US Pat. No. 9,426,927

SCALABLE LIQUID SUBMERSION COOLING SYSTEM

LIQUIDCOOL SOLUTIONS, INC...

1. A scalable liquid submersion cooling system for electronics, comprising: a plurality of modular electronics enclosures,
each enclosure includes a liquid tight section that houses a plurality of electronic components to be liquid submersion cooled,
a plurality of electronic components in the liquid-tight section, a liquid inlet to the liquid-tight section, and a liquid
outlet from the liquid-tight section; a plurality of modular manifolds each of which is configured to fluidly connect to each
electronics enclosure, each modular manifold includes a liquid supply manifold portion and a liquid return manifold portion,
a plurality of liquid supply outlets in the liquid supply manifold portion, at least one liquid supply inlet in the liquid
supply manifold portion, a plurality of liquid return inlets in the liquid return manifold portion, and at least one liquid
return outlet in the liquid return manifold portion; and for each of the modular manifolds, the number of liquid supply outlets
and the number of liquid return inlets differ between each modular manifold but are the same within each modular manifold;
a plurality of modular pumps each of which is configured to fluidly connect to the modular manifolds, each pump having a different
pumping performance; and a plurality of modular heat exchanger units each of which is configured to fluidly connect to the
modular pumps.

US Pat. No. 9,086,859

LIQUID SUBMERSION COOLED ELECTRONIC SYSTEM

LIQUIDCOOL SOLUTIONS, INC...

1. An electronic device comprising:
a sealed case defining a liquid tight interior space, a liquid inlet in fluid communication with the interior space, a liquid
outlet in fluid communication with the interior space, and a plurality of heat generating electronic devices within the interior
space;

a single-phase, dielectric cooling liquid disposed within the interior space and submerging the heat generating electronic
devices;

a manifold in the interior space of the sealed case and connected to the liquid inlet, the manifold includes a plurality of
manifold outlets; and

a tube having one end connected to one of the manifold outlets and a second end closely adjacent to one of the heat generating
electronic devices to direct incoming single-phase dielectric cooling liquid from the liquid inlet and the manifold onto the
one heat generating electronic device.

US Pat. No. 9,128,681

LIQUID SUBMERSION COOLED POWER SUPPLY SYSTEM

LIQUIDCOOL SOLUTIONS, INC...

1. A power supply system, comprising:
a plurality of power supply units, each power supply unit including:
a sealed case defining a liquid tight interior space, the case having a liquid inlet that is in fluid communication with the
interior space, and a liquid outlet that is in fluid communication with the interior space;

a plurality of power supplies of the same type disposed within the interior space; and
a single-phase, dielectric cooling liquid disposed within the interior space and submerging the power supplies; and
a rack, and a plurality of the power supply units are disposed on the rack in an array.

US Pat. No. 9,918,408

METHOD AND APPARATUS TO MANAGE COOLANT PRESSURE AND FLOW FOR AN ARRAY OF LIQUID SUBMERGED ELECTRONIC DEVICES

LIQUIDCOOL SOLUTIONS, INC...

1. A system, comprising:
a plurality of electronic devices arranged side-by-side in a lateral direction on a shelf, each electronic device of the plurality
of electronic devices includes a liquid-tight case and heat generating electronic components within the liquid-tight case,
each of the liquid-tight cases includes a liquid inlet port and a liquid outlet port;

each of the electronic devices being configured for liquid submersion cooling by a cooling liquid;
a cooling liquid delivery manifold fluidly connected to the liquid inlet port of each of the liquid-tight cases;
a cooling liquid return manifold fluidly connected to the liquid outlet port of each of the liquid-tight cases;
a bypass line that fluidly connects the cooling liquid delivery manifold and the cooling liquid return manifold;
a pressure regulating device in the bypass line that regulates a pressure through the bypass line, wherein a fluid pressure
of the cooling liquid in each of the electronic devices is substantially the same.

US Pat. No. 9,913,402

SCALABLE LIQUID SUBMERSION COOLING SYSTEM

LIQUIDCOOL SOLUTIONS, INC...

1. A scalable liquid submersion cooling system for electronics, comprising:
a plurality of modular manifolds each of which is configured to fluidly connect to an electronics enclosure containing the
electronics that are liquid submersion cooled by cooling liquid supplied from a respective one of the modular manifolds; each
modular manifold includes a liquid supply manifold portion and a liquid return manifold portion, a plurality of liquid supply
outlets in the liquid supply manifold portion, at least one liquid supply inlet in the liquid supply manifold portion, a plurality
of liquid return inlets in the liquid return manifold portion, and at least one liquid return outlet in the liquid return
manifold portion; and for each of the modular manifolds; the number of liquid supply outlets and the number of liquid return
inlets differ between each modular manifold but are the same within each modular manifold.

US Pat. No. 9,223,360

RACK MOUNTED LIQUID SUBMERSION COOLED ELECTRONIC SYSTEM

LIQUIDCOOL SOLUTIONS, INC...

