smoothes an induced voltage received from the main output unit
and outputs a main output voltage;

a converter unit that steps up or steps down the main output voltage and outputs stepped up or stepped down voltage to a main
load in a subsequent stage;

a sub-rectifying and smoothing circuit that is provided in the sub-output unit and, through switching of a switch device,
rectifies and smoothes an induced voltage received from the sub-output unit and outputs the rectified and smoothed voltage
to a sub-load connected to the sub-rectifying and smoothing circuit;

a first control unit that performs switching control of the switch circuit based on a feedback signal corresponding to the
main output voltage;

a second control unit that, based on a set target value, performs switching control of the switch device of the sub-rectifying
and smoothing circuit and drives the sub-load;

a detection unit that detects information regarding a load status of the main load; and
a changing unit that changes the target value based on the information detected by the detection unit.

US Pat. No. 9,191,005

LEVEL CONVERSION CIRCUIT AND LEVEL-CONVERSION-FUNCTION-EQUIPPED LOGIC CIRCUIT

MURATA MANUFACTURING CO.,...

1. A level conversion circuit connected upstream of a logic circuit, the level conversion circuit comprising:
a first enhancement type FET having a drain and a gate,
a first resistor for voltage maintenance connected between a source of the first enhancement type FET and a ground, and
voltage shifting means and current restriction means connected in series with each other between the drain and the gate of
the first enhancement type FET and a control voltage input terminal, wherein

the gate of the first enhancement type FET is connected to a gate of a second enhancement type FET and wherein the second
enhancement type FET serves as an input FET of the logic circuit.

US Pat. No. 9,105,603

LAMINATE TYPE SEMICONDUCTOR CERAMIC CAPACITOR WITH VARISTOR FUNCTIONALITY AND METHOD FOR MANUFACTURING THE SAME

MURATA MANUFACTURING CO.,...

1. A laminate type semiconductor ceramic capacitor with varistor functionality, the capacitor comprising:
a laminated sintered body having a plurality of alternately stacked semiconductor ceramic layers and internal electrode layers,
the semiconductor ceramic layers comprising a SrTiO3 based grain boundary insulated semiconductor ceramic; and

external electrodes on opposed ends of the laminated sintered body, the external electrodes electrically connected to respective
sets of the internal electrode layers,

wherein the semiconductor ceramic has a compounding molar ratio m between the Sr site and the Ti site to satisfy 1.000?m?1.020,
has a donor element present as a solid solution in crystal grains, has an acceptor element present in a grain boundary layer
in a range of 0.5 mol or less and greater than 0 mol with respect to 100 mol of the Ti element, contains a Zr element in a
range of 0.15 mol or more and 3.0 mol or less with respect to 100 mol of the Ti element, and the crystal grains are 1.5 ?m
or less in average grain size.

US Pat. No. 9,417,737

TOUCH PANEL, AND TOUCH-TYPE INPUT APPARATUS AND CONTROL METHOD THEREFOR

MURATA MANUFACTURING CO.,...

1. A touch panel comprising:
a piezoelectric sheet of poly-L-lactic acid having a stretching axis oriented in a predetermined direction; and
a plurality of electrodes on said piezoelectric sheet;
said piezoelectric sheet is in such a condition that tension is imparted in a direction that forms approximately a 45 degree
angle with said stretching axis.

US Pat. No. 9,418,790

METHOD FOR MANUFACTURING A MULTILAYER CERAMIC ELECTRONIC COMPONENT

Murata Manufacturing Co.,...

1. A method for manufacturing a multilayer ceramic electronic component, comprising the steps of:
providing a ceramic base body which includes stacked ceramic layers and internal conductors, the internal conductors including
exposed portions that are exposed at external surfaces of the ceramic base body;

plating the ceramic base body to deposit Cu plating films directly on the exposed portions of the internal conductors; and
heat treating the ceramic base body so as to generate Cu oxide in the Cu plating films, to make the multilayer ceramic electronic
component.

US Pat. No. 9,412,503

ELECTRONIC COMPONENT INCLUDING OUTER ELECTRODES PROVIDED ON END PORTIONS OF A SURFACE OF AN ELECTRONIC COMPONENT BODY

MURATA MANUFACTURING CO.,...

1. An electronic component comprising:
an electronic component body including first and second surfaces that extend in a first direction and a second direction perpendicular
to the first direction, third and fourth surfaces that extend in the first direction and a third direction perpendicular to
the first and second directions, and fifth and sixth surfaces that extend in the second and third directions;

a first inner electrode that is provided in the electronic component body and extends to a first end portion of the first
surface in the first direction;

a second inner electrode that is provided in the electronic component body so as to oppose the first inner electrode in the
second direction and extends to a second end portion of the first surface in the first direction;

a first outer electrode provided on the first end portion of the first surface in the first direction and connected to the
first inner electrode; and

a second outer electrode provided on the second end portion of the first surface in the first direction and connected to the
second inner electrode; wherein

the first and second outer electrodes are disposed only on the first surface and are spaced away from outer edges of the first
surface; and

when L0 is a dimension of the electronic component body in the first direction, L1 is a distance between the first outer electrode and the second outer electrode on the first surface in the first direction,
L2 is a dimension of each of the first and second outer electrodes on the first surface in the first direction, and L3 is a dimension of the electronic component body in the second direction, L0>L3, 0%

US Pat. No. 9,390,876

LAMINATE-TYPE ACTUATOR

Murata Manufacturing Co.,...

1. A laminate-type actuator comprising
a laminate including an electrostrictive material layer wound and laminated in a form of a tube together with first and second
electrodes sandwiching the electrostrictive material layer therebetween,

the laminate including a pair of flat portions facing each other and a pair of curved portions interconnecting the pair of
flat portions circumferentially and having spaces inside the curved portions, and in a cross-section perpendicular to an axis
of the laminate, an outer width formed by the pair of flat portions being smaller than an outer width of each of the curved
portions, and a distance between the pair of flat portions being smaller than an inner width of each of the curved portions.

US Pat. No. 9,337,797

HIGH FREQUENCY MODULE

Murata Manufacturing Co.,...

1. A high frequency module comprising:
a multilayer substrate;
a high frequency amplifier circuit mounted on the multilayer substrate;
a thermal via provided in the multilayer substrate directly below the high frequency amplifier circuit and configured to dissipate
heat of the high frequency amplifier circuit; and

an LC circuit included in the multilayer substrate and connected to the high frequency amplifier circuit, the LC circuit including
an inductor and a capacitor; wherein

the thermal via defines the inductor; and
the LC circuit overlaps the high frequency amplifier circuit when viewed in a lamination direction of the multilayer substrate.

US Pat. No. 9,330,353

ANTENNA MODULE

Murata Manufacturing Co.,...

