US Pat. No. 9,408,263

LED LIGHTING DEVICE

LUMENS CO., LTD., Yongin...

1. A light emitting diode (LED) lighting device comprising:
an LED;
a bridge rectifier;
a TRIAC dimmer for controlling the luminance of the LED; and
a load connected between an output terminal of the TRIAC dimmer and the bridge rectifier to stabilize the operation of the
TRIAC dimmer even in low dimming level of the TRIAC dimmer,

wherein the load includes:
a first damping resistor that is connected between a first node of the output terminal and a first node of the bridge rectifier;
and

a second damping resistor that is connected between a second node of the output terminal and a second node of the bridge rectifier,
wherein the bridge rectifier is connected with the load to supply an operating current to the LED and the LED receives the
operating current from the bridge rectifier.

US Pat. No. 9,491,825

LED LIGHTING DEVICE

LUMENS CO., LTD., Yongin...

1. An LED lighting device, comprising:
a rectification circuit unit for receiving an input power from a power source unit and outputting a rectified power;
an LED unit having a plurality of the LED channels connected in series and a resistor unit connected to the last end of the
LED channels;

a current sensing resistor; and
a switch circuit unit comprising a plurality of switches, wherein an nth switch is connected to the rear end of an nth LED channel so as to control an operation of the LED channel, and is controlled by a sum of a current of the nth switch and a current of an (n+1)th switch, which flows through the current sensing resistor.

US Pat. No. 9,385,289

LIGHT-EMITTING-DEVICE PACKAGE AND PRODUCTION METHOD THEREFOR

LUMENS CO., LTD., Yongin...

10. A method of manufacturing a light-emitting-device package, comprising:
preparing a metal substrate strip including aluminum;
oxidizing the metal substrate strip so that an insulating layer is formed on the metal substrate strip;
forming an aluminum reflective layer on a light emitting device seating part of the insulating layer;
providing a first electrode layer at one side of the insulating layer and providing a second electrode layer at the other
side of the insulating layer; and

seating an ultraviolet (UV) light emitting device on the light emitting device seating part,
wherein the aluminum reflective layer is disposed between the first electrode layer and the insulating layer so as to be electrically
connected to the first electrode layer.

US Pat. No. 9,320,098

LIGHTING DEVICE AND LIGHT-EMITTING DEVICE

LUMENS CO., LTD., Yongin...

1. A lighting device comprising:
a light-emitting unit comprising a current input node, a current output node, a current bypass output node, and a first light-emitting
group for emitting light due to a current input to the current input node;

a second light-emitting group connected to receive a current output from the current output node; and
a flicker controller provided between the current input node and the current bypass output node to turn off the first and
second light-emitting groups when a voltage input to the current input node is equal to or lower than a predetermined voltage,

wherein the current output node is configured to selectively output a whole or a part of a current input through the current
input node, and

wherein the current bypass output node is configured to output a remaining part of the current input through the current input
node, when the current output node outputs the part of the current.

US Pat. No. 9,930,750

METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE PACKAGES, LIGHT-EMITTING DEVICE PACKAGE STRIP, AND LIGHT-EMITTING DEVICE PACKAGE

LUMENS CO., LTD., Yongin...

1. A method for manufacturing light-emitting device packages, the method comprising:a light-emitting device mounting step for mounting a plurality of light-emitting devices on a substrate strip;
a phosphor forming step for forming a phosphor on the plurality of light-emitting devices;
a reflective member forming step for forming a reflective member on the substrate strip to surround the phosphor;
a supporting member forming step for forming a supporting member under the substrate strip to support the substrate strip; and
a package singulation step for singulating unit packages by cutting the substrate strip and the reflective member,
wherein the supporting member forming step comprises:
an insulator fixing step for fixing an insulator having provided a wiring layer thereon, under the substrate strip;
a through hole forming step for forming through holes in the insulator; and
a through electrode forming step for forming through electrodes in the through holes and forming a rear wiring layer connected to the through electrode on the wiring layer.

US Pat. No. 9,414,453

LIGHTING DEVICE

LUMENS CO., LTD., Yongin...

1. A lighting device, comprising:
a light emitting unit comprising a current input terminal, a current output terminal, a current bypass output terminal, and
a first light emitting group that emits light by a current inputted to the current input terminal; and

a second light emitting group connected to receive at least part of a current outputted through the current output terminal,
wherein the current output terminal selectively outputs an entirety of or at least part of a current inputted through the
current input terminal;

wherein the current bypass output terminal outputs the rest of the entirety of the current other than the at least part of
the current, when the current output terminal outputs the at least part of the current, and the current bypass output terminal
is connected to an another current bypass output terminal connected at a side of a current output stage of the second light
emitting group such that the rest of the entirety of the current does not flow into the second light emitting group;

wherein the light emitting unit further comprises a first bypass unit connected between the current input terminal and the
current output terminal,

when the first bypass unit is in an on-state, a part of a current inputted through the current input terminal flows through
a bypass route provided by the first bypass unit,

when the first bypass unit is in an off-state, the current inputted through the current input terminal does not flow through
the bypass route, and a transition between the on-state and the off-state of the first bypass unit is controlled by a voltage
of the current output terminal;

wherein the first bypass unit further comprises:
a resistor, one terminal of the resistor being connected at the current output terminal and the other terminal of the resistor
being connected to the first light emitting group,

a transistor connected between the other terminal and the current input terminal, and
a bias voltage supplying element providing a predetermined voltage difference between the current output terminal and a gate
of the transistor.

US Pat. No. 10,045,416

LIGHTING APPARATUS

LUMENS CO., LTD., Yongin...

1. A lighting apparatus comprising:a direct current power supply unit;
a light emitting unit operating in response to a direct current voltage applied from the direct current power supply unit and comprising first light emitting groups having a first correlated color temperature and being turned on at a first turn-on voltage (VB) and second light emitting groups having a second correlated color temperature and being turned on at a second turn-on voltage (VA) greater than the first turn-on voltage, the first light emitting groups being connected in parallel with the second light emitting groups; and
a voltage control unit located between the direct current power supply unit and the light emitting unit to control the level of a voltage applied from the direct current power supply unit to the light emitting unit wherein the voltage control unit comprises at least one variable resistor, wherein the voltage control unit operates in such a manner that a voltage having a level between the second turn-on voltage and the first turn-on voltage is applied to the light emitting unit to turn on only the first light emitting groups or a voltage greater than the second turn-on voltage is applied to the light emitting unit to turn on both the first and second light emitting groups.

US Pat. No. 10,015,853

LED LIGHTING DEVICE USING AC POWER SUPPLY

LUMENS CO., LTD., Yongin...

1. A light emitting diode (LED) lighting device, comprising:N-light emitting channels comprising a first light emitting channel, a second light emitting channel, and a third light emitting channel connected in series, wherein the first light emitting channel includes a first upstream part and a first downstream part, the second light emitting channel includes a second upstream part and a second downstream part, and the third light emitting channel includes a third upstream part and a third downstream part, N is a positive integer greater than or equal to 2;
a rectifier configured to rectify an alternating current (AC) power supply from a power source and connected to a start stage of the N-light emitting channels for power supply;
an electric power distribution unit comprising a light emitting channel connection part and a ground connection part;
a reverse-current breaking part configured to couple to the first downstream part of the first light emitting channel and the second upstream part of the second light emitting channel;
a first switch part configured to couple the first upstream part of the first light emitting channel to the second upstream part of the second light emitting channel to form a current path between the first upstream part and the second upstream part; and
a second switch part configured to couple the second upstream part of the second light emitting channel to the third upstream part of the third light emitting channel to form a current path between the second upstream part and the third upstream part.

US Pat. No. 9,543,280

LIGHT EMITTING MODULE AND LIGHTING DEVICE

LUMENS CO., LTD., Yongin...

1. A light emitting module comprising:
an electrode layer including a plurality of blocks that are insulated from each other by an electrode separating line; and
one or more light emitting elements mounted on the electrode layer so as to be electrically connected to any one block of
the blocks of the electrode layer and a neighboring block, respectively,

wherein the blocks have another neighboring block disposed in a first direction and still another neighboring block disposed
in a second direction, based on any one block of the blocks while having the electrode separating line therebetween so that
heat generated from the light emitting elements is emitted through the blocks.

US Pat. No. 9,397,278

LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, LIGHTING DEVICE AND ITS MANUFACTURING METHOD

LUMENS CO., LTD., Yongin...

1. A light emitting device package comprising:
a flip chip type light emitting device having a first pad and a second pad;
a lead frame that comprises a first electrode disposed at one side of an electrode separation space and a second electrode
disposed at the other side of the electrode separation space, and on which the light emitting device is mounted;

a first bonding medium disposed between the first pad of the light emitting device and the first electrode of the lead frame
to electrically connect the first pad and the first electrode; and

a second bonding medium disposed between the second pad of the light emitting device and the second electrode of the lead
frame to electrically connect the second pad and the second electrode,

wherein at least one first accommodating cup capable of accommodating the first bonding medium is formed in the first electrode
of the lead frame,

wherein at least one second accommodating cup capable of accommodating the second bonding medium is formed in the second electrode
of the lead frame, and

wherein at least one air discharge path is formed on each of the first and second accommodating cups to easily discharge the
air inside the first and second accommodating cups to the outside due to the first and second bonding media depressed inside
the first and second accommodating cups when the light emitting device is mounted on the lead frame.

US Pat. No. 9,713,208

LED LIGHTING DEVICE

LUMENS CO., LTD., Yoingi...

1. A light emitting diode (LED) lighting device comprising:
a light emitting element including one or more LEDs;
a triode for alternating current (TRIAC) dimmer for controlling a luminance of the light emitting element and having a first
node and a second node at an output terminal;

a bridge rectifier disposed between the TRIAC dimmer and the light emitting element, wherein the bridge rectifier is connected
between the first node and the second node of the TRIAC dimmer to configure a third node corresponding to the first node of
the TRIAC dimmer and a fourth node corresponding to the second node of the TRIAC dimmer; and

a load including a load resistor, disposed between the first node of the TRIAC dimmer and a first node of the bridge rectifier,
wherein the load is connected between the second node of the TRIAC dimmer and a second node of the bridge rectifier,
wherein the load is configured to maintain an operating current of the TRIAC dimmer so as to have the operating current of
the TRIAC dimmer does not drop below a holding current of the TRIAC dimmer at a minimum dimming level of a dimming period,
and

wherein the load resistor includes at least one first damping resistor that is connected between the first node of the TRIAC
dimmer and the first node of the bridge rectifier, and at least one second damping resistor that is connected between the
second node of the TRIAC dimmer and the second node of the bridge rectifier.

US Pat. No. 9,583,685

LIGHT-EMITTING-DEVICE PACKAGE AND PRODUCTION METHOD THEREFOR

LUMENS CO., LTD., Yongin...

1. A light emitting device package, comprising:
a substrate comprising a first surface and a second surface opposed to the first surface;
an aluminum reflective layer formed over the first surface; and
a light emitting device mounted on the aluminum reflective layer with an adhesive member interposed therebetween,
wherein the light emitting device emits ultraviolet light in a wavelength range from 200 nm to 380 nm, and
wherein the aluminum reflective layer comprises a first part on which the light emitting device mounts and a second part which
is separated from the first part by a separation line.

US Pat. No. 9,583,686

LIGHT-EMITTING-DEVICE PACKAGE AND PRODUCTION METHOD THEREFOR

LUMENS CO., LTD., Yongin...

1. A light emitting device package, comprising:
a metal substrate comprising a first surface and a second surface opposed to the first surface, wherein the metal substrate
includes a cavity in a direction of the first surface;

an insulation layer disposed outside the cavity and covering at least a portion of the first surface and at least a portion
of the second surface;

a light emitting device mounted on a bottom surface of the cavity, wherein the light emitting device is configured to emit
ultraviolet light in a wavelength range from 200 nm to 380 nm; and

a pair of electrodes coupled to the light emitting device, wherein the bottom surface of the cavity includes an aluminum component.

US Pat. No. 9,924,572

LIGHTING DEVICE

LUMENS CO., LTD., Yongin...

1. A lighting device, comprising:
a plurality of light emitting channels, each light emitting channel comprising one or more light emitting diodes (LEDs), the
plurality of light emitting channels comprising a first light emitting channel and a second light emitting channel;

a first bypass unit including one or more bypass units;
a second bypass unit including one or more bypass units,
wherein the first bypass unit is configured to electrically connect an upstream stage of the first light emitting channel
and an upstream stage of the second light emitting channel, and

wherein the second bypass unit is configured to electrically connect a downstream stage of the first light emitting channel
and a downstream stage of the second light emitting channel; and

a reverse current blocking unit disposed between an output terminal of the first bypass unit and an input terminal of the
second bypass unit,

wherein the first bypass unit and the second bypass unit have an asymmetric structure in such a way that a total number of
bypass units of the first bypass unit is one less than a total number of bypass units of the second bypass unit.

US Pat. No. 9,570,664

LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, LIGHTING DEVICE AND ITS MANUFACTURING METHOD

LUMENS CO., LTD., Yongin...

1. A light emitting device package comprising:
a flip chip type light emitting device including a first pad and a second pad;
a lead frame where the light emitting device is mounted, the lead frame comprising a first electrode disposed at one side
of an electrode separation space and a second electrode disposed at the other side of the electrode separation space;

a first bonding medium disposed between the first pad of the light emitting device and the first electrode of the lead frame
to electrically connect the first pad to the first electrode; and

a second bonding medium disposed between the second pad of the light emitting device and the second electrode of the lead
frame to electrically connect the second pad to the second electrode,

wherein at least one first accommodating cup capable of accommodating the first bonding medium is formed in the first electrode
of the lead frame, at least one second accommodating cup capable of accommodating the second bonding medium is formed in the
second electrode of the lead frame, the first pad directly contacts with an upper surface of the first electrode of the lead
frame and an upper surface of the first bonding medium in the manner of the same plane, and the second pad directly contacts
with an upper surface of the second electrode of the lead frame and an upper surface of the second bonding medium in the manner
of the same plane.