1. A system, comprising:
a rack configured for receiving a plurality of electronic systems thereon, the rack having an inlet manifold and an outlet
manifold;

a plurality of electronic systems mounted on the rack in a horizontal array, each electronic system comprising:
a sealed case defining a liquid tight interior space, a fluid inlet in fluid communication with the interior space and fluidly
connected to the inlet manifold, a fluid outlet in fluid communication with the interior space and fluidly connected to the
outlet manifold, and a plurality of heat generating electronic devices disposed within the interior space;

a single-phase, dielectric cooling liquid disposed within the interior space and submerging the heat generating electronic
devices;

a heat exchanger mounted on the rack, the heat exchanger including an inlet in fluid communication with the outlet manifold
and an outlet in fluid communication with the inlet manifold;

a pump fluidly connected to the heat exchanger for pumping the single-phase, dielectric cooling liquid through the heat exchanger;
and

a liquid cooling system in heat exchange relationship with the heat exchanger.

US Pat. No. 9,051,502

NANOFLUIDS FOR USE IN COOLING ELECTRONICS

LIQUIDCOOL SOLUTIONS, INC...

1. A fluid composition with enhanced thermal conductivity for cooling electronics, comprising:
a dielectric base fluid having a predetermined thermal conductivity, the dielectric base fluid comprises polyalphaolefin with
added anti-oxidant chemicals;

about 0.001 to about 1 percent by weight of a non-electrically conductive nanomaterial having an aspect ratio of 500-2000
dispersed into the dielectric base fluid, the non-electrically conductive nanomaterial having a thermal conductivity greater
than the predetermined thermal conductivity of the dielectric base fluid, and the non-electrically conductive nanomaterial
comprises hexagonal boron nitride; and

a chemical dispersing agent.

US Pat. No. 9,451,726

METHOD AND APPARATUS TO MANAGE COOLANT PRESSURE AND FLOW FOR AN ARRAY OF LIQUID SUBMERGED ELECTRONIC DEVICES

LiquidCool Solutions, Inc...

1. A system, comprising:
an array of electronic devices, the array including at least two vertical levels and each vertical level of the at least two
vertical levels including at least one of the electronic devices; each of the electronic devices being configured for liquid
submersion cooling by a cooling liquid; and

a fluid delivery system,
wherein at each vertical level the fluid delivery system includes a cooling liquid delivery manifold, a cooling liquid return
manifold, a bypass line, and a pressure regulating device in the bypass line;

at each vertical level the bypass line fluidly connects the cooling liquid delivery manifold and the cooling liquid return
manifold; and

at each vertical level the pressure regulating device regulates a pressure through the bypass line;
wherein a fluid pressure of the cooling liquid in each of the electronic devices of the array is substantially the same.

US Pat. No. 9,176,547

LIQUID SUBMERSION COOLED DATA STORAGE OR MEMORY SYSTEM

LIQUIDCOOL SOLUTIONS, INC...

1. A data storage or memory system, comprising:
a plurality of data storage or memory units, each data storage or memory unit including:
a sealed case defining a liquid tight interior space, the case having a liquid inlet that is in fluid communication with the
interior space, and a liquid outlet that is in fluid communication with the interior space;

a plurality of data storage or memory devices of the same type disposed within the interior space; and
a single-phase, dielectric cooling liquid disposed within the interior space and submerging the data storage or memory devices;
and

a rack, and a plurality of the data storage or memory units are disposed on the rack in an array.

US Pat. No. 10,390,458

LIQUID SUBMERSION COOLED ELECTRONIC SYSTEMS AND DEVICES

LIQUIDCOOL SOLUTIONS, INC...

1. A liquid submersion cooled electronic device, comprising:a device housing defining an interior space and a maximum dielectric cooling liquid level;
heat generating electronic components disposed within the interior space of the device housing;
a dielectric cooling liquid in the interior space, the dielectric cooling liquid submerging and in direct contact with the heat generating electronic components;
a dielectric cooling liquid inlet in the device housing through which dielectric cooling liquid enters the interior space; and
a dielectric cooling liquid outlet weir in the device housing from which dielectric cooling liquid exits the interior space, the dielectric cooling liquid outlet weir is disposed at the maximum dielectric cooling liquid level of the device housing wherein the cooling liquid outlet weir establishes the level of the dielectric cooling liquid within the interior space and establishes a volumetric rate of flow of the dielectric cooling liquid within the interior space that is needed for the cooling of the heat generating electronic components.

US Pat. No. 10,271,456

ENCLOSURE FOR LIQUID SUBMERSION COOLED ELECTRONICS

LIQUIDCOOL SOLUTIONS, INC...