1. An antenna module comprising:
a base including two opposing mounting surfaces;
an antenna coil provided on or in the base so as to define an opening, the antenna coil having a shape that is symmetrical
or substantially symmetrical with respect to a reference plane; and

an IC chip and a plurality of electronic components mounted on one of the mounting surfaces and electrically coupled to the
antenna coil, the IC chip and the electronic components being arranged inside the opening when viewed in plan from a normal
direction of the mounting surfaces; wherein

at least two of the plurality of electronic components are arranged so as to be symmetrical or substantially symmetrical to
each other with respect to the reference plane when viewed in plan from the normal direction; and

the at least two of the plurality of electronic components that are arranged so as to be symmetrical or substantially symmetrical
to each other with respect to the reference plane are surface-mounted electronic components and the at least two of the plurality
of electronic components that are arranged so as to be symmetrical or substantially symmetrical to each other with respect
to the reference plane are surface-mounted electronic components.

US Pat. No. 9,331,658

FILTER CIRCUIT

MURATA MANUFACTURING CO.,...

1. A filter circuit comprising:
a first circuit connected to a first terminal;
a second circuit connected to a second terminal and the first circuit;
a third circuit connected to a third terminal, the first circuit, and ground;
an external connection capacitor including a first end connected directly to a connection point between the first and third
circuits and a second end connected directly to an external control terminal; and

the external connection capacitor and the third circuit define an LC parallel resonator; wherein
the first and second circuits constitute a first filter circuit;
the first and third circuits constitute a second filter circuit;
the third circuit includes an LC parallel resonant circuit;
a first end of the LC parallel resonant circuit is connected to the connection point; and
a second end of the LC parallel resonant circuit is connected to ground.

US Pat. No. 9,276,550

IMPEDANCE MATCHING SWITCH CIRCUIT, IMPEDANCE MATCHING SWITCH CIRCUIT MODULE, AND IMPEDANCE MATCHING CIRCUIT MODULE

MURATA MANUFACTURING CO.,...

1. An impedance matching switch circuit module comprising:
an impedance matching switch circuit comprising:
a first high-frequency input/output terminal and a second high-frequency input/output terminal defining input/output terminals
for a high-frequency signal;

a first matching terminal configured to be connected to an external matching element;
a first switch device connected between the first high-frequency input/output terminal and the second high-frequency input/output
terminal; and

a second switch device connected between the first matching terminal and a first high-frequency input/output terminal side
of the first switch device or a second high-frequency input/output terminal side of the first switch device;

a switch IC including the first switch device and the second switch device provided therein; and
a base body having a rectangular or substantially rectangular shape; wherein
the switch IC is mounted on a front surface of the base body, and the first high-frequency input/output terminal, the second
high-frequency input/output terminal, the first matching terminal, and a plurality of terminals configured to perform driving
control of the switch IC are provided on a back surface of the base body opposite to the front surface of the base body;

a first group including the first high-frequency input/output terminal and the second high-frequency input/output terminal,
a second group including the first matching terminal, and a third group including the plurality of terminals configured to
perform driving control of the switch IC are arranged in a first direction of the back surface; and

the first group and the second group are adjacent to each other in the first direction.

US Pat. No. 9,111,690

MULTILAYER ELECTRONIC COMPONENT

Murata Manufacturing Co.,...

1. A multilayer electronic component comprising:
a multilayer composite including a stack of a plurality of insulating layers and an internal electrode primarily composed
of a base metal and extending along interfaces between the plurality of insulating layers, one end of the internal electrode
being exposed at a predetermined surface of the multilayer composite; and

a plating layer disposed directly on the predetermined surface of the multilayer composite so as to be electrically connected
to the exposed end of the internal electrode; wherein

a metal film primarily composed of at least one metal selected from the group consisting of Pd, Au, Pt, and Ag is disposed
only on the exposed end of the internal electrode and is not disposed on the predetermined surface of the multilayer composite.

US Pat. No. 9,413,415

HIGH FREQUENCY MODULE

MURATA MANUFACTURING CO.,...

1. A high frequency module, comprising:
an antenna switch including:
an antenna terminal connected to an antenna,
a plurality of signal terminals corresponding to a plurality of communication systems,
a control terminal configured to supply, to the antenna terminal, a first control signal as a direct current voltage of an
antenna potential,

a transmission/reception transistor circuit configured to switch connection or non-connection between a transmission/reception
signal terminal among the plurality of signal terminals and the antenna terminal, a transmission/reception signal being input/output
to and from the transmission/reception signal terminal, and

a transmission transistor circuit configured to switch connection or non-connection between a transmission signal terminal
among the plurality of signal terminals and the antenna terminal, a transmission signal being input to the transmission signal
terminal, and

configured to switch connection or non-connection between the plurality of signal terminals and the antenna terminal, respectively;
a logic unit configured to activate the antenna switch; and
a voltage generation circuit configured to generate the first control signal and a second control signal, based on a control
signal output from the logic unit, wherein

for the transmission/reception transistor circuit, the second control signal for turning ON or OFF the transmission/reception
transistor circuit is input to a gate, the transmission/reception signal terminal is connected to one end of a source/drain,
and the antenna terminal and the control terminal are connected to another end of the source/drain, and

the voltage generation circuit is configured to generate the first control signal to be provided to the control terminal and
the second control signal for turning ON the transmission/reception transistor circuit based on the control signal output
from the logic unit, and a voltage level of the second control signal is a voltage level that is higher than that of the first
control signal.

US Pat. No. 9,397,575

SWITCHING POWER SUPPLY DEVICE

Murata Manufacturing Co.,...

1. A switching power supply device, comprising:
a power supply voltage input unit configured to accept input of an input power supply voltage;
a direct current voltage output unit configured to receive output of a direct current voltage;
a transformer including a primary winding and a secondary winding;
a low side switching element connected in series to the primary winding and configured to apply a voltage at the power supply
voltage input unit to the primary winding upon being turned on;

a switching control circuit configured to control the low side switching element; and
a rectifying smoothing circuit configured to rectify and smooth a voltage output from the secondary winding and output an
output voltage to the direct current voltage output unit; wherein

the switching control circuit includes:
a current-mode-controlling switching control IC that includes:
a current detection terminal, to which a current that is supposed to flow through a power conversion circuit during an on
time of a switching element in the power conversion circuit is detected as a voltage signal and is input;

a feedback terminal;
a zero voltage timing detection terminal; and
a switching element control signal output terminal; wherein
the current-mode-controlling switching control IC is configured to output a drive signal that causes the low side switching
element to turn off from the switching element control signal output terminal in response to a voltage applied to the current
detection terminal reaching a voltage applied to the feedback terminal;

a feedback voltage signal generating circuit configured to generate a feedback voltage signal based on the output voltage
and apply the generated feedback voltage signal to the feedback terminal;

a drive voltage signal output unit configured to receive a signal input to the zero voltage timing detection terminal and
output, upon detecting an inversion of a voltage polarity in the transformer, a drive voltage signal that causes the low side
switching element to turn on; and

a reference voltage generating circuit configured to generate a reference voltage of which a voltage increases monotonously
along with a time that has elapsed since the drive voltage signal has been output and function as a voltage-time conversion
circuit by inputting the generated reference voltage to the current detection terminal; and

in a power conversion operation in which a current flowing through the low side switching element during an on time of the
low side switching element does not increase monotonously along with the time that has elapsed, the current-mode-controlling
switching control IC is used.