US Pat. No. 9,831,407

LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, ILLUMINATION APPARATUS, AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE PACKAGE

LUMENS CO., LTD., Yongin...

1. A light emitting device package comprising:
a light emitting device including a first terminal and a second terminal;
a substrate including a first electrode formed at one side of an electrode separating space and a second electrode formed
at the other side of the electrode separating space;

a first conductive bonding member installed on the first electrode of the substrate so as to be electrically connected to
the first terminal of the light emitting device;

a second conductive bonding member installed on the second electrode of the substrate so as to be electrically connected to
the second terminal of the light emitting device;

a reflection encapsulant installed on the substrate so as to form a reflection cup part configured to reflect light generated
in the light emitting device and filled in the electrode separating space to form an electrode separating part; and

a filler filled between the reflection cup part and the first and second conductive bonding members,
wherein the first terminal of the light emitting device includes:
a reinforcing metal layer installed to be close to the light emitting device and formed of a conductive material having a
first elongation percentage; and

a buffering metal layer installed beneath the reinforcing metal layer and formed of a conductive material having a second
elongation percentage higher than the first elongation percentage.

US Pat. No. 9,142,747

LIGHT EMITTING DEVICE PACKAGE AND BACKLIGHT UNIT COMPRISING THE SAME

LUMENS CO., LTD., Yongin...

1. A light emitting element package, comprising:
a lead frame;
a light emitting element on the lead frame;
a molded material combined with the lead frame and having an opening for emitting light generated by the light emitting element;
a reflection structure having an opening that corresponds to the opening of the molded material and contacting the molded
material; and

an adhesive layer provided in at least part of a region between the molded material and the reflection structure to fix the
reflection structure onto the molded material,

wherein the adhesive layer has a first thickness in an area adjacent to the light emitting element and a second thickness
in an area away from the light emitting element, and wherein the first thickness is greater than the second thickness.

US Pat. No. 9,608,177

LIGHT EMITTING DEVICE PACKAGE AND BACKLIGHT UNIT HAVING THE SAME

LUMENS CO., LTD., Yongin...

1. A light emitting device package comprising:
an encapsulation material disposed on a substrate to surround a light emitting device that is coupled to the substrate; and
a guide member disposed on the encapsulation material to guide an assembly path of a lens, wherein the guide member comprises:
a first inclined surface having a first inclination configured to guide a light incident part of the lens;
a second inclined surface having a second inclination greater than the first inclination and configured to further guide the
light incident part of the lens;

a top surface;
a bottom surface having an area greater than that of the top surface;
a contact surface having a contact portion which the light incident part of the lens contacts and is fixed to; and
a stopper connected to the contact surface and configured to contact a bottom surface of the light incident part of the lens.

US Pat. No. 9,748,459

METHOD FOR MANUFACTURING IMPROVED CHIP-ON-BOARD TYPE LIGHT EMITTING DEVICE PACKAGE AND SUCH MANUFACTURED CHIP-ON-BOARD TYPE LIGHT EMITTING DEVICE PACKAGE

LUMENS CO., LTD., Yongin...

1. A chip-on-board type light emitting device package comprising:
a dual frame including a base frame on which a plurality of light emitting devices are mounted and an electrode frame positioned
above the base frame so as to be spaced apart from the base frame and including two electrodes separated from each other;
and

a molding part coupled to the dual frame so that the base frame and the electrode frame are spaced apart from each other and
having an opening through which light generated in the plurality of light emitting devices is to be emitted,

wherein the base frame has a through-hole through which the electrode frame is exposed, and
wherein the molding part forms a side wall of the opening so as to expose a portion of the electrode frame, and is extended
to be filled in an overlapped region between the electrode frame and the base frame.

US Pat. No. 9,918,363

LED LIGHTING DEVICE

LUMENS CO., LTD., Yongin...

1. A light emitting diode (LED) lighting device, comprising:
a circuit for receiving an input power from a power source and outputting a rectified power;
an LED unit comprising a plurality of LED channels connected in series, each LED channel having a front end and a rear end;
a current sensing resistor; and
a switch circuit unit comprising a plurality of switches,
wherein an Nth switch is connected to the rear end of an Nth LED channel so as to control an operation of the Nth LED channel, and is controlled by a sum of a current of the Nth switch and a current of an (N+1)th switch, which flows through the current sensing resistor,

wherein, forward voltages of the LED channels are unevenly redistributed so as to keep power consumption between the Nth switch and the (N+1)th switch substantially same,

wherein the LED unit further comprises a resistor connected to a last end of the LED channels and configured to decrease heat
generated at the switch circuit unit, and

wherein N is a positive integer.

US Pat. No. 9,854,638

LIGHTING APPARATUS

LUMENS CO., LTD., Yongin...

1. A lighting apparatus comprising:
a direct current power supply unit;
a light emitting unit operating in response to a direct current voltage applied from the direct current power supply unit
and comprising first light emitting groups having a first correlated color temperature and being turned on at a first turn-on
voltage (VB) or above and second light emitting groups having a second correlated color temperature and being turned on at a second turn-on
voltage (VA) greater than the first turn-on voltage, the first light emitting groups being connected in parallel with the second light
emitting groups; and

a voltage control unit located between the direct current power supply unit and the light emitting unit to control a level
of a voltage applied from the direct current power supply unit to the light emitting unit,

wherein the voltage control unit comprises at least one variable resistor to control the level of the voltage applied to the
light emitting unit such that the second light emitting groups emit light or are prevented from emitting light, achieving
a desired correlated color temperature according to a preset proportion.

US Pat. No. 9,780,262

LIGHT-EMITTING-DEVICE PACKAGE AND PRODUCTION METHOD THEREFOR

LUMENS CO., LTD., Yongin...

1. A light emitting device package comprising:
a substrate including a first surface and a second surface opposed to the first surface;
a reflective layer formed over the first surface;
a light emitting device disposed on the reflective layer with an adhesive member interposed between the light emitting device
and the reflective layer, the light emitting device being configured to emit ultraviolet light in a wavelength range from
200 nm to 380 nm, and being coupled to electrodes; and

a dam structure having an internal region associated with the light emitting device, the dam structure being disposed on electrodes
on the first surface of the substrate.

US Pat. No. 10,001,592

BACKLIGHT UNIT, DOUBLE CONE-SHAPED REFLECTOR, DOUBLE CONE-SHAPED REFLECTOR STRIP, ILLUMINATION APPARATUS, AND METHOD OF MANUFACTURING DOUBLE CONE-SHAPED REFLECTOR

LUMENS CO., LTD., Yongin...

1. A backlight unit comprising:a flat substrate;
a light emitting device mounted on the flat substrate;
a light guide plate being disposed on the flat substrate and including an inner wall surface, the inner wall surface defining a through-hole which accommodates the light emitting device;
a hollow reflector being inserted to be disposed in the through-hole and having a contacted reflection portion contacted to the light emitting device and a spaced reflection portion spaced from the light emitting device, wherein the hollow reflector is filled with an opaque material; and
a flange part formed on an upper surface of the reflector in a plate shape and contacting a surrounding part of the through-hole to fix the reflector to the through-hole of the light guide plate, wherein the contacted reflection portion and the spaced reflection portion are configured to reflect light generated in the light emitting device to penetrate into the light guide plate through the inner wall surface.

US Pat. No. 9,997,675

LIGHT-EMITTING-DEVICE PACKAGE AND PRODUCTION METHOD THEREFOR

LUMENS CO., LTD., Yongin...

1. A light emitting device package comprising:a substrate including a first surface and a second surface opposed to the first surface;
a reflective layer formed over the first surface;
a light emitting device disposed on the reflective layer with an adhesive member disposed between the light emitting device and the reflective layer, the light emitting device being coupled to electrodes; and
a dam structure having an internal region associated with the light emitting device, the dam structure being disposed on the electrodes on the first surface of the substrate,
wherein the substrate includes at least one marginal protrusion that protrudes by a marginal length from the lateral surface.

US Pat. No. 9,741,914

LENS FOR LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE PACKAGE

LUMENS CO., LTD., Yongin...

1. A lens for a light-emitting device, the lens comprising:
a lens body comprising a light-receiving portion provided in a lower surface of the lens body, a light-emitting portion provided
on an upper surface of the lens body, and a recess provided at a center of the upper surface of the lens body; and

a flat portion provided in a horizontal shape on a bottom surface of the recess and perpendicular to a main emission line
of light emitted from a light-emitting device such that at least part of light received through the light-receiving portion
emits upwardly,

wherein a diameter of the flat portion is 1/100 to 1/10 of an inlet diameter of the light-receiving portion,
wherein the light-receiving portion is a dome-shaped recess which is concave upward,
wherein the light-emitting portion has a cross section comprising a left hemisphere including a first curvature and a first
curvature center located at a left side of a centerline, and a right hemisphere including the first curvature and a second
curvature center located at a right side of the centerline,

wherein the recess includes a cross section comprising: a left recess provided from a top surface of the left hemisphere toward
a top center point of the light-receiving portion, and a right recess provided from a top surface of the right hemisphere
toward the top center point of the light-receiving portion, and

wherein the flat portion includes a cross section provided between the left and right recesses.

US Pat. No. 9,572,212

LED LIGHTING DEVICE USING AC POWER SUPPLY

LUMENS CO., LTD., Yongin...

1. A lighting device comprising:
a first lighting part comprising a first light emission part;
a second lighting part comprising a second light emission part;
a control voltage output part configured to output a control voltage according to a peak value of an input power supply input,
wherein the first light emission part and the second light emission part are configured to switch between series- and parallel-connection
configurations according to a value of the control voltage;

a switch part connecting a first upstream part of the first light emission part and a second upstream part of the second light
emission part; and

a reverse-current breaking part connecting a first downstream part of the first light emission part and the second upstream
part, wherein the switch part is configured to form a current path between the first upstream part and the second upstream
part when the control voltage has a first logic value, and configured to block the current path when the control voltage has
a second logic value.

US Pat. No. 10,062,675

MICRO-LED ARRAY DISPLAY DEVICES

LUMENS CO., LTD., Yongin...

1. A micro-LED array display device comprising:a micro-LED panel comprising a substrate and a plurality of micro-LED pixels formed on the substrate by growing a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer in order on the substrate and removing the active layer and the second conductivity-type semiconductor layer in predetermined portions to expose the first conductivity-type semiconductor layer, whereby the micro-LED pixels have a vertical structure including the first conductivity-type semiconductor layer, the active layer, and the second conductivity-type semiconductor layer in order on the substrate and none of the micro-LED pixels is formed on the substrate in the exposed portions;
a CMOS backplane comprising a plurality of CMOS cells corresponding to the micro-LED pixels;
bumps electrically connecting the micro-LED pixels to the corresponding CMOS cells in a state in which the micro-LED pixels are arranged to face the CMOS cells; and
a first conductivity-type metal layer formed over a portion of the exposed portions of the first conductivity-type semiconductor layer, the first conductivity-type metal layer being spaced from the micro-LED pixels,
wherein the first conductivity-type metal layer functions as a common electrode of the micro-LED pixels,
wherein the micro-LED pixels are flip-chip bonded to the corresponding CMOS cells formed on the CMOS backplane through the bumps so that the micro-LED pixels are individually controlled, and
wherein the first conductivity-type metal layer has the same height as the micro-LED pixels.

US Pat. No. 9,690,030

LIGHT EMITTING DEVICE INCLUDING A LENS AT A PREDETERMINED POSITION AND BACKLIGHT UNIT COMPRISING SAME

LUMENS CO., LTD., Yongin...

1. A light emitting device comprising:
a molded material including an opening through which light generated from a light emitting element disposed in the molded
material is emitted;

a projecting support disposed along at least part of a circumference of the opening of the molded material;
a lens including an inner surface that defines an internal surface on which the light emitted from the light emitting element
is incident, an outer surface that defines an external surface from which the incident light is emitted to the outside, and
a bottom surface that connects the inner surface and the outer surface, wherein a boundary between the inner surface and the
bottom surface contacts the projecting support, or a lower part of the inner surface contacts the projecting support, or the
bottom surface contacts the projecting support; and

a lead frame on which the light emitting element is mounted and includes a first lead and a second lead spaced apart from
each other,

wherein an upper part of the opening of the molded material includes a circular shape, and a lower part of the opening of
the molded material includes a rectangular shape disposed in a footprint of the circular shape,

wherein the molded material is bonded to the lead frame such that part of a top surface of the first lead and part of a top
surface of the second lead are exposed to an area defined by the rectangular shape,

wherein the rectangular shape includes four sides that are not parallel to one direction along which a lead separation region
between the first and second leads extends,

wherein a convergence point of two sides that converge on the first lead among the four sides is connected to a first curve
projecting in a direction away from the lead separation region, and

wherein a convergence point of two sides that converge on the second lead among the four sides is connected to a second curve
projecting in a direction away from the lead separation region.

US Pat. No. 9,985,176

LIGHT EMITTING DIODE WITH REFLECTIVE PART FOR UVA AND BLUE WAVELENGTHS

Lumens Co., Ltd., Yongin...

