US Pat. No. 9,554,457

PACKAGE FOR MULTIPLE LIGHT EMITTING DIODES

LedEngin, Inc., San Jose...

1. A lighting apparatus comprising:
a substrate having:
a plurality of electrically insulating base layers;
a plurality of top-side electrical contacts disposed on a top one of the electrically insulating base layers;
a plurality of external electrical contacts disposed on an exterior surface of the substrate; and
a plurality of electrical paths connecting the top-side electrical contacts to the external electrical contacts, wherein at
least a portion of the plurality of electrical paths is disposed between the electrically insulating base layers; and

a plurality of light-emitting diodes (LEDs) arranged on the top one of the electrically insulating base layers and electrically
connected to the plurality of top-side electrical contacts, wherein the electrical paths in the substrate are arranged such
that different subsets of the LEDs are connected in a plurality of independently addressable groups and wherein at least one
of the independently addressable groups includes at least two of the LEDs.

US Pat. No. 9,642,206

COMPACT EMITTER FOR WARM DIMMING AND COLOR TUNABLE LAMP

LedEngin, Inc., San Jose...

1. A substrate for an LED emitter, the substrate comprising:
a body with a recess region formed therein;
a plurality of bonding pads disposed within the recess region, the plurality of bonding pads including a plurality of LED
bonding pads and a plurality of supporting chip bonding pads;

a plurality of external electrical contacts disposed outside the recess region; and
a plurality of electrical paths disposed at least partially within the body of the substrate, the electrical paths connecting
the external electrical contacts to a first subset of the supporting chip bonding pads and connecting a second subset of the
supporting chip bonding pads to the plurality of LED bonding pads such that a controller/driver chip bonded to the supporting
chip bonding pads is operable to deliver different operating currents to different ones of the LEDs in response to a control
signal received via one of the external electrical contacts.

US Pat. No. 9,653,663

CERAMIC LED PACKAGE

LedEngin, Inc., San Jose...

1. A package for multiple LEDs and for attachment to a substrate comprising:
a body including:
a top body layer;
a cavity disposed through the top body layer and having a floor for bonding to the multiple LEDs; and
a thermal conduction layer bonded to the top body layer and having a top surface forming the floor of the cavity and a bottom
surface, the thermal conduction layer including a thermally conducting ceramic material;

a plurality of metal LED bonding pads in direct contact with the floor and configured to bond to respective ones of the multiple
LEDs; and

a plurality of electrical bonding pads in direct contact with the floor, coupled to respective ones of the plurality of LED
bonding pads, and in electrical communication with a plurality of electrical contacts disposed on a surface of the body.

US Pat. No. 9,468,069

SMOOTH BRIGHTNESS ADJUSTMENT FOR COLOR-TUNABLE LIGHT SOURCE MODULE

LedEngin, Inc., San Jose...

1. A method comprising:
generating a first pulse sequence using a first pulse-width modulator, the first pulse sequence having a first pulse period
corresponding to a high frequency;

generating a modulating pulse sequence using a second pulse-width modulator, the modulating pulse sequence having a second
pulse period corresponding to a low frequency,

wherein generating each modulating pulse in the modulating pulse sequence includes perturbing a width of the modulating pulse
by a perturbation amount, the perturbation amount being in a range corresponding to the first pulse period, and wherein different
modulating pulses in the sequence are perturbed by different amounts; and

modulating the pulse train using the sequence of modulating pulses to produce an output electrical signal.

US Pat. No. 9,482,407

SPOT TIR LENS SYSTEM FOR SMALL HIGH-POWER EMITTER

LedEngin, Inc., San Jose...

17. A lens assembly, comprising:
a total-internal-reflection (TIR) lens, the lens including:
an optical body member having a step-shaped upper surface defining an increasingly wider cavity extending from an interior
portion to an upper opening of the optical body.

US Pat. No. 9,794,999

COLOR TUNABLE LIGHT SOURCE MODULE WITH BRIGHTNESS AND DIMMING CONTROL

LedEngin, Inc., San Jose...

