US Pat. No. 10,074,709

DISPLAY DEVICE

Mikuni Electron Corporati...

1. A display device, comprising:a transistor includes an oxide semiconductor layer, a first gate electrode, a first insulating layer, and a transparent conductive layer; and
an organic EL element includes a first electrode having a light-transmissive, a second electrode, a light emitting layer, and an electron transfer layer,
wherein
the first gate electrode including a region overlapping the oxide semiconductor layer,
the first insulating layer provided between the first gate electrode and the oxide semiconductor layer,
the transparent conductive layer provided between the first insulating layer and the oxide semiconductor layer, and at least including a region in contact with the oxide semiconductor layer,
the first electrode including a region overlapping the second electrode,
the light emitting layer provided between the first electrode and the second electrode,
the electron transfer layer provided between the first electrode and the light emitting layer, and
the first electrode is continuous from the transparent conductive layer.

US Pat. No. 10,561,018

CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

MIKUNI ELECTRON CORPORATI...

1. A method for manufacturing connection structure, the method comprising:arranging conductive particles and a first composite on a first electrode located on a first surface of a first member, each of the conductive particles comprising a particle core having elasticity coated with metals;
arranging a second composite on a region other than the first electrode of the first surface;
arranging the first surface and a second surface of a second member where a second electrode is located, so that the first electrode and the second electrode are opposed to each other; and
curing the first composite and the second composite simultaneously while pressing the first member and the second member until the conductive particles are deformed,
wherein the second composite contains an ene/thiol-based curable resin containing an ethylene unsaturated compound and a thiol compound, and a curable component of at least one of the ethylene unsaturated compound and the thiol compound is a 9,9-bisarylfluorene compound.

US Pat. No. 10,624,215

CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

MIKUNI ELECTRON CORPORATI...

2. A method for manufacturing connection structure, the method comprising:arranging a second composite on a first region between a plurality of adjacent first electrodes located on a first surface of a first member by a pad printing scheme using a second planographic intaglio plate;
arranging a first composite on an upper surface and a recessed portion of a first planographic intaglio plate and arranging conductive particles in the recessed portion of the first planographic intaglio plate;
displacing the first composite and the conductive particles from the first planographic intaglio plate to a pad;
transferring the first composite on the first surface and transferring the conductive particles on the plurality of first electrodes from the pad, so that the first composite on the first region is more thinly arranged than the first composite on the plurality of first electrodes, each of the conductive particles comprises a particle core having elasticity coated with metals;
arranging the first surface and a second surface of a second member where a plurality of second electrodes is located, so that the plurality of first electrodes and the plurality of second electrodes are opposed to each other;
pressing the first member and the second member; and
curing the first composite and the second composite.

US Pat. No. 10,403,700

OXIDE SEMICONDUCTOR TRANSISTOR

MIKUNI ELECTRON CORPORATI...

1. A transistor, comprising:an oxide semiconductor layer over a substrate;
a first gate electrode arranged on a side of the oxide semiconductor layer opposite to the substrate and including a region overlapping the oxide semiconductor layer,
a first insulating layer between the first gate electrode and the oxide semiconductor layer; and
a first transparent conductive layer and a second transparent conductive layer arranged on a side of the oxide semiconductor layer to the substrate,
wherein
the first transparent conductive layer and the second transparent conductive layer are spaced apart from each other,
the first gate electrode has a region overlapping a region where the first transparent conductive layer and the second transparent conductive layer are spaced apart from each other, and
the first transparent conductive layer and the second transparent conductive layer are in contact with the oxide semiconductor layer.

US Pat. No. 10,580,751

CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

MIKUNI ELECTRON CORPORATI...

1. A method for manufacturing connection structure, the method comprising:arranging a first composite and conductive particles in a recessed portion of a first planographic intaglio plate;
displacing the first composite and the conductive particles from the first planographic intaglio plate to a pad;
transferring the conductive particles and the first composite on a plurality of first electrodes located on a first surface of a first member from the pad, so that the conductive particles are arranged only on the plurality of first electrodes, each of the conductive particles comprises a particle core having elasticity coated with metals;
arranging a second composite on the plurality of first electrodes and a first region between the adjacent first electrodes of the first surface by a pad printing scheme using a second planographic intaglio plate, so that the second composite on the plurality of first electrodes is more thinly arranged than the second composite on the first region;
arranging the first surface and a second surface of a second member where a plurality of second electrodes is located, so that the plurality of first electrodes and the plurality of second electrodes are opposed to each other;
pressing the first member and the second member; and
curing the first composite and the second composite.

US Pat. No. 10,529,681

CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

MIKUNI ELECTRON CORPORATI...