1. A light emitting diode comprising:a first conductivity type semiconductor layer having a front side and a back side;
a second conductivity type semiconductor layer having a front side and a back side;
an active layer formed between the back side of the first conductivity type semiconductor layer and the front side of the second conductivity type semiconductor layer;
a second conductivity type reflective layer formed on the back side of the second conductivity type semiconductor layer; and
a reflective part formed on the back side of the second conductivity type reflective layer opposite the second conductivity type semiconductor layer to reflect light of a short wavelength (UVA wavelength) band and light of a blue wavelength band and electrically connected to the second conductivity type semiconductor layer,
wherein the reflective part comprises a second conductivity type intermediate layer for improving ohmic contact and a reflective metal layer for reflecting light of the short wavelength band and light of the blue wavelength band.

US Pat. No. 10,074,788

LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, ILLUMINATION APPARATUS, AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE PACKAGE

LUMENS CO., LTD., Yongin...

1. A light emitting device package comprising:a light emitting device including a first terminal and a second terminal;
a substrate including a first electrode formed at one side of an electrode separating space and a second electrode formed at the other side of the electrode separating space;
a first conductive bonding member installed on the first electrode of the substrate so as to be electrically connected to the first terminal of the light emitting device;
a second conductive bonding member installed on the second electrode of the substrate so as to be electrically connected to the second terminal of the light emitting device; and
a reflection encapsulant installed on the substrate so as to form a reflection cup part configured to reflect light generated in the light emitting device and filled in the electrode separating space to form an electrode separating part,
wherein a height of the first terminal from the bottom of the substrate is the same as a height of the second terminal from the bottom of the substrate, and the electrode separating part has a height higher than that of the substrate, and
wherein the first terminal of the light emitting device includes:
a reinforcing metal layer installed to be close to the light emitting device and formed of a conductive material; and
a buffering metal layer installed beneath the reinforcing metal layer and formed of a conductive material, and contacted with the first conductive bonding member.

US Pat. No. 10,056,527

UV LED PACKAGE

LUMENS CO., LTD., Yongin...

1. An ultra-violet (UV) light emitting diode (LED) package comprising:a submount comprising a heat dissipating substrate, a first reflective electrode film and a second reflective electrode film separated from the first reflective electrode film by an electrode separation gap on the heat dissipating substrate, a first flip-chip bonding pad and a first wire bonding pad disposed on the first reflective electrode film, and a second flip-chip bonding pad and a second wire bonding pad disposed on the second reflective electrode film;
a UV LED chip adapted to emit UV light at 200 nm to 400 nm, the UV LED chip comprising a first conductive electrode pad corresponding to the first flip-chip bonding pad and a second conductive electrode pad corresponding to the second flip-chip bonding pad, and flip-chip bonded to the submount through a first bonding bump disposed between the first flip-chip bonding pad and the first conductive electrode pad and a second bonding bump disposed between the second flip-chip bonding pad and the second conductive electrode pad; and
a package body mounted on the submount and comprising a first metal body electrically connected to the first wire bonding pad through a first bonding wire and a second metal body separated from the first metal body by an insulating material and electrically connected to the second wire bonding pad through a second bonding wire,
wherein the first flip-chip bonding pad comprises a recess formed at a position adjacent to the electrode separation gap so as to be sufficiently spaced apart from one area of the electrode separation gap.

US Pat. No. 9,853,017

LIGHT EMITTING DEVICE PACKAGE AND LIGHT EMITTING DEVICE PACKAGE MODULE

LUMENS CO., LTD., Yongin...

1. A light emitting device package comprising:
a base including a cavity;
a first light emitting device disposed in the cavity, the first light emitting device including a first light emitting element
configured to produce light having a first peak wavelength and a first fluorescent layer covering a top surface and a side
surface of the first light emitting element;

a second light emitting device disposed in the cavity, the second light emitting device including a second light emitting
element configured to produce light having a second peak wavelength and a second fluorescent layer covering a top and side
surfaces-of the second light emitting element; and

a molding member configured to fill the cavity, the molding member being disposed on the first light emitting device and the
second light emitting device, and the molding member including a molding spacing portion disposed between the first light
emitting device and the second light emitting device so as to separate the first light emitting device and the second light
emitting device,

wherein the first fluorescent layer is configured to convert the light having the first peak wavelength of the first light
emitting element to light having a third peak wavelength, and the second fluorescent layer is configured to convert the light
having the second peak wavelength of the second light emitting element to light having a fourth peak wavelength,

wherein an edge of the molding member is configured to define a sealing portion which is disposed on a portion of a top of
the base surrounding the cavity, and

wherein the sealing portion of the molding member includes a slope profile and a flat profile, the slope profile is extended
from a central portion of the molding member and includes a predetermined gradient in a side direction and the flat profile
is extended from the slope profile and includes a gradient of substantially zero.

US Pat. No. 10,103,131

LED MODULE AND METHOD FOR FABRICATING THE SAME

LUMENS CO., LTD., Yongin...

1. A display module comprising:a substrate;
a plurality of electrode patterns arranged in a matrix on the substrate, and each of the electrode patterns includes a common electrode pad aligned to a first end line parallel to the lengthwise direction of the matrix on the substrate, and a first individual electrode pad, a second individual electrode pad and a third individual electrode pad aligned to a second end line parallel to the first end line; and
a plurality of groups of LED chips arranged in a matrix on the substrate, and each of groups of LED chips includes a first LED chip, a second LED chip, and a third LED chip arrayed in a line along the lengthwise direction which emit lights at different wavelengths when power is applied thereto,
wherein the plurality of electrode patterns have a same height as a whole, and the first individual electrode pad, the second individual electrode pad and the third individual electrode pad comprise a first end, a second end and a third end adjacent to the first end line respectively.

US Pat. No. 10,015,852

LIGHTING DEVICE

LUMENS CO., LTD., Yongin...

1. A light emitting diode (LED) lighting device comprising:at least one LED cell including linearly connected N light emitting channels, N being a value greater than or equal to 2, and the N emitting channels having separately a current input terminal and a current output terminal;
a jump circuit unit connected between an input stage of a Mth light emitting channel and an input stage of a (M+1)th light emitting channel among the light emitting channels, and intermittently connecting a current flowing through a connection path;
an electric power distribution circuit unit intermittently connecting a current flowing to a ground at each connecting unit between the light emitting channels; and
a reverse current blocking unit blocking from a current flowing towards the rectifier at a connection unit disposed between the Mth light emitting channel and the (M+1)th light emitting channel,
wherein the M is a natural number not smaller than 1 and not greater than (N?1),
wherein when the current flows through the jump circuit unit, the current flows through the electric power distribution circuit unit, and when the current does not flow through the jump circuit unit, the current does not flow through the electric power distribution circuit unit.

US Pat. No. 9,853,187

LIGHT EMITTING DIODE

Lumens Co., Ltd., Yongin...

1. A light emitting diode comprising:
a first conductivity type semiconductor layer having a front side and a back side;
a second conductivity type semiconductor layer having a front side and a back side;
an active layer formed between the back side of the first conductivity type semiconductor layer and the front side of the
second conductivity type semiconductor layer;

a second conductivity type reflective layer formed on the back side of the second conductivity type semiconductor layer;
a reflective part formed on the back side of the second conductivity type reflective layer opposite the second conductivity
type semiconductor layer to reflect light of a short wavelength (UVA wavelength) band and light of a blue wavelength band;

the reflective part electrically connected to the second conductivity type semiconductor layer wherein the second conductivity
type reflective layer comprises distributed bragg reflector (DBR) unit layers for reflecting light of a short wavelength (UVA
wavelength) band of 315 nm to 420 nm, each of the DBR unit layers comprises a low refractive index layer and a high refractive
index layer adjacent to the low refractive index layer;

the low refractive index layer and the high refractive index layer comprise AlxGa1-xN (0
the DBR unit layers are repeated in at least triplicate in the second conductivity type reflective layer, and when the total
doping concentration of the second conductivity type dopant in the initial three DBR unit layers placed closest to the back
side of the second conductivity type semiconductor layer and the total doping concentration of the second conductivity type
dopant in the other DBR unit layers are defined as first and second doping concentrations, respectively, the first doping
concentration is lower than the second doping concentration.

US Pat. No. 9,824,952

LIGHT EMITTING DEVICE PACKAGE STRIP

LUMENS CO., LTD., Yongin...

1. A light emitting device package comprising:
a light emitting device having a first electrode pad and a second electrode pad; and
a molding member including a preformed reflector sheet having an upper surface, a lower surface, and a hole connected from
the upper surface to the lower surface,

wherein the light emitting device is inserted and fixed into the hole, the first electrode pad and the second electrode pad
are exposed to the outside of the hole, and lower surfaces of the first electrode pad and the second electrode pad are coplanar
with the lower surface of the preformed reflector sheet;

wherein the light emitting device includes: a light transmitting substrate, a first conductive-type semiconductor layer, an
active layer, and a second conductive-type semiconductor layer sequentially disposed from a top toward a bottom of the light
emitting device;

wherein the light emitting device is a flip-chip light emitting device in which a first conductive-type pad of a region of
the first conductive-type semiconductor layer opened by mesa etching and a second conductive-type pad of a region of the second
conductive-type semiconductor layer are bonded to the first electrode pad and the second electrode pad, respectively;

wherein a light transmitting substrate, the first conductive-type semiconductor layer, the first electrode pad and the second
electrode pad are enclosed by inner side surfaces of the preformed reflector sheet to be vertically contacted without empty
space;

wherein the upper surface of the light emitting device and the upper surface of the preformed reflector sheet are coplanar
with each other; and

wherein bottom surfaces of the reflector sheet, the first electrode pad and the second electrode pad are exposed such that
the bottom surfaces of the first electrode pad and the second electrode pad are capable of one or more electrical connections.

US Pat. No. 9,806,245

LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE PACKAGE

LUMENS CO., LTD., Yongin...

1. A light emitting device package comprising:
a light emitting device including a first pad and a second pad;
a lead frame including a first electrode disposed at one side of an electrode separation space and a second electrode disposed
at the other side of the electrode separation space, and the lead frame having the light emitting device seated thereon;

a first bonding medium disposed between the first pad of the light emitting device and the first electrode of the lead frame
such that the first pad of the light emitting device and the first electrode of the lead frame are electrically connected
to each other; and

a second bonding medium disposed between the second pad of the light emitting device and the second electrode of the lead
frame such that the second pad of the light emitting device and the second electrode of the lead frame are electrically connected
to each other,

wherein at least one first accommodating cup part configured to accommodate the first bonding medium therein is formed in
the first electrode of the lead frame, and at least one second accommodating cup part configured to accommodate the second
bonding medium therein is formed in the second electrode of the lead frame,

wherein a width or a length of an inlet of the at least one first accommodating cup part is smaller than a width or a length
of the first pad and a width or a length of an inlet of the at least one second accommodating cup part is smaller than a width
or a length of the second pad of the light emitting device such that one portion of the first pad of the light emitting device
directly contacts the first electrode of the lead frame and one portion of the second pad of the light emitting device directly
contacts the second electrode of the lead frame, and

wherein the first bonding medium is housed in the at least one first accommodating cup part so that the one portion of the
first pad of the light emitting device can be directly contacted to the first electrode of the lead frame, and the second
bonding medium is housed in the at least one second accommodating cup part so that the one portion of the second pad of the
light emitting device can be directly contacted to the second electrode of the lead frame.

US Pat. No. 9,788,377

LED LIGHTING DEVICE USING AC POWER SUPPLY

LUMENS CO., LTD., Yongin...

1. A lighting device comprising:
a first light emission unit coupled to an input power supply, the first light emission unit including a first plurality of
light emission groups;

a second light emission unit coupled to the first light emission unit, the second light emission unit including a second plurality
of light emission groups;

a peak detector configured to measure a magnitude of a voltage of an input power from the input power supply and configured
to detect a peak voltage of the input power;

a driving part configured to control a value of a current flowing through the second light emission unit or the first light
emission unit, based on the detected peak voltage of the input power;

a switch part configured to change an electrical connection between the first light emission unit and the second light emission
unit to either a series connection or a parallel connection, based on the detected peak voltage of the input power; and

a plurality of bypass switches configured to change an electrical connection between two adjacent light emission groups within
the first light emission unit or the second light emission unit to either a series connection or a parallel connection, based
on the detected peak voltage of the input power,

wherein each of the plurality of bypass switches is configured to individually and independently correspond to each of the
light emission groups in the first light emission unit and the second light emission unit,

wherein the switch part is further configured to:
change the electrical connection between the first light emission unit and the second light emission unit to the parallel
connection, when the detected peak voltage is less than a first voltage;

change the electrical connection between the first light emission unit and the second light emission unit to the serial connection,
when the detected peak voltage is greater than the first voltage;

maintain the parallel connection of the first light emission unit and the second light emission unit, in a region where a
forward voltage when all of the light emission groups of the first light emission unit are connected in series is below a
predetermined voltage; and

switch to the series connection of the first light emission unit and the second light emission unit, in a region where the
forward voltage when all of the light emission groups of the first light emission unit are connected in series is equal to
or greater than the predetermined voltage.

US Pat. No. 10,015,850

LIGHTING APPARATUS

LUMENS CO., LTD., Yongin...