1. A method of controlling brightness and color temperature in a light source device having a plurality of independently addressable
groups of LEDs, wherein the LEDs in each group emit light of a different color, the method comprising:
receiving a control signal indicating that a brightness of the light source should be changed from a starting brightness value
to a target brightness value;

defining a brightness trajectory from the current brightness value to the target brightness value, the brightness trajectory
consisting of a sequence of frames, each frame having a different brightness value assigned thereto and a duration that is
long enough to be perceptible to a human eye; and

executing the brightness trajectory, wherein executing the brightness trajectory includes, for each frame in the sequence
of frames:

determining, using a microcontroller, a brightness set-point for the current frame based at least in part on the brightness
trajectory;

computing, for each of a plurality of output channels of the microcontroller, a pulse width and a number of pulses to include
in a pulse train to be generated on each of the plurality of output channels during a brightness cycle that is common to all
of the output channels, the brightness cycle consisting of a fixed number (NB) of pulse periods, each pulse period having the same duration (p), the pulse train on each output channel consisting of a
selectable number (NON) of active pulse periods of duration p during each of which a pulse having a selectable pulse width is generated and another
number (NB?NON) of inactive pulse periods of duration p during which a pulse is not generated, the computation being based at least in part
on a current color temperature and the brightness set-point for the current frame such that the pulse width for each output
channel is computed based on the current color temperature and the number NON of active pulse periods is computed based on the brightness set-point,

wherein selecting the number NON of active pulse periods and the pulse width for each output channel includes:

accessing a lookup table using the current color temperature to determine first and second baseline pulse width parameters;
interpolating between the first and second baseline pulse width parameters to generate a width value consisting of a first
subset of most significant bits and a second subset of least significant bits;

determining the pulse width based at least in part on the most significant bits of the width value; and
determining the number NON of pulses to include in the pulse train based at least in part on the brightness set point and the least significant bits
of the width value;

generating, on each of the plurality of output channels, a pulse train using the pulse width and number of pulses computed
for that channel;

converting each of the pulse trains to an operating current;
delivering each of the operating currents to a different one of the independently addressable groups of LEDs; and
repeating the acts of generating, converting and delivering for the duration of the frame.

US Pat. No. 9,269,697

SYSTEM AND METHODS FOR WARM WHITE LED LIGHT SOURCE

LedEngin, Inc., San Jose...

1. An LED (light-emitting diode) light emitter, comprising:
a single emitter structure having a substrate with a plurality of LED dies arranged thereon, wherein the plurality of LED
dies includes at least one white LED die that produces a white light, and at least one red LED die that produces a red light,

wherein each white LED die includes a blue light LED chip with a wavelength-converting layer disposed directly thereon and
each red LED die includes a red light LED chip; and

a total-internal-reflection (TIR) lens positioned to collect light emitted from the single emitter structure and adapted to
mix the light from the plurality of LED dies to produce a uniform warm white light;

wherein the white LED dies are selected such that the light output by the LED light emitter has a desired color temperature
when the number of white LED dies is twice the number of red LED dies, and an equal current is supplied to all of the plurality
of LEDs;

wherein the plurality of LEDs consists of 16 white LED dies and eight red LED dies arranged symmetrically in a 5×5 grid, with
four red LED dies placed in corners.

US Pat. No. 9,234,801

MANUFACTURING METHOD FOR LED EMITTER WITH HIGH COLOR CONSISTENCY

LedEngin, Inc., San Jose...

1. A method for forming light emitters with multiple LEDs (light-emitting-diodes), wherein the number of LEDs in each emitter
is an integer M, the method comprising:
determining color coordinates CIEx and CIEy and intensity for each of a plurality of LEDs, wherein CIEx and CIEy are color
coordinates in a CIE chromaticity diagram, and wherein N is the number of LEDs in the plurality of LEDs;

determining a first parameter X0 and a second parameter Y0 for a target light color, wherein X0 and Y0 are related to CIEx and CIEy of each of the N LEDs and a weighting factor related to the intensity of each of the N LEDs;

for each possible group of M LEDs out of the N LEDs in the plurality of LEDs:
determining a first group parameter X and a second group parameter Y, wherein X and Y are related to CIEx and CIEy of each
of the M LEDs and a weighting factor related to the intensity of each of the M LEDs; and

determining a difference between the first and second group parameters X and Y of each LED in the group of M LEDs and X0 and Y0;

selecting a first group of M LEDs whose first group parameter X and second group parameter Y are closest to X0 and Y0 as a first candidate for forming a light emitter with M LEDs;

removing the selected first group of M LEDs from the plurality of LEDs; and
for the LEDs remaining in the plurality of LEDs, repeating the above processes to select a group of M LEDs as the next candidate
for forming a light emitter.

US Pat. No. 9,222,630

METHOD AND SYSTEM FOR FORMING LED LIGHT EMITTERS

LedEngin, Inc., San Jose...