1. A method for manufacturing connection structure, the method comprising:arranging a first composite and conductive particles in a recessed portion of a first planographic intaglio plate;
displacing the first composite and the conductive particles from the first planographic intaglio plate to a pad;
transferring the conductive particles and the first composite on a plurality of first electrodes located on a first surface of a first member from the pad, so that the conductive particles are arranged only on the plurality of first electrodes, each of the conductive particles comprises a particle core having elasticity coated with metals;
arranging a second composite on the plurality of first electrodes and a first region between the adjacent first electrodes of the first surface by a pad printing scheme using a second planographic intaglio plate, so that the second composite on the plurality of first electrodes is more thinly arranged than the second composite on the first region;
arranging the first surface and a second surface of a second member where a plurality of second electrodes is located, so that the plurality of first electrodes and the plurality of second electrodes are opposed to each other;
pressing the first member and the second member; and
curing the first composite and the second composite.

US Pat. No. 10,680,051

DISPLAY DEVICE INCLUDING DUAL GATE OXIDE SEMICONDUCTOR TRANSISTOR

MIKUNI ELECTRON CORPORATI...

1. A display device, comprising:an oxide semiconductor layer on a substrate;
a first gate electrode between the substrate and the oxide semiconductor layer;
a second gate electrode on a side of the oxide semiconductor layer opposite to the substrate;
a first insulating layer between the first gate electrode and the oxide semiconductor layer;
a second insulating layer between the oxide semiconductor layer and the second gate electrode;
a first transparent conductive layer and a second transparent conductive layer on the substrate side of the oxide semiconductor layer;
a gate signal line between the substrate and the first insulating layer; and
a data signal line between the first transparent conductive layer and the oxide semiconductor layer,
wherein
the first transparent conductive layer and the second transparent conductive layer are spaced apart from each other,
the first gate electrode and the second gate electrode have a region overlapping a region where the first transparent conductive layer and the second transparent conductive layer are spaced apart from each other,
the first transparent conductive layer and the second transparent conductive layer are in contact with the oxide semiconductor layer,
the first gate electrode is continuous with the gate signal line in the same layer, and
the second gate electrode is connected to the gate signal line via a contact hole which though the first insulating layer and the second insulating layer in a region outside the oxide semiconductor layer.

US Pat. No. 10,691,240

TOUCH PANEL DISPLAY

MIKUNI ELECTRON CORPORATI...

1. A touch panel display, comprising:a transparent resin substrate;
a touch sensor embedded in the transparent resin substrate;
a plurality of pixels each including a first transistor, a second transistor, and an organic electroluminescence element electrically connected with the first transistor;
a display portion including the plurality of pixels and arranged in a region overlapping with the touch sensor on the transparent resin substrate; and
a shield electrode between the touch sensor and the display portion and extending over entire portions of the touch sensor and the display unit,
wherein
the touch sensor includes a first sensor electrode extending in a first direction and a second sensor electrode extending in a second direction crossing the first direction,
the transparent resin substrate includes a first transparent resin layer, a second transparent resin layer, a third transparent resin layer and a fourth transparent resin layer,
the first sensor electrode is located between the first transparent resin layer and the second transparent resin layer,
the second sensor electrode is located between the second transparent resin layer and the third transparent resin layer, and
the shield electrode is located between the third transparent resin layer and the fourth transparent resin layer,
wherein
the first transistor and the second transistor each include a first gate electrode between the shield electrode and the fourth transparent resin layer and in contact with the shield electrode, a first insulating layer on the fourth transparent resin layer, a semiconductor layer on the first insulating layer, a second insulating layer on the semiconductor layer, and a second gate electrode on the second insulating layer,
the shield electrode is light-transmissive,
the first gate electrode of the first transistor and the first gate electrode of the second transistor are light blocking, and
the organic electroluminescence element is arranged on the first insulating layer and emits light through the shield electrode.

US Pat. No. 10,777,526

CONNECTION STRUCTURE

MIKUNI ELECTRON CORPORATI...

1. A connection structure comprising:a first member having a first surface;
at least one first electrode located on the first surface;
a second member having a second surface opposed to the first surface;
at least one second electrode opposed to the at least one first electrode and located on the second surface;
a first resin and conductive particles arranged in at least one first region between the at least one first electrode and the at least one second electrode, the conductive particles including a particle core having elasticity coated with metals; and
a second resin arranged in the at least one first region and in a second region surrounding the at least one first region between the first surface and the second surface,
wherein the first resin is in contact with the at least one first electrode in the at least one first region,
the second resin is in contact with the at least one second electrode in the at least one first region,
the second resin in the second region is thicker than the second resin in the at least one first region, and
the first resin and the second resin have different compositions from each other,
the at least one first electrode includes a plurality of first electrodes, and
an insulating film is arranged between the plurality of first electrodes on the first surface.