1. A lighting apparatus comprising:a power supply unit generating alternating current (AC) power;
a first light emitting unit connected in series to the power supply unit and including a plurality of light emitting groups, each light emitting group including at least one light emitting diode element that emits light according to a power supply voltage from the power supply unit, the plurality of light emitting groups each being connected to one another in series;
a second light emitting unit connected in series to the first light emitting unit and including a plurality of light emitting groups, each light emitting group including at least one light emitting diode element that emits light according to an input voltage through the power supply unit or the first light emitting unit, the plurality of light emitting groups each being connected to one another in series;
a first distribution switch unit including a plurality of switches arranged to correspond to the respective light emitting groups so as to switch on or off a current of the light emitting diode element, wherein one end of each switch is connected to a rear stage of each of the plurality of light emitting groups in the first light emitting unit and the other ends of the plurality of switches are connected in common;
a second distribution switch unit including a plurality of switches arranged to correspond to the respective light emitting groups so as to switch on or off a current of the light emitting diode element, wherein one end of each switch is connected to a rear stage of each of the plurality of light emitting groups in the second light emitting unit and the other ends of the plurality of switches are connected in common;
a voltage detecting unit connected in series to the power supply unit and measuring a power supply voltage from the power supply unit;
a switching controlling unit for determining whether to connect the first light emitting unit and the second light emitting unit in parallel or in series, based on a peak value of the power supply voltage measured and maintained by the voltage detecting unit;
a reference voltage controlling unit for selectively controlling the switches in the first distribution switch unit and the second distribution switch unit which are connected to the respective rear stages of the light emitting groups in the first light emitting unit and the second light emitting unit, according to the power supply voltage value measured by the voltage detecting unit, in such a manner as to light up the plurality of light emitting groups sequentially from the light emitting group closest to the power supply unit;
a first variable resistor unit connected between the other ends connecting the respective switches in common in the first distribution switch unit and a ground, and including a variable resistor;
a second variable resistor unit connected between the other ends connecting the respective switches in common in the second distribution switch unit and the ground, and including a variable resistor;
a power controlling unit changing resistance values of the variable resistors included in the first variable resistor unit and the second variable resistor unit, based on the peak value of the power supply voltage measured and maintained by the voltage detecting unit, to constantly maintain power consumed by the first light emitting unit and the second light emitting unit; and
a switch unit connected in series between the power supply unit and the second light emitting unit and controlled by the switching controlling unit, wherein the switch unit is turned on to connect the first light emitting unit and the second light emitting unit in parallel when the peak value of the power supply voltage measured and maintained by the voltage detecting unit is smaller than a switching control reference voltage, and the switch unit is turned off to connect the first light emitting unit and the second light emitting unit in series when the peak value of the power supply voltage measured and maintained by the voltage detecting unit is greater than the switching control reference voltage,
wherein the power controlling unit is configured to:
change the resistance values of the variable resistor of the first variable resistor unit and the variable resistor of the second variable resistor unit to a same resistance value when the peak value of the power supply voltage measured and maintained by the voltage detecting unit is smaller than the switching control reference voltage, and
change the resistance values of the variable resistor of the first variable resistor unit and the variable resistor of the second variable resistor unit to respectively different resistance values when the peak value of the power supply voltage measured and maintained by the voltage detecting unit is greater than the switching control reference voltage,
wherein the reference voltage controlling unit provides a first distribution switch reference voltage to the first distribution switch unit and the second distribution switch unit when the peak value of the power supply voltage measured and maintained by the voltage detecting unit is smaller than the switching control reference voltage, and
wherein the reference voltage controlling unit provides the first distribution switch reference voltage to the first distribution switch unit and a second distribution switch reference voltage having a value greater than the first distribution switch reference voltage to the second distribution switch unit when the peak value of the power supply voltage measured and maintained by the voltage detecting unit is greater than the switching control reference voltage.

US Pat. No. 9,933,560

LIGHT EMITTING DEVICE PACKAGE WITH AN UPPER COVER HAVING AN INTERVAL MAINTAINING PART, BACKLIGHT UNIT, AND METHOD OF MANUFACTURING LIGHT EMITTING APPARATUS

LUMENS CO., LTD., Yongin...

1. A light emitting device package comprising:a substrate having a first electrode formed at one side of an electrode separation line and a second electrode formed at the other side of the electrode separation line;
a light emitting device including a first pad electrically connected to the first electrode and a second pad electrically connected to the second electrode;
a reflection molding member installed on the substrate, having a form in which a front surface thereof is opened so as to induce light generated by the light emitting device toward the front of the light emitting device package, and including a reflection cup part of which an upper portion is opened so as to accommodate the light emitting device therein;
an upper cover formed in a shape corresponding to that of an upper surface of the reflection molding member so as to cover the light emitting device and the opened upper portion of the reflection cup part of the reflection molding member; and
an interval maintaining part formed at the upper cover such that a predetermined optical interval is maintained between a light guide plate and the light emitting device, the interval maintaining part being protruding from a front surface of the upper cover toward the light guide plate such that a front end thereof contacts the light guide plate,
wherein the upper cover comprises a plurality of protrusions configured in such a way that the plurality of protrusions of the upper cover couple with grooves of the reflection molding member to cover the opened upper portion of the reflection cup part of the reflection molding member.

US Pat. No. 9,923,128

LIGHT EMITTING DEVICE PACKAGE AND BACKLIGHT UNIT HAVING THE SAME

LUMENS CO., LTD., Yongin...

1. A light emitting device package comprising:
a substrate;
a light emitting device disposed on the substrate; and
a guide member disposed on an encapsulation material,
wherein the guide member comprises:
a top surface;
at least one inclined surface to guide a light incident part of a lens, the lens including at least one engaging surface to
contact the guide member; and

a bottom surface configured to contact the encapsulation material,
the encapsulation material being configured to surround the light emitting device and including a stopper configured to contact
the at least one engaging surface of the lens; and

wherein the at least one inclined surface of the guide member comprises a contact surface including a first inclined surface
and a second inclined surface, the first inclined surface being inclined to the top surface, and the second inclined surface
being inclined to the first inclined surface and to the top surface.

US Pat. No. 10,165,637

LED LIGHTING DEVICE USING AC POWER SUPPLY

LUMENS CO., LTD., Yongin...

1. A light emitting diode (LED) lighting device comprising:a power source configured to produce a plurality of different output voltage;
N-light emitting channels comprising a first light emitting channel, a second light emitting channel, and a third light emitting channel connected in series, and coupled to the power source;
a rectifier configured to rectifier an alternating current (AC) power supply from the power source and connected to a start stage of the first light emitting channel; and
a control voltage output part including a peak detector and a voltage comparator, the peak detector hold and output a peak value of the plurality of different out voltage of the power source and the voltage comparator compare the peak value with a present value and outputs a control voltage having a value corresponding to a high logical value when the peak value is greater than the present value.

US Pat. No. 9,781,791

LIGHTING DEVICE

LUMENS CO., LTD., Yongin...

1. A lighting device, comprising:
a plurality of light emitting channels sequentially connected, each light emitting channel including one or more light emitting
devices (LEDs);

a rectifying unit configured to rectify alternating current (AC) power and provide the rectified AC power to the plurality
of light emitting channels;

a first bypass unit;
a second bypass unit,
wherein:
the first bypass unit intermittently and electrically connects an upstream stage of a first light emitting channel, which
is at an arbitrary location, and an upstream stage of a second light emitting channel, which is disposed at an arbitrary location
behind the first light emitting channel towards downstream; and

the second bypass unit intermittently and electrically connects a downstream stage of the first light emitting channel and
a downstream stage of the second light emitting channel or a downstream stage of a third light emitting channel, which is
disposed at an arbitrary location behind the second light emitting channel towards downstream; and

a reverse current blocking unit disposed between an output terminal of the first bypass unit and an input terminal of the
second bypass unit, wherein the first bypass unit and the second bypass unit have an asymmetric structure.

US Pat. No. 10,085,319

LIGHTING APPARATUS

LUMENS CO., LTD., Yongin...

1. A lighting apparatus comprising:a power supply unit;
a light emitting unit operating in response to a voltage applied from the power supply unit and comprising at least one first light emitting group having a first correlated color temperature and being turned on at a first turn-on voltage (VB) and at least one second light emitting group having a second correlated color temperature and being turned on at a second turn-on voltage (VA) greater than the first turn-on voltage, the first light emitting groups being connected in parallel with the second light emitting groups;
a substrate mounting the light emitting unit; and
a voltage control unit controlling the level of the voltage applied from the power supply unit to the light emitting unit,
wherein the first light emitting groups are arranged inside the second light emitting groups on the substrate,
wherein the voltage is increased from the voltage lower than the first turn-on voltage to the voltage higher than the second turn-on voltage, the light emitting unit is emitted from the inside of the substrate and emitted from the first light emitting group to the second light emitting group.

US Pat. No. 9,985,175

LED PANEL

LUMENS CO., LTD., Yongin...

1. An LED panel comprising: LED chips, each of which comprises a sapphire substrate, a plurality of light emitting cells disposed below the sapphire substrate, and an etched portion formed between the plurality of light emitting cells; and a mount substrate on which the LED chips are mounted by flip bonding, wherein each of the LED chip comprises a plurality of color cells formed corresponding to the plurality of light emitting cells on the sapphire substrate to change or maintain the color of light from the corresponding light emitting cells and a plurality of light collecting portions formed corresponding to the plurality of light emitting cells and the plurality of color cells on the bottom surface of the substrate and adapted to collect light from the corresponding light emitting cells on the corresponding color cells.

US Pat. No. 10,062,809

LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, LIGHTING DEVICE AND ITS MANUFACTURING METHOD

LUMENS CO., LTD., Yongin...

1. A light emitting device package, comprising:a substrate including a first electrode, a second electrode, and an electrode separating portion between the first electrode and the second electrode;
a light emitting device including a body, a first pad and a second pad, the first pad and the second pad being disposed on a bottom surface of the body facing the substrate, wherein the first pad and the second pad of the light emitting device are coupled to the first electrode and the second electrode, respectively, of the substrate; and
a phosphor layer disposed on a top surface of the body of the light emitting device, wherein the phosphor layer is configured to include a top surface in a form of a convex lens shape, the top surface of the phosphor layer facing away from the light emitting device, and wherein a cross section at a center of the phosphor layer has a larger thickness than a cross section at a boundary area of the phosphor layer such that an optical length is uniform over an entire area of the phosphor layer so as to have a uniform color and brightness in the boundary area of the phosphor layer.

US Pat. No. 9,941,259

LED MODULE AND METHOD FOR FABRICATING THE SAME

LUMENS CO., LTD., Yongin...

1. A display module comprising:a substrate;
a plurality of electrode patterns having a predetermined height arranged in a matrix on the substrate; and
a plurality of groups of LED chips arranged in a matrix on the substrate so as to have the same height as a whole and correspond to the electrode patterns,
wherein:
each of the electrode patterns comprises a common electrode pad aligned to a first end line parallel to the lengthwise direction of the matrix, and a first individual electrode pad, a second individual electrode pad, and a third individual electrode pad aligned to a second end line parallel to the first end line and located between the first end line and the second end line;
each of the groups of LED chips comprises a first LED chip, a second LED chip, and a third LED chip arrayed in a line along the lengthwise direction and emitting light at different wavelengths when power is applied thereto;
each of the first LED chip, the second LED chip, and the third LED chip has an epilayer structure comprising a laminate structure of a light transmission growth substrate, a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer and has a first area where the second conductive semiconductor layer is exposed and a second area where the first conductive semiconductor layer is exposed;
the first LED chip has a 1st first electrode bonded to the first individual electrode pad through a 1st first bump formed on the first area and a 1st second electrode bonded to the common electrode pad through a 1st second bump formed on the second area at the side facing the substrate;
the second LED chip has a 2nd first electrode bonded to the second individual electrode pad through a 2nd first bump formed on the first area and a 2nd second electrode bonded to the common electrode pad through a 2nd second bump formed on the second area at the side facing the substrate;
the third LED chip has a 3rd first electrode bonded to the third individual electrode pad through a 3rd first bump formed on the first area and a 3rd second electrode bonded to the common electrode pad through a 3rd second bump formed on the second area at the side facing the substrate; and
the first area of the first LED chip, the first area of the second LED chip, and the first area of the third LED chip have the same height, the second area of the first LED chip, the second area of the second LED chip, and the second area of the third LED chip have the same height, the 1st first bump, the 2nd first bump, and the 3rd first bump have the same first height when finally compressed, the 1st second bump, the 2nd second bump, and the 3rd second bump have the same second height when finally compressed, and the first height and the second height are determined so as to compensate for different heights of the first LED chip, the second LED chip, and the third LED chip due to the step height between the first areas and the second areas.

US Pat. No. 10,128,308

MICRO LED DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

LUMENS CO., LTD., Yongin...

1. A micro light emitting diode (LED) display device, comprising:a micro LED panel in which a plurality of micro LED pixels is arranged in rows and columns; and
a micro LED driving substrate (backplane) configured to include an active matrix (AM) circuit unit including a plurality of CMOS cells corresponding to the plurality of micro LED pixels, and a control circuit unit disposed in an outer region of the AM circuit unit,
wherein the control circuit unit is disposed to be adjacent to two sides among four sides of the micro LED panel,
wherein a first conductive metal layer serves as a common electrode of the plurality of micro LED pixels, and
wherein the first conductive metal layer is formed along an outer region of the micro LED panel, and positioned on two sides of the micro LED panel according to a layout of the control circuit unit.

US Pat. No. 10,074,787

LIGHT EMITTING DIODE

LUMENS CO., LTD., Yongin...

1. A light emitting diode comprising:a plurality of light emitting cells comprising a first light emitting cell and a second light emitting cell spaced apart from each other on a single substrate;
a continuous passivation layer formed over the upper surface and one facet of the first light emitting cell, the upper surface and the other facet of the second light emitting cell, and the substrate, wherein the other facet of the second light emitting cell corresponds to the one facet of the first light emitting cell; and
an interconnection layer formed on the passivation layer to directly and electrically connect the first light emitting cell to the second light emitting cell,
wherein the interconnection layer comprises an edge lump portion formed around a first edge where the upper surface and the one facet of the first light emitting cell meet each other or a second edge where the upper surface and the other facet of the second light emitting cell meet each other, and wherein the edge lump portion protrudes in a direction away from the edge;
wherein the edge lump portion comprises:
an upper portion extending in a vertical direction of the passivation layer,
a lateral portion extending in a lateral direction of the passivation layer, and
an intermediate portion connecting the upper portion with the lateral portion,
wherein at least one of the normal thickness of the upper portion of the edge lump portion, the normal thickness of the lateral portion of the edge lump portion, and the normal thickness of the intermediate portion of the edge lump portion are larger than a thickness of other portion other than the edge lump portion in the interconnection layer;
wherein the interconnection layer comprises a first interconnection layer formed on the passivation layer and a second interconnection layer formed on the first interconnection layer, and
wherein the edge lump portion is formed in the second interconnection layer.