1. A flexible sheet of light-emitting diode (LED) light emitters, comprising:
a support substrate including a thermally conductive material;
an LED emitter sheet overlying the support substrate, the LED emitter sheet including a plurality of LED light emitters;
a flexible circuit sheet overlying the LED emitter sheet;
a phosphor sheet overlying flexible circuit sheet, the phosphor sheet including a wave-length converting material; and
a lens sheet overlying the phosphor sheet, the lens sheet including a plurality of lenses.

US Pat. No. 9,080,729

MULTIPLE-LED EMITTER FOR A-19 LAMPS

LedEngin, Inc., San Jose...

1. An LED (light-emitting diode) high-power wide-angle A-19 lamp, comprising:
a lamp envelope structure configured for transmission of light therethrough;
a base structure coupled to a lower portion of the lamp envelope structure for coupling to an external power source;
a driver circuit coupled to the base for receiving power from the external power source; and
a single LED emitter disposed inside the A-19 lamp for receiving regulated power from the driver circuit and for emitting
light that is transmitted through the lamp envelope structure, wherein the LED emitter comprises:

a plurality of light-emitting diodes (LEDs) disposed in a single recess in a substrate, each LED being coated with a material
containing a color-shifting phosphor; and

a single lens disposed over the LEDs and the substrate, the single lens being made of an optically-transparent material and
without additional color-shifting phosphor;

wherein the emitter is configured to consume electrical power of 30 Watts or higher and to provide light distribution at 130
degrees or wider at 50% peak intensity without additional secondary optical components.

US Pat. No. 9,416,928

METHOD AND SYSTEM FOR FORMING LED LIGHT EMITTERS

LedEngin, Inc., San Jose...

1. A flexible sheet of light-emitting diode (LED) light emitters, comprising:
a flexible support substrate including a thermally conductive material;
a plurality of LED light emitters overlying the flexible support substrate;
a flexible circuit sheet coupled to the plurality of LED light emitters;
a flexible phosphor sheet overlying the plurality of LED light emitters, the flexible phosphor sheet including a wave-length
converting material; and

a plurality of lenses overlying the flexible phosphor sheet.

US Pat. No. 9,634,214

GRAPHITE-CONTAINING SUBSTRATES FOR LED PACKAGES

LedEngin, Inc., San Jose...

1. A substrate for a lighting apparatus, the substrate comprising:
a body layer having:
a graphite core consisting of one or more graphite sheets, the graphite core having substantially planar top and bottom surfaces;
an upper ceramic sublayer disposed on the top surface of the graphite core; and
a lower ceramic sublayer disposed on the bottom surface of the graphite core;
a first patterned metal layer disposed on a top surface of the upper ceramic sublayer, wherein the first patterned metal layer
includes a plurality of electrical contact pads for bonding to a plurality of light-emitting diode (LED) dies; and

a second patterned metal layer disposed on a bottom surface of the lower ceramic sublayer, portions of the second patterned
metal layer being electrically connected to portions of the first patterned metal layer.

US Pat. No. 9,528,665

PHOSPHORS FOR WARM WHITE EMITTERS

LedEngin, Inc., San Jose...

1. A method for fabricating light-emitting devices, the method comprising:
obtaining a plurality of light-emitting diode (LED) chips fabricated to emit blue light;
preparing a phosphor-containing material comprising a matrix material having dispersed therein a mixture of a red phosphor
and a green phosphor, wherein the phosphor-containing material has about 60-80 units of red phosphor and 390-430 units of
green phosphor; and

disposing different thicknesses of the phosphor-containing material on different ones of the LED chips, wherein the LED chips
having different thicknesses of the phosphor-containing material emit light characterized by different points along the Planckian
locus in a CIE chromaticity diagram;

combining two or more of the LED chips covered with different thicknesses of the phosphor-containing material to form an LED
emitter, which emits light characterized by a point along the Planckian locus in the CIE chromaticity diagram.

US Pat. No. 9,345,095

TUNABLE MULTI-LED EMITTER MODULE

LedEngin, Inc., San Jose...