US Pat. No. 9,378,890

CERAMIC CAPACITOR HAVING A SMALL VARIATION IN CAPACITY

Murata Manufacturing Co.,...

1. A ceramic capacitor comprising:
a ceramic base including a first and a second primary surface extending along a length direction and a width direction, a
first and a second side surface extending along the length direction and a thickness direction, and a first and a second end
surface extending along the width direction and the thickness direction;

first internal electrodes which extend in the ceramic base along the length direction and the width direction and which are
exposed at the first end surface;

second internal electrodes which are arranged in the ceramic base to face the first internal electrodes in the thickness direction
and which are exposed at the second end surface;

a first external electrode which is electrically connected to the first internal electrodes and includes a first portion arranged
on the first end surface, second portions arranged on the first and second primary surfaces, and third portions arranged on
the first and second side surfaces, and which includes Ag at least in a surface layer thereof; and

a second external electrode which is electrically connected to the second internal electrodes and includes a fourth portion
arranged on the second end surface, fifth portions arranged on the first and second primary surfaces, and sixth portions arranged
on the first and second side surfaces, and which includes Ag at least in a surface layer thereof; wherein

the first external electrode and the second external electrode each include a first metal layer and a second metal layer covering
the first metal layer;

ends of the second portions and the third portions of the second metal layer of the first external electrode are in contact
with the surface of the ceramic base;

ends of the fifth portions and the sixth portions of the second metal layer of the second external electrode are in contact
with the surface of the ceramic base;

when a voltage that is about two times a rated voltage is applied between the first external electrode and the second external
electrode, an electric field intensity generated at a portion connected between a corner portion of the first internal electrode
and the end of the sixth portion at a side of the first end surface by a shortest distance FS is about 0.34 kV/mm or less; and

FS?461 ?m.

US Pat. No. 9,373,954

ESD PROTECTION DEVICE AND METHOD FOR PRODUCING THE SAME

MURATA MANUFACTURING CO.,...

1. An ESD protection device comprising:
a first discharge electrode and a second discharge electrode that are disposed so as to face each other;
a discharge auxiliary electrode formed so as to span between the first discharge electrode and the second discharge electrode;
and

an insulator base that holds the first discharge electrode, the second discharge electrode, and the discharge auxiliary electrode,
wherein the discharge auxiliary electrode includes a plurality of metal particles containing a first metal as a main component,
and

the metal particles have a fractal dimension D of 1.03 or more.

US Pat. No. 9,341,561

APERTURE ARRAY STRUCTURE AND MEASUREMENT METHOD USING THE SAME

MURATA MANUFACTURING CO.,...

1. An aperture array structure comprising:
a first principal surface;
a second principal surface opposed to the first principal surface; and
a plurality of apertures extending through the aperture array structure in a direction perpendicular to the first principal
surface and the second principal surface, wherein

a first opening area of each aperture at the first principal surface is smaller than a second opening area of each aperture
at the second principal surface, and

an inner wall of each aperture has a recess.

US Pat. No. 9,333,593

JOINING METHOD, JOINT STRUCTURE AND METHOD FOR PRODUCING THE SAME

MURATA MANUFACTURING CO.,...

1. A method of joining objects to each other, the method comprising:
locating an insert material between a first joining object and a second joining object, the first joining object and/or the
second joining object having a first metal composed of Sn or an alloy containing Sn,

the insert material containing, as a main component, a second metal which is an alloy containing at least one selected from
among Cu—Ni, Cu—Mn, Cu—Al and Cu—Cr alloys, which each contain 70% or more of Cu, the first metal having a lower melting point
than the second metal; and

subjecting the first joining object and the second joining object to a heat treatment while the insert material is located
therebetween until an intermetallic compound of the first metal and the second metal is produced such that the first joining
object and the second joining object are joined to each other.

US Pat. No. 9,253,881

MULTILAYER FLEXIBLE SUBSTRATE

Murata Manufacturing Co.,...

1. A multilayer flexible substrate comprising: a first structural layer including at least one resin sheet including a first
insulating layer, a first wiring conductor provided on a principal surface of the first insulating layer, and first filled
vias provided in the first insulating layer; and a second structural layer which is provided on a portion of a principal surface
of the first structural layer and which includes at least one resin sheet including a second insulating layer, a second wiring
conductor provided on a principal surface of the second insulating layer, and a second filled via disposed in the second insulating
layer; wherein the multilayer flexible substrate includes a rigid region including a portion of the first structural layer
and the second structural layer and a flexible region that is more flexible than the rigid region and including another portion
of the first structural layer; the first filled vias are provided in the rigid region and in the flexible region; the first
filled vias provided in the flexible region have a higher porosity than the second filled via provided in the second structural
layer.

US Pat. No. 9,241,402

FLEXIBLE MULTILAYER SUBSTRATE

MURATA MANUFACTURING CO.,...

1. A flexible multilayer substrate, comprising:
a stacked body including a plurality of stacked resin layers extending in a longitudinal direction and defining a flexible
portion; wherein

the stacked body includes an innermost surface that is a surface located inside when both ends in the longitudinal direction
are bent to come closer to each other, and an outermost surface that is a surface located outside when both ends in the longitudinal
direction are bent to come closer to each other;

a plurality of conductor patterns are arranged inside the stacked body and distributed over a surface of one or more of the
plurality of resin layers;

a portion located on an innermost surface side with respect to a center plane of the stacked body in a thickness direction
is a first portion, a portion located on an outermost surface side with respect to the center plane of the stacked body in
a thickness direction is a second portion, and an area having a minimum spacing along the longitudinal direction between the
conductor patterns arranged on a same surface of a resin layer of the plurality of resin layers, is located in the second
portion; and

the stacked body includes an area having a spacing which extends along the longitudinal direction between the conductor patterns
arranged on a same surface of a resin layer of the plurality of resin layers and which is larger than the minimum spacing.

US Pat. No. 9,196,818

BOUNDARY ACOUSTIC WAVE DEVICE

Murata Manufacturing Co.,...


US Pat. No. 9,188,616

MODULE AND CAPACITANCE DETECTING METHOD

MURATA MANUFACTURING CO.,...