US Pat. No. 10,206,256

LED LIGHTING DEVICE

LUMENS CO., LTD., Yongin...

1. A light emitting diode (LED) lighting device, comprising:a rectifier circuit for receiving an input power from a power source unit and outputting a rectified power;
an LED unit comprising a plurality of LED channels, the plurality of LED channels being connected in series and comprising a first LED channel, a second LED channel and a Nth LED channel, wherein each LED channel includes a front part and a rear part;
a resistor unit is connected in series to a front part of the Nth LED channel; and
a switch unit comprising a first switch, a second switch and a (N+1)th switch,
wherein the switch unit is configured to operate the LED channels and the resistor unit, and part of the first LED channel,
wherein a front part of the resistor unit is connected to the (N+1)th switch, and
wherein heat generated at the (N+1)th switch is distributed to the resistor unit when an input voltage that is equal to or greater than a rated voltage is inputted.

US Pat. No. 10,074,636

LED MODULE AND METHOD FOR FABRICATING THE SAME

LUMENS CO., LTD., Yongin...

1. A method for fabricating a display module, comprising:forming electrode patterns, each of which comprises a first individual electrode pad, a second individual electrode pad, a third individual electrode pad, and a common electrode pad, in a matrix on a substrate;
loading 1st first bumps, 2nd first bumps, and 3rd first bumps on the first individual electrode pads, the second individual electrode pads, and the third individual electrode pads, respectively, and loading 1st second bumps, 2nd second bumps, and 3rd second bumps on the common electrode pads;
bonding LED chips comprising first LED chips having 1st first electrodes and 1st second electrodes, second LED chips having 2nd first electrodes and 2nd second electrodes, and third LED chips having 3rd first electrodes and 3rd second electrodes in a matrix to a bonding carrier;
moving the bonding carrier such that the 1st first electrodes, the 2nd first electrodes, and the 3rd first electrodes face the 1st first bumps, the 2nd first bumps, and the 3rd first bumps, respectively, and the 1st second electrodes, the 2nd second electrodes, and the 3rd second electrodes face the 1st second bumps, the 2nd second bumps, and the 3rd second bumps, respectively; and
pressurizing the first LED chips, the second LED chips, and the third LED chips to a predetermined pressure such that the 1st second bumps, the 2nd second bumps, and the 3rd second bumps are compressed to a first height and the 1st second bumps, the 2nd second bumps, and the 3rd second bumps are compressed to a second height (chip placing down),
wherein each of the electrode patterns is formed such that the common electrode pad is aligned to a first end line parallel to the lengthwise direction of the matrix, and the first individual electrode pad, the second individual electrode pad, and the third individual electrode pad are aligned to a second end line parallel to the first end line and are located between the first end line and the second end line; and the chip placing down is carried out such that the first LED chip, the second LED chip, and the third LED chip are arrayed in a line along the lengthwise direction.

US Pat. No. 10,096,586

LED DISPLAY MODULES AND METHODS FOR MAKING THE SAME

LUMENS CO., LTD., Yongin...

1. A method for fabricating a display module, comprising:preparing an active matrix substrate comprising a plurality of control units;
transferring a plurality of pairs of solder bumps arranged in a matrix on a bump support to the active matrix substrate by primary transfer printing while maintaining an original matrix of the solder bumps;
transferring a plurality of light emitting diode (LED) chips arranged in a matrix on a chip support to the active matrix substrate by secondary transfer printing while maintaining an original matrix of the LED chips;
forming grid barriers on the active matrix substrate on which the plurality of LED chips are arranged in a matrix, to isolate the plurality of LED chips into individual chip units; and
matching a plurality of color cells comprising first color cells, second color cells, and third color cells disposed consecutively in one direction to the plurality of LED chips.

US Pat. No. 10,177,291

LENS FOR LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE PACKAGE

LUMENS CO., LTD., Yongin...

1. A method of manufacturing a light-emitting device package, the method comprising:preparing an alignment jig comprising one or more alignment pins;
aligning a lead frame strip on the alignment jig by passing the alignment pins through alignment holes of the lead frame strip having mounted a plurality of light-emitting devices thereon;
applying an adhesive in a plurality of lens holes of the aligned lead frame strip; and
aligning a lens strip on the lead frame strip by passing the alignment pins through alignment holes of the lens strip comprising a plurality of lenses, and inserting and bonding at least parts of the lenses into the lens holes in which the adhesive is applied,
wherein the lenses include connection grooves, and the lenses are interconnected by each lens bridge inserted into the connection grooves of the lenses adjacent to each other.

US Pat. No. 10,164,149

LED PANEL

LUMENS CO., LTD., Yongin...

1. An LED panel comprising LED chips and a mount substrate on which the LED chips are mounted wherein each of the LED chips comprises a substrate having a patterned surface, a plurality of light collecting portions, each of which comprises a reflection plane formed on the pattern, and a plurality of light emitting cells which are formed from an epilayer formed on the substrate to cover the plurality of light collecting portions and each of which comprises an active layer and a p-type semiconductor layer on an n-type area comprising the surface of an n-type semiconductor layer, and wherein the plurality of light emitting cells are formed corresponding to the plurality of light collecting portions.

US Pat. No. 10,163,870

LIGHT EMITTING DEVICE PACKAGE AND LIGHT EMITTING DEVICE PACKAGE MODULE

LUMENS CO., LTD., Yongin...

1. A light emitting device package, comprising:a substrate including a first electrode, a second electrode, and an electrode separation portion disposed between the first electrode and the second electrode;
a first light emitting device including a first pad and a second pad, the first pad being electrically coupled to the first electrode of the substrate;
a second light emitting device including a third pad and a fourth pad, the fourth pad being electrically coupled to the second electrode of the substrate;
a pad connecting member, the pad connecting member being disposed on the substrate and configured to electrically couple the second pad of the first light emitting device and the third pad of the second light emitting device; and
an electrode separation extension portion,
wherein the substrate is configured to electrically couple the first light emitting device and the second light emitting device in series via the pad connecting member, and
wherein the electrode separation extension portion of which a width is extended is disposed on the electrode separation portion.

US Pat. No. 10,210,795

LED DISPLAY MODULE

LUMENS CO., LTD., Yongin...

1. An LED display module comprising:a substrate;
a plurality of multi-pixel packages arrayed in a matrix with rows and columns on the substrate, each multi-pixel package comprising:
a package substrate;
a plurality of pixels on the package substrate, each pixel comprising a red LED chip, a green LED chip, and a blue LED chip; and
a plurality of common electrode pads disposed on an upper surface of the package substrate, each common electrode pad being connected in common to anode terminals of the LED chips of the corresponding pixel; and
a driver IC adapted to independently control the pixels of the multi-pixel packages,
wherein the plurality of common electrode pads that are disposed adjacent to one another in the row direction are connected to each other.

US Pat. No. 10,283,678

LIGHT-EMITTING-DEVICE PACKAGE AND PRODUCTION METHOD THEREFOR

LUMENS CO., LTD., Yongin...

14. A backlight unit comprising:a substrate;
a light guide plate disposed on the substrate; and
a light emitting device package connected to a printed circuit board,
wherein the light emitting device comprising: a metal substrate including a first surface and a second surface opposed to the first surface;
an insulation layer covering at least a portion of the first surface and at least a portion of the second surface;
a first electrode layer provided at one side of the insulating layer;
a second electrode layer provided at the other side of the insulating layer; and
a light emitting device that is electrically connected to the first electrode layer and the second electrode layer and emit ultraviolet light,
wherein UV reflectance of the first surface of the metal substrate is higher than UV reflectance of the electrodes and the insulating layers.

US Pat. No. 10,283,687

LIGHT EMITTING DIODE

LUMENS CO., LTD., Yongin...

1. A light emitting diode comprising:a plurality of light emitting cells comprising a first light emitting cell, a second light emitting cell, and a Nth light emitting cell in series, wherein the first light emitting cell and the second light emitting cell are spaced apart from each other on a single substrate;
a passivation layer formed over an upper surface and one facet of the first light emitting cell, the other facet of the second light emitting cell, and the substrate;
multi-interconnection layers comprising a first interconnection layer formed on the passivation layer to electrically connect the first light emitting cell and the second light emitting cell and a second interconnection layer formed on the first interconnection layer to electrically connect the first light emitting cell and the second light emitting cell; and
a first bonding wire connecting to the first light emitting cell and a second bonding wire connecting to the Nth light emitting cell,
wherein power is supplied to the plurality of light emitting cells through the first bonding wire and the second bonding wire,
wherein the second interconnection layer includes a first edge lump portion formed around a first edge of the upper surface of the first light emitting cell.

US Pat. No. 10,234,088

LIGHT EMITTING DEVICES AND LIGHT EMITTING BULBS INCLUDING THE SAME

LUMENS CO., LTD., Yongin...

1. Filament type light emitting bulb including a base, a light transmitting globe coupled to a front opening of the base, a pair of leads, and a plurality of light emitting devices, said one of the light emitting devices comprising;an elongated non-conductive substrate;
a first light emitting diode chip, a second light emitting diode chip and nth, where n?1, light emitting diode chip mounted on the upper surface of the non-conductive substrate and each comprising input and output ends extending toward the non-conductive substrate; and
two connection means formed on the non-conductive substrate, and the connection means including a first connection mean adjacent to the first light emitting diode chip connected a input terminal and a second connection mean adjacent to the nth light emitting diode chip connected a output terminal;
two extending terminals connected the first connection mean and the second connection mean respectively; and
a light transmitting encapsulation covered the non-conductive substrate, the two connection means and partially covered the two extending terminals;
wherein a first width of a portion of the first connection mean corresponding to the input terminal is larger than a second width of a portion of the first connection mean corresponding to the input end.

US Pat. No. 10,286,921

DROWSINESS PREVENTION SYSTEM FOR VEHICLE

LUMENS CO., LTD., Yongin...

1. A drowsiness prevention system installed in a vehicle and comprising:a light emitting unit irradiating infrared light, whose distribution angle pattern is inclined from a central axial line, toward the driver's iris;
an infrared camera capturing images of the driver's iris; and
a warning sound generating unit determining the driver to be drowsy to generate a warning sound when the driver's iris is not detected from the images captured by the infrared camera within a preset reference time,
wherein the light emitting unit is mounted in an area other than the driver's front area, and
wherein the light emitting unit comprises:
a base comprising a chip mounting surface;
a light emitting diode (LED) chip comprising a central axial line perpendicular to the chip mounting surface;
a total internal reflection (TIR) lens comprising entrance planes and exit planes from which light entering through the entrance planes is emitted; and
a reflector coupled to the TIR lens.

US Pat. No. 10,281,812

PROJECTION DEVICE USING MICRO LED PANEL AND METHOD OF FABRICATING THE SAME

LUMENS CO., LTD., Yongin...

1. A method for fabricating a third micro light emitting diode (LED) display device in a projection device which includes a first micro LED display device outputting light of a first wavelength, a second micro LED display device outputting light of a second wavelength and the third micro LED display device outputting light of a third wavelength, the method comprising:forming a GaAs substrate;
stacking emission structures on the GaAs substrate, the emission structures comprising a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer;
making a micro LED panel including a plurality of micro LED pixels formed by performing an etching process on the emission structures according to a unit pixel area and a first conductive metal layer formed along an outer region of the plurality of micro LED pixels;
making a silicon substrate including an active matrix (AM) circuit unit comprising a plurality of CMOS cells corresponding to the plurality of micro LED pixels and a common cell disposed on an outer region of the AM circuit unit;
flip-chip bonding the micro LED panel onto the silicon substrate; and
separating the GaAs substrate attached onto the micro LED panel,
wherein the first conductive metal layer disposed on the outer region of the plurality of micro LED pixels is electrically connected to the common cell disposed on the outer region of the AM circuit unit by flip-chip bonding the micro LED panel onto the silicon substrate.

US Pat. No. 10,368,415

LIGHTING APPARATUS

LUMENS CO., LTD., Yongin...

1. A LED lighting apparatus comprising:a power supply unit;
a light emitting unit operating in response to a voltage applied from the power supply unit and comprising at least one first light emitting group having a first color temperature and being turned on at a first turn-on voltage (VB) and at least one second light emitting group having a second color temperature and being turned on at a second turn-on voltage (VA) greater than the first turn-on voltage;
a substrate mounting the light emitting unit; and
a voltage control unit controlling the level of the voltage applied from the power supply unit to the light emitting unit,
wherein the voltage is increased from the voltage lower than the first turn-on voltage to the voltage higher than the second turn-on voltage, the light emitting unit is emitted from the inside of the substrate and emitted from the first light emitting group to the second light emitting group,
wherein the voltage control unit comprising at least one variable resistor controlled the first light emitting group to emit warm white color.

US Pat. No. 10,305,004

LIGHT EMITTING DIODE DISPLAY APPARATUS

LUMENS CO., LTD., Yongin...