1. A light-emitting diode (LED) emitter module, comprising:
a substrate having a plurality of base layers of an electrically insulating material, a plurality of electrical contacts disposed
on a top one of the base layer, and a plurality of electrical paths coupled to the electrical contacts, wherein at least a
portion of the plurality of electrical paths is disposed between the base layers;

first and second groups of LED dies disposed on the substrate, each group having one or more LED dies, each of the LED dies
being coupled to an electrical contact, wherein the electrical paths are configured for feeding separate electrical currents
to the groups of LED dies;

a memory device containing information associating a plurality output light colors with a corresponding plurality of combinations
of electrical currents, each combination specifying a first electric current for one of the first group of LED dies and a
second electric current for one of the second group of LED dies; and

a circuit for accessing the information in the memory device,
wherein the substrate with the first and second groups of LED dies, the memory device, and the circuit are disposed on a same
circuit board.

US Pat. No. 9,560,713

COLOR TUNABLE LIGHT SOURCE MODULE WITH BRIGHTNESS CONTROL

LedEngin, Inc., San Jose...

1. A light source module comprising:
an emitter having a plurality of LEDs disposed on a single substrate, the plurality of LEDs being electrically connected into
at least three independently addressable groups of LEDs, wherein the LEDs in each group emit light of a different color;

a plurality of current regulators, each current regulator being coupled to provide an operating current to a different one
of the independently addressable groups of LEDs in response to an adjustable input voltage and a constant reference voltage;

a microcontroller configured to receive input settings specifying a color temperature and a brightness setting for the light
source module and to generate a pulse train on each of a plurality of output channels during a brightness cycle that is common
to all of the output channels, the brightness cycle consisting of a fixed number (NB) of pulse periods, each pulse period having the same duration (p), the pulse train on each output channel consisting of a
selectable number (NON) of active pulse periods of duration p during each of which a pulse having a selectable pulse width is generated and another
number (NB-NON) of inactive pulse periods of duration p during which a pulse is not generated, wherein the microcontroller is further configured
to select the number NON of active pulse periods and the pulse width for each output channel based on the input settings; and

a plurality of RC integrator circuits, each RC integrator circuit being coupled between a different one of the output channels
of the microcontroller and a different one of the plurality of current regulators, each RC integrator circuit being configured
to receive the pulse train from a different one of the output channels of the microcontroller and to provide the adjustable
input voltage to a different one of the current regulators,

wherein the microcontroller is further configured such that selecting the number NON of active pulse periods and the pulse width for each output channel includes:

accessing a lookup table using the target color temperature to determine first and second baseline pulse width parameters;
interpolating between the first and second baseline pulse width parameters to generate a width value consisting of a first
subset of most significant bits and a second subset of least significant bits;

determining the pulse width based at least in part on the most significant bits of the width value; and
determining the number NON of pulses to include in the pulse train based at least in part on the brightness set point and the least significant bits
of the width value.

US Pat. No. 9,530,943

LED EMITTER PACKAGES WITH HIGH CRI

LedEngin, Inc., San Jose...

1. An emitter package comprising:
a single ceramic substrate having a recess region formed on a top surface thereof and a plurality of bonding pads disposed
within the recess region; and

a plurality of LED chips disposed within the recess region and bonded to the bonding pads,
wherein the ceramic substrate further includes a plurality of electrical paths disposed at least partially within the body
of the ceramic substrate, the electrical paths electrically connecting the LED chips into three independently addressable
groups,

the three independently addressable groups including:
a first group consisting of one or more blue LED chips coated with a first broad-spectrum phosphor material having at least
120 nm FWHM at a first concentration to produce light having a predominantly blue spectrum;

a second group consisting of one or more blue LED chips coated with a mixture of a second broad-spectrum phosphor material
and a red nitride phosphor to produce light having a warm white color; and

a third group consisting of one or more near-ultraviolet LED chips coated with a red nitride phosphor to produce light having
a spectrum dominated by red wavelengths,

wherein the emitter package is tunable to produce light in a range of color temperatures (CCT) from 2700 K to 6000 K with
a color rendering index (CRI) of at least 90 at every CCT within the range of CCT from 2700 K to 6000 K.

US Pat. No. 9,406,654

PACKAGE FOR HIGH-POWER LED DEVICES

LedEngin, Inc., San Jose...

1. A light device package comprising:
a substrate having a top surface that includes a recess region, the recess region having a plurality of LED contact pads disposed
therein for connecting one or more light-emitting diodes (LEDs);

a thick supporting plate disposed over at least a portion of the bottom surface of the substrate; and
a plurality of peripheral contact pads disposed on an outer area of the top surface of the substrate outside a perimeter of
the recess region, the peripheral contact pads being electrically connected to the one or more LED contact pads,

wherein the thick supporting plate and the peripheral contact pads each include:
an interface layer comprising a plurality of sub-layers of different metals, the plurality of sub-layers including at least
a tungsten sub-layer and a nickel sub-layer; and

a copper layer,
wherein the interface layer is disposed directly on the surface of the substrate and the copper layer is disposed directly
on the interface layer.