1. A module, comprising:
(a) a current path connected to an object of detection and including a capacitance component; and
(b) a capacitance detecting circuit supplying a constant current to said object of detection through said current path, for
determining a capacitance value of said object of detection, said capacitance value detecting circuit including:

(1) a constant current source supplying said constant current to a voltage detection point;
(2) a storage unit storing: (a) first data, obtained in advance of said determination of said capacitance value, concerning
a time it takes to charge a capacitance element having a known capacitance value to said prescribed voltage when said constant
current is applied to said capacitance element and (b) second data, obtained in advance of said detection of said capacitance
value, concerning a time it takes to charge said capacitance component to said prescribed voltage when said constant current
is applied to said capacitive component;

(3) a charge/discharge circuit connecting said current path to said voltage detection point to charge both said object of
detection and said capacitance component, and disconnecting said current path from said voltage detection point to discharge
both said object of detection and said capacitance component;

(4) a time measuring circuit generating a third data indicative of a time it takes to charge said object of detection and
said capacitance component with said constant current to cause said voltage detection point to attain said prescribed voltage;
and

(5) an operation unit:
(a) generating fourth data representing a time it takes to charge said object of detection from a difference between said
third data and said second data; and

(b) calculating a capacitance value of said object of detection based on a ratio between said third data and said first data.

US Pat. No. 9,130,467

SWITCHING POWER SUPPLY DEVICE

Murata Manufacturing Co.,...

1. A switching power supply device, comprising:
a transformer including at least a primary winding and a secondary winding;
a primary side circuit including
a primary side resonant inductor formed so as to be equivalent to and in series with the primary winding,
a primary side resonant capacitor forming, together with the primary side resonant inductor, a primary side resonant circuit,
and

a primary side alternating current voltage generation circuit including at least two switching elements and configured to
generate a trapezoidal wave alternating current voltage from an input direct current power supply voltage and to provide the
trapezoidal wave alternating current voltage to the primary side resonant circuit; and

a secondary side circuit including
a secondary side resonant inductor formed so as to be equivalent to and in series with the secondary winding,
a secondary side resonant capacitor forming, together with the secondary side resonant inductor, a secondary side resonant
circuit, and

a secondary side rectifying circuit including a rectifying element and configured to rectify an alternating current outputted
from the secondary side resonant circuit to obtain a direct current voltage,

wherein a mutual inductance is formed equivalently through mutual induction between the primary winding and the secondary
winding, and a multi-resonant circuit that includes a plurality of LC resonant circuits is formed at least by the primary
side circuit and the secondary side circuit, and

wherein, with the multi-resonant circuit,
the primary side resonant circuit and the secondary side resonant circuit resonate with each other, and electric power is
transmitted from the primary side circuit to the secondary side circuit through magnetic field resonant coupling in which
a current flows in the mutual inductance;

energy that is not transmitted from the primary winding is retained in the primary side resonant circuit as resonant energy
through a resonance phenomenon;

of energy which the secondary winding has received, energy that is not supplied to an output is retained in the secondary
side resonant circuit as resonant energy through a resonance phenomenon; and

the secondary side resonant circuit forms a current path that is different from a current path in which the rectifying element
is formed in series to transmit electric power from the primary winding to the secondary winding.

US Pat. No. 9,130,483

PIEZOELECTRIC POWER GENERATOR

MURATA MANUFACTURING CO.,...

1. A piezoelectric power generator comprising:
a first elastic body configured to deform upon receiving a stress, the first elastic body including:
an elastic body main portion,
a first abutting portion that is fixed to the elastic body main portion and is positioned adjacent a first side of the second
elastic body, and

a second abutting portion that is fixed to the elastic body main portion and is positioned adjacent a second side of the second
elastic body, where the first side of the second elastic body is opposite the second side of the elastic main body;

a piezoelectric power-generating element that includes a second elastic body arranged adjacent a first side of the first elastic
body; and

a vibration suppressing member arranged relative to the first elastic body and the second elastic body so as to suppress a
bending mode vibration of the second elastic body,

wherein the piezoelectric power generator is structured such that, when the first elastic body deforms into a shape that is
concave relative to the first side of the first elastic body, the second elastic body receives a stress from the first elastic
body and deforms into a concave shape, and when the first elastic body deforms into a shape that is convex relative to the
first side of the first elastic body, the second elastic body does not receive a stress from the first elastic body, and

wherein the first and second abutting portions abut against the second elastic body when the first elastic body deforms into
the shape that is concave relative to the first side of the first elastic body.

US Pat. No. 9,130,540

HIGH-FREQUENCY MODULE HAVING INDUCTORS DISPOSED WITH DIRECTIONS OF THEIR POLARITIES OPPOSITE TO EACH OTHER

Murata Manufacturing Co.,...

1. A high-frequency module comprising:
an antenna-side terminal connected to an antenna terminal;
a transmission signal terminal;
first and second reception balanced signal terminals;
a transmission filter connected between the antenna terminal and the transmission signal terminal;
a reception filter connected between the antenna terminal and the first and second reception balanced signal terminals, the
reception filter having a balanced-unbalanced transforming function;

a plurality of inductors connected between the reception filter and the first or second reception balanced signal terminal;
a mount board;
a wave splitter chip mounted on one principal surface of the mount board and including the transmission filter and the reception
filter; and

a plurality of inductor chips mounted on the one principal surface of the mount board and including the plurality of inductors;
wherein

the plurality of inductor chips include a first inductor chip including a first inductor connected between the reception filter
and the first reception balance signal terminal and a second inductor chip including a second inductor connected between the
reception filter and the second reception balance signal terminal; and

the first and second inductor chips are disposed adjacent to each other, each of the first and second inductor chips has a
polarity, and the first and second inductor chips are arranged such that directions of the polarities are opposite to each
other, as viewed from the reception filter.

US Pat. No. 9,101,085

EXPANDING DEVICE AND METHOD FOR MANUFACTURING COMPONENTS

Murata Manufacturing Co.,...

1. An expanding device comprising:
a heating table on a top surface of which a central first portion of an adhesive tape, including a portion with a wafer attached
thereto, is provided;

a non-heated ring arranged to surround an outer peripheral edge of the heating table;
a heat insulation which is provided on an upper surface of the non-heated ring and on which a second portion of the adhesive
tape located outwardly of the first portion thereof is directly or indirectly provided;

a holder arranged to hold a third portion of the adhesive tape located outwardly of the second portion; and
a drive unit arranged to move the heating table and the non-heated ring up and down relative to the holder to expand the adhesive
tape.

US Pat. No. 9,532,447

MULTI-LAYER RESIN SUBSTRATE AND METHOD OF MANUFACTURING MULTI-LAYER RESIN SUBSTRATE

MURATA MANUFACTURING CO.,...

1. A multi-layer resin substrate integrated by stacking and thermocompression bonding a plurality of resin layers each composed
of a thermoplastic resin as a main material and having a main surface,
said plurality of resin layers including a resin layer having a pattern member arranged on said main surface, and
a surface of at least one resin layer of said plurality of resin layers having a paint layer, which is obtained by applying
a thermoplastic resin paint to a region corresponding to a region insufficient in thickness as a stack as a whole during a
process for stacking and thermocompression bonding said plurality of resin layers.