1. An LED display apparatus comprising:an LED substrate in which a plurality of LED elements corresponding to subpixels and emitting first-wavelength light are arranged in rows and columns;
a first wavelength conversion sheet provided on the LED substrate and converting the first-wavelength light into second-wavelength light; and
a second wavelength conversion sheet provided on the first wavelength conversion sheet and converting the first-wavelength light or the second-wavelength light into third-wavelength light,
wherein a first light transmitting portion formed through a punching step that transmits the first-wavelength light is formed in at least a partial region of the first wavelength conversion sheet,
wherein a second light transmitting portion formed through a punching step that transmits the first-wavelength light or the second-wavelength light is formed in at least a partial region of the second wavelength conversion sheet,
wherein the first light transmitting portion and the second light transmitting portion are formed in at least a portion of positions corresponding to the subpixels of the plurality of LED elements in the first wavelength conversion sheet and the second wavelength conversion sheet, respectively, so that the first-wavelength light, the second-wavelength light, and the third-wavelength light are all emitted,
wherein the light transmitting portions are formed in both the first wavelength conversion sheet and the second wavelength conversion sheet in a region corresponding to a first subpixel constituting one pixel,
wherein the light transmitting portion is formed only in the second wavelength conversion sheet in a region corresponding to a second subpixel constituting the one pixel, and
wherein the light transmitting portion is formed only in the first wavelength conversion sheet in a region corresponding to a third subpixel constituting the one pixel.

US Pat. No. 10,217,899

LIGHT EMITTING DIODE WITH REFLECTIVE PART FOR UVA AND BLUE WAVELENGTHS

Lumens Co., Ltd., Yongin...

1. A light emitting diode comprising:a first conductivity type semiconductor layer having a front side and a back side;
a second conductivity type semiconductor layer having a front side and a back side;
an active layer formed between the back side of the first conductivity type semiconductor layer and the front side of the second conductivity type semiconductor layer;
a first reflective layer formed on the back side of the second conductivity type semiconductor layer; and
a reflective part formed on the back side of the first reflective layer opposite the second conductivity type semiconductor layer to reflect light of a short wavelength (UVA wavelength) band and light of a blue wavelength,
wherein the first reflective layer comprises distributed Bragg reflector (DBR) unit layers for reflecting light of a short wavelength band of 315 nm to 420 nm, each of the DBR unit layers comprises a low refractive index layer and a high refractive index layer adjacent to the low refractive index layer,
wherein the reflective part comprises a second conductivity type intermediate layer for improving ohmic contact and a reflective metal layer for reflecting light of a short wavelength band and light of a blue wavelength band.

US Pat. No. 10,375,779

LIGHTING APPARATUS

LUMENS CO., LTD., Yongin...

1. A lighting apparatus comprising:a power supply unit generating alternating current (AC) power;
a light emitting unit connected in series with the power supply unit and including a first light emitting unit and a second light emitting unit that each have at least one light emitting diode element;
a voltage detecting unit connected in series with the power supply unit and measuring a voltage value input from the power supply unit; and
a reference voltage controlling unit selectively controlling a first distribution switch unit and a second distribution switch unit which are separately connected to the first light emitting unit and the second light emitting unit, according to the voltage value measured by the voltage detecting unit,
wherein the reference voltage controlling unit supplies a first distribution switch reference voltage to the first distribution switch unit and the second distribution switch unit when the voltage value measured by the voltage detecting unit is smaller than a switching control reference voltage,
wherein the reference voltage controlling unit supplies a first distribution switch reference voltage to the first distribution switch unit, and supplies a second distribution switch reference voltage having a value greater than the first distribution switch reference voltage to the second distribution switch unit, when the voltage value measured by the voltage detecting unit is greater than a switching control reference voltage, and
wherein the first light emitting unit includes one or more backdraft prevention units connected in series with a rear stage of the light emitting diode element.

US Pat. No. 10,312,424

SEMICONDUCTOR LIGHT EMITTING ELEMENT AND BACKLIGHT ASSEMBLY INCLUDING THE SAME

LUMENS CO., LTD., Yongin...

1. A semiconductor light emitting element comprising:a light emitting element chip including a first pad, a second pad, an upper surface and a side surface;
a wavelength conversion layer formed on the upper surface and the side surface of the light emitting element chip;
a sidewall reflection part having an inner surface facing the light emitting element chip, the inner surface being parallel to the side surface of the light emitting element chip and being spaced apart from the side surface of the light emitting element chip; and
a bottom surface reflection part protruding from a lower portion of the sidewall reflection part and having an arc shape,
wherein the sidewall reflection part and the bottom surface reflection part are configured to reflect light in a direction in which the light penetrates through an upper surface of the wavelength conversion layer, the light being generated from the light emitting element chip,
wherein the light emitting element chip includes:
a first semiconductor layer having a first polarity;
a second semiconductor layer having a second polarity and disposed lower than the first semiconductor layer; and
an active layer disposed between the first semiconductor layer and the second semiconductor layer,
wherein a height of the bottom surface reflection part is equal to or greater than that of the active layer, and
wherein a bottom surface of the second semiconductor layer is exposed to a lower side of the semiconductor light emitting element.

US Pat. No. 10,319,706

MICRO-LED MODULE AND METHOD FOR FABRICATING THE SAME

LUMENS CO., LTD., Yongin...

1. A method for fabricating a micro-LED module comprising:preparing a micro-LED comprising a plurality of electrode pads and a plurality of LED cells;
preparing a submount substrate comprising a plurality of electrodes corresponding to the plurality of electrode pads; and
flip-bonding the micro-LED to the submount substrate through a plurality of solders located between the plurality of electrode pads and the plurality of electrodes,
wherein the micro-LED comprises a substrate and an epilayer comprising the LED cells,
wherein the flip-bonding comprises heating the plurality of solders by a plurality of laser beams passing vertically through the micro-LED from one side to the other side of the micro-LED, and the plurality of laser beams comprise laser beams passing through the substrate and the epilayer in which none of the LED cells are present and laser beams passing through the substrate and the epilayer in which the LED cells are present.

US Pat. No. 10,365,371

MULTI-POSITION SENSING APPARATUS

LUMENS CO., LTD., Yongin...

1. A multi-position sensing apparatus, comprising:a light emitting element configured to irradiate detection light to a first or second target;
a first light receiving part including a first light receiving area in a first light receiving range angle with respect to a first light receiving axis to receive a first or second reflective light reflected from the first or second target; and
a second light receiving part including a second light receiving area in a second light receiving range angle with respect to a second light receiving axis in parallel to the first light receiving axis to receive the second or first reflective light reflected from the second or first target,
wherein the first light receiving part includes:
a first photo diode configured to use first barrier ribs having a height to change a transmitted amount of light depending on at least an angle and a plurality of first slits installed in parallel in a first direction to sense a light quantity of light transmitting between the first slits in the first area biased to one side and a quantity of light in a second area biased to the other side; and
a second photo diode configured to be adjacently installed to the first photo diode and to use second barrier ribs having a height to change the transmitted amount of light depending on at least the angle and a plurality of second slits installed in parallel in a second direction to sense a quantity of light transmitting between the second slits in a third area biased to one side and a quantity of light in a fourth area biased to the other side.

US Pat. No. 10,109,775

LIGHT EMITTING DEVICES AND LIGHT EMITTING BULBS INCLUDING THE SAME

LUMENS CO., LTD., Yongin...

1. A light emitting device comprising:a non-conductive transparent substrate;
one or more light emitting diode chips mounted on the upper surface of the non-conductive transparent substrate and each comprising input and output ends extending toward the non-conductive transparent substrate; and
conductive transparent connection portions formed on the upper surface of the non-conductive transparent substrate and electrically connected to the input and output ends,
wherein light transmitting regions are provided in the vicinity of the input and output ends between the non-conductive transparent substrate and the light emitting diode chips and light is emitted backward from the light emitting diode chips through the light transmitting regions and the non-conductive transparent substrate.

US Pat. No. 10,490,541

LED DISPLAY MODULES AND METHODS FOR MAKING THE SAME

LUMENS CO., LTD., Yongin...

1. An LED pixel unit comprising: a light shield wall having a first hole, a second hole, and a third hole extending from the upper surface to the lower surface thereof; a first light emitting unit arranged to fill the first hole; a second light emitting unit arranged to fill the second hole; and a third light emitting unit arranged to fill the third hole, wherein the first light emitting unit comprises a first color filter arranged in the upper portion of the inner space of the first hole, a first LED chip arranged below the first color filter, and a first wavelength converting element interposed between the first color filter and the first LED chip, the second light emitting unit comprises a second color filter arranged in the upper portion of the inner space of the second hole, a second LED chip arranged below the second color filter, and a second wavelength converting element interposed between the second color filter and the second LED chip, the third light emitting unit comprises a third color filter arranged in the upper portion of the inner space of the third hole, a third LED chip arranged below the third color filter, and a third wavelength converting element interposed between the third color filter and the third LED chip, the first LED chip, the second LED chip, and the third LED chip emit light of the same wavelength, the first wavelength converting element, the second wavelength converting element, and the third wavelength converting element receive and convert the light of the same wavelength emitted from the first LED chip, the second LED chip, and the third LED chip into white light, respectively, and the first color filter, the second color filter, and the third color filter separate light at a first wavelength, light at a second wavelength, and light at a third wavelength from the white light and allow the separated light to pass therethrough, respectively.

US Pat. No. 10,364,947

LED MODULE

LUMENS CO., LTD., Yongin...

1. An LED module comprising:light sources elongated in a first direction;
a mount supporting the light sources; and
a composite reflector integrated with the mount to guide light received from the light sources,
wherein the composite reflector comprises:
a first region arranged adjacent to the light sources to reflect light in a second direction substantially orthogonal to the first direction,
a third region arranged away from the mount to reflect light in the second direction substantially orthogonal to the first direction, and
a second region interposed between the first region and the third region and formed with a plurality of diffraction lines through which light is diffused in the second direction,
wherein the first region is devoid of the diffraction lines,
wherein the light from the light source is collected more in the second region than in the first region and the third region,
wherein the first region includes a first area substantially orthogonal to the mount and a second area intersecting the first area at an obtuse angle,
wherein the second region includes a first main diffraction area extending from one end of the second area at the same slope as the second area and a second main diffraction area intersecting the first main diffraction area at an obtuse angle,
wherein the slope of the second diffraction area is the same as the slope of the third region, and
wherein the light sources comprise a first row of light sources located closer to a boundary between the mount and the composite reflector and a second row of light sources located farther from the boundary, such that the light sources are alternately arranged in a zigzag pattern.

US Pat. No. 10,468,392

LED MODULE AND METHOD FOR FABRICATING THE SAME

LUMENS CO., LTD., Yongin...

1. A micro LED module comprising:a substrate;
a plurality of electrode patterns formed on the substrate, each of which includes a first individual electrode pad, a second individual electrode pad, a third individual electrode pad, and a common electrode pad; and
a plurality of LED chip groups, each of which includes LED chips, the LED chips including a first LED chip flip bonded to the first individual electrode pad and the common electrode pad, the second LED chip flip bonded to the second individual electrode pad and the common electrode pad, and the third LED chip flip bonded to the third individual electrode pad and the common electrode pad,
wherein the LED chip groups are arranged in a matrix on the substrate with the same the widthwise direction intervals and the same lengthwise directions intervals, a distance between the first LED chip and the second LED chip is identical to a distance between the second LED chip and the third LED chip.

US Pat. No. 10,444,511

HEAD-MOUNTED DISPLAY APPARATUSES

LUMENS CO., LTD., Yongin...

1. A head-mounted display apparatus comprising:an optical member having a front surface, a rear surface, and a plurality of side surfaces;
a display unit adapted to emit a display image toward one of the side surfaces of the optical member; and
a reflective structure disposed inside the optical member to reflect the display image emitted from the display unit and to allow the reflected display image to pass and propagate through the rear surface,
wherein the reflective structure comprises a micromirror arranged obliquely relative to a reference plane as a virtual plane extending from the front surface of the optical member to cover the reflective structure, and
wherein a width of an orthographic projection of the micromirror and a height of the micromirror are determined depending on an angle of incidence of the display image on the micromirror, an angle of reflection of the display image from the micromirror, and a refractive index of the optical member.

US Pat. No. 10,405,387

LED LIGHTING DEVICE USING AC POWER SUPPLY

LUMENS CO., LTD., Yongin...

1. A light emitting diode (LED) lighting device comprising:a power source part configured to produce a plurality of different output voltage;
a first LED part comprising one or more LED groups;
a second LED part comprising one or more LED groups;
a control voltage output part configured to output a control voltage according to a peak value of an output voltage from the power source part;
a first driving part connected to the first LED part, wherein the first driving part operates on a first voltage;
a second driving part connected to the second LED part, wherein the second driving part operates on the first voltage and a second voltage, wherein upon the first voltage, a current flowing in the first LED part is controlled by the first driving part and a current flowing in the second LED part is controlled by the second driving part, and wherein upon the second voltage, the first driving part becomes disabled and a current flowing in the first LED part and the second LED part are controlled by the second driving part; and
a switch part connected to an upstream part of the first LED part and an upstream part of the second LED part, wherein the switch part is configured to switch an ON/OFF state according to the control voltage, and wherein when the switch part is in an ON state, a current output from the power source part is divided and flows to the first LED part and the second LED part and when the switch part is in an OFF state, a current output from the power source part is not divided and flows to the first LED part and the second LED part.

US Pat. No. 10,396,248

SEMICONDUCTOR LIGHT EMITTING DIODE

LUMENS CO., LTD., Yongin...

