1. A method for fabricating a display module, comprising:forming electrode patterns, each of which comprises a first individual electrode pad, a second individual electrode pad, a third individual electrode pad, and a common electrode pad, in a matrix on a substrate;
loading 1st first bumps, 2nd first bumps, and 3rd first bumps on the first individual electrode pads, the second individual electrode pads, and the third individual electrode pads, respectively, and loading 1st second bumps, 2nd second bumps, and 3rd second bumps on the common electrode pads;
bonding LED chips comprising first LED chips having 1st first electrodes and 1st second electrodes, second LED chips having 2nd first electrodes and 2nd second electrodes, and third LED chips having 3rd first electrodes and 3rd second electrodes in a matrix to a bonding carrier;
moving the bonding carrier such that the 1st first electrodes, the 2nd first electrodes, and the 3rd first electrodes face the 1st first bumps, the 2nd first bumps, and the 3rd first bumps, respectively, and the 1st second electrodes, the 2nd second electrodes, and the 3rd second electrodes face the 1st second bumps, the 2nd second bumps, and the 3rd second bumps, respectively; and
pressurizing the first LED chips, the second LED chips, and the third LED chips to a predetermined pressure such that the 1st second bumps, the 2nd second bumps, and the 3rd second bumps are compressed to a first height and the 1st second bumps, the 2nd second bumps, and the 3rd second bumps are compressed to a second height (chip placing down),
wherein each of the electrode patterns is formed such that the common electrode pad is aligned to a first end line parallel to the lengthwise direction of the matrix, and the first individual electrode pad, the second individual electrode pad, and the third individual electrode pad are aligned to a second end line parallel to the first end line and are located between the first end line and the second end line; and the chip placing down is carried out such that the first LED chip, the second LED chip, and the third LED chip are arrayed in a line along the lengthwise direction.