US Pat. No. 9,442,032

MICROELECTROMECHANICAL PRESSURE SENSOR WITH ROBUST DIAPHRAGM

MURATA MANUFACTURING CO.,...

1. A microelectromechanical pressure sensor structure that comprises a body structure and a diaphragm plate, wherein
the body structure comprises a planar base and side walls;
a first surface extends along the planar base;
the side walls extend as a circumference away from the planar base;
the diaphragm plate extends on the side walls along a second surface;
the planar base, the side walls and the diaphragm plate are attached to each other such that the first surface, the second
surface and inner surfaces of the side walls form a hermetically closed gap in a reference pressure;

a top edge of the inner surfaces of the side walls forms a circumference of a diaphragm that has a length and a width in the
direction of the second surface, wherein the length is in a direction of the longest extent of the diaphragm, and the width
is in a direction perpendicular the direction of the length in the direction of the second surface; and

the length of the diaphragm is at least three times the width of the diaphragm.

US Pat. No. 9,413,324

ELECTRONIC COMPONENT

Murata Manufacturing Co.,...

1. An electronic component comprising:
an input port;
a first output port;
a ground port;
a first capacitor and a second capacitor that are electrically connected in series to one another in a path between the input
port and the first output port;

a first inductor connected between the ground port and a portion of the path between the input port and the first output port;
a second inductor electrically connected in parallel to the second capacitor; and
a first sub line; wherein
the second inductor and the first sub line define a first directional coupler by generating electromagnetic coupling therebetween.

US Pat. No. 9,368,808

ELECTRICAL CONNECTION MATERIAL FOR SOLID OXIDE FUEL CELL, SOLID OXIDE FUEL CELL, SOLID OXIDE FUEL CELL MODULE, AND METHOD FOR MANUFACTURING SOLID OXIDE FUEL CELL

MURATA MANUFACTURING CO.,...

1. A solid oxide fuel cell comprising:
an electrical connection comprising, stacked in the following order, a first ceramic porous layer, a first ceramic dense layer,
a second ceramic porous layer, a second ceramic dense layer, and a third ceramic porous layer, the first and second ceramic
dense layers having a porosity lower than a porosity of the first, second and third ceramic porous layers; and

a plurality of power generation cells electrically connected to each other via the electrical connection.

US Pat. No. 9,370,092

MULTILAYER WIRING BOARD

Murata Manufacturing Co.,...

1. A multilayer wiring board comprising:
a multilayer body including a plurality of insulating layers stacked on each other, the multilayer wiring board including:
a ground electrode located at a center or approximate center of one principal surface of the multilayer body;
a plurality of individual electrodes located at an outer edge of the one principal surface of the multilayer body; and
a surface insulating film including an interelectrode insulating portion and a surface covering portion, the interelectrode
insulating portion covering an edge portion of the ground electrode to provide insulation between the ground electrode and
each of the plurality of individual electrodes, the surface covering portion being disposed on a surface of the ground electrode
to divide the ground electrode into a plurality of regions; wherein

at least a central portion of the ground electrode located at the center or the approximate center of the one principal surface
of the multilayer body is exposed to an outside of the multilayer body.

US Pat. No. 9,368,712

SURFACE ACOUSTIC WAVE DEVICE

MURATA MANUFACTURING CO.,...

1. A surface acoustic wave device comprising:
a piezoelectric substrate including a groove located in a surface thereof;
an IDT electrode including a first electrode layer located in the groove and a second electrode layer located outside the
groove; and

a dielectric film arranged on the piezoelectric substrate so as to cover the IDT electrode; wherein
the second electrode layer is tapered toward a side opposite to the piezoelectric substrate, and
a cross-sectional shape of the second electrode layer is trapezoidal, and a ratio T/R of a length T of an upper base to a
length R of a lower base in a cross section of the second electrode layer is within a range of about 0.86 to about 0.98.

US Pat. No. 9,300,019

HIGH-FREQUENCY MODULE

Murata Manufacturing Co.,...

1. A high-frequency module comprising:
a multilayer substrate including a plurality of dielectric layers, wiring conductors located on the dielectric layers, and
interlayer connection conductors extending through the dielectric layers in a thickness direction;

a high-frequency switch and an electronic component mounted on a first main surface of the multilayer substrate; and
a control signal input terminal that is located on a second main surface of the multilayer substrate and that receives a control
signal for the high-frequency switch; wherein

a control signal wiring conductor connected to the control signal input terminal and located on of the dielectric layers adjacent
to the second main surface of the multilayer substrate;

a high-frequency signal wiring conductor through which a high-frequency signal of the high-frequency switch flows is located
on one of the dielectric layers adjacent to the first main surface of the multilayer substrate; and

the control signal for the high-frequency switch received by the high-frequency switch from the control signal input terminal
includes a serial data signal and a clock signal.

US Pat. No. 9,275,804

CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME

Murata Manufacturing Co.,...

1. A ceramic electronic component comprising:
a ceramic body including a plurality of internal electrodes including ends that are exposed on a surface of the ceramic body;
a glass coating layer covering a portion of the ceramic body on which the plurality of internal electrodes are exposed; and
an electrode terminal provided directly on the glass coating layer and including a plating film; wherein
the glass coating layer is made of a glass medium in which metal powder particles are dispersed;
the glass coating layer is a composite film in which the glass medium and the metal powder particles are integrally bonded;
the glass coating layer has a thickness of about 1 ?m to about 10 ?m;
the metal powder particles define conduction paths electrically connecting the plurality of internal electrodes with the electrode
terminal;

all of the metal powder particles are not sintered together and the glass medium is continuously arranged to fill spaces between
the metal powder particles.

US Pat. No. 9,263,190

MULTILAYER CERAMIC CAPACITOR HAVING HIGH MOISTURE RESISTANCE

Murata Manufacturing Co.,...

1. A multilayer ceramic capacitor comprising:
a ceramic multilayer body including a plurality of dielectric ceramic layers and a plurality of inner electrodes alternately
stacked; and

outer electrodes provided on an outer surface of the ceramic multilayer body and electrically connected to the inner electrodes;
wherein

the dielectric ceramic layers include a perovskite-type compound containing Ba and Ti; and
when a region within an electrically effective portion of the dielectric ceramic layers sandwiched between the inner electrodes,
the region being positioned near an area where the inner electrode and the outer electrode connect to each other, is observed
with a transmission electron microscope (TEM) and is subjected to a mapping analysis using energy dispersive X-ray spectroscopy
(EDS);

a relationship ((L2?L3)/L1)×100?50 is satisfied, where L1 denotes a total length of ceramic grain boundaries, which are detected from a TEM transmission image obtained with the TEM
observation, L2 denotes a total length of grain boundaries where the rare earth element is present, which are detected from a mapping image
obtained with the mapping analysis and the TEM transmission image, and L3 denotes a total length of portions in which the grain boundaries where the rare earth element is present and grain boundaries
where at least one of Mn, Mg, and Si is present are overlapped, the portions being detected from a mapping image obtained
with the mapping analysis and the TEM transmission image; and

a total number of the stacked inner electrodes is 100 layers or greater.