1. A semiconductor light emitting diode comprising:a first conductive semiconductor layer,
a second conductive semiconductor layer,
an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer,
a transparent electrode formed on the second conductive semiconductor layer,
a non-conductive reflection film covering a circumferential surface of the transparent electrode and having one or more via-holes formed therein,
a reflective electrode formed on the non-conductive reflection film,
interconnection electrodes filled in the via-holes and electrically connecting the reflective electrode to the transparent electrode, and
ohmic contact layers formed between the transparent electrode and the interconnection electrodes,
wherein a reflectance of the non-conductive reflection film for light at a wavelength of 400 nm is at least 80%,
wherein the non-conductive reflection film comprises first type of layers and second type of layers, the first type of layer and the second type of layer being stacked alternately, and
wherein the ohmic contact layers are filled in recesses formed by etching a portion of the transparent electrode corresponding to the via-holes.

US Pat. No. 10,487,996

LIGHT EMITTING DEVICES AND LIGHT EMITTING BULBS INCLUDING THE SAME

LUMENS CO., LTD., Yongin...

1. A filament type light emitting bulb including a base, a light transmitting globe coupled to a front opening of the base, a pair of leads, and a plurality of light emitting devices, said one of the light emitting devices comprising;a non-conductive substrate;
a first light emitting diode chip, a second light emitting diode chip and nth, where n?1, light emitting diode chip mounted on the upper surface of the non-conductive substrate and each comprising input and output ends;
two connection means including a first connection mean adjacent to the first light emitting diode chip connected an input terminal and a second connection mean adjacent to the nth light emitting diode chip connected an output terminal;
two extending terminals connected the first connection mean and the second connection mean respectively; and
a light transmitting encapsulant covered the non-conductive substrate, the two connection means and partially covered the two extending terminals;
wherein the nth light emitting diode chip formed a first electrode pad and a second electrode pad and connected on the non-conductive substrate through a first bump and a second bump respectively.

US Pat. No. 10,461,231

METHOD FOR FABRICATING LED PACKAGE

LUMENS CO., LTD., Yongin...

1. A method for fabricating light emitting device packages, comprising:preparing light emitting device units formed by arranging a plurality of light emitting devices on a sheet, filling a light transmitting material between the light emitting devices arranged on the sheet to form a light-transmitting member, curing the light-transmitting material, obliquely cutting the light-transmitting material relative to the individual light emitting devices and separating the individual light emitting devices from the sheet;
mounting and arranging the light emitting device units on a substrate; attaching wavelength converting members to the respective light emitting device units mounted and arranged on the substrate;
filling a reflective material between the light emitting device units attached with the wavelength converting members to form a reflective member; and
vertically cutting the reflective material such that the reflective material surrounds the individual light emitting device units attached with the wavelength converting members.

US Pat. No. 10,429,031

LINEAR LED MODULE AND BACKLIGHT UNIT INCLUDING THE SAME

LUMENS CO., LTD., Yongin...

1. A backlight unit comprising:a rear case arranged in rear of a display panel;
a reflective sheet positioned in the rear of the display panel in the rear case; and
a linear light emitting diode (LED) module comprising an LED bar and a linear reflector and arranged along one side edge of the reflective sheet,
wherein the linear reflector comprises a mounting portion on which the LED bar is mounted along a lengthwise direction and a composite reflective portion integrated with the mounting portion and adapted to primarily reflect light emitted from the LED bar toward the reflective sheet,
wherein a cross-section of the composite reflective portion comprises a curved reflective surface adjacent to the mounting portion and a straight reflective surface extending away from a boundary with the mounting portion,
wherein the reflective sheet is adapted to secondarily reflect the light primarily reflected from the composite reflective portion toward the display panel,
wherein the LED bar comprises a plurality of LEDs arrayed on a substrate in a lengthwise direction of the substrate, each of the LEDs having an optical axis,
wherein the composite reflective portion is configured to intersect the optical axis,
wherein the mounting portion comprises a mounting surface on which the LED bar is mounted,
wherein the mounting surface is divided into an inner surface and an outer surface by a line drawn perpendicular to the mounting surface from the boundary between the curved reflective surface and the straight reflective surface, such that the inner surface is between a first end adjacent to the curved surface and the line and the outer surface is between the line and a second end opposite to the first end,
wherein the LEDs lies in the inner surface,
wherein the reflective sheet comprises one or more light attenuating areas formed around its one side edge adjacent to the linear LED module to increase the amount of light absorbed and reduce the amount of light reflected, and
wherein a number of holes or black dot patterns are formed in the light attenuating areas.

US Pat. No. 10,546,989

LIGHT EMITTING ELEMENT AND METHOD FOR FABRICATING THE SAME

LUMENS CO., LTD., Yongin...

1. A light emitting element comprising:an LED chip comprising a light emitting semiconductor stack and first and second electrode pads disposed under the light emitting semiconductor stack and spaced apart from each other;
a substrate mounted with the LED chip and comprising a first electrode corresponding to the first electrode pad and a second electrode corresponding to the second electrode pad;
a first solder portion connecting the first electrode pad and the first electrode; and
a second solder portion connecting the second electrode pad and the second electrode,
wherein the first solder portion and the second solder portion are formed without escaping from the mounting area of the LED chip on the substrate by heating a solder material to its melting point or above with an IR laser, and
wherein the first solder portion is formed by applying a plurality of solder materials to the first electrode and heating the solder materials with the IR laser such that the solder materials are combined together, and the second solder portion is formed by applying a plurality of solder materials to the second electrode and heating the solder materials with the IR laser such that the solder materials are combined together.

US Pat. No. 10,490,703

LIGHT-EMITTING-DEVICE PACKAGE AND PRODUCTION METHOD THEREFOR

LUMENS CO., LTD., Yongin...

7. A light emitting device package comprising:a metal substrate comprising a first surface and a second surface opposed to the first surface;
an insulation layer formed the metal substrate, wherein the insulation layer included an alumina material or an alumina oxide;
a light emitting device mounted on a cavity of the first surface with an adhesive member, wherein the light emitting package emits ultraviolet light in a wavelength range from 200 nm to 380 nm;
at least pair of bonding wires electrically connected a first electrode pad and a second electrode pad of the light emitting package; and
a lens installed around the metal substrate, wherein the cavity comprising a first part on which the light emitting device mounts and a second part which is separated from the first part by a separation line.

US Pat. No. 10,410,998

MICRO-LED MODULE AND METHOD FOR FABRICATING THE SAME

LUMENS CO., LTD., Yongin...

1. A micro-LED module comprising:a micro-LED comprising a plurality of LED cells, each of which comprises a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer;
a submount substrate electrically connected to the micro-LED;
a plurality of electrode pads formed on the micro-LED;
a plurality of electrodes formed on the submount substrate to correspond to the plurality of electrode pads;
a plurality of connection members through which the plurality of electrode pads are connected to the corresponding plurality of electrodes;
a gap fill layer formed in a gap between the micro-LED and the submount substrate and having a bonding strength to the micro-LED and the submount substrate; and
a cell cover layer formed to cover exposed areas of the first conductive semiconductor layer and edge portions of the plurality of electrode pads and including pad exposure holes through which portions of each of the plurality of electrode pads are exposed,
wherein each of the plurality of exposed electrode pads is depressed to a predetermined depth from the surface of the cell cover layer, and
wherein the plurality of LED cells are arrayed in a matrix inside the micro-LED and an exposed area of the first conductive semiconductor layer is formed outside the micro-LED.

US Pat. No. 10,559,554

METHOD FOR FABRICATING LED MODULE USING TRANSFER TAPE

LUMENS CO., LTD., Yongin...

1. A method for fabricating an LED module, comprising:constructing a chip-on-carrier comprising a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and
transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing,
wherein the transfer printing comprises:
primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape;
disposing the transfer tape such that the bonding areas are positioned between the LED chips on the chip retainer and a pick-up roller rolling in one direction;
pressurizing the transfer tape against the LED chips on the chip retainer with the pick-up roller to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips;
after the chip pick-up, moving the transfer tape between a placing roller and the substrate such that the LED chips attached to the transfer tape are positioned between the placing roller and the substrate;
irradiating UV light onto the transfer tape carrying the LED chips with a UV light source positioned above the transfer tape to weaken the adhesive strength of the bonding areas of the transfer tape; and
pressurizing the LED chips on the transfer tape against the substrate with the placing roller rolling in one direction, such that the LED chips attached to the bonding areas of the transfer tape whose adhesive strength are weakened by the UV light are detached from the transfer tape and placed on the substrate, wherein the electrode pads of the LED chips are attached to pairs of bumps formed on the substrate.

US Pat. No. 10,504,878

LED MODULE ASSEMBLIES FOR DISPLAYS

LUMENS CO., LTD., Yongin...

1. An LED module assembly for a display comprising a first LED module and a second LED module wherein the first LED module comprises a first unit substrate, a plurality of LED chips mounted on the first unit substrate to form a plurality of pixels, and a first light absorbing layer formed on the first unit substrate; the second LED module comprises a second unit substrate, a plurality of LED chips mounted on the second unit substrate to form a plurality of pixels, and a second light absorbing layer formed on the second unit substrate; the first unit substrate and the second unit substrate are laterally connected to each other; each of the first light absorbing layer and the second light absorbing layer comprises a plurality of valleys formed between the plurality of pixels; the first light absorbing layer and the second light absorbing layer comprise a first inclined portion and a second inclined portion, respectively; and at least one of the plurality of valleys is formed by the first inclined portion and the second inclined portion, wherein the surface of each of the plurality of LED chips lies at the same level as the upper end of the corresponding valley and is exposed to the outside.

US Pat. No. 10,667,345

METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE PACKAGES, LIGHT-EMITTING DEVICE PACKAGE STRIP, AND LIGHT-EMITTING DEVICE PACKAGE

LUMENS CO., LTD., Yongin...

1. A method for manufacturing light-emitting device packages, the method comprising:a light-emitting device mounting step for mounting a plurality of light-emitting devices on a substrate strip;
a phosphor forming step for forming a phosphor on the plurality of light-emitting devices;
a reflective member forming step for forming a reflective member on the substrate strip to surround the phosphor;
a support member forming step for forming a support member including an insulator and a wiring layer below the substrate strip to support the substrate strip; and
a package singulation step for singulating unit packages by cutting the substrate strip and the reflective member,
wherein the substrate strip has a plurality of pairs of a first electrode and a second electrode;
wherein upper surfaces of the first electrode and the second electrode are coplanar with lower surfaces of the light-emitting device, the phosphor, and the reflective member, and
wherein each of the unit packages formed by the support member forming step and the package singulator step comprises:
a first cut surface on a side surface of the reflective member;
a second cut surface on a side surface of the first electrode and the second electrode;
a plurality of through electrodes, each of the through electrodes penetrating through the insulator to connect to each of the first electrode and the second electrode, respectively; and
a plurality of rear wiring layers on the wiring layer, each of the rear wiring layers being connected to each of the through electrodes, respectively.

US Pat. No. 10,644,212

LED CHIP WITH IMPROVED BONDING STRENGTH AND LED MODULE USING THE LED CHIP

LUMENS CO., LTD., Yongin...

1. An LED chip comprising:a semiconductor stacked structure comprising a first conductive semiconductor layer and an active layer and a second conductive semiconductor layer sequentially formed on one area of the first conductive semiconductor layer;
a passivation layer covering the outer surface of the semiconductor stacked structure and comprising a first opening and a second opening;
a first electrode pad connected to the first conductive semiconductor layer through the first opening; and
a second electrode pad connected to the second conductive semiconductor layer through the second opening,
wherein each of the first electrode pad and the second electrode pad comprises a multilayer body comprising a plurality of metal layers and a contact body connected to the multilayer body, the contact body of the first electrode pad comprises a surface contact part in contact with the passivation layer outside the first opening and an ohmic contact part in contact with the first conductive semiconductor layer through the first opening, the contact body of the second electrode pad comprises a surface contact part in contact with the passivation layer outside the second opening and an ohmic contact part in contact with the second conductive semiconductor layer through the second opening, each of the ohmic contact parts comprises an ohmic contact layer in direct contact with the first or second conductive semiconductor layer and comprising Au and one or more metal layers formed on the ohmic contact layer and interposed between the ohmic contact layer and the surface contact part, and a ratio of an area of the first or second opening to a surface area of the ohmic contact layer is from 0.1:1 to 0.3:1.

US Pat. No. 10,638,582

LIGHTING DEVICE

LUMENS CO., LTD., Yongin...

1. A dimming controlled LED lighting device comprising:a power supply unit configured to produce a plurality of different output voltage;
a plurality of LED groups comprising a first LED group and a second LED group electrically connected to each other to have sequential numbers from upstream to downstream and receiving the power supply unit;
a rectifying unit configured to rectified AC power to the plurality of LED groups;
a LED lighting circuit including the plurality of LED groups, a current input terminal, a current output terminal, the current output terminal selectively output a part of or an entirety of a current input through the current input terminal; and
a dimming controlled LED driving circuit connected to the LED lighting circuit to control a reference voltage to be divided a bias voltage using at least of resistors,
wherein the dimming controlled LED driving circuit further comprises: a negative terminal of a comparator connected to an intermediate node of which one end is grounded, the other end is connected to an input voltage, and a positive terminal of the comparator connected to a threshold voltage, and
wherein when the input voltage is smaller than a comparison voltage, an output of the comparator becomes a high state and the reference voltage becomes zero voltage.

US Pat. No. 10,468,393

LED MODULE AND METHOD FOR FABRICATING THE SAME

LUMENS CO., LTD., Yongin...

