US Pat. No. 9,795,032

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME

MATERIAL CONCEPT, INC., ...

1. An electric component comprising a copper electrode on an inorganic material substrate, wherein an interface layer containing
copper, manganese, silicon and oxygen is provided at the interface between the substrate and the copper electrode, and the
interface layer contains crystal grains mainly composed of copper and dispersed therein, wherein the interface layer comprises
a first region and a second region.

US Pat. No. 10,433,427

METHOD FOR FIRING COPPER PASTE

MATERIAL CONCEPT, INC., ...

1. A method for firing a copper paste, the method comprising:an application step of applying a copper paste to a substrate, the copper paste comprising copper particles, a binder resin, and a solvent;
after the application step, a first heating step of heating the substrate at 350° C. or more and 500° C. or less in a nitrogen gas atmosphere containing 500 ppm or more and 2000 ppm or less of oxidizing gas in a volume ratio, and oxidizing and sintering the copper particles in the copper paste; and
after the first heating step, a second heating step of heating the substrate at 400° C. or more and 550° C. or less in a nitrogen gas atmosphere containing 1% or more reducing gas in a volume ratio, and reducing the oxidized and sintered copper oxide,
wherein a mass percent of the binder resin in an organic vehicle contained in the copper paste is more than 0.05% and less than 17.0%,
wherein the binder resin is one or more selected from a group consisting of cellulose resin, acrylic resin, butyral resin, alkyd resin, epoxy resin and phenol resin,
wherein the copper particles in the copper paste are oxidized by oxidation in the first heating step, and cuprous oxide is formed in a continuous shape so as to cover the copper particle surface, and
wherein the oxide of copper particles formed by the first heating step includes cuprous oxide and cupric oxide, and heating is carried out such that an amount of the cuprous oxide is larger than an amount of the cupric oxide,
wherein an electrical resistivity of a copper wiring obtained after the second heating step is 6 ??cm or less.

US Pat. No. 9,941,420

CONDUCTIVE PASTE, METHOD FOR FORMING WIRING, ELECTRONIC COMPONENT, AND SILICON SOLAR CELL

MATERIAL CONCEPT, INC., ...

1. An electrically conductive paste consisting of metal particles, and an organic vehicle comprising a binder resin, wherein a mean value of aspect ratio defined as a ratio of a maximum diameter to a minimum diameter of the metal particles is equal to or larger than 1.0 and smaller than 2.2 wherein:a 90% particle diameter of the metal particles is more than 0.3 ?m and less than 7.0 ?m;
a 50% particle diameter of the metal particles is more than 0.1 ?m and less than 3.4 ?m;
wherein the metal particles consists of copper and oxygen, wherein a concentration of oxygen contained in the metal particles is 0.05 mass % or more and 2.0 mass % or less;
a mass % of the organic vehicle contained in the electrically conductive paste is 3.0% or more and 19.0% or less, and
the binder resin is a resin which is decomposable by baking, and a mass % of the binder resin in the organic vehicle contained in the electrically conductive paste is 0.05% or more and 17.0% or less.

US Pat. No. 10,532,544

WEATHER RESISTANT THERMOFORMED ARTICLES

PREMIER MATERIAL CONCEPTS...

15. An article comprising:a base layer formed from a thermoplastic olefin comprising a thermoplastic polymer, an elastomer, and a base filler, the base layer comprising between about 20-35% by weight of the base filler, the base layer having a first thickness; and
a first cap layer disposed on the base layer, the first cap layer comprising a polyolefin and between 0.1-15% by weight of a first cap filler, the first cap layer having a second thickness less than the first thickness, wherein the base layer and the first cap layer are formed in a thermoforming process, wherein the first cap layer includes an outer surface having a gloss ranging from 0.1-29% on a 60 degree angle Gardner Gloss meter, and wherein the second thickness is 10% or less of the first thickness, wherein the base filler and the first cap filler are each formed from an inorganic solid.

US Pat. No. 10,355,147

SOLAR CELL MODULE AND METHOD FOR MANUFACTURING THE SAME

MATERIAL CONCEPT, INC., ...

1. A solar cell module comprising:a solar cell comprising a semiconductor substrate;
a protection glass and an encapsulating material on a light receiving surface side of the semiconductor substrate; and
an oxide layer containing a metal element and silicon between the semiconductor substrate and the protection glass,
wherein the oxide layer contains manganese as the metal element; and
wherein the oxide layer has a total concentration of the manganese and silicon of 20 atomic %-70 atomic %.

US Pat. No. 10,529,875

SOLAR CELL AND PRODUCTION METHOD THEREFOR

MATERIAL CONCEPT, INC., ...

1. A silicon solar cell having a silicon substrate, comprising:a metal oxide layer formed on the silicon substrate, and
copper-based wiring formed on the metal oxide layer,
wherein the metal oxide layer consists of:
(a) either one of titanium or manganese;
(b) one of vanadium, niobium, tantalum or silicon;
(c) at least one of copper and nickel; and
(d) oxygen,
wherein the metal oxide layer comprises 5 atom % or more to 20 atom % or less of copper and nickel in total, and
wherein the at least one of the copper and the nickel is dispersed as a precipitate of metal particles throughout the inside of the metal oxide layer.