US Pat. No. 9,240,543

METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE

MURATA MANUFACTURING CO.,...

1. A method for manufacturing a piezoelectric device comprising:
a step of forming an ion implantation layer by implanting ions into a piezoelectric substrate;
a step of forming an adhesive layer on the piezoelectric substrate;
a step of forming a supporting body on the piezoelectric substrate in which the ion implantation layer has been formed; and
a step of detaching a layer of the piezoelectric substrate in which the ion implantation layer has been formed to form a piezoelectric
thin film by heating the piezoelectric substrate; wherein

the piezoelectric substrate is composed of lithium tantalate;
in the step of detaching the layer of the piezoelectric substrate to form the piezoelectric thin film, the piezoelectric substrate
in which the ion implantation layer has been formed is heated at a reduced pressure less than atmospheric pressure of about
5000 Pa or less and at a heating temperature of about 350° C. or less; and

the adhesive layer is directly bonded to an adhesive surface of the supporting body by a surface activated bonding method
in which bonding is performed while a joint surface of the adhesive layer adjacent to the adhesive surface of the supporting
body is activated by applying ions under a vacuum pressure.

US Pat. No. 9,234,928

ELECTRIC FIELD PROBE

Murata Manufacturing Co.,...

1. An electric field probe comprising:
a rodlike monopole antenna; and
a hollow and conductive reflective member provided coaxially with the monopole antenna to cover the monopole antenna,
wherein one end portion of the reflective member is open in an axial direction of the monopole antenna,
wherein the monopole antenna is provided such that one end portion of the monopole antenna is substantially aligned with the
open end face of the reflective member,

wherein the open one end portion of the reflective member is spread wider than another end portion of the reflective member,
wherein a side wall of the reflective member has a linear cross section, and
wherein a signal received by the monopole antenna is output to a measuring device.

US Pat. No. 9,236,185

MULTILAYER CERAMIC CAPACITOR

Murata Manufacturing Co.,...

1. A multilayer ceramic capacitor comprising:
a ceramic laminated body including dielectric ceramic layers and internal electrodes stacked with the dielectric ceramic layers
disposed therebetween; and

external electrodes disposed on a predetermined area of the ceramic laminated body so as to be electrically connected to respective
ones of the internal electrodes; wherein

the dielectric ceramic layers include a perovskite compound including Ba and Ti, Zr, and a rare earth element;
ratios of Zr and the rare earth element to 100 molar parts of Ti are within a range of:
Zr: about 0.4 molar parts to about 2.0 molar parts;
the rare earth element: about 0.05 molar parts to about 0.5 molar parts, and
a molar ratio (Zr/rare earth element) of Zr to the rare earth element is within a range of about 3.3 to about 8.0;
the internal electrodes include defective portions interrupting continuity of the internal electrodes;
a proportion P1 determined by a formula P1=N1/N2×100 is about 80% or more, where N1 represents a total number of the defective
portions including Al therein, and N2 represents a total number of the defective portions; and

dielectric ceramic included in the dielectric ceramic layers has an average grain diameter within a range of about 230 nm
to about 350 nm.

US Pat. No. 9,093,980

ELASTIC WAVE FILTER DEVICE

Murata Manufacturing Co.,...

1. An elastic wave filter device comprising:
a ladder filter unit including first and second signal terminals, a series arm connecting the first and second signal terminals,
a plurality of series arm resonators connected in series in the series arm, at least three parallel arms connecting the series
arm and a ground potential, the at least three parallel arms including a first parallel arm, and parallel arm resonators provided
in the respective at least three parallel arms;

a first inductor connected between the first parallel arm and the ground potential;
a second inductor connected between at least two of the parallel arms, other than the first parallel arm among the at least
three parallel arms, and the ground potential; and

a capacitor connected between a connection point of the first parallel arm and the first inductor and a connection point of
the second inductor and the at least two parallel arms.

US Pat. No. 9,082,549

ELECTRONIC COMPONENT

Murata Manufacturing Co.,...

1. An electronic component comprising:
a multilayer ceramic capacitor including:
a ceramic laminate including a plurality of ceramic layers and a plurality of inner electrodes which are alternately laminated;
and

a first outer electrode and a second outer electrode that are located at opposite ends of the ceramic laminate;
a substrate that has a flat shape and includes a first principal surface and a second principal surface that are opposite
to each other, the substrate including:

a first mounting electrode on which the first outer electrode is mounted;
a second mounting electrode on which the second outer electrode is mounted;
a first external connection electrode that connects to the first mounting electrode; and
a second external connection electrode that connects to the second mounting electrode; wherein
the first mounting electrode and the second mounting electrode are located on the first principal surface;
the first external connection electrode and the second external connection electrode are located on the second principal surface;
the multilayer ceramic capacitor is mounted so that the first principal surface and the second principal surface, and the
inner electrodes are parallel or substantially parallel to each other; and

the first outer electrode includes a portion that does not overlap the substrate.

US Pat. No. 9,627,760

ANTENNA DEVICE AND WIRELESS COMMUNICATION APPARATUS

Murata Manufacturing Co.,...

2. The antenna device according to claim 1, wherein the sub-coil antenna is magnetically coupled to a feeding coil connected to a feeding circuit.

US Pat. No. 9,460,859

DIELECTRIC THIN FILM ELEMENT, ANTIFUSE ELEMENT, AND METHOD OF PRODUCING DIELECTRIC THIN FILM ELEMENT

MURATA MANUFACTURING CO.,...

1. A dielectric thin film element, comprising:
a capacitance section having a dielectric layer with an upper surface and a lower surface, a first electrode layer on the
upper surface, and a second electrode layer on the lower surface;

a protection layer on the capacitance section;
a first opening extending though the protection layer to expose the first electrode layer;
a second opening extending through the protection layer, the first electrode layer and the dielectric layer, to expose the
second electrode layer;

a first interconnect layer having a first portion disposed on the protection layer and a second portion that extends through
the first opening to the first electrode layer;

a second interconnect layer having a first portion disposed on the protection layer and a second portion that extends through
the second opening to the second electrode layer;

a pair of external electrodes electrically coupled to the first and second interconnect layers, respectively;
first surface metal layers disposed on the respective second portions of each of the first and second interconnect layers;
and

second surface metal layers disposed directly on the respective first portions of the first and second interconnect layers.

US Pat. No. 9,407,207

RADIO FREQUENCY AMPLIFYING CIRCUIT AND POWER AMPLIFYING MODULE

MURATA MANUFACTURING CO.,...