US Pat. No. 9,842,973

METHOD OF MANUFACTURING CERAMIC LED PACKAGES WITH HIGHER HEAT DISSIPATION

LedEngin, Inc., San Jose...

1. A method of fabricating a light-emitting device, the method comprising:
providing a package including:
a light-emitting side, a top surface,
a socket including a socket sidewall and a bottom surface, the socket sidewall disposed between the top surface and a bottom
surface of the package, the socket disposed on the light-emitting side of the package; and

a cavity having a floor and configured to transmit light to the light emitting side of the package via the socket;
disposing an LED (light emitting diode) within the cavity and bonded to the floor of the cavity;
disposing a thermal insulation layer within the cavity between the LED and the top surface of the package;
disposing a luminescent layer within the cavity between the thermal insulation layer and the top surface of the package;
providing a glass lens including a cap and a plug, the cap including an upper surface and a lower surface, the plug including
a lower surface and a plug sidewall between the lower surface of the plug and the lower surface of the cap, wherein the plug
is configured to be disposed within the socket and the lower surface of the cap is configured to be disposed adjacent the
top surface of the package; and

disposing an adhesive layer to attach the lower surface of the cap to the top surface of the package, wherein a portion of
the adhesive layer is disposed between the luminescent layer and the lower surface of the plug.

US Pat. No. 9,816,691

METHOD AND SYSTEM FOR FORMING LED LIGHT EMITTERS

LedEngin, Inc., San Jose...

1. A flexible sheet of light-emitting diode (LED) light emitters, comprising:
a flexible support substrate including a thermally conductive material;
a plurality of LED light emitters overlying the flexible support substrate;
a flexible circuit sheet coupled to the plurality of LED light emitters;
a phosphor layer overlying the plurality of LED light emitters, the phosphor layer including a wave-length converting material;
and

a plurality of lenses overlying the phosphor layer.

US Pat. No. 9,929,326

LED PACKAGE HAVING MUSHROOM-SHAPED LENS WITH VOLUME DIFFUSER

LedEngin, Inc., San Jose...

1. A light-emitting device package comprising:a body including top and bottom surfaces;
a cavity in the body, the cavity extending from the top surface towards the bottom surface and having a floor;
one or more LED (light-emitting-diode) dies disposed on the floor of the cavity;
an encapsulation layer disposed within the cavity over the one or more LED dies;
a socket formed over the encapsulation layer, the socket including a top surface, a socket sidewall, and a bottom surface, the socket sidewall disposed between the top surface and the bottom surface of the socket;
a lens disposed over the over the socket, the lens comprising two or more optical materials with different indices of refraction, the lens including a cap and a plug, the cap having an upper surface that has a spherical vertical cross-section and a lower surface, the plug having a planar bottom surface and a plug sidewall between the lower surface of the plug and the lower surface of the cap, the plug disposed within the socket, and the lower surface of the cap disposed adjacent the top surface of the socket; and
an adhesive layer disposed to attach the lower surface of the cap to the top surface of the socket, wherein a portion the adhesive layer is disposed between the encapsulation layer and the lower surface of the plug.

US Pat. No. 9,897,284

LED-BASED MR16 REPLACEMENT LAMP

LedEngin, Inc., San Jose...

1. A lamp comprising:
a housing providing an external electrical connection, wherein the housing incorporates a heat-dissipating structure, wherein
the housing has an outer shape conforming to a form factor of an MR16 lamp;

a single emitter structure disposed within the housing, the single emitter structure having:
a substrate having a recess;
a plurality of light-emitting diodes (LEDs) arranged within the recess, wherein each LED is a separate semiconductor die mounted
on the substrate, wherein different ones of the plurality of LEDs produce light of different colors, and wherein the plurality
of LEDs includes at least one LED that produces a warm white light, at least one LED that produces a cool white light, and
at least one LED that produces a red light;

wherein the substrate includes electrical connection traces such that the LEDs are connected to form a plurality of independently
addressable groups; and

a primary lens disposed over the recess;
a total-internal-reflection (TIR) lens positioned to collect light emitted from the single emitter structure and adapted to
mix the light from the plurality of LEDs to produce a uniform white light, wherein the TIR lens has:

a concave front surface having a plurality of hexagonal convex microlenses thereon; and
a central cavity extending along the optical axis from a rear surface to a point more than halfway to the concave front surface,
wherein the primary lens of the single emitter structure extends partway into the central cavity;

a diffusive coating applied to a front face of the TIR lens; and
a control circuit disposed within the housing and configured to supply different amounts of power to different ones of the
independently addressable groups of the LEDs to provide a tunable color of light.

