US Pat. No. 9,795,032

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME

MATERIAL CONCEPT, INC., ...

1. An electric component comprising a copper electrode on an inorganic material substrate, wherein an interface layer containing
copper, manganese, silicon and oxygen is provided at the interface between the substrate and the copper electrode, and the
interface layer contains crystal grains mainly composed of copper and dispersed therein, wherein the interface layer comprises
a first region and a second region.

US Pat. No. 10,433,427

METHOD FOR FIRING COPPER PASTE

MATERIAL CONCEPT, INC., ...

1. A method for firing a copper paste, the method comprising:an application step of applying a copper paste to a substrate, the copper paste comprising copper particles, a binder resin, and a solvent;
after the application step, a first heating step of heating the substrate at 350° C. or more and 500° C. or less in a nitrogen gas atmosphere containing 500 ppm or more and 2000 ppm or less of oxidizing gas in a volume ratio, and oxidizing and sintering the copper particles in the copper paste; and
after the first heating step, a second heating step of heating the substrate at 400° C. or more and 550° C. or less in a nitrogen gas atmosphere containing 1% or more reducing gas in a volume ratio, and reducing the oxidized and sintered copper oxide,
wherein a mass percent of the binder resin in an organic vehicle contained in the copper paste is more than 0.05% and less than 17.0%,
wherein the binder resin is one or more selected from a group consisting of cellulose resin, acrylic resin, butyral resin, alkyd resin, epoxy resin and phenol resin,
wherein the copper particles in the copper paste are oxidized by oxidation in the first heating step, and cuprous oxide is formed in a continuous shape so as to cover the copper particle surface, and
wherein the oxide of copper particles formed by the first heating step includes cuprous oxide and cupric oxide, and heating is carried out such that an amount of the cuprous oxide is larger than an amount of the cupric oxide,
wherein an electrical resistivity of a copper wiring obtained after the second heating step is 6 ??cm or less.

US Pat. No. 9,941,420

CONDUCTIVE PASTE, METHOD FOR FORMING WIRING, ELECTRONIC COMPONENT, AND SILICON SOLAR CELL

MATERIAL CONCEPT, INC., ...

1. An electrically conductive paste consisting of metal particles, and an organic vehicle comprising a binder resin, wherein a mean value of aspect ratio defined as a ratio of a maximum diameter to a minimum diameter of the metal particles is equal to or larger than 1.0 and smaller than 2.2 wherein:a 90% particle diameter of the metal particles is more than 0.3 ?m and less than 7.0 ?m;
a 50% particle diameter of the metal particles is more than 0.1 ?m and less than 3.4 ?m;
wherein the metal particles consists of copper and oxygen, wherein a concentration of oxygen contained in the metal particles is 0.05 mass % or more and 2.0 mass % or less;
a mass % of the organic vehicle contained in the electrically conductive paste is 3.0% or more and 19.0% or less, and
the binder resin is a resin which is decomposable by baking, and a mass % of the binder resin in the organic vehicle contained in the electrically conductive paste is 0.05% or more and 17.0% or less.