1. A radio frequency amplifying circuit comprising:
an amplifying transistor configured to amplify a radio frequency signal input to a base of the amplifying transistor via a
matching network to output an amplified radio frequency signal;

a first bias transistor connected to the amplifying transistor based on a current-mirror connection to supply a bias to the
amplifying transistor;

a second bias transistor connected to the base of the amplifying transistor based on an emitter-follower connection to supply
a bias to the amplifying transistor;

a second amplifying transistor configured to amplify a radio frequency signal input, by the amplifying transistor, to a base
of the second amplifying transistor via a matching network;

a third bias transistor connected to the second amplifying transistor based on a current-mirror connection to supply a bias
to the second amplifying transistor;

a fourth bias transistor connected to a base of the second amplifying transistor based on an emitter-follower connection to
supply a bias to the second amplifying transistor; and

an input terminal for a first control voltage applied to collector sides of the first and third bias transistors and an input
terminal for a second control voltage applied to base sides of the second and fourth bias transistors are independent and
separate from each other.

US Pat. No. 9,404,732

ELECTRONIC COMPONENT THICKNESS MEASUREMENT METHOD, METHOD FOR MANUFACTURING A SERIES OF ELECTRONIC COMPONENTS USING THE MEASUREMENT METHOD, A SERIES OF ELECTRONIC COMPONENTS MANUFACTURED BY THE MANUFACTURING METHOD, AND ELECTRONIC

Murata Manufacturing Co.,...

1. An electronic component thickness measurement method comprising the steps of:
applying a first electromagnetic wave from obliquely above to an electronic component and a transparent plate on which the
electronic component is mounted;

receiving reflected waves of the first electromagnetic wave and forming first image data including a first reference line
representing an intensity peak of a reflected wave reflected from an upper surface of the electronic component and a plurality
of second reference lines representing respective intensity peaks of a plurality of reflected waves reflected from the transparent
plate;

applying a second electromagnetic wave, which is different from the first electromagnetic wave in a direction of polarization,
from obliquely above and at a same angle as the first electromagnetic wave, to a position on the electronic component and
the transparent plate identical or substantially identical to a position to which the first electromagnetic wave is applied;

receiving reflected waves of the second electromagnetic wave and forming second image data including a first reference line
representing an intensity peak of a reflected wave reflected from the upper surface of the electronic component and a plurality
of second reference lines representing respective intensity peaks of a plurality of reflected waves reflected from the transparent
plate;

extracting, from a plurality of the second reference lines in the first image data and a plurality of the second reference
lines in the second image data, only a second reference line at which a difference in intensity peak between respective second
reference lines at a same position in the first image data and the second image data is smallest, and forming third image
data including the first reference line and the extracted second reference line; and

calculating a thickness of the electronic component from a distance between the first reference line and the second reference
line in the third image data.

US Pat. No. 9,401,532

HIGH-FREQUENCY SIGNAL LINE AND ELECTRONIC DEVICE INCLUDING THE SAME

MURATA MANUFACTURING CO.,...

1. A high-frequency signal line, comprising:
a multilayer body including a first region and a second region, and a plurality of flexible insulating layers stacked on each
other;

a signal conductive layer provided in or on the multilayer body;
a first ground conductive layer provided in or on the multilayer body, and facing the signal conductive layer; and
a second ground conductive layer provided in or on the multilayer body, a capacitance being generated between the second ground
conductive layer and the signal conductive layer; wherein

a distance between the first ground conductive layer and the signal conductive layer in the first region is smaller than a
distance between the first ground conductive layer and the signal conductive layer in the second region;

the multilayer body is bent in the first region; and
the second ground conductive layer is not provided in at least a portion of the first region, and is separated into a plurality
of separate planar conductive portions.

US Pat. No. 9,383,860

CAPACITANCE PROCESSING CIRCUIT AND A MEMS DEVICE

MURATA MANUFACTURING CO.,...

1. A processing circuit for processing input signals from a capacitive transducer structure, the processing circuit comprising:
a current-to-voltage converter;
one or more successive gain stage circuits;
a reference voltage generator;
dividing circuitry comprising an analog-to-digital converter; wherein
the current-to-voltage converter includes circuitry for
receiving a first input signal and a second input signal from the capacitive transducer structure,
outputting to a first gain stage of the gain stage circuits, and to the reference voltage generator a first voltage signal
that corresponds to the first input signal, and a second voltage signal that corresponds to the second input signal;

the gain stages include circuitry for generating from the first voltage signal and the second voltage signal a differential
output signal;

the reference voltage generator includes circuitry for generating from the first voltage signal and the second voltage signal
a common mode output signal;

the dividing circuitry is configured to generate a digital signal that corresponds to a quotient of the differential output
signal and the common mode output signal.

US Pat. No. 9,343,360

BUMP-EQUIPPED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING BUMP-EQUIPPED ELECTRONIC COMPONENT

MURATA MANUFACTURING CO.,...

1. A bump-equipped electronic component comprising:
a circuit substrate; and
first and second bumps primarily composed of Cu, disposed on a principal surface of the circuit substrate, and having different
cross-sectional areas in a direction parallel or substantially parallel to the principal surface; wherein

one of the first and second bumps having a smaller cross-sectional area includes a height adjustment layer, which reduces
or eliminates a gap between top of the first and second bumps, disposed in a direction perpendicular or substantially perpendicular
to the principal surface.

US Pat. No. 9,276,194

BONDING METHOD FOR BONDING METAL PLATE AND PIEZOELECTRIC BODY

Murata Manufacturing Co.,...

1. A bonding method in which a metal plate and a piezoelectric body including an electrode provided on a side of the piezoelectric
body opposed to the metal plate are bonded to each other using an electrically conductive adhesive including carbon black
as an electrically conductive aid, so as to provide electrical conductivity between the metal plate and the electrode of the
piezoelectric body, the bonding method comprising the steps of:
applying the electrically conductive adhesive in a paste form between the metal plate and the electrode of the piezoelectric
body, the electrically conductive adhesive including carbon black with a nano-level average particle size, and the electrically
conductive adhesive being included in a solventless or solvent-based resin so that the carbon black form an aggregate with
an average particle size of about 1 ?m to about 50 ?m; and

after applying the electrically conductive adhesive, subjecting the metal plate and the piezoelectric body to heating and
pressurization to deform the aggregate, and hardening the electrically conductive adhesive;

wherein prior to the heating and pressurization, the aggregate is floating in the solventless or solvent-based resin without
contacting the metal plate or the electrode.

US Pat. No. 9,240,760

POWER AMPLIFIER MODULE

MURATA MANUFACTURING CO.,...