US Pat. No. 10,172,206

COMPACT EMITTER FOR WARM DIMMING AND COLOR TUNABLE LAMP

LedEngin, Inc., San Jose...

1. An LED emitter comprising:a substrate having:
a body with a recess region formed therein;
a plurality of bonding pads disposed within the recess region, the plurality of bonding pads including a plurality of LED bonding pads and a plurality of supporting chip bonding pads;
an external power contact disposed outside the recess region;
a plurality of electrical paths disposed at least partially within the body of the substrate, the electrical paths connecting the external power contact to at least one of the supporting chip bonding pads and connecting a first subset of the supporting chip bonding pads to the plurality of LED bonding pads such that a supporting chip connected to the supporting chip bonding pads is operable to deliver different operating currents to different ones of the LEDs;
a plurality of LEDs disposed in the recess region and connected to the LED bonding pads;
a supporting chip disposed in the recess region and connected to the supporting chip bonding pads, the supporting chip including a driver circuit to generate different operating currents for the different ones of the LEDs, a control circuit to control operation of the driver circuit in response to an external control signal, and a programmable read-only memory to store a mapping between each of a plurality of states of the external control signal and a corresponding distribution of operating currents to be generated by the driver circuit; and
an optically transparent cover disposed over and sealed to the recess region.

US Pat. No. 10,219,345

TUNABLE LED EMITTER WITH CONTINUOUS SPECTRUM

LedEngin, Inc., San Jose...

1. A light-emitting device comprising:a substrate;
a plurality of LED chips disposed on the substrate, the LED chips including LED chips of at least four different colors; and
a plurality of electrical paths disposed in part on the substrate and in part within the substrate, the electrical paths connecting the LED chips into at least three independently addressable groups, the number of independently addressable groups being less than the number of different colors of the LED chips, wherein each LED chip belongs to only one of the independently addressable groups,
wherein different ones of the independently addressable groups of LEDs produce different colors of light and wherein at least a first one of the independently addressable groups of LEDs includes a first LED chip of a first color and a second LED chip of a second color different from the first color, wherein the first LED chip is a monochromatic LED chip and the second LED chip is a phosphor-converted LED chip that produces broad spectrum light having a full width at half maximum intensity (FWHM) of at least 100 nm.

US Pat. No. 10,149,363

METHOD FOR MAKING TUNABLE MULTI-LED EMITTER MODULE

LedEngin, Inc., San Jose...

1. A method for making a light-emitting diode (LED) emitter module, comprising:providing a substrate having a plurality of electrical contacts and a plurality of electrical paths coupled to the electrical contacts;
providing two or more groups of LED dies disposed on the substrate, each group having one or more LED dies, each of the LED dies being coupled to an electrical contact, wherein the electrical paths are configured for feeding separate electrical currents to the groups of LED dies;
placing a primary lens over the two or more groups of LED dies;
determining information associating a plurality of output light colors with a corresponding plurality of combinations of electrical currents, each combination specifying a plurality of electrical current values, each electrical current value being associated with one of the two or more groups of LED dies;
providing a memory device on the substrate;
storing the information in the memory device; and
providing a circuit for accessing the information in the memory device.

US Pat. No. 10,429,030

HYBRID LENS SYSTEM INCORPORATING TOTAL INTERNAL REFLECTION LENS AND DIFFUSER

LedEngin, Inc., San Jose...

1. A lens system, comprising:an optical body member, having an upper end, a lower end opposite the upper end, and an outer surface, the optical body member being substantially symmetric with respect to an optical axis, the lower end of the optical body member including a cavity for accommodating a light source, the outer surface being shaped to provide total internal reflection (TIR) for light from the light source; and
a diffuser, having a curved shell and a circular rim, the diffuser being configured for being disposed over the light source and configured to fit inside the cavity at the lower end of the optical body member;
wherein light from the light source is mixed by the diffuser and collimated by the optical body member to form a spot light.