1. A method for fabricating a micro LED module, comprising steps of:preparing a plurality of LED chip groups, each of which includes a plurality of LED chips, the LED chips including a red LED chip having a 1st first electrode and a 1st second electrode, a green LED chips having a 2nd first electrode and a 2nd second electrode, and a blue LED chip having a 3rd first electrode and a 3rd second electrode;
forming electrode patterns, each of which comprises a first individual electrode pad, a second individual electrode pad, a third individual electrode pad, and a common electrode pad, in a matrix on a substrate;
loading a 1st first bump, a 2nd first bump, and a 3rd first bump on the first individual electrode pad, the second individual electrode pad, and the third individual electrode pad, respectively, and loading 1st second bump, 2nd second bump, and 3rd second bump on the common electrode pad; and
arranging the LED chip groups in a matrix on the substrate such that the 1st first electrode, the 2nd first electrode, and the 3rd first electrodes face the 1st first bump, the 2nd first bump, and the 3rd first bump, respectively, and the 1st second electrode, the 2nd second electrode, and the 3rd second electrode face the 1st second bump, the 2nd second bump, and the 3rd second bump, respectively;
wherein the electrode patterns are formed such that the common electrode pad is aligned to a first end line parallel to the lengthwise direction of the matrix, and the first individual electrode pad, the second individual electrode pad, and the third individual electrode pad are aligned to a second end line parallel to the first end line and are located between the first end line and the second end line.

US Pat. No. 10,636,349

MICRO LED DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

LUMENS CO., LTD., Yongin...

1. A micro light emitting diode (LED) display device, comprising:a micro LED driving substrate in which a plurality of CMOS cells are arranged in rows and columns;
a micro LED panel which is flip-chip bonded onto the micro LED driving substrate and includes a plurality of micro LED pixels electrically connected with the plurality of CMOS cells, the micro LED panel defining an inner region in which the plurality of micro LED pixels are arranged and an outer region in which none of the plurality of micro LED pixels is arranged, each of the micro LED pixels defining a unit pixel region;
wherein the plurality of micro LED pixels are formed by etching a first surface of an emission structure comprising a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer in etch portions defining the unit pixel regions, such that each of the plurality of micro LED pixels comprises:
a first conductive semiconductor layer having a first surface facing the micro LED driving substrate and a second surface opposite to the first surface;
an active layer on the first surface of the first conductive semiconductor layer; and
a second conductive semiconductor layer on the active layer,
wherein the micro LED panel further comprises a plurality of separators formed on a second surface, opposite to the first surface, of the emission structure in positions vertically corresponding to the etch portions, such that the plurality of separators extend from the first conductive semiconductor layer in a direction opposite to the micro LED driving substrate, and
wherein the micro LED panel further comprises a first conductive metal layer formed in the outer region of the micro LED panel.

US Pat. No. 10,636,938

LED PANEL

LUMENS CO., LTD., Yongin...

1. An LED device comprising:a plurality of light emitting cells;
a substrate disposed over the plurality of light emitting cells and having a plurality of light collecting portions corresponding to the plurality of light emitting cells; and
a plurality of color cells disposed over the substrate in correspondence to the plurality of light emitting cells, at least one of the plurality of color cells being configured to change the wavelength of light from the corresponding light emitting cell.

US Pat. No. 10,586,897

LED PACKAGE

LUMENS CO., LTD., Yongin...

7. An LED package comprising:a reflector having a cavity formed therein;
an LED chip arranged in a lower space of the cavity of the reflector;
a wavelength converting panel comprising a lower glass plate, an upper glass plate, and a wavelength converting sheet interposed between the lower glass plate and the upper glass plate and arranged in an upper space of the cavity of the reflector; and
a sealing member for heat transfer disposed on a side surface of the lower glass plate and a side surface of the upper glass plate and connecting the wavelength converting panel to the reflector,
wherein an inner wall surface of the reflector comprises a first stepped portion on which the wavelength converting panel is seated and a second stepped portion connected to the overlying first stepped portion and filled with the sealing member for heat transfer, the LED chip is disposed in the lower space of the reflector and is integrated with the reflector by a composite of amorphous spherical silica and a resin formed in the lower space of the reflector, and the LED chip comprises a pair of electrode pads exposed downward through an opening formed at a lower end of the reflector, and
wherein the sealing member for heat transfer is made of a metal or metallic material.

US Pat. No. 10,553,757

UV LED PACKAGE

LUMENS CO., LTD., Yongin...

1. An ultra-violet (UV) light emitting diode (LED) package comprising:a submount comprising a first reflective electrode film and a second reflective electrode film separated from the first reflective electrode film by an electrode separation gap on a heat dissipating substrate, a first flip-chip bonding pad and a first wire bonding pad disposed on the first reflective electrode film, and a second flip-chip bonding pad and a second wire bonding pad disposed on the second reflective electrode film, wherein the first flip-chip bonding pad is separated from the first wire bonding pad, and the second flip-chip bonding pad is separated from the second wire bonding pad;
a UV LED chip emits ultraviolet light in a wavelength range from 200 nm to 400 nm, the UV LED chip comprising a first conductive electrode pad corresponding to the first flip-chip bonding pad and a second conductive electrode pad corresponding to the second flip-chip bonding pad; and
a package body comprising a first metal body and a second metal body separated from the first metal body by an insulating material and the first metal body electrically connected to the first wire bonding pad through a first bonding wire and the second metal body electrically connected to the second wire bonding pad through a second bonding wire,
wherein the UV LED chip positioned substantially a center of the submount and covered at least a part of the first reflective electrode film, the second reflective electrode film and the electrode separation gap, and
wherein the first flip chip bonding pad comprises a main bonding pattern and a pair of peripheral bonding patterns arranged away from the main bonding pattern, and the main bonding pattern is connected to the pair of peripheral bonding patterns through a pair of linear connection bonding patterns crossing each other around the main bonding pattern.

US Pat. No. 10,362,649

LED LIGHTING DEVICE

LUMENS CO., LTD., Yongin...

1. A light emitting diode (LED) lighting device, comprising:a rectifier circuit unit for receiving input power from a power source unit and outputting a rectified power;
a charge storage circuit unit, receiving power from the rectifier circuit unit, storing charges at a high voltage, and outputting the stored charges at low voltage;
an LED unit having a plurality of LED channels and a resistor channel connected in series;
a dimming control unit comprising a variable resistor for controlling the current flowing through the LED unit to control dimming of the LED channel; and
a switch circuit unit comprising a plurality of switches,
wherein an Nth switch is connected to the rear end of an Nth LED channel so as to control an operation of the Nth LED channel, and is controlled by a sum of a current of the Nth switch and a current of an (N+1)th switch, which flows through the variable resistor,
wherein N is a positive integer, wherein the (N+1)th switch is connected to the resistor channel, and
wherein the variable resistor is connected to each of the plurality of switches in the switch circuit unit.

US Pat. No. 10,222,539

LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, AND METHOD OF MANUFACTURING LIGHT EMITTING APPARATUS

LUMENS CO., LTD., Yongin...

1. A light emitting device package comprising:a substrate having a first electrode formed at one side of an electrode separation line and a second electrode formed at the other side of the electrode separation line;
a light emitting device including a first pad electrically connected to the first electrode and a second pad electrically connected to the second electrode;
a reflection molding member installed on the substrate, having a form in which a front surface thereof is opened so as to induce light generated by the light emitting device toward a front of the light emitting device package, and including a reflection cup part of which an upper portion is opened so as to accommodate the light emitting device therein; and
an upper cover formed in a shape corresponding to that of an upper surface of the reflection molding member so as to cover the light emitting device and the opened upper portion of the reflection cup part of the reflection molding member,
wherein the light emitting device is a vertical mounting type light emitting device including a light emitting layer so as to be in parallel with the first pad and the second pad, and the first pad and the second pad electrically connected to the substrate are substantially perpendicular to the substrate, and
wherein light generated in the light emitting layer is directed toward an upper surface of the light emitting device corresponding to the front of the light emitting device package.

US Pat. No. 10,663,756

DISPLAY APPARATUS

LUMENS CO., LTD., Yongin...

1. A display apparatus comprising:at least one light emitting diode (LED) display unit comprising a plurality of LED display panels outputting image lights;
a light guide unit comprising a plurality of in-coupling zones where the image lights are received and a single out-coupling zone to which the received image lights are guided;
a plurality of in-coupling holographic optical elements (HOEs) arranged in the in-coupling zones to define a propagation path of the image lights through the light guide unit; and
a plurality of out-coupling HOEs arranged in the out-coupling zone to define a path through which the image lights guided through the light guide unit are sent outside the light guide unit,
wherein the light guide unit comprises at least one waveguide,
wherein the plurality of in-coupling HOEs comprise:
a first in-coupling HOE arranged on a first side of the waveguide and defining a propagation path of a first image light through the waveguide; and
a second in-coupling HOE arranged on a second side of the waveguide opposite to the first side and defining a propagation path of a second image light through the waveguide,
wherein the plurality of out-coupling HOEs comprise:
a first out-coupling HOE stacked on a back surface of the waveguide between the first and second sides of the waveguide for deflecting the first image light traveling along the propagation path defined by the first in-coupling HOE and sending the deflected first image light toward the right eye of a viewer, and
a second out-coupling HOE stacked on the first out-coupling HOE for deflecting the second image light traveling along the propagation path defined by the second in-coupling HOE and sending the deflected second image light toward the left eye of the viewer.

US Pat. No. 10,622,512

LIGHT EMITTING DIODE WITH REFLECTIVE PART FOR UVA AND BLUE WAVELENGTHS

LUMENS CO., LTD., Yongin...

1. A light emitting diode comprising;a substrate having a front side and a back side;
a first conductive type semiconductor layer having a front side and a back side, and formed on the back side of the substrate;
a second conductive type semiconductor layer having a front side and a back side, and formed on the back side of the first conductive type semiconductor layer;
an active layer having a short wavelength band of 315 to 420 nm, and formed between the back side of the first conductive type semiconductor layer and the front side of the second conductive type semiconductor layer;
a plurality of distributed bragg reflector (DBR) unit layers having a front side and a back side, and comprising a low refractive index layer and a high refractive index layer adjacent to the low refractive index layer; and
a metal reflective layer having a front side and a back side, and formed on the back side of the plurality of DBR unit layers;
wherein an intermediate layer for improving ohmic contact formed between the back side of the plurality of DBR unit layers and the front side of the metal reflective layer, comprises silver.

US Pat. No. 10,607,970

LED DISPLAY MODULE

LUMENS CO., LTD., Yongin...

1. An LED display module comprising: a micro-LED array comprising a plurality of pixel units arrayed in a matrix with rows and columns, each of the pixel units comprising a red LED, a green LED, and a blue LED; a substrate comprising a top layer on which the pixel units are mounted, a first layer located under the top layer, and a second layer located under the first layer; and pairs of electrode pads disposed on the substrate and to which first electrodes and second electrodes of the LEDs of the pixel units are connected, wherein the distances between peripheral portions of the paired electrode pads are longer than the distances between central portions thereof.

US Pat. No. 10,607,973

MICRO-LED ARRAY DISPLAY DEVICES WITH CMOS CELLS

LUMENS CO., LTD., Yongin...

7. A micro-LED array display device comprising:first, second, and third micro-LED panels emitting light of different wavelength bands, each of the micro-LED panels comprising a plurality of micro-LED pixels;
a single CMOS backplane comprising a plurality of CMOS cells corresponding to the micro-LED pixels;
bumps electrically connecting the micro-LED pixels of the first, second, and third micro-LED panels to the corresponding CMOS cells in a state in which the micro-LED pixels of the first, second, and third micro-LED panels are arranged to face the CMOS cells; and
a first conductivity-type metal layer of each of the first, second, and third micro-LED panels being formed along the periphery of the micro-LED panel and located between the micro-LED panels and the single CMOS backplane,
wherein the micro-LED pixels of the first, second, and third micro-LED panels are flip-bonded to the corresponding CMOS cells formed on the CMOS backplane through the bumps so that the micro-LED pixels are individually controlled,
wherein the micro-LED pixels of each of the first, second, and third micro-LED panels are formed by growing a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer in order on a substrate, etching the first conductivity-type semiconductor layer, the active layer, and the second conductivity-type semiconductor layers such that the micro-LED pixels of each of the first, second, and third micro-LED panels have a vertical structure comprising the substrate, the first conductivity-type semiconductor layer, the active layer, and the second conductivity-type semiconductor layer formed in order, and removing the active layer and the second conductivity-type semiconductor layer from exposed portions of the first conductivity-type semiconductor layer where none of the micro-LED pixels of each of the first, second, and third micro-LED panels are formed,
wherein the first conductivity-type metal layer is formed over the portions of the first conductivity-type semiconductor layer where none of the micro-LED pixels of each of the first, second, and third micro-LED panels are formed and is spaced apart from the micro-LED pixels of each of the first, second, and third micro-LED panels, and
wherein the first conductivity-type metal layer of each of the first, second, and third micro-LED panels functions as a common electrode of the micro-LED pixels of the micro-LED panel.

US Pat. No. 10,692,845

METHOD FOR ARRAYING MICRO-LED CHIPS FOR MANUFACTURING LED DISPLAY PANEL AND MULTI-CHIP CARRIER USED IN THE METHOD

LUMENS CO., LTD., Yongin...

1. A method for arraying micro-LED chips comprising:preparing a chip carrier formed with a plurality of chip pockets whose internal pressure is reduced through a plurality of suction holes;
capturing the micro-LED chips in the corresponding chip pockets such that the micro-LED chips are in close contact with the bottoms of the chip pockets;
placing the micro-LED chips captured in the chip pockets on a base body; and
half-turning the chip carrier in which the captured micro-LED chips are aligned in the corresponding chip pockets,
wherein each of the chip pockets comprises a slope through which an inlet having a larger width than the bottom is connected to the bottom and wherein the distances between the centers of the adjacent micro-LED chips placed on the base body are the same as those between the centers of the corresponding chip pockets.