1. A power amplifier module comprising:
a first amplification transistor configured to amplify and output a radio frequency signal;
a second amplification transistor connected in parallel to the first amplification transistor and having a smaller size than
the first amplification transistor;

a bias circuit configured to supply a bias voltage or a bias current to the first and second amplification transistors;
a current detector circuit configured to detect a current flowing in the second amplification transistor;
a bias control circuit configured to control the bias voltage or the bias current supplied from the bias circuit to the first
and second amplification transistors depending on the detection result of the current detector circuit; and

a reference voltage generator circuit configured to generate a predetermined reference voltage,
wherein the current detector circuit includes a detection resistor connected in series to the second amplification transistor,
the detection resistor being configured to generate a detection voltage corresponding to the current flowing in the second
amplification transistor, and

wherein the bias control circuit includes a comparator circuit configured to compare the detection voltage with the reference
voltage, and a first bias-reducing circuit configured to reduce the bias voltage or the bias current when the detection voltage
is greater than the predetermined reference voltage on the basis of the comparison result of the comparator circuit.

US Pat. No. 9,538,649

METHOD OF MANUFACTURING MODULE

MURATA MANUFACTURING CO.,...

1. A method of manufacturing a module comprising a wiring substrate, one or more column-shaped connection terminals forming
an interlayer connection conductor, and one or more first electronic components, the column-shaped connection terminals and
the first electronic components being mounted on the wiring substrate and sealed with a resin, the method comprising:
a providing step of providing one or more column-shaped connection terminals each having a substantially T-shaped cross section,
a first end portion of each of the connection terminals having a larger diameter than a second end portion of each of the
connection terminals;

a first mounting step of mounting one or more first electronic components on one main surface of the wiring substrate, and
mounting the connection terminals on the one main surface of the wiring substrate in such a manner that the second end portion
of each of the connection terminals having a smaller diameter is connected to the wiring substrate; and

a first sealing step of sealing the first electronic components and the connection terminals with a resin layer.

US Pat. No. 9,406,862

ELASTIC WAVE DEVICE INCLUDING MULTILAYER METAL FILM

Murata Manufacturing Co.,...

1. An elastic wave device comprising:
a piezoelectric substrate including a primary surface;
a first electrode provided on the primary surface of the piezoelectric substrate and including a first multilayer metal film
including at least three metal films laminated in a bottom-to-top direction, and at least an IDT electrode;

a second electrode provided above the primary surface of the piezoelectric substrate and including a second multilayer metal
film including metal films laminated in the bottom-to-top direction; and

a contact portion at which the first electrode and the second electrode are electrically connected to each other and defined
by a portion at which a bottommost film of the second multilayer metal film and a topmost film of the first multilayer metal
film are overlapped with each other; wherein

the first multilayer metal film includes an epitaxial Ti film defining the topmost film and an epitaxial AlCu film, the epitaxial
Ti film having a crystal orientation oriented in a predetermined direction so that a normal line direction of a (001) plane
of a Ti crystal of the epitaxial Ti film coincides with a Z axis of a crystal of a piezoelectric body defining the piezoelectric
substrate; and

the second multilayer metal film includes a Ti film as the bottommost film.

US Pat. No. 9,378,452

RADIO IC DEVICE

MURATA MANUFACTURING CO.,...

1. A radio IC device comprising:
a flexible dielectric base including a first surface, a second surface, and an end surfaces, the first surface and the second
surface facing each other and being connected to one another by the end surface;

a radiation element including a metal film or a metal foil wrapped around the dielectric base and extending from the first
surface to the second surface through the end surface; and

a radio IC element mounted on the radiation element; wherein
the radiation element includes, in a portion of the radiation element other than a portion of the radiation element on which
the radio IC element is mounted, a bonded portion that is bonded to the dielectric base and a non-bonded portion that is not
bonded to the dielectric base;

the radio IC element is arranged to be adjacent to the first surface of the dielectric base;
the portion of the radiation element on which the radio IC element is mounted and a portion of the radiation element facing
the end surface are not bonded to the dielectric base; and

a portion of the radiation element facing the second surface is bonded to the dielectric base.

US Pat. No. 9,373,072

ANTENNA, METHOD OF MANUFACTURING THE ANTENNA, AND WIRELESS IC DEVICE

MURATA MANUFACTURING CO.,...

1. An antenna comprising:
a lead wire including a first power feed portion at one end thereof and a second power feed portion at another end thereof
opposite to the one end; wherein

the lead wire includes first and second radiation portions in which the lead wire is folded back at a first folded-back portion
and a second folded-back portion, respectively, to define a loop shape;

a lead wire portion extending toward each of the first and second folded-back portions and another lead wire portion extending
away from each of the first and second folded-back portions are arranged adjacent to each other to define a first proximity
portion and a second proximity portion, respectively, near the first and second power feed portions, the lead wire portions
and the another lead wire portions being electromagnetically coupled at the first and second proximity portions;

a loop is defined by the first power feed portion, the first proximity portion, the second proximity portion, and the second
power feed portion of the lead wire and functions as an impedance matching portion;

a portion of the lead wire including the first proximity portion and the first folded-back portion and another portion of
the lead wire including the second proximity portion and the second folded-back portion function as a dipole antenna;

the first and second power feed portions, the first and second radiation portions, and the first and second proximity portions
are defined by only one single lead wire;

the first and second proximity portions are the only electromagnetically coupled portions of the lead wire; and
the one end and the another end of the lead wire are connected to an wireless IC chip such that the lead wire and the wireless
IC chip define a loop-shaped pattern.

US Pat. No. 9,349,524

WIRE-WOUND ELECTRONIC COMPONENT

Murata Manufacturing Co.,...

1. A wire-wound electronic component comprising:
a core having a winding base extending in an axial direction, and a first flange provided at a first end of the winding base
in the axial direction;

a wire wound around the winding base; and
a first external electrode that is provided only on a plurality of first side surfaces of the first flange and that is connected
to a first end of the wire, the first side surfaces being peripheral surfaces of the first flange in directions orthogonal
to the axial direction;

wherein a first connecting surface on which the first end of the wire contacts with the first external electrode is one of
the first side surfaces that is different from one of the first side surfaces that functions as a first mounting surface;

wherein the first external electrode extends from the first mounting surface to the first end of the wire in such a manner
to turn in a direction the same as a first winding direction in which the wire winds from the first end to a second end;

wherein the core further has a second flange provided at a second end of the winding base in the axial direction;
wherein the wire-wound electronic component further comprises a second external electrode that is provided only on a plurality
of second side surfaces of the second flange and that is connected to a second end of the wire, the second side surfaces being
peripheral surfaces of the second flange in directions orthogonal to the axial direction;

wherein a second connecting surface on which the second end of the wire contacts with the second external electrode is one
of the second side surfaces that is different from one of the second side surfaces that functions as a second mounting surface;
and

wherein the second external electrode extends from the second mounting surface to the second end of the wire in such a manner
to turn in a direction the same as a second winding direction in which the wire winds from the second end to the first end.