1. An identity recognition device, comprising:a thermal conductive casing;
an identity recognition module;
a heat dissipation assembly comprising a plurality of heat pipes, a heat absorbing block and a first heat sink, the heat pipes disposed on the thermal conductive casing and in thermal contact with the thermal conductive casing, the heat absorbing block in thermal contact with the identity recognition module, and two opposite sides of the first heat sink respectively in thermal contact with the heat pipes and the heat absorbing block; and
a heat dissipation coating coated on the thermal conductive casing and the heat pipes; wherein the thermal conductivity of the heat dissipation coating is larger than the thermal conductivities of the thermal conductive casing and the heat pipes;
wherein the thermal conductive casing comprises a front plate, a back plate, and an annular side plate, the back plate and the front plate are opposite to each other, the annular side plate is connected to and located between the front plate and the back plate, such that the front plate, the back plate and the annular side plate together form an accommodating space, the identity recognition module and the heat dissipation assembly are located in the accommodating space, the plurality of heat pipes comprise at least one first heat pipe, at least one second heat pipe, and at least one third heat pipe, the at least one first heat pipe is embedded into the back plate, and the at least one second heat pipe and the at least one third heat pipe are respectively embedded into two opposite sides of the annular side plate.