US Pat. No. 10,074,709

DISPLAY DEVICE

Mikuni Electron Corporati...

1. A display device, comprising:a transistor includes an oxide semiconductor layer, a first gate electrode, a first insulating layer, and a transparent conductive layer; and
an organic EL element includes a first electrode having a light-transmissive, a second electrode, a light emitting layer, and an electron transfer layer,
wherein
the first gate electrode including a region overlapping the oxide semiconductor layer,
the first insulating layer provided between the first gate electrode and the oxide semiconductor layer,
the transparent conductive layer provided between the first insulating layer and the oxide semiconductor layer, and at least including a region in contact with the oxide semiconductor layer,
the first electrode including a region overlapping the second electrode,
the light emitting layer provided between the first electrode and the second electrode,
the electron transfer layer provided between the first electrode and the light emitting layer, and
the first electrode is continuous from the transparent conductive layer.

US Pat. No. 10,403,700

OXIDE SEMICONDUCTOR TRANSISTOR

MIKUNI ELECTRON CORPORATI...

1. A transistor, comprising:an oxide semiconductor layer over a substrate;
a first gate electrode arranged on a side of the oxide semiconductor layer opposite to the substrate and including a region overlapping the oxide semiconductor layer,
a first insulating layer between the first gate electrode and the oxide semiconductor layer; and
a first transparent conductive layer and a second transparent conductive layer arranged on a side of the oxide semiconductor layer to the substrate,
wherein
the first transparent conductive layer and the second transparent conductive layer are spaced apart from each other,
the first gate electrode has a region overlapping a region where the first transparent conductive layer and the second transparent conductive layer are spaced apart from each other, and
the first transparent conductive layer and the second transparent conductive layer are in contact with the oxide semiconductor layer.

US Pat. No. 10,561,018

CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

MIKUNI ELECTRON CORPORATI...

1. A method for manufacturing connection structure, the method comprising:arranging conductive particles and a first composite on a first electrode located on a first surface of a first member, each of the conductive particles comprising a particle core having elasticity coated with metals;
arranging a second composite on a region other than the first electrode of the first surface;
arranging the first surface and a second surface of a second member where a second electrode is located, so that the first electrode and the second electrode are opposed to each other; and
curing the first composite and the second composite simultaneously while pressing the first member and the second member until the conductive particles are deformed,
wherein the second composite contains an ene/thiol-based curable resin containing an ethylene unsaturated compound and a thiol compound, and a curable component of at least one of the ethylene unsaturated compound and the thiol compound is a 9,9-bisarylfluorene compound.

US Pat. No. 10,529,681

CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

MIKUNI ELECTRON CORPORATI...

1. A method for manufacturing connection structure, the method comprising:arranging a first composite and conductive particles in a recessed portion of a first planographic intaglio plate;
displacing the first composite and the conductive particles from the first planographic intaglio plate to a pad;
transferring the conductive particles and the first composite on a plurality of first electrodes located on a first surface of a first member from the pad, so that the conductive particles are arranged only on the plurality of first electrodes, each of the conductive particles comprises a particle core having elasticity coated with metals;
arranging a second composite on the plurality of first electrodes and a first region between the adjacent first electrodes of the first surface by a pad printing scheme using a second planographic intaglio plate, so that the second composite on the plurality of first electrodes is more thinly arranged than the second composite on the first region;
arranging the first surface and a second surface of a second member where a plurality of second electrodes is located, so that the plurality of first electrodes and the plurality of second electrodes are opposed to each other;
pressing the first member and the second member; and
curing the first composite and the second composite.