1. An electronic system, comprising:an enclosure that includes a primary housing, a first end plate, and a second end plate;
the primary housing having a plurality of walls defining an interior space, a first open end, and a second open end;
each wall having a thickness defined between an interior surface and an exterior surface thereof;
a first one of the walls includes a plurality of heat dissipating fins formed on the exterior surface thereof, each heat dissipating fin having a longitudinal axis;
a plurality of fluid passages in the first wall inward from the fins, the fluid passages extend from the first open end to the second open end, each fluid passage having a longitudinal axis, and the longitudinal axes of the fluid passages are parallel to the longitudinal axes of the heat dissipating fins;
heat generating electronic components disposed in the interior space;
the first end plate is removably attached to the primary housing at the first open end thereof and closes the first open end, the first end plate includes a plurality of heat dissipating fins on an exterior surface thereof;
a first sealing gasket between the first end plate and the primary housing at the first open end thereof to seal between the first end plate and the primary housing to prevent fluid leakage between the first end plate and the primary housing, the first sealing gasket includes at least one fluid opening formed therethrough that is aligned with the fluid passages to permit fluid flow through the first sealing gasket;
the first sealing gasket is formed from rubber, silicone, neoprene, or plastic polymer;
the second end plate is removably attached to the primary housing at the second open end thereof and closes the second open end, the second end plate includes a plurality of heat dissipating fins on an exterior surface thereof;
a second sealing gasket between the second end plate and the primary housing at the second open end thereof to seal between the second end plate and the primary housing to prevent fluid leakage between the second end plate and the primary housing, the second sealing gasket includes at least one fluid opening formed therethrough that is aligned with the fluid passages to permit fluid flow through the second sealing gasket;
the second sealing gasket is formed from rubber, silicone, neoprene, or plastic polymer;
a cooling liquid within the interior space and submerging the heat generating electronic components in direct contact therewith; and
a circulation system that circulates the cooling liquid in the electronic system, the circulation system is configured to direct the cooling liquid through the fluid passages in the first wall, the circulation system includes a pump, and the pump is mounted in the primary housing or on the first or second end plate and the cooling liquid remains within the enclosure while being circulated.

US Pat. No. 10,609,839

LIQUID SUBMERSION COOLED ELECTRONIC SYSTEMS AND DEVICES

LIQUIDCOOL SOLUTIONS, INC...

1. A liquid submersion cooled electronic device, comprising:a non-pressurized device housing defining an interior space, the non-pressurized device housing including a tray with an at least partially open top and a cover removably attached to the tray and disposed over the at least partially open top;
at least one heat generating electronic component disposed within the interior space of the non-pressurized device housing;
a dielectric cooling liquid in the interior space, the dielectric cooling liquid partially or fully submerging and in direct contact with the at least one heat generating electronic component;
a pump having a pump inlet in fluid communication with the interior space and a pump outlet;
a heat exchanger having a heat exchanger inlet in fluid communication with the pump outlet and having a heat exchanger outlet in fluid communication with the interior space;
a liquid distribution manifold within the interior space, the liquid distribution manifold having a manifold inlet in fluid communication with the heat exchanger outlet, and a plurality of manifold outlets;
a tube having an inlet end thereof connected to one of the manifold outlets, and an outlet end thereof adjacent to the at least one heat generating electronic component to direct a return flow of dielectric cooling liquid to the at least one heat generating electronic component;
an open top tray disposed within the interior space, the at least one heat generating electronic component is disposed within the open top tray, the outlet end of the tube is connected to the open top tray to direct the return flow of dielectric cooling liquid into a space defined by the open top tray, and a side wall of the open top tray includes a dielectric cooling liquid outlet weir from which dielectric cooling liquid exits the space defined by the open top tray.

US Pat. No. 11,032,939

LIQUID SUBMERSION COOLED ELECTRONIC SYSTEMS

LiquidCool Solutions, Inc...

1. A method of cooling heat generating electronic computer components of a computing system, comprising:submerging the heat generating electronic computer components, that are mounted on an upper surface of a circuit board, of the computing system in a dielectric cooling liquid contained in an interior space defined within a liquid-tight enclosure of the computing system so that the heat generating electronic computer components are in direct contact with the dielectric cooling liquid; the liquid-tight enclosure includes a first wall, a second wall opposite the first wall, a third wall interconnecting the first wall and the second wall, a fourth wall opposite the third wall and interconnecting the first wall and the second wall, a first end wall and a second end wall; the first wall and the second wall are each larger in area than the third wall, the fourth wall, the first end wall, and the second end wall; and the upper surface of the circuit board is parallel to the first wall and to the second wall;
circulating the dielectric cooling liquid through a heat exchanger for cooling the dielectric cooling liquid without circulating the dielectric cooling liquid to a heat exchanger external to the liquid-tight enclosure, wherein the dielectric cooling liquid is circulated by a pump disposed within the interior space of the liquid-tight enclosure and submerged in the dielectric cooling liquid and the pump is not mounted on the circuit board, and the pump is positioned closer to the first end wall than it is to the second end wall; and
directing a return flow of the dielectric cooling liquid, after being cooled in the heat exchanger, into a manifold that does not overlap the upper surface and that is not affixed to the circuit board, the manifold is positioned closer to the second end wall than it is to the first end wall, and thereafter from the manifold directly onto at least one of the submerged heat generating electronic computer components or directly onto a heat sink that is fixed to the at least one submerged heat generating